Water removal device and semiconductor equipment

Abstract

The utility model provides a water removal device and semiconductor equipment, the water removal device comprises a shell, a cooling pipeline, a cooling assembly and an exhaust pipeline, the interior of the shell is provided with a cooling cavity which can be communicated with a process cavity, and the cooling assembly is located in the cooling cavity; the cooling assembly comprises a cooling head and a plurality of condensing discs mounted on the cooling head, and the condensing discs are vertically arranged at intervals in the axial direction of the cooling head and are of hollow structures; the cooling pipeline is communicated with the condensing disc so as to introduce a coolant into the condensing disc; one end of the exhaust pipeline is communicated with the cooling cavity, and the other end of the exhaust pipeline is used for being communicated with a vacuum pump. According to the utility model, water vapor in the process cavity can be quickly removed, the exhaust time is greatly reduced, the recovery efficiency of semiconductor equipment (a machine) is improved, and the water vapor content during exhaust can be effectively reduced, so that damage to high-pressure and high-temperature sensitive devices is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing and manufacturing, especially to a water removal device and semiconductor equipment. BACKGROUND

[0002] Many processes in the technical field of semiconductor processing and manufacturing need to be carried out in a vacuum process chamber, and the higher the vacuum degree of the process chamber, the purer the internal environment of the process chamber and the fewer the impurities in the process chamber. With the development of high-end processes, the purity of the internal environment of the process chamber is required to be higher and higher, and the application of the vacuum chamber process is also more and more extensive.

[0003] Because water vapor objectively exists in the atmosphere, when the process chamber is opened and maintained, the process chamber will inevitably be connected with the atmosphere, and the water vapor in the atmosphere will enter the process chamber. In addition, when the cavity of the process chamber is maintained or brushed, water vapor will also be left in the process chamber. The water vapor in the process chamber is difficult to be pumped out under vacuum conditions, and a long time is needed to exhaust to gradually reduce the water vapor.

[0004] The residual water vapor in the process chamber will react with the process gas, making the process uncontrollable. In addition, in a high-voltage process chamber, the water vapor in the process chamber will also cause discharge, thereby bringing great safety hazards.

[0005] It should be noted that the information disclosed in the background technology part of the utility model is only intended to deepen the understanding of the general background technology of the utility model, and should not be regarded as acknowledging or implying in any form that the information constitutes prior art known to those skilled in the art. CONTENT OF THE UTILITY MODEL

[0006] The utility model aims to provide a water removal device and semiconductor equipment, which can quickly remove water vapor in the process chamber, greatly reduce the exhaust time, improve the machine efficiency of the semiconductor equipment (machine), and effectively reduce the water vapor content during exhaust, thereby avoiding damage to high-voltage and high-temperature sensitive devices.

[0007] To achieve the above-mentioned purpose, the utility model provides a water removal device, which comprises a shell, a cooling pipeline, a cooling assembly and an exhaust pipeline, the inside of the shell has a cooling cavity capable of being connected with a process chamber, and the cooling assembly is located in the cooling cavity; the cooling assembly comprises a cooling head and a plurality of condensing discs mounted on the cooling head, the plurality of condensing discs are arranged in an up-down interval along the axial direction of the cooling head, and the condensing disc is a hollow structure; the cooling pipeline is connected with the condensing disc to pass the coolant into the condensing disc; one end of the exhaust pipeline is connected with the cooling cavity, and the other end of the exhaust pipeline is used to be connected with a vacuum pump.

[0008] Optionally, the water removal device provided by the present invention also includes an isolation valve capable of isolating the cooling chamber from the process chamber, one end of the isolation valve is connected to the cooling chamber, and the other end of the isolation valve is used to be connected to the process chamber.

[0009] Optionally, the water removal device provided by the present invention further includes a flange connected to the shell, and the flange is arranged on the top of the shell.

[0010] Optionally, the water removal device provided by the present invention further includes a regeneration pipe, one end of which is connected to the cooling chamber, and the other end of which is used to be connected to a gas source capable of providing heated regeneration gas.

[0011] Optionally, the water removal device provided by the present invention further includes a regeneration valve, which is arranged on the regeneration pipeline.

[0012] Optionally, the water removal device provided by the present invention further includes an exhaust valve, which is arranged on the exhaust pipe.

