Automobile controller and vehicle

Abstract

The utility model relates to an automobile controller and a vehicle. The automobile controller comprises a first cover body, a second cover body and a circuit board assembly. Wherein the second cover body and the first cover body are buckled to form an accommodating cavity; the circuit board assembly is arranged in the accommodating cavity, the circuit board assembly comprises a circuit board, and the circuit board comprises functional areas with different heat dissipation functions; wherein the outer side, deviating from the circuit board, of the first cover body is provided with heat dissipation fins corresponding to the corresponding functional areas, and the density of the heat dissipation fins is in direct proportion to the heating value of the corresponding functional areas. The heat on the corresponding functional area can be transferred to the corresponding heat dissipation fins in a heat conduction mode, the heat dissipation fins dissipate the heat in an air flowing mode, and therefore the heat dissipation fins can dissipate the heat of the corresponding functional area, and the heat dissipation efficiency of the corresponding functional area is improved through the heat dissipation fins with the corresponding density in the corresponding functional area. According to the automobile controller, targeted heat dissipation can be realized, and local heat dissipation enhancement is carried out, so that the heat dissipation efficiency of the automobile controller can be well improved.

Description

Technical Field

[0001] The present application belongs to the field of automobile technology, and specifically relates to an automobile controller and a vehicle. Background Art

[0002] An automotive controller is an integrated controller used to manage and control multiple embedded electronic control units within a vehicle's electronic systems. Its primary functions include data processing and control, communication and network management, safety, and fault diagnosis. However, existing automotive controllers generate significant heat during vehicle operation due to chip processing, decoding complex data, and inter-device communication. Passive heat dissipation in controllers, which rely on airflow to dissipate heat, is ineffective, impacting the performance of the host computer. Therefore, improving controller heat dissipation is a pressing technical challenge. Utility Model Content

[0003] The present application provides an automobile controller and a vehicle to solve the technical problem of how to improve the heat dissipation effect of the automobile controller.

[0004] In order to solve the above technical problems, a technical solution adopted in this application is: an automobile controller, comprising: a first cover body; a second cover body, the second cover body and the first cover body are buckled together to form a accommodating cavity; a circuit board assembly, the circuit board assembly is arranged in the accommodating cavity, the circuit board assembly includes a circuit board, and the circuit board includes functional areas with different heat dissipation; wherein, the outer side of the first cover body facing away from the circuit board is provided with heat dissipation fins corresponding to the corresponding functional areas, and the density of the heat dissipation fins is proportional to the heat generation of the corresponding functional areas.

[0005] According to one embodiment of the present application, the first cover body is provided with a heat dissipation conduction part corresponding to the functional area, and the thermal conductivity of the heat dissipation conduction part is proportional to the heat dissipation of the corresponding functional area; the heat dissipation fins are arranged on the heat dissipation conduction part.

[0006] According to one embodiment of the present application, the functional area includes a first functional area and a second functional area, the heat generation of the first functional area is greater than that of the second functional area; the first cover body includes a cover plate having a mounting opening, the heat dissipation conduction part is installed on the cover plate and covers the mounting opening, and the thermal conductivity of the heat dissipation conduction part is greater than that of the cover plate; wherein, the orthographic projection of the first functional area toward the first cover body is located within the heat dissipation conduction part; and the portion of the cover plate opposite to the second functional area is also provided with heat dissipation fins.

[0007] According to an embodiment of the present application, the heat dissipation conducting portion and the first cover body insert are die-cast, and the heat dissipation conducting portion and the first cover body are integrally formed.

[0008] According to one embodiment of the present application, the functional area includes a plurality of electronic components, and the electronic components are all arranged on the side of the circuit board facing the first cover.

[0009] According to one embodiment of the present application, a heat conducting member is provided on the inner side of the first cover body facing the circuit board, and the orthographic projection of the heat conducting member toward the circuit board at least partially overlaps with the functional area.

[0010] According to one embodiment of the present application, the functional area includes a plurality of electronic components, and the heat conducting member is at least partially in contact with the electronic components.

[0011] According to one embodiment of the present application, a first metal part is provided on the outer periphery of the circuit board; a second metal part is provided on the inner side of the first cover body facing the second cover body corresponding to the first metal part; a third metal part is provided on the inner side of the second cover body facing the first cover body corresponding to the first metal part, wherein the first metal part is connected to the second metal part and the third metal part.

