Semiconductor fixing tool piece and semiconductor pre-wetting processing assembly

Abstract

The utility model provides a semiconductor fixing tool piece and a semiconductor pre-wetting processing assembly. The semiconductor fixing tool piece comprises a base (11), a protruding limiting part (12), a fixed bearing part (13) and a water retaining part (14). The convex limiting part (12), the fixed bearing part (13) and the water retaining part (14) are arranged or formed on the upper surface of the base (11); the water retaining part (14) is arranged between the protruding limiting part (12) and the fixed bearing part (13) and used for blocking fluid flowing from the protruding limiting part (12) to the fixed bearing part (13). When the semiconductor fixing tool piece is used for fixing substrates such as silicon wafers, the problem that the substrates such as the silicon wafers slide due to the fact that water splashes to the fixed bearing part in the pre-wetting process can be effectively solved, the stability of the substrates such as the silicon wafers in the rotating process is guaranteed, the risk of wafer breaking is avoided, and therefore the product quality and safety are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a semiconductor fixing tooling piece and a semiconductor pre-wetting treatment component. Background Art

[0002] In the field of semiconductor manufacturing, electroplating is a common process used to deposit metal layers on substrates such as silicon wafers. Before the electroplating process, a pre-wetting spin treatment is required to remove various contaminants on the surface of substrates such as silicon wafers and improve the wettability of the surface of substrates such as silicon wafers, thereby improving the quality and performance of the electroplated layer. During the pre-wetting spin treatment, a tooling piece is used to fix substrates such as silicon wafers to ensure the stability of substrates such as silicon wafers during the electroplating pre-wetting spin process. The tooling piece of the prior art uses a support portion and a protrusion to fix substrates such as silicon wafers to prevent substrates such as silicon wafers from being thrown out during the rotation process. However, the water used in the pre-wetting spin treatment process is easily splashed onto the support portion. The material of the support portion is a sticky substance. After being stained with water, the stickiness disappears, and the support portion is caused to slip, causing the substrates such as silicon wafers to slide, and may even cause the substrates such as silicon wafers to be thrown out during the rotation process, causing the risk of fragmentation. Utility Model Content

[0003] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a semiconductor fixing tooling and a semiconductor pre-wetting processing component to solve the problem in the prior art that substrates such as silicon wafers are easily thrown out due to slipping during pre-wetting rotation processing.

[0004] To achieve the above-mentioned purpose and other related purposes, the present invention is obtained through the following technical solutions.

[0005] The utility model provides a semiconductor fixing tooling part, comprising a base, a raised limiting portion, a fixed supporting portion and a water retaining portion; the raised limiting portion, the fixed supporting portion and the water retaining portion are all arranged on or formed on the upper surface of the base; the water retaining portion is arranged between the raised limiting portion and the fixed supporting portion, and is used to block the fluid flowing from the raised limiting portion to the fixed supporting portion.

[0006] In a preferred embodiment, it further comprises an adhesive pad, which is located on the top surface of the fixed supporting portion.

[0007] In a preferred embodiment, the substrate is a flat plate structure.

[0008] In a preferred embodiment, the height of the water retaining portion is not higher than the height of the fixed supporting portion.

[0009] In a preferred embodiment, the height of the raised limiting portion is higher than the height of the fixed supporting portion and the water retaining portion.

[0010] In a preferred embodiment, the number of the fixed supporting parts is at least 2.

[0011] In a preferred embodiment, a through hole is provided inside the fixing support portion.

[0012] In a preferred embodiment, the height of the fixed supporting portion is not less than the height of the water retaining portion.

[0013] In a preferred embodiment, the side surface of the water retaining portion is formed with an arc structure.

[0014] In a preferred embodiment, the inner side surface of the raised limiting portion is formed with an arc structure.

[0015] In a preferred embodiment, the raised limiting portion includes a cylindrical structure portion.

[0016] In a preferred embodiment, the raised limiting portion and the fixed bearing portion are respectively arranged close to two ends of the semiconductor fixing fixture.

[0017] In a preferred embodiment, the base is further provided with a fixing hole.

[0018] In a preferred embodiment, a through drainage hole is further provided on the base, and the drainage hole is located inside the water retaining portion and close to the fixed supporting portion.

[0019] In a preferred embodiment, the water retaining portion extends from one side edge of the base to the other side edge; and / or, both ends of the water retaining portion extend to the inner end of the base; and / or, one end of the water retaining portion extends to the inner end of the base, and the other end extends to one side of the base.

