Display module and electronic equipment

Abstract

The utility model discloses a display module and electronic equipment, and belongs to the technical field of display, the display module comprises a display panel, a binding device and an anisotropic conductive adhesive film; the display panel comprises an array substrate, a first organic layer, an inorganic layer and a circuit layer, the array substrate is provided with a non-display area, a binding device and the first organic layer are arranged on the same side of the array substrate, and the binding device is bound to the non-display area of the array substrate through an anisotropic conductive adhesive film; the first organic layer is located between the array substrate and the inorganic layer; a part of the first organic layer extends to the non-display area, and the circuit layer is located in the non-display area and embedded in the first organic layer; a part of the inorganic layer extends to the non-display area, and one end, facing the binding device, of the inorganic layer extends to the edge position of the first organic layer and covers the edge position of the first organic layer; wherein in the direction perpendicular to the array substrate, the orthographic projection of the area, covering the first organic layer, of the inorganic layer is located outside the orthographic projection of the binding device.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of display, and particularly relates to a display module and electronic equipment. BACKGROUND

[0002] With the rapid development of electronic equipment, the application of electronic equipment is more and more extensive, and electronic equipment such as mobile phones and tablet computers play an increasingly important role in people's work, life and entertainment.

[0003] The main component of electronic equipment to realize the display function is a display module, which includes a display panel, a binding device and an anisotropic conductive adhesive film. The display panel includes an array substrate and a touch layer, and the binding device is bound to the non-display area of the array substrate through the anisotropic conductive adhesive film. The array substrate and the touch layer are stacked, and part of the touch layer extends to the non-display area of the array substrate. The touch layer can include an organic layer, an inorganic layer and a circuit layer. The organic layer is mainly used to cover the particulate pollutants that cannot be avoided in the production process, buffer bending and stress in the folding process. The inorganic layer is mainly used to block the erosion of external water and oxygen. The circuit layer is used to realize the electrical connection function. The organic layer is stacked with the array substrate, the circuit layer is embedded in the part of the organic layer extending to the non-display area, and the inorganic layer covers the organic layer.

[0004] However, in the binding process of the binding device, the binding device will generate a pressure towards the array substrate on the anisotropic conductive adhesive film. The pressure will extrude the inorganic layer, and the stress of the part of the inorganic layer covering the corner position of the organic layer is relatively concentrated, so it is easy to crack in extrusion, thereby causing the external water and oxygen to enter the organic layer from the corner position of the organic layer, and further causing the risk of corrosion of the circuit layer. Therefore, the reliability of the display module in the related art is poor. UTILITY MODEL CONTENT

[0005] The purpose of the embodiments of the application is to provide a display module and electronic equipment, which can solve the problem of poor reliability of the display module.

[0006] The application discloses a display module, which comprises a display panel, a binding device and an anisotropic conductive adhesive film.

[0007] The display panel includes an array substrate, a first organic layer, an inorganic layer and a circuit layer, the array substrate has a non-display area, the binding device and the first organic layer are arranged on the same side of the array substrate, and the binding device is bound to the non-display area of ​​the array substrate through the anisotropic conductive adhesive film; the first organic layer is located between the array substrate and the inorganic layer; part of the first organic layer extends to the non-display area, the circuit layer is located in the non-display area and is embedded in the first organic layer; part of the inorganic layer extends to the non-display area, and the inorganic layer extends to the edge position of the first organic layer toward one end of the binding device and covers the edge position of the first organic layer; wherein, in the direction perpendicular to the array substrate, the orthographic projection of the area where the inorganic layer covers the first organic layer is located outside the orthographic projection of the binding device.

[0008] The present application discloses an electronic device, comprising a housing and the above-mentioned display module, wherein the display module is arranged on the housing.

[0009] In an embodiment of the present application, the orthographic projection of the area where the inorganic layer covers the first organic layer, along a direction perpendicular to the array substrate, lies outside the orthographic projection of the binding device. In this solution, the corners of the first organic layer and the areas of the inorganic layer covering the corners of the first organic layer are both located outside the coverage of the binding device. This reduces stress in the areas of the inorganic layer covering the corners of the organic layer, thereby preventing cracking in the areas of the inorganic layer corresponding to the corners of the organic layer. This in turn reduces the risk of corrosion in the circuit layer, thereby improving the reliability of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a schematic structural diagram of the first display module disclosed in the embodiment of the present application;

[0011] Figures 2 to 6 is a schematic diagram of a partial structure of a display panel of the first display module disclosed in an embodiment of the present application;

[0012] Figure 7 is a structural diagram of the second display module disclosed in the embodiment of the present application;

[0013] Figure 8 Schematic diagram of a partial structure of a display panel of a second display module disclosed in an embodiment of the present application.