[0013] Optionally, the water removal device provided by the present invention further includes a safety valve, one end of the safety valve is connected to the cooling chamber, and the other end of the safety valve is connected to the air outlet pipe.

[0014] Optionally, the water removal device provided by the present invention further includes a pressure sensor disposed on the shell, and the pressure sensor is used to monitor the pressure in the cooling chamber.

[0015] Optionally, the side walls of the condensation tray are arranged to protrude upward relative to the bottom wall of the condensation tray.

[0016] Optionally, the side wall of the condensation tray is arranged at an angle to the bottom wall thereof.

[0017] To achieve the above object, the present invention further provides a semiconductor device, comprising a process chamber and any one of the water removal devices described above.

[0018] Compared with the prior art, the dewatering device and semiconductor equipment provided by the present invention have the following advantages:

[0019] Beneficial effects:

[0020] The water removing device provided by the utility model comprises a shell, a cooling pipeline, a cooling assembly and an exhaust pipeline, the inside of the shell is provided with a cooling cavity capable of being communicated with a process cavity, and the cooling assembly is located in the cooling cavity; the cooling assembly comprises a cooling head and a plurality of condensing discs mounted on the cooling head, the plurality of condensing discs are arranged in an up-down interval along the axial direction of the cooling head, and the condensing discs are hollow structures; the cooling pipeline is communicated with the condensing discs to pass coolant into the condensing discs; one end of the exhaust pipeline is communicated with the cooling cavity, and the other end of the exhaust pipeline is used for being communicated with a vacuum pump.

[0021] Since the semiconductor device provided by the utility model comprises the water removing device provided by the utility model, the semiconductor device provided by the utility model has at least all the beneficial effects of the water removing device provided by the utility model, and therefore the beneficial effects of the semiconductor device provided by the utility model can be referred to the beneficial effects of the water removing device provided by the utility model described above, and will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a schematic diagram of gas components under rough vacuum condition;

[0023] Figure 2 It is a schematic diagram of device damage caused by instantaneous discharge of a large amount of water vapor;

[0024] Figure 3 It is a schematic diagram of the overall structure of the water removing device provided by an embodiment of the utility model;

[0025] Figure 4 It is a schematic diagram of the structure of the condensing disc provided by another embodiment of the utility model.

[0026] Among them, the sign explanation is as follows:

[0027] Housing-100; Cooling chamber-110;

[0028] Cooling pipe-200; first cooling sub-pipe-210; second cooling sub-pipe-220;

[0029] Cooling assembly-300; cooling head-310; condensation plate-320; recess-321;

[0030] Exhaust duct - 400;

[0031] Isolation valve-510; regeneration valve-520; exhaust valve-530; safety valve-540;

[0032] Flange-600;

[0033] Regeneration pipeline-700;

[0034] Pressure sensor-800;

[0035] Sealing element-910; Compression element-920;

[0036] Gas source - 10; vacuum pump - 20; outlet pipe - 30. DETAILED DESCRIPTION

[0037] The following is a further detailed description of the water removal device and semiconductor equipment proposed in the present invention in conjunction with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer based on the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation of the present invention. In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, please refer to the drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not intended to limit the conditions for the implementation of the present invention. Any structural modifications, changes in proportional relationships or adjustments in size should still fall within the scope of the technical content disclosed in the present invention as long as they are the same or similar to the effects and purposes that can be achieved by the present invention. The specific design features of the present invention disclosed herein, including, for example, specific dimensions, directions, positions and shapes, will be determined in part by the specific application and use environment. Also, in the embodiments described below, sometimes the same reference numerals are used in common between different drawings to represent the same parts or parts having the same functions, and their repeated descriptions are omitted. In this specification, similar reference numerals and letters are used to represent similar items, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings. In addition, if the method described herein includes a series of steps, the order of these steps presented herein is not necessarily the only order in which these steps can be performed, and some of the steps described may be omitted and / or some other steps not described herein may be added to the method.

[0038] It should be noted that, in this document, relational terms such as first and second, etc., are merely used to distinguish one entity or operation from another, and do not necessarily require or imply any actual relationship or order between these entities or operations, nor should they be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Moreover, the terms "comprises," "includes," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprises a..." does not exclude the presence of other identical elements in the process, method, article, or device that includes the element. The singular forms "a", "an" and "the" include plural referents, the term "or" is generally used in a sense including "and / or", the term "several" is generally used in a sense including "at least one", the term "at least two" is generally used in a sense including "two or more", and the term "multiple" is generally used in a sense including "at least two".

