Organic silicon slurry treatment device

Abstract

The utility model discloses an organic silicon slag slurry treatment device. The organic silicon slag slurry treatment device comprises a filtering unit, a drying unit and a rectifying unit, a solid phase outlet of the filtering unit is communicated with an inlet of the drying unit; a liquid phase outlet of the drying unit is communicated with an inlet of the rectification unit; a liquid phase outlet of the filtering unit is communicated with an inlet of the rectifying unit; the filtering unit comprises a rotary drum vacuum filter; and the drying unit comprises a screw dryer. The organic silicon slurry treatment device provided by the utility model has the characteristic of higher recovery rate of high-boiling residues.

Description

Technical Field

[0001] The utility model relates to an organosilicon slurry processing device, belonging to the field of applied chemical industry. Background Art

[0002] In the production process of organosilicon and downstream high-value-added products, slurry treatment is a highly sought-after process. Due to the extremely complex and highly reactive composition of organosilicon slurry, it contains not only a large amount of organosilicon high-boiling products, but also some active components such as unreacted silicon powder and scrap copper contacts, which are prone to spontaneous combustion. This also makes it difficult to single out the treatment methods for organosilicon slurry, making the treatment process extremely challenging. In the past, practitioners focused on improving the recovery rate of valuable high-boiling products and deactivating the slurry. For example, CN204125407U added a suspension separator to pre-treat the slurry to improve the recovery rate of dichlorodimethylsilane and a small amount of high-boiling products. Subsequently, with technological advancements, practitioners have gradually sought economical and environmentally friendly slurry treatment methods. CN109180717B sets a magnetic plate at the feed inlet of the organosilicon slurry treatment device to absorb iron powder in the slurry and reduce the metal content in the slurry; CN103550902B feeds alkaline water and slurry into a straight tube of a tubular reactor for reaction, and uses the flow of alkaline water to remove the slurry hydrolyzate; CN106623370A uses hydrochloric acid for hydrolysis, leaching copper chloride and achieving separation of silicon powder and waste copper; CN106957058A performs continuous circulation hydrolysis on the slurry, avoiding the incomplete reaction, agglomeration and internal flame retardancy caused by directly adding water drops to the slurry; CN109045555B adds calcium carbonate to the distillation kettle for distillation, and then hydrolyzes the slurry with sodium carbonate aqueous solution. Relying only on the distillation kettle, the recovery rate of high-boiling substances is low and the amount of hydrolysis wastewater is large; although CN102180605B proposes a comprehensive treatment method for organosilicon slurry, its process is complicated and the equipment investment is large. Although the above methods have many advantages, they inevitably require the leaching of metals such as copper before treating the metal-containing wastewater, which greatly increases the production cost and wastewater treatment cost. In addition, the above methods all have the defect of low recovery rate of high-boiling substances.

[0003] Therefore, the development of an organosilicon slurry treatment device with a high high-boiling point recovery rate and an organosilicon production process technology has become a research direction. Utility Model Content

[0004] The utility model provides an organosilicon slurry processing device, which has the characteristics of high recovery rate of high-boiling substances.

[0005] The utility model provides an organosilicon slurry processing device, which includes a filtering unit, a drying unit, and a distillation unit;

[0006] The solid phase outlet of the filtration unit is communicated with the inlet of the drying unit; the liquid phase outlet of the drying unit is communicated with the inlet of the distillation unit;

[0007] The liquid phase outlet of the filtration unit is communicated with the inlet of the distillation unit;

[0008] The filtration unit includes a rotary drum vacuum filter;

[0009] The drying unit includes a screw dryer.

[0010] The device as described above, wherein the operating temperature of the screw dryer is 140-200°C.

[0011] The device as described above, wherein the distillation unit includes a distillation tower.

[0012] The device as described above, wherein it further comprises a hydrolysis unit, wherein the inlet of the hydrolysis unit is connected to the solid phase outlet of the drying unit.

[0013] The device as described above, wherein the inner wall surface of the rotary drum of the rotary drum vacuum filter is provided with a filter aid layer;

[0014] The filter aid layer includes a filter aid, and the filter aid is selected from at least one of diatomaceous earth, bentonite, red jade, kadama earth, and perlite.

