Injection mold of magnetic conductive ring assembly

By introducing a cooling mechanism into the injection mold and utilizing a combination of an annular water pipe and a semiconductor cooler, the problems of slow molding of injection molding materials and sticky cavity are solved, thus achieving efficient injection molding production.

CN223419939UActive Publication Date: 2025-10-10LAIAN COUNTY PINGSONG MASCH MFG CO LTD
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Patent Information

Application Number
CN202422036129.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-22
Publication Date
2025-10-10
Estimated Expiration
2034-08-22

AI Technical Summary

Technical Problem

The existing injection mold for magnetic ring components lacks a cooling structure, which causes the injection molding material to be slow and easily stick to the inner wall of the cavity, affecting subsequent operations.

Method used

An injection mold with a cooling mechanism was designed, which included a water tank, an annular water pipe, a semiconductor refrigerator and a mixing mechanism. The annular water pipe was used to wrap the cavity for cooling, and the semiconductor refrigerator was used to further cool the water in the water tank to avoid uneven heating and cooling.

Benefits of technology

It improves the molding rate of injection molding materials, reduces viscosity, and ensures efficient production of injection molded parts.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an injection mold of a magnetic conducting ring assembly, belongs to the technical field of magnetic conducting ring assembly processing, and aims to solve the problems that in the prior art, a cooling structure of an injection molding part is not provided, so that in the mold forming process, injection molding raw materials are slow to form, meanwhile, the inner wall of a cavity is stuck, and subsequent operation is influenced. Comprising a base mounting frame, a composition mechanism is mounted above the base mounting frame, the composition mechanism comprises a mounting plate and a movable frame, a lower mold is fixedly arranged above the mounting plate, an upper mold is fixedly arranged at the bottom of the movable frame, a cavity is formed in the middle of the lower mold, and a preassembling groove is formed in the position, located on the periphery of the cavity, in the lower mold; a cooling mechanism is jointly mounted in the base mounting frame and the preassembling groove, the cooling mechanism comprises a water tank, water changing mechanisms are mounted on one side of the upper portion of the water tank and one side of the side edge of the water tank, first cooling assemblies are jointly mounted inside and outside the water tank, and uniform mixing mechanisms are mounted on the two sides of the middle of the water tank.
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Description

Technical Field

[0001] The utility model belongs to the technical field of magnetic ring component processing, and particularly relates to an injection mold of the magnetic ring component. Background Art

[0002] For the magnetic ring assembly in the non-contact hall-type torque sensor, the existing processing and manufacturing of the magnetic ring assembly is through injection molding, which requires an injection mold.

[0003] For example, patent CN203357817U discloses an injection mold for a magnetic ring assembly, comprising a lower mold assembly (100) and an upper mold assembly (200), and a positioning mechanism (300) provided on the lower mold assembly (100); the lower mold assembly (100) comprises a lower mold (101), a core rod (102) provided on the lower mold (101), and a guide device (400) provided to fit the core rod (102); and the upper mold assembly (200) comprises an upper mold (201) and an injection gate (202) provided on the upper mold (201).

[0004] The above-mentioned injection mold does not have a cooling structure for the injection molded part during use. Therefore, during the molding process, the injection molding material is slowly molded and causes adhesion to the inner wall of the cavity, which affects subsequent operations. Utility Model Content

[0005] (1) Technical problems to be solved

[0006] In response to the shortcomings of the existing technology, the purpose of this utility model is to provide an injection mold for a magnetic ring assembly, aiming to solve the problem that the existing technology does not have a cooling structure for the injection molded parts, so that during the mold molding process, the injection molding raw material is slowly molded and causes sticking to the inner wall of the cavity, affecting subsequent operations.

[0007] (2) Technical solution

[0008] In order to solve the above technical problems, the utility model provides an injection mold for a magnetic ring assembly, comprising a base mounting frame, a component mechanism installed above the base mounting frame, the component mechanism including a mounting plate and a movable frame, and a lower mold is fixedly provided above the mounting plate, an upper mold is fixedly provided at the bottom of the movable frame, a cavity is opened in the middle of the lower mold, and a pre-installed groove is opened inside the lower mold at the periphery of the cavity, a cooling mechanism is jointly installed inside the base mounting frame and the pre-installed groove, the cooling mechanism includes a water tank, and a water changing mechanism is installed on the upper side and the side side of the water tank, a first cooling assembly is jointly installed inside and outside the water tank, and a mixing mechanism is installed on both sides of the middle part of the water tank.

