Wafer cleaning device

Abstract

The utility model belongs to the technical field of wafer cleaning, and discloses a wafer cleaning device which comprises a cleaning chamber and a cleaning mechanism, the cleaning chamber forms a space for cleaning wafers, the cleaning mechanism comprises an angle adjusting part and a liquid spraying part, and the liquid spraying part is installed on the angle adjusting part and can spray cleaning liquid. The cleaning liquid can react with pollutants on the surface of the wafer to clean the wafer, the angle adjusting part is used for adjusting the orientation of the liquid spraying part, the liquid spraying part is used for cleaning the wafer and / or the inner wall of the cleaning chamber, when the liquid spraying part faces the wafer, the wafer can be cleaned, and when the liquid spraying part faces the inner wall of the cleaning chamber, the inner wall of the cleaning chamber can be cleaned. The cleaning mechanism can be independently used for cleaning the wafer or the inner wall of the cleaning chamber and can also be used for cleaning the wafer and the inner wall of the cleaning chamber at the same time in the wafer cleaning process, and the situation that pollutants attached to the inner wall of the cleaning chamber fall off and are attached to the surface of the wafer, and the yield of the wafer manufacturing process is affected is prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a wafer cleaning device. Background Art

[0002] As the application of LED chips continues to expand, patterned substrates, or chip bases, are widely used as key materials in LED manufacturing. Wafers are the most widely used. Dust can cause serious contamination on wafers, necessitating their cleaning during the wafer production process.

[0003] In the prior art, wafers are cleaned using a wafer cleaning device, wherein a cleaning mechanism in the wafer cleaning device sprays cleaning fluid onto the surface of the wafer to remove contaminants on the surface of the wafer, thereby ensuring that the wafer has good quality and performance.

[0004] When cleaning liquids are used to clean wafers in a cleaning system, the resulting dust adheres to the inner walls of the cleaning system. This dust can then fall off and adhere to the wafer surface, contaminating the wafers and reducing their quality, ultimately impacting the yield rate of the wafer manufacturing process. Utility Model Content

[0005] The utility model aims to provide a wafer cleaning device capable of cleaning wafers and the inner wall of a cleaning chamber at the same time.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] Provided is a wafer cleaning device, comprising: a cleaning chamber, wherein the cleaning chamber forms a space for cleaning wafers;

[0008] A cleaning mechanism includes an angle adjustment portion and a liquid spray portion, wherein the liquid spray portion is installed on the angle adjustment portion, the angle adjustment portion is used to adjust the direction of the liquid spray portion, and the liquid spray portion is used to clean the wafer and / or the inner wall of the cleaning chamber.

[0009] As a preferred solution of the above-mentioned wafer cleaning device, the angle adjustment part includes a robotic arm and a turntable assembly, one end of the robotic arm is connected to the liquid spray part, and the other end is rotatably connected to the turntable assembly to adjust the direction of the liquid spray part within a first angle range.

[0010] As a preferred solution of the above-mentioned wafer cleaning device, the angle adjustment part further includes a first driving member, which is drivingly connected to the turntable assembly, and the first driving member is used to drive the turntable assembly to rotate.

[0011] As a preferred solution of the above-mentioned wafer cleaning device, the robotic arm includes a first driving arm and a second driving arm, one end of the first driving arm is rotatably connected to the turntable assembly, and the second driving arm is rotatably connected to the other end of the first driving arm, the first driving arm and the second driving arm can rotate relative to each other in a vertical plane, and the liquid spraying part is connected to the second driving arm to adjust the position of the liquid spraying part in a vertical plane.

[0012] As a preferred solution of the above-mentioned wafer cleaning device, the angle adjustment part also includes a second driving member and a third driving member, the second driving member is drivingly connected to the first driving arm, and the third driving member is drivingly connected to the second driving arm. The second driving member is used to drive the first driving arm to rotate in the vertical plane, and the third driving member is used to drive the second driving arm to rotate in the vertical plane.

[0013] As a preferred solution of the above-mentioned wafer cleaning device, the liquid spray part includes a fourth driving member, which is driven and connected to the liquid spray part to adjust the direction of the liquid spray part within a second angle range, and the second angle range is smaller than the first angle range.

[0014] As a preferred solution of the above-mentioned wafer cleaning device, the wafer cleaning device further includes a wafer supporting portion, and the wafer supporting portion is arranged at the bottom of the cleaning chamber.

