Solar silicon wafer cutting base plate capable of preventing edge breakage

Abstract

The utility model discloses a solar silicon wafer cutting base plate capable of preventing edge breakage, which comprises a base supporting plate and a first connecting block arranged on the upper side of the base supporting plate, and further comprises a driving motor which is arranged in the base supporting plate, the upper side of the driving motor is connected with a driving disc, the upper side of the driving disc is provided with a driving rod, and the driving rod is connected with the driving motor. A first limiting block is arranged on the outer side of the driving rod, and a first guide rod is arranged on the outer side of the first limiting block. The solar silicon wafer cutting base plate capable of preventing edge breakage is provided with an inner-layer supporting structure and an outer-layer supporting structure in the using process, so that the solar silicon wafer is not prone to edge breakage damage in the cutting process, the machining yield of the device is improved, the using quality of the device is guaranteed, meanwhile, the device is convenient to disassemble, assemble and replace after being damaged, and the service life of the device is prolonged. And the maintenance and overhaul efficiency of the device is improved, the maintenance and overhaul cost of the device is reduced, and the better using effect is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to solar wafer cutting technical field, concretely to a solar wafer cutting backing plate of preventing edge collapse. BACKGROUND

[0002] Solar wafer cutting backing plate is a tool specially used for supporting wafer and assisting cutting, usually called "cutting pad" or "slicing pad". In the wafer cutting process, the cutting pad provides a smooth cutting surface, ensuring the wafer to keep stable during cutting, avoiding the cutting precision to drop caused by sliding or vibration. In addition, the material of the cutting pad has certain elasticity and hardness, which can buffer the impact force generated during cutting to a certain extent, protecting the wafer from damage, such as;

[0003] The cutting backing plate provided in authorization announcement No. CN212351290U includes a backing plate body and a fiber connecting part, the backing plate body includes a first body and a second body, the first body is rotationally connected with the second body through the fiber connecting part, the first body can rotate around the second body, so that the backing plate body can be folded and opened. The first body and the second body are connected through the fiber connecting part, so that the backing plate body can be folded, and the carrying area of the cutting backing plate can be reduced after folding, facilitating the folding and carrying of the cutting backing plate.

[0004] The prior art in the above has the following defects: the existing solar wafer cutting backing plate does not have an inner-outer double-layer supporting structure during use, which causes the solar wafer to be easily damaged by edge collapse during cutting, greatly reduces the processing yield of the device, affects the use quality of the device, and after damage, the device is not convenient to disassemble, replace and maintain, which reduces the maintenance efficiency of the device and increases the maintenance cost of the device. Therefore, the utility model provides a solar wafer cutting backing plate to solve the problems in the above background. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a solar wafer cutting backing plate to solve the problems in the above background, that is, the solar wafer cutting backing plate does not have an inner-outer double-layer supporting structure during use, which causes the solar wafer to be easily damaged by edge collapse during cutting, greatly reduces the processing yield of the device, affects the use quality of the device, and after damage, the device is not convenient to disassemble, replace and maintain, which reduces the maintenance efficiency of the device and increases the maintenance cost of the device.

[0006] To achieve the above purpose, the utility model provides the following technical scheme: a solar wafer cutting backing plate to prevent edge collapse, comprising: a base support plate, and a first connecting block arranged on the upper side of the base support plate, further comprising:

[0007] A driving motor is mounted inside the base support plate, and an upper side of the driving motor is connected with a driving disc, an upper side of the driving disc is provided with a driving rod, an outer side of the driving rod is provided with a first limiting block, an outer side of the first limiting block is provided with a first guide rod, an upper side of the first connecting block is provided with a first backing plate, an outer side of the first connecting block is provided with a connecting plate, an outer side of the connecting plate is provided with a second connecting block, an inner side of the second connecting block is provided with a connecting assembly, and an upper side of the second connecting block is provided with a second backing plate.

[0008] In a possible implementation, the connecting assembly comprises a second limiting block mounted in the second connecting block, an outer side of the second limiting block is provided with a second guide rod, a lower end of the second limiting block is provided with a damper, and a right side of the second limiting block is provided with an operating block.

[0009] In a possible implementation, the second limiting block is arranged in clamping connection with the connecting plate, and the second limiting block is arranged in sliding connection with the second guide rod.

[0010] In a possible implementation, the driving disc is arranged in engagement with the driving rod, and the driving rod is arranged in threaded connection with the first limiting block.

[0011] In a possible implementation, the first limiting block is arranged in clamping connection with the first connecting block, and the first limiting block is arranged in sliding connection with the first guide rod.

[0012] In a possible implementation, the first guide rod has a longitudinal section in a "T" shape, and the first guide rod is arranged symmetrically about a central axis of the first limiting block.

[0013] In a possible implementation, the second connecting block is arranged symmetrically about a central axis of the first connecting block, and the second connecting block is arranged in sliding connection with the connecting plate.

[0014] In a possible implementation, an upper side of the first backing plate is provided with a mounting plate, and an upper side of the mounting plate is provided with anti-skid convex points.

