Device for rapidly measuring impedance of inner layer of PCB (Printed Circuit Board)

Abstract

The utility model discloses a PCB inner layer impedance rapid measuring device, which comprises a conductive main body and an insulator, and is characterized in that the conductive main body can movably extend into a test hole of a PCB, so that the conductive main body is connected with an impedance test line of an inner layer of the PCB exposed on the inner wall of the test hole, the insulator is connected to the conductive main body, and when the conductive main body extends into the test hole, the insulator is connected with the conductive main body. The insulator is located between the conductive body and the top layer of the PCB, and / or the insulator is located between the conductive body and the bottom layer of the PCB. Therefore, the test reliability can be improved while the inner layer impedance test time of the first batch of PCBs can be saved. The method is widely applied to the technical field of PCB manufacturing.

Description

Technical Field

[0001] The present application relates to the field of PCB manufacturing technology, and in particular to a device for quickly measuring the impedance of a PCB inner layer. Background Art

[0002] PCB inner layer impedance testing is a routine test item in the PCB manufacturing process. With the advancement and development of PCB technology, PCBs are showing a development trend of high frequency, high speed, and high density, and the requirements for PCB impedance are also becoming increasingly higher. In particular, the requirements for PCB inner layer impedance for high-speed transmission signals are even more stringent. To meet the requirements for PCB impedance, PCB manufacturing usually adopts a method of completing the first batch of production and then testing the inner layer impedance. After the inner layer impedance test of the first batch of PCBs is qualified, mass production is carried out. For PCBs with complex processes (such as N+N type or double-drilled POFV), the first batch of inner layer impedance testing takes a long time, affecting product delivery time. In addition, if the inner layer impedance test of the first batch of PCBs fails, it needs to be readjusted and the first batch of production and testing must be carried out again. Since the inner layer impedance cannot be confirmed in time, a lot of time is wasted.

[0003] In the related art, after the lamination process and drilling process, a conductor is inserted into the test hole to connect with the impedance test line of the inner layer of the PCB, and a chamfer is set at the end of the test hole to avoid contact and conduction between the conductor and the copper layer of the top or bottom layer of the PCB, thereby testing the inner layer impedance of the PCB and saving the inner layer impedance test time of the first batch of PCBs. However, since the conductor and the PCB are not limited and fixed, the conductor is easy to shake relative to the test hole, causing the conductor to contact with the copper layer of the top or bottom layer of the PCB, and the distance between the conductor and the test hole at the chamfer position is small, which makes it easy for conductive impurities to enter the test hole and cause conduction, thereby affecting the reliability of the PCB inner layer impedance test. Utility Model Content

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a PCB inner layer impedance fast measurement device that can save the inner layer impedance test time of the first batch of PCBs while improving the test reliability.

[0005] According to the first aspect of the present application, a device for quickly measuring the inner layer impedance of a PCB includes:

[0006] A conductive body, the conductive body being configured to movably extend into a test hole of a PCB so as to electrically connect the conductive body to an impedance test line of an inner layer of the PCB exposed through an inner wall of the test hole;

[0007] an insulator, wherein the insulator is connected to the conductive body, and when the conductive body is inserted into the test hole, the insulator is located between the conductive body and the top layer of the PCB, and / or the insulator is located between the conductive body and the bottom layer of the PCB.

[0008] The PCB inner layer impedance fast measurement device according to the embodiment of the present application has at least the following beneficial effects: the conductive body can be movably extended into the test hole of the PCB, so that the conductive body is electrically connected to the impedance test line of the PCB inner layer exposed on the inner wall of the test hole, and the insulator is connected to the conductive body. When the conductive body is inserted into the test hole, the insulator is located between the conductive body and the top layer (or bottom layer) of the PCB, so that when the conductive body is inserted into the test hole of the PCB, the conductive body and the impedance test line of the inner layer of the PCB are connected, and the conductive body and the copper layer of the top layer or bottom layer of the PCB are isolated and not conductive by the insulator, thereby The head is electrically connected to the conductive body to measure the impedance of the inner layer of the PCB, improving the reliability of the PCB inner layer impedance test. At the same time, the PCB inner layer impedance rapid measurement device is used to extend into the PCB test hole for impedance testing. After the PCB has undergone the lamination process and drilling, the inner layer impedance test process can be carried out. This allows the PCB inner layer impedance test process to be moved earlier in the PCB manufacturing process, eliminating the time spent waiting for other processes (such as baking the board after drilling, deburring, copper plating, electroplating, outer layer etching, etc.) after the first batch of PCBs are drilled. This saves time for the inner layer impedance test of the first batch of PCBs and helps shorten product delivery. After the PCB inner layer impedance test is completed, the conductive body leaves the test hole, allowing the PCB inner layer impedance rapid measurement device to be separated from the PCB, facilitating subsequent processing steps on the PCB and completing PCB manufacturing.

[0009] According to some embodiments of the present application, the conductive body is a first conductive rod, the insulator is arranged on the outer periphery of the first conductive rod and is flush with the outer peripheral surface of the first conductive rod, and when the first conductive rod is inserted into the test hole, the first conductive rod abuts against the inner wall of the test hole, and the insulator abuts against the top layer of the PCB and / or the bottom layer of the PCB.

