Wafer tray centering device and wafer production equipment

Abstract

The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer tray centering device and wafer production equipment. The wafer tray centering device comprises a vacuum chamber, a first positioning push rod, a second positioning push rod and a third positioning push rod, a supporting frame for supporting a wafer tray is arranged in the vacuum chamber, and the first positioning push rod, the second positioning push rod and the third positioning push rod extend into the vacuum chamber. The first positioning push rod is driven by the first driving part to move in the direction close to or away from the wafer tray, the second positioning push rod is driven by the second driving part to move in the direction close to or away from the wafer tray, and the third positioning push rod is driven by the third driving part to move in the direction close to or away from the wafer tray. The first positioning push rod, the second positioning push rod and the third positioning push rod are circumferentially arranged around the wafer tray. The wafer production equipment comprises the wafer tray centering device. According to the utility model, the wafer tray can be centered in a vacuum environment.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer tray centering device and wafer production equipment. Background Art

[0002] In the automated semiconductor production process, wafer handling is a common process throughout the production process. Using robotic arms to transfer wafers is particularly common. However, due to the long arms of robotic arms, mechanical vibrations are inevitable during wafer handling. This vibration is transmitted to the wafer tray, causing it to shift in position and deviate from its center position. This wafer tray offset can affect the processing accuracy of the wafers it carries.

[0003] While vacuum chucks can be used in atmospheric conditions to prevent the wafer tray from shifting due to mechanical vibration, this cannot be achieved in a vacuum environment. Therefore, centering the wafer tray in a vacuum environment is currently difficult, impacting wafer production efficiency. Utility Model Content

[0004] The main purpose of the utility model is to propose a wafer tray centering device and wafer production equipment, aiming to solve the technical problem that the wafer tray is inconvenient to center in a vacuum environment, thereby reducing the production efficiency of the wafer.

[0005] To achieve the above objectives, the present invention proposes a wafer tray centering device, comprising:

[0006] A vacuum chamber, wherein a support frame is provided in the vacuum chamber, and the support frame is used to support the wafer tray;

[0007] a first positioning push rod, the first positioning push rod extending into the vacuum chamber, the first positioning push rod being driven by a first driving portion to move toward or away from the wafer tray;

[0008] a second positioning push rod, the second positioning push rod extending into the vacuum chamber, the second positioning push rod being driven by a second driving portion to move toward or away from the wafer tray;

[0009] a third positioning push rod, the third positioning push rod extending into the vacuum chamber, the third positioning push rod being driven by a third driving portion to move toward or away from the wafer tray;

[0010] Wherein, the first positioning push rod, the second positioning push rod and the third positioning push rod are arranged around the circumference of the wafer tray.

[0011] In some embodiments, the first driving portion is provided with a first driving rod, and an end of the first driving rod facing away from the first driving portion is connected to the first positioning push rod, for driving the first positioning push rod to move toward or away from the wafer tray;

[0012] The second driving portion is provided with a second driving rod, and one end of the second driving rod facing away from the second driving portion is connected to the second positioning push rod, for driving the second positioning push rod to move toward or away from the wafer tray;

[0013] The third driving part is provided with a third driving rod, and one end of the third driving rod away from the third driving part is connected to the third positioning push rod, which is used to drive the third positioning push rod to move toward or away from the wafer tray.

[0014] In some embodiments, the first driving part, the second driving part and the third driving part are all arranged outside the vacuum chamber, a vacuum bellows is provided between the first driving part, the second driving part and the third driving part and the vacuum chamber, the first driving rod, the second driving rod and the third driving rod are all arranged in the vacuum bellows, and the first driving rod, the second driving rod and the third driving rod extend in the vacuum bellows into the vacuum chamber.

[0015] In some embodiments, the vacuum chamber is provided with an inlet slit valve, which is suitable for allowing a robot to pass into the vacuum chamber. The robot is used to support the wafer to transfer the wafer into the vacuum chamber and align the center of the wafer with the center of the wafer tray in a first direction.

[0016] In some embodiments, the wafer tray is provided with a hollow portion, and a fourth driving portion is provided in the vacuum chamber along the first direction and on the side away from the robot. The fourth driving portion can pass through the hollow portion and can move toward or away from the robot to lift the wafer from the robot and place the wafer in the wafer tray.

[0017] In some embodiments, the hollow portion is a circular structure centered on the center of the wafer tray, and the size of the hollow portion is smaller than the size of the wafer.