[0015] In a possible implementation, the mounting plate is arranged in clamping connection with the first backing plate, and the anti-skid convex points are uniformly arranged on the upper side of the mounting plate.

[0016] Compared with the prior art, the solar silicon wafer cutting pad capable of preventing edge collapse has the following beneficial effects: the inner and outer double-layer supporting structures are provided during use, so that the solar silicon wafer is not prone to edge collapse damage during cutting, the processing yield of the device is improved, the use quality of the device is ensured, the device can be conveniently disassembled, replaced and reassembled after damage, the maintenance and repair efficiency of the device is improved, the maintenance and repair cost of the device is reduced, and the device has better use effect.

[0017] The second limiting block is pushed upward by the damper and the second guide rod, so that the second limiting block is clamped with the connecting plate to fix the second connecting block and the second pad plate outside the first connecting block, the solar silicon wafer to be processed is supported by the first pad plate and the second pad plate, the pressure on the solar silicon wafer is buffered, and the solar silicon wafer is prevented from being damaged due to uneven stress.

[0018] The driving rod is driven by the driving motor and the driving disc to rotate in the inside of the base support plate, so that the driving rod drives the first limiting block to displace inward along the first guide rod to loosen the limiting of the first connecting block, the first connecting block and the first pad plate are conveniently taken out upward by the maintenance personnel, the maintenance and repair efficiency of the device is improved, and the maintenance cost of the device is reduced.

[0019] The anti-skid convex points are fixed on the upper side of the first pad plate by the mounting plate, so that the solar silicon wafer is in contact with the anti-skid convex points on the upper side of the device, the connection tightness of the solar silicon wafer and the device is improved by the anti-skid convex points, the position of the solar silicon wafer is prevented from being deviated during processing, the processing stability of the device is improved, and the cutting efficiency of the device is improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a front view of the sectional structure of the utility model;

[0021] Figure 2 It is a side view of the sectional structure of the utility model;

[0022] Figure 3 It is a top view of the sectional structure of the utility model;

[0023] Figure 4 It is a front view of the sectional structure of the utility model; Figure 1 It is an enlarged structure diagram of A in the utility model;

[0024] Figure 5 It is a first limiting block and a first guide rod connection integral structure diagram of the utility model.

[0025] In the figure: 1. base support plate; 2. drive motor; 3. drive disk; 4. drive rod; 5. first limit block; 6. first guide rod; 7. first connecting block; 8. first pad; 9. mounting plate; 10. anti-slip bump; 11. connecting plate; 12. second connecting block; 13. connecting assembly; 1301. second limit block; 1302. second guide rod; 1303. damper; 1304. operating block; 14. second pad. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] See also Figure 1-5 The utility model provides a technical solution: a solar silicon wafer cutting pad with anti-collapse edge, comprising: a base support plate 1, and a first connecting block 7 provided on the upper side of the base support plate 1, and further comprising:

[0028] A driving motor 2 is installed inside the base support plate 1, and a driving disk 3 is connected to the upper side of the driving motor 2, a driving rod 4 is provided on the upper side of the driving disk 3, and a first limit block 5 is provided on the outer side of the driving rod 4, a first guide rod 6 is provided on the outer side of the first limit block 5, a first pad 8 is provided on the upper side of the first connecting block 7, and a connecting plate 11 is provided on the outer side of the first connecting block 7, a second connecting block 12 is provided on the outer side of the connecting plate 11, and a connecting assembly 13 is provided inside the second connecting block 12, and a second pad 14 is provided on the upper side of the second connecting block 12, constituting a complete solar silicon wafer cutting pad.

[0029] like Figure 1 、 Figure 2 and Figure 4As shown, the connecting assembly 13 includes a second limit block 1301 installed inside the second connecting block 12, and a second guide rod 1302 is provided on the outer side of the second limit block 1301, and a damper 1303 is provided at the lower end of the second limit block 1301, and an operating block 1304 is provided on the right side of the second limit block 1301, the second limit block 1301 is relatively engaged with the connecting plate 11, and the second limit block 1301 and the second guide rod 1302 are relatively slidably arranged, the second connecting block 12 is symmetrically arranged about the central axis of the first connecting block 7, and the second connecting block 12 and the connecting plate 11 are relatively slidably arranged, and the operating block 1304 is pressed downward to make the operating block 1304 pushes the second limit block 1301 to move downward along the second guide rod 1302 to squeeze the damper 1303, and at the same time, the second connecting block 12 and the second pad 14 are installed along the connecting plate 11 on the outside of the first connecting block 7. At this time, the pressure on the operating block 1304 is relaxed, so that the damper 1303 pushes the second limit block 1301 to reset along the second guide rod 1302 and engage with the connecting plate 11, thereby completing the installation and fixation of the second pad 14. The first pad 8 cooperates with the second pad 14 to provide inner and outer double-layer support for the solar silicon wafer to be processed, buffering the pressure on the solar silicon wafer to avoid edge collapse and damage of the solar silicon wafer due to uneven force.