[0014] Description of reference numerals:

[0015] 100-display panel, 110-array substrate, 111-first pin, 120-first organic layer, 121-first surface, 122-second surface, 123-side, 124-partitioning groove, 1241-first inner wall surface, 1242-second inner wall surface, 130-inorganic layer, 131-first covering layer, 132-second covering layer, 133-third covering layer, 140-circuit layer, 150-water oxygen absorption layer, 160-second organic layer, 200-binding device, 210-second pin, 300-anisotropic conductive film, AA-non-display area, A1-binding area, A2-non-binding area. DETAILED DESCRIPTION

[0016] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0017] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects and are not used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate so that the embodiments of this application can be implemented in an order other than those illustrated or described herein. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0018] The display module and electronic device provided in the embodiments of the present application are described in detail below with reference to specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0019] Please refer to Figures 1 to 8 The present invention discloses a display module, which is applied to an electronic device to realize the display function of the electronic device. The display module includes a display panel 100, a binding device 200, and an anisotropic conductive film 300.

[0020] The display panel 100 is the main component of the display module. The display panel 100 includes an array substrate 110, a first organic layer 120, an inorganic layer 130 and a circuit layer 140. The array substrate 110 has a display area and a non-display area AA. The display area here is used to realize the display function of the display module. The non-display area AA cannot be displayed. The non-display area AA is used to bind and connect corresponding devices. The binding device 200 is bound to the non-display area AA of the array substrate 110 through an anisotropic conductive adhesive film 300. The binding device 200 here can be a driver chip, a flexible circuit board, a capacitor, a resistor and other devices. In the specific binding structure, the array substrate 110 can have a first pin 111, and the binding device 200 can have a second pin 210. The first pin 111 and the second pin 210 are electrically connected and fixed by the anisotropic conductive adhesive film 300, thereby realizing the binding operation of the binding device 200.

[0021] The binding device 200 and the first organic layer 120 are disposed on the same side of the array substrate 110. The first organic layer 120 is located between the array substrate 110 and the inorganic layer 130. In this case, the first organic layer 120 is stacked on the array substrate 110, while the inorganic layer 130 is stacked on the first organic layer 120. A portion of the first organic layer 120 extends into the non-display area AA. In this application, the portion of the first organic layer 120 extending into the non-display area AA is referred to as the non-display area of ​​the first organic layer 120. The circuit layer 140 is located in the non-display area AA and is embedded within the first organic layer 120. In this case, the circuit layer 140 is embedded within the non-display area of ​​the first organic layer 120. A portion of the inorganic layer 130 extends into the non-display area AA. In this application, the portion of the inorganic layer 130 extending into the non-display area AA is referred to as the non-display area of ​​the inorganic layer 130. One end of the inorganic layer 130 facing the binding device 200 extends to an edge of the first organic layer 120 and covers the edge of the first organic layer 120 .

[0022] The edge position of the first organic layer 120 is the corner position of the first organic layer 120, and the inorganic layer 130 covers the corner position of the first organic layer 120. Specifically, the first organic layer 120 can have a first surface 121, a second surface 122, and a side surface 123. The first surface 121 and the second surface 122 are oppositely arranged, and the side surface 123 is located at a side edge of the first surface 121 and the second surface 122 toward the bonding device 200. The second surface 122 is attached to the array substrate 110. At this time, the inorganic layer 130 covers the first surface 121 and the side surface 123. The intersection of the first surface 121 and the side surface 123 and the side surface 123 are the corner position of the first organic layer 120. The inorganic layer 130 has a height change when covering the corner position. Here, it can be understood that the inorganic layer 130 has a climbing position, and the climbing position is subjected to a greater stress. Therefore, in the related art, the bonding device 200 generates a pressure on the anisotropic conductive adhesive film 300 toward the array substrate 110, which easily causes the climbing position of the inorganic layer 130 to crack.