[0039] In the description of the present invention, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present invention. In the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific contexts. In addition, in the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0040] For ease of understanding, before introducing the water removal device and semiconductor equipment provided by the present invention, a brief description of the research background of the present invention is first given.

[0041] As described in the background art, water objectively exists in the atmosphere. Please refer to Table 1, which is a table showing the composition of the atmosphere at 50% humidity and 20°C.

[0042] Table 1 Composition content of atmosphere at 50% humidity and 20°C

[0043] <![CDATA[氮气(N2)]]> 78.00000％ oxygen (O2) 21.00000％ Argon (Ar) 0.95000％ <![CDATA[水(H2O)]]> 0.75000％ carbon dioxide (CO2) 0.03000％ Neon (Ne) 0.00180％ Helium (He) 0.00052％

[0044] As shown in Table 1, under the conditions of 50% humidity and 20°C, the water vapor content in the atmosphere is only 0.75%, which seems to have little impact. However, under vacuum conditions, the proportion of water vapor will change qualitatively. Please refer to Figure 1 , which is a schematic diagram of gas composition under rough vacuum conditions. Figure 1As shown, in 10 -3 Under rough vacuum conditions of 100 Torr, the proportion of water vapor reaches 98%, which means that water vapor becomes the largest gas component under rough vacuum.

[0045] Furthermore, taking water attached to the surface of the process chamber as an example, since water loses pressure in a vacuum, it will quickly boil at low temperatures. After boiling, it will quickly lose temperature and turn into ice and condense on the process chamber, making it more difficult to discharge the subsequent water vapor.

[0046] The water vapor attached to the process chamber can only be slowly exhausted by heating the process chamber. This process is long and tedious. If the exhaust is too fast, a large amount of water vapor will burst out instantly, causing surface creepage or tip discharge in the high-voltage chamber, which will damage the circuit or even cause direct breakdown. Please refer to Figure 2 , which is a schematic diagram of device damage caused by the instantaneous discharge of a large amount of water vapor. Figure 2 As shown in the figure, when high-voltage devices are vented, a large amount of water vapor is released instantaneously, causing surface creepage that penetrates the insulating bushing and causes damage to the device.

[0047] Based on this, the core idea of ​​the present invention is to provide a dehumidification device and semiconductor equipment that can quickly remove water vapor in the process chamber, greatly reduce the exhaust time, improve the recovery efficiency of semiconductor equipment (machine), and effectively reduce the water vapor content during exhaust, thereby avoiding damage to high-voltage and high-temperature sensitive devices.

[0048] In order to realize the above idea, the utility model provides a water removal device, please refer to Figure 3 , which is a schematic diagram of the overall structure of the water removal device provided by one embodiment of the present utility model. Figure 3 As shown, the dewatering device of the present invention includes a shell 100, a cooling pipe 200, a cooling assembly 300 and an exhaust pipe 400. The interior of the shell 100 is provided with a cooling chamber 110 which can be communicated with the process chamber, and the cooling assembly 300 is located in the cooling chamber 110; the cooling assembly 300 includes a cooling head 310 and a plurality of condensation trays 320 installed on the cooling head 310, the plurality of condensation trays 320 are arranged at intervals up and down along the axial direction of the cooling head 310, and the condensation trays 320 are hollow structures; the cooling pipe 200 is connected to the condensation trays 320 to pass the coolant into the condensation trays 320; one end of the exhaust pipe 400 is connected to the cooling chamber 110, and the other end of the exhaust pipe 400 is used to be connected to the vacuum pump 20.

[0049] Thus, when the process chamber needs to be evacuated to form a negative pressure, a coolant can be provided to the condensation tray 320 through the cooling pipe 200 to circulate and cool the condensation tray 320, so that the water vapor in the gas flowing from the process chamber into the cooling chamber 110 can condense on the condensation tray 320, and other gases can be discharged through the exhaust pipe 400 under the action of the vacuum pump 20 connected to the exhaust pipe 400. In summary, it can be seen that by adopting the dehydration device provided by the utility model, the water vapor in the process chamber can be quickly removed, the exhaust time of the process chamber can be greatly reduced, the recovery efficiency of the semiconductor equipment (machine) can be improved, and the water vapor content during exhaust can be effectively reduced, thereby avoiding damage to high-pressure and high-temperature sensitive devices. In addition, by adopting the dehydration device provided by the utility model, the water vapor in the process chamber can be quickly removed without changing the overall machine structure and process of the semiconductor equipment. At the same time, the dehydration device provided by the utility model is simple in structure and easy to implement.

