Wafer positioning device
By setting up a liquid cooling channel on the slide of the wafer positioning device and injecting cooling liquid to lower the temperature, the positioning error problem caused by thermal expansion and contraction of the motor is solved, and high-precision wafer positioning is achieved.
Patent Information
- Application Number
- CN202422763467.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-12
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-11-12
AI Technical Summary
In existing wafer positioning devices, the increase in motor temperature causes the slide and camera components to expand and contract, affecting the movement accuracy and resulting in errors in wafer positioning.
Liquid cooling channel cooling technology is adopted. By setting liquid cooling channels on the slide and injecting cooling liquid, the temperature of the slide and camera components is reduced to avoid thermal deformation and ensure movement accuracy.
The effect of motor heat on the slide and camera components is effectively reduced, positioning errors caused by thermal deformation are avoided, and the motion accuracy of the slide and camera components is improved.
Smart Images

Figure CN223427477U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor processing equipment, in particular to a wafer positioning device. Background Art
[0002] In the semiconductor manufacturing industry, the mass transfer of MicroLEDs (micro-light-emitting diode displays) requires the use of a high-precision camera assembly in a wafer positioning device to align the upper and lower substrates. As the camera assembly moves downward, its focus must be shifted to the wafer surface of the lower substrate to assist in wafer positioning. Existing wafer positioning devices use a motor-driven slide to achieve vertical movement of the camera assembly. Rising motor temperature causes thermal expansion and contraction of the slide and camera assembly, affecting their motion accuracy and leading to errors in wafer positioning. Utility Model Content
[0003] The purpose of the embodiment of the present utility model is to provide a wafer positioning device that can reduce the impact of increased motor temperature on the slide and camera assembly, ensure the movement accuracy of the slide and camera assembly, and thus avoid errors in wafer positioning.
[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0005] A wafer positioning device, comprising:
[0006] base;
[0007] A slide seat is slidably mounted on the base; the slide seat is provided with a liquid cooling channel, and the liquid cooling channel has a liquid inlet and a liquid outlet;
[0008] A linear motor is mounted on the base; an output end of the linear motor is transmission-connected to the slide; and
[0009] The camera assembly is mounted on the slide.
[0010] Optionally, the wafer positioning device further comprises a cylinder mounted on the base; the linear motor comprises a stator and a mover;
[0011] The slide is slidably mounted on the base in a vertical direction, the output shaft of the cylinder is connected to the slide to provide an upward pulling force to the slide, the stator of the linear motor is mounted on the base, and the mover of the linear motor is transmission-connected to the slide.
[0012] Optionally, the wafer positioning device further comprises a cross roller guide rail provided on the base; the slide is slidably provided on the cross roller guide rail.
[0013] Optionally, the wafer positioning device further includes a pressure regulating valve; the pressure regulating valve is connected to the cylinder.
[0014] Optionally, the wafer positioning device further includes a floating joint; the output shaft of the cylinder is connected to the slide via the floating joint.
[0015] Optionally, the slide seat includes a slide plate and a connecting plate; the slide plate is provided with a mounting hole, the connecting plate is mounted on the slide plate and covers the mounting hole, and the mover of the linear motor is connected to the connecting plate.
[0016] Optionally, the wafer positioning device further includes a first connecting pipe, a second connecting pipe, a first pipe joint, and a second pipe joint; the liquid cooling channel has a first