[0015] As a preferred solution of the above-mentioned wafer cleaning device, a guide portion is provided in the cleaning chamber, and the guide portion is arranged along the circumference of the wafer supporting portion. The guide portion can guide the cleaning waste liquid to the edge of the cleaning chamber.

[0016] As a preferred embodiment of the wafer cleaning device, the wafer cleaning device further comprises a drain portion, which is disposed in the cleaning chamber and communicates with the outside of the cleaning chamber to discharge cleaning waste liquid; and / or,

[0017] The wafer cleaning device further includes an exhaust portion, which is disposed in the cleaning chamber and communicates with the outside of the cleaning chamber to exhaust cleaning waste gas.

[0018] As a preferred embodiment of the above-mentioned wafer cleaning device, the wafer cleaning device further includes a supporting portion, which includes a supporting seat and a supporting frame, one end of the supporting frame is connected to the angle adjustment portion, and the other end of the supporting frame is connected to the supporting seat.

[0019] Beneficial effects of the utility model:

[0020] The wafer cleaning device of the present invention includes a cleaning chamber and a cleaning mechanism, wherein the cleaning chamber forms a space for cleaning wafers. The cleaning mechanism includes an angle adjustment portion and a liquid spray portion, wherein the liquid spray portion is mounted on the angle adjustment portion and can spray a cleaning liquid, wherein the cleaning liquid can react with contaminants on the surface of the wafer to clean the wafer, and the angle adjustment portion is used to adjust the direction of the liquid spray portion, and the liquid spray portion is used to clean the wafer and / or the inner wall of the cleaning chamber. When the liquid spray portion is directed toward the wafer, the wafer can be cleaned, and when the liquid spray portion is directed toward the inner wall of the cleaning chamber, the inner wall of the cleaning chamber can be cleaned. The cleaning mechanism can be used alone to clean the wafer or the inner wall of the cleaning chamber, or it can be used to clean the wafer and the inner wall of the cleaning chamber simultaneously during the wafer cleaning process, so as to prevent contaminants attached to the inner wall of the cleaning chamber from falling off and adhering to the wafer surface, contaminating the wafer, and thus affecting the yield rate of the wafer manufacturing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic structural diagram of a wafer cleaning device provided by an embodiment of the present utility model;

[0022] Figure 2 This is a schematic diagram of the cleaning mechanism structure provided by an embodiment of the utility model;

[0023] Figure 3 It is a schematic structural diagram of the first driving member provided in an embodiment of the present utility model.

[0024] In the picture:

[0025] 1. Cleaning chamber; 2. Angle adjustment part; 21. Turntable assembly; 211. Rotating table; 212. Rotating mounting seat; 213. Connecting seat; 22. Robotic arm; 221. First driving arm; 222. Second driving arm; 23. First driving member; 24. Second driving member; 3. Liquid spraying part; 31. Nozzle; 32. Liquid supply pipe; 4. Wafer supporting part; 41. Wafer supporting platform; 42. Lifting platform; 5. Guide part; 6. Wafer; 7. Support part; 71. Support seat; 72. Support frame; 721. Beam; 722. Column; 8. Drainage part; 9. Exhaust part. DETAILED DESCRIPTION

[0026] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0027] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0028] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0029] In the description of this embodiment, the terms "upper," "lower," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0030] like Figure 1 and Figure 2 As shown, this embodiment provides a wafer cleaning device, including a cleaning chamber 1 and a cleaning mechanism, wherein the cleaning chamber 1 forms a space for cleaning the wafer 6. The cleaning mechanism includes an angle adjustment portion 2 and a liquid spray portion 3. The liquid spray portion 3 is mounted on the angle adjustment portion 2 and is capable of spraying a cleaning liquid. The cleaning liquid can react with contaminants on the surface of the wafer 6 to clean the wafer 6. The angle adjustment portion 2 is used to adjust the direction of the liquid spray portion 3. The liquid spray portion 3 is used to clean the wafer 6 and / or the inner wall of the cleaning chamber 1. When the liquid spray portion 3 is directed toward the wafer 6, the wafer 6 can be cleaned. When the liquid spray portion 3 is directed toward the inner wall of the cleaning chamber 1, the inner wall of the cleaning chamber 1 can be cleaned. The cleaning mechanism can be used alone to clean the wafer 6 or the inner wall of the cleaning chamber 1, or it can simultaneously clean the wafer 6 and the inner wall of the cleaning chamber 1 during the wafer 6 cleaning process to prevent contaminants attached to the inner wall of the cleaning chamber 1 from falling off and attaching to the surface of the wafer 6, contaminating the wafer 6, and thus affecting the yield rate of the wafer 6 manufacturing process.