[0010] According to some embodiments of the present application, a first positioning portion is provided at the top of the first conductive rod, the first positioning portion is electrically connected to the first conductive rod, and the first positioning portion protrudes from the outer circumferential surface of the first conductive rod along the radial direction of the first conductive rod. The insulator includes a first insulating member and a second insulating member connected to each other, the first insulating member is arranged at one end of the first conductive rod close to the first positioning portion, and the second insulating member is arranged on a side of the first positioning portion close to the first conductive rod.

[0011] According to some embodiments of the present application, the conductive body is a second conductive rod, which includes a first conductive part and a first insulating part along its own circumferential direction. The insulator includes a first measuring ring, which includes a second conductive part and a second insulating part arranged in sequence along the circumferential direction of the second conductive rod. The first measuring ring is sleeved on the outer circumference of the second conductive rod and is rotatable relative to the second conductive rod so that the second conductive part is aligned with or staggered with the first conductive part.

[0012] According to some embodiments of the present application, the PCB inner layer impedance rapid measurement device further includes a plurality of second measurement rings, each of the second measurement rings including a third conductive portion and a third insulating portion sequentially arranged along the circumferential direction of the second conductive rod, the plurality of second measurement rings being sequentially sleeved on the outer circumference of the second conductive rod and located on a side of the first measurement ring close to the test hole, and the respective second measurement rings being rotatable relative to the second conductive rod so that the third conductive portion is aligned with the first conductive portion so as to be conductive or staggered.

[0013] According to some embodiments of the present application, the PCB inner layer impedance rapid measurement device also includes a second positioning portion, which is connected to one end of the second conductive rod and abuts against the first measuring ring, and the second positioning portion is non-conductive, and the outer diameter of the second positioning portion is larger than the inner diameter of the first measuring ring and smaller than the outer diameter of the first measuring ring.

[0014] According to some embodiments of the present application, a conductive head is provided at one end of the second conductive rod away from the second positioning portion, the conductive head is electrically connected to the first conductive part, and the diameter of the conductive head is larger than the diameter of the second conductive rod.

[0015] According to some embodiments of the present application, the PCB inner layer impedance rapid measurement device also includes a pressure plate and an elastic member, both of which are non-conductive, and the pressure plate is sleeved on the outer periphery of the second conductive rod and is located between the conductive head and the first measuring ring, and the two ends of the elastic member are respectively connected to the pressure plate and the conductive head, and the elastic member is used to apply an elastic force directed to the first measuring ring to the pressure plate so that the first measuring ring and multiple second measuring rings abut against each other.

[0016] According to some embodiments of the present application, the number of the first conductive part and the number of the first insulating part are both multiple, the multiple first insulating parts are arranged at intervals, each first conductive part is arranged between two adjacent first insulating parts, and the ends of the multiple first conductive parts close to the center of the second conductive rod intersect and conduct, the number of the second conductive part and the number of the second insulating part are both multiple, and each second insulating part and each second conductive part are alternately arranged along the circumferential direction of the second conductive rod.

[0017] According to some embodiments of the present application, the arc length of the third conductive portion is smaller than the arc length of the third insulating portion.

[0018] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present application is further described below with reference to the accompanying drawings and embodiments, wherein:

[0020] Figure 1 This is a schematic structural diagram of the device for quickly measuring the inner layer impedance of a PCB disclosed in the first embodiment of the present application;

[0021] Figure 2 This is a cross-sectional view of the device for quickly measuring the inner layer impedance of a PCB disclosed in the first embodiment of the present application;

[0022] Figure 3 A cross-sectional view of the PCB inner layer impedance fast measurement device and the PCB in an assembled state disclosed in the first embodiment of the present application;

[0023] Figure 4 This is a schematic structural diagram of a device for quickly measuring the inner layer impedance of a PCB disclosed in the second embodiment of the present application;

[0024] Figure 5 A cross-sectional view of a device for quickly measuring the inner layer impedance of a PCB disclosed in a second embodiment of the present application;

[0025] Figure 6 A cross-sectional view of the PCB inner layer impedance fast measurement device and the PCB in an assembled state disclosed in the second embodiment of the present application;

[0026] Figure 7 This is a schematic structural diagram of the second conductive rod of the PCB inner layer impedance fast measurement device disclosed in the second embodiment of the present application;

[0027] Figure 8 A cross-sectional view of a connecting rod disclosed in a second embodiment of the present application;

[0028] Figure 9This is a schematic structural diagram of the first measurement disclosed in the second embodiment of this application;

[0029] Figure 10 This is a structural diagram of the second measurement disclosed in the second embodiment of this application.