[0020] In a preferred embodiment, a semiconductor pre-wetting processing assembly includes a turntable and a plurality of radially extending arms disposed on the turntable; the semiconductor fixing tool is disposed at the end of each of the radially extending arms.

[0021] In a preferred embodiment, it further comprises a vertical support portion, which is provided at the end of the radially extending arm and is arranged perpendicular to the turntable and connected to the lower surface of the base;

[0022] In a preferred embodiment, the base is parallel to or located in the rotation plane, and the inner end of the base is arranged close to the rotation center.

[0023] The utility model provides a semiconductor fixing fixture and a semiconductor pre-wetting treatment component, which have the following beneficial effects:

[0024] The use of the semiconductor fixing tooling provided in the present application to fix silicon wafers and other substrates can effectively prevent the problem of silicon wafers and other substrates sliding caused by water splashing onto the fixed supporting part during the pre-wetting process, thereby ensuring the stability of silicon wafers and other substrates during the rotation process, avoiding the risk of breakage, and thus improving product quality and safety; and can also reduce the contact between silicon wafers and other substrates and the tooling during rotation, reducing the risk of contamination. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Shown is a schematic diagram of the structure of a semiconductor fixture.

[0026] Figure 2 Shown is a schematic diagram of the usage status of semiconductor fixing fixtures.

[0027] Figure 3 Shown is a schematic diagram of the structure of a semiconductor pre-wetting processing component.

[0028] Explanation of Figure Numbers

[0029] 1. Semiconductor fixture parts;

[0030] 11 base;

[0031] 12 raised limiting portion;

[0032] 13 fixed supporting part;

[0033] 14 water retaining part;

[0034] 15 fixing holes;

[0035] 16 drainage holes;

[0036] 2 turntables;

[0037] 3 radial extension arms;

[0038] 4 Vertical support parts. DETAILED DESCRIPTION

[0039] The following describes the implementation of the present invention through specific embodiments. People familiar with this technology can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0040] See also Figures 1 to 3. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of this utility model. Therefore, they have no substantive technical significance. Any modification of the structure, change in the proportional relationship or adjustment of the size should still fall within the scope of the technical content disclosed by this utility model without affecting the efficacy and purpose that can be achieved by this utility model. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of this utility model. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of this utility model without substantially changing the technical content.

[0041] like Figure 1 As shown, the utility model provides a semiconductor fixing tool, including a base 11, a raised limiting portion 12, a fixed supporting portion 13 and a water retaining portion 14; the raised limiting portion 12, the fixed supporting portion 13 and the water retaining portion 14 are all arranged on or formed on the upper surface of the base 11; the water retaining portion 14 is arranged between the raised limiting portion 12 and the fixed supporting portion 13, and is used to block the fluid flowing from the raised limiting portion 12 to the fixed supporting portion 13.

[0042] The semiconductor fixing tooling provided in the above embodiment is used to fix silicon wafers and other substrates during the rotating pre-wetting process, thereby ensuring the stability of silicon wafers and other substrates during the rotating pre-wetting process, avoiding the risk of fragmentation, and improving product quality and safety. Among them, the fixed supporting portion 13 is used to fix silicon wafers and other substrates; the water retaining portion 14 can effectively prevent water from flowing from the raised limiting portion 12 to the fixed supporting portion 13 during the pre-wetting process, causing water to splash onto the fixed supporting portion 13 and causing the silicon wafer and other substrates to slide; the raised limiting portion 12 is used to block silicon wafers and other substrates to prevent silicon wafers and other substrates from flying out of the semiconductor fixing tooling during the pre-wetting process and causing fragmentation.

[0043] In a Figure 1 In the specific embodiment shown, the substrate 11 is a flat plate structure.

[0044] In a specific embodiment, the number of the fixed supporting parts 13 is at least 2. For example, the number can be 2, 3, or 4. Figure 1 In a specific embodiment, the number of the fixed supporting parts 13 is 2. The more the fixed supporting parts 13 are, the larger the contact area with the substrate such as the silicon wafer is, and the better the stability of the substrate such as the silicon wafer is.

[0045] In a Figure 1 In the specific embodiment shown, a through hole is provided inside the fixing support portion 13 .

[0046] In a Figure 1 In the illustrated embodiment, the fixed support portion 13 further includes an adhesive pad located on the top surface of the fixed support portion 13. The adhesive pad is made of an ultrapure elastomeric material used for semiconductors, has adhesive properties or can serve as a suction cup without damaging substrates such as silicon wafers. Specifically, the adhesive pad is made of an ultrapure perfluoroelastomer material, such as Perlast-G67P.