[0018] In some embodiments, a positioning groove is provided in the wafer tray, and the positioning groove is used to place the wafer.

[0019] In some embodiments, the first driving part, the second driving part, and the third driving part are all cylinders.

[0020] In some embodiments, the first driving unit, the second driving unit, and the third driving unit are all servo motors.

[0021] Correspondingly, the present invention also proposes a wafer production device, including the wafer tray centering device described in any of the above embodiments.

[0022] Compared with the prior art, the beneficial effects of the present invention are:

[0023] In the technical solution of the present invention, a wafer tray centering device is provided for conveniently centering the wafer tray in a vacuum environment. When the wafer tray does not need to be centered, the first driving unit drives the first positioning push rod to move away from the wafer tray, the second driving unit drives the second positioning push rod to move away from the wafer tray, and the third driving unit drives the third positioning push rod to move away from the wafer tray, so that the first positioning push rod, the second positioning push rod and the third positioning push rod retract to the origin position without affecting the use of a robot to load the wafer onto the wafer tray.

[0024] When the wafer tray needs to be centered, the first drive unit drives the first positioning push rod to move toward the wafer tray, the second drive unit drives the second positioning push rod to move toward the wafer tray, and the third drive unit drives the third positioning push rod to move toward the wafer tray, so that the first positioning push rod, the second positioning push rod, and the third positioning push rod jointly clamp the wafer tray. Since the first positioning push rod, the second positioning push rod, and the third positioning push rod are arranged circumferentially around the wafer tray, that is, the first positioning push rod, the second positioning push rod, and the third positioning push rod are not on the same straight line, according to the principle of "three points not on the same straight line determine a circle", the first positioning push rod, the second positioning push rod, and the third positioning push rod can jointly determine the preset center position of the wafer tray. The first positioning push rod, the second positioning push rod, and the third positioning push rod can be used to correct the position of the wafer tray to achieve centering of the wafer tray.

[0025] The wafer tray centering device provided by the utility model can realize the centering positioning of the wafer tray in the vacuum chamber by only using three circumferentially arranged positioning push rods. It is simple to operate and can improve the processing efficiency of the wafers on the wafer tray and enhance the processing accuracy of the wafers on the wafer tray.

[0026] Wafer production equipment using the above-mentioned wafer tray centering device is conducive to centering and positioning the wafer tray, thereby helping to improve the production progress and processing accuracy of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0028] Figure 1 A structural diagram of a wafer tray centering device provided by one embodiment of the present invention when the positioning push rod is in a retracted state;

[0029] Figure 2 A structural diagram of a wafer tray centering device provided by one embodiment of the present invention when the positioning push rod is in an extended state;

[0030] Figure 3 This is a structural diagram of the wafer tray centering device provided by one embodiment of the present invention when a robot arm is inserted into the device.

[0031] Description of Figure Numbers:

[0032] 100-vacuum chamber;

[0033] 110-support frame; 120-wafer tray;

[0034] 121-hollow part;

[0035] 200-first positioning push rod;

[0036] 300-second positioning push rod;

[0037] 400-third positioning push rod;

[0038] 500-first driving unit;

[0039] 510 - first driving rod;

[0040] 600- second driving unit;

[0041] 610 - second driving rod;

[0042] 700- third driving unit;

[0043] 710 - third driving rod;

[0044] 800- fourth driving unit;

[0045] 900-inlet slit valve;

[0046] 1000-Robot.

[0047] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0049] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0050] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or", "and / or" or "and / or" appear in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0051] In the automated semiconductor production process, wafer handling is a common process throughout the production process. Using robotic arms to transfer wafers is particularly common. However, due to the long arms of robotic arms, mechanical vibrations are inevitable during wafer handling. This vibration is transmitted to the wafer tray, causing it to shift in position and deviate from its center position. This wafer tray offset can affect the processing accuracy of the wafers it carries.

[0052] While vacuum chucks can be used in atmospheric conditions to prevent the wafer tray from shifting due to mechanical vibration, this cannot be achieved in a vacuum environment. Therefore, centering the wafer tray in a vacuum environment is currently difficult, impacting wafer production efficiency.

[0053] It should be noted that the processing and manufacturing of semiconductor products generally need to be carried out in a vacuum environment, because the vacuum environment can minimize the falling of particles such as dust, avoid damaging the lattice structure of semiconductor products and the coverage of each layer of materials, thereby helping to improve the performance of semiconductor products.

