High-efficiency eutectic machine

Abstract

The utility model discloses a high-efficiency eutectic machine which comprises an eutectic table, feeding modules and a substrate transfer module, and the feeding modules are arranged on the two sides of the eutectic table in the X-axis direction respectively. The feeding module comprises a blue film tensioning assembly, a first material taking mechanism, a correcting assembly and a second material taking mechanism. The first material taking mechanism comprises a material taking swing arm and a first crystal taking welding head arranged on the material taking swing arm, and the material taking swing arm swings between the blue film tensioning assembly and the correction assembly in a reciprocating mode; the second material taking mechanism is used for taking and placing the substrate or the wafer on the correction assembly to the eutectic table; the substrate transfer module is installed on the rack and used for feeding the substrate to the eutectic platform and grabbing and discharging the eutectic product on the eutectic platform. According to the high-efficiency eutectic machine, the substrate transfer module is used for grabbing and discharging eutectic products, meanwhile, the feeding module takes and places other substrates or wafers on the eutectic table from the blue film tensioning assembly so as to facilitate secondary eutectic, and the working efficiency of the eutectic process is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chips, in particular to a high-efficiency eutectic machine. Background Art

[0002] Eutectic bonding refers to the fusion of eutectic materials within eutectic solder. It is a process that creates a highly thermally and electrically conductive bond, often required for the densely packed circuits found in today's chips. It is a highly controlled chip placement process suitable for devices requiring high reliability and precision. Eutectic soldering technology is widely used in the electronics packaging industry for applications such as chip-to-substrate bonding, substrate-to-casing bonding, and capping. Compared to traditional epoxy conductive adhesive bonding, eutectic soldering offers advantages such as high thermal conductivity, low resistance, rapid heat transfer, enhanced reliability, and high post-bonding shear strength. It is therefore well-suited for chip-to-substrate and substrate-to-casing interconnects in high-frequency, high-power devices.

[0003] The existing eutectic machine needs to take the finished product back to the thermal layer blue film after bonding the chip, heat sink substrate and base plate, and then pick up the heat sink substrate from the thermal layer blue film again for the next eutectic process, which is not conducive to improving production efficiency. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a high-efficiency eutectic machine.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is: a high-efficiency eutectic machine, comprising a frame and a eutectic table, a feeding module and a substrate transfer module installed on the frame, wherein the feeding modules are respectively provided on both sides of the eutectic table along the X-axis direction; the feeding module comprises a blue film tensioning assembly, a first feeding mechanism, a correction assembly and a second feeding mechanism; the first feeding mechanism comprises a feeding swing arm and a first crystal taking welding head arranged on the feeding swing arm, and the feeding swing arm swings back and forth between the blue film tensioning assembly and the correction assembly; the second feeding mechanism comprises a first X-axis drive mechanism, a first Z-axis drive mechanism and a second crystal taking welding head, the first X-axis drive mechanism is arranged between the correction assembly and the eutectic table, the first X-axis drive mechanism is driven and connected to the first Z-axis drive mechanism, and the first Z-axis drive mechanism is driven and connected to the second crystal taking welding head; the substrate transfer module is installed on the frame and is used to load the substrate onto the eutectic table and to grab and unload the eutectic completed products of the eutectic platform.

[0006] Furthermore, the first material picking mechanism also includes a second Z-axis drive mechanism and a first rotation drive mechanism, and the second Z-axis drive mechanism and the first rotation drive mechanism are respectively connected to the material picking swing arm.

[0007] Further, the correction assembly comprises a correction table, a second X-axis driving mechanism, a first Y-axis driving mechanism and a correction identification camera, the second X-axis driving mechanism and the first Y-axis driving mechanism are respectively in driving connection with the correction table, and the correction identification camera is arranged above the correction table.

[0008] Further, the correction assembly further comprises a second rotary driving mechanism, and the second rotary driving mechanism is in driving connection with the correction table.

[0009] Further, the feeding module further comprises a wafer taking identification camera, and the wafer taking identification camera is arranged above the blue film tensioning assembly.

[0010] Further, a eutectic identification camera is further arranged above the eutectic table.