[0012] According to one embodiment of the present application, an antenna assembly is integrated on the circuit board; the first cover body and the second cover body each include a cover top and side walls connected to the cover top, and the side walls are connected to each other so that the first cover body and the second cover body are connected to each other to form the accommodating cavity; wherein, the side wall is provided with a recessed portion facing away from the outside of the accommodating cavity; the automobile controller also includes an antenna cover, and the antenna cover is U-shaped, and the antenna cover includes two oppositely arranged side portions and a top connecting the two side portions, the two sides are respectively connected to the cover top, and the top is connected to the side walls and blocks the recessed portion.

[0013] According to one embodiment of the present application, a metal block is further provided in each recessed portion, and each metal block is located between the corresponding side wall and the top, and respectively abuts against the corresponding top and the inner wall of the recessed portion.

[0014] In order to solve the above technical problems, another technical solution adopted in this application is: a vehicle, comprising any of the vehicle controllers described above.

[0015] The present application has the following beneficial effects: The automotive controller of the present application includes a first cover, a second cover, and a circuit board assembly. The second cover and the first cover are fastened together to form a receiving cavity. The circuit board assembly is disposed within the receiving cavity. The circuit board assembly includes a circuit board, which includes functional areas with different heat dissipation functions. Heat dissipation fins corresponding to the corresponding functional areas are disposed on the outer side of the first cover, facing away from the circuit board. The density of the heat dissipation fins is proportional to the heat output of the corresponding functional area. Since a greater density of heat dissipation fins provides a larger heat exchange area and better heat dissipation, the density of the heat dissipation fins is proportional to the heat output of the corresponding functional area. This results in a denser density of heat dissipation fins in areas with greater heat output on the circuit board. Consequently, the amount of heat dissipated by the heat dissipation fins is greater. This allows heat from the functional areas with greater heat output to be dissipated more quickly through the heat dissipation fins, avoiding the problem of delayed heat dissipation and improving heat dissipation. Thus, by distributing heat dissipation fins at corresponding densities in corresponding functional areas, the present application achieves targeted heat dissipation and enhances local heat dissipation, thereby significantly improving the heat dissipation efficiency of the automotive controller. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:

[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of an embodiment of an automobile controller of the present application;

[0018] Figure 2 This is a schematic diagram of the exploded structure of an embodiment of the automobile controller of the present application;

[0019] Figure 3 It is a structural schematic diagram of the antenna cover of an embodiment of the automobile controller of the present application. DETAILED DESCRIPTION

[0020] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It will be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some, rather than all, structures related to the present application are shown in the accompanying drawings. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0021] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0022] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the described features. In the description of this application, "plurality" means two or more, unless otherwise specifically specified.

[0023] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0024] The automobile controller in this application can be applied to related structures such as vehicles, rail transportation or industrial equipment. This application will be explained by taking the application of the automobile controller in a vehicle as an example.

[0025] See also Figures 1 to 2 , Figure 1 This is a schematic diagram of the three-dimensional structure of an embodiment of an automobile controller of the present application; Figure 2 It is a schematic diagram of the exploded structure of an embodiment of the automobile controller of the present application.

[0026] One embodiment of the present application provides an automobile controller 10. The automobile controller 10 includes a first cover 11, a second cover 12, and a circuit board assembly 13. The second cover 12 and the first cover 11 are fastened together to form a receiving cavity 111. The circuit board assembly 13 is disposed within the receiving cavity 111. The circuit board assembly 13 includes a circuit board 131. The circuit board 131 includes functional areas 133 with different heat dissipation properties. Heat dissipation fins 132 corresponding to the corresponding functional areas 133 are disposed on the outer side of the first cover 11 facing away from the circuit board 131. The density of the heat dissipation fins 132 is proportional to the heat generated by the corresponding functional areas 133.

[0027] As can be seen from the above structure, the first cover body 11 and the second cover body 12 are buckled together to form a accommodating cavity 111, and the circuit board assembly 13 is arranged in the accommodating cavity 111. The accommodating cavity 111 can play a certain protective role for the circuit board 131 and the remaining functional components arranged on the circuit board 131, so as to prevent the circuit board assembly 13 from being affected by dust or accumulated water during the use of the vehicle, thereby improving the service life of the circuit board assembly 13.

