A press-pack IGBT sub-module test adapter and test equipment

Abstract

The application provides a press-pack IGBT sub-module test adapter and a test device. The press-pack IGBT sub-module test adapter comprises a lower clamp. The lower clamp comprises: a conductive base plate, the conductive base plate having an array of positioning holes, the array of positioning holes comprising a plurality of separate positioning holes; a positioning assembly, the positioning assembly comprising a conductive adapter, the conductive adapter being adapted to be placed on the array of positioning holes, the conductive adapter being provided with a first recess, the first recess being adapted to place a to-be-tested sub-module; and a first fastener, the first fastener being adapted to penetrate the conductive adapter on the side of the first recess and extend in at least part of the positioning holes. When the structure of the to-be-tested sub-module changes, the structure of the whole adapter does not need to be redesigned, the universality of the adapter is improved, and thus the test cost is reduced and the test time is shortened.

Description

Technical Field

[0001] This invention relates to the field of power electronics technology, specifically to a crimp-type IGBT sub-module test adapter and test equipment. Background Technology

[0002] Insulated-gate bipolar transistors (IGBTs), as a typical representative of power electronic devices, have wide applications in modern power electronics. They combine the advantages of metal-oxide-semiconductor field-effect transistors (MOSFETs)—high input impedance, low control power, simple drive circuits, high switching speed, and low switching losses—with the advantages of bipolar junction transistors (BJTs)—high current density, low saturation voltage drop, and strong current handling capability. Therefore, they are ideal switching devices in the field of power electronics and are currently widely used in motor frequency converters, wind power converters, photovoltaic inverters, high-frequency welding machine inverters, and other fields.

[0003] With the continuous increase in capacitance, increasingly higher demands are being placed on the performance and reliability of insulated-gate bipolar transistors (IGBTs). Electrical characteristic testing of IGBTs can detect their performance and reliability. Existing electrical characteristic testing equipment typically employs an adapter and a pressure application device. By placing the module under test (DUT) in the adapter and using the pressure application device to achieve an electrical connection between the DUT and the adapter, leads are then used to electrically connect the adapter to other components of the electrical characteristic testing equipment for testing. In other words, the adapter is used to fix the DUT and achieve the electrical connection between the DUT and the testing equipment, avoiding direct connection between the DUT and other components of the testing equipment. This reduces the complexity and length of the leads, and consequently, reduces parasitic inductance.

[0004] However, the adapter's structure needs to be adapted to the structure of the sub-module under test, which results in the adapter lacking a certain degree of universality. When the structure of the sub-module under test changes, the adapter needs to be redesigned, thereby increasing the testing cost and testing time. Summary of the Invention

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defect that the existing crimped IGBT sub-module test adapter does not have a certain degree of universality, thereby providing a crimped IGBT sub-module test adapter and test equipment.

[0006] This invention provides a press-fit IGBT sub-module test adapter, including a lower clamp; the lower clamp includes: a conductive substrate having an array of positioning holes, the array of positioning holes including a plurality of discrete positioning holes; a positioning component including a conductive adapter adapted to be placed on the array of positioning holes, the conductive adapter having a first groove adapted to place the sub-module under test; and a first fastener adapted to penetrate the conductive adapter through the side of the first groove and extend into at least a portion of the positioning holes.

[0007] Optionally, the press-fit IGBT sub-module test adapter further includes: a test companion component, which is adapted to be located on the conductive substrate and on the side of the positioning component, and the test companion component is adapted to accommodate the test companion sub-module.

[0008] Optionally, the press-fit IGBT sub-module test adapter further includes: an upper clamp, which is adapted to be disposed opposite to the lower clamp, the upper clamp including a negative electrode substrate, a positive electrode substrate and an inductor connection substrate stacked and spaced apart, the conductive substrate being adapted to be electrically connected to the inductor connection substrate.

[0009] Optionally, the conductive substrate includes a drive lead-out area located on the side of the positioning hole array; a drive lead-out structure is provided on the drive lead-out area, and the drive lead-out structure is separated from the conductive substrate; when the test sub-module is an IGBT sub-module and the test sub-module is a diode, the gate of the IGBT sub-module is in contact with the drive lead-out structure, the emitter of the IGBT sub-module is in contact with the conductive substrate, the collector of the IGBT sub-module is adapted to be electrically connected to the positive substrate, the cathode of the diode is in contact with the conductive substrate, and the anode of the diode is adapted to be electrically connected to the negative substrate.

[0010] Optionally, when the test sub-module is a diode and the test sub-module is an IGBT sub-module, the anode of the diode is in contact with the conductive substrate, the cathode of the diode is adapted to be electrically connected to the positive substrate, the emitter of the IGBT sub-module is adapted to be electrically connected to the negative substrate, and the collector of the IGBT sub-module is adapted to be electrically connected to the conductive substrate.

[0011] Optionally, the drive lead-out area is provided with a second groove; the drive lead-out structure is located in the second groove; the second groove further includes an insulating layer located between the drive lead-out structure and the conductive substrate.

[0012] Optionally, the drive lead-out structure is a conductive layer; or, the drive lead-out structure is a spring disc, wherein a portion of the spring disc is embedded in the insulating layer and a portion of the spring disc protrudes from the insulating layer.

[0013] Optionally, the press-fit IGBT sub-module test adapter further includes: a first electrical connector, adapted to be located between the upper clamp and the lower clamp, the first electrical connector being adapted to electrically connect the sub-module under test and the positive electrode substrate; a second electrical connector, adapted to be located between the upper clamp and the lower clamp, the two ends of the second electrical connector being adapted to contact the conductive substrate and the inductive connection substrate respectively; and a probe assembly, adapted to be located between the negative electrode substrate and the sub-module under test, the probe assembly being adapted to electrically connect the sub-module under test and the negative electrode substrate.

[0014] Optionally, when the test sub-module is an IGBT sub-module and the test sub-module is a diode, the two ends of the first electrical connector are adapted to contact the collector of the IGBT sub-module and the positive electrode substrate, respectively; the probe assembly includes an anode probe, one end of which is fixed on the negative electrode substrate, and the anode probe is adapted to electrically connect the negative electrode substrate and the anode of the diode.

[0015] Optionally, when the test sub-module is a diode and the sub-module under test is an IGBT sub-module, the two ends of the first electrical connector are adapted to contact the cathode of the diode and the positive substrate, respectively. The probe assembly includes an emitter probe, a gate probe and an insulating connection portion. One end of the emitter probe is fixed on the negative substrate and is adapted to electrically connect the negative substrate and the emitter of the IGBT sub-module. The insulating connection portion is located between one end of the gate probe and the negative substrate, and the other end of the gate probe away from the insulating connection portion is adapted to contact the gate of the IGBT sub-module.

[0016] Optionally, the press-fit IGBT sub-module test adapter further includes: a height-adjustable support component located on the conductive substrate, wherein one end of the support component facing away from the conductive substrate is adapted to contact the upper clamp.