[0011] Further, a downward-looking identification camera is further arranged on the side of the correction assembly.

[0012] Further, the substrate transfer module comprises a receiving box, a second Y-axis driving mechanism, a third Z-axis driving mechanism and a third wafer taking welding head, the second Y-axis driving mechanism is arranged between the receiving box and the eutectic table, the second Y-axis driving mechanism is in driving connection with the third Z-axis driving mechanism, and the third wafer taking welding head is in driving connection with the third Z-axis driving mechanism.

[0013] Further, the substrate transfer module further comprises a third X-axis driving mechanism, and the third X-axis driving mechanism is in driving connection with the receiving box.

[0014] Further, a plurality of mounting tables are arranged on the third X-axis driving mechanism, and the receiving box is detachably mounted on the mounting tables.

[0015] The high-efficiency eutectic machine of the utility model has the beneficial effects that the feeding module of the high-efficiency eutectic machine is used to take and place a substrate or a wafer from a blue film tensioning assembly to a eutectic table, after the substrate and the wafer are bonded, the substrate transfer module takes down the eutectic completed product, at the same time, the feeding module takes and places another substrate or wafer from the blue film tensioning assembly to the eutectic table so as to eutectic again, and the working efficiency of the eutectic process is effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a whole structure schematic view of the high-efficiency eutectic machine of the utility model embodiment one.

[0017] Figure 2 It is a partial structure schematic view of the high-efficiency eutectic machine of the utility model embodiment one.

[0018] Label explanation:

[0019] 1, rack;

[0020] 2. Eutectic stage; 21. Eutectic recognition camera;

[0021] 3. Substrate transfer module; 31. Material receiving box; 32. Second Y-axis drive mechanism; 33. Third Z-axis drive mechanism; 34. Third wafer extraction welding head; 35. Third X-axis drive mechanism; 36. Mounting table;

[0022] 4. Blue film tensioning assembly; 41. Crystal retrieval and recognition camera;

[0023] 5. First material taking mechanism; 51. Material taking swing arm; 52. First crystal taking welding head; 53. Second Z-axis driving mechanism; 54. First rotation driving mechanism;

[0024] 6. Calibration assembly; 61. Calibration platform; 62. Second X-axis drive mechanism; 63. First Y-axis drive mechanism; 64. Calibration recognition camera; 65. Second rotation drive mechanism; 66. Upward-looking recognition camera;

[0025] 7. Second material taking mechanism; 71. First X-axis driving mechanism; 72. First Z-axis driving mechanism; 73. Second crystal taking welding head. DETAILED DESCRIPTION

[0026] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following description is given in conjunction with the embodiments and the accompanying drawings.

[0027] Please refer to Figure 1 and Figure 2 A high-efficiency eutectic machine comprises a frame 1 and a eutectic table 2, a feeding module and a substrate transfer module 3 installed on the frame 1, wherein the feeding modules are respectively provided on both sides of the eutectic table 2 along the X-axis direction; the feeding module comprises a blue film tensioning component 4, a first material picking mechanism 5, a correction component 6 and a second material picking mechanism 7; the first material picking mechanism 5 comprises a material picking swing arm 51 and a first crystal picking welding head 52 provided on the material picking swing arm 51, and the material picking swing arm 51 swings back and forth between the blue film tensioning component 4 and the correction component 6; the first material picking mechanism 5 comprises a material picking swing arm 51 and a first crystal picking welding head 52 provided on the material picking swing arm 51; the material picking swing arm 51 swings back and forth between the blue film tensioning component 4 and the correction component 6; the first material picking mechanism 5 comprises a material picking swing arm 51 and a first crystal picking welding head 52 provided on the material picking swing arm 51; the first ... mechanism 5 comprises a material picking swing arm 51 and a first crystal picking welding head 52 The second material-taking mechanism 7 includes a first X-axis drive mechanism 71, a first Z-axis drive mechanism 72 and a second crystal-taking welding head 73. The first X-axis drive mechanism 71 is arranged between the correction component 6 and the eutectic table 2. The first X-axis drive mechanism 71 is driven and connected to the first Z-axis drive mechanism 72. The first Z-axis drive mechanism 72 is driven and connected to the second crystal-taking welding head 73. The substrate transfer module 3 is installed on the frame 1 and is used to load the substrate to the eutectic table 2 and to grab and unload the eutectic finished products on the eutectic platform.