[0050] It should be noted that although Figure 3 The description herein uses the example of four condensation pans 320 installed on the cooling head 310. However, as those skilled in the art will appreciate, this does not constitute a limitation of the present invention. In other embodiments, two, three, five, or even more condensation pans 320 may be installed on the cooling head 310. Furthermore, as those skilled in the art will appreciate, the lower the coolant temperature used to cool the condensation pans 320, the better. This is because excessively low temperatures can cause nitrogen and oxygen to condense on the condensation pans 320, thereby reducing the condensation pans' 320 water vapor treatment efficiency. Preferably, a temperature of 0°C is appropriate for the coolant used to cool the condensation pans 320. Furthermore, as those skilled in the art will appreciate, to ensure that gas within the process chamber can flow smoothly into the cooling chamber 110 when the cooling chamber 110 is connected to the process chamber, the dewatering device provided by the present invention can be installed below the process chamber or in a location where gas can easily diffuse.

[0051] Please continue to refer to Figure 3 ,like Figure 3As shown, in some exemplary embodiments, the water removal device provided by the present invention also includes an isolation valve 510 capable of isolating the cooling chamber 110 from the process chamber, one end of the isolation valve 510 is connected to the cooling chamber 110, and the other end of the isolation valve 510 is used to be connected to the process chamber. Therefore, when the process chamber needs to be evacuated to form a negative pressure, the isolation valve 510 can be opened first to connect the cooling chamber 110 with the process chamber, so that the gas in the process chamber can flow into the cooling chamber 110, wherein most of the water vapor in the gas can condense on the condensation tray 320, and the remaining gas can be discharged through the exhaust pipe 400 under the action of the vacuum pump 20 connected to the exhaust pipe 400; when the vacuum level in the process chamber reaches the process vacuum level requirement or after a preset time (for example, half an hour after the pressure reaches the mTorr level, the longer the time, the better the water vapor removal effect), the isolation valve 510 is closed to isolate the cooling chamber 110 from the process chamber, and then the dehydration device can be regenerated without any impact on the process chamber to remove ice on the condensation tray 320 and prepare for the next dehydration. In summary, the present invention provides an isolation valve 510 between the process chamber and the cooling chamber 110. During regeneration, the isolation valve 510 can be used to isolate the process chamber from the cooling chamber 110, thereby ensuring that the self-regeneration of the water removal device will not affect the process chamber.

[0052] It should be noted that, as those skilled in the art will appreciate, the present invention does not limit the specific type of the isolation valve 510 , and the isolation valve 510 may be a solenoid valve or a manual valve. Furthermore, to facilitate automated operation, the isolation valve 510 is preferably a solenoid valve.

[0053] Please continue to refer to Figure 3 ,like Figure 3 As shown, in some exemplary embodiments, the dewatering device provided by the present invention further includes a flange 600 connected to the housing 100, and the flange 600 is provided on the top of the housing 100. Therefore, by providing the flange 600 connected to the housing 100, the dewatering device provided by the present invention can be conveniently fixed to the outer surface of the process chamber through the flange 600.

[0054] Further, if Figure 3 As shown, the isolation valve 510 is installed above the flange 600. Therefore, by installing the isolation valve 510 above the flange 600, it is more convenient to connect one end of the isolation valve 510 to the cooling chamber 110 and the other end of the isolation valve 510 to the process chamber.

[0055] Please continue to refer to Figure 3 ,like Figure 3 As shown, in some exemplary embodiments, the dewatering device provided by the present invention further includes a regeneration pipe 700, one end of which is connected to the cooling chamber 110, and the other end of which is used to be connected to a gas source 10 capable of providing heated regeneration gas. Thus, by providing the regeneration pipe 700, heated regeneration gas (e.g., heated nitrogen) can be provided to the cooling chamber 110, thereby heating the cooling chamber 110, thereby converting ice condensed on the condensation pan 320 into water for subsequent discharge together with the heated regeneration gas, thereby achieving self-regeneration of the dewatering device in preparation for the next dewatering operation.