[0031] Specifically, the cleaning chamber 1 is a cylindrical structure with a circular opening at the top. The angle adjustment part 2 is arranged above the cleaning chamber 1, and the liquid spraying part 3 is installed at one end of the angle adjustment part 2 facing the bottom of the cleaning chamber 1 so that the liquid spraying part 3 is located inside the cleaning chamber 1. The liquid spraying part 3 includes a nozzle 31 and a liquid supply pipe 32. One end of the liquid supply pipe 32 is connected to the nozzle 31, and the other end extends into the cleaning liquid. The cleaning liquid is sprayed from the nozzle 31 through an air pump. The air pump is provided with an air pump control system that can set the liquid spraying parameters. In this embodiment, the liquid spraying time is 1-10s, the liquid spraying mass is 1-10g, and the liquid spraying speed is 1-10ml / s. The liquid spraying speed and liquid spraying flow rate are adjusted by adjusting the air pressure of the air pump. The cleaning liquid is sprayed from the nozzle 31 and directly contacts the contaminants on the surface of the wafer 6 to remove the contaminants on the surface of the wafer 6. The nozzle 31 is made of a metal material that is resistant to corrosion and oxidation, and the aperture of the nozzle 31 is 0.5-2mm. The cleaning liquid can be a chemical solvent such as acetone, toluene, ethanol, propylene glycol monomethyl ether acetate, etc., which is not limited in this embodiment.

[0032] Optionally, the angle adjustment portion 2 includes a robotic arm 22 and a turntable assembly 21 , wherein one end of the robotic arm 22 is connected to the liquid spraying portion 3 , and the other end is rotatably connected to the turntable assembly 21 to adjust the direction of the liquid spraying portion 3 within a first angle range.

[0033] Specifically, the turntable assembly 21 includes a rotating table 211, a rotating mounting seat 212 and a connecting seat 213. The rotating mounting seat 212 is installed on the side of the rotating table 211 facing the liquid spraying part 3, and the installation method can be screw connection or clamping, which is not limited in this embodiment. The connecting seat 213 is installed on the side of the rotating mounting seat 212 away from the rotating table 211, and the installation method can be screw connection or clamping, which is not limited in this embodiment. One end of the robotic arm 22 is connected to the liquid spraying part 3, and the other end is gear-connected to the connecting seat 213. The robotic arm 22 can swing with the connection point as the center of the circle, thereby adjusting the direction of the liquid spraying part 3 within a first angle range, wherein the first angle range is a fan-shaped area below the horizontal plane where the connection point is located and with the connection point of the connecting seat 213 and the robotic arm 22 as the center of the circle and the length of the robotic arm 22 as the radius.

[0034] Alternatively, as Figure 1-Figure 3 As shown, the angle adjustment part 2 also includes a first driving member 23, which is driven and connected to the turntable assembly 21. The first driving member 23 is used to drive the turntable assembly 21 to rotate. The rotation of the turntable assembly 21 can drive the robotic arm 22 to rotate in the horizontal direction, thereby driving the nozzle 31 to rotate in the horizontal direction, thereby achieving comprehensive cleaning of the inner wall of the cleaning chamber 1.

[0035] Specifically, the first driving member 23 can be a motor. In this embodiment, the first driving member 23 is connected to the turntable assembly 21 via a pulley. The driving end of the first driving member 23 is connected to the drive shaft at the input end of the pulley via a snap-fit ​​connection. The side of the rotating platform 211 facing away from the rotating mounting base 212 is also connected to the drive shaft at the output end of the pulley via a snap-fit ​​connection. The motor drives the pulley at the input end to rotate, which in turn drives the pulley at the output end to rotate, thereby driving the turntable assembly 21 to rotate.