[0028] Secondly, because the functional areas 133 on the circuit board 131 have different heat dissipation conditions, heat dissipating fins 132 corresponding to the functional areas 133 are provided on the outer side of the first cover plate 114 facing away from the circuit board 131. Heat from the corresponding functional areas 133 can be transferred to the corresponding heat dissipating fins 132 via heat conduction. The heat dissipating fins 132 then dissipate the heat via air flow, thereby allowing the heat dissipating fins 132 to dissipate heat from the corresponding functional areas 133. Furthermore, since a greater density of heat dissipating fins 132 provides a larger heat exchange area and a better heat dissipation effect, the density of heat dissipating fins 132 is proportional to the heat generation of the corresponding functional areas 133. This results in a denser density of heat dissipating fins 132 in areas with greater heat generation on the circuit board 131. Consequently, a greater amount of heat is dissipated through the heat dissipating fins 132, allowing the heat from the functional areas 133 with greater heat generation to be dissipated quickly through the heat dissipating fins 132, thereby avoiding the problem of delayed heat dissipation and improving the heat dissipation effect. It can be seen that the present application can achieve targeted heat dissipation and enhance local heat dissipation by providing heat dissipation fins 132 of corresponding density in corresponding functional areas 133, thereby greatly improving the heat dissipation efficiency of the automobile controller 10.

[0029] Please continue reading Figure 2 In one embodiment of the present application, a heat dissipation conduction portion 112 corresponding to the corresponding functional area 133 is provided on the first cover body 11, and the thermal conductivity of the heat dissipation conduction portion 112 is proportional to the heat generation of the corresponding functional area 133. The heat dissipation fins 132 are provided on the heat dissipation conduction portion 112. Specifically, the heat dissipation conduction portion 112 can conduct the heat of the corresponding functional area 133 to the first cover body 11 by heat conduction, and then transfer the heat on the first cover body 11 to the heat dissipation fins 132 by heat conduction, so that the heat dissipation fins 132 can dissipate heat from the corresponding functional area 133. The provision of the heat dissipation conduction portion 112 can play a certain role in conducting the heat of the corresponding functional area 133, thereby facilitating the heat dissipation of the heat of the corresponding functional area 133 by the heat dissipation fins 132, so as to better improve the heat dissipation effect of the heat dissipation fins 132. In addition, the greater the heat generation of the corresponding functional area 133, the greater the thermal conductivity of the heat dissipation conduction part 112, and thus the better the heat dissipation effect of the corresponding functional area 133, which can achieve targeted heat dissipation and local heat dissipation enhancement, thereby improving the heat dissipation efficiency of the automobile controller 10.

[0030] The heat dissipation conductive portion 112 in the present application can be a die-cast part or a cold-forged part. Specifically, for areas of the functional area 133 where heat dissipation requirements are low, the heat dissipation conductive portion 112 can be a die-cast part, and low-density heat dissipation fins 132 can be provided on the heat dissipation conductive portion 112 for heat dissipation. For areas of the functional area 133 where heat dissipation requirements are high, the heat dissipation conductive portion 112 can be a cold-forged part made of a material with a high thermal conductivity coefficient, and high-density heat dissipation fins 132 can be provided on the heat dissipation conductive portion 112 for heat dissipation. This can achieve localized heat dissipation enhancement, further improving the heat dissipation effect of the automotive controller 10.

[0031] It should be noted that in the present application, the first cover 11 can be formed by die-casting of an aluminum alloy, and the heat dissipation conducting portion 112 can be die-cast as an insert with the first cover 11. The heat dissipation conducting portion 112 and the first cover 11 are integrally formed. This can fully utilize the properties of the material and take advantage of the manufacturing advantages of die-casting and cold forging processes, greatly saving production costs. Of course, in other embodiments, the die-casting and cold forging parts can also be set on the first cover 11 by other means, such as direct fixing, embedded installation, or combined assembly, which are not limited here.