[0056] It should be noted that, as those skilled in the art will appreciate, the regeneration gas may be other inert gases in addition to nitrogen.

[0057] Please continue to refer to Figure 3 ,like Figure 3 As shown, in some exemplary embodiments, the water removal device provided by the present invention further includes a regeneration valve 520 , and the regeneration valve 520 is provided on the regeneration pipe 700 . Thus, when the process chamber needs to be evacuated to form a negative pressure, the regeneration valve 520 is closed to isolate the cooling chamber 110 from the gas source 10 that can provide heated regeneration gas, thereby preventing the regeneration gas from flowing into the cooling chamber 110 through the regeneration pipe 700. When the vacuum level in the process chamber reaches the process vacuum level requirement or the opening time reaches the preset time, when the dehydration device needs to be regenerated (i.e., to remove ice on the condensation tray 320), the regeneration valve 520 is opened to connect the cooling chamber 110 with the gas source 10 that can provide heated regeneration gas, thereby ensuring that the heated regeneration gas (e.g., heated nitrogen) provided by the gas source 10 can smoothly pass through the regeneration pipe 700 into the cooling chamber 110, thereby heating the cooling chamber 110, thereby converting the ice condensed on the condensation tray 320 into water, which is then discharged together with the heated regeneration gas, thereby achieving self-regeneration of the dehydration device and preparing for the next dehydration operation.

[0058] It should be noted that, as those skilled in the art will appreciate, the present invention does not limit the specific type of the regeneration valve 520 , and the regeneration valve 520 may be a solenoid valve or a manual valve. Furthermore, to facilitate automated operation, the regeneration valve 520 is preferably a solenoid valve.

[0059] Please continue to refer to Figure 3,like Figure 3 As shown, in some exemplary embodiments, the dewatering device provided by the present invention further includes an exhaust valve 530, which is provided on the exhaust pipe 400. Therefore, when the process chamber needs to be evacuated to form a negative pressure, the exhaust valve 530 can be opened to enable the cooling chamber 110 to be connected to the vacuum pump 20, so that the vacuum pump 20 can provide a certain suction force to discharge other gases except the water vapor condensed on the condensation plate in the gas flowing from the process chamber into the cooling chamber 110 through the exhaust pipe 400; during the regeneration process of the dewatering device, the exhaust valve 530 can be closed first to isolate the cooling chamber 110 from the vacuum pump 20, thereby preventing the heated regeneration gas introduced through the regeneration pipe 700 from being condensed in the vacuum pump 20. , and is discharged through the exhaust pipe 400 under the action of the vacuum pump 20, so as to ensure that the heated regeneration gas can smoothly heat the cooling chamber 110, so that the ice condensed on the condensation plate 320 turns into water; when the pressure in the cooling chamber 110 reaches a first preset pressure threshold (for example, 100 Torr to 1000 Torr), the heated regeneration gas is stopped from being introduced into the cooling chamber 110, and the exhaust valve 530 is opened to allow the cooling chamber 110 to be connected to the vacuum pump 20, so that a certain suction force can be provided by the vacuum pump 20 to extract the gas (including the regeneration gas and water vapor) in the cooling chamber 110.

[0060] It should be noted that, as those skilled in the art will appreciate, the present invention does not limit the specific type of exhaust valve 530; the exhaust valve 530 may be a solenoid valve or a manual valve. Furthermore, to facilitate automated operation, the exhaust valve 530 is preferably a solenoid valve. It should also be noted that, as those skilled in the art will appreciate, the present invention does not limit the specific value of the first preset pressure threshold; the specific value of the first preset pressure threshold may be set based on actual needs. For example, the first preset pressure threshold may be 780 Torr.

[0061] Please continue to refer to Figure 3 ,like Figure 3As shown, in some exemplary embodiments, the water removal device provided by the present invention further includes a safety valve 540, one end of which is in communication with the cooling chamber 110, and the other end of which is in communication with the air outlet pipe 30. Thus, by providing the safety valve 540, when the pressure in the cooling chamber 110 is greater than a second preset pressure threshold (e.g., 1000 Torr), the safety valve 540 can be pushed open (automatically opened) under the action of the high pressure in the cooling chamber 110, thereby allowing the gas in the cooling chamber 110 to be discharged through the air outlet pipe 30 to release the pressure in the cooling chamber 110, thereby ensuring that the water removal device will not be damaged due to excessive pressure in the cooling chamber 110, effectively ensuring the safety and reliability of the water removal device provided by the present invention during use.

