Cadmium zinc telluride wafer chamfering equipment
By designing CdZnTe wafer chamfering equipment and utilizing the coordinated work of servo motors and hydraulic systems, the problems of low chamfering efficiency and poor uniformity were solved, and efficient and controllable chamfering processing was achieved.
Patent Information
- Application Number
- CN202422933837.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-11-29
AI Technical Summary
Existing CdZnTe wafer chamfering equipment is inefficient, fragile, has poor chamfer uniformity, and has uncontrollable angles, making it difficult to meet processing requirements.
A CdZnTe wafer chamfering equipment was designed, which included a chamfering workbench, a corundum surface, a servo motor and a hydraulic system. Through the coordinated action of the servo motor and the hydraulic system, the CdZnTe wafer was automatically chamfered, and a 2000 mesh corundum surface was used for precise chamfering.
The automated chamfering of CdZnTe wafers is achieved, which improves efficiency, ensures the uniformity and angle controllability of chamfering, and is suitable for the processing of large-size wafers.
Smart Images
Figure CN223419144U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of cadmium zinc telluride crystal processing, in particular to a cadmium zinc telluride wafer chamfering device. Background Art
[0002] CdZnTe crystals are functional materials of great engineering and strategic significance. For example, medical imaging devices made from CdZnTe can produce clearer images while reducing radiation exposure during patient examinations. CdZnTe crystals are also a key raw material for manufacturing high-performance instruments and meters.
[0003] Due to limitations in crystal growth technology, it's impossible to produce a completely single-crystal, defect-free ingot. Instead, square wafers that meet the requirements are selected from the wafer. However, CdZnTe is a soft and brittle material, making its processing more difficult. In CdZnTe wafer processing, to reduce edge chipping, fragmentation, and scratches during grinding and polishing, eight edges of the wafer are typically chamfered before polishing. Existing techniques suffer from low chamfering efficiency, prone to fragmentation, poor chamfer uniformity, and uncontrollable chamfer angles. Utility Model Content
[0004] The utility model aims to provide a CdZnTe wafer chamfering device to overcome the above problems or at least partially solve the above problems.
[0005] In order to achieve the above-mentioned purpose, the technical solution of the present utility model is specifically implemented as follows:
[0006] 7. The swiftly and minutely adjusting device for a wood-planer working table as claimed in claim 1, wherein said linking rod and said adjusting base are pivotally connected to each other with a bolt, and said bolt has a round shank to contact with said linking rod. said linking rod is pivotally connected to said linking rod and said bolt has a round shank to contact with said linking rod.
[0007] As a further solution of the present invention, the diamond surface is plated with 2000 mesh diamond.
[0008] As a further solution of the present invention, a lifting hydraulic cylinder is fixedly connected to the interior of the fixing seat, and a hydraulic rod on the lifting hydraulic cylinder is fixedly connected to the lower side of the support frame.
[0009] As a further solution of the present invention, the angle between the inclined surface and the horizontal plane is 0.2°.
[0010] As a further solution of the present invention, a first servo motor is fixedly connected to the left side of the support frame, the output shaft on the right side of the first servo motor is connected to the screw, and the screw is connected to the sliding seat through a ball nut pair.
[0011] As a further solution of the present invention, two splints are provided, and the two splints are symmetrically arranged in the connecting frame, and the inner side surfaces of the splints are provided with anti-slip surfaces.
[0012] As a further solution of the present invention, a sleeve is fixedly connected to the upper side of the connecting frame, and the sleeve is sleeved on the output shaft of the second servo motor and fixed by bolts.
[0013] The utility model provides a CdZnTe wafer chamfering device, which has the beneficial effects of automated chamfering, high efficiency, simple operation, high yield, good chamfering uniformity, controllable chamfering angle, and compatibility with the chamfering requirements of large-size CdZnTe wafers. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0015] Figure 1 It is a structural diagram of the present utility model.