[0054] In order to solve the technical problem that the wafer tray 120 is inconvenient to be centered in a vacuum environment and reduces the production efficiency of the wafer, refer to Figures 1 to 3 , an embodiment of the present invention provides a wafer tray 120 centering device, which includes a vacuum chamber 100, a first positioning push rod 200, a second positioning push rod 300 and a third positioning push rod 400. A support frame 110 is provided in the vacuum chamber 100, and the support frame 110 is used to support the wafer tray 120. The first positioning push rod 200 extends into the vacuum chamber 100, and the first positioning push rod 200 is driven by the first driving part 500 and can move toward or away from the wafer tray 120. The second positioning push rod 300 extends into the vacuum chamber 100, and the second positioning push rod 300 is driven by the second driving part 600 and can move toward or away from the wafer tray 120. The third positioning push rod 400 extends into the vacuum chamber 100, and the third positioning push rod 400 is driven by the third driving part 700 and can move toward or away from the wafer tray 120. The first positioning push rod 200 , the second positioning push rod 300 and the third positioning push rod 400 are circumferentially arranged around the wafer tray 120 .

[0055] Specifically, in order to solve the above problems, in this embodiment, a wafer tray 120 centering device is provided for conveniently centering the wafer tray 120 in a vacuum environment. When the wafer tray 120 does not need to be centered, the first drive unit 500 drives the first positioning push rod 200 to move in the direction away from the wafer tray 120, the second drive unit 600 drives the second positioning push rod 300 to move in the direction away from the wafer tray 120, and the third drive unit 700 drives the third positioning push rod 400 to move in the direction away from the wafer tray 120, so that the first positioning push rod 200, the second positioning push rod 300 and the third positioning push rod 400 retract to the origin position without affecting the use of the robot 1000 to load the wafer onto the wafer tray 120.

[0056] When the wafer tray 120 needs to be centered, the first driving unit 500 will drive the first positioning push rod 200 to move toward the direction close to the wafer tray 120, the second driving unit 600 will drive the second positioning push rod 300 to move toward the direction close to the wafer tray 120, and the third driving unit 700 will drive the third positioning push rod 400 to move toward the direction close to the wafer tray 120, so that the first positioning push rod 200, the second positioning push rod 300 and the third positioning push rod 400 jointly clamp the wafer tray 120. Since the first positioning push rod 200, the second positioning push rod 300 and the third positioning push rod 400 are arranged circumferentially around the wafer tray 120, that is, the first positioning push rod 200, the second positioning push rod 300 and the third positioning push rod 400 are not on the same straight line, according to the principle of "three points that are not on the same straight line determine a circle", the first positioning push rod 200, the second positioning push rod 300 and the third positioning push rod 400 can jointly determine the preset center position of the wafer tray 120, and the first positioning push rod 200, the second positioning push rod 300 and the third positioning push rod 400 can be used to correct the position of the wafer tray 120 to achieve the centering of the wafer tray 120.

[0057] The wafer tray 120 centering device provided in this embodiment can realize the centering positioning of the wafer tray 120 in the vacuum chamber 100 by only using three circumferentially arranged positioning rods. It is simple to operate and can improve the processing efficiency of the wafers on the wafer tray 120 and enhance the processing accuracy of the wafers on the wafer tray 120.

[0058] In some embodiments, reference Figures 1 to 3 The first drive unit 500 is provided with a first drive rod 510. The end of the first drive rod 510 facing away from the first drive unit 500 is connected to the first positioning push rod 200, and is used to drive the first positioning push rod 200 to move toward or away from the wafer tray 120. The second drive unit 600 is provided with a second drive rod 610. The end of the second drive rod 610 facing away from the second drive unit 600 is connected to the second positioning push rod 300, and is used to drive the second positioning push rod 300 to move toward or away from the wafer tray 120. The third drive unit 700 is provided with a third drive rod 710. The end of the third drive rod 710 facing away from the third drive unit 700 is connected to the third positioning push rod 400, and is used to drive the third positioning push rod 400 to move toward or away from the wafer tray 120. For example, the first driving part 500 , the second driving part 600 , and the third driving part 700 may be driving motors, or the first driving part 500 , the second driving part 600 , and the third driving part 700 may be driving cylinders.