[0030] Reference numerals:

[0031] 100. PCB inner layer impedance rapid measurement device; 11. First conductive rod; 12. Insulator; 121. First insulating member; 122. Second insulating member; 123. Third insulating member; 13. First positioning portion; 21. Second conductive rod; 211. First conductive portion; 212. First insulating portion; 22. Conductive head; 23. First measuring ring; 231. Second conductive portion; 232. Second insulating portion; 24. Second positioning portion; 25. Second measuring ring; 251. Third conductive portion; 252. Third insulating portion; 26. Pressure plate; 27. Elastic member;

[0032] 200, PCB; 201, inner layer; 202, top layer; 203, bottom layer. DETAILED DESCRIPTION

[0033] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0034] In the description of this application, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0035] In the description of this application, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0036] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0037] In the description of this application, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples.

[0038] PCB inner layer impedance testing is a routine test item during the PCB manufacturing process. To meet the requirements for high-speed signal transmission, mass production typically requires qualified first-pass testing. This testing requires connecting the inner layer impedance traces to test holes. These holes are copper-plated to conduct the inner layer signals to the outer PCB layers. Furthermore, annular rings are provided on the outer PCB layers to provide test points for probes. These rings are insulated from the outer copper surface to prevent impedance probing signal misalignment. Therefore, the first batch of PCB impedance testing is typically performed after PCB manufacturing is completed (i.e., after drilling, electroplating, and etching). For example, the impedance testing process for a double-drilled POFV board is as follows: inner layer fabrication - lamination - drilling - adhesive removal - copper deposition - electroplating - drilling - adhesive removal - copper deposition - electroplating - outer layer etching - inner side impedance testing. Furthermore, several auxiliary processes are involved, such as post-drilling board baking and deburring. As a result, the inner layer impedance test of the first batch of PCBs takes a long time, often taking more than a week to obtain the test results of the inner layer impedance. If the inner layer impedance test fails, it is necessary to readjust and produce the first batch again and test it. Only after the test passes can mass production begin, which seriously affects the delivery time of the product.

[0039] In the related art, after the lamination process and drilling process, a conductor is inserted into the test hole to connect with the impedance test line of the inner layer of the PCB, and a chamfer is set at the end of the test hole to avoid contact and conduction between the conductor and the copper layer of the top or bottom layer of the PCB, thereby testing the inner layer impedance of the PCB and saving the inner layer impedance test time of the first batch of PCBs. However, since the conductor and the PCB are not limited and fixed, the conductor is easy to shake relative to the test hole, causing the conductor to contact with the copper layer of the top or bottom layer of the PCB, and the distance between the conductor and the test hole at the chamfer position is small, which makes it easy for conductive impurities to enter the test hole and cause conduction, thereby affecting the reliability of the PCB inner layer impedance test.

[0040] Based on this, the present application provides a PCB inner layer impedance rapid measurement device. By positioning the test hole to connect the PCB inner layer impedance line and cooperating with the PCB inner layer impedance rapid measurement device to perform inner layer impedance testing, the inner layer impedance testing process can be advanced to the process after the drilling process, so that the PCB inner layer impedance testing process is moved forward in the PCB manufacturing process, thereby saving the time spent waiting for other processes after the first batch of PCB drilling. At the same time, by arranging an insulator on the conductive body to isolate the copper layers of the top and bottom layers of the PCB, the problem of the first batch of PCB inner layer impedance testing taking a long time and affecting the test reliability is solved.

[0041] The technical solution of the present application will be further described below with reference to the embodiments and drawings.

[0042] Please also refer to Figure 1 、 Figure 3 as well as Figure 4 、 Figure 6 An embodiment of the present application provides a device 100 for quickly measuring the inner layer impedance of a PCB, including a conductive body and an insulator 12. The conductive body can be movably extended into a test hole of a PCB 200 to electrically connect the conductive body to an impedance test line of an inner layer 201 of the PCB exposed through the inner wall of the test hole. The insulator 12 is connected to the conductive body. When the conductive body is extended into the test hole, the insulator 12 is located between the conductive body and a top layer 202 of the PCB, and / or between the conductive body and a bottom layer 203 of the PCB.

[0043] The PCB inner layer impedance rapid measurement device 100 provided in the embodiment of the present application has a conductive body that can be movably extended into a test hole of a PCB 200 so that the conductive body is electrically connected to the impedance test line of the inner layer 201 of the PCB exposed on the inner wall of the test hole, and the insulator 12 is connected to the conductive body. When the conductive body is inserted into the test hole, the insulator 12 is located between the conductive body and the top layer 202 of the PCB (or the bottom layer 203 of the PCB). When the conductive body is inserted into the test hole of the PCB 200, the conductive body and the impedance test line of the inner layer 201 of the PCB are connected, and the conductive body and the copper layer of the top layer 202 or the bottom layer 203 of the PCB are isolated and not conductive by the insulator 12. Therefore, the impedance of the inner layer of the PCB can be measured by electrically connecting the conductive probe to the conductive body, thereby improving the reliability of the PCB inner layer impedance test. At the same time, the PCB inner layer impedance rapid measurement device 100 is used to extend into the PCB test hole to perform impedance testing. After the PCB has undergone the lamination process and drilling process, the inner layer impedance testing process can be performed, so that the PCB inner layer impedance testing process is completed on the PCB. The device is positioned earlier in the manufacturing process of the first batch of PCBs 200, eliminating the time spent waiting for other processes (such as post-drilling baking, deburring, copper plating, electroplating, and outer layer etching) after drilling holes in the first batch of PCBs 200. This reduces the time required for inner layer impedance testing of the first batch of PCBs 200, thereby shortening product delivery. Once the PCB inner layer impedance test is complete, the conductive body exits the test hole, allowing the PCB inner layer impedance rapid measurement device 100 to be removed from the PCB 200, facilitating subsequent processing steps on the PCB 200 and completing the manufacturing of the PCB 200.