[0015] The device as described above, wherein the rotation speed of the rotary vacuum filter is controlled to be 0.1-3 r / min, and the filtration area is 5-40 m 2 .

[0016] In the device as described above, the filter aid layer has a thickness of 10 to 40 mm.

[0017] The device as described above, wherein the number of theoretical plates of the distillation tower is 30-100, and the operating pressure is 0.05-0.15 MPaG.

[0018] The device as described above, wherein it further comprises a high-boiling-substance buffer unit, and the liquid phase outlet of the filtration unit is connected to the inlet of the distillation unit through the high-boiling-substance buffer unit.

[0019] The device as described above, wherein it further comprises a slurry buffer unit, wherein the outlet of the slurry buffer unit is communicated with the inlet of the filter unit.

[0020] The organosilicon slurry processing device provided by the utility model has the characteristic of high recovery rate of high-boiling substances. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0022] Figure 1 This is a schematic structural diagram of the first organosilicon slurry treatment device provided by the present invention;

[0023] Figure 2 This is a schematic structural diagram of the second organosilicon slurry treatment device provided by the present invention;

[0024] Figure 3 This is a schematic structural diagram of a third organosilicon slurry treatment device provided by the present invention;

[0025] Figure 4 This is a schematic diagram of the equipment of the third organosilicon slurry treatment device provided by the present invention.

[0026] Description of reference numerals:

[0027] A-filtration unit;

[0028] B-drying unit;

[0029] C-distillation unit;

[0030] D-hydrolysis unit;

[0031] E-high boiling buffer unit;

[0032] F-slurry buffer unit;

[0033] 1- slurry buffer tank;

[0034] 2-Drum vacuum filter;

[0035] 3-Screw dryer;

[0036] 4-High boiling material buffer tank;

[0037] 5-distillation tower;

[0038] 6-Slurry hydrolysis tank. DETAILED DESCRIPTION

[0039] To help those skilled in the art better understand the present invention, the present invention is further described in detail below. The specific embodiments listed below are merely illustrative of the principles and features of the present invention. The examples are intended only to explain the present invention and do not limit its scope. Based on the embodiments of the present invention, all other implementations obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] The first aspect of the present invention provides an organosilicon slurry processing device, which includes a filtering unit A, a drying unit B, and a distillation unit C;

[0041] The solid phase outlet of the filtration unit A is connected to the inlet of the drying unit B;

[0042] The liquid phase outlet of the drying unit B is connected to the inlet of the distillation unit C; the liquid phase outlet of the filtration unit A is connected to the inlet of the distillation unit C;

[0043] Filtration unit A includes a rotary vacuum filter 2;

[0044] The drying unit B includes a screw dryer 3 .

[0045] Figure 1 This is a schematic diagram of the structure of the first organosilicon slurry treatment device provided by the present invention. Figure 1 As shown, the device includes a filtration unit A, a drying unit B, and a distillation unit C; wherein the solid phase outlet of the filtration unit A is connected to the inlet of the drying unit B; and the liquid phase outlet of the drying unit B is connected to the inlet of the distillation unit C.

[0046] The device provided by the utility model is used to treat the slurry generated in the production process of organic silicon, wherein the main components of the slurry include high boiling point material, copper contact and silicon powder, the high boiling point material is liquid, and the copper contact and silicon powder are solid.

[0047] Specifically, the slurry is first filtered through the filtration unit A. During the filtration process, the high-boiling liquid contained in the slurry is separated from the copper contacts and silicon powder solids. The high-boiling liquid enters the distillation unit C through the liquid phase outlet of the filtration unit A, and the solid phase substances including the copper contacts and silicon powder solids enter the drying unit B through the solid phase outlet of the filtration unit A.