[0017] Optionally, the support assembly includes a support portion and an adjustment portion connected to the support portion, the adjustment portion being adapted to connect to the conductive substrate and adjust the spacing between the support portion and the conductive substrate.

[0018] Optionally, the adjusting part is a stud; the conductive substrate is provided with internal threads, and the adjusting part is adapted to be screwed into the internal threads.

[0019] Optionally, the accompanying testing component includes: an upper insulating plate and a lower insulating plate arranged at relative intervals, and a second fastener for connecting the upper insulating plate and the lower insulating plate; the upper insulating plate is provided with a first through hole, and the first electrical connector is adapted to pass through the first through hole; the lower insulating plate is adapted to be fixed on the conductive substrate, and the lower insulating plate has a receiving cavity penetrating the lower insulating plate, and the accompanying testing sub-module is adapted to be embedded in the receiving cavity.

[0020] Optionally, the negative electrode substrate, positive electrode substrate, and inductor connection substrate are stacked sequentially, with a first insulating plate between the positive electrode substrate and the negative electrode substrate, and a second insulating plate between the inductor connection substrate and the positive electrode substrate; the upper clamp is provided with a second through hole penetrating the inductor connection substrate and the second insulating plate, and a third through hole penetrating the inductor connection substrate, the second insulating plate, the positive electrode substrate, and the first insulating plate sequentially, the second through hole being adapted to be located directly above the test component, one end of the first electrical connector being adapted to be located in the second through hole, the other end of the first electrical connector being adapted to be located in the first through hole, the third through hole being adapted to be located directly above the positioning component, and the probe component extending along the third through hole.

[0021] Optionally, one end of the first electrical connector located in the second through hole is fixedly connected to the positive electrode substrate, and the other end of the first electrical connector facing away from the positive electrode substrate is adapted to be detachably disposed from the auxiliary testing component; or, one end of the first electrical connector is detachably disposed from the positive electrode substrate, and the other end of the first electrical connector is adapted to be fixedly connected to the upper insulating plate.

[0022] The second electrical connector is fixedly connected to the conductive substrate, and the other end of the second electrical connector facing away from the conductive substrate is adapted to be detachably disposed from the inductive connection substrate; or, the second electrical connector is fixedly connected to the inductive connection substrate, and the other end of the second electrical connector facing away from the inductive connection substrate is adapted to be detachably disposed from the conductive substrate.

[0023] Optionally, both the first electrical connector and the second electrical connector are elastic elements; both the first electrical connector and the second electrical connector include a spring probe.

[0024] The present invention also provides a test device for a crimped IGBT sub-module, including the crimped IGBT sub-module test adapter.

[0025] Optionally, the press-fit IGBT sub-module test adapter further includes: an upper clamp, adapted to be disposed opposite to the lower clamp, the upper clamp including a negative electrode substrate, a positive electrode substrate, and an inductor connection substrate stacked and spaced apart; a test companion component, adapted to be located on the conductive substrate and on the side of the positioning component, the test companion component being adapted to accommodate the test companion sub-module; when one of the test companion sub-module and the sub-module under test is an IGBT sub-module, the other is a diode; the press-fit IGBT sub-module test equipment further includes: an inductor coil, one end of the inductor coil being electrically connected to the inductor connection substrate; a power supply, the positive terminal of the power supply being electrically connected to the other end of the inductor coil and the positive electrode substrate, and the negative terminal of the power supply being electrically connected to the negative electrode substrate; and a driving unit, the driving unit being electrically connected to the gate of the IGBT sub-module and the negative electrode substrate.

[0026] The technical solution of this invention has the following advantages:

[0027] 1. The present invention provides a press-fit type IGBT sub-module test adapter, comprising a lower clamp, the lower clamp including a conductive substrate, a positioning component, and a first fastener. The positioning component includes a conductive adapter, the conductive adapter having a first groove adapted to hold the sub-module under test. When the structure of the sub-module under test changes, the conductive adapter is replaced to adapt the size of the first groove in the conductive adapter to the sub-module under test. The first fastener passes through the conductive adapter on the side of the first groove and extends to at least some positioning holes in the conductive substrate to connect the conductive adapter and the conductive substrate. The selection of the positioning holes is adapted to the structure of the conductive adapter, and the array of positioning holes can meet the fixing requirements of different conductive adapters. Therefore, when the structure of the sub-module under test changes, there is no need to redesign the entire adapter structure, improving the adapter's versatility, thereby reducing testing costs and shortening testing time. Simultaneously, the first fastener connecting the conductive adapter and the conductive substrate facilitates the assembly and disassembly of the conductive adapter and the conductive substrate, and the assembly and disassembly process does not damage the conductive substrate, ensuring the reusability of the conductive substrate.

[0028] 2. The pressure-fit IGBT sub-module test adapter provided by the present invention further includes a test companion component. The test companion component is adapted to be located on the conductive substrate and on the side of the positioning component. The test companion component is adapted to accommodate the test companion sub-module. That is, the test companion sub-module can be set inside the adapter. Therefore, the electrical connection between the test companion sub-module and the adapter can be achieved without using long leads, reducing the effective length of the power circuit, thereby reducing the power parasitic inductance, reducing overvoltage and oscillation phenomena during switching, and improving the accuracy of test results.

[0029] 3. The pressure-fit IGBT sub-module test adapter provided by this invention includes a positioning component, a test component, a sub-module under test, a test sub-module, and a support component between the upper clamp and the conductive substrate during testing. The support component supports the upper clamp, thereby ensuring more uniform pressure on the sub-module under test and reducing the probability of sub-module failure during testing. Furthermore, the height of the support component can be adjusted according to the height of the sub-module under test, providing significant flexibility.

[0030] 4. The press-fit type IGBT sub-module test adapter provided by the present invention includes an upper insulating plate and a lower insulating plate arranged at relative intervals, and a second fastener for connecting the upper insulating plate and the lower insulating plate. The lower insulating plate is adapted to be fixed on the conductive substrate, and has a receiving cavity penetrating the lower insulating plate. The sub-module is adapted to be embedded in the receiving cavity, which avoids horizontal displacement of the sub-module and improves the stability of the sub-module on the conductive substrate, thereby maintaining a stable electrical connection between the sub-module and the conductive substrate, which is beneficial to ensuring the smooth progress of electrical characteristic testing. The second fastener restricts the sub-module to a certain position. The upper and lower insulating plates are used to press the test sub-module together for electrical characteristic testing. Because the structure of the test component remains constant during testing, the test sub-module is always under pressure, avoiding repeated pressure application and depressurization during electrical characteristic testing and improving its lifespan. Simultaneously, the force on the test sub-module can be controlled by adjusting the distance between the upper and lower insulating plates using a second fastener, providing significant flexibility. Furthermore, the simple structure of the test component allows for timely replacement of the test sub-module in case of failure during testing, improving testing efficiency.