[0044] Optionally, when the test hole is a through hole, after the conductive body is inserted into the test hole, the insulator 12 is located between the conductive body and the top layer 202 of the PCB, or between the conductive body and the bottom layer 203 of the PCB, thereby ensuring the reliability of the PCB inner layer impedance test. When the test hole is a blind hole, after the conductive body is inserted into the test hole, the insulator 12 is located between the conductive body and the top layer 202 or bottom layer 203 of the PCB.

[0045] First embodiment:

[0046] Figure 1 and Figure 2 FIG. 1 shows the structure of the PCB inner layer impedance fast measurement device 100 in the first embodiment. Figure 3 The figure shows the structural matching relationship when the PCB inner layer impedance fast measuring device 100 in the first embodiment is inserted into the test hole of the PCB 200.

[0047] Please combine Figures 1 to 3In some embodiments, the conductive body is a first conductive rod 11, and the insulator 12 is arranged on the outer periphery of the first conductive rod 11 and is flush with the outer peripheral surface of the first conductive rod 11. When the first conductive rod 11 is inserted into the test hole, the first conductive rod 11 abuts against the inner wall of the test hole, and the insulator 12 abuts against the top layer 202 of the PCB and / or the bottom layer 203 of the PCB.

[0048] In this way, the first conductive rod 11 abuts against the inner wall of the test hole, so that the first conductive rod 11 is connected to the impedance test line of the inner layer 201 of the PCB. At the same time, the first conductive rod 11 is isolated from the copper layers of the top layer 202 and the bottom layer 203 of the PCB by the insulator 12, so as to avoid interference with the test results of the PCB inner layer impedance due to the copper of the top layer 202 and the bottom layer 203 of the PCB being connected to the first conductive rod 11, thereby ensuring the accuracy of the PCB inner layer impedance test and meeting the product requirements for the PCB inner layer impedance.

[0049] Optionally, a mounting groove is provided on the outer periphery of the first conductive rod 11, and the insulator 12 is installed in the mounting groove and is flush with the outer periphery of the first conductive rod 11, thereby ensuring the flatness of the outer periphery of the PCB inner layer impedance rapid measurement device 100. When the first conductive rod 11 is inserted into the test hole, it can ensure that the first conductive rod 11 abuts against the inner wall of the test hole to conduct with the impedance test line exposed on the inner wall of the test hole, and can also ensure that the first conductive rod 11 is isolated from the top layer 202 and the bottom layer 203 of the PCB under the action of the insulator 12, so as to improve the reliability of the PCB inner layer impedance test.

[0050] It is understandable that in other embodiments, the insulator 12 may also be an insulating coating coated on the outer periphery of the first conductive rod 11 .

[0051] Optionally, a first positioning portion 13 is provided at the top of the first conductive rod 11, and the first positioning portion 13 protrudes from the outer peripheral surface of the first conductive rod 11 along the radial direction of the first conductive rod 11. The insulator 12 includes a first insulating member 121 and a second insulating member 122 connected to each other. The first insulating member 121 is arranged at one end of the first conductive rod 11 close to the first positioning portion 13, and the second insulating member 122 is arranged on a side of the first positioning portion 13 close to the first conductive rod. By providing the first positioning portion 13, on the one hand, the first conductive rod 11 can be positioned by snapping when it is inserted into the test hole, so that the position of the first conductive rod 11 relative to the test hole remains stable, which is conducive to ensuring that the first conductive rod 11 and the impedance test line of the inner layer 201 of the PCB remain conductive, and the insulator 12 remains connected to the top layer 202 and / or bottom layer 203 of the PCB, thereby ensuring the reliability of the impedance test of the inner layer of the PCB and avoiding the situation where the first conductive rod 11 is stuck in the test hole and cannot be escaped. On the other hand, the first positioning portion 13 is conductive to the first conductive rod 11, which can also help increase the end size of the first conductive rod 11, thereby facilitating the increase of the area of ​​conductive contact between the first conductive rod 11 and the probe, facilitating the electrical connection between the probe and the first conductive rod 11, and thus facilitating the testing of the inner layer impedance of the PCB. In addition, the insulator 12 insulates the first conductive rod 11 from the PCB top layer 202 through the first insulating member 121, and insulates the first positioning portion 13 from the PCB top layer 202 through the second insulating member 122, so as to facilitate positioning of the first positioning portion 13 while insulating the surface copper of the PCB top layer 202, thereby ensuring the reliability of the PCB inner layer impedance test.