[0048] In the organosilicon slurry treatment device provided by the present invention, filtration unit A includes a rotary vacuum filter 2. The liquid phase outlet of rotary vacuum filter 2 serves as the liquid phase outlet of filtration unit A, and the solid phase outlet of rotary vacuum filter 2 serves as the solid phase outlet of filtration unit A. Rotary vacuum filter 2 comprises a rotatable cylindrical structure with small pores on its surface that allow liquid phase materials to pass through. During filtration, the slurry enters the cylindrical structure and rotates with it. Under the action of centrifugal force, the liquid phase passes through the pores and enters the liquid phase outlet of rotary vacuum filter 2, while the remaining solid phase materials enter the solid phase outlet of rotary vacuum filter 2, thus completing the filtration process. The rotary vacuum filter 2 offers the advantages of automatic and continuous operation, large processing capacity, low flow resistance, easy control, and uniform material heating, enabling the organosilicon slurry treatment device provided by the present invention to achieve a high recovery rate of high-boiling-point materials.

[0049] Furthermore, the solid phase material including the copper contacts and silicon powder solids enters the drying unit B for drying through the solid phase outlet of the filtration unit A. The solid phase material still contains a small amount of high-boiling substances. Therefore, the high-boiling substances are separated from the copper contacts and silicon powder solids through the drying process. The separated high-boiling substances are then recovered to the distillation unit C to achieve a higher high-boiling substance recovery rate.

[0050] In the organosilicon slurry treatment device provided by the present invention, drying unit B includes a spiral dryer. The inlet of the spiral dryer serves as the inlet of drying unit B, and the liquid phase outlet of the spiral dryer serves as the liquid phase outlet of drying unit B. The spiral dryer offers the advantages of continuous production, uniform drying effect, short drying time, and energy conservation, enabling the organosilicon slurry treatment device provided by the present invention to achieve a high recovery rate of high-boiling substances.

[0051] Distillation unit C is used to distill the high-boiling liquid phase from filtration unit A and drying unit B. High-boiling substances are primarily composed of two components: uncrackable high-boiling substances and cleavable high-boiling substances. Uncrackable high-boiling substances have lower boiling points, primarily including hexamethyldisilane, while cleavable high-boiling substances have higher boiling points, primarily including ethyldichlorosilane, hexachlorodisilane, and dichlorotetramethyldisilane. Distillation utilizes these different boiling points to separate the uncrackable and cleavable high-boiling substances, allowing each to be utilized.

[0052] The present invention does not limit the specific equipment selection of the distillation unit C, as long as it can achieve the separation of indecomposable high boiling substances and decomposable high boiling substances.

[0053] The organosilicon slurry processing device provided by the present invention uses a rotary vacuum filter 2 to filter the slurry, preliminarily separates the high-boiling substances and solid phase substances contained in the slurry, and then uses a spiral dryer to separate the high-boiling substances contained in the solid phase substances again, which has the characteristic of a high high-boiling substance recovery rate.

[0054] At the same time, the high-boiling gas and the filtered liquid phase material are mixed into the feed, and the heat of the high-boiling gas can be used to vaporize part of the clear liquid, reducing the heat consumption of the distillation unit C.

[0055] Furthermore, in one embodiment, the operating temperature of the screw dryer 3 is 140-200° C. This operating temperature allows the high-boiling substances contained in the solid phase to be separated from other solid phase substances at a faster rate, thereby making the organosilicon slurry treatment device provided by the present invention have a higher treatment efficiency.

[0056] Furthermore, in one embodiment, in the organosilicon slurry treatment apparatus provided by the present invention, the distillation unit C includes a distillation tower 5. The inlet of the distillation tower 5 is the inlet of the distillation unit C. The distillation tower 5 can further improve the separation efficiency of high-boiling substances, thereby further improving the treatment efficiency of the organosilicon slurry treatment apparatus provided by the present invention.

[0057] Figure 2 This is a schematic diagram of the structure of the second organosilicon slurry treatment device provided by the present invention. Figure 2 As shown, the device further comprises a hydrolysis unit D, the inlet of the hydrolysis unit D being connected to the solid phase outlet of the drying unit B.