[0016] Figure 2 This is a schematic structural diagram of the second servo motor in the present invention.
[0017] Figure 3 It is a structural schematic diagram of the connecting frame in the utility model.
[0018] In the figure: 1. Chamfering workbench; 2. Diamond surface; 3. Connecting frame; 4. Connecting sleeve; 5. Sliding seat; 6. Screw; 7. First servo motor; 8. Support frame; 9. Fixed seat; 10. Lifting hydraulic cylinder; 11. Second servo motor; 12. Clamping plate; 13. Electric push rod; 31. Casing. DETAILED DESCRIPTION
[0019] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.
[0020] See also Figure 1-3 The embodiment of the present invention provides a chamfering device for cadmium zinc telluride wafers, including a chamfering workbench 1, the upper side of the chamfering workbench 1 is provided with an inclined surface, and a diamond grinding surface 2 is fixedly installed on the inclined surface, a fixed seat 9 is provided on the left side of the chamfering workbench 1, a connecting frame 3 is plugged into the fixing seat 9, and the connecting frame 3 moves up and down along the fixing seat 9, a lead screw 6 is rotatably connected to the connecting frame 3, a sliding seat 5 is sleeved on the lead screw 6 and moves along the lead screw 6, the sliding seat 5 is provided at the lower side of the supporting frame 8, a connecting sleeve 4 is fixedly connected to the lower side of the sliding seat 5, and a second servo motor 11 is fixed inside the connecting sleeve 4, the output shaft of the second servo motor 11 passes through the connecting sleeve 4 and is connected to the connecting frame 3, a splint 12 is provided inside the connecting frame 3, and the connecting frame 3 is fixedly connected to an electric push rod 13, the electric push rod 13 is fixedly connected to the outer side of the splint 12, and the splint 12 is provided above the diamond grinding surface 2.
[0021] The diamond surface 2 is coated with 2000 mesh diamond.
[0022] The angle between the inclined surface and the horizontal plane is 0.2°.
[0023] During use, the present invention places a CdZnTe wafer between two clamping plates 12, adjusts the position of the CdZnTe wafer so that the bottom surface of the CdZnTe wafer remains horizontal, and drives the clamping plate 12 to move by the operation of the electric push rod 13, thereby clamping the CdZnTe wafer, and then operates the lifting hydraulic cylinder 10 to drive the support frame 8 to move up and down, thereby synchronously moving the CdZnTe wafer up and down, and then operates the first servo motor 7 to drive the sliding seat 5 to move left and right along the lead screw 6, and synchronously drives the CdZnTe wafer to move left and right, thereby adjusting the CdZnTe wafer to the rightmost position of the diamond grinding surface 2, and then inputs the CdZnTe wafer moving speed into the control terminal of the first servo motor 7: 0.02m / s; CdZnTe wafer chamfering depth: 0.5mm, and the CdZnTe wafer is driven to move to the left by the operation of the first servo motor 7, so as to chamfer the left portion of the lower side surface of the CdZnTe wafer. After the chamfering of the left portion of the lower side surface is completed, the second servo motor 11 is operated and drives the connecting frame 3 and the CdZnTe wafer to rotate 180°. After resetting, the CdZnTe wafer is moved to the left again to chamfer the right portion of the lower side surface of the CdZnTe wafer. After the chamfering of the lower side surface is completed, the CdZnTe wafer is removed from the clamping plate 12, rotated 90° clockwise, and the CdZnTe wafer is clamped between the two clamping plates 12 again. Then the above steps are repeated to chamfer again, and this is continued until all four faces and eight corners of the CdZnTe wafer are removed.
[0024] like Figure 1 As shown, a lifting hydraulic cylinder 10 is fixedly connected to the interior of the fixing seat 9, and the hydraulic rod on the lifting hydraulic cylinder 10 is fixedly connected to the lower side of the support frame 8. The operation of the lifting hydraulic cylinder 10 drives the support frame 8 to move up and down, and can drive the connecting frame 3 and the clamped CdZnTe wafer to move up and down, thereby adjusting the height of the CdZnTe wafer.