[0052] Optionally, the test hole of the PCB can be a blind hole or a through hole. When the test hole is a through hole, the insulator 12 also includes a third insulating member 123. The third insulating member 123 is arranged at an end of the first conductive rod 11 away from the first insulating member 121. When the first conductive rod 11 is inserted into the test hole, the third insulating member 123 is located between the first conductive rod 11 and the PCB bottom layer 203.

[0053] In this way, when the first conductive rod 11 is inserted into the test hole, the first conductive rod 11 is only connected to the impedance test line of the inner layer 201 of the PCB. The first conductive rod 11 is isolated from the top layer 202 and the bottom layer 203 of the PCB by the insulator 12 and is not conductive. This makes the test result of the PCB inner layer impedance fast measurement device 100 on the PCB inner layer impedance more reliable, which is conducive to ensuring the inner layer impedance of the product.

[0054] Second embodiment:

[0055] Figure 4 and Figure 5 FIG. 2 shows the structure of a PCB inner layer impedance fast measuring device 100 in a second embodiment. Figure 6The figure shows the structural matching relationship when the PCB inner layer impedance fast measuring device 100 in the second embodiment is inserted into the test hole of the PCB 200.

[0056] Please combine Figures 4 to 6 In some embodiments, the conductive body is a second conductive rod 21, and the second conductive rod 21 includes a first conductive portion 211 and a first insulating portion 212 along its own circumferential direction (see Figure 7 and Figure 8 ), the insulator 12 includes a first measuring ring 23, the first measuring ring 23 includes a second conductive portion 231 and a second insulating portion 232 arranged in sequence along the circumferential direction of the second conductive rod 21 (see Figure 9 ), the first measuring ring 23 is sleeved on the outer periphery of the second conductive rod 21 and is rotatable relative to the second conductive rod 21, so that the second conductive portion 231 and the first conductive portion 211 are arranged in alignment or staggered.

[0057] Thus, by allowing the first measurement ring 23 to rotate relative to the second conductive rod 21, the position of the second conductive portion 231 relative to the first conductive portion 211 can be adjusted. When the first measurement ring 23 or the second conductive rod 21 rotates so that the second conductive portion 231 and the first conductive portion 211 are interlaced, the second insulating portion 232 corresponds to the first conductive portion 211. At this point, the second conductive rod 21 is insulated from the first measurement ring 23. The second conductive rod 21 remains non-conductive with the top layer 202 and / or bottom layer 203 of the PCB, isolated by the first measurement ring 23. While the first conductive portion 211 is directly or indirectly conductive to the impedance test line of the inner layer 201 of the PCB, the impedance of the inner layer of the PCB can be measured. When the first measurement ring 23 or the second conductive rod 21 rotates so that the second conductive portion 231 aligns with the first conductive portion 211, the second conductive rod 21 is conductively connected to the first measurement ring 23, enabling the measurement of other PCB data to accommodate different test scenarios.

[0058] Optionally, as can be seen from the foregoing, the first measuring ring 23 is rotatable relative to the second conductive rod 21. Considering that when the test hole is set through the PCB 200 (i.e., the test hole is a through hole), the number of first measuring rings 23 is at least two and they are respectively located at both ends of the second conductive rod 21, so that the at least two first measuring rings 23 correspond to the top layer 202 and the bottom layer 203 of the PCB, respectively, so that the first conductive portion 211 is isolated from the top layer 202 and the bottom layer 203 of the PCB. Based on this, the PCB inner layer impedance rapid measurement device 100 also includes a second positioning portion 24. The second positioning portion 24 is connected to one end of the second conductive rod 21 and abuts against the first measuring ring 23. The second positioning portion 24 is non-conductive, and the outer diameter of the second positioning portion 24 is larger than the inner diameter of the first measuring ring 23 and smaller than the outer diameter of the first measuring ring 23.

[0059] By providing the second positioning portion 24, the position of the first measuring ring 23 along the thickness direction of the PCB 200 can be limited, so as to ensure that the second conductive rod 21 is inserted into the test hole while limiting the first measuring ring 23, thereby preventing the first measuring ring 23 from falling off the second conductive rod 21, thereby improving the reliability of the PCB inner layer impedance test.

[0060] It should be noted that the second positioning portion 24 is a disc-shaped structure. In other embodiments, the second positioning portion 24 may also be a rectangular or irregular structure, as long as the size of the second positioning portion 24 is larger than the inner diameter of the first measuring ring 23 and smaller than the outer diameter of the first measuring ring 23 to ensure that the second conductive rod 21 is positioned when it is inserted into the test hole of the PCB 200. Figure 6 、 Figures 8 to 10 In some embodiments, considering that different PCB models 200 have different thicknesses, and the top layer 202 and bottom layer 203 of different PCBs also have different thicknesses, if the first measurement ring 23 is fixed relative to the second conductive rod 21 along the thickness direction of the PCB 200, when the PCB inner layer impedance rapid measurement device 100 is applied to different PCBs, it is not possible to ensure that the first measurement ring 23 corresponds to the top layer 202 or bottom layer 203 of the PCB, thereby failing to ensure the reliability of the PCB inner layer impedance test. To address this issue, the PCB inner layer impedance rapid measurement device 100 further includes a plurality of second measurement rings 25. Each second measurement ring 25 includes a third conductive portion 251 and a third insulating portion 252 sequentially arranged along the circumference of the second conductive rod 21. The plurality of second measurement rings 25 are sequentially sleeved around the outer circumference of the second conductive rod 21 and located on the side of the first measurement ring 23 near the test hole. Each second measurement ring 25 is rotatable relative to the second conductive rod 21 so that the third conductive portion 251 is aligned or interlaced with the first conductive portion 211.