[0031] 5. The press-fit IGBT sub-module testing equipment provided by this invention eliminates the need to redesign the entire adapter structure when the structure of the sub-module under test changes, improving the adapter's versatility, thereby reducing testing costs and shortening testing time. Simultaneously, the first fastener connects the conductive adapter to the conductive substrate, facilitating assembly and disassembly of the conductive adapter and conductive substrate without damaging the conductive substrate during assembly and disassembly, ensuring the reusability of the conductive substrate. Attached Figure Description

[0032] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0033] Figure 1 This is a front view of the crimped IGBT sub-module test adapter provided in an embodiment of the present invention;

[0034] Figure 2 for Figure 1 The front view of the lower clamp is shown;

[0035] Figure 3 for Figure 1 Top view of the lower clamp shown;

[0036] Figure 4 for Figure 1 The diagram shows the structure of the lower clamp.

[0037] Figure 5 for Figure 1 The diagram shows the structural schematic of the support component.

[0038] Figure 6 for Figure 1 The diagram shows the structure of the conductive substrate.

[0039] Figure 7 for Figure 1 The right view of the upper clamp shown;

[0040] Figure 8 for Figure 1 The top view of the upper clamp shown;

[0041] Figure 9 for Figure 1 The diagram shows the structure of the second electrical connector.

[0042] Figure 10 for Figure 1 The diagram shows the structure of the test component.

[0043] Figure 11 for Figure 1 The main view of the test component shown;

[0044] Figure 12 A test circuit diagram of a crimped IGBT sub-module test device provided in an embodiment of the present invention;

[0045] Figure 13 for Figure 12The diagram shows the electrical connection of the crimped IGBT sub-module test equipment.

[0046] Figure 14 Another test circuit diagram of the crimped IGBT sub-module test equipment provided in this embodiment of the invention;

[0047] Figure 15 for Figure 14 The diagram shows the electrical connection of the crimped IGBT sub-module test equipment.

[0048] Explanation of reference numerals in the attached figures:

[0049] 11-Negative electrode substrate; 12-First insulating plate; 13-Positive electrode substrate; 14-Second insulating plate; 15-Inductor connection substrate; 16-Second through hole; 17-Third through hole; 18-Probe assembly; 181-Emitter probe; 182-Gate probe; 183-Insulating connection portion; 19-Insulating pin; 21-Conductive substrate; 211-Positioning hole; 212-Second groove; 22-Support assembly; 221-Support portion; 222-Adjustment Section; 23-Testing component; 231-Upper insulating plate; 232-First through hole; 233-Lower insulating plate; 234-Receiving cavity; 235-Second fastener; 24-Positioning component; 241-Conductive adapter; 242-First fastener; 3-First electrical connector; 4-Second electrical connector; 41-Needle; 42-Needle tube; 43-Spring; 44-Fixing nut; 5-First limiting component; 6-Second limiting component; 7-Drive unit. Detailed Implementation

[0050] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0052] See Figure 1 This embodiment provides a crimp-type IGBT sub-module test adapter, including a lower clamp; see also Figures 2-4The lower clamp includes: a conductive substrate 21, see [link / reference]. Figure 6 The conductive substrate 21 has a positioning hole array, which includes a plurality of discrete positioning holes 211; a positioning component 24, which includes a conductive adapter 241 adapted to be placed on the positioning hole array, the conductive adapter 241 having a first groove adapted to place a sub-module under test; and a first fastener 242 adapted to penetrate the conductive adapter 241 on the side of the first groove and extend into at least a portion of the positioning holes 211.

[0053] The aforementioned press-fit IGBT sub-module test adapter is suitable for testing the electrical characteristics of the sub-module under test. When the structure of the sub-module under test changes, the conductive adapter 241 is replaced so that the size of the first groove in the conductive adapter 241 is adapted to the sub-module under test. A first fastener 242 passes through the conductive adapter 241 on the side of the first groove and extends to at least some of the positioning holes 211 in the conductive substrate 21 to connect the conductive adapter 241 to the conductive substrate 21. The selection of the positioning holes 211 is adapted to the structure of the conductive adapter 241, and the array of positioning holes can accommodate the fixing of different conductive adapters 241. Therefore, when the structure of the sub-module under test changes, there is no need to redesign the entire adapter structure, improving the adapter's versatility, thereby reducing testing costs and shortening testing time. Meanwhile, the conductive adapter 241 and the conductive substrate 21 are connected by the first fastener 242, which facilitates the assembly and disassembly of the conductive adapter 241 and the conductive substrate 21, and will not damage the conductive substrate 21 during the assembly and disassembly process, thus ensuring the reusability of the conductive substrate 21.

[0054] Specifically, the first fastener 242 can be a bolt, the conductive substrate 21 can be a copper busbar, and the material of the conductive substrate 21 can be a high-conductivity conductor such as copper.

[0055] In this embodiment, the conductive substrate 21 includes a drive lead-out area located on the side of the positioning hole array; a drive lead-out structure is provided on the drive lead-out area, the drive lead-out structure being separated from the conductive substrate 21, and the drive lead-out structure being adapted to connect to the drive unit 7 in the press-fit IGBT sub-module testing equipment. Further, the drive lead-out area is provided with a second groove 212; the drive lead-out structure is located in the second groove 212; the second groove 212 also includes an insulating layer located between the drive lead-out structure and the conductive substrate 21 to prevent electrical conduction between the drive lead-out structure and the conductive substrate 21.

[0056] In one embodiment, the drive lead-out structure is a conductive layer; further, the surface of the conductive layer facing away from the insulating layer is flush with the conductive substrate 21 on the side of the second groove 212, and the coverage area of ​​the insulating layer and the conductive layer is larger than the size of the second groove 212. The conductive layer located outside the second groove 212 is used to connect the lead wire. In other embodiments, the drive lead-out structure is a spring disc, a portion of which is embedded in the insulating layer, and a portion of which protrudes from the insulating layer. The insulating structure includes, but is not limited to, a gasket; further, the spring disc is provided with a conductive lead-out structure for connecting the lead wire. It should be understood that the conductive substrate 21 includes, but is not limited to, the above-described structures.

[0057] Based on the testing principles of electrical testing, electrical characteristic testing equipment requires the inclusion of a test module, which is electrically connected to the adapter. However, since the test module is independently located outside the adapter, the electrical connection between the test module and the adapter requires a relatively long lead, which generates a large parasitic inductance in the power loop, affecting the accuracy of the test results.

[0058] In this embodiment, see Figures 1-4 The press-fit IGBT sub-module test adapter further includes a test companion component 23, which is adapted to be located on the conductive substrate 21 and on the side of the positioning component 24. The test companion component 23 is adapted to accommodate the test companion sub-module. Therefore, electrical connection between the test companion sub-module and the adapter can be achieved without using long leads, reducing the effective length of the power circuit, thereby reducing power parasitic inductance, decreasing overvoltage and oscillation phenomena during switching, and improving the accuracy of test results. Based on the principle of electrical characteristic testing, the conductive substrate 21 is electrically connected to the inductor connection substrate 15.