[0036] In another embodiment, the first drive member 23 is connected to the turntable assembly 21 via a gear reducer. The driving end of the first drive member 23 is connected to the transmission shaft at the input end of the gear reducer by a snap-fit ​​method, and the side of the rotating table 211 facing away from the rotating mounting base 212 is connected to the transmission shaft at the output end of the gear reducer by a snap-fit ​​method. The gear at the input end of the gear reducer is driven by a motor to rotate, which drives the gear at the output end to rotate, thereby driving the turntable assembly 21 to rotate. The first drive member 23 can also use a structure such as an electric cylinder to generate the corresponding power. The specific type of the first drive member 23 can be selected based on the actual drive requirements and installation space, and this application does not make specific restrictions on this.

[0037] Optionally, the robotic arm 22 includes a first driving arm 221 and a second driving arm 222, one end of the first driving arm 221 is rotatably connected to the turntable assembly 21, and the second driving arm 222 is rotatably connected to the other end of the first driving arm 221, the first driving arm 221 and the second driving arm 222 can rotate relative to each other in a vertical plane, and the liquid spraying part 3 is connected to the second driving arm 222 to adjust the position of the liquid spraying part 3 in a vertical plane.

[0038] Specifically, the first driving arm 221 and the second driving arm 222 are rod-shaped, one end of the first driving arm 221 is connected to the connecting seat 213 through a gear, and the other end of the first driving arm 221 is connected to the second driving arm 222 through a gear. The first driving arm 221 and the second driving arm 222 can swing with the connection point as the center of the circle, thereby adjusting the position of the liquid spraying part 3 on the vertical plane.

[0039] Optionally, the angle adjustment part 2 also includes a second driving member 24 and a third driving member, the second driving member 24 is drivingly connected to the first driving arm 221, and the third driving member is drivingly connected to the second driving arm 222. The second driving member 24 is used to drive the first driving arm 221 to rotate in the vertical plane, and the third driving member is used to drive the second driving arm 222 to rotate in the vertical plane.

[0040] Specifically, the second driving member 24 may be a motor, which may be fixed to the side wall of the rotating mounting base 212 by means of a snap connection, and the first driving arm 221 may be driven by the second driving member 24 to rotate about the connection point between the connecting base 213 and the first driving arm 221. The third driving member may be a motor, which may be fixed to the side of the first driving arm 221 by means of a snap connection, and the second driving arm 222 may be driven by the third driving member to rotate about the connection point between the first driving arm 221 and the second driving arm 222.

[0041] Optionally, the liquid spraying portion 3 includes a fourth driving member, which is driven and connected to the liquid spraying portion 3 to adjust the direction of the liquid spraying portion 3 within a second angular range, and the second angular range is smaller than the first angular range to achieve more precise adjustment. Specifically, the nozzle 31 is connected to the second robotic arm 22 via a gear. The motor can be fixed to the side of the second driving arm 222 by a snap-on connection, and the motor drives the nozzle 31 to rotate within the second angular range with the connection point between the nozzle 31 and the second driving wall as the center of the circle. The second angular range is a circular area with the connection point between the nozzle 31 and the second driving arm 222 as the center of the circle and the length of the nozzle 31 as the radius. In this embodiment, the rotation angle of the nozzle 31 is 0-135°.

[0042] Optionally, the wafer cleaning device further includes a wafer supporting portion 4 , which is disposed at the bottom of the cleaning chamber 1 and is used for supporting wafers.

[0043] Specifically, the wafer support unit 4 includes a wafer support platform 41 and a lifting platform 42. The wafer support platform 41 is cylindrical and is used to hold the wafer 6. The lifting platform 42 is arranged below the wafer support platform 41 and is used to drive the wafer support platform 41 to rise and fall vertically and rotate horizontally. The lifting platform 42 is fixed to the bottom of the cleaning chamber 1 by screws, and the wafer support unit 4 is fixed to the side of the lifting platform 42 away from the bottom of the cleaning chamber 1 by screws. The specific structure of the lifting platform 42 can be referred to the existing technology and will not be described in detail in this application.

[0044] Optionally, a guide portion 5 is provided in the cleaning chamber 1, and the guide portion 5 is arranged along the circumference of the wafer supporting portion 4. The guide portion 5 can guide the cleaning waste liquid to the edge of the cleaning chamber 1, so as to facilitate the discharge of the cleaning waste liquid. Specifically, the guide portion 5 is arranged along the circumference of the lifting platform 42. The guide portion 5 is an upwardly convex arc-shaped structure, which is fixed to the bottom of the cleaning chamber 1 by bonding. The cleaning waste liquid flows to the guide portion 5 through the edge of the wafer supporting platform 41, and the guide portion 5 guides the cleaning waste liquid to the edge of the cleaning chamber 1.

