Bearing device and semiconductor process chamber

Abstract

The embodiment of the utility model provides a bearing device and a semiconductor process chamber, and the bearing device comprises a linear driving assembly, a support, a sleeve body, a supporting shaft, a pedestal, a heater, a radio frequency electrode, a rotary conductive assembly, a magnetic coupler, and a rotary driving assembly. The linear driving assembly is in driving connection with the support, the sleeve body is connected with the support, the supporting shaft is rotationally supported in the sleeve body, the base is supported on the supporting shaft, and the linear driving assembly is used for driving the base to ascend and descend. The heater and the radio frequency electrode are respectively embedded in the base, the heater is connected with the heating power supply through the rotary conductive component, and the radio frequency electrode is connected with the radio frequency power supply through the rotary conductive component; the rotation driving assembly is used for driving the supporting shaft to rotate through the magnetic coupler.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a carrier device and a semiconductor process chamber. Background Art

[0002] During semiconductor processing, wafers supported on a pedestal in a supporting device need to be heated. In related art, heating lamps are installed beneath the pedestal, irradiating the pedestal with the lamps to heat the pedestal, thereby indirectly heating the wafers supported on the pedestal. This radiant heating method suffers from poor temperature control. Utility Model Content

[0003] The embodiments of the present application provide a carrier device and a semiconductor process chamber to solve the problem of how to improve the temperature control effect of heating a wafer.

[0004] In order to solve the above technical problems, this application is implemented as follows:

[0005] In a first aspect, an embodiment of the present application provides a carrying device.

[0006] The carrying device provided in the embodiment of the present application is applied to a semiconductor process chamber, and the carrying device includes: a linear drive component, a bracket, a sleeve, a support shaft, a base, a heater, a radio frequency electrode, a rotating conductive component, a magnetic coupler and a rotating drive component; the linear drive component is driven and connected to the bracket, the sleeve is connected to the bracket, the support shaft is rotatably supported in the sleeve, the base is supported on the support shaft, and the linear drive component is used to drive the base to rise and fall; the heater and the radio frequency electrode are respectively embedded in the base, the heater is connected to the heating power supply via the rotating conductive component, and the radio frequency electrode is connected to the radio frequency power supply via the rotating conductive component; the rotating drive component is used to drive the support shaft to rotate via the magnetic coupler.

[0007] Optionally, the supporting device further includes a first conductive member and a second conductive member, the first conductive member and the second conductive member are respectively arranged on the support shaft, and the first conductive member and the second conductive member respectively extend along one end of the support shaft toward the base to one end away from the base; the first connecting portion of the heater is electrically connected to the rotating conductive component via the first conductive member, and the second connecting portion of the heater is electrically connected to the rotating conductive component via the second conductive member.

[0008] Optionally, the supporting device further includes a third conductive member, which is provided on the support shaft and extends along one end of the support shaft toward the base to an end away from the base; the RF electrode is electrically connected to the rotating conductive component via the third conductive member.

[0009] Optionally, the support shaft is provided with a first through hole, a second through hole and a third through hole extending along the axial direction of the support shaft; the first conductive member is arranged in the first through hole, the second conductive member is arranged in the second through hole, and the third conductive member is arranged in the third through hole.

[0010] Optionally, the support shaft comprises an inner shaft and an outer shaft, the inner shaft is an insulating shaft, and the first through hole, the second through hole and the third through hole are arranged in the inner shaft.

[0011] Optionally, the rotating conductive assembly comprises a shell, a follower, a plurality of fourth conductive members and a plurality of fifth conductive members; the shell is connected with the support frame, the follower is sleeved in the shell, and the follower is coaxially connected with the support shaft; a plurality of the fourth conductive members are arranged in the follower along the axial direction of the support shaft, and the fifth conductive member is in conductive contact connection with the fourth conductive member one by one; a plurality of the fifth conductive members are arranged in the shell, and the fourth conductive member and the fifth conductive member are electrically connected to the heating power supply through the fourth conductive member and the fifth conductive member connected with the fourth conductive member; and the third conductive member is electrically connected to the radio frequency power supply through the fourth conductive member and the fifth conductive member connected with the fourth conductive member.

