Circuit board structure capable of reducing interference and improving temperature measurement accuracy

Abstract

The utility model discloses a circuit board structure capable of reducing interference and improving temperature measurement accuracy, which comprises a packaging unit arranged on a circuit board and connected with a pin of a temperature sensing chip, the circuit board is provided with an isolating ring at a position corresponding to the packaging unit, and the inner layer of the circuit board corresponding to the isolating ring is a distribution forbidding area. The isolation ring is enclosed outside the packaging unit in a shape like a Chinese character'ao ', the isolation ring is also provided with an opening, and the opening is used for leading out wires from the packaging unit of the temperature sensing chip on the surface layer and / or the bottom layer of the circuit board. According to the utility model, the isolating ring is arranged around the temperature sensing chip, and the distribution forbidding area is formed in the area where the isolating ring is located, so that external interference factors are reduced, the working environment of the temperature sensing chip is ensured to be relatively independent, unnecessary heat transfer or electromagnetic interference is avoided, and the accuracy of temperature measurement data is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and more particularly to a circuit board structure capable of reducing interference and improving temperature measurement accuracy. Background Art

[0002] In the manufacture of modern electronic devices, printed circuit boards (PCBs) serve as core components connecting various electronic components. They not only transmit signals but also supply and convert power between components. The precision and rationality of their design directly determine the performance and reliability of the entire system. With the continuous advancement of technology, PCB design trends are gradually evolving from simple connectivity to highly integrated and multifunctional designs to meet the needs of increasingly complex electronic systems.

[0003] Traditional PCB design approaches tend to maximize space utilization and minimize costs. Routing layout adheres to the principle of "routing wherever possible." This means increasing routing density as much as possible while minimizing PCB area, while still meeting electrical performance and safety regulations. This reduces material and production costs. This design strategy is effective in most cases.

[0004] However, when it comes to temperature sensor chips, hidden dangers arise. As a key component for monitoring the temperature of circuit boards and their surroundings, the accuracy of temperature sensor chips is directly related to the system's overheat protection, energy management, and overall performance optimization. Based on ambient temperature fluctuations, they must adjust the system's cooling strategy and energy consumption mode in real time to ensure efficient device operation while maintaining a safe and stable temperature range.

[0005] However, in practical applications, designers often overlook the routing of the temperature sensor chip. Internal routing is not zoned around the temperature sensor chip, causing heat generated by the internal routing to be transferred to the temperature sensor chip, resulting in inaccurate temperature measurements. This not only affects the system's overheat protection and energy management efficiency, but can also lead to overheating or overcooling of circuit board components due to temperature measurement deviations, further compromising the performance and reliability of the entire electronic system. Utility Model Content

[0006] In order to overcome the problem that the internal wiring of the existing circuit board is not divided into areas to avoid the temperature sensor chip, resulting in the heat generated by the internal wiring at the temperature sensor chip being transferred to the temperature sensor chip, causing inaccurate temperature measurement, the utility model provides a circuit board structure that reduces interference and improves temperature measurement accuracy.

[0007] The technical solution of this utility model is as follows:

[0008] A circuit board structure for reducing interference and improving temperature measurement accuracy includes a packaging unit provided on the circuit board and connected to the pins of a temperature sensor chip. The circuit board is provided with an isolation ring at a position corresponding to the packaging unit. The inner layer of the circuit board corresponding to the isolation ring is a no-clothing area. The isolation ring is in a "concave" shape and encloses the outside of the packaging unit. The isolation ring is also provided with an opening, which is used to allow the packaging unit of the temperature sensor chip to lead out on the surface layer and / or bottom layer of the circuit board.

[0009] According to the above solution of the present invention, the distance between the isolation ring and the packaging unit is not less than 30 mil.

[0010] According to the above solution of the present invention, the width of the isolation ring is 30 mil.

[0011] According to the above solution of the present invention, the packaging unit includes a plurality of packaging pads connected to the pins of the temperature sensor chip, and the packaging pads are arranged in pairs.

[0012] According to the above solution of the present invention, the packaging pads are arranged in a matrix of two columns and four rows.

[0013] According to the above-mentioned scheme of the utility model, the packaging unit also includes a heat dissipation pad, which is located in the middle position of the two columns of packaging pads. The width of the heat dissipation pad is smaller than the spacing between the packaging pads on both sides, and the length of the heat dissipation pad is smaller than the length from the beginning to the end of the packaging pad on the same side.