[0045] Optionally, the wafer cleaning device also includes a drain portion 8, which is arranged in the cleaning chamber 1 and connected to the outside of the cleaning chamber 1 to discharge the cleaning waste liquid; and / or, the wafer cleaning device also includes an exhaust portion 9, which is arranged in the cleaning chamber 1 and connected to the outside of the cleaning chamber 1 to discharge the cleaning waste gas, so as to prevent the excessive cleaning waste liquid and cleaning waste gas generated in the cleaning chamber 1 from contaminating the wafer 6.

[0046] Specifically, the drain portion 8 is provided at the bottom of the cleaning chamber 1, and a drain hole is provided at the bottom of the cleaning chamber 1. The drain hole is connected to the outside of the cleaning chamber 1, and the cleaning waste liquid can be discharged from the cleaning chamber 1 through the drain hole. The exhaust portion 9 is provided at the bottom of the cleaning chamber 1, and an exhaust hole is provided at the bottom of the cleaning chamber 1. The exhaust hole is connected to the outside of the cleaning chamber 1, and the cleaning waste gas can be discharged from the cleaning chamber 1 through the exhaust hole.

[0047] Furthermore, the drain portion 8 is disposed at the edge of the bottom of the cleaning chamber 1, and the exhaust portion 9 is disposed in the middle of the bottom of the cleaning chamber 1. The drain portion 8 and the exhaust portion 9 are disposed at different locations within the cleaning chamber 1 to prevent waste cleaning liquid from flowing into the exhaust hole and clogging the exhaust hole. In this embodiment, the drain portion 8 is disposed near the inner wall of the cleaning chamber 1 to facilitate the discharge of waste cleaning liquid directed to the edge of the cleaning chamber 1 by the guide portion 5. The exhaust portion 9 is disposed away from the inner wall of the cleaning chamber 1 to prevent waste cleaning liquid from passing through the exhaust portion 9.

[0048] Optionally, the wafer cleaning device also includes a support part 7, which includes a support seat 71 and a support frame 72. One end of the support frame 72 is connected to the angle adjustment part 2, and the other end of the support frame 72 is connected to the support seat 71. The support part 7 can fix the angle adjustment part 2 so that it is located above the cleaning chamber 1. At the same time, the support part 7 can drive the angle adjustment part 2 to rotate, thereby realizing the adjustment of the position of the angle adjustment part 2.

[0049] Specifically, the support portion 7 is a '7'-shaped structure. One end of the support frame 72 is fixedly engaged with the first driving member 23. The support seat 71 is arranged outside the cleaning chamber 1. The support seat 71 is provided with a mounting hole. The mounting hole is provided with a motor, which is fixed in the mounting hole by a snap-on method. The other end of the support frame 72 is driven and connected to the motor. The motor drives the support frame 72 to rotate in the horizontal direction, thereby driving the angle adjustment portion 2 to rotate in the horizontal direction, thereby achieving adjustment of the horizontal position of the angle adjustment portion 2.

[0050] Furthermore, the support frame 72 includes a column 722 and a crossbeam 721. One end of the column 722 is driven and connected to the motor. The other end of the column 722 and one end of the crossbeam 721 are both provided with internal threads. The column 722 and the crossbeam 721 are fixedly connected by a connector. The other end of the crossbeam 721 is fixedly engaged with the first driving member 23. The motor drives the column 722 to rotate horizontally, which in turn drives the crossbeam 721 to rotate horizontally, thereby driving the angle adjustment unit 2 to rotate horizontally.

[0051] When cleaning wafer 6, the liquid spray cleaning parameters are set on the control system operation interface to control the operating state of the wafer cleaning device. The cleaning liquid is sprayed above the center of wafer 6 for 1 second, the spray speed is 1-1.5 ml / s, and the rotation speed of the wafer carrier 41 is 13-50 r / min. After the wafer carrier 41 rotates for 5-10 seconds, the control system automatically adjusts the angle of the nozzle 31 and the angles of the first drive arm 221 and the second drive arm 222 so that the nozzle 31 is inclined at 15-30° above the center of wafer 6, and the beam 721 swings from above the center of wafer 6 to the edge of wafer 6, back and forth 3 times. The cleaning liquid spray time is 3 seconds, and the rotation speed of the wafer carrier 41 is 1000-1500 r / min.