[0032] In one embodiment of the present application, the functional area 133 includes a first functional area 1331 and a second functional area 1332. The first functional area 1331 generates more heat than the second functional area 1332. The first cover 11 includes a cover plate 114 having a mounting opening 113. The heat dissipation conductive portion 112 is mounted on the cover plate 114 and covers the mounting opening 113. The heat dissipation conductive portion 112 has a greater thermal conductivity than the cover plate 114. The provision of the mounting opening 113 on the cover plate 114 provides sufficient space for the heat dissipation conductive portion 112. And because the thermal conductivity of the heat dissipation conduction part 112 is greater than that of the cover plate 114, the heat dissipation conduction part 112 can directly conduct the heat of the first functional area 1331 to the heat dissipation fins 132 for heat dissipation. Compared with directly setting the heat dissipation conduction part 112 on the cover plate 114, the heat of the first functional area 1331 is indirectly transmitted to the heat dissipation conduction part 112 through the cover plate 114 and then transmitted to the heat dissipation fins 132. The heat dissipation effect in this application is better.

[0033] Furthermore, the orthographic projection of the first functional area 1331 toward the first cover 11 is located within the heat dissipation conductive portion 112. This ensures that all heat from the first functional area 1331 is transferred to the heat dissipation conductive portion 112, and then to the heat dissipation fins 132 for dissipation. This approach effectively prevents some heat from being transferred from the first functional area 1331 to the cover 114, thereby affecting the overall heat dissipation effect.

[0034] Furthermore, the portion of the cover 114 opposite the second functional area 1332 is also provided with heat dissipating fins 132, which dissipate heat from the second functional area 1332. This approach allows for zoned heat dissipation of the different functional areas 133 on the circuit board 131. The provision of heat dissipating fins 132 on both the first functional area 1331 and the second functional area 1332 improves the heat dissipation efficiency of the automotive controller 10 by increasing the heat dissipation area. Furthermore, this also enhances localized heat dissipation, thereby improving the controller's heat dissipation performance.

[0035] In one embodiment of the present application, the functional area 133 includes several electronic components (not shown), which are all arranged on the side of the circuit board 131 facing the first cover 11. This arrangement can make the arrangement space of the first cover 11 and the second cover 12 smaller, thereby reducing the overall size of the automobile controller 10 and achieving a miniaturized configuration of the automobile controller 10.

[0036] Among them, electronic components may include chips, sensors, capacitors, power management modules, MOS tubes, transceivers, microprocessors, etc., which will not be listed here one by one.

[0037] In one embodiment of the present application, a heat conductor (not shown) is provided on the inner side of the first cover 11 facing the circuit board 131. Because heat conductors have excellent thermal conductivity, providing the heat conductor on the inner side of the first cover 11 facing the circuit board 131 effectively improves the thermal conductivity of the first cover 11. Furthermore, because the functional area 133 generates a relatively large amount of heat, the orthographic projection of the heat conductor toward the circuit board 131 at least partially overlaps with the functional area 133. This improves the thermal conductivity of the first cover 11 corresponding to the functional area 133, thereby enhancing local heat dissipation in the functional area 133 and further improving the heat dissipation of the automotive controller 10.

[0038] Preferably, the positive projection of the heat conductor toward the circuit board 131 coincides with the functional area 133. In this case, not only can the thermal conductivity at the position of the first cover plate 114 corresponding to the functional area 133 be improved, thereby achieving enhanced local heat dissipation of the functional area 133, but also the setting area of ​​the heat conductor can be reduced, thereby saving production costs.

[0039] Of course, in some other embodiments, the orthographic projection area of ​​the heat conducting member toward the circuit board 131 may also be larger or smaller than the orthographic projection area of ​​the functional area 133 toward the circuit board 131 , which is not limited here.

[0040] The heat conducting member may be thermal grease, thermal silicone pad, thermal potting glue, thermal silicone sheet or metal heat conducting sheet, etc., which is not limited here.

[0041] In one embodiment of the present application, the functional area 133 includes several electronic components, and the heat conductor is at least partially in contact with the electronic components. Due to the excellent thermal conductivity of the heat conductor, by at least partially contacting the electronic components, the heat generated by the electronic components can be directly transferred to the heat dissipation conductive portion 112, and then to the heat dissipation fins 132 for dissipation. This approach can further improve the heat dissipation effect of the automotive controller 10.