[0025] like Figure 1 As shown, the left side of the support frame 8 is fixedly connected to the first servo motor 7, the output shaft on the right side of the first servo motor 7 is connected to the screw 6, and the screw 6 is connected to the sliding seat 5 through a ball nut pair. The operation of the first servo motor 7 can drive the screw 6 to rotate, and then drive the sliding seat 5 and the clamping plate 12 to move left and right along the screw 6, thereby driving the CdZnTe wafer to move to the left and contact with the diamond surface 2, thereby chamfering the CdZnTe wafer.
[0026] like Figure 3 As shown, two clamping plates 12 are provided, and the two clamping plates 12 are symmetrically arranged in the connecting frame 3, and the inner side surfaces of the clamping plates 12 are provided with anti-slip surfaces, which improves the stability of the clamping plates 12 on the CdZnTe wafer.
[0027] like Figure 3As shown, a sleeve 31 is fixedly connected to the upper side of the connecting frame 3 , and the sleeve 31 is sleeved on the output shaft of the second servo motor 11 and fixed by bolts, so as to facilitate a stable connection between the connecting frame 3 and the second servo motor 11 .
[0028] The above are merely embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should all be included within the scope of the claims of the present application.
Claims
1. A CdZnTe wafer chamfering device, comprising a chamfering workbench (1), characterized in that: The upper side of the chamfering workbench (1) is provided with an inclined surface, and a diamond grinding surface (2) is fixedly installed on the inclined surface. A fixed seat (9) is provided on the left side of the chamfering workbench (1). A connecting frame (3) is plugged into the fixing seat (9), and the connecting frame (3) moves up and down along the fixing seat (9). A lead screw (6) is rotatably connected to the connecting frame (3), and a sliding seat (5) is sleeved on the lead screw (6) and moves along the lead screw (6). The sliding seat (5) is provided on the lower side of the support frame (8). The lower side of the sliding seat (5) is fixedly connected to a connecting sleeve (4), and a second servo motor (11) is fixed inside the connecting sleeve (4). The output shaft of the lower side of the second servo motor (11) passes through the connecting sleeve (4) and is connected to the connecting frame (3). A clamping plate (12) is provided inside the connecting frame (3), and the connecting frame (3) is fixedly connected to an electric push rod (13). The electric push rod (13) is fixedly connected to the outer side surface of the clamping plate (12). The clamping plate (12) is provided above the diamond grinding surface (2).
2. The CdZnTe wafer chamfering device according to claim 1, characterized in that: The diamond surface (2) is plated with 2000 mesh diamond.
3. The CdZnTe wafer chamfering device according to claim 1, characterized in that: A lifting hydraulic cylinder (10) is fixedly connected inside the fixing seat (9), and a hydraulic rod on the lifting hydraulic cylinder (10) is fixedly connected to the lower side of the support frame (8).
4. The CdZnTe wafer chamfering device according to claim 1, characterized in that: The angle between the inclined surface and the horizontal plane is 0.2°.
5. The CdZnTe wafer chamfering device according to claim 1, characterized in that: A first servo motor (7) is fixedly connected to the left side of the support frame (8), an output shaft on the right side of the first servo motor (7) is connected to a lead screw (6), and the lead screw (6) is connected to a sliding seat (5) via a ball nut pair.
6. The CdZnTe wafer chamfering device according to claim 1, characterized in that: Two clamping plates (12) are provided, and the two clamping plates (12) are symmetrically arranged in the connecting frame (3), and the inner side surfaces of the clamping plates (12) are provided with anti-slip surfaces.
7. The CdZnTe wafer chamfering device according to claim 1, characterized in that: A sleeve (31) is fixedly connected to the upper side of the connecting frame (3), and the sleeve (31) is sleeved on the output shaft of the second servo motor (11) and fixed by bolts.