[0052] When cleaning the inner wall of the cleaning chamber 1, the timed washing tank setting is performed in the control system operation interface. Every time 200-300 wafers 6 are cleaned, the rotation of the turntable 211 is controlled by the control system, and the angles of the first driving arm 221, the second driving arm 222 and the nozzle 31 are adjusted at the same time to clean the inner wall of the cleaning chamber 1. The cleaning liquid spraying speed is 3-5 ml / s, and the spraying time is 45-60 s. The turntable 211 rotates forward one circle and then reverse one circle, and goes back and forth 4 times.

[0053] Obviously, the above-described embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the manner in which the present invention is to be implemented. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A wafer cleaning device, characterized in that: include: A cleaning chamber (1), wherein the cleaning chamber (1) forms a space for cleaning wafers (6); A cleaning mechanism, comprising an angle adjustment portion (2) and a liquid spray portion (3), wherein the liquid spray portion (3) is mounted on the angle adjustment portion (2), the angle adjustment portion (2) is used to adjust the orientation of the liquid spray portion (3), and the liquid spray portion (3) is used to clean the wafer (6) and / or the inner wall of the cleaning chamber (1).

2. The wafer cleaning device according to claim 1, wherein: The angle adjustment portion (2) comprises a mechanical arm (22) and a turntable assembly (21); one end of the mechanical arm (22) is connected to the liquid spraying portion (3), and the other end is rotatably connected to the turntable assembly (21) to adjust the direction of the liquid spraying portion (3) within a first angle range.

3. The wafer cleaning device according to claim 2, wherein: The angle adjustment portion (2) further comprises a first driving member (23), wherein the first driving member (23) is drivingly connected to the turntable assembly (21), and the first driving member (23) is used to drive the turntable assembly (21) to rotate.

4. The wafer cleaning device according to claim 2, wherein: The robotic arm (22) includes a first driving arm (221) and a second driving arm (222), one end of the first driving arm (221) is rotatably connected to the turntable assembly (21), and the second driving arm (222) is rotatably connected to the other end of the first driving arm (221), the first driving arm (221) and the second driving arm (222) are capable of relative rotation on a vertical plane, and the liquid spraying portion (3) is connected to the second driving arm (222) to adjust the position of the liquid spraying portion (3) on a vertical plane.

5. The wafer cleaning device according to claim 4, characterized in that: The angle adjustment portion (2) further comprises a second driving member (24) and a third driving member, wherein the second driving member (24) is drivingly connected to the first driving arm (221), and the third driving member is drivingly connected to the second driving arm (222), the second driving member (24) is used to drive the first driving arm (221) to rotate in a vertical plane, and the third driving member is used to drive the second driving arm (222) to rotate in a vertical plane.

6. The wafer cleaning device according to claim 2, characterized in that: The liquid spraying portion (3) includes a fourth driving member, which is drivingly connected to the liquid spraying portion (3) to adjust the direction of the liquid spraying portion (3) within a second angle range, and the second angle range is smaller than the first angle range.

7. The wafer cleaning device according to any one of claims 1 to 6, characterized in that: The wafer cleaning device further comprises a wafer carrying portion (4), and the wafer carrying portion (4) is arranged at the bottom of the cleaning chamber (1).

8. The wafer cleaning device according to claim 7, characterized in that: A guide portion (5) is provided in the cleaning chamber (1), and the guide portion (5) is arranged along the circumference of the wafer supporting portion (4). The guide portion (5) can guide the cleaning waste liquid to the edge of the cleaning chamber (1).

9. The wafer cleaning device according to any one of claims 1 to 6, characterized in that: The wafer cleaning device further comprises a liquid draining portion (8), wherein the liquid draining portion (8) is arranged in the cleaning chamber (1) and communicated with the outside of the cleaning chamber (1) to discharge the cleaning waste liquid; and / or, The wafer cleaning device further comprises an exhaust portion (9), which is arranged in the cleaning chamber (1) and communicates with the outside of the cleaning chamber (1) to discharge cleaning waste gas.

10. The wafer cleaning device according to any one of claims 1 to 6, characterized in that: The wafer cleaning device further comprises a supporting portion (7), wherein the supporting portion (7) comprises a supporting seat (71) and a supporting frame (72), wherein one end of the supporting frame (72) is connected to the angle adjustment portion (2), and the other end of the supporting frame (72) is connected to the supporting seat (71).

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