[0014] According to the above-mentioned solution of the present invention, a solder resist window is provided on the periphery of the heat dissipation pad.

[0015] According to the above solution of the present invention, the width of the solder resist window ranges from 1 to 4 mil.

[0016] According to the utility model of the above solution, a circular mark formed by white paint silk screen printing is provided on the outer side of the pin of the temperature sensor chip, and the circular mark is used to identify the direction of the pin of the surface mount device.

[0017] The beneficial effect of the present invention according to the above scheme is that the present invention reduces external interference factors by arranging an isolation ring around the temperature sensor chip to form a no-layout zone in the area where the isolation ring is located, thereby ensuring that the working environment of the temperature sensor chip is relatively independent, avoiding unnecessary heat transfer or electromagnetic interference, and ensuring the accuracy of the temperature measurement data. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 This is a schematic structural diagram of the surface layer of the circuit board of the present invention;

[0020] Figure 2 This is a schematic structural diagram of the bottom layer of the circuit board of the present invention.

[0021] In the drawings, the reference numerals are as follows:

[0022] 100. Circuit board; 10. Package unit; 11. Package pad; 12. Heat dissipation pad; 13. Solder mask window; 20. Isolation ring; 21. Opening; 30. Circular mark. DETAILED DESCRIPTION

[0023] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.

[0024] It should be noted that the terms "including" and "having," as well as any variations thereof, in the specification and claims of the present invention are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to the process, method, product, or device. Terms such as "disposed" should be interpreted broadly, for example, and may refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, internal connections between two elements, or interactions between two elements, unless otherwise expressly defined. Terms such as "upper," "lower," "left," "right," "front," "back," and "bottom" indicate directions or positions based on those shown in the accompanying drawings. These are for ease of description only and should not be construed as limitations on the present invention.

[0025] It should be noted that existing PCB design approaches tend to maximize space utilization and minimize costs. Routing layout follows the principle of "routing wherever possible." This means increasing routing density as much as possible while minimizing PCB area, while still meeting electrical performance and safety regulations, thereby reducing material and production costs. This design strategy is effective in most cases.

[0026] As a key component for monitoring the temperature of circuit boards and their surroundings, the accuracy of temperature sensors is directly related to system overheat protection, energy management, and overall performance optimization. Temperature sensors must adjust the system's cooling strategy and energy consumption mode in real time based on ambient temperature changes to ensure efficient device operation while maintaining a safe and stable temperature range.

[0027] However, in practical applications, designers often overlook the routing of the temperature sensor chip. Internal routing is not zoned around the temperature sensor chip, causing heat generated by the internal routing to be transferred to the temperature sensor chip, resulting in inaccurate temperature measurements. This not only affects the system's overheat protection and energy management efficiency, but can also lead to overheating or overcooling of circuit board components due to temperature measurement deviations, further compromising the performance and reliability of the entire electronic system.

[0028] like Figure 1-Figure 2 As shown, this embodiment provides a circuit board structure that reduces interference and improves temperature measurement accuracy. By arranging an isolation ring 20 around the temperature sensor chip, a no-layout zone is formed in the area where the isolation ring 20 is located, thereby reducing external interference factors and ensuring that the working environment of the temperature sensor chip is relatively independent, thereby avoiding unnecessary heat transfer or electromagnetic interference and ensuring the accuracy of the temperature measurement data.

[0029] Specifically, it includes a packaging unit 10 connected to the pins of the temperature sensor chip on the circuit board 100, and the circuit board 100 is provided with an isolation ring 20 at the corresponding position of the packaging unit 10. The inner layer of the circuit board 100 corresponding to the isolation ring 20 is a prohibited area. The isolation ring 20 is in a "concave" shape and encloses the outside of the packaging unit 10. The isolation ring 20 is also provided with an opening 21. The opening 21 is used for the packaging unit 10 of the temperature sensor chip to lead out wiring on the surface and / or bottom layer of the circuit board 100 to connect other parts of the circuit board 100 or external equipment.

[0030] In one embodiment, the distance between the isolation ring 20 and the packaging unit 10 is no less than 30 mils. The width of the isolation ring 20 is 30 mils. A width of 30 mils can provide a sufficient physical barrier to effectively block heat transfer from other areas of the circuit board 100, thereby protecting the temperature sensor chip from interference from external temperature fluctuations.