[0042] In one embodiment of the present application, the automobile controller 10 further includes a support frame 115, which is secured to the side of the circuit board 131 facing the second cover 12 via fasteners. The orthographic projection of the electronic component on the circuit board 131 partially overlaps with the support frame 115, thereby limiting the position of the electronic component. Since the circuit board 131 generally has a certain degree of toughness, when the support frame 115 is secured to the side of the circuit board 131 facing the second cover 12 via fasteners, the circuit board 131 at the position of the support frame 115 will deform toward the side closer to the first cover 11. As a result, the electronic component will also move closer to the side of the first cover 11 as the circuit board 131 deforms. On the one hand, the electronic component can be fixed between the circuit board 131 and the heat conductive member, thereby providing a certain degree of position limiting the electronic component. On the other hand, the distance between the electronic component and the heat conductive member can be reduced, so that the heat of the electronic component can be transferred to the heat conductive member more quickly, reducing the diffusion of the heat of the electronic component, thereby improving the heat dissipation effect of the automobile controller 10.

[0043] When the support frame 115 is positioned on the side of the circuit board assembly 13 facing the second cover 12, adhesive is provided on the bottom of the support frame 115, that is, on the side of the support frame 115 facing the circuit board 131. The support frame 115 is first adhered to the circuit board 131 using the adhesive, and then fastened to the circuit board 131 using fasteners to achieve installation. The adhesive provides a preliminary positioning function for the installation of the support frame 115, while the fasteners further enhance the connection strength between the support frame 115 and the circuit board 131.

[0044] In one embodiment of the present application, a first metal member (not shown) is provided on the outer periphery of the circuit board 131; a second metal member (not shown) is provided on the inner side of the first cover 11 facing the second cover 12, corresponding to the first metal member; and a third metal member (not shown) is provided on the inner side of the second cover 12 facing the first cover 11, corresponding to the first metal member. The first metal member is connected to the second and third metal members. In the present application, the provision of the first, second, and third metal members can effectively reduce the penetration of electromagnetic fields, thereby effectively alleviating the impact of electromagnetic interference on the electronic components within the circuit board 131, ensuring the normal operation of the electronic components on the circuit board 131. Furthermore, the provision of these metal members can shield external magnetic fields, preventing them from intruding into the electronic components on the circuit board, thereby improving the reliability of the automotive controller 10. Furthermore, the use of metal members to reduce electromagnetic interference can also reduce localized heating caused by electromagnetic interference, thereby indirectly improving the heat dissipation performance of the automotive controller 10.

[0045] In addition, since the first metal part connects the second metal part and the third metal part, it can also ensure that the front and back surfaces of the circuit board 131 are evenly stressed, thereby preventing the circuit board 131 from warping due to uneven stress and causing shielding failure.

[0046] In one embodiment of the present application, an antenna assembly (not shown in the figure) is integrated on the circuit board 131. In this case, the number of parts of the automobile controller 10 can be reduced, thereby reducing the volume of the automobile controller 10, realizing a miniaturized design of the automobile controller 10, and at the same time improving the integration of the automobile controller 10.

[0047] Furthermore, the first cover 11 and the second cover 12 each include a cover top and side walls connected to the cover tops. The side walls are connected to each other so that the first cover 11 and the second cover 12 are connected to each other to form a receiving cavity 111. The side walls are provided with a recessed portion 121 on the outside of the receiving cavity 111. The automobile controller 10 also includes an antenna cover 14. The antenna cover 14 is U-shaped and includes two oppositely disposed side portions 141 and a top portion 142 connecting the two side portions 141. The two side portions 141 are respectively connected to the cover tops, and the top portion 142 is connected to the side walls and blocks the recessed portion 121. The provision of the recessed portion 121 can effectively prevent metal from distorting the antenna radiation field and affecting signal transmission and reception, thereby improving the signal transmission and reception performance of the antenna assembly. The setting of the antenna cover 14 can provide a certain degree of protection for the antenna assembly integrated on the circuit board 131, so as to prevent the antenna assembly from being damaged by sewage or dust entering the circuit board 131 during vehicle driving, thereby affecting the reception and transmission of signals by the antenna assembly.