[0047] In a more specific embodiment, the fixing supporting parts 13 are connected to each other by snapping and / or bonding.

[0048] In a specific embodiment, the height of the water retaining portion 14 is not higher than the height of the fixed supporting portion 13. In a more specific embodiment, the height of the water retaining portion 14 is lower than the height of the fixed supporting portion 13.

[0049] In a more specific embodiment, the height of the fixed supporting portion 13 is 1.2 to 3 times the height of the water retaining portion 14 .

[0050] like Figure 2 As shown, when a substrate such as a silicon wafer is placed on the semiconductor fixed tooling 1 for pre-wetting treatment, the height of the water retaining portion 14 is lower than the height of the fixed supporting portion 13. During the rotation process, the contact between the substrate such as the silicon wafer and the water retaining portion 14 can be reduced, thereby reducing the risk of contamination.

[0051] In a specific embodiment, the height of the raised limiting portion 12 is higher than the height of the fixed supporting portion 13 and the water retaining portion 14. In a further specific embodiment, the height of the raised limiting portion 12 is 2 to 3 times that of the fixed supporting portion 13.

[0052] like Figure 2 As shown, when a substrate such as a silicon wafer is placed on a semiconductor fixed tooling part 1 for pre-wetting treatment, the height of the raised limiting portion 12 is higher than the height of the fixed supporting portion 13 and the water retaining portion 14. During the rotation process, the silicon wafer and other substrates can be blocked to prevent being thrown out due to centrifugal action, which may cause the risk of fragmentation.

[0053] In a Figure 1 In the specific embodiment shown, the inner side surface of the raised limiting portion 12 is formed with an arc structure.

[0054] In the above embodiment, when a silicon wafer or other substrate is placed on the semiconductor fixing fixture 1 for pre-wetting treatment, if the silicon wafer or other substrate moves to the raised limit portion 12 during rotation, the arc-shaped inner side surface that is in direct contact with the silicon wafer or other substrate can prevent the silicon wafer or other substrate from being scratched.

[0055] In a Figure 1In the more specific embodiment shown, the raised limiting portion 12 includes a cylindrical structure.

[0056] In a Figure 1 In the specific embodiment shown, the side surface of the water retaining portion 14 is formed with an arc structure.

[0057] In a Figure 1 In the specific embodiment shown in FIG2 , the protruding limiting portion 12 and the fixed bearing portion 13 are respectively arranged close to two ends of the semiconductor fixing fixture 1 .

[0058] In the above embodiment, when a substrate such as a silicon wafer is placed on the semiconductor fixing fixture 1 for pre-wetting treatment, the farther the distance between the fixed supporting portion 13 and the raised limiting portion 12 is, and the closer the fixed supporting portion 13 is to the center point of the substrate such as the silicon wafer, the better the stability of the substrate such as the silicon wafer.

[0059] In a Figure 1 In the specific embodiment shown, the base 11 is further provided with a fixing hole 15 for fixing the semiconductor fixing fixture 1 on the electroplating equipment.

[0060] In a Figure 1 In the illustrated embodiment, the base 11 is further provided with a through-hole 16, which is located inside the water retaining portion 14 and near the fixed support portion 13. The drain hole 16 serves as a preventative measure. In case a substrate such as a silicon wafer is fixed to the semiconductor fixture 1 for pre-wetting, and the water retaining portion 14 cannot completely block water flowing from the raised stop portion 12 to the fixed support portion 13, the drain hole 16 is used to quickly drain water near the fixed support portion 13, thereby preventing the substrate such as the silicon wafer from slipping due to water on the fixed support portion 13.

[0061] In a specific embodiment, the water retaining portion 14 extends from one side edge of the base 11 to the other side edge; and / or, both ends of the water retaining portion 14 extend to the inner end of the base 11; and / or, one end of the water retaining portion 14 extends to the inner end of the base 11, and the other end extends to one side of the base 11.

[0062] like Figure 3 As shown, a semiconductor pre-wetting processing component includes a turntable 2 and a plurality of radial extension arms 3 provided on the turntable 2; the semiconductor fixing tool 1 is provided at the end of each radial extension arm 3.

[0063] The semiconductor pre-wetting processing assembly is used to fix the semiconductor tooling piece 1 during the pre-wetting process, the radial extension arm 3 is used to fix and support the semiconductor tooling piece 1, and the turntable 2 is used to provide power for rotation during the pre-wetting process. The number of radial extension arms 3 can be 3, 4, or 5, such as Figure 3 In the specific embodiment shown, there are 3.