[0059] In this embodiment, see Figures 2-4 The crimped IGBT sub-module test adapter further includes: an upper clamp, which is adapted to be disposed opposite to the lower clamp, see [reference]. Figure 7 The upper clamp includes a negative electrode substrate 11, a positive electrode substrate 13, and an inductor connection substrate 15 stacked and spaced apart. The conductive substrate 21 is adapted to be electrically connected to the inductor connection substrate 15. Specifically, the negative electrode substrate 11, the positive electrode substrate 13, and the inductor connection substrate 15 can be made of copper busbars; furthermore, the negative electrode substrate 11, the positive electrode substrate 13, and the inductor connection substrate 15 are made of a good conductor with high conductivity, such as copper. Since copper not only has good conductivity and high hardness but also high temperature resistance, when the conductive substrate 21, the negative electrode substrate 11, the positive electrode substrate 13, and the inductor connection substrate 15 are all made of copper, the adapter has good high temperature resistance and is suitable for high temperature testing of IGBT sub-modules.

[0060] Furthermore, in this embodiment, when the accompanying sub-module is an IGBT sub-module, the sub-module under test is a diode; when the accompanying sub-module is a diode, the sub-module under test is an IGBT sub-module. That is, the press-fit IGBT sub-module test adapter is suitable for testing the electrical characteristics of different types of sub-modules under test.

[0061] Specifically, when the test sub-module is an IGBT sub-module and the sub-module under test is a diode, the gate of the IGBT sub-module is in contact with the drive lead-out structure, the emitter of the IGBT sub-module is in contact with the conductive substrate 21, the collector of the IGBT sub-module is adapted to be electrically connected to the positive substrate 13, the cathode of the diode is in contact with the conductive substrate 21, and the anode of the diode is adapted to be electrically connected to the negative substrate 11; when the test sub-module is a diode and the sub-module under test is an IGBT sub-module, the anode of the diode is in contact with the conductive substrate 21, the cathode of the diode is adapted to be electrically connected to the positive substrate 13, the emitter of the IGBT sub-module is adapted to be electrically connected to the negative substrate 11, and the collector of the IGBT sub-module is adapted to be electrically connected to the conductive substrate 21.

[0062] In this embodiment, see Figure 1 The press-fit IGBT sub-module test adapter further includes: a first electrical connector 3, adapted to be located between the upper and lower clamps, and adapted to electrically connect the test sub-module and the positive electrode substrate 13; a second electrical connector 4, adapted to be located between the upper and lower clamps, with both ends adapted to contact the conductive substrate 21 and the inductive connection substrate 15 respectively, to achieve electrical connection between the conductive substrate 21 and the inductive connection substrate 15; see also Figure 8 The probe assembly 18 is adapted to be located between the negative electrode substrate 11 and the sub-module under test. The probe assembly 18 is adapted to electrically connect the sub-module under test and the negative electrode substrate 11. The probe assembly 18 can be selected according to the structure of the sub-module under test.

[0063] In one embodiment, when the test sub-module is an IGBT sub-module and the test sub-module is a diode, the two ends of the first electrical connector 3 are adapted to contact the collector of the IGBT sub-module and the positive substrate 13 respectively, so as to realize the electrical connection between the collector of the IGBT sub-module and the positive substrate 13; the probe assembly 18 includes an anode probe, one end of which is fixed on the negative substrate 11, and the anode probe is adapted to electrically connect the negative substrate 11 and the anode of the diode.

[0064] In other embodiments, when the test sub-module is a diode and the test sub-module is an IGBT sub-module, the two ends of the first electrical connector 3 are adapted to contact the cathode of the diode and the positive substrate 13 respectively, so as to realize the electrical connection between the cathode of the diode and the positive substrate 13; see also Figure 8 The probe assembly 18 includes an emitter probe 181, a gate probe 182, and an insulating connection portion 183. One end of the emitter probe 181 is fixed to the negative electrode substrate 11, and the emitter probe 181 is adapted to electrically connect the negative electrode substrate 11 and the emitter of the IGBT sub-module. The insulating connection portion 183 is located between one end of the gate probe 182 and the negative electrode substrate 11, and the other end of the gate probe 182 away from the insulating connection portion 183 is adapted to contact the gate of the IGBT sub-module. The insulating connection portion 183 is used to isolate the gate probe 182 and the negative electrode substrate 11 to prevent the gate probe 182 and the emitter test probe from being electrically connected to the negative electrode substrate 11 at the same time.

[0065] Specifically, the insulating connection portion 183 is embedded in the negative electrode substrate 11. One end of the gate probe 182 is embedded in the insulating connection portion 183 to a certain depth, and the other end of the gate probe 182 contacts the gate of the IGBT sub-module. The emitter probe 181 is soldered to the negative electrode substrate 11 and does not contact the positive electrode substrate 13 or the inductor connection substrate 15. Its other end is adapted to contact the emitter of the IGBT sub-module. When the insulating connection portion 183 protrudes from the surface of the negative electrode substrate 11, the length of the compressed gate probe 182 is less than that of the compressed emitter probe 181. The height of the support assembly 22 is adjusted according to the heights of the compressed emitter probe 181 and gate probe 182 to ensure uniform pressure in the IGBT sub-module and to ensure the electrical connection effect between the emitter probe 181 and gate probe 182. To further ensure uniform pressure in the IGBT sub-module, the shape and size of the emitter probe 181 are the same as those of the emitter of the IGBT sub-module, and the shape and size of the gate probe 182 are the same as those of the gate of the IGBT sub-module. Furthermore, one end of the gate probe 182 can be fixed inside the insulating connection portion 183 by bolts.

[0066] It should be understood that the relative positions and number of the emitter probe 181 and the gate probe 182 are adapted to the relative positions and number of the emitter and gate of the IGBT sub-module, and the lengths of the emitter probe 181 and the gate probe 182 are adapted to ensure that when the emitter probe 181 contacts the emitter of the IGBT sub-module, the gate probe 182 contacts the gate of the IGBT sub-module.

[0067] Furthermore, both the first electrical connector 3 and the second electrical connector 4 are elastic elements; both the first electrical connector 3 and the second electrical connector 4 include a spring probe. See details below. Figure 9 The second electrical connector 4 may include a needle 41, a needle tube 42, a spring 43, and a fixing nut 44. The needle 41 contacts the spring 43, and the central axis of the needle 41 coincides with the central axis of the spring 43. The needle tube 42 is sleeved outside the needle 41 and the spring 43. One side surface of the fixing nut 44 contacts the end of the needle tube 42 and the spring 43 opposite to the needle 41. When the needle 41 compresses the spring 43, the fixing nut 44 ensures that the spring probe does not tilt. Furthermore, the needle 41 and the needle tube 42 may be made of oxygen-free copper and plated with gold to reduce contact resistance; the spring 43 may be made of beryllium copper wire.

[0068] It should be understood that the compressed lengths of the first electrical connector 3 and the second electrical connector 4 are adapted to ensure that during testing, while both ends of the first electrical connector 3 are in contact with the test sub-module and the positive electrode substrate 13 respectively, both ends of the second electrical connector 4 are in contact with the conductive substrate 21 and the inductive connection substrate 15 respectively. In one embodiment, the surfaces of the first electrical connector 3 and the second electrical connector 4 are gold-plated to reduce contact resistance, thereby reducing the parasitic resistance of the adapter; furthermore, the first electrical connector 3 and the second electrical connector 4 are made of oxygen-free copper material.