[0048] In order to ensure the signal receiving and transmitting functions of the antenna assembly, the antenna cover 14 is usually made of plastic or other non-metallic materials, which is not limited here.

[0049] See also Figure 3 , Figure 3 The figure is a schematic diagram of the structure of the antenna cover of an embodiment of the automotive controller of the present application. The top 142 of the antenna cover 14 is interspersed with a plurality of through-holes 1421. A positioning tab (not shown) is also provided on the side of the top 142 of the antenna cover 14 facing the circuit board 131. A triangular reinforcement 1411 is provided at the end of the antenna cover 14. The reinforcement 1411 is connected to the top 142 and the end, and a positioning boss 1412 is also provided on the reinforcement 1411. During installation, the antenna cover 14 is first positioned perpendicular to the plane of the side 141 using the positioning tab. The positioning boss 1412 then positions the antenna cover 14 perpendicular to the plane of the top 142 using the positioning tab. Finally, the antenna cover 14 is installed and secured using fasteners passing through the through-holes 1421. This installation method can, on the one hand, reduce installation errors of the antenna cover 14 and improve the protective effect of the antenna cover 14, and on the other hand, improve the efficiency of the installation of the antenna cover 14 by the staff. In addition, because the triangle shape has good stability, the ends of the antenna cover 14 are provided with reinforcements 1411 connected to the top 142 and the side 141, which can also greatly improve the structural strength of the antenna cover 14 and achieve full coverage of the recessed portion 121, further improving the protective effect of the antenna cover 14.

[0050] Please continue reading Figure 2 In order to prevent interference with the signals transmitted or received by the antenna assembly, in the embodiment of the present application, a metal block 143 is further provided in each recessed portion 121. The provision of the metal block 143 not only prevents interference between multiple signals when the antenna assembly transmits signals, thereby improving the stability and reliability of communication, but also prevents interference between multiple signals during signal reception, thereby improving the quality of the received signal. Furthermore, each metal block 143 is located between the side wall and the top 142, and respectively abuts against the corresponding top 142 and the inner wall of the recessed portion 121. This makes the signal strength received and transmitted by the antenna assembly more uniform, thereby enhancing the stability and reliability of communication of the vehicle controller 10.

[0051] In the embodiment of the present application, the first cover 11 and the second cover 12 are square in structure. A snap portion is provided at each opposite end of each side of the first cover 11, and a connecting portion is provided at each opposite end of each side of the second cover 12 corresponding to the snap portion. When the first cover 11 and the second cover 12 are fastened together to form the installation cavity, the snap portion and the connecting portion engage. On the one hand, this can avoid installation errors in the extension direction of each side of the first cover 11 and the second cover 12, thereby ensuring the tightness of the first cover 11 and the second cover 12 when fastened together, thereby improving the sealing performance of the installation cavity and preventing the service life of the circuit board assembly 13 from being affected by installation errors between the first cover 11 and the second cover 12. On the other hand, the snap portion and the connecting portion engage in a simple installation method, which can effectively improve the installation efficiency of the production personnel. In addition, to improve the installation strength of the first cover 11 and the second cover 12, after the snap portion and the connecting portion are fastened together, a fastener is used to lock them, thereby improving the installation strength of both and improving the reliability of the automobile controller 10.

[0052] Furthermore, during the installation of the circuit board assembly 13, positioning holes and waist-shaped holes are provided on the circuit board assembly 13. Positioning posts are provided on the first cover 11 corresponding to the positioning holes. The posts are inserted into the positioning holes to position the circuit board assembly 13. Furthermore, limiting posts are provided on the first cover 11 corresponding to the waist-shaped holes. The limiting posts are inserted into the waist-shaped holes to limit the position of the circuit board 131. Therefore, when the circuit board assembly 13 is installed on the first cover 11, the coordination between the positioning holes and the positioning posts, and between the waist-shaped holes and the limiting posts, can reduce the difficulty of positioning the circuit board assembly 13, thereby improving the efficiency of the production staff in installing the circuit board assembly 13.

[0053] Another embodiment of the present application provides a vehicle, which includes any of the above-mentioned automobile controllers 10 .