[0023] In this application, in the direction perpendicular to the array substrate 110, the orthographic projection of the region where the inorganic layer 130 covers the first organic layer 120 is located outside the orthographic projection of the bonding device 200. Here, the direction perpendicular to the array substrate 110 can also be understood as the thickness direction of the array substrate 110. At this time, the orthographic projection of the region where the inorganic layer 130 covers the first surface 121 and the side surface 123 of the first organic layer 120 is located outside the orthographic projection of the bonding device 200. Here, the orthographic projection of the bonding device 200 can be understood as the region covered by the bonding device 200. At this time, the climbing position of the inorganic layer 130 is located outside the region covered by the bonding device 200.

[0024] In the embodiments disclosed in this application, the corner position of the first organic layer 120 and the region of the inorganic layer 130 covering the corner position of the first organic layer 120 are both located outside the region covered by the bonding device 200. Therefore, the stress of the part of the inorganic layer 130 covering the corner position of the organic layer is reduced, thereby avoiding the region of the inorganic layer 130 corresponding to the corner position of the organic layer from being easily cracked, thereby reducing the risk of water vapor entering the organic layer from the corner position of the organic layer, and further reducing the risk of corrosion of the circuit layer 140, thereby improving the reliability of the display module.

[0025] In addition, the part of the inorganic layer 130 covering the corner position of the organic layer is not easily cracked, thereby also improving the corrosion resistance of the entire non-display area AA and the bonding area A1 of the display panel 100.

[0026] The technical solution disclosed by the present application is to solve the corrosion resistance of the non-display area AA and the binding area A1 of the display panel 100, so that the non-display area AA does not contain a display stack and a display device, and therefore the drawings disclosed by the present application are all structures of the non-display area AA of the display panel 100. The first organic layer 120, the inorganic layer 130 and the circuit board in the present application form a touch layer of the display panel 100, and of course the touch layer also has a display area and a non-display area. Here, the non-display area of the touch layer is mainly described. The display layer of the display panel 100 is located in the display area of the touch layer and the display area of the array substrate 110, and the specific structure is a known technology, which will not be described herein.

[0027] In an alternative solution, as shown in Figure 1 , the binding device 200 can be a driving chip, and the display panel 100 and the driving chip can adopt a COP (Chip on Panel) solution, that is, the non-display area AA includes the binding area A1 and the non-binding area A2, and the driving chip is bound to the binding area A1, and the non-binding area A2 can be bent to bend the binding area A1 to the back plate of the display area AA of the display panel 100. Therefore, the display module disclosed by the present application can be used in the COP solution.

[0028] Of course, the solution in the present application can also be adapted to the COF (Chip on film) solution of the display module, and of course the binding device 200 here is a film, and the film is bound to the binding area A1. In addition, other binding solutions of the display module can also apply the structure of the present application, which will not be described herein.

[0029] In the above embodiment, the inorganic layer 130 needs to cover the adjacent first surface 121 and the side surface 123 of the first organic layer 120, and therefore the inorganic layer 130 can include a first covering layer 131 and a second covering layer 132 connected to each other, the first covering layer 131 covers the first surface 121, and the second covering layer 132 covers the side surface 123. The second covering layer 132 herein is the ramp position in the above text. In the direction perpendicular to the array substrate 110, the orthographic projection of the first covering layer 131 and the second covering layer 132 is located outside the orthographic projection of the binding device 200. Here, it can also be understood that the distance between the edge line of the side of the second covering layer 132 away from the side surface 123 and the edge line of the side of the binding device 200 facing the second covering layer 132 is greater than 0. The distance between the edge line of the side of the second covering layer 132 away from the side surface 123 and the edge line of the side of the binding device 200 facing the second covering layer 132 is shown as H in Figure 1 and Figure 7 . The value of H can be flexibly selected according to specific requirements, which will not be limited herein.

[0030] In another optional embodiment, the inorganic layer 130 may further include a third covering layer 133. The third covering layer 133 may be located on a side of the second covering layer 132 facing away from the side surface 123 and overlap the array substrate 110. In this solution, a portion of the inorganic layer 130 extends onto the array substrate 110, which is more conducive to protecting the array substrate 110.

[0031] Furthermore, in a direction perpendicular to the array substrate 110, the orthographic projections of the first cover layer 131, the second cover layer 132, and the third cover layer 133 are all located within the orthographic projection of the anisotropic conductive adhesive film 300. In this solution, the anisotropic conductive adhesive film 300 can secure a portion of the inorganic layer 130, thereby further improving the stacking performance of the display panel 100.

