High-luminous-efficiency fluorescent lamp capable of rapidly dissipating heat

Abstract

The utility model discloses a high luminous efficiency fluorescent lamp of quick heat dissipation relates to fluorescent lamp technical field, including heat dissipation cover, protective cover, fixed buckle, heat dissipation hole and heat dissipation water channel, heat dissipation hole, lamp panel and vapor chamber are installed on the heat dissipation cover, the inner side of heat dissipation cover is equipped with fluorescent lamp bead, and the heat dissipation cover is equipped with the heat dissipation hole. A heat dissipation water channel, a semiconductor heat exchange piece and a supporting frame are installed above the vapor chamber, a water pump is installed on the left side of the heat dissipation water channel, and heat dissipation pieces, a turbofan and a motor are installed above the heat dissipation water channel. And the heat dissipation water channel is fixedly connected above the supporting frame, so that the contact area can be maximized, and heat dissipation is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of fluorescent lamps, in particular to a high-light-efficiency fluorescent lamp with rapid heat dissipation. Background Art

[0002] Fluorescent lamps are also called fluorescent lamps. Traditional fluorescent lamps are low-pressure mercury lamps. They use the principle that low-pressure mercury vapor releases ultraviolet light when powered, causing phosphor to emit visible light. Therefore, they are low-pressure arc discharge light sources. However, existing fluorescent lamps have some shortcomings, such as:

[0003] The fluorescent lamp described in application number: CN201620815868.1 does not have an efficient heat dissipation component. As a result, the device cannot carry excessive current during use, which limits the power of the device and affects the user experience and lighting effect. Utility Model Content

[0004] The purpose of the present invention is to provide a high-efficiency fluorescent lamp with rapid heat dissipation, so as to solve the problem raised in the above background technology that the equipment on the existing market is not equipped with an efficient heat dissipation component, resulting in the equipment being unable to carry excessive current during use, which limits the power of the equipment and affects the user experience and lighting effect.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solutions: a high-light-efficiency fluorescent lamp with rapid heat dissipation, comprising a heat dissipation cover, a protective cover, a fixing buckle, heat dissipation holes and a heat dissipation water channel;

[0006] Heat dissipation holes, a lamp panel and a heat spreader are installed above the heat dissipation cover, fluorescent lamp beads are installed on the inside of the heat dissipation cover, heat dissipation water channels, semiconductor heat exchange plates and support frames are installed above the heat spreader, a water pump is installed on the left side of the heat dissipation water channel, and heat sinks, turbofans and motors are installed above the heat dissipation water channels.

[0007] As a preferred technical solution of the present invention, the heat dissipation cover is a trapezoidal structure as a whole, and heat dissipation holes are evenly provided on the side of the heat dissipation cover, and the heat dissipation holes are an oblique structure parallel to the side of the heat dissipation cover;

[0008] By adopting the above technical solution, the device can gather light by making the heat dissipation cover as a whole into a trapezoidal structure, thereby concentrating the light and improving the lighting efficiency of the device. The heat dissipation holes are inclined and parallel to the sides of the heat dissipation cover, which can increase the air circulation speed of the device and improve the heat dissipation efficiency through the physical property of hot air floating up.

[0009] As a preferred technical solution of the present invention, the bottom inner side of the heat dissipation cover is fixedly connected to fluorescent lamp beads, and the fluorescent lamp beads are arranged in an array structure. The fluorescent lamp beads are fixedly connected to the light board above;

[0010] By adopting the above technical solution, the device can ensure sufficient light intensity by fixing a total of 36 fluorescent lamp beads at the bottom inside the heat dissipation cover. The fluorescent lamp beads are arranged in an array structure, which can evenly distribute the light source and increase the lighting range of the device.

[0011] As a preferred technical solution of the present invention, the light panel is fixedly connected to the support frame above, and the support frame is fixedly connected to the heat dissipation water channel above. The heat dissipation water channel is divided into two layers, and the heat dissipation water channel is an M-shaped structure as a whole. The right side of the heat dissipation water channel is fixedly connected to the water pump;

[0012] By adopting the above technical solution, the device can improve the structural strength of the device while ensuring the heat exchange efficiency by fixedly connecting the heat dissipation water channel above the support frame. Fixedly connecting the heat dissipation water channel above the support frame can maximize the contact area and improve heat dissipation.