[0062] It should be noted that, as those skilled in the art will appreciate, the safety valve 540 may be, but is not limited to, a pressure relief valve. The specific structure of the pressure relief valve can be referenced to relevant content known to those skilled in the art and will not be further described here. It should also be noted that, as those skilled in the art will appreciate, the present invention does not limit the specific value of the second preset pressure threshold, and the specific value of the second preset pressure threshold can be set according to actual needs.

[0063] Please continue to refer to Figure 3 ,like Figure 3 As shown, in some exemplary embodiments, the water removal device provided by the present invention further includes a pressure sensor 800 disposed on the housing 100, and the pressure sensor 800 is used to monitor the pressure in the cooling chamber 110. Thus, through the pressure sensor 800, the pressure in the cooling chamber 110 can be monitored in real time, so that during the regeneration process, when the pressure in the cooling chamber 110 reaches a first preset pressure threshold (e.g., 100 Torr to 1000 Torr), the introduction of heated regeneration gas into the cooling chamber 110 can be stopped in a timely manner, and the exhaust valve 530 can be opened to allow the cooling chamber 110 to be connected to the vacuum pump 20, so that the vacuum pump 20 can provide a certain suction force to remove the gas (including regeneration gas and water vapor) in the cooling chamber 110.

[0064] Please continue to refer to Figure 3 ,like Figure 3As shown, in some exemplary embodiments, the sidewalls of the condensation pan 320 are arranged to protrude upward relative to the bottom wall of the condensation pan 320. Thus, by arranging the sidewalls of the condensation pan 320 to protrude upward relative to the bottom wall of the condensation pan 320, a receiving area surrounded by the sidewalls and the bottom wall can be formed on the condensation pan 320. This ensures that after heated regeneration gas is introduced into the cooling chamber 110, ice condensed on the condensation pan 320 turns into water and falls into the receiving area without falling down.

[0065] Please continue to refer to Figure 3 ,like Figure 3 As shown, in some exemplary embodiments, the sidewalls of the condensation pan 320 are arranged at an angle to its bottom wall. Thus, by arranging the sidewalls of the condensation pan 320 at an angle to its bottom wall, not only can the surface area of ​​the condensation pan 320 be increased, but also, after heated regeneration gas is introduced into the cooling chamber 110, ice condensed on the condensation pan 320 can be transformed into water and fall smoothly into the accommodation area enclosed by the sidewalls and the bottom wall.

[0066] It should be noted that, as those skilled in the art will understand, the condensation tray 320 can be Figure 3 The inner surface shown is a smooth flat structure, and can also be a wave-shaped structure with multiple concave portions 321 (such as Figure 4 As shown in FIG. 3 , which is a schematic diagram of the structure of a condensation pan 320 provided in another embodiment of the present invention, the wavy condensation pan 320 can ensure that after the heated regeneration gas is introduced into the cooling chamber 110, the ice condensed on the condensation pan 320 turns into water and falls directly into the recess 321 in the condensation pan 320. It should also be noted that, as can be understood by those skilled in the art, the present invention does not limit the specific shape of the recess 321. The recess 321 can be Figure 4 The V-shape shown can also be a U-shape or other shapes.

[0067] Please continue to refer to Figure 3 ,like Figure 3 As shown, in some exemplary embodiments, a seal 910 is provided at the connection between the cooling pipe 200 and the housing 100. Thus, by providing the seal 910 at the connection between the cooling pipe 200 and the housing 100, the airtightness of the connection between the cooling pipe 200 and the housing 100 can be effectively ensured, effectively preventing air leakage.

[0068] Please continue to refer to Figure 3 ,like Figure 3As shown, in some exemplary embodiments, the dewatering device provided by the present invention further includes a pressing member 920 connected to the sealing member 910. Thus, the pressing member 920 provided in connection with the sealing member 910 can compress the sealing member 910, effectively preventing the sealing member 910 from falling off during use, thereby effectively improving the stability of the dewatering device provided by the present invention during use.