[0028] From the above description, it can be seen that the beneficial effect of the present invention is that: the feeding module of this high-efficiency eutectic machine is used to take and place the substrate or chip from the blue film tensioning assembly 4 to the eutectic table 2. After the substrate and the chip are bonded, the substrate transfer module 3 grabs and unloads the eutectic completed product. At the same time, the feeding module takes and places another substrate or chip from the blue film tensioning assembly 4 to the eutectic table 2 for eutecticization again, which effectively improves the working efficiency of the eutectic process.

[0029] Furthermore, the first material picking mechanism 5 also includes a second Z-axis driving mechanism 53 and a first rotation driving mechanism 54 , and the second Z-axis driving mechanism 53 and the first rotation driving mechanism 54 are respectively driven and connected to the material picking swing arm 51 .

[0030] It can be seen from the above description that the second Z-axis driving mechanism 53 is used to drive the material-taking swing arm 51 to rise and fall, and the first rotary driving mechanism 54 is used to drive the material-taking swing arm 51 to swing.

[0031] Furthermore, the correction component 6 includes a correction platform 61, a second X-axis drive mechanism 62, a first Y-axis drive mechanism 63 and a correction recognition camera 64, the second X-axis drive mechanism 62 and the first Y-axis drive mechanism 63 are respectively driven and connected to the correction platform 61, and the correction recognition camera 64 is arranged above the correction platform 61.

[0032] As can be seen from the above description, the correction recognition camera 64 is used to identify the position of the chip in real time, and the second X-axis drive mechanism 62 and the first Y-axis drive mechanism 63 are used to drive the correction stage 61 to move along the X-axis and Y-axis directions respectively to correct the position of the chip.

[0033] Furthermore, the calibration assembly 6 further includes a second rotation drive mechanism 65 , which is drivingly connected to the calibration platform 61 .

[0034] As can be seen from the above description, the second rotation drive mechanism 65 is used to drive the correction stage 61 to rotate so as to correct the angle of the wafer.

[0035] Furthermore, the feeding module further includes a crystal retrieval recognition camera 41 , which is disposed above the blue film tensioning assembly 4 .

[0036] As can be seen from the above description, the wafer identification camera 41 is used to identify whether the first wafer welding head 52 is aligned with the wafer or substrate on the blue film tensioning assembly 4 .

[0037] Furthermore, a eutectic recognition camera 21 is included, and the eutectic recognition camera 21 is arranged above the eutectic table 2 .

[0038] As can be seen from the above description, the eutectic recognition camera 21 is used to identify whether the wafer and substrate on the eutectic stage 2 are aligned.

[0039] Furthermore, an upward-looking recognition camera 66 is provided on the side of the correction component 6 .

[0040] As can be seen from the above description, the upward-looking recognition camera 66 is used to identify whether the orientation of the wafer or substrate picked up by the second picking mechanism 7 is correct, and can identify defects in the wafer or substrate.

[0041] Furthermore, the substrate transfer module 3 includes a material receiving box 31, a second Y-axis drive mechanism 32, a third Z-axis drive mechanism 33 and a third crystallization welding head 34. The second Y-axis drive mechanism 32 is arranged between the material receiving box 31 and the eutectic table 2. The second Y-axis drive mechanism 32 is driven and connected to the third Z-axis drive mechanism 33. The third crystallization welding head 34 is driven and connected to the third Z-axis drive mechanism 33.

[0042] As can be seen from the above description, the second Y-axis driving mechanism 32 is used to drive the third crystal extraction welding head 34 to move along the Y-axis direction between the eutectic table 2 and the material receiving box 31, and the third Z-axis driving mechanism 33 is used to drive the third crystal extraction welding head 34 to rise and fall.

[0043] Furthermore, the substrate transfer module 3 further includes a third X-axis driving mechanism 35 , and the third X-axis driving mechanism 35 is drivingly connected to the material receiving box 31 .