[0013] As a preferred technical solution of the present invention, the bottom of the support frame is fixedly connected to the heat spreader, and the heat spreader is fitted with the heat dissipation channel. Silicone grease is evenly applied to the fitting position of the heat spreader and the heat dissipation channel, and the bottom of the heat spreader is fixedly connected to the light board;

[0014] By adopting the above technical solution, the device can improve the thermal conductivity of the device and further improve the heat dissipation efficiency of the device by evenly applying silicone grease at the joint between the heat spreader and the heat dissipation water channel.

[0015] As a preferred technical solution of the present invention, the upper surface of the heat dissipation channel is fixedly connected to the semiconductor heat exchange plate, the semiconductor heat exchange plate is a square structure, the bottom of the semiconductor heat exchange plate is made of pure copper, and silicone grease is also applied between the semiconductor heat exchange plate and the heat dissipation channel;

[0016] By adopting the above technical solution, the device can minimize the heat transfer layer and ensure the heat dissipation efficiency of the device by fixedly connecting the semiconductor heat exchange plate to the upper surface of the heat dissipation water channel.

[0017] As an optimal technical solution of the present invention, a heat sink is fixedly connected above the semiconductor heat exchange plate, a motor is fixedly connected to the right side of the heat sink, the right side of the motor is fixedly connected to the turbofan output shaft, and the air inlet of the turbofan is opened on the right side of the protective cover.

[0018] By adopting the above technical solution, the device can form an L-shaped air duct by installing a motor and a turbofan on the right side of the heat sink, effectively improving the heat dissipation efficiency.

[0019] Compared with the prior art, the beneficial effects of the present invention are:

[0020] 1. The device has a trapezoidal heat dissipation cover that can gather light and improve lighting efficiency. The heat dissipation holes are arranged in an oblique structure parallel to the side of the heat dissipation cover. The heat dissipation holes can increase the air circulation speed and heat dissipation efficiency of the device by the physical property of hot air floating upwards.

[0021] 2. The device can ensure sufficient light intensity by fixing 36 fluorescent lamp beads on the bottom of the inner side of the heat dissipation cover. The fluorescent lamp beads are arranged in an array structure, which can evenly distribute the light source and increase the lighting range of the device.

[0022] 3. The device can improve the structural strength of the device while ensuring heat exchange efficiency by fixing the heat dissipation water channel on the support frame. The heat dissipation water channel fixed on the support frame can maximize the contact area and improve heat dissipation.

[0023] 4. By evenly applying silicone grease at the joints between the heat spreader and the heat dissipation channel, the thermal conductivity of the device can be increased, further improving the heat dissipation efficiency of the device.

[0024] 5. The device can minimize the heat transfer layer and ensure the heat dissipation efficiency of the equipment by fixing the semiconductor heat exchange plate to the upper surface of the heat dissipation channel;

[0025] 6. By installing a motor and a turbofan on the right side of the heat sink, the device can form an L-shaped air duct, effectively improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 This is a schematic diagram of the connection structure between the heat dissipation cover and the heat dissipation holes of the utility model;

[0028] Figure 2 This is a schematic diagram of the connection structure between the heat dissipation cover and the protective cover of the utility model;

[0029] Figure 3 This is a schematic diagram of the connection structure between the semiconductor heat exchanger and the support frame of the utility model;

[0030] Figure 4 This is a schematic diagram of the connection structure between the heat sink and the heat dissipation channel of the utility model;

[0031] Figure 5 It is a side view structural diagram of the utility model.