[0009] Furthermore, the first cooling component includes a connecting pipe, and the connecting pipe is installed through one side of the water tank. One end of the connecting pipe is connected to a water pump, and a fixing bracket is fixedly installed on the outside of the water pump. The other port of the water pump is connected to an annular water pipe, and a semiconductor refrigerator is installed on one side of the water tank.

[0010] Furthermore, the annular water pipes are distributed in an annular stacked manner, and the inner side edges of the annular water pipes are in contact with the periphery of the cavity.

[0011] Furthermore, the mixing mechanism includes a rotating rod, and the rotating rod is symmetrically installed on both sides of the middle of the water tank. Stirring rods are provided around the two rotating rods, and synchronous wheels are fixed around one end of the two rotating rods. A synchronous belt is provided around the two synchronous wheels, and a motor is installed at the end of one of the rotating rods.

[0012] Furthermore, the component mechanism includes a mounting plate, and the mounting plate is fixed above the base frame, support guide rods are fixed at the four corners of the top of the mounting plate, and the top ends of the four support guide rods are connected to a top plate, a hydraulic cylinder is installed above the top plate, and the protruding end of the hydraulic cylinder is connected to a movable frame.

[0013] Furthermore, the water changing mechanism includes a threaded water inlet, and the threaded water inlet is respectively opened on the upper side and the side side of the water tank. A threaded water plug is installed in the middle of the two threaded water inlets, and a sealing ring is installed at the inner end of each threaded water plug.

[0014] (3) Beneficial effects

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] When the cooling water flows in the annular water pipe, it can indirectly perform an effective wrap-around cooling of the injection molded parts in the mold cavity, thereby increasing the molding rate of the raw materials and reducing the viscosity. After the cooling water absorbs the heat of the injection molding raw materials, it will flow into the water tank again. At this time, under the cooling support of the semiconductor refrigerator, the above-mentioned hot water exchange can be cooled again. With the existence of two sets of rotating rods and distributed stirring rods, the mixing uniformity of the cooling water in the water tank can be improved, thereby avoiding the phenomenon of uneven hot and cold water in the water tank.

[0017] Subsequent personnel of the present invention can utilize the threaded water inlets provided on the top and side of the water tank and the threaded installation of the threaded water plug to replace the water inside the water tank, which is portable and practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0020] Figure 2 To look at the internal structure diagram;

[0021] Figure 3 Schematic diagram of the three-dimensional structure of the annular water pipe;

[0022] Figure 4 This is a schematic diagram of the internal structure of the water tank from above;

[0023] Figure 5 for Figure 2 Schematic diagram of the structure at point A in the middle.