[0069] Furthermore, the number of the first electrical connector 3 is one or more. Preferably, the number of the first electrical connector 3 is multiple. If the number of the first electrical connector 3 is one, then if the first electrical connector 3 does not contact the test sub-module and / or the positive electrode substrate 13, then the electrical connection between the test sub-module and the positive electrode substrate 13 cannot be achieved, resulting in the inability to perform electrical characteristic testing normally. Multiple first electrical connectors 3 can reduce the probability of electrical connection failure between the test sub-module and the positive electrode substrate 13, ensuring that electrical characteristic testing can be performed normally.

[0070] Further, the number of the second electrical connectors 4 is one or more. Preferably, the number of the second electrical connectors 4 is multiple, and the second electrical connectors 4 are adapted to surround the positioning component 24. If the number of the second electrical connectors 4 is one, then if the second electrical connector 4 does not contact the conductive substrate 21 and / or the inductive connection substrate 15, then an electrical connection between the conductive substrate 21 and the inductive connection substrate 15 cannot be achieved, resulting in the inability to perform electrical characteristic tests normally. Multiple second electrical connectors 4 can reduce the probability of electrical connection failure between the conductive substrate 21 and the inductive connection substrate 15, ensuring that electrical characteristic tests can be performed normally.

[0071] During electrical characteristic testing, the test sub-module needs to be pressurized. In existing electrical characteristic testing equipment, the test sub-module is pressurized and depressurized at the beginning and end of each test. Repeated pressing of the test sub-module will damage it and affect its service life.

[0072] In this embodiment, see Figures 10-11 The accompanying test assembly 23 includes: an upper insulating plate 231 and a lower insulating plate 233 arranged at relative intervals, and a second fastener 235 for connecting the upper insulating plate 231 and the lower insulating plate 233; the upper insulating plate 231 is provided with a first through hole 232, and the first electrical connector 3 is adapted to pass through the first through hole 232; the lower insulating plate 233 is adapted to be fixed on the conductive substrate 21, and the lower insulating plate 233 has a receiving cavity 234 penetrating the lower insulating plate 233, and the accompanying test sub-module is adapted to be embedded in the receiving cavity 234, which avoids horizontal displacement of the accompanying test sub-module, improves the stability of the accompanying test sub-module on the conductive substrate 21, and thus maintains a stable electrical connection between the accompanying test sub-module and the conductive substrate 21, which is beneficial to ensuring the smooth progress of electrical characteristic testing. The test module is secured between the upper insulating plate 231 and the lower insulating plate 233 by the second fastener 235, thereby pressurizing the test module for electrical characteristic testing. Since the structure of the test component 23 remains constant during the test, the test module is always in a pressurized state with constant pressure, avoiding repeated pressure application and depressurization during electrical characteristic testing, thus improving the lifespan of the test module. Simultaneously, adjusting the distance between the upper insulating plate 231 and the lower insulating plate 233 using the second fastener 235 allows for control of the force applied to the test module, providing greater flexibility. Furthermore, the simple structure of the test component 23 allows for timely replacement of the test module in case of failure during testing, improving testing efficiency.

[0073] Specifically, the second fasteners 235 are multiple and arranged around the center of the supporting component 23 to make the pressure distribution of the supporting sub-module more uniform. Figures 10-11 As shown, the second fastener 235 is located at the four corners of the test component 23. The second fastener 235 can be a bolt.

[0074] Furthermore, such as Figures 10-11As shown, the second fastener 235 can penetrate the upper insulating plate 231, the lower insulating plate 233 and the conductive substrate 21 to fix the test component 23 on the conductive substrate 21; or the second fastener 235 can penetrate a portion of the depth of the upper insulating plate 231 and the lower insulating plate 233 to bond the lower insulating plate 233 to the conductive substrate 21 or embed it into a portion of the depth of the conductive substrate 21.

[0075] Furthermore, as an optional implementation, the upper insulating plate 231 is provided with a third groove (not shown in the figure) of a certain depth on the side facing the lower insulating plate 233. The top of the test sub-module is embedded in the third groove. The third groove further restricts the test sub-module, improves the stability of the test sub-module, and reduces the distance between the upper insulating plate 231 and the lower insulating plate 233, thereby reducing the longitudinal dimension of the test component 23, which in turn helps to reduce the longitudinal dimension of the adapter and realize the miniaturization of the adapter.

[0076] Furthermore, as an optional implementation, the test companion component 23 further includes a voltage-conducting block (not shown in the figure) embedded in the third groove. The side surface of the voltage-conducting block facing away from the upper insulating plate 231 is adapted to contact the test companion sub-module to achieve electrical connection, and the side surface of the voltage-conducting block facing the upper insulating plate 231 is adapted to be electrically connected to the first electrical connector 3. When one end of the first electrical connector 3 located in the second through hole 16 is fixedly connected to the positive electrode substrate 13, and the other end is detachably connected to the test component 23, as long as the other end of the first electrical connector 3 facing away from the positive electrode substrate 13 contacts the voltage-conducting block after pressure is applied to the adapter, the first electrical connector 3 can be electrically connected to the test component and the positive electrode substrate 13. When one end of the first electrical connector 3 is detachably connected to the positive electrode substrate 13, and the other end is fixedly connected to the upper insulating plate 231, the other end of the first electrical connector 3 is embedded in the voltage-conducting block. As long as one end of the first electrical connector 3 contacts the positive electrode substrate 13 after pressure is applied to the adapter, the first electrical connector 3 can be electrically connected to the test component and the positive electrode substrate 13. The voltage-conducting block serves as an intermediate material to facilitate the electrical connection between the test component and the first electrical connector 3.

[0077] In one embodiment, such as Figures 7-8As shown, the negative electrode substrate 11, the positive electrode substrate 13, and the inductor connection substrate 15 are stacked sequentially. A first insulating plate 12 is disposed between the positive electrode substrate 13 and the negative electrode substrate 11, and a second insulating plate 14 is disposed between the inductor connection substrate 15 and the positive electrode substrate 13. The upper clamp is provided with a second through hole 16 penetrating the inductor connection substrate 15 and the second insulating plate 14, and a third through hole 17 penetrating the inductor connection substrate 15, the second insulating plate 14, the positive electrode substrate 13, and the first insulating plate 12 sequentially. The second through hole 16 is adapted to be located directly above the test component 23. One end of the first electrical connector 3 is adapted to be located in the second through hole 16, and the other end of the first electrical connector 3 is adapted to be located in the first through hole 232. The third through hole 17 is adapted to be located directly above the positioning component 24, and the probe component 18 extends along the third through hole 17. The first insulating plate 12 insulates the negative electrode substrate 11 from the positive electrode substrate 13, and the second insulating plate 14 insulates the positive electrode substrate 13 from the inductor connection substrate 15 to avoid leakage affecting the test results during the test. The sum of the compressed length of the first electrical connector 3 and the thickness of the test sub-module is equal to the thickness of the inductor connection substrate 15, the thickness of the second insulating plate 14, the distance from the bottom of the first groove in the conductive adapter 241 to the upper surface of the conductive substrate 21, and the compressed length of the second electrical connector 4. It should be understood that the structure of the upper clamp includes, but is not limited to, the above-described structure.