[0032] In the figure: 1. Heat dissipation cover; 2. Protective cover; 3. Fixing buckle; 4. Heat dissipation hole; 5. Fluorescent lamp beads; 6. Heat sink; 7. Turbofan; 8. Semiconductor heat exchanger; 9. Support frame; 10. Motor; 11. Water pump; 12. Lamp board; 13. Heat spreader; 14. Heat dissipation water channel. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0034] See also Figure 1 - Figure 5 The technical solution of the utility model is as follows: a high-efficiency fluorescent lamp with rapid heat dissipation, comprising a heat dissipation cover 1, a protective cover 2, a fixing buckle 3, a heat dissipation hole 4, a fluorescent lamp bead 5, a heat sink 6, a turbofan 7, a semiconductor heat exchange plate 8, a support frame 9, a motor 10, a water pump 11, a lamp board 12, a heat sink 13 and a heat dissipation water channel 14;

[0035] Heat dissipation holes 4, a light board 12 and a heat spreader 13 are installed above the heat dissipation cover 1. The heat dissipation cover 1 is a trapezoidal structure as a whole, and heat dissipation holes 4 are evenly opened on the side of the heat dissipation cover 1. The heat dissipation holes 4 are an inclined structure parallel to the side of the heat dissipation cover 1. The device can gather light by making the heat dissipation cover 1 as a whole into a trapezoidal structure, and concentrate the light to improve the lighting efficiency of the device. The heat dissipation holes 4 are an inclined structure parallel to the side of the heat dissipation cover 1, which can increase the air circulation speed of the device and improve the heat dissipation efficiency through the physical property of hot air floating up. Fluorescent lamp beads 5 are installed on the inside of the heat dissipation cover 1, and the bottom of the inside of the heat dissipation cover 1 is fixedly connected to the fluorescent lamp beads 5. There are thirty-six fluorescent lamp beads 5, and the fluorescent lamp beads 5 are arranged in an array structure. The fluorescent lamp beads 5 are fixedly connected to the light board 12 above. The device can ensure sufficient light intensity by fixing the fluorescent lamp beads 5 at the bottom inside the heat dissipation cover 1 with a total of thirty-six. The fluorescent lamp beads 5 are arranged in an array structure, which can evenly distribute the light source and increase the illumination range of the device. A heat dissipation water channel 14, a semiconductor heat exchange plate 8, and a support frame 9 are installed above the heat dissipation plate 13. The support frame 9 is fixedly connected above the lamp board 12. The heat dissipation water channel 14 is fixedly connected above the support frame 9. The heat dissipation water channel 14 is divided into two layers, and the heat dissipation water channel 14 is an M-shaped structure as a whole. The right side of the heat dissipation water channel 14 is fixedly connected to the water pump 11. The device can provide While the structural strength of the equipment is high, the heat exchange efficiency is guaranteed, and the fixed connection of the heat dissipation water channel 14 above the support frame 9 can maximize the contact area and improve heat dissipation. A water pump 11 is installed on the left side of the heat dissipation water channel 14, and the bottom of the support frame 9 is fixedly connected to the heat spreader 13, and the heat spreader 13 is fitted with the heat dissipation water channel 14. The heat spreader 13 and the heat dissipation water channel 14 are evenly coated with silicone grease at the fitting position. The bottom of the heat spreader 13 is fixedly connected to the light board 12. The device can improve the thermal conductivity of the equipment by evenly applying silicone grease at the fitting position of the heat spreader 13 and the heat dissipation water channel 14, thereby further improving the heat dissipation efficiency of the equipment. A heat sink 6, a turbofan 7 and a motor 10 are installed above the heat dissipation water channel 14, and the upper surface of the heat dissipation water channel 14 is fixed. The semiconductor heat exchanger 8 is connected. The semiconductor heat exchanger 8 has a square structure. The bottom of the semiconductor heat exchanger 8 is made of pure copper, and silicone grease is also applied between the semiconductor heat exchanger 8 and the heat dissipation water channel 14. The device can minimize the heat transfer level by fixing the semiconductor heat exchanger 8 on the upper surface of the heat dissipation water channel 14, thereby ensuring the heat dissipation efficiency of the device. The heat sink 6 is fixedly connected above the semiconductor heat exchanger 8, and the right side of the heat sink 6 is fixedly connected to the motor 10. The right side of the motor 10 is fixedly connected to the output shaft of the turbofan 7, and the air inlet of the turbofan 7 is opened on the right side of the protective cover 2. The device can form an L-shaped air duct by installing the motor 10 and the turbofan 7 on the right side of the heat sink 6, thereby effectively improving the heat dissipation efficiency.