[0024] The marks in the accompanying drawings are: 1. base frame; 2. component mechanism; 21. mounting plate; 22. support guide rod; 23. top plate; 24. hydraulic cylinder; 25. movable frame; 3. lower mold; 4. upper mold; 5. cavity; 6. pre-installed groove; 7. cooling mechanism; 71. water tank; 72. first cooling component; 721. connecting pipe; 722. water pump; 723. annular water pipe; 724. fixed frame; 725. semiconductor refrigerator; 73. mixing mechanism; 731. rotating rod; 732. stirring rod; 733. synchronous wheel; 734. synchronous belt; 735. motor; 8. water changing mechanism; 81. threaded water inlet; 82. threaded water plug; 83. sealing ring. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] This specific embodiment is an injection mold of a magnetic ring assembly, and its structural diagram is as follows Figures 1 to 5As shown, it includes a base frame 1, a component mechanism 2 is installed above the base frame 1, and the component mechanism 2 includes a mounting plate 21, and the mounting plate 21 is fixed to the top of the base frame 1, and support guide rods 22 are fixed to the four corners of the top of the mounting plate 21, and the tops of the four support guide rods 22 are connected to a top plate 23, a hydraulic cylinder 24 is installed above the top plate 23, and the protruding end of the hydraulic cylinder 24 is connected to a movable frame 25, and a lower mold 3 is fixed above the mounting plate 21, and an upper mold 4 is fixed at the bottom of the movable frame 25, a cavity 5 is opened in the middle of the lower mold 3, and a pre-installed groove 6 is opened inside the lower mold 3 at the periphery of the cavity 5, a cooling mechanism 7 is jointly installed inside the base frame 1 and the pre-installed groove 6, and the cooling mechanism 7 includes a water tank 71, and A water changing mechanism 8 is installed on the upper side and the side of the water tank 71. A first cooling assembly 72 is installed on the inside and outside of the water tank 71. The first cooling assembly 72 includes a connecting pipe 721, and the connecting pipe 721 is installed on one side of the water tank 71. One end of the connecting pipe 721 is connected to a water pump 722, and a fixing bracket 724 is fixedly installed on the outside of the water pump 722. The other end of the water pump 722 is connected to an annular water pipe 723. A semiconductor refrigerator 725 is installed on one side of the water tank 71. The annular water pipe 723 is distributed in an annular stacking manner, and the inner side of the annular water pipe 723 is attached to the periphery of the cavity 5. A mixing mechanism 73 is installed on both sides of the middle of the water tank 71. The mixing mechanism 73 includes a rotating rod 731 , and the rotating rods 731 are symmetrically installed on both sides of the middle of the water tank 71. The two rotating rods 731 are respectively provided with stirring rods 732 around their peripheries, and synchronous wheels 733 are fixed around one end of the two rotating rods 731. The peripheries of the two synchronous wheels 733 are sleeved with synchronous belts 734. A motor 735 is installed at the end of one of the rotating rods 731. The daily personnel start the hydraulic cylinder 24 so that the movable frame 25 connected to the end of the extended end can cooperate with the guide of the supporting guide rod 22 to move the upper mold 4 to the lower mold 3 above the mounting plate 21. When the two are combined, the injection molding material of the magnetic ring assembly can enter the middle cavity 5 of the lower mold 3 through the feed port in the upper mold 4. During this process, the staff can start the water pump 722 and guide it to Under the above conditions, the cooling water in the water tank 71 will flow into the annular water pipe 723 along the connecting pipe 721, wherein the annular water pipe 723 is arranged in an annular stacked manner around the cavity 5. Therefore, when the cooling water flows in the annular water pipe 723, the injection molded parts in the cavity 5 can be indirectly and effectively wrapped and cooled, thereby increasing the molding rate of the raw materials and reducing the viscosity. After the cooling water absorbs the heat of the injection molding raw materials, it will flow into the water tank 71 again. At this time, under the cooling support of the semiconductor refrigerator 725, the above-mentioned hot water can be cooled again. With the existence of the two sets of rotating rods 731 and the distributed stirring rods 732, the mixing uniformity of the cooling water in the water tank 71 can be improved, thereby avoiding the phenomenon of uneven hot and cold water inside.

[0027] Among them, the water changing mechanism 8 includes a threaded water inlet 81, and the threaded water inlet 81 is respectively opened on the upper side and the side of the water tank 71. A threaded water plug 82 is installed in the middle of the two threaded water inlets 81, and a sealing ring 83 is installed at the inner end of each threaded water plug 82. Subsequent personnel can use the threaded water inlet 81 provided on the upper and side of the water tank 71 to replace the water inside the water tank 71 through the threaded installation of the threaded water plug 82. It is portable and practical.