[0058] The hydrolysis unit D is used to hydrolyze the solid phase material from the drying unit B. Specifically, in the hydrolysis unit D, the solid phase material contacts and reacts with an alkaline substance to obtain silicon oxide and further process it. The present invention does not limit the specific structure of the hydrolysis unit D, as long as the solid phase material contacts and reacts with the alkaline substance. In one embodiment, the hydrolysis unit D includes a reactor with a stirring device. The alkaline substance can be lime milk, which can be obtained by mixing quicklime and water. The mass ratio of quicklime to solid phase material can be controlled between 1:1 and 1:6, and the mass ratio of water to solid phase material can be controlled between 1:1 and 1:10. The hydrolysis product is a waste solid, which avoids the generation of a large amount of metal-containing wastewater, saves the equipment fee and operating cost of subsequent wastewater treatment, and may reduce metal pollution to the soil, is harmless to the environment and is economical.

[0059] In one embodiment, a filter aid layer is provided on the inner wall surface of the rotary drum of the rotary vacuum filter 2. The filter aid layer includes a filter aid selected from at least one of diatomaceous earth, bentonite, Akadama clay, kadama clay, and perlite. Specifically, before using the rotary vacuum filter 2 for filtration, the filter aid layer including the filter aid can be pre-coated on the inner wall surface of the rotary drum, distributing the filter aid layer across the inner wall surface. As a result, when the slurry enters the rotary vacuum filter 2, the filtration process is always "cake filtration." This not only improves filtration efficiency and the quality of high-boiling substances in the liquid phase, but also effectively prevents the slurry from compacting during heating and drying, facilitating further processing.

[0060] Furthermore, in one embodiment, the rotation speed of the rotary vacuum filter 2 is controlled to be 0.1-3 r / min, and the filtration area is 5-40 m 2 The thickness of the filter aid layer is 10 to 40 mm. The rotary drum vacuum filter 2 having the above characteristics can achieve higher filtration efficiency.

[0061] Furthermore, in one embodiment, the distillation tower 5 has a theoretical plate number of 30 to 100 and an operating pressure of 0.05 to 0.15 MPa G. The distillation tower 5 having the above characteristics can achieve a more efficient separation of non-cleavable high-boiling substances and crackable high-boiling substances.

[0062] In one embodiment, the organosilicon slurry treatment device provided by the present invention further includes a high-boiling-material buffer unit E. The high-boiling-material buffer unit E is located between the filtration unit A and the distillation unit C. The liquid phase outlet of the filtration unit A is connected to the inlet of the distillation unit C through the high-boiling-material buffer unit E. The high-boiling-material buffer unit E is used to receive liquid phase material from the filtration unit A. In one embodiment, the high-boiling-material buffer unit E is also connected to a vacuum system to create a vacuum environment for the rotary drum vacuum filter 2.

[0063] The present invention does not limit the specific equipment selection of the high-boiling-material buffer unit E. In one embodiment, the high-boiling-material buffer unit E is a high-boiling-material buffer tank 4.

[0064] Figure 3 This is a schematic diagram of the structure of the third type of organosilicon slurry treatment device provided by the present invention. Figure 3 As shown, the organosilicon slurry treatment device provided by the present invention also includes a slurry buffer unit F, the outlet of which is connected to the inlet of the filter unit A. The slurry buffer unit F is used to receive slurry from the preceding process and can buffer the slurry flow, thereby making the organosilicon slurry treatment device provided by the present invention more reliable.

[0065] The present invention does not limit the specific equipment selection of the slurry buffer unit F. In one embodiment, the slurry buffer unit F is a slurry buffer tank 1.

[0066] Figure 4 This is a schematic diagram of the third type of organosilicon slurry treatment device provided by the present invention, as shown in FIG. Figure 4 As shown, the device includes a slurry buffer tank 1, a rotary vacuum filter 2, a screw dryer 3, a high-boiling material buffer tank 4, a distillation tower 5 and a slurry hydrolysis tank 6.

[0067] Among them, the slurry buffer tank 1 belongs to the slurry buffer unit F, the rotary vacuum filter 2 belongs to the filtration unit A, the screw dryer 3 belongs to the drying unit B, the high boiling point buffer tank 4 belongs to the high boiling point buffer unit E, the distillation tower 5 belongs to the distillation unit C, and the slurry hydrolysis tank 6 belongs to the hydrolysis unit D.