[0054] It should be noted that terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or vertical, but rather that they may be slightly tilted. Terms such as "parallel" and "perpendicular" do not imply that components are absolutely parallel or perpendicular to each other, but rather that they may form a certain angular deviation. For example, "horizontal" simply means that its direction is more horizontal than "vertical" and does not mean that the structure must be completely horizontal, but rather that it may be slightly tilted. Furthermore, terms such as "center," "longitudinal," "transverse," "length," "width," "thickness," "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," "clockwise," and "counterclockwise" indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships typically used when the products of this application are used. These terms are intended solely to facilitate the description of the embodiments of this application and to simplify the description, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0055] It is understood that the meaning of "plurality" herein is at least two, such as two, three, etc., unless there is a special limitation. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units that are inherent to these processes, methods, products or devices. The term "and / or" is merely a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the related objects before and after are in an "or" relationship.

[0056] The above description is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An automobile controller, characterized in that: include: a first cover; a second cover body, wherein the second cover body and the first cover body are buckled together to form a receiving cavity; A circuit board assembly is disposed in the accommodating cavity, the circuit board assembly includes a circuit board, and the circuit board includes functional areas with different heat dissipation; Wherein, heat dissipation fins corresponding to the functional areas are provided on the outer side of the first cover body away from the circuit board, and the density of the heat dissipation fins is proportional to the heat generation of the corresponding functional areas.

2. The automobile controller according to claim 1, characterized in that: The first cover is provided with a heat dissipation conducting portion corresponding to the functional area, and the thermal conductivity of the heat dissipation conducting portion is proportional to the heat dissipation of the corresponding functional area; The heat dissipation fins are arranged on the heat dissipation conducting portion.

3. The automobile controller according to claim 2, characterized in that: The functional area includes a first functional area and a second functional area, and the heat generation of the first functional area is greater than that of the second functional area; The first cover body includes a cover plate having a mounting opening, the heat dissipation conducting portion is mounted on the cover plate and covers the mounting opening, and the heat dissipation conducting portion has a greater thermal conductivity than the cover plate; wherein the orthographic projection of the first functional area toward the first cover body is located within the heat dissipation conducting portion; The portion of the cover plate opposite to the second functional area is also provided with heat dissipation fins.

4. The automobile controller according to claim 2, characterized in that: The heat dissipation conducting portion and the first cover body insert are die-cast, and the heat dissipation conducting portion and the first cover body are integrally formed.

5. The automobile controller according to claim 1, characterized in that: The functional area includes a plurality of electronic components, and the electronic components are all arranged on the side of the circuit board facing the first cover.

6. The automobile controller according to any one of claims 1 to 3, characterized in that: A heat conducting member is provided on the inner side of the first cover body facing the circuit board, and an orthographic projection of the heat conducting member toward the circuit board at least partially overlaps with the functional area.

7. The automobile controller according to claim 6, characterized in that: The functional area includes a plurality of electronic components, and the heat conducting member is at least partially in contact with the electronic components.

8. The automobile controller according to claim 1, characterized in that: The outer periphery of the circuit board is provided with a first metal part; A second metal piece is provided on the inner side of the first cover body facing the second cover body corresponding to the first metal piece; A third metal piece is provided on the inner side of the second cover body facing the first cover body corresponding to the first metal piece, wherein the first metal piece is connected to the second metal piece and the third metal piece.

9. The automobile controller according to claim 1, characterized in that: An antenna assembly is integrated on the circuit board; The first cover body and the second cover body each include a cover top and a side wall connected to the cover top, the side walls are connected to each other so that the first cover body and the second cover body are connected to each other to form the accommodating cavity; wherein the side wall is provided with a recessed portion on the outside facing away from the accommodating cavity; The automobile controller also includes an antenna cover, which is U-shaped and includes two oppositely arranged side portions and a top connecting the two side portions. The two side portions are respectively connected to the top of the cover, and the top is connected to the side wall and blocks the recessed portion.

10. The automobile controller according to claim 9, characterized in that: A metal block is further provided in each of the recessed portions. Each of the metal blocks is located between the corresponding side wall and the top, and respectively abuts against the corresponding top and the inner wall of the corresponding recessed portion.

11. A vehicle, characterized in that: The vehicle controller comprises the vehicle controller as described in any one of claims 1-10.

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