[0028] Working principle: Daily personnel start the hydraulic cylinder 24, so that the movable frame 25 connected to the extended end can cooperate with the guide of the support guide rod 22 to carry the upper mold 4 to the lower mold 3 above the mounting plate 21. When the two are combined, the injection molding material of the magnetic ring assembly can enter the middle cavity 5 of the lower mold 3 through the feed port in the upper mold 4. During this process, the staff can start the water pump 722. Under its guidance, the cooling water in the water tank 71 will enter the annular water pipe 723 along the connecting pipe 721, wherein the annular water pipe 723 is annularly stacked and sleeved around the cavity 5. Therefore, when the cooling water flows in its annular water pipe 723, it can indirectly affect the injection molding material in the cavity 5. The parts are effectively wrapped and cooled to increase the molding rate of the raw materials and reduce the viscosity. When the cooling water absorbs the heat of the injection molding raw materials, it will flow into the water tank 71 again. At this time, under the cooling support of the semiconductor refrigerator 725, the above-mentioned hot water can be cooled again. With the existence of two sets of rotating rods 731 and distributed stirring rods 732, the mixing of the cooling water in the water tank 71 can be improved to avoid the phenomenon of uneven hot and cold water inside the water tank. Subsequent personnel can use the threaded water inlet 81 on the top and side of the water tank 71 to replace the water inside the water tank 71 through the threaded installation of the threaded water plug 82. It is portable and practical.

[0029] All technical features in this embodiment can be freely combined according to actual needs.

[0030] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An injection mold for a magnetic ring assembly, comprising a base frame (1), a component mechanism (2) being installed above the base frame (1), the component mechanism (2) comprising a mounting plate (21) and a movable frame (25), a lower mold (3) being fixedly installed above the mounting plate (21), an upper mold (4) being fixedly installed at the bottom of the movable frame (25), a cavity (5) being provided in the middle of the lower mold (3), and a pre-installed groove (6) being provided inside the lower mold (3) at the periphery of the cavity (5), a cooling mechanism (7) being jointly installed inside the base frame (1) and the pre-installed groove (6), the cooling mechanism (7) comprising a water tank (71), a water changing mechanism (8) being installed on one side above and one side of the water tank (71), a first cooling assembly (72) being jointly installed inside and outside the water tank (71), and a mixing mechanism (73) being installed on both sides of the middle of the water tank (71).

2. The injection mold of the magnetic conductive ring assembly according to claim 1, characterized in that: The first cooling component (72) includes a connecting pipe (721), and the connecting pipe (721) is installed through one side of the water tank (71), one end of the connecting pipe (721) is connected to a water pump (722), and a fixing frame (724) is fixedly installed on the outside of the water pump (722), and the other end of the water pump (722) is connected to an annular water pipe (723), and a semiconductor cooler (725) is installed on one side of the water tank (71).

3. The injection mold of the magnetic conductive ring assembly according to claim 2, characterized in that: The annular water pipes (723) are distributed in an annular stacked manner, and the inner side edges of the annular water pipes (723) are in contact with the periphery of the cavity (5).

4. The injection mold of the magnetic conductive ring assembly according to claim 1, characterized in that: The mixing mechanism (73) includes a rotating rod (731), and the rotating rod (731) is symmetrically installed on both sides of the middle of the water tank (71). The peripheries of the two rotating rods (731) are respectively provided with stirring rods (732), and a synchronous wheel (733) is fixed around one end of the two rotating rods (731). The peripheries of the two synchronous wheels (733) are provided with a synchronous belt (734), and a motor (735) is installed at the end of one of the rotating rods (731).

5. The injection mold of the magnetic conductive ring assembly according to claim 1, characterized in that: The component mechanism (2) includes a mounting plate (21), and the mounting plate (21) is fixed above the base mounting frame (1). Support guide rods (22) are fixed at the four corners of the top of the mounting plate (21), and the top ends of the four support guide rods (22) are connected to a top plate (23). A hydraulic cylinder (24) is installed above the top plate (23), and the protruding end of the hydraulic cylinder (24) is connected to a movable frame (25).

6. The injection mold of the magnetic conductive ring assembly according to claim 1, characterized in that: The water changing mechanism (8) comprises a threaded water inlet (81), and the threaded water inlet (81) is respectively opened on one side above and one side of the water tank (71), a threaded water plug (82) is installed in the middle of the two threaded water inlets (81), and a sealing ring (83) is installed at the inner end of each threaded water plug (82).

Citation Information

Patent Citations

  • Injection mold of magnetic conduction ring component

    CN203357817U