[0059] Specifically, in the present embodiment, the first driving part 500, the second driving part 600 and the third driving part 700 are taken as examples of the driving motor (at this time, the first driving rod 510, the second driving rod 610 and the third driving rod 710 are the driving motor shafts), and the action process of the first driving part 500 driving the first positioning push rod 200, the second driving part 600 driving the second positioning push rod 300 and the third driving part 700 driving the third positioning push rod 400 is described. When the pushing action of the first positioning push rod 200, the second positioning push rod 300 and the third positioning push rod 400 is needed to realize the centering of the wafer tray 120, the first driving part 500, the second driving part 600 and the third driving part 700 are started at the same time, so that the first driving rod 510 drives the first positioning push rod 200 to move towards the direction close to the wafer tray 120, so that the second driving rod 610 drives the second positioning push rod 300 to move towards the direction close to the wafer tray 120, and so that the third driving rod 710 drives the third positioning push rod 400 to move towards the direction close to the wafer tray 120. After the first positioning push rod 200, the second positioning push rod 300 and the third positioning push rod 400 move to the position, they abut against the circumferential edge of the wafer tray 120. According to the principle of "three points not in the same straight line determine a circle", the first positioning push rod 200, the second positioning push rod 300 and the third positioning push rod 400 can jointly determine the position of the preset center of the wafer tray 120. The first positioning push rod 200, the second positioning push rod 300 and the third positioning push rod 400 can be used to correct the position of the wafer tray 120, so as to realize the centering of the wafer tray 120.

[0060] When the centering of the wafer tray 120 by the first positioning push rod 200, the second positioning push rod 300 and the third positioning push rod 400 is completed, the first driving part 500, the second driving part 600 and the third driving part 700 are started at the same time, so that the first driving rod 510 drives the first positioning push rod 200 to move away from the wafer tray 120, so that the second driving rod 610 drives the second positioning push rod 300 to move away from the wafer tray 120, and so that the third driving rod 710 drives the third positioning push rod 400 to move away from the wafer tray 120. At this time, the first positioning push rod 200, the second positioning push rod 300 and the third positioning push rod 400 will gradually retract to the original position, without affecting the wafer loading operation on the wafer tray 120.

[0061] In some embodiments, with reference to Figures 1 to 3The first driving part 500, the second driving part 600 and the third driving part 700 are all arranged outside the vacuum chamber 100, and a vacuum bellows is provided between the first driving part 500, the second driving part 600 and the third driving part 700 and the vacuum chamber 100. The first driving rod 510, the second driving rod 610 and the third driving rod 710 are all arranged in the vacuum bellows, and the first driving rod 510, the second driving rod 610 and the third driving rod 710 extend from the vacuum bellows to the vacuum chamber 100.

[0062] Specifically, in this embodiment, since the air in a vacuum environment is generally thin (an absolute vacuum environment is rarely found in actual production), there is no heat convection in a vacuum environment, only heat conduction and radiation. Therefore, heat dissipation by the driver unit (for example, a drive motor) in a vacuum environment is relatively difficult. Furthermore, during operation, the driver unit (for example, a drive motor) emits microparticles and molecular deposits (such as grease), which can contaminate the vacuum chamber 100 and affect wafer production quality and performance. Therefore, disposing the first, second, and third driver units 500, 600, and 700 outside the vacuum chamber 100 ensures proper heat dissipation during normal operation of the first, second, and third driver units 500, 600, and 700, while also preventing contamination within the vacuum chamber 100 caused by microparticles and molecular deposits emitted by the first, second, and third driver units 500, 600, and 700 during normal operation, which could affect wafer processing accuracy within the vacuum chamber 100.

[0063] Furthermore, vacuum bellows are provided at the connections between the first driving part 500, the second driving part 600 and the third driving part 700 and the vacuum chamber 100. The first driving rod 510 passes through the vacuum bellows and is connected to the first positioning push rod 200, the second driving rod 610 passes through the vacuum bellows and is connected to the second positioning push rod 300, and the third driving rod 710 passes through the vacuum bellows and is connected to the third positioning push rod 400. By providing the vacuum bellows, the sealing between the first driving part 500, the second driving part 600 and the third driving part 700 and the vacuum chamber 100 can be ensured, which is conducive to maintaining the vacuum environment in the vacuum chamber 100.