[0078] Specifically, such as Figure 7 As shown, the negative electrode substrate 11 is connected to the first insulating plate 12, the first insulating plate 12 is connected to the positive electrode substrate 13, the positive electrode substrate 13 is connected to the second insulating plate 14, and the second insulating plate 14 is connected to the inductor connection substrate 15 via insulating pins 19. The first insulating plate 12 and the second insulating plate 14 can be made of high-temperature resistant, high-insulation materials; furthermore, the materials of the first insulating plate 12 and the second insulating plate 14 are phenolic resin.

[0079] In a first embodiment, one end of the first electrical connector 3 is detachably disposed from the positive electrode substrate 13, and the other end of the first electrical connector 3 is adapted to be fixedly connected to the upper insulating plate 231. Specifically, one end of the first electrical connector 3 is fixed in the first through hole 232. When pressure is applied to the adapter, one end of the first electrical connector 3 contacts the auxiliary test module, and the other end contacts the positive electrode substrate 13; after the pressure is unloaded, the first electrical connector 3 separates from the positive electrode substrate 13 and the auxiliary test module.

[0080] In the first implementation, such as Figure 8As shown, to prevent the first electrical connector 3 from tilting and causing poor contact between the first electrical connector 3 and the positive electrode substrate 13 when pressure is applied to the adapter, a first limiting member 5 is provided on the surface of the positive electrode substrate 13 facing the inductor connection substrate 15. The first limiting member 5 is located in the second through hole 16 and has a first limiting hole that penetrates through the first limiting member 5. The end of the first electrical connector 3 facing away from the upper insulating plate 231 is adapted to be inserted into the first limiting hole, which serves to fix the first electrical connector 3 and ensure the electrical connection between the first electrical connector 3 and the positive electrode substrate 13. The first limiting member 5 can be a spring 43 contact finger.

[0081] Furthermore, in the first embodiment, the cross-sectional area of ​​the second through hole 16 is greater than or equal to the area of ​​the orthographic projection of the test component 23 onto the conductive substrate 21. Before applying pressure to the adapter, the upper and lower clamps need to be aligned so that the end of the first electrical connector 3 facing away from the upper insulating plate 231 passes through the second through hole 16 and contacts only the positive electrode substrate 13. By limiting the cross-sectional area of ​​the second through hole 16 as described above, the risk of the first electrical connector 3 contacting the inductor connection substrate 15 while in contact with the positive electrode substrate 13 is effectively reduced, thereby ensuring the smooth progress of the test process.

[0082] In a second embodiment, the first electrical connector 3 is fixedly connected to the positive electrode substrate 13 at one end of the second through hole 16, and the other end of the first electrical connector 3 facing away from the positive electrode substrate 13 is detachably disposed from the test component 23. Before applying pressure to the adapter, the upper and lower clamps need to be aligned, specifically the alignment of the first electrical connector 3 with the first through hole 232 in the test component 23. This ensures that after the adapter is subjected to force, the first electrical connector 3 passes through the first through hole 232 and contacts the test sub-module. At this time, the first electrical connector 3 will not contact other conductive components, ensuring the smooth progress of the test process. When pressure is applied to the adapter, the other end of the first electrical connector 3 facing away from the positive electrode substrate 13 contacts the test component 23; after the pressure is unloaded, the other end of the first electrical connector 3 facing away from the positive electrode substrate 13 separates from the test component 23.

[0083] In a first embodiment, the second electrical connector 4 is fixedly connected to the conductive substrate 21, and the other end of the second electrical connector 4 facing away from the conductive substrate 21 is adapted to be separably disposed from the inductive connection substrate 15. When pressure is applied to the adapter, the other end of the second electrical connector 4 facing away from the conductive substrate 21 contacts the inductive connection substrate 15; after the pressure is released, the other end of the second electrical connector 4 facing away from the conductive substrate 21 separates from the inductive connection substrate 15. Further, a second limiting member 6 is provided on the inductive connection substrate 15, and the second limiting member 6 has a second limiting hole penetrating through the second limiting member 6. The end of the second electrical connector 4 facing away from the conductive substrate 21 is adapted to be inserted into the second limiting hole.

[0084] As a second implementation method, such as Figure 7 As shown, the second electrical connector 4 is fixedly connected to the inductor connection substrate 15, and the other end of the second electrical connector 4 facing away from the inductor connection substrate 15 is adapted to be separable from the conductive substrate 21. When pressure is applied to the adapter, the other end of the second electrical connector 4 facing away from the inductor connection substrate 15 contacts the conductive substrate 21; after the pressure is released, the other end of the second electrical connector 4 facing away from the inductor connection substrate 15 separates from the conductive substrate 21. Further, as... Figure 3 As shown, a second limiting member 6 is provided on the surface of the conductive substrate 21. The second limiting member 6 has a second limiting hole that penetrates through the second limiting member 6. The end of the second electrical connector 4 facing away from the inductor connection substrate 15 is adapted to be inserted into the second limiting hole.

[0085] Specifically, the second limiting member 6 serves to fix the second electrical connector 4, ensuring the electrical connection between the second electrical connector 4 and the inductor connection substrate 15; the second limiting member 6 can be a spring 43 contact finger. Furthermore, the second electrical connector 4 is adapted to surround the positioning assembly 24.

[0086] As an optional implementation, the upper insulating plate 231 has a fourth groove on the side opposite to the lower insulating plate 233. The second fastener 235 is located in the fourth groove, penetrates the upper insulating plate 231, and extends to at least a portion of the depth of the lower insulating plate 233. Specifically, when the second fastener 235 is a bolt, the head of the bolt is located in the fourth groove, and the bolt shank penetrates the upper insulating plate 231 and extends to at least a portion of the depth of the lower insulating plate 233. When the size of the second through hole 16 is greater than or equal to the size of the orthographic projection of the test component 23 on the positive electrode substrate 13, if the pressure applied to the adapter is large, the upper part of the test component 23 can be embedded in the second through hole 16 during the test, so that the end of the second fastener 235 protruding from the upper insulating plate 231 contacts the positive electrode substrate 13; however, if the second fastener 235 penetrates the lower insulating plate 233 and the conductive substrate 21, then the positive electrode substrate 13 and the conductive substrate 21 are electrically connected through the second fastener 235, affecting the electrical characteristic test; by setting the fourth groove, the second fastener 235 does not protrude from the upper insulating plate 231, avoiding contact between the second fastener 235 and the positive electrode substrate 13, thereby avoiding electrical connection between the positive electrode substrate 13 and the conductive substrate 21, ensuring the smooth progress of the test.