[0031] In one embodiment, the packaging unit 10 includes a plurality of packaging pads 11 connected to the pins of the temperature sensor chip. The packaging pads 11 are arranged in pairs to ensure stable connection of the temperature sensor chip, thereby ensuring accuracy and stability of signal transmission.

[0032] The package pads 11 are arranged in a matrix of two columns and four rows. This arrangement optimizes the space utilization of the circuit board 100, facilitates precise alignment during the automated placement process, and reduces production errors.

[0033] The packaging unit 10 also includes a heat dissipation pad 12, which is located in the middle of the two rows of packaging pads 11. The heat generated by the temperature sensor chip during operation is quickly transferred to the heat dissipation pad 12 on the circuit board 100, thereby improving heat conduction efficiency. The width of the heat dissipation pad 12 is less than the spacing between the packaging pads 11 on either side, and the length of the heat dissipation pad 12 is less than the length from the leading end to the trailing end of the packaging pad 11 on the same side. The pad area formed by the packaging pads 11 covers the heat dissipation pad 12, ensuring optimal heat dissipation within a limited space while maintaining the layout space for other components.

[0034] A solder resist window 13 is provided on the periphery of the heat dissipation pad 12. The width of the solder resist window 13 ranges from 1 to 4 mils, ensuring sufficient heat dissipation area while avoiding mechanical strength degradation or potential electrical short circuit risks caused by overly wide windows.

[0035] A circular mark 30 formed by white paint silk screen is provided on the outside of the pin of the temperature sensor chip. The circular mark 30 is used to identify the direction of the pin of the surface-mount device. The circular mark 30 serves as a visual reference point, accurately indicating the direction of the pin of the temperature sensor chip, which greatly facilitates correct alignment during manual or automatic assembly.

[0036] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to this utility model.

[0037] The above is an exemplary description of the present utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the present utility model patent is not limited to the above-mentioned method. As long as various improvements are made using the method concept and technical solution of the present utility model patent, or the concept and technical solution of the present utility model patent are directly applied to other occasions without improvement, they are all within the scope of protection of the present utility model.

Claims

1. A circuit board structure for reducing interference and improving temperature measurement accuracy, characterized in that: The invention comprises a packaging unit provided on a circuit board and connected to the pins of a temperature sensor chip. The circuit board is provided with an isolation ring at a position corresponding to the packaging unit. The inner layer of the circuit board corresponding to the isolation ring is a prohibited area. The isolation ring is in a "concave" shape and encloses the outside of the packaging unit. The isolation ring is also provided with an opening, which is used for allowing the packaging unit of the temperature sensor chip to lead out on the surface layer and / or bottom layer of the circuit board.

2. A circuit board structure for reducing interference and improving temperature measurement accuracy according to claim 1, characterized in that: The distance between the isolation ring and the packaging unit is not less than 30 mil.

3. A circuit board structure for reducing interference and improving temperature measurement accuracy according to claim 1 or 2, characterized in that: The width of the isolation ring is 30 mil.

4. The circuit board structure for reducing interference and improving temperature measurement accuracy according to claim 1, characterized in that: The packaging unit includes a plurality of packaging pads connected to the pins of the temperature sensor chip, and the packaging pads are arranged in pairs.

5. A circuit board structure for reducing interference and improving temperature measurement accuracy according to claim 4, characterized in that: The package pads are arranged in a matrix of two columns and four rows.

6. The circuit board structure for reducing interference and improving temperature measurement accuracy according to claim 5, characterized in that: The packaging unit also includes a heat dissipation pad, which is located in the middle of the two rows of packaging pads. The width of the heat dissipation pad is smaller than the spacing between the packaging pads on both sides, and the length of the heat dissipation pad is smaller than the length from the beginning to the end of the packaging pad on the same side.

7. A circuit board structure for reducing interference and improving temperature measurement accuracy according to claim 6, characterized in that: A solder resist window is provided on the periphery of the heat dissipation pad.

8. The circuit board structure for reducing interference and improving temperature measurement accuracy according to claim 7, characterized in that: The width of the solder mask opening ranges from 1 to 4 mil.

9. The circuit board structure for reducing interference and improving temperature measurement accuracy according to claim 1, characterized in that: A circular mark formed by silk-screen printing with white paint is provided on the outside of the pin of the temperature sensor chip, and the circular mark is used to identify the direction of the pin of the surface-mounted device.

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