[0064] In some embodiments, reference Figures 1 to 3 The vacuum chamber 100 is provided with an inlet slit valve 900, which is adapted to allow a robot 1000 to pass into the vacuum chamber 100. The robot 1000 is configured to support wafers and transfer the wafers into the vacuum chamber 100 so that the center of the wafer is aligned with the center of the wafer tray 120 in a first direction. For example, the first direction may be a vertical direction.

[0065] Specifically, in this embodiment, the entrance slit valve 900 has an open state and a closed state. When the entrance slit valve 900 is in the open state, the robot 1000 can enter the vacuum chamber 100 through the entrance slit valve 900 to transfer wafers into the vacuum chamber 100 and perform wafer processing in the vacuum chamber 100. When the robot 1000 moves out of the vacuum chamber 100, the entrance slit valve 900 is closed, thereby isolating the vacuum chamber 100 from the outside atmosphere and ensuring the vacuum environment in the vacuum chamber 100.

[0066] Furthermore, after the robot 1000 aligns the center of the wafer with the center of the wafer tray 120 in the first direction, it stops moving and waits for the subsequent mechanism to transfer the wafer on the robot 1000 to the wafer tray 120. The center of the wafer and the center of the wafer tray 120 are aligned in the first direction in advance, that is, the center of the wafer and the center of the wafer tray 120 are on the same vertical line in advance. When the wafer is transferred from the robot 1000 to the wafer tray 120, the wafer can be transferred to the center position of the wafer tray 120 without adjusting the position of the wafer on the wafer tray 120. When the center of the wafer tray 120 is offset, it is only necessary to use the first positioning push rod 200, the second positioning push rod 300 and the third positioning push rod 400 to achieve the centering of the wafer tray 120.

[0067] In some embodiments, reference Figures 1 to 3 The wafer tray 120 is provided with a hollow portion 121, and a fourth driving unit 800 is provided in the vacuum chamber 100 along the first direction and on the side away from the robot 1000. The fourth driving unit 800 can pass through the hollow portion 121 and can move toward or away from the robot 1000 to lift the wafer from the robot 1000 and place the wafer in the wafer tray 120.

[0068] Specifically, in this embodiment, when a wafer needs to be transferred from the robot 1000 to the wafer tray 120, the fourth drive unit 800 first moves toward the robot 1000. As the fourth drive unit 800 moves toward the robot 1000, it passes through the hollow portion 121 and reaches the robot 1000, thereby lifting the wafer from the robot 1000. After lifting the wafer, the fourth drive unit 800 moves away from the robot 1000. As the fourth drive unit 800 moves away from the robot 1000 and passes through the hollow portion 121 again, it lowers the wafer onto the wafer tray 120, thereby positioning the wafer on the wafer tray 120. Simultaneously, the fourth drive unit 800 moves to its origin.

[0069] It should be noted that throughout the wafer transfer process, the wafer tray 120 remains stationary on the support frame 110, ensuring that the wafer tray 120 remains centered. If the wafer tray 120 deviates due to mechanical vibration, the first positioning rod 200, second positioning rod 300, and third positioning rod 400 of the wafer tray 120 centering device provided in this embodiment can be used to adjust the centering of the wafer tray 120.

[0070] In some embodiments, reference Figures 1 to 3 The hollow portion 121 is a circular structure centered on the center of the wafer tray 120, and the size of the hollow portion 121 is smaller than the size of the wafer. Only by designing the size of the hollow portion 121 smaller than the size of the wafer can the wafer not leak out of the hollow portion 121 and the wafer tray 120 can support the wafer.

[0071] In some embodiments, the wafer tray 120 is provided with a positioning groove (not shown) for positioning the wafer. For example, to accommodate the wafer, the positioning groove can be configured as a circular positioning groove, and the size of the positioning groove is slightly larger than the size of the wafer. This ensures that the wafer can be smoothly placed in the positioning groove, thereby achieving the positioning of the wafer on the wafer tray 120.

[0072] In some embodiments, the first drive unit 500, the second drive unit 600, and the third drive unit 700 are all pneumatic cylinders. Pneumatic cylinders have a fast response speed and good operating stability. They can not only ensure that the first positioning push rod 200, the second positioning push rod 300, and the third positioning push rod 400 can be quickly moved into position, but also reduce the mechanical vibration generated by the first drive unit 500, the second drive unit 600, and the third drive unit 700 during operation, thereby reducing the possibility of the wafer tray 120 shifting.