[0036] Working principle: When using a high-efficiency fluorescent lamp with fast heat dissipation, first fix the heat dissipation cover 1 to the appropriate position through the fixing buckle 3, then connect the power supply to start the device. When the lamp board 12 starts to power the fluorescent lamp beads 5, the motor 10 and the turbofan 7 will start to run synchronously, sucking in cold air to take away the heat generated by the semiconductor heat exchange plate 8 through the heat sink 6, and the heat dissipation water channel 14 under the semiconductor heat exchange plate 8 will be quickly cooled and repeatedly circulated through the water pump 11, and the heat generated by the lamp board 12 during operation will be absorbed by the heat sink 13 and exchanged under the contact of the heat dissipation water channel 14.

[0037] Thereby completing a series of tasks, the contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high-light-efficiency fluorescent lamp with rapid heat dissipation, comprising a heat dissipation cover (1), a protective cover (2), a fixing buckle (3), a heat dissipation hole (4) and a heat dissipation water channel (14); Its characteristics are: A heat dissipation hole (4), a lamp board (12) and a heat spreader (13) are installed above the heat dissipation cover (1); a fluorescent lamp bead (5) is installed inside the heat dissipation cover (1); a heat dissipation water channel (14), a semiconductor heat exchange plate (8) and a support frame (9) are installed above the heat spreader (13); a water pump (11) is installed on the left side of the heat dissipation water channel (14); and a heat sink (6), a turbofan (7) and a motor (10) are installed above the heat dissipation water channel (14).

2. The high-efficiency fluorescent lamp with rapid heat dissipation according to claim 1, characterized in that: The heat dissipation cover (1) is of a trapezoidal structure as a whole, and heat dissipation holes (4) are evenly arranged on the side of the heat dissipation cover (1), and the heat dissipation holes (4) are of an oblique structure and parallel to the side of the heat dissipation cover (1).

3. The high-efficiency fluorescent lamp with rapid heat dissipation according to claim 2, characterized in that: The inner bottom of the heat dissipation cover (1) is fixedly connected to fluorescent lamp beads (5), wherein there are thirty-six fluorescent lamp beads (5) in total, and the fluorescent lamp beads (5) are arranged in an array structure, and the top of the fluorescent lamp beads (5) is fixedly connected to a light board (12).

4. The high-efficiency fluorescent lamp with rapid heat dissipation according to claim 3, characterized in that: The light panel (12) is fixedly connected to the support frame (9) above, and the support frame (9) is fixedly connected to the heat dissipation water channel (14) above. The heat dissipation water channel (14) is divided into two layers, and the heat dissipation water channel (14) is an M-shaped structure as a whole. The right side of the heat dissipation water channel (14) is fixedly connected to the water pump (11).

5. The high-efficiency fluorescent lamp with rapid heat dissipation according to claim 4, characterized in that: The bottom of the support frame (9) is fixedly connected to a heat spreader (13), and the heat spreader (13) is fitted with a heat dissipation channel (14). Silicone grease is evenly applied to the fitting position of the heat spreader (13) and the heat dissipation channel (14), and the bottom of the heat spreader (13) is fixedly connected to a light board (12).

6. The high-efficiency fluorescent lamp with rapid heat dissipation according to claim 5, characterized in that: The upper surface of the heat dissipation channel (14) is fixedly connected to the semiconductor heat exchange plate (8), the semiconductor heat exchange plate (8) is a square structure, the bottom of the semiconductor heat exchange plate (8) is made of pure copper, and silicone grease is also applied between the semiconductor heat exchange plate (8) and the heat dissipation channel (14).

7. The high-efficiency fluorescent lamp with rapid heat dissipation according to claim 6, characterized in that: The semiconductor heat exchange plate (8) is fixedly connected to a heat sink (6) above, the heat sink (6) is fixedly connected to a motor (10) on the right side, the motor (10) is fixedly connected to an output shaft of a turbofan (7) on the right side, and an air inlet of the turbofan (7) is opened on the right side of the protective cover (2).

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