[0069] Please continue to refer to Figure 3 ,like Figure 3 As shown, in some exemplary embodiments, the cooling pipe 200 includes a first cooling sub-pipe 210 and a second cooling sub-pipe 220. The first cooling sub-pipe 210 is used for coolant inflow, and the second cooling sub-pipe 220 is used for coolant outflow after absorbing heat. The cooling head 310 is a hollow structure with a cavity. The condensation pan 320 has an inlet (not shown) connected to the first cooling sub-pipe 210 and an outlet (not shown) connected to the second cooling sub-pipe 220. As a result, coolant can flow into the inlet of the condensation pan 320 through the first cooling sub-pipe 210, thereby cooling the condensation pan 320. The coolant that has absorbed heat then flows through the outlet of the condensation pan 320 to the second cooling sub-pipe 220, thereby achieving cyclic cooling of the condensation pan 320.

[0070] It should be noted that, as those skilled in the art will appreciate, the inlet on the condensate pan 320 can be connected to the first cooling sub-pipe 210 via a first pipeline (not shown in the figure), and the outlet on the condensate pan 320 can be connected to the second cooling sub-pipe 220 via a second pipeline (not shown in the figure). It should also be noted that, as those skilled in the art will appreciate, a first multi-way joint having multiple interfaces can be provided at one end of the first cooling sub-pipe 210 close to the housing 100 to connect the first cooling sub-pipe 210 with the inlets on the multiple condensate pans 320; and a second multi-way joint having multiple interfaces can be provided at one end of the second cooling sub-pipe 220 close to the housing 100 to connect the second cooling sub-pipe 220 with the outlets on the multiple condensate pans 320.

[0071] Next, the specific working principle of the dewatering device provided by the present invention is described. The specific working principle of the dewatering device provided by the present invention is as follows: when the process chamber needs to be evacuated to form a negative pressure, the isolation valve 510 and the exhaust valve 530 are first opened to connect the cooling chamber 110 with the process chamber, thereby allowing the gas in the process chamber to flow into the cooling chamber 110. Since the temperature on the condensation plate 320 is lower than the temperature of the entire cooling chamber 110, most of the water vapor will condense on the condensation plate 320, while the other gases can be discharged through the exhaust pipe 400 under the action of the vacuum pump 20 connected to the exhaust pipe 400. When the vacuum level in the process chamber reaches the process vacuum level requirement or after a preset time (for example, half an hour after the pressure reaches the mTorr level), the original exhaust valve of the process chamber is opened and the isolation valve 510 is closed to isolate the cooling chamber 110 from the process chamber. After isolation, the cooling pipe 200 stops cooling, and the exhaust valve 530 is closed. The regeneration valve 520 is opened to allow heated regeneration gas (for example, heated nitrogen, with a recommended temperature of 60°C or above) to flow into the cooling chamber 110. Due to the increase in pressure in the cooling chamber 110 and the presence of hot gas, the ice on the condensation plate 320 will turn into water. The pressure in the cooling chamber 110 can be monitored in real time by the pressure sensor 800. When the pressure in the cooling chamber 110 reaches a first preset pressure threshold (which can be between 100 Torr and 1000 Torr, for example, 780 Torr), the regeneration valve 520 is closed to stop the introduction of heated regeneration gas into the cooling chamber 110, and the exhaust valve 530 is opened to remove the gas (including regeneration gas and water vapor) in the cooling chamber 110. By repeatedly filling and pumping (filling refers to opening the regeneration valve 520 to fill the cooling chamber 110 with heated regeneration gas, and pumping refers to opening the exhaust valve 530 to remove the gas in the cooling chamber 110), the water molecules on the condensation tray 320 can be quickly removed, so that the entire dehydration device becomes dry again. The time for repeated filling and pumping can be between 1 minute and 210 minutes, for example, the time for repeated filling and pumping is 120 minutes. After the dehydration device has completed regeneration, it becomes ready again, waiting for the next chamber opening (the cooling chamber 110 is connected to the process chamber) to quickly remove the water vapor in the process chamber.

[0072] To achieve the above-mentioned objectives, the present invention further provides a semiconductor device comprising a process chamber and any of the dewatering devices described above. Since the semiconductor device provided by the present invention includes the dewatering device provided by the present invention, the semiconductor device provided by the present invention exhibits at least all of the beneficial effects of the dewatering device provided by the present invention. For details regarding the beneficial effects of the semiconductor device provided by the present invention, reference may be made to the above description of the beneficial effects of the dewatering device provided by the present invention, and no further elaboration is required here.

