Integrated heat dissipation device

Abstract

The utility model provides an integrated heat dissipation device, which comprises a heat conduction base, a cover plate and a fin group, a plurality of cavities are arranged on the heat conduction base, the cover plate is arranged on the cavities of the heat conduction base, and the fin group is arranged on the cover plate. The fin group comprises a plurality of heat dissipation fins arranged side by side, a plurality of heat dissipation grid flow channels are arranged on the heat dissipation fins, the heat dissipation grid flow channels are mutually independent, the number of the heat dissipation grid flow channels corresponds to the number of the cavities, and each heat dissipation grid flow channel is communicated with the corresponding cavity. Each heat dissipation grid flow channel is provided with a connecting inlet and a connecting outlet, the connecting inlets and the connecting outlets are distributed up and down, and the connecting inlets and the connecting outlets are both communicated with the cavity. Working fluid is arranged in the cavity and the heat dissipation grid flow channel. The integrated heat dissipation device can solve the problems that electronic components arranged in multiple layers cannot dissipate heat in time, and the heat dissipation efficiency is not uniform, so that the heat dissipation performance is improved, and the heat dissipation device is convenient to install and arrange.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, in particular to an integrated heat dissipation device. Background Art

[0002] With the development of the electronics industry, the computing speed of electronic components such as central processing units has increased significantly, and the heat they generate has also increased dramatically. In order to ensure the normal operation of electronic components, heat dissipation devices are usually installed on them to dissipate the heat of the electronic components.

[0003] In the prior art, a Chinese utility model patent with publication number CN213543313U, entitled "A Heat Dissipation Device," discloses a heat dissipation device comprising a base and a plurality of heat dissipation fins, wherein the base has at least one internal flow channel for filling with a phase-change fluid. Each of these heat dissipation fins comprises a plate body and at least one tube body, each of these plate bodies having an extended flow channel, which is connected to at least one internal flow channel through the tube body. During use, the phase-change fluid in the internal flow channel vaporizes upon heating and flows toward the extended flow channel, and the phase-change fluid in the extended flow channel liquefies and then flows back to the internal flow channel to form an internal cooling cycle, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0004] However, in some devices, where multiple electronic components are closely arranged, particularly in multiple layers, using existing heat dissipation devices can result in the bottom electronic components being in the liquid working fluid (liquefied phase-change fluid) region, while the top electronic components are in the vaporized working fluid (vaporized phase-change fluid) region. In this case, the heat from the electronic components in the vaporized phase-change fluid region cannot be properly transferred to the phase-change fluid. This prevents these components from dissipating their heat in a timely manner, resulting in uneven heat dissipation across the multiple electronic components and affecting the normal operation of the device.

[0005] Therefore, the present invention designs an integrated heat dissipation device to overcome the above technical problems. Utility Model Content

[0006] In response to the shortcomings of the existing technology, the utility model provides an integrated heat dissipation device, which can solve the problem that multi-layered electronic components cannot dissipate heat in time and the heat dissipation efficiency is uneven, thereby improving the heat dissipation performance and facilitating the installation and layout of the heat dissipation device.

[0007] The purpose of this utility model is achieved through the following technical solutions:

[0008] An integrated heat dissipation device comprises: a heat conducting base, a cover plate, and a fin group, wherein the heat conducting base is provided with a plurality of cavities, the cover plate is provided on the cavities of the heat conducting base, and the fin group is provided on the cover plate;

[0009] The fin group includes a plurality of heat dissipation fins arranged side by side, and a plurality of heat dissipation grid flow channels are provided on the heat dissipation fins. The plurality of heat dissipation grid flow channels are independent of each other, the number of the heat dissipation grid flow channels corresponds to the number of the cavities, and each of the heat dissipation grid flow channels is connected to the corresponding cavity;

[0010] Working fluid is provided in the cavity and the heat dissipation grid flow channel.

[0011] In one embodiment, each of the heat dissipation grid flow channels is provided with a connection inlet and a connection outlet, the connection inlet and the connection outlet are distributed up and down, and both the connection inlet and the connection outlet are connected to the cavity.