[0061] In this way, by arranging the second measuring ring 25 to be rotatable relative to the second conductive rod 21, the position of the third conductive portion 251 relative to the first conductive portion 211 can be adjusted, so that the position of the second measuring ring 25 can be adjusted as needed when corresponding to different layers of the PCB 200. This allows the PCB inner layer impedance rapid measurement device 100 to be applicable to different PCBs 200 and perform inner layer impedance tests on PCBs of different thicknesses, thereby expanding the scope of application of the PCB inner layer impedance rapid measurement device 100. Exemplarily, when the second conductive rod 21 is inserted into the test hole and the plurality of second measuring rings 25 are all located in the test hole, and the first measuring ring 23 corresponds to the top layer 202 or the bottom layer 203 of the PCB board, the first measuring ring 23 or the second conductive rod 21 is rotated to the second conductive portion 231 and arranged alternately with the first conductive portion 211, so that the first conductive portion 211 is isolated from the top layer 202 or the bottom layer 203 of the PCB through the second insulating portion 232. The second measuring ring 25 or the second conductive rod 21 is rotated to the third conductive portion 251 and arranged in alignment with the first conductive portion 211, so that the first conductive portion 211 can be electrically connected to the impedance test line of the inner layer 201 of the PCB through the third conductive portion 251, so that when the probe is electrically connected to the first conductive portion 211 of the second conductive rod 21, the impedance of the inner layer of the PCB can be measured. Please refer to Figure 6 When the second conductive rod 21 is inserted into the test hole and at least one second measuring ring 25 is located outside the test hole, and the first measuring ring 23 is located outside the test hole, the second measuring ring 25 or the second conductive rod 21 is rotated so that the third conductive portion 251 of the second measuring ring 25 located in the test hole and corresponding to the inner layer of the PCB is aligned with the first conductive portion 211. The third conductive portion 251 of the second measuring ring 25 located in the test hole and corresponding to the top layer 202 or the bottom layer 203 of the PCB is alternately arranged with the first conductive portion 211. This allows the first conductive portion 211 to be electrically connected to the impedance test line of the inner layer 201 of the PCB through the third conductive portion 251. The first conductive portion 211 is isolated from the top layer 202 or the bottom layer 203 of the PCB by the third insulating portion 252. As a result, an electrical signal can be transmitted sequentially through the probe, the first conductive portion 211, and the third conductive portion 251 to the impedance test line of the inner layer of the PCB to measure the impedance of the inner layer of the PCB.

[0062] It can be understood that in other embodiments, the second conductive rod 21 may also be provided with a mounting groove on the outer periphery, the first measuring ring 23 is installed in the mounting groove and is flush with the outer periphery of the second conductive rod 21, and the second conductive rod 21 is abutted against the test hole through the first conductive part 211 to conduct the impedance test line with the inner layer of the PCB through the first conductive part 211.

[0063] Optionally, considering that multiple second measurement rings 25 are stacked in sequence, when the third conductive portions 251 of two adjacent second measurement rings 25 are conductive, even if the third conductive portion 251 of one of the second measurement rings 25 intersects with the first conductive portion 211, the electrical signal can still be transmitted sequentially through the two second measurement rings 25. When one of the two adjacent second measurement rings 25 corresponds to an inner layer of the PCB and is conductive to an impedance test line on the inner layer of the PCB, and the other second measurement ring 25 corresponds to the top layer 202 or bottom layer 203 of the PCB, the conductive state of the two adjacent second measurement rings 25 may affect the test result of the impedance of the inner layer of the PCB. Based on this, the arc length of the third conductive portion 251 is smaller than the arc length of the third insulating portion 252.

[0064] In this way, when the third conductive portions 251 of two adjacent second measurement rings 25 are interlaced, the third conductive portion 251 of one second measurement ring 25 is connected to the third insulating portion 252 of another second measurement ring 25, thereby making the third conductive portions 251 of the two adjacent second measurement rings 25 non-conductive. This ensures that the two adjacent second measurement rings 25 are insulated from each other, thereby facilitating reliability of PCB inner layer impedance testing.

[0065] Optionally, the arc length of one end of the third conductive part 251 close to the center of the second measuring ring 25 is greater than the arc length of the first conductive part 211, thereby increasing the contact area between the third conductive part 251 and the first conductive part 211, which is conducive to the conduction between the third conductive part 251 and the first conductive part 211, thereby facilitating the conduction between the second conductive rod 21 and the impedance test line of the inner layer 201 of the PCB.