[0044] As can be seen from the above description, the third X-axis driving mechanism 35 is used to drive the material receiving box 31 to move along the X-axis direction so that the third crystal extraction welding head 34 can place the eutectic finished product at different positions in the material receiving box 31 .

[0045] Furthermore, a plurality of mounting platforms 36 are provided on the third X-axis driving mechanism 35 , and the material receiving box 31 is detachably mounted on the mounting platforms 36 .

[0046] It can be seen from the above description that when the material receiving box 31 on one of the mounting platforms 36 is full and needs to be removed, the material receiving box 31 on the other mounting platform 36 can be moved to the working position to receive the eutectic finished product.

[0047] Please refer to Figure 1 and Figure 2The first embodiment of the present invention is as follows: a high-efficiency eutectic machine, comprising a frame 1 and a eutectic table 2, a feeding module and a substrate transfer module 3 mounted on the frame 1, wherein the feeding modules are respectively provided on both sides of the eutectic table 2 along the X-axis direction; the feeding module comprises a blue film tensioning assembly 4, a first material picking mechanism 5, a correction assembly 6 and a second material picking mechanism 7; the first material picking mechanism 5 comprises a material picking swing arm 51 and a first crystal picking welding head 52 provided on the material picking swing arm 51, and the material picking swing arm 51 is provided between the blue film tensioning assembly 4 and the correction assembly 6. The second material picking mechanism 7 includes a first X-axis driving mechanism 71, a first Z-axis driving mechanism 72 and a second crystal picking welding head 73. The first X-axis driving mechanism 71 is arranged between the correction component 6 and the eutectic table 2. The first X-axis driving mechanism 71 is driven and connected to the first Z-axis driving mechanism 72. The first Z-axis driving mechanism 72 is driven and connected to the second crystal picking welding head 73. The substrate transfer module 3 is installed on the frame 1 and is used to load the substrate to the eutectic table 2 and to grab and unload the eutectic completed products on the eutectic platform.

[0048] The first material taking mechanism 5 further includes a second Z-axis driving mechanism 53 and a first rotation driving mechanism 54, which are respectively connected to the material taking swing arm 51. The first rotation driving mechanism 54 is a rotary motor.

[0049] The calibration assembly 6 includes a calibration platform 61, a second X-axis drive mechanism 62, a first Y-axis drive mechanism 63, and a calibration recognition camera 64. The second X-axis drive mechanism 62 and the first Y-axis drive mechanism 63 are respectively connected to the calibration platform 61, and the calibration recognition camera 64 is arranged above the calibration platform 61. The second X-axis drive mechanism 62 and the first Y-axis drive mechanism 63 are both linear motor modules, and the calibration recognition camera 64 is a CCD camera.

[0050] The calibration assembly 6 further includes a second rotary drive mechanism 65, which is drivingly connected to the calibration platform 61. The second rotary drive mechanism 65 is a rotary motor.

[0051] The feeding module further includes a crystal identification camera 41, which is disposed above the blue film tensioning assembly 4. The crystal identification camera 41 is a CCD camera.

[0052] The high-efficiency eutectic machine further includes a eutectic recognition camera 21, which is disposed above the eutectic stage 2. The eutectic recognition camera 21 is a CCD camera.

[0053] An upward-looking recognition camera 66 is further provided on the side of the correction component 6 , and the upward-looking recognition camera 66 is a CCD camera.

[0054] The substrate transfer module 3 includes a material receiving box 31, a second Y-axis drive mechanism 32, a third Z-axis drive mechanism 33, and a third crystal extraction welding head 34. The second Y-axis drive mechanism 32 is located between the material receiving box 31 and the eutectic table 2 and is drivingly connected to the third Z-axis drive mechanism 33. The third crystal extraction welding head 34 is drivingly connected to the third Z-axis drive mechanism 33. The second Y-axis drive mechanism 32 is a linear slide module.

[0055] The substrate transfer module 3 further includes a third X-axis drive mechanism 35, which is drivingly connected to the material receiving box 31. The third X-axis drive mechanism 35 is a linear slide module.