[0012] In one embodiment, in the same heat dissipation grid flow channel, the heat dissipation grid flow channel is divided into a condensation zone and an evaporation zone according to the liquid level position of the working fluid therein, the connection inlet corresponds to the condensation zone, and the connection outlet corresponds to the evaporation zone;

[0013] During operation, the working fluid is in a gaseous state in the condensation zone, and in a liquid state in the evaporation zone.

[0014] In one embodiment, the heat dissipation grid flow channel is a honeycomb structure;

[0015] The heat dissipation grid flow channel is inclined upward, and in the same heat dissipation grid flow channel, the side away from the connection inlet has a highest point and a lowest point, the highest point is higher than the connection inlet, and the lowest point is higher than the connection outlet.

[0016] In one embodiment, the number of the cavities is three, and correspondingly, three heat dissipation grid flow channels are provided on the same heat dissipation fin, and the three heat dissipation grid flow channels respectively correspond to and connect the three cavities.

[0017] In one embodiment, there are two cover plates, the two cover plates are respectively a first cover plate and a second cover plate, the three cavities are respectively a first cavity, a second cavity and a third cavity, the first cover plate is covered on the first cavity, the second cover plate is covered on the second cavity and the third cavity, and a gap is formed between the first cover plate and the second cover plate.

[0018] In one embodiment, a positioning through hole is provided on the cover plate, and the positioning through hole is adapted to the connection inlet and the connection outlet.

[0019] In one embodiment, a plurality of cylindrical nails are provided on the heat-conducting base, and the cylindrical nails are located in the cavity. When the cover plate is closed on the cavity, the cylindrical nails support the cover plate.

[0020] In summary, the integrated heat dissipation device of the present invention can solve the problem that multi-layered electronic components cannot dissipate heat in time and the heat dissipation efficiency is uneven, thereby improving the heat dissipation performance and facilitating the installation and layout of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for use in the embodiments.

[0022] Figure 1 This is a schematic structural diagram of the integrated heat dissipation device of the present utility model;

[0023] Figure 2 for Figure 1 An exploded schematic diagram of the integrated heat sink shown;

[0024] Figure 3 This is a schematic diagram of the state where the heat sink fins are installed on the heat conductive base;

[0025] Figure 4 is a planar schematic diagram of the heat dissipation fins;

[0026] Figure 5 is a planar cross-sectional view of the integrated heat dissipation device in operation;

[0027] Figure 6 Schematic diagram of the structure of the thermal base and cover. DETAILED DESCRIPTION

[0028] To facilitate understanding of the present invention, the present invention will be described in more detail below with reference to the accompanying drawings. Those skilled in the art can easily understand the other advantages and effects of the present invention from the contents disclosed in this specification. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in this specification for those skilled in the art to understand and read, and are not intended to limit the applicable conditions for the implementation of the present invention. Therefore, they have no substantial technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size, without affecting the effects and objectives that can be achieved by the present invention, should still fall within the scope of the technical content disclosed in this utility model. Furthermore, terms such as "upper," "lower," "left," "right," and "center" used in this specification are only used for clarity of description and are not intended to limit the applicable scope of the present invention. Changes or adjustments to their relative relationships are also considered to be within the applicable scope of the present invention without substantial changes to the technical content.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of this invention are intended solely for the purpose of describing specific embodiments and are not intended to limit this invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0030] The utility model provides an integrated heat dissipation device 10, such as Figure 1 and Figure 2 As shown, it comprises: a heat conducting base 100, a cover plate 200, and a fin group 300. The heat conducting base 100 is provided with a plurality of cavities 110, the cover plate 200 is provided on the cavities 110 of the heat conducting base 100, and the fin group 300 is provided on the cover plate 200.

[0031] Among them, such as Figure 2 As shown, the fin group 300 includes a plurality of heat dissipation fins 310 arranged side by side, and a plurality of heat dissipation grid flow channels 311 (such as Figure 3 As shown), multiple heat dissipation grid channels 311 are independent of each other. The number of heat dissipation grid channels 311 corresponds to the number of cavities 110, and each heat dissipation grid channel 311 is connected to the corresponding cavity 110. A working fluid is provided in the cavity 110 and the heat dissipation grid channel 311. The working fluid is a phase change fluid, such as pure water or refrigerant, which will vaporize and float upward after being heated, and will liquefy and flow downward after releasing heat and condensing. During use, the working fluid circulates in the cavity 110 and the heat dissipation grid channel 311, and continuously vaporizes and liquefies during the circulation, thereby achieving heat dissipation (the specific working principle will be explained below).