[0032] In another optional solution, the inorganic layer 130 can cover the first surface 121 and the side surface 123, and the first organic layer 120 can be provided with a partitioning groove 124, which can be located between the circuit layer 140 and the side surface 123. In this case, even if water and oxygen from the outside enter from the corners of the first organic layer 120, the partitioning groove 124 can prevent the water and oxygen from further invading toward the circuit layer 140, thereby further improving the corrosion resistance of the circuit layer 140 and thus further enhancing the reliability of the display module.

[0033] In the above solution, the opening of the partition groove 124 may face the array substrate 110 . In this case, the partition groove 124 may not be filled with any substance, and the partition groove 124 is in a vacuum state.

[0034] In an alternative approach, Figure 7 As shown, the opening of the partition groove 124 faces one side of the inorganic layer 130 . At this time, when the inorganic layer 130 is deposited, part of the inorganic layer 130 is filled in the partition groove 124 .

[0035] In another optional embodiment, the partition groove 124 may be filled with a water-oxygen absorption layer 150. The water-oxygen absorption layer 150 can absorb water and oxygen, thereby further preventing water and oxygen from further invading the circuit layer 140, thereby further improving the corrosion resistance of the circuit layer 140 and further improving the reliability of the display module.

[0036] In the above embodiment, the water and oxygen absorbing layer 150 may be a desiccant, such as calcium oxide. Of course, the water and oxygen absorbing layer 150 may also be made of other materials, which is not limited herein.

[0037] In a specific solution, the water and oxygen absorption layer 150 may be a silicon layer. The silicon layer has good adsorption and adhesion properties, thereby further improving the corrosion resistance of the circuit layer 140 .

[0038] In another optional embodiment, the partitioning groove 124 has a first inner wall surface 1241 and a second inner wall surface 1242, which are arranged along the side surface 123 toward the circuit layer 140. The distance between the first inner wall surface 1241 and the second inner wall surface 1242 gradually decreases along the direction from the first surface 121 to the second surface 122. In this case, the size of the notch of the partitioning groove 124 is larger than the size of the bottom of the partitioning groove 124 along the direction from the first surface 121 to the second surface 122. This solution ensures that the partitioning groove 124 has a good water and oxygen barrier effect while also ensuring the strength of the first organic layer 120.

[0039] Furthermore, the first inner wall surface 1241 and the second inner wall surface 1242 intersect. The intersection of the first inner wall surface 1241 and the second inner wall surface 1242 forms the bottom of the partition groove 124. The first inner wall surface 1241 and the second inner wall surface 1242 form a V-shaped structure, thus forming a V-shaped groove. In this embodiment, the V-shaped groove has a simple structure and is easy to manufacture.

[0040] The partition groove 124 in the present application is not limited to a “V”-shaped structure, and can also be a “U”, “C” or other shapes.

[0041] In the embodiment disclosed in the present application, the display panel 100 may further include a second organic layer 160 , which may be disposed on a side of the inorganic layer 130 facing away from the first organic layer 120 . This solution can further improve the reliability of the display panel 100 .

[0042] During the manufacturing process of the display panel 100 disclosed in the present application, an array substrate 110 is first provided, and then a metal layer is deposited on the array substrate 110. Figure 6 As shown, the metal layer here can be a titanium or aluminum layer. Then the metal layer is etched to obtain a circuit layer 140, as shown in FIG. Figure 5 Then, the first organic layer 120 is formed by using an organic coating device, as shown in FIG. Figure 4 Then, a partition groove 124 is formed on the first organic layer 120 by exposure and development, as shown in FIG. Figure 3 Here, the water oxygen absorption layer 150 can be first filled in the partition groove 124 by dispensing and coating, and then the inorganic layer 130 and the second organic layer 160 are deposited. Finally, the Figure 1 The display panel 100 shown in FIG. Figure 3 The inorganic layer 130 and the second organic layer 160 are directly deposited on the basis shown in FIG. Figure 7 and Figure 8 The display panel 100 shown in FIG.

[0043] This application only discloses the structure of the non-display area of ​​the display panel 100 and the structure stacking steps. The structure of the display area of ​​the display panel 100 and the structure stacking steps are well-known technologies and are not limited herein.