[0087] In this embodiment, see Figure 2 The press-fit IGBT sub-module test adapter further includes a height-adjustable support component 22 located on the conductive substrate 21. One end of the support component 22 facing away from the conductive substrate 21 is adapted to contact the upper clamp. The support component 22 supports the upper clamp, thereby making the pressure on the sub-module under test more uniform and reducing the probability of sub-module failure during testing. Simultaneously, the height of the support component 22 can be adjusted according to the height of the sub-module under test, providing greater flexibility. Specifically, when the height of the sub-module under test is large, the height of the support component 22 is increased; when the height of the sub-module under test is small, the height of the support component 22 is decreased.

[0088] For details, see Figure 5 The support assembly 22 includes a support portion 221 and an adjustment portion 222 connected to the support portion 221. The adjustment portion 222 is adapted to connect to the conductive substrate 21 and adjust the distance between the support portion 221 and the conductive substrate 21. In one embodiment, the adjustment portion 222 is a stud; the conductive substrate 21 is provided with internal threads, and the adjustment portion 222 is adapted to be screwed into the internal threads. The height of the support assembly 22 is adjusted by screwing the adjustment portion 222 in or out.

[0089] This embodiment also provides a crimp-type IGBT submodule testing device, including the aforementioned crimp-type IGBT submodule testing adapter. The crimp-type IGBT submodule testing device possesses all the advantages of the crimp-type IGBT submodule testing adapter, which will not be elaborated further here.

[0090] In this embodiment, see Figure 13 The press-fit IGBT sub-module testing equipment further includes: an inductor coil, one end of which is electrically connected to the inductor connection substrate 15; a power supply, the positive terminal of which is electrically connected to the other end of the inductor coil and the positive substrate 13, and the negative terminal of which is electrically connected to the negative substrate 11; a driving unit 7, which is electrically connected to the gate and emitter of the IGBT sub-module; a pressure application device for applying pressure to the adapter; and a heating device adapted to be located below the conductive substrate 21 for heating the sub-module under test during high-temperature testing.

[0091] Specifically, the connection between one end of the inductor coil and the inductor connection substrate 15, the connection between the positive terminal of the power supply and the other end of the inductor coil, the connection between the positive terminal of the power supply and the positive terminal substrate 13, and the connection between the negative terminal of the power supply and the negative terminal substrate 11 are all made by wire connection.

[0092] When the test sub-module is a diode and the test sub-module is an IGBT sub-module, the driving unit 7 is connected to the gate probe 182 in the gate-emitter assembly using leads to achieve electrical connection between the driving unit 7 and the gate of the IGBT sub-module; the driving unit 7 is connected to the negative electrode substrate 11 using leads to achieve electrical connection between the driving unit 7 and the emitter of the IGBT sub-module.

[0093] When the sub-module under test is a diode and the sub-module to be tested is an IGBT sub-module, the test circuit of the press-fit IGBT sub-module test equipment is as follows: Figures 12-13As shown, the drive circuit provides drive signals to the IGBT sub-module, and the power circuit provides voltage to the IGBT sub-module for various electrical characteristic tests of the IGBT, such as switching tests and RBSOA tests. Specifically, the drive circuit is: drive unit 7—negative substrate 11—emitter probe 181 in the gate-emitter assembly—emitter of the IGBT sub-module—gate of the IGBT sub-module—gate probe 182 in the gate-emitter assembly—drive unit 7; the power circuit is: positive power supply—inductor coil—inductor connection substrate 15—second electrical connector 4—conductive substrate 21—collector of the IGBT sub-module—emitter of the IGBT sub-module—emitter probe 181 in the gate-emitter assembly—negative substrate 11—negative power supply; the auxiliary test circuit is: inductor coil—inductor connection substrate 15—second electrical connector 4—conductive substrate 21—anode of the auxiliary test sub-module—cathode of the auxiliary test sub-module—first electrical connector 3—positive substrate 13—inductor coil. During the test, the test sub-module is connected in parallel with the inductor coil. The current in the test sub-module is opposite to the current in the IGBT sub-module. During the switching process, the test sub-module and the IGBT sub-module are in a complementary coaxial state, which effectively cancels the stray inductance from the adapter itself and reduces interference from external signals.

[0094] When the sub-module under test is an IGBT sub-module and the sub-module under test is a diode, the driving unit 7 and the driving lead structure are connected by leads to achieve electrical connection between the driving unit 7 and the gate of the IGBT sub-module; the driving unit 7 and the conductive substrate 21 are connected by leads to achieve electrical connection between the driving unit 7 and the emitter of the IGBT sub-module.

[0095] When the sub-module under test is an IGBT sub-module and the sub-module to be tested is a diode, the test circuit of the press-fit IGBT sub-module test equipment is as follows: Figures 14-15 As shown, the driving circuit provides a driving signal to the IGBT sub-module, and the power supply in the circuit under test provides voltage to the diode. Specifically, the driving circuit is: driving unit 7—driving lead structure—gate of IGBT sub-module—emitter of IGBT sub-module—conductive substrate—driving unit 7; the circuit under test is: positive power supply—inductor coil—inductor connection substrate 15—second electrical connector 4—conductive substrate 21—cathode of diode—anode of diode—anode probe—negative substrate 11—negative power supply; the auxiliary test circuit is: inductor coil—inductor connection substrate 15—second electrical connector 4—conductive substrate 21—emitter of IGBT sub-module—collector of IGBT sub-module—first electrical connector 3—positive substrate 13—inductor coil.

[0096] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A crimp-type IGBT sub-module test adapter, characterized in that, include: The lower clamp, the upper clamp, and the accompanying testing assembly, wherein the upper clamp is adapted to be disposed opposite to the lower clamp; The lower clamp includes: A conductive substrate having an array of positioning holes, the array of positioning holes comprising a plurality of discrete positioning holes; A positioning component, the positioning component including a conductive adapter, the conductive adapter being adapted to be placed on the positioning hole array, the conductive adapter having a first groove, the first groove being adapted to place the sub-module to be tested; A first fastener, the first fastener being adapted to penetrate the conductive adapter through the side of the first groove and extend in at least a portion of the positioning holes; A drive lead-out structure is provided, wherein the conductive substrate contains a drive lead-out area located on the side of the positioning hole array, and the drive lead-out structure is located in the drive lead-out area and is separated from the conductive substrate. The upper clamp includes a negative electrode substrate, a positive electrode substrate, and an inductor connection substrate stacked and spaced apart, and the conductive substrate is adapted to be electrically connected to the inductor connection substrate. The test companion component is located on the conductive substrate and is adapted to accommodate a test companion sub-module; the test companion sub-module is an IGBT sub-module and the test sub-module is a diode; or, the test companion sub-module is a diode and the test sub-module is an IGBT sub-module.

2. The crimp-type IGBT sub-module test adapter according to claim 1, characterized in that, The accompanying testing component is located on the side of the positioning component.

3. The crimp-type IGBT sub-module test adapter according to claim 1, characterized in that, When the sub-module under test is an IGBT sub-module and the sub-module under test is a diode, the gate of the IGBT sub-module is in contact with the drive lead structure, the emitter of the IGBT sub-module is in contact with the conductive substrate, the collector of the IGBT sub-module is adapted to be electrically connected to the positive substrate, the cathode of the diode is in contact with the conductive substrate, and the anode of the diode is adapted to be electrically connected to the negative substrate.