[0032] like Figure 3 As shown, each heat dissipation grid flow channel 311 is provided with a connection inlet 312 and a connection outlet 313 , the connection inlet 312 and the connection outlet 313 are distributed up and down, and both the connection inlet 312 and the connection outlet 313 are connected to the cavity 110 .

[0033] Preferably, Figure 4 As shown, within the same heat dissipation grid channel 311, the heat dissipation grid channel 311 is divided into a condensation zone 301 and an evaporation zone 302 based on the liquid level of the working fluid therein. The connection inlet 312 corresponds to the condensation zone 301, and the connection outlet 313 corresponds to the evaporation zone 302. During operation, the working fluid is in a gaseous state in the condensation zone 301, and in a liquid state in the evaporation zone 302.

[0034] In this embodiment, if Figure 2 and Figure 3As shown, there are three cavities 110 . Accordingly, three heat dissipation grid channels 311 are provided on the same heat dissipation fin 310 . The three heat dissipation grid channels 311 correspond to and communicate with the three cavities 110 , respectively.

[0035] The working principle of the integrated heat dissipation device 10 of the present invention is described below. Figure 4 and Figure 5 :

[0036] It should be noted in advance that each cavity 110 and the corresponding heat dissipation grid flow channel 311 form a closed circulation whole, and there are three circulation wholes in this embodiment;

[0037] Taking one of the circulation systems as an example, during operation, one side of the heat-conducting base 100 is in close contact with the external heat-generating electronic component 20. The heat generated by the electronic component 20 will be transferred to the heat-conducting base 100 and heat the working fluid in the cavity 110. The working fluid is vaporized by the heat and becomes steam. These vapors will rise and enter the condensation zone 301 of the heat dissipation grid flow channel 311 through the connecting inlet 312. Subsequently, the vaporized working fluid in the condensation zone 301 transfers heat to the heat dissipation fins 310 and dissipates it into the air, thereby achieving heat dissipation. During this period, the working fluid after releasing heat will return to liquid form and flow back to the evaporation zone 302 of the heat dissipation grid flow channel 311 under the action of gravity, and then return to the cavity 110 through the connecting outlet 313, thus completing the cycle.

[0038] Compared with the prior art, the present embodiment has a total of three circulation entities, and according to the distribution relationship of the three cavities 110, the three circulation entities are also arranged from top to bottom, so that the three circulation entities can cope with multiple electronic components 20 arranged and distributed in three layers. The reason for this design is that in the prior art, when multiple electronic components are arranged in multiple layers, using the heat dissipation device of the prior art, the bottom electronic components will be in the area of ​​liquefied working fluid, while the top electronic components will be in the area of ​​vaporized working fluid. At this time, the heat of the electronic components in the area of ​​vaporized working fluid cannot be normally transferred to the working fluid, which causes the heat of these electronic components to be unable to be dissipated in time, resulting in uneven heat dissipation of multiple electronic components, affecting the normal use of the equipment. The integrated heat dissipation device 10 of the present embodiment has three circulation entities, which means that it has three evaporation zones 302 (equivalent to the area of ​​liquefied working fluid), which enables the electronic components 20 arranged and distributed in three layers to be able to dissipate heat in time, and the heat dissipation efficiency is similar.

[0039] Preferably, Figure 4As shown, the heat dissipation mesh channel 311 has a honeycomb structure. Furthermore, the heat dissipation mesh channel 311 is tilted upward. Within the same heat dissipation mesh channel 311, the side away from the connection inlet 312 has a highest point and a lowest point. The highest point is located above the connection inlet 312, and the lowest point is located above the connection outlet 313. This design ensures that the heat dissipation mesh channel 311 has a larger condensation zone 301 and also facilitates the return of the liquefied working fluid to the evaporation zone 302.

[0040] Preferably, the cover plate 200 is provided with a positioning through hole 201 (such as Figure 2 As shown, the positioning through hole 201 is adapted to connect the connection inlet 312 and the connection outlet 313. During assembly, the heat sink 310 is inserted into the positioning through hole 201 of the cover plate 200, and the heat sink 310 is welded to the cover plate 200, and the connection inlet 312 and the connection outlet 313 are sealed with the positioning through hole 201.