[0066] Optionally, the arc length of the second conductive portion 231 is smaller than the arc length of the second insulating portion 232. The arc lengths of the second conductive portion 231 and the third conductive portion 251 are the same or substantially the same, and the arc lengths of the second insulating portion 232 and the third insulating portion 252 are the same or substantially the same. This ensures that the first measurement loop 23 and the second measurement loop 25 remain insulated when interleaved, thereby improving the reliability of PCB inner layer impedance testing.

[0067] Optionally, the inner diameters of the first measuring ring 23 and the second measuring ring 25 are equal to or slightly larger than the outer diameter of the second conductive rod 21, so that the first measuring ring 23 and the second measuring ring 25 can rotate relative to the second conductive rod 21, and the second conductive part 231 and the third conductive part 251 can contact the first conductive part 211 to conduct electrical signals.

[0068] Optionally, there are multiple first conductive portions 211 and multiple first insulating portions 212, each of which is spaced apart, with each first conductive portion 211 disposed between two adjacent first insulating portions 212. Furthermore, the multiple first conductive portions 211 are interconnected and conductively connected near the axis of the second conductive rod 21. This facilitates conductive communication between the first conductive portion 211 and the second conductive portion 231 and the third conductive portion 251, facilitating the transmission of electrical signals and facilitating impedance testing of PCB inner layers.

[0069] Optionally, each first measurement ring 23 may include multiple second conductive portions 231 and multiple second insulating portions 232, and each second conductive portion 231 and each second insulating portion 232 may be alternately arranged along the circumference of the second conductive rod 21. Each second measurement ring 25 may include multiple third conductive portions 251 and multiple third insulating portions 252, and each third conductive portion 251 and each third insulating portion 252 may be alternately arranged along the circumference of the second conductive rod 21. This allows the rotation angle of the first measurement ring 23, the second measurement ring 25, or the second conductive rod 21 to be reduced when adjusting the conductivity between the first conductive portion 211 and the second conductive portion 231 or the third conductive portion 251, thereby facilitating and improving the efficiency of PCB inner layer impedance testing, thereby further reducing the time required for inner layer impedance testing of the first batch of PCBs.

[0070] Please refer again Figure 4 and Figure 6 In some embodiments, given that the test hole is typically small, the top of the first conductive portion 211 is even smaller, resulting in a probe being unable to accurately electrically connect with the first conductive portion 211 when connected to the PCB inner layer impedance rapid measurement device 100, which can easily affect the PCB internal impedance test. Therefore, a conductive head 22 is provided at the end of the second conductive rod 21 away from the second positioning portion 24. The conductive head 22 is electrically connected to the first conductive portion 211, and the diameter of the conductive head 22 is larger than the diameter of the second conductive rod 21. This increases the area of ​​electrical connection between the second conductive rod 21 and the probe, facilitating electrical connection between the probe and the second conductive rod 21, thereby facilitating testing of the PCB inner layer impedance.

[0071] Optionally, the PCB inner layer impedance rapid measurement device 100 also includes a pressure plate 26 and an elastic member 27. Both the pressure plate 26 and the elastic member 27 are non-conductive. The pressure plate 26 is sleeved on the outer periphery of the second conductive rod 21 and is located between the conductive head 22 and the first measuring ring 23. The two ends of the elastic member 27 are respectively connected to the pressure plate 26 and the conductive head 22. The elastic member 27 is used to apply an elastic force to the pressure plate 26 directed to the first measuring ring 23, so that the first measuring ring 23 and the multiple second measuring rings 25 abut against each other.

[0072] This facilitates keeping two adjacent conductive portions in close contact along the height direction of the PCB, so that the third conductive portions 251 of two adjacent second measurement rings 25 are in close contact, and the third conductive portions 251 of adjacent second measurement rings 25 are in close contact with the second conductive portion 231 of the first measurement ring 23. This facilitates the transmission of electrical signals and improves the conductivity of the PCB inner layer impedance rapid measurement device 100. Furthermore, it facilitates providing rotational friction for the first and second measurement rings 23, 25 to limit the rotation of the first and second measurement rings 23, 25, and prevent the first and second measurement rings 23, 25 from loosening and rotating relative to the second conductive rod 21, which would cause the positions of the second conductive portions 231 and the third conductive portions 251 to change, thereby affecting the transmission of electrical signals and, consequently, affecting the PCB inner layer impedance test.

[0073] Optionally, the outer diameter of the pressure plate 26 is larger than the diameter of the test hole, so that the second conductive rod 21 can be limited to facilitate maintaining the position of the PCB inner layer impedance rapid measurement device 100 relative to the test hole, and the PCB inner layer impedance rapid measurement device 100 can be held and carried to facilitate the installation of the second conductive rod 21 in the test hole or leaving the test hole.

[0074] Optionally, the elastic member 27 is sleeved on the outer periphery of the second conductive rod 21. This can improve the structural reliability of the PCB inner layer impedance fast measuring device 100.