[0068] The outlet of the slurry buffer tank 1 is connected to the inlet of the rotary vacuum filter 2, the liquid phase outlet of the rotary vacuum filter 2 is connected to the inlet of the distillation tower 5 through the high-boiling buffer tank 4, the solid phase outlet of the rotary vacuum filter 2 is connected to the inlet of the screw dryer 3, the liquid phase outlet of the screw dryer 3 is connected to the inlet of the distillation tower 5, and the solid phase outlet of the screw dryer 3 is connected to the inlet of the slurry hydrolysis tank 6.

[0069] The working process of the device is as follows:

[0070] Diatomaceous earth is pre-coated on the rotary vacuum filter 2, and the slurry of waste contacts including high boiling points, copper powder and silicon powder from the bottom of the washing tower is sent to the rotary vacuum filter 2 through the slurry buffer tank 1. Liquid high boiling points are obtained with the help of diatomaceous earth, and are sent to the distillation tower 5 through the high boiling point buffer tank 4 for distillation and separation. Indestructible high boiling points are obtained at the top of the tower, and decomposable high boiling points are obtained at the bottom of the tower.

[0071] The high-viscosity solid slurry (solid filter residue and diatomaceous earth, solid content ≤ 60%) produced by rotary drum vacuum filter 2 is fed into screw dryer 3 and heated to produce vaporous high-boiling products, which then enter distillation tower 5 for distillation. Indestructible high-boiling products are obtained at the top of the tower, while destructible high-boiling products are obtained at the bottom.

[0072] The dried, non-hardened, high-viscosity slurry (solid content ≤ 85%) is sent from the screw dryer 3 to the slurry hydrolysis tank 6, where quicklime and a small amount of water are added for hydrolysis. The solid slurry is then bagged and sent out of the filter. At this time, the rotary drum vacuum filter 2 rotates at 1.5 r / min and has a filtration area of ​​20 m 2 , the filter cake thickness is ≤30 mm; the temperature of screw dryer 3 is controlled at 160℃; the operating pressure of the high boiling tower is 0.05MpaG, and the number of plates is 40; the mass ratio of quicklime to slurry is 1:4; and the mass ratio of water to slurry is 1:5.

[0073] The organosilicon slurry processing device provided by the present invention is further described below through examples.

[0074] Embodiment

[0075] The present embodiment uses Figure 4 The third organic silicon slag treatment device provided by the utility model has the advantages that the slag is treated, the slag is treated, and the slag is treated. Figure 4 As shown in the figure, the device comprises a slag buffer tank 1, a rotary drum vacuum filter 2, a screw dryer 3, a high-boiling substance buffer tank 4, a rectifying tower 5 and a slag hydrolysis tank 6.

[0076] Among them, the slag buffer tank 1 belongs to the slag buffer unit F, the rotary drum vacuum filter 2 belongs to the filtration unit A, the screw dryer 3 belongs to the drying unit B, the high-boiling substance buffer tank 4 belongs to the high-boiling substance buffer unit E, the rectifying tower 5 belongs to the rectifying unit C, and the slag hydrolysis tank 6 belongs to the hydrolysis unit D.

[0077] The outlet of the slag buffer tank 1 is communicated with the inlet of the rotary drum vacuum filter 2, the liquid phase outlet of the rotary drum vacuum filter 2 is communicated with the inlet of the rectifying tower 5 through the high-boiling substance buffer tank 4, the solid phase outlet of the rotary drum vacuum filter 2 is communicated with the inlet of the screw dryer 3, the liquid phase outlet of the screw dryer 3 is communicated with the inlet of the rectifying tower 5, and the solid phase outlet of the screw dryer 3 is communicated with the inlet of the slag hydrolysis tank 6.

[0078] The rotary speed of the rotary drum vacuum filter 2 is 1.5 r / min, the filtration area is 20 m 2 , and the filter cake thickness is ≤30 mm; the temperature of the screw dryer 3 is controlled at 160℃; the operating pressure of the rectifying tower 5 is 0.05MpaG, and the number of plates is 40; the mass ratio of quicklime to slag is 1:4; and the mass ratio of water to slag is 1:5.