[0073] In summary, compared with the prior art, the water removal device and semiconductor equipment provided by the present invention have the following beneficial effects:

[0074] (1) The present invention can quickly remove water vapor in the process chamber, greatly reducing the exhaust time of the process chamber, improving the recovery efficiency of semiconductor equipment (machines), and can effectively reduce the water vapor content during exhaust, thereby avoiding damage to high-voltage and high-temperature sensitive devices.

[0075] (2) The present invention can achieve rapid removal of water vapor in the process chamber without changing the overall machine structure and process of the semiconductor equipment.

[0076] (3) The utility model has a simple structure and is easy to implement.

[0077] (4) The present invention provides an isolation valve 510 between the process chamber and the cooling chamber 110. During regeneration, the process chamber and the cooling chamber 110 can be isolated by the isolation valve 510, thereby ensuring that the self-regeneration of the water removal device will not affect the process chamber.

[0078] (5) The present invention can ensure that the water removal device will not be damaged due to excessive pressure in the cooling chamber 110 by providing a safety valve 540, thereby effectively ensuring the safety and reliability of the water removal device provided by the present invention during use.

[0079] (6) The present invention can achieve rapid drainage of the process chamber by providing an isolation valve 510, an exhaust valve 530, a regeneration valve 520 and a safety valve 540, and by the mutual cooperation between these valve bodies.

[0080] (7) The dehydration device provided by the utility model can be regenerated independently after removing the water vapor and can be recycled repeatedly. There is no need for the process chamber to wait, the exhaust efficiency is high and there is no impact on the process.

[0081] It should be noted that, in the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are mutually inconsistent.

[0082] It should also be noted that the above description is merely a description of preferred embodiments of the present invention and does not limit the scope of the present invention. Any changes or modifications made by persons skilled in the art based on the above disclosure are within the scope of protection of the present invention. Obviously, those skilled in the art may make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations fall within the scope of the present invention and its equivalents, the present invention is intended to include such modifications and variations.

Claims

1. A water removal device, characterized in that: The process chamber comprises a shell, a cooling pipe, a cooling assembly, and an exhaust pipe. The shell has a cooling cavity in communication with the process chamber, and the cooling assembly is located in the cooling cavity. The cooling assembly includes a cooling head and a plurality of condensation pans mounted on the cooling head, wherein the plurality of condensation pans are arranged at intervals in the vertical direction of the cooling head, and the condensation pans are hollow structures; The cooling pipe is in communication with the condensation pan to pass the coolant into the condensation pan; One end of the exhaust pipe is connected to the cooling chamber, and the other end of the exhaust pipe is used to be connected to a vacuum pump.

2. The water removal device according to claim 1, characterized in that: It also includes an isolation valve capable of isolating the cooling chamber from the process chamber, one end of the isolation valve is connected to the cooling chamber, and the other end of the isolation valve is used to be connected to the process chamber.

3. The water removal device according to claim 1, characterized in that: It also includes a flange connected to the shell, and the flange is arranged on the top of the shell.

4. The water removal device according to claim 1, characterized in that: It also includes a regeneration pipe, one end of which is connected to the cooling chamber, and the other end of which is used to be connected to a gas source that can provide heated regeneration gas.

5. The water removal device according to claim 4, characterized in that: It also includes a regeneration valve, which is arranged on the regeneration pipeline.

6. The water removal device according to claim 1, characterized in that: It also includes an exhaust valve, which is arranged on the exhaust pipe.

7. The water removal device according to claim 1, characterized in that: It also includes a safety valve, one end of which is connected to the cooling chamber, and the other end of which is connected to the air outlet pipe.

8. The water removal device according to claim 1, characterized in that: It also includes a pressure sensor arranged on the shell, and the pressure sensor is used to monitor the pressure in the cooling cavity.

9. The water removal device according to claim 1, characterized in that: The side wall of the condensation tray is arranged to protrude upward relative to the bottom wall of the condensation tray, and / or the side wall of the condensation tray is arranged to form an angle with the bottom wall thereof.

10. A semiconductor device, characterized in that: The process chamber comprises a process chamber and the water removal device according to any one of claims 1 to 9.

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