[0064] In a Figure 3 In the specific embodiment shown, the semiconductor pre-wetting treatment assembly further includes a vertical support portion 4 , which is provided at the end of the radially extending arm 3 and is arranged perpendicular to the turntable 2 , and is connected to the lower surface of the base 11 .

[0065] In a more specific embodiment, the vertical support portion 4 is detachably connected to the base 11 , such as by means of the fixing holes 15 and screws.

[0066] In a Figure 3 In the embodiment shown, the base 11 is parallel to or located in the rotation plane, and the inner end of the base 11 is disposed close to the rotation center.

[0067] Semiconductor pre-wetting treatment components are used for pre-wetting spin treatment of silicon wafers and other substrates before electroplating, such as Figure 3 As shown, the steps are as follows:

[0068] (1) Fixing the semiconductor pre-wetting treatment component in the inner chamber of the electroplating equipment;

[0069] (2) Place the substrate such as a silicon wafer between the three semiconductor fixtures 1 and fix it with the fixing support 13, ensuring that an appropriate gap is maintained between its edge and the raised limiting portion 12;

[0070] (3) During the pre-wetting treatment phase, the semiconductor pre-wetting treatment assembly rotates the substrate, such as the silicon wafer. Simultaneously, the water spraying component in the electroplating equipment chamber sprays water to clean the surface of the substrate, such as the silicon wafer. The specific parameters of the water spraying operation are: the pressure is set to 0.5 MPa, the duration is 10 seconds, and the water spraying angle is fixed at 45 degrees.

[0071] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed in the present invention are intended to be covered by the claims of the present invention.

Claims

1. A semiconductor fixing fixture, characterized in that: The invention comprises a base (11), a raised limiting portion (12), a fixed supporting portion (13) and a water retaining portion (14); the raised limiting portion (12), the fixed supporting portion (13) and the water retaining portion (14) are all arranged on or formed on the upper surface of the base (11); the water retaining portion (14) is arranged between the raised limiting portion (12) and the fixed supporting portion (13) and is used to block the fluid flowing from the raised limiting portion (12) to the fixed supporting portion (13).

2. The semiconductor fixing fixture according to claim 1, characterized in that: It also includes a sticky pad, which is located on the top surface of the fixed supporting portion (13); and / or the base (11) is a flat plate structure.

3. The semiconductor fixing fixture according to claim 1, wherein: The height of the water retaining portion (14) is not higher than the height of the fixed supporting portion (13); And / or, the height of the raised limiting portion (12) is higher than the height of the fixed supporting portion (13) and the water retaining portion (14); And / or, the number of the fixed supporting parts (13) is at least 2.

4. The semiconductor fixing fixture according to claim 1, wherein: The inner side surface of the raised limiting portion (12) is formed with an arc-shaped structure; and / or the side surface of the water retaining portion (14) is formed with an arc-shaped structure.

5. The semiconductor fixing fixture according to claim 4, characterized in that: The raised limiting portion (12) comprises a cylindrical structural portion.

6. The semiconductor fixing fixture according to claim 1, wherein: The raised limiting portion (12) and the fixed supporting portion (13) are respectively arranged close to two ends of the semiconductor fixing fixture (1).

7. The semiconductor fixing fixture according to claim 1, characterized in that: The base (11) is further provided with a fixing hole (15); And / or, a through drainage hole (16) is further provided on the base (11), and the drainage hole (16) is located inside the water retaining portion (14) and is arranged close to the fixed supporting portion (13).

8. The semiconductor fixing fixture according to claim 1, wherein: The water retaining portion (14) extends from one side edge of the base (11) to the other side edge; and / or, both ends of the water retaining portion (14) extend to the inner end of the base (11); and / or, one end of the water retaining portion (14) extends to the inner end of the base (11), and the other end extends to one side of the base (11).

9. A semiconductor pre-wetting processing component, characterized in that: It comprises a turntable (2) and a plurality of radial extension arms (3) provided on the turntable (2); the end of each radial extension arm (3) is provided with a semiconductor fixing fixture (1) according to any one of claims 1 to 8.

10. The semiconductor pre-wetting processing assembly according to claim 9, characterized in that: It also includes a vertical support portion (4), which is provided at the end of the radially extending arm (3) and is arranged perpendicular to the turntable (2), and is connected to the lower surface of the base (11); And / or, the base (11) is parallel to or located in the rotation plane, and the inner end of the base (11) is arranged close to the rotation center.

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