[0041] Preferably, the heat conducting base 100 is provided with a plurality of cylindrical pins 120 (such as Figure 6 As shown), the cylindrical nail 120 is located in the cavity 110. When the cover plate 200 is covered on the cavity 110, the cylindrical nail 120 supports the cover plate 200 to prevent the cover plate 200 from collapsing and deforming.

[0042] Furthermore, it is found in actual use that the cover plate 200 that is too long is prone to deformation during the welding process, causing leakage of the working fluid. Figure 6 As shown, the number of cover plates 200 is designed to be two. The two cover plates 200 are respectively referred to as the first cover plate 210 and the second cover plate 220. At the same time, the three cavities 110 are respectively referred to as: the first cavity 111, the second cavity 112 and the third cavity 113. During assembly, the first cover plate 210 is covered on the first cavity 111, and the second cover plate 220 is covered on the second cavity 112 and the third cavity 113, and a gap is formed between the first cover plate 210 and the second cover plate 220. The divided cover plates 200 will not show obvious deformation during welding, and the existence of the gap means that even if welding expansion deformation occurs, there will be no squeezing between the first cover plate 210 and the second cover plate 220, resulting in aggravated deformation.

[0043] In summary, the integrated heat dissipation device 10 of the present invention can solve the problem that multi-layered electronic components 20 cannot dissipate heat in time and the heat dissipation efficiency is uneven, thereby improving the heat dissipation performance and facilitating the installation and layout of the heat dissipation device.

[0044] The above-described embodiments merely represent several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. An integrated heat dissipation device, characterized in that: include: A heat-conducting base, a cover plate, and a fin group, wherein the heat-conducting base is provided with a plurality of cavities, the cover plate is provided on the cavities of the heat-conducting base, and the fin group is provided on the cover plate; The fin group includes a plurality of heat dissipation fins arranged side by side, and a plurality of heat dissipation grid flow channels are provided on the heat dissipation fins. The plurality of heat dissipation grid flow channels are independent of each other, the number of the heat dissipation grid flow channels corresponds to the number of the cavities, and each of the heat dissipation grid flow channels is connected to the corresponding cavity; Working fluid is provided in the cavity and the heat dissipation grid flow channel.

2. The integrated heat dissipation device according to claim 1, wherein: Each of the heat dissipation grid flow channels is provided with a connection inlet and a connection outlet, the connection inlet and the connection outlet are distributed up and down, and both the connection inlet and the connection outlet are communicated with the cavity.

3. The integrated heat dissipation device according to claim 2, wherein: In the same heat dissipation grid flow channel, the heat dissipation grid flow channel is divided into a condensation zone and an evaporation zone according to the liquid level position of the working fluid therein, the connection inlet corresponds to the condensation zone, and the connection outlet corresponds to the evaporation zone; During operation, the working fluid is in a gaseous state in the condensation zone, and in a liquid state in the evaporation zone.

4. The integrated heat dissipation device according to claim 3, characterized in that: The heat dissipation grid flow channel is a honeycomb structure; The heat dissipation grid flow channel is inclined upward, and in the same heat dissipation grid flow channel, the side away from the connection inlet has a highest point and a lowest point, the highest point is higher than the connection inlet, and the lowest point is higher than the connection outlet.

5. The integrated heat dissipation device according to claim 2, characterized in that: The number of the cavities is three. Correspondingly, three heat dissipation grid flow channels are provided on the same heat dissipation fin, and the three heat dissipation grid flow channels correspond to and communicate with the three cavities respectively.

6. The integrated heat dissipation device according to claim 5, characterized in that: There are two cover plates, which are respectively a first cover plate and a second cover plate. The three cavities are respectively a first cavity, a second cavity and a third cavity. The first cover plate covers the first cavity, the second cover plate covers the second cavity and the third cavity, and a gap is formed between the first cover plate and the second cover plate.

7. The integrated heat dissipation device according to claim 2, wherein: The cover plate is provided with a positioning through hole, and the positioning through hole is adapted to the connection inlet and the connection outlet.

8. The integrated heat dissipation device according to claim 1, characterized in that: The heat-conducting base is provided with a plurality of cylindrical nails, and the cylindrical nails are located in the cavity. When the cover plate is closed on the cavity, the cylindrical nails support the cover plate.

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