[0079] The working process of the device is as follows:

[0080] The diatomite is pre-coated on the rotary drum vacuum filter 2, the slag of the waste catalyst including high-boiling substances, copper powder and silicon powder from the bottom of the washing tower is sent into the rotary drum vacuum filter 2 through the slag buffer tank 1, and the liquid phase high-boiling substances are obtained under the help of the diatomite, and then the liquid phase high-boiling substances are sent into the rectifying tower 5 through the high-boiling substance buffer tank 4, and then the non-cleavable high-boiling substances are obtained at the top of the tower, and the cleavable high-boiling substances are obtained at the bottom of the tower.

[0081] The solid phase material high-viscosity slag (solid filter residue and diatomite, solid content ≤60%) produced by the rotary drum vacuum filter 2 is sent into the screw dryer 3 and heated, and then the gas phase high-boiling substances are obtained and sent into the rectifying tower 5 for rectification treatment, and then the non-cleavable high-boiling substances are obtained at the top of the tower, and the cleavable high-boiling substances are obtained at the bottom of the tower.

[0082] The dried, uncompacted high-viscosity slurry (solid content ≤ 85%) is sent from the screw dryer 3 to the slurry hydrolysis tank 6, where quicklime and a small amount of water are added for hydrolysis. The solid slurry is then bagged and sent out of the boundary.

[0083] Compared with existing organic silicon slurry treatment processes, this process eliminates slag compaction before hydrolysis, produces minimal metal-containing wastewater, improves high-boiling-point recovery by 10%, and reduces wastewater treatment equipment and costs by 15%, making it environmentally friendly and economically viable.

[0084] In the description of the embodiments of the present application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances. The terms "first," "second," "third," "fourth," and so on (if any) in the specification and claims of this application and the accompanying drawings are used to distinguish similar items and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this manner are interchangeable where appropriate, such that the embodiments of the present application described herein can, for example, be implemented in an order other than that illustrated or described herein. Furthermore, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, product, or apparatus.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the comparative examples of the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the technical solutions of the embodiments of the present invention.

Claims

1. An organosilicon slurry processing device, characterized in that: Including filtration unit, drying unit, and distillation unit; The solid phase outlet of the filtration unit is communicated with the inlet of the drying unit; the liquid phase outlet of the drying unit is communicated with the inlet of the distillation unit; The liquid phase outlet of the filtration unit is communicated with the inlet of the distillation unit; The filtration unit includes a rotary drum vacuum filter; The drying unit includes a screw dryer.

2. The device according to claim 1, characterized in that The operating temperature of the screw dryer is 140-200°C.

3. The device according to claim 1, characterized in that The distillation unit includes a distillation tower.

4. The device according to claim 1, characterized in that The invention also comprises a hydrolysis unit, wherein the inlet of the hydrolysis unit is communicated with the solid phase outlet of the drying unit.

5. The device according to claim 1, characterized in that The inner wall surface of the rotary drum of the rotary drum vacuum filter is provided with a filter aid layer; The filter aid layer includes a filter aid, and the filter aid is selected from at least one of diatomaceous earth, bentonite, red jade, kadama earth, and perlite.

6. The device according to claim 5, characterized in that The rotary drum vacuum filter is controlled to have a rotation speed of 0.1-3 r / min and a filtration area of ​​5-40 m 2 .

7. The device according to claim 5, characterized in that The thickness of the filter aid layer is 10-40 mm.

8. The device according to claim 3, characterized in that The number of theoretical plates of the distillation tower is 30-100, and the operating pressure is 0.05-0.15 MPaG.

9. The device according to claim 3, characterized in that It also includes a high-boiling buffer unit, and the liquid phase outlet of the filtration unit is connected to the inlet of the distillation unit through the high-boiling buffer unit.

10. The device according to claim 9, characterized in that It also includes a slurry buffer unit, wherein the outlet of the slurry buffer unit is communicated with the inlet of the filter unit.

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