[0012] Optionally, the support frame is provided with a fifth through hole, the support shaft is arranged in the fifth through hole, the sleeve body is located on the side of the support frame facing the base, one end of the sleeve body away from the base is in sealing butt joint with the outer periphery of the fifth through hole, the shell is arranged on the side of the support frame away from the base, and the end of the shell facing the base is in sealing butt joint with the outer periphery of the fifth through hole.

[0013] Optionally, the magnetic coupling comprises a first magnetic ring and a second magnetic ring, the first magnetic ring is sleeved outside the support shaft and connected with the support shaft, and the second magnetic ring is arranged outside the sleeve body and sleeved outside the first magnetic ring; the rotating driving assembly is used for driving the second magnetic ring to rotate, so as to drive the support shaft to rotate with the first magnetic ring.

[0014] In a second aspect, the embodiments of the present application provide a semiconductor process chamber.

[0015] The semiconductor process chamber provided by the embodiments of the present application comprises: a chamber body and any one of the bearing devices provided by the embodiments of the present application; the chamber body is provided with a containing cavity, the base is arranged in the containing cavity, and the linear driving assembly is mounted outside the chamber body.

[0016] Optionally, the semiconductor process chamber further includes a telescopic sealing sleeve; the chamber body is further provided with a fourth through-hole connected to the accommodating cavity, the sleeve body is arranged in the fourth through-hole, the telescopic sealing sleeve is arranged outside the sleeve body, and one end of the sleeve body located in the accommodating cavity is sealed and docked with the outer periphery of the fourth through-hole through the telescopic sealing sleeve; the inner wall of the chamber body, the outer wall of the telescopic sealing sleeve, the inner wall of the sleeve body, the bracket, and the shell of the rotating conductive component form a sealed cavity.

[0017] At least one of the above technical solutions adopted in the embodiments of the present application can achieve the following beneficial effects:

[0018] In the embodiments of the present application, a pedestal is used to support a wafer. A heater embedded in the pedestal heats the wafer to a temperature that meets process requirements. This method of heating the wafer with a heater embedded in the pedestal offers better temperature control than heating the wafer by irradiating the pedestal with a heating lamp.

[0019] In addition, the linear drive assembly can drive the base to rise and fall, the rotary drive assembly can drive the base to rotate along with the support shaft through the magnetic coupler, and the RF power supply can provide RF current to the RF electrode, so that the function of the semiconductor process chamber equipped with the carrier device can better meet the process requirements.

[0020] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are only some embodiments recorded in this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0022] Figure 1 A schematic diagram of a semiconductor process chamber equipped with a carrier device provided in an embodiment of the present application;

[0023] Figure 2 for Figure 1 A partial schematic diagram of the carrying device is shown in FIG.

[0024] Description of reference numerals:

[0025] 1-Semiconductor process chamber;

[0026] 10-carrying device;

[0027] 11- linear drive assembly; 111- bracket; 1111- fifth through-hole; 112- sleeve body;

[0028] 121-support shaft; 121a-inner shaft; 1211-first through-hole; 1212-second through-hole; 1213-third through-hole; 121b-outer shaft; 122-base;

[0029] 13- heater; 131- first conductive member; 132- second conductive member;

[0030] 14-RF electrode; 141-third conductive member;

[0031] 15-rotating conductive component; 151-housing; 152-follower; 153-fourth conductive member; 153a-first sub-conductive member; 153b-second sub-conductive member; 153c-third sub-conductive member; 154-fifth conductive member; 154a-fourth sub-conductive member; 1541a-first feedthrough member; 1542a-first conductive brush; 154b-fifth sub-conductive member; 1541b-second feedthrough member; 1542b-second conductive brush; 154c-sixth sub-conductive member; 1541c-third feedthrough member; 1542c-third conductive brush;

[0032] 161-magnetic coupler; 162-rotation drive assembly; 1611-first magnetic ring; 1612-second magnetic ring;

[0033] 21-heating power supply; 22-RF power supply;

[0034] 30-chamber body; 30a-accommodation cavity; 30b-fourth through hole;

[0035] 40-Telescopic sealing sleeve. DETAILED DESCRIPTION

[0036] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0037] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0038] In addition, although the terms used in this application are selected from well-known and commonly used terms, some terms mentioned in the specification of this application may be selected by the applicant at his or her discretion, and their detailed meanings are explained in the relevant parts of the description of this article.

[0039] Furthermore, it is required that the application be understood not only by the actual terms used but also by the meanings connoted by each term.

[0040] The following describes in detail the technical solutions provided by various embodiments of the present application in conjunction with the accompanying drawings.

[0041] The embodiment of the present application provides a carrying device. Figure 1 and Figure 2 The carrier device 10 provided in the embodiment of the present application is applied to a semiconductor process chamber 1. The carrier device 10 includes: a linear drive assembly 11, a bracket 111, a sleeve 112, a support shaft 121, a base 122, a heater 13, a radio frequency electrode 14, a rotating conductive assembly 15, a magnetic coupler 161, and a rotating drive assembly 162.

[0042] The linear drive assembly 11 is drivingly connected to the bracket 111, the housing 112 is connected to the bracket 111, the support shaft 121 is rotatably supported within the housing 112, and the base 122 is supported by the support shaft 121. The linear drive assembly 11 is used to drive the base 122 to rise and fall. Specifically, the linear drive assembly 11 drives the base 122, which is supported by the support shaft 121, to rise and fall via the bracket 111, the housing 112, and the support shaft 121. In other words, the bracket 111, the housing 112, the support shaft 121, and the base 122 are synchronously raised and lowered under the drive of the linear drive assembly 11.

[0043] The heater 13 and the RF electrode 14 are respectively embedded in the base 122. The heater 13 is connected to the heating power supply 21 via the rotating conductive component 15, and the RF electrode 14 is connected to the RF power supply 22 via the rotating conductive component 15. The rotation drive component 162 is used to drive the support shaft 121 to rotate via the magnetic coupler 161.

[0044] In this way, in the embodiments of the present application, the susceptor 122 is used to carry the wafer. The heater 13 embedded in the susceptor 122 can heat the wafer so that the temperature of the wafer meets the process requirements. The way that the heater 13 embedded in the susceptor 122 heats the wafer has the characteristic that the temperature control effect is better than the way that the wafer is heated by irradiating the susceptor with a heating lamp.

[0045] In addition, the linear drive assembly 11 can drive the susceptor 122 to ascend and descend, the rotary drive assembly 162 can drive the susceptor 122 to rotate with the support shaft 121 through the magnetic coupler 161, and the radio frequency power supply 22 can provide the radio frequency electrode 14 with radio frequency current, so that the function of the semiconductor process chamber 1 provided with the carrying device 10 can better meet the process requirements.

[0046] In some embodiments, the susceptor 122 can be made of ceramic materials such as aluminum nitride (ALN), aluminum oxide (AL2O3), silicon carbide (SiC), etc. For example, the heater 13 and the radio frequency electrode 14 can be sintered in the susceptor 122 in the process of sintering the susceptor 122. The material of the heater 13 and the radio frequency electrode 14 can be made of metal materials such as molybdenum (Mo), silver (Ag), platinum (Pt), etc. The susceptor 122 can be used at a maximum of 500 degrees Celsius. The susceptor 122 can be a ceramic heater or an electrostatic chuck with heating function.

[0047] In some embodiments, the carrying device 10 further comprises a first conductive member 131 and a second conductive member 132. The first conductive member 131 and the second conductive member 132 are respectively arranged on the support shaft 121, and extend from the end of the support shaft 121 facing the susceptor 122 to the end of the support shaft 121 away from the susceptor 122. The first connecting portion of the heater 13 is electrically connected to the rotary conductive assembly 15 through the first conductive member 131, and the second connecting portion of the heater 13 is electrically connected to the rotary conductive assembly 15 through the second conductive member 132. The rotary conductive assembly 15 is connected to the heating power supply 21, so that the first connecting portion and the second connecting portion of the heater 13 can be respectively connected to the heating power supply 21 through the first conductive member 131, the second conductive member 132 and the rotary conductive assembly 15, thereby forming a power supply loop for supplying power from the heating power supply 21 to the heater 13.

[0048] In some embodiments, the carrying device 10 further comprises a third conductive member 141. The third conductive member 141 is arranged on the support shaft 121, and extends from the end of the support shaft 121 facing the susceptor 122 to the end of the support shaft 121 away from the susceptor 122. The radio frequency electrode 14 is electrically connected to the rotary conductive assembly 15 through the third conductive member 141. Further, the rotary conductive assembly 15 is electrically connected to the radio frequency power supply 22. In this way, the radio frequency power supply 22 can provide the radio frequency electrode 14 with radio frequency current through the rotary conductive assembly 15 and the third conductive member 141.

[0049] In some embodiments, the support shaft 121 is provided with a first through hole 1211, a second through hole 1212 and a third through hole 1213 extending along the axial direction of the support shaft 121. The first conductive member 131 is threaded through the first through hole 1211, the second conductive member 132 is threaded through the second through hole 1212, and the third conductive member 141 is threaded through the third through hole 1213. In this way, the arrangement of the conductive members can be facilitated by threading the first conductive member 131, the second conductive member 132 and the third conductive member 141 through the through holes of the support shaft 121, respectively.

[0050] In some embodiments, the support shaft 121 comprises an inner shaft 121a and an outer shaft 121b. Exemplarily, the inner shaft 121a and the outer shaft 121b can be connected by a threaded connection. The inner shaft 121a is an insulating shaft, and the first through hole 1211, the second through hole 1212 and the third through hole 1213 are all provided in the inner shaft 121a. Exemplarily, the inner shaft 121a can be a ceramic shaft. For example, the ceramic shaft can be made of alumina, zirconia or aluminum nitride. The outer shaft 121b can be a metal shaft. For example, the metal shaft can be made of stainless steel. Exemplarily, the first conductive member 131, the second conductive member 132 and the third conductive member 141 are all made of metal materials, for example, all of them are copper columns (or copper wires). The first through hole 1211, the second through hole 1212 and the third through hole 1213 are all provided in the inner shaft 121a, and the first conductive member 131, the second conductive member 132 and the third conductive member 141 are threaded through the corresponding through holes, respectively. In this way, by making the inner shaft 121a an insulating shaft, the first conductive member 131, the second conductive member 132 and the third conductive member 141 can be prevented from short-circuiting.

[0051] Of course, in other embodiments, in the case where the inner shaft 121a is not an insulating shaft, an insulating material layer can be provided on the outer periphery of the first conductive member 131, the second conductive member 132 and the third conductive member 141 to prevent the first conductive member 131, the second conductive member 132 and the third conductive member 141 from short-circuiting.

[0052] In some embodiments, the rotating conductive assembly 15 includes a housing 151, a follower 152, a plurality of fourth conductive members 153, and a plurality of fifth conductive members 154. The housing 151 is connected to the bracket 111, and the follower 152 is sleeved within the housing 151. The follower 152 is coaxially connected to the support shaft 121. The plurality of fourth conductive members 153 are spaced apart on the follower 152 along the axis of the support shaft 121, and the fifth conductive members 154 are electrically connected to the fourth conductive members 153 in a one-to-one correspondence. The plurality of fifth conductive members 154 are disposed in the housing 151. The first conductive member 131 and the second conductive member 132 are electrically connected to the heating power source 21 via the fourth conductive member 153 and the corresponding fifth conductive member 154. The third conductive member 141 is electrically connected to the RF power source 22 via the fourth conductive member 153 and the corresponding fifth conductive member 154.

[0053] Exemplarily, the follower 152 is an insulator. For example, the follower 152 is a ceramic insulator. The material of the ceramic insulator can be aluminum oxide or zirconium oxide. Each fourth conductive member 153 is embedded in the follower 152. Figure 1 The number of fourth conductive members 153 is three. From top to bottom, the three fourth conductive members 153 are a first sub-conductive member 153a, a second sub-conductive member 153b, and a third sub-conductive member 153c. For example, the outer peripheries of the first sub-conductive member 153a, the second sub-conductive member 153b, and the third sub-conductive member 153c are each provided with a conductive cylindrical surface.

[0054] There are three fifth conductive members 154. From top to bottom, the three fifth conductive members 154 are the fourth sub-conductive member 154a, the fifth sub-conductive member 154b, and the sixth sub-conductive member 154c. The fourth sub-conductive member 154a is electrically connected to the first sub-conductive member 153a, the fifth sub-conductive member 154b is electrically connected to the second sub-conductive member 153b, and the sixth sub-conductive member 154c is electrically connected to the third sub-conductive member 153c. During the synchronous rotation of the follower 152 along with the support shaft 121, the fourth conductive members 153 maintain a one-to-one electrical connection with the fifth conductive members 154.

[0055] Furthermore, illustratively, the first connection portion of the heater 13 is electrically connected to the first sub-conductor 153a via the first conductive member 131, the first sub-conductor 153a is electrically connected to the fourth sub-conductor 154a, and the fourth sub-conductor 154a is electrically connected to the heating power source 21. The second connection portion of the heater 13 is electrically connected to the third sub-conductor 153c via the second conductive member 132, the third sub-conductor 153c is electrically connected to the sixth sub-conductor 154c, and the sixth sub-conductor 154c is electrically connected to the heating power source 21. The RF electrode 14 is electrically connected to the second sub-conductor 153b via the third conductive member 141, the second sub-conductor 153b is electrically connected to the fifth sub-conductor 154b, and the fifth sub-conductor 154b is electrically connected to the RF power source 22.

[0056] Exemplarily, the first sub-conductive member 153a, the second sub-conductive member 153b and the third sub-conductive member 153c may be conductive slides, and the outer surface of the conductive slides is a cylindrical surface. Thus, the outer surface of the conductive slides forms the conductive cylindrical surface described above.

[0057] The conductive slide is fixed to the follower 152 and can rotate with the follower 152. The conductive slide can adjust its conductivity by changing its width as needed. The wider the width, the stronger the conductivity. The conductive slide can be made of a metal with good conductivity, such as copper. The surface of the conductive slide can be plated with gold or other wear-resistant metal as needed.

[0058] The fourth sub-conductive member 154a includes a first feedthrough 1541a and a first conductive brush 1542a. The fifth sub-conductive member 154b includes a second feedthrough 1541b and a second conductive brush 1542b. The sixth sub-conductive member 154c includes a third feedthrough 1541c and a third conductive brush 1542c. The first, second, and third feedthroughs 1541a, 1541b, and 1541c are disposed through the housing 151. The first, second, and third feedthroughs 1541a, 1541b, and 1541c are both conductive and sealed, and can also be insulated from the sealed housing, thereby achieving electrical continuity between the vacuum side of the conductive slip ring and the atmospheric side.

[0059] Each conductive brush can be made of a wear-resistant alloy material with excellent electrical conductivity. The brushes are connected to the conductive portion of the feedthrough, and the number of brushes can be increased as needed; a greater number of brushes provides greater electrical conductivity. The brushes are tangential to the outer circumference of the conductive slideway, creating elastic contact and achieving electrical conduction. During operation, the follower 152 rotates with the fourth conductive member 153. The housing 151, feedthrough, and conductive brushes are stationary, while the brushes slide on the outer circumference of the conductive slideway, achieving rotational conduction.

[0060] In some embodiments, the support shaft 121 is rotatably connected to the housing 112 via first and second bearings spaced apart. The first and second bearings may be metal bearings. If the first and second bearings are metal bearings, they may be degreased and dry-ground using ball bearings to prevent vacuum degassing. Of course, in other embodiments, ceramic bearings may also be used for the first and second bearings.

[0061] In some embodiments, the follower 152 can be rotatably connected to the housing 151 via third and fourth bearings. For example, the third and fourth bearings can be metal bearings. If the third and fourth bearings are metal bearings, they can be degreased and dry-ground using balls to prevent vacuum degassing. Of course, in other embodiments, ceramic bearings can also be used for the third and fourth bearings.

[0062] In some embodiments, the bracket 111 is provided with a fifth through-hole 1111. The support shaft 121 is provided through the fifth through-hole 1111. The sleeve 112 is located on the side of the bracket 111 facing the base 122, and the end of the sleeve 112 facing away from the base 122 is sealedly docked with the outer periphery of the fifth through-hole 1111. The housing 151 is provided on the side of the bracket 111 facing away from the base 122, and the end of the housing 151 facing the base 122 is sealedly docked with the outer periphery of the fifth through-hole 1111. In this way, the housing 151 and the sleeve 112 can be used to cover the support shaft 121 and the follower 152, thereby facilitating sealing when the carrier 10 is placed in the chamber body 30 of the semiconductor process chamber 1.

[0063] In some embodiments, the magnetic coupler 161 includes a first magnetic ring 1611 and a second magnetic ring 1612. The first magnetic ring 1611 is sleeved around and connected to the support shaft 121. The second magnetic ring 1612 is disposed outside the housing 112 and sleeved around the first magnetic ring 1611. The rotation drive assembly 162 is configured to rotate the second magnetic ring 1612, thereby driving the support shaft 121 to rotate along with the first magnetic ring 1611.

[0064] It should be noted that a magnetic coupling is also called a magnetic coupling or a permanent magnet transmission device. The magnetic coupling 161 can transmit torque through the magnetic field between the first magnetic ring 1611 and the second magnetic ring 1612. For example, the first magnetic ring 1611 is provided with magnets with alternating magnetic poles distributed circumferentially around the first magnetic ring 1611, and the second magnetic ring 1612 is provided with magnets with alternating magnetic poles distributed circumferentially around the second magnetic ring 1612. During the rotation of the second magnetic ring 1612, based on the principle of attraction between opposite magnetic poles, the first magnetic ring 1611 can be driven to rotate.

[0065] Thus, combined Figure 1 When the rotation drive assembly 162 drives the second magnetic ring 1612 to rotate around the axis of the support shaft 121, the second magnetic ring 1612 can drive the first magnetic ring 1611 to rotate. Furthermore, the first magnetic ring 1611 can drive the support shaft 121 and the base 122 to rotate.

[0066] In some embodiments, the rotary driving assembly 162 can include a rotary motor and a transmission mechanism. For example, the transmission mechanism includes a transmission belt. The transmission belt is connected with a belt wheel on the output shaft of the rotary motor, and is also connected with the second magnetic ring 1612, so that the power of the output shaft of the rotary motor can be transmitted to the second magnetic ring 1612 by the transmission belt. For example, the transmission mechanism includes a gear, so that the power of the output shaft of the rotary motor can be transmitted to the second magnetic ring 1612 by the principle of gear transmission.

[0067] It should be noted that, in order to improve the maintenance convenience of the magnetic coupling 161, in some embodiments, the sleeve 112 includes an upper sleeve and a lower sleeve. In other words, the sleeve 112 is spliced by the upper sleeve and the lower sleeve. The lower sleeve is sleeved outside the first magnetic ring 1611, and the second magnetic ring 1612 is sleeved outside the lower sleeve. Therefore, during the maintenance of the magnetic coupling 161, only the lower sleeve needs to be disassembled, and the sleeve 112 does not need to be disassembled as a whole.

[0068] In some embodiments, a first sealing ring is clamped between the upper sleeve and the lower sleeve. A second sealing ring is clamped between the lower sleeve and the support 111. A third sealing ring is clamped between the support 111 and the housing 151. In addition, the sleeve 112 can be a metal sleeve, for example, the sleeve 112 is made of stainless steel.

[0069] In some embodiments, the linear driving assembly 11 is a linear motor, a hydraulic cylinder, etc. Alternatively, the linear driving assembly 11 includes a rotary driving element and a ball screw transmission mechanism, etc. which can convert rotary motion into linear motion. For example, the rotary driving element is a rotary motor. The main body part of the linear driving assembly 11 can be connected with the outer wall of the chamber body 30 of the semiconductor process chamber 1.

[0070] The embodiments of the present application also provide a semiconductor process chamber. Referring to Figure 1 The semiconductor process chamber 1 provided by the embodiments of the present application includes: a chamber body 30 and any one of the bearing devices 10 provided by the embodiments of the present application. The chamber body 30 is provided with a receiving cavity 30a, the susceptor 122 is arranged in the receiving cavity 30a, and the linear driving assembly 11 is installed outside the chamber body 30.

[0071] In some embodiments, the semiconductor process chamber 1 further includes a telescopic sealing sleeve 40. The chamber body 30 is further provided with a fourth through hole 30b in communication with the receiving cavity 30a, and the sleeve 112 is sleeved in the fourth through hole 30b. The telescopic sealing sleeve 40 is sleeved outside the sleeve 112, and one end of the sleeve 112 located in the receiving cavity 30a is sealingly connected with the outer periphery of the fourth through hole 30b through the telescopic sealing sleeve 40. The inner wall of the chamber body 30, the outer wall of the telescopic sealing sleeve 40, the inner wall of the sleeve 112, the support 111 and the housing 151 of the rotary conductive assembly 15 surround a sealed cavity.

[0072] Exemplarily, the telescopic sealing sleeve 40 is a bellows. The bellows is sealingly connected to the top end of the sleeve body 112 at one end and sealingly connected to the outer periphery of the fourth through hole 30b of the chamber body 30 at the other end. In this way, the sealing cavity can be formed by the telescopic sealing sleeve 40, the sleeve body 112, the hole wall of the fifth through hole 1111 of the bracket 111, and the shell 151. Thus, the sealing cavity is separated from the outside environment during the semiconductor process.

[0073] Exemplarily, the side of the bellows facing the top end of the sleeve body 112 can be welded to the top end of the sleeve body 112. The side of the bellows facing away from the top end of the sleeve body 112 can be welded with a flange. For example, the flange is a stainless steel flange. The flange is in abutment with the outer periphery of the fourth through hole 30b. The fourth sealing ring is clamped between the flange and the outer periphery of the fourth through hole 30b.

[0074] In some embodiments, the semiconductor process chamber 1 is a physical vapor deposition (PVD) chamber. During the process, the inside of the chamber body 30 needs to be maintained in a high vacuum state. The first sealing ring, the second sealing ring, the third sealing ring, and the fourth sealing ring have good sealing effect, so that the pressure in the sealing cavity formed by the inner wall of the chamber body 30, the outer wall of the telescopic sealing sleeve 40, the inner wall of the sleeve body 112, the bracket 111, and the shell 151 of the rotating conductive assembly 15 can reach a sealing effect of less than 10E-7 Torr.

[0075] During the process, the outside of the bellows is in a vacuum state, and the atmosphere state exists between the bellows and the sleeve body 112. The fourth sealing ring between the bellows and the outer periphery of the fourth through hole 30b isolates the atmosphere and the vacuum. The sleeve body 112 includes an upper sleeve body and a lower sleeve body, and the first sealing ring is clamped between the upper sleeve body and the lower sleeve body. The second sealing ring is clamped between the lower sleeve body and the bracket 111, and the third sealing ring is clamped between the bracket 111 and the shell 151. The first sealing ring, the second sealing ring, and the third sealing ring can be used to isolate the atmosphere and the vacuum. The sealing structures of the base 122 are all static seals, which are not interfered by external magnetic field and electric field, and the sealing effect is more reliable.

[0076] It should be noted that the relational terms herein such as first and second, and the like, are used solely to distinguish one entity or action from another, without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0077] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the embodiments of the present application, and the scope of the embodiments of the present application is defined by the appended claims and their equivalents.

Claims

1. A carrier device (10), used in a semiconductor process chamber (1), characterized in that: The carrying device (10) comprises: a linear drive component (11), a bracket (111), a sleeve (112), a support shaft (121), a base (122), a heater (13), a radio frequency electrode (14), a rotating conductive component (15), a magnetic coupler (161) and a rotating drive component (162); The linear drive assembly (11) is drivably connected to the bracket (111), the sleeve (112) is connected to the bracket (111), the support shaft (121) is rotatably supported in the sleeve (112), the base (122) is supported on the support shaft (121), and the linear drive assembly (11) is used to drive the base (122) to rise and fall; The heater (13) and the radio frequency electrode (14) are respectively embedded in the base (122); the heater (13) is connected to a heating power source (21) via the rotating conductive component (15); and the radio frequency electrode (14) is connected to a radio frequency power source (22) via the rotating conductive component (15); The rotary drive assembly (162) is used to drive the support shaft (121) to rotate via the magnetic coupler (161).

2. The carrying device (10) according to claim 1, characterized in that The carrying device (10) further comprises a first conductive member (131) and a second conductive member (132), wherein the first conductive member (131) and the second conductive member (132) are respectively arranged on the support shaft (121), and the first conductive member (131) and the second conductive member (132) respectively extend along one end of the support shaft (121) facing the base (122) to one end facing away from the base (122); The first connection portion of the heater (13) is electrically connected to the rotating conductive component (15) via the first conductive member (131), and the second connection portion of the heater (13) is electrically connected to the rotating conductive component (15) via the second conductive member (132).

3. The carrying device (10) according to claim 2, characterized in that: The carrying device (10) further includes a third conductive member (141), the third conductive member (141) being provided on the support shaft (121), and the third conductive member (141) extending along one end of the support shaft (121) facing the base (122) to one end facing away from the base (122); the radio frequency electrode (14) is electrically connected to the rotating conductive component (15) via the third conductive member (141).

4. The carrying device (10) according to claim 3, characterized in that The support shaft (121) is provided with a first through hole (1211), a second through hole (1212), and a third through hole (1213) extending along its own axial direction; The first conductive member (131) is disposed through the first through-hole (1211), the second conductive member (132) is disposed through the second through-hole (1212), and the third conductive member (141) is disposed through the third through-hole (1213).

5. The carrying device (10) according to claim 4, characterized in that: The support shaft (121) comprises an inner shaft (121a) and an outer shaft (121b); the inner shaft (121a) is an insulating shaft; the first through-hole (1211), the second through-hole (1212), and the third through-hole (1213) are all provided on the inner shaft (121a).

6. The carrying device (10) according to claim 3, characterized in that The rotating conductive component (15) comprises a housing (151), a follower (152), a plurality of fourth conductive members (153), and a plurality of fifth conductive members (154); The housing (151) is connected to the bracket (111), the follower (152) is sleeved in the housing (151), and the follower (152) is coaxially connected to the support shaft (121); A plurality of fourth conductive members (153) are spaced apart and arranged on the follower (152) along the axial direction of the support shaft (121); and the fifth conductive members (154) are electrically contacted and connected with the fourth conductive members (153) in a one-to-one correspondence; A plurality of the fifth conductive members (154) are provided on the housing (151), and the first conductive member (131) and the second conductive member (132) are electrically connected to the heating power source (21) via the fourth conductive member (153) and the corresponding fifth conductive member (154); The third conductive member (141) is electrically connected to the radio frequency power source (22) via the fourth conductive member (153) and the fifth conductive member (154) connected thereto.

7. The carrying device (10) according to claim 6, characterized in that The bracket (111) is provided with a fifth through-hole (1111), the support shaft (121) is passed through the fifth through-hole (1111), the sleeve (112) is located on the side of the bracket (111) facing the base (122), and the end of the sleeve (112) facing away from the base (122) is sealed and docked with the outer periphery of the fifth through-hole (1111), and the shell (151) is provided on the side of the bracket (111) facing away from the base (122), and the end of the shell (151) facing the base (122) is sealed and docked with the outer periphery of the fifth through-hole (1111).

8. The carrying device (10) according to claim 1, characterized in that The magnetic coupler (161) includes a first magnetic ring (1611) and a second magnetic ring (1612), wherein the first magnetic ring (1611) is sleeved outside the support shaft (121) and connected to the support shaft (121), and the second magnetic ring (1612) is arranged outside the sleeve (112) and sleeved outside the first magnetic ring (1611). The rotation drive assembly (162) is used to drive the second magnetic ring (1612) to rotate, so as to drive the support shaft (121) to rotate along with the first magnetic ring (1611).

9. A semiconductor process chamber (1), characterized in that: include: A chamber body (30) and a carrying device (10) as described in any one of claims 1 to 8; the chamber body (30) is provided with a receiving cavity (30a), the base (122) is provided in the receiving cavity (30a), and the linear drive assembly (11) is installed outside the chamber body (30).

10. The semiconductor process chamber (1) according to claim 9, characterized in that The semiconductor process chamber (1) further comprises a telescopic sealing sleeve (40); the chamber body (30) is further provided with a fourth through-hole (30b) communicating with the accommodating cavity (30a); the sleeve (112) is arranged in the fourth through-hole (30b); the telescopic sealing sleeve (40) is sleeved outside the sleeve (112); one end of the sleeve (112) located in the accommodating cavity (30a) is sealed and docked with the outer periphery of the fourth through-hole (30b) via the telescopic sealing sleeve (40); The inner wall of the chamber body (30), the outer wall of the telescopic sealing sleeve (40), the inner wall of the sleeve body (112), the bracket (111), and the housing (151) of the rotating conductive component (15) form a sealed cavity.

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