[0044] Based on the display module disclosed in the embodiments of the present application, the embodiments of the present application further disclose an electronic device, and the disclosed electronic device includes the display module described in any of the above embodiments.

[0045] The electronic device disclosed in the present application further includes a housing, and the display module is arranged on the housing.

[0046] The electronic devices disclosed in the embodiments of the present application may be smart phones, tablet computers, e-book readers, wearable devices (such as smart watches), electronic game consoles, and other devices. The embodiments of the present application do not limit the specific types of electronic devices.

[0047] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A display module, characterized in that: It comprises a display panel (100), a binding device (200) and an anisotropic conductive adhesive film (300); The display panel (100) comprises an array substrate (110), a first organic layer (120), an inorganic layer (130) and a circuit layer (140); the array substrate (110) has a non-display area (AA); the binding device (200) and the first organic layer (120) are arranged on the same side of the array substrate (110); the binding device (200) is bound to the non-display area (AA) of the array substrate (110) through the anisotropic conductive adhesive film (300); the first organic layer (120) is located between the array substrate (110) and the inorganic layer (130); a portion of the first organic layer (120) The circuit layer (140) extends to the non-display area (AA), and is located in the non-display area (AA) and embedded in the first organic layer (120); a portion of the inorganic layer (130) extends to the non-display area (AA), and one end of the inorganic layer (130) toward the binding device (200) extends to the edge position of the first organic layer (120) and covers the edge position of the first organic layer (120); wherein, in a direction perpendicular to the array substrate (110), the orthographic projection of the area of ​​the inorganic layer (130) covering the first organic layer (120) is located outside the orthographic projection of the binding device (200).

2. The display module according to claim 1, wherein: The first organic layer (120) has a first surface (121), a second surface (122), and a side surface (123); the first surface (121) and the second surface (122) are arranged opposite to each other; the side surface (123) is located at an edge of one side of the first surface (121) and the second surface (122) facing the binding device (200); and the second surface (122) is in contact with the array substrate (110); The inorganic layer (130) comprises a first covering layer (131), a second covering layer (132), and a third covering layer (133) connected in sequence, wherein the first covering layer (131) covers the first surface (121), the second covering layer (132) covers the side surface (123), and the third covering layer (133) is located on a side of the second covering layer (132) away from the side surface (123) and overlaps with the array substrate (110); along a direction perpendicular to the array substrate (110), the orthographic projections of the first covering layer (131) and the second covering layer (132) are located outside the orthographic projection of the binding device (200).

3. The display module according to claim 2, wherein: In a direction perpendicular to the array substrate (110), the orthographic projection of the first covering layer (131), the orthographic projection of the second covering layer (132), and the orthographic projection of the third covering layer (133) are all located within the orthographic projection of the anisotropic conductive adhesive film (300).

4. The display module according to claim 1, wherein: The first organic layer (120) has a first surface (121), a second surface (122), and a side surface (123); the first surface (121) and the second surface (122) are arranged opposite to each other; the side surface (123) is located at an edge of the first surface (121) and the second surface (122) facing the binding device (200); the second surface (122) is in contact with the array substrate (110); and the inorganic layer (130) covers the first surface (121) and the side surface (123); The first organic layer (120) is provided with a partition groove (124), and the partition groove (124) is located between the circuit layer (140) and the side surface (123).

5. The display module according to claim 4, wherein: The partition groove (124) is filled with a water and oxygen absorption layer (150).

6. The display module according to claim 5, wherein: The water oxygen absorption layer (150) is a silicon layer.

7. The display module according to claim 4, wherein: The partition groove (124) has a first inner wall surface (1241) and a second inner wall surface (1242), and the first inner wall surface (1241) and the second inner wall surface (1242) are arranged in a direction from the side surface (123) to the circuit layer (140); and in a direction from the first surface (121) to the second surface (122), the distance between the first inner wall surface (1241) and the second inner wall surface (1242) gradually decreases.

8. The display module according to claim 7, wherein: The first inner wall surface (1241) and the second inner wall surface (1242) intersect.

9. The display module according to claim 6, wherein: The display panel (100) further comprises a second organic layer (160), wherein the second organic layer (160) is arranged on a side of the inorganic layer (130) facing away from the first organic layer (120).

10. An electronic device, characterized in that: The device comprises a housing and the display module according to any one of claims 1 to 9, wherein the display module is arranged on the housing.

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