4. The press-fit type IGBT sub-module test adapter according to claim 1, characterized in that, When the test sub-module is a diode and the test sub-module is an IGBT sub-module, the anode of the diode is in contact with the conductive substrate, the cathode of the diode is adapted to be electrically connected to the positive substrate, the emitter of the IGBT sub-module is adapted to be electrically connected to the negative substrate, and the collector of the IGBT sub-module is adapted to be electrically connected to the conductive substrate.

5. The crimp-type IGBT sub-module test adapter according to claim 1, characterized in that, The drive lead-out area is provided with a second groove; the drive lead-out structure is located in the second groove; The second groove also includes an insulating layer located between the drive lead-out structure and the conductive substrate.

6. The press-fit type IGBT sub-module test adapter according to claim 5, characterized in that, The drive lead-out structure is a conductive layer; or, the drive lead-out structure is a spring disc, wherein a portion of the spring disc is embedded in the insulating layer and a portion of the spring disc protrudes from the insulating layer.

7. The press-fit type IGBT sub-module test adapter according to claim 1, characterized in that, Also includes: A first electrical connector is adapted to be located between the upper clamp and the lower clamp, and the first electrical connector is adapted to electrically connect the test sub-module and the positive electrode substrate; A second electrical connector is adapted to be located between the upper clamp and the lower clamp, and both ends of the second electrical connector are adapted to contact the conductive substrate and the inductive connection substrate, respectively. A probe assembly adapted to be located between the negative electrode substrate and the sub-module under test, the probe assembly being adapted to electrically connect the sub-module under test and the negative electrode substrate.

8. The press-fit type IGBT sub-module test adapter according to claim 7, characterized in that, When the test sub-module is an IGBT sub-module and the test sub-module is a diode, the two ends of the first electrical connector are adapted to contact the collector of the IGBT sub-module and the positive electrode substrate, respectively; the probe assembly includes an anode probe, one end of which is fixed on the negative electrode substrate, and the anode probe is adapted to electrically connect the negative electrode substrate and the anode of the diode.

9. The press-fit type IGBT sub-module test adapter according to claim 7, characterized in that, When the test sub-module is a diode and the sub-module under test is an IGBT sub-module, the two ends of the first electrical connector are adapted to contact the cathode of the diode and the positive substrate, respectively. The probe assembly includes an emitter probe, a gate probe and an insulating connection portion. One end of the emitter probe is fixed on the negative substrate and is adapted to electrically connect the negative substrate and the emitter of the IGBT sub-module. The insulating connection portion is located between one end of the gate probe and the negative substrate, and the other end of the gate probe away from the insulating connection portion is adapted to contact the gate of the IGBT sub-module.

10. The crimped IGBT sub-module test adapter according to claim 1, characterized in that, Also includes: A height-adjustable support assembly located on the conductive substrate, wherein one end of the support assembly facing away from the conductive substrate is adapted to contact the upper clamp.

11. The crimped IGBT sub-module test adapter according to claim 10, characterized in that, The support assembly includes a support portion and an adjustment portion connected to the support portion. The adjustment portion is adapted to connect to the conductive substrate and adjust the spacing between the support portion and the conductive substrate.

12. The crimp-type IGBT sub-module test adapter according to claim 11, characterized in that, The adjusting part is a stud; the conductive substrate is provided with internal threads, and the adjusting part is adapted to be screwed into the internal threads.

13. The press-fit type IGBT sub-module test adapter according to claim 7, characterized in that, The accompanying testing component includes: an upper insulating plate and a lower insulating plate arranged at relative intervals, and a second fastener for connecting the upper insulating plate and the lower insulating plate; the upper insulating plate is provided with a first through hole, and the first electrical connector is adapted to pass through the first through hole; the lower insulating plate is adapted to be fixed on the conductive substrate, and the lower insulating plate has a receiving cavity penetrating the lower insulating plate, and the accompanying testing sub-module is adapted to be embedded in the receiving cavity.

14. The crimp-type IGBT sub-module test adapter according to claim 13, characterized in that, The negative electrode substrate, positive electrode substrate, and inductor connection substrate are stacked sequentially. A first insulating plate is disposed between the positive electrode substrate and the negative electrode substrate, and a second insulating plate is disposed between the inductor connection substrate and the positive electrode substrate. The upper clamp is provided with a second through hole penetrating the inductor connection substrate and the second insulating plate, and a third through hole penetrating the inductor connection substrate, the second insulating plate, the positive electrode substrate, and the first insulating plate sequentially. The second through hole is adapted to be located directly above the test component. One end of the first electrical connector is adapted to be located in the second through hole, and the other end of the first electrical connector is adapted to be located in the first through hole. The third through hole is adapted to be located directly above the positioning component, and the probe component extends along the third through hole.

15. The crimp-type IGBT sub-module test adapter according to claim 14, characterized in that, The first electrical connector is fixedly connected to the positive electrode substrate at one end of the second through hole, and the other end of the first electrical connector facing away from the positive electrode substrate is adapted to be detachably disposed from the auxiliary testing component; or, one end of the first electrical connector is detachably disposed from the positive electrode substrate, and the other end of the first electrical connector is adapted to be fixedly connected to the upper insulating plate. The second electrical connector is fixedly connected to the conductive substrate, and the other end of the second electrical connector facing away from the conductive substrate is adapted to be detachably disposed from the inductive connection substrate; or, the second electrical connector is fixedly connected to the inductive connection substrate, and the other end of the second electrical connector facing away from the inductive connection substrate is adapted to be detachably disposed from the conductive substrate.

16. The press-fit type IGBT sub-module test adapter according to claim 7, characterized in that, Both the first electrical connector and the second electrical connector are elastic elements; both the first electrical connector and the second electrical connector include a spring probe.

17. A testing device for a press-fit type IGBT sub-module, characterized in that, The test adapter for the crimped IGBT sub-module as described in any one of claims 1 to 16.

18. The crimped IGBT sub-module testing equipment according to claim 17, characterized in that, The press-fit IGBT sub-module test adapter further includes: an upper clamp, which is adapted to be disposed opposite to the lower clamp, the upper clamp including a negative electrode substrate, a positive electrode substrate and an inductor connection substrate stacked and spaced apart; and a test companion component, which is adapted to be located on the conductive substrate and on the side of the positioning component, the test companion component being adapted to accommodate the test companion sub-module; when one of the test companion sub-module and the sub-module under test is an IGBT sub-module, the other is a diode; The press-fit type IGBT sub-module testing equipment also includes: An inductor coil, one end of which is electrically connected to the inductor connection substrate; A power supply, wherein the positive terminal of the power supply is electrically connected to the other end of the inductor coil and the positive terminal substrate, and the negative terminal of the power supply is electrically connected to the negative terminal substrate. A driving unit is electrically connected to the gate and emitter of the IGBT sub-module.

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