[0030] like Figure 1 、 Figure 2 and Figure 5 As shown, the driving disk 3 is relatively meshed with the driving rod 4, and the driving rod 4 is relatively threadedly connected to the first limit block 5, the first limit block 5 is relatively engaged with the first connecting block 7, and the first limit block 5 is relatively slidingly arranged with the first guide rod 6. The longitudinal section of the first guide rod 6 is a "T"-shaped structure, and the first guide rod 6 is symmetrically arranged about the central axis of the first limit block 5. When the device is damaged and needs to be repaired, the driving motor 2 drives the driving disk 3 to rotate inside the base support plate 1, so that the driving disk 3 pushes the driving rod 4 to rotate. At this time, the driving rod 4 drives the first limit block 5 to move inward along the first guide rod 6 to relax the limit on the first connecting block 7, so that the maintenance personnel can take out the first connecting block 7 and the first pad 8 to the upper side, thereby improving the maintenance efficiency of the device and reducing the maintenance cost of the device.

[0031] like Figure 1 、 Figure 2 and Figure 3As shown, a mounting plate 9 is provided on the upper side of the first pad 8, and anti-slip protrusions 10 are provided on the upper side of the mounting plate 9. The mounting plate 9 and the first pad 8 are relatively engaged with each other, and the anti-slip protrusions 10 are evenly arranged on the upper side of the mounting plate 9. By installing the mounting plate 9 on the upper side of the first pad 8, the solar silicon wafer is in contact with the anti-slip protrusions 10 on the upper side of the device. The anti-slip protrusions 10 improve the connection tightness between the solar silicon wafer and the device, avoid the position displacement of the solar silicon wafer during the processing, improve the processing stability of the device, and improve the cutting efficiency of the device.

[0032] The standard parts used in the present invention can all be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the existing technology. The machinery, parts and equipment all adopt conventional models in the existing technology, and the circuit connection adopts the conventional connection method in the existing technology. It will not be described in detail here. The content not described in detail in this specification belongs to the existing technology known to professional and technical personnel in this field.

[0033] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A solar silicon wafer cutting pad with anti-collapse edge, comprising: The base support plate (1) and the first connecting block (7) provided on the upper side of the base support plate (1) are characterized in that they further include: A driving motor (2) is mounted inside a base support plate (1), and a driving disk (3) is connected to the upper side of the driving motor (2), a driving rod (4) is provided on the upper side of the driving disk (3), and a first limiting block (5) is provided on the outer side of the driving rod (4), a first guiding rod (6) is provided on the outer side of the first limiting block (5), a first pad (8) is provided on the upper side of the first connecting block (7), and a connecting plate (11) is provided on the outer side of the first connecting block (7), a second connecting block (12) is provided on the outer side of the connecting plate (11), a connecting assembly (13) is provided inside the second connecting block (12), and a second pad (14) is provided on the upper side of the second connecting block (12).

2. The anti-collapse solar silicon wafer cutting pad according to claim 1, characterized in that: The connecting assembly (13) comprises a second limiting block (1301) installed inside the second connecting block (12), a second guide rod (1302) is provided on the outside of the second limiting block (1301), a damper (1303) is provided at the lower end of the second limiting block (1301), and an operating block (1304) is provided on the right side of the second limiting block (1301).

3. The anti-collapse solar silicon wafer cutting pad according to claim 2, characterized in that: The second limiting block (1301) is relatively engaged with the connecting plate (11), and the second limiting block (1301) is relatively slidably arranged with the second guide rod (1302).

4. The anti-collapse solar silicon wafer cutting pad according to claim 1, characterized in that: The driving disc (3) and the driving rod (4) are arranged in relative engagement, and the driving rod (4) and the first limiting block (5) are threadedly connected relative to each other.

5. The anti-collapse solar silicon wafer cutting pad according to claim 1, characterized in that: The first limiting block (5) and the first connecting block (7) are relatively engaged with each other, and the first limiting block (5) and the first guiding rod (6) are relatively slidably arranged.

6. The anti-collapse solar silicon wafer cutting pad according to claim 1, characterized in that: The longitudinal section of the first guide rod (6) is a "T"-shaped structure, and the first guide rod (6) is symmetrically arranged in the upper and lower directions about the central axis of the first limit block (5).

7. The anti-collapse solar silicon wafer cutting pad according to claim 1, characterized in that: The second connecting block (12) is arranged symmetrically with respect to the central axis of the first connecting block (7), and the second connecting block (12) and the connecting plate (11) are arranged to slide relative to each other.

8. The anti-collapse solar silicon wafer cutting pad according to claim 1, characterized in that: A mounting plate (9) is provided on the upper side of the first pad (8), and an anti-slip convex point (10) is provided on the upper side of the mounting plate (9).

9. The anti-collapse solar silicon wafer cutting pad according to claim 8, characterized in that: The mounting plate (9) is relatively engaged with the first pad (8), and the anti-slip protrusions (10) are evenly arranged on the upper side of the mounting plate (9).

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