[0073] In some embodiments, the first drive unit 500, the second drive unit 600, and the third drive unit 700 are all servo motors. Servo motors have high motion accuracy and good stability. They can not only drive the first positioning push rod 200, the second positioning push rod 300, and the third positioning push rod 400 to their proper positions, but also reduce mechanical vibrations generated by the first drive unit 500, the second drive unit 600, and the third drive unit 700 during operation, thereby reducing the possibility of positional displacement of the wafer tray 120.

[0074] Correspondingly, another embodiment of the present invention further provides a wafer production device, which includes the wafer tray 120 centering device in any of the above embodiments.

[0075] Specifically, in this embodiment, the wafer production equipment using the above-mentioned wafer tray 120 centering device is conducive to centering and positioning the wafer tray 120, thereby facilitating improvement of wafer production progress and processing accuracy.

[0076] Thanks to the improvement of the centering device of the wafer tray 120 mentioned above, the wafer production equipment of this embodiment has the same technical effect as the centering device of the wafer tray 120 mentioned above, which will not be repeated here.

[0077] It should be noted that other contents of the wafer tray 120 centering device and wafer production equipment disclosed in the present invention can be found in the prior art and will not be described in detail here.

[0078] The above are only preferred embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the utility model concept, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A wafer tray centering device, characterized in that: include: A vacuum chamber, wherein a support frame is provided in the vacuum chamber, and the support frame is used to support the wafer tray; a first positioning push rod, the first positioning push rod extending into the vacuum chamber, the first positioning push rod being driven by a first driving portion to move toward or away from the wafer tray; a second positioning push rod, the second positioning push rod extending into the vacuum chamber, the second positioning push rod being driven by a second driving portion to move toward or away from the wafer tray; a third positioning push rod, the third positioning push rod extending into the vacuum chamber, the third positioning push rod being driven by a third driving portion to move toward or away from the wafer tray; Wherein, the first positioning push rod, the second positioning push rod and the third positioning push rod are arranged around the circumference of the wafer tray.

2. The wafer tray centering device according to claim 1, wherein: The first driving portion is provided with a first driving rod, and one end of the first driving rod facing away from the first driving portion is connected to the first positioning push rod, for driving the first positioning push rod to move toward or away from the wafer tray; The second driving portion is provided with a second driving rod, and one end of the second driving rod facing away from the second driving portion is connected to the second positioning push rod, for driving the second positioning push rod to move toward or away from the wafer tray; The third driving part is provided with a third driving rod, and one end of the third driving rod away from the third driving part is connected to the third positioning push rod, which is used to drive the third positioning push rod to move toward or away from the wafer tray.

3. The wafer tray centering device according to claim 2, wherein: The first driving part, the second driving part and the third driving part are all arranged outside the vacuum chamber, and a vacuum bellows is provided between the first driving part, the second driving part and the third driving part and the vacuum chamber. The first driving rod, the second driving rod and the third driving rod are all arranged in the vacuum bellows, and the first driving rod, the second driving rod and the third driving rod extend in the vacuum bellows into the vacuum chamber.

4. The wafer tray centering device according to claim 1, wherein: The vacuum chamber is provided with an inlet slit valve, which is suitable for introducing a robot into the vacuum chamber. The robot is used to support the wafer to transfer the wafer into the vacuum chamber and align the center of the wafer with the center of the wafer tray in a first direction.

5. The wafer tray centering device according to claim 4, characterized in that: The wafer tray is provided with a hollow portion, and a fourth driving portion is provided on a side of the vacuum chamber along the first direction and away from the robot. The fourth driving portion can pass through the hollow portion and can move toward or away from the robot to lift the wafer from the robot and place the wafer in the wafer tray.

6. The wafer tray centering device according to claim 5, characterized in that: The hollow portion is a circular structure centered on the center of the wafer tray, and the size of the hollow portion is smaller than the size of the wafer.

7. The wafer tray centering device according to claim 1, wherein: A positioning groove is provided in the wafer tray, and the positioning groove is used to place the wafer.

8. The wafer tray centering device according to any one of claims 1 to 7, characterized in that: The first driving part, the second driving part, and the third driving part are all cylinders.

9. The wafer tray centering device according to any one of claims 1 to 7, characterized in that: The first driving unit, the second driving unit, and the third driving unit are all servo motors.

10. Wafer production equipment, characterized in that A wafer tray centering device comprising the wafer tray centering device according to any one of claims 1 to 9.

Images