[0075] Optionally, the first insulating portion 212, the second insulating portion 232, the third insulating portion 252, the second positioning portion 24, and the pressure plate 26 can all be made of insulating materials, or alternatively, an insulating layer can be applied to the surface of a conductive material. An insulating layer is provided around the outer periphery of the elastic member 27. This ensures that the first insulating portion 212, the second insulating portion 232, the third insulating portion 252, the second positioning portion 24, the pressure plate 26, and the elastic member 27 have insulating properties.

[0076] The embodiments of the present application have been described in detail above with reference to the accompanying drawings. However, the present application is not limited to the above embodiments. Various modifications can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the present application. In addition, the embodiments of the present application and the features of the embodiments can be combined with each other unless there is a conflict.

Claims

1. A PCB inner layer impedance fast measurement device, characterized in that: include: A conductive body, the conductive body being configured to be movably inserted into a test hole of a PCB so as to electrically connect the conductive body to an impedance test line of an inner layer of the PCB exposed through an inner wall of the test hole; an insulator, wherein the insulator is connected to the conductive body, and when the conductive body is inserted into the test hole, the insulator is located between the conductive body and the top layer of the PCB, and / or the insulator is located between the conductive body and the bottom layer of the PCB.

2. The PCB inner layer impedance fast measurement device according to claim 1, characterized in that: The conductive body is a first conductive rod, and the insulator is arranged on the outer periphery of the first conductive rod and is flush with the outer peripheral surface of the first conductive rod. When the first conductive rod is inserted into the test hole, the first conductive rod abuts against the inner wall of the test hole, and the insulator abuts against the top layer of the PCB and / or the bottom layer of the PCB.

3. The PCB inner layer impedance fast measurement device according to claim 2, characterized in that: A first positioning portion is provided at the top of the first conductive rod, the first positioning portion is electrically connected to the first conductive rod, and the first positioning portion protrudes from the outer circumferential surface of the first conductive rod along the radial direction of the first conductive rod. The insulator includes a first insulating member and a second insulating member connected to each other, the first insulating member is arranged at one end of the first conductive rod close to the first positioning portion, and the second insulating member is arranged on a side of the first positioning portion close to the first conductive rod.

4. The PCB inner layer impedance fast measurement device according to claim 1, characterized in that: The conductive body is a second conductive rod, which includes a first conductive portion and a first insulating portion along its own circumferential direction. The insulator includes a first measuring ring, which includes a second conductive portion and a second insulating portion arranged in sequence along the circumferential direction of the second conductive rod. The first measuring ring is sleeved on the outer circumference of the second conductive rod and is rotatable relative to the second conductive rod so that the second conductive portion is aligned with or interlaced with the first conductive portion.

5. The PCB inner layer impedance fast measurement device according to claim 4, characterized in that: The PCB inner layer impedance rapid measurement device also includes multiple second measurement rings, each of which includes a third conductive portion and a third insulating portion arranged in sequence along the circumferential direction of the second conductive rod. The multiple second measurement rings are sequentially sleeved on the outer circumference of the second conductive rod and located on the side of the first measurement ring close to the test hole. Each second measurement ring is rotatable relative to the second conductive rod so that the third conductive portion is aligned with or interlaced with the first conductive portion.

6. The PCB inner layer impedance fast measurement device according to claim 5, characterized in that: The PCB inner layer impedance rapid measurement device also includes a second positioning portion, which is connected to one end of the second conductive rod and abuts against the first measuring ring. The second positioning portion is non-conductive, and the outer diameter of the second positioning portion is larger than the inner diameter of the first measuring ring and smaller than the outer diameter of the first measuring ring.

7. The PCB inner layer impedance fast measurement device according to claim 6, characterized in that: A conductive head is provided at one end of the second conductive rod away from the second positioning portion. The conductive head is electrically connected to the first conductive portion, and a diameter of the conductive head is greater than a diameter of the second conductive rod.

8. The PCB inner layer impedance fast measurement device according to claim 7, characterized in that: The PCB inner layer impedance rapid measurement device also includes a pressure plate and an elastic member, both of which are non-conductive. The pressure plate is sleeved on the outer circumference of the second conductive rod and is located between the conductive head and the first measuring ring. The two ends of the elastic member are respectively connected to the pressure plate and the conductive head. The elastic member is used to apply an elastic force to the pressure plate directed towards the first measuring ring so that the first measuring ring and multiple second measuring rings abut against each other.

9. The PCB inner layer impedance fast measurement device according to claim 4, characterized in that: There are multiple first conductive parts and multiple first insulating parts, and the multiple first insulating parts are arranged at intervals. Each first conductive part is arranged between two adjacent first insulating parts, and the multiple first conductive parts are interconnected and conductive at the axis of the second conductive rod. There are multiple second conductive parts and multiple second insulating parts, and the second insulating parts and the second conductive parts are alternately arranged along the circumferential direction of the second conductive rod.

10. The PCB inner layer impedance fast measurement device according to claim 5, characterized in that: An arc length of the third conductive portion is smaller than an arc length of the third insulating portion.

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