[0056] The third X-axis drive mechanism 35 is provided with a plurality of mounting platforms 36, and the material receiving box 31 is detachably mounted on the mounting platforms 36. In this embodiment, the number of the mounting platforms 36 is three. In other embodiments, the number of the mounting platforms 36 can be set to two, four, or more.

[0057] To sum up, the feeding module of the high-efficiency eutectic machine provided by the present invention is used to take and place the substrate or chip from the blue film tensioning assembly to the eutectic table. After the substrate and the chip are bonded, the substrate transfer module grabs and unloads the eutectic product. At the same time, the feeding module takes and places another substrate or chip from the blue film tensioning assembly to the eutectic table for eutecticization again, effectively improving the working efficiency of the eutectic process.

[0058] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent transformations made using the contents of the description and drawings of the present invention, or directly or indirectly applied in the relevant technical field, are also included in the patent protection scope of the present invention.

Claims

1. A high-efficiency eutectic machine, characterized by: The machine comprises a frame and a eutectic table, a feeding module and a substrate transfer module installed on the frame, wherein the feeding modules are respectively provided on both sides of the eutectic table along the X-axis direction; the feeding module comprises a blue film tensioning assembly, a first material picking mechanism, a correction assembly and a second material picking mechanism; the first material picking mechanism comprises a material picking swing arm and a first crystal picking welding head arranged on the material picking swing arm, and the material picking swing arm swings back and forth between the blue film tensioning assembly and the correction assembly; the second material picking mechanism comprises a first X-axis drive mechanism, a first Z-axis drive mechanism and a second crystal picking welding head, the first X-axis drive mechanism is arranged between the correction assembly and the eutectic table, the first X-axis drive mechanism is driven and connected to the first Z-axis drive mechanism, and the first Z-axis drive mechanism is driven and connected to the second crystal picking welding head; the substrate transfer module is installed on the frame and is used to load the substrate onto the eutectic table and to grab and unload the eutectic finished products of the eutectic platform.

2. The high-efficiency eutectic machine according to claim 1, characterized in that: The first material picking mechanism further includes a second Z-axis driving mechanism and a first rotation driving mechanism, and the second Z-axis driving mechanism and the first rotation driving mechanism are respectively connected to the material picking swing arm.

3. The high-efficiency eutectic machine according to claim 1, characterized in that: The correction assembly includes a correction platform, a second X-axis drive mechanism, a first Y-axis drive mechanism and a correction recognition camera. The second X-axis drive mechanism and the first Y-axis drive mechanism are respectively driven and connected to the correction platform. The correction recognition camera is arranged above the correction platform.

4. The high-efficiency eutectic machine according to claim 3, characterized in that: The correction assembly further includes a second rotation drive mechanism, which is drivingly connected to the correction platform.

5. The high-efficiency eutectic machine according to claim 1, characterized in that: The feeding module further includes a crystal retrieval identification camera, which is arranged above the blue film tensioning assembly.

6. The high-efficiency eutectic machine according to claim 1, characterized in that: It also includes a eutectic recognition camera, which is arranged above the eutectic stage.

7. The high-efficiency eutectic machine according to claim 1, characterized in that: An upward-looking recognition camera is also provided on the side of the correction component.

8. The high-efficiency eutectic machine according to claim 1, characterized in that: The substrate transfer module includes a material receiving box, a second Y-axis drive mechanism, a third Z-axis drive mechanism and a third crystal extraction welding head. The second Y-axis drive mechanism is arranged between the material receiving box and the eutectic table. The second Y-axis drive mechanism is driven and connected to the third Z-axis drive mechanism. The third crystal extraction welding head is driven and connected to the third Z-axis drive mechanism.

9. The high-efficiency eutectic machine according to claim 8, characterized in that: The substrate transfer module further includes a third X-axis drive mechanism, and the third X-axis drive mechanism is drivingly connected to the material receiving box.

10. The high-efficiency eutectic machine according to claim 9, characterized in that: The third X-axis driving mechanism is provided with a plurality of mounting platforms, and the material receiving box is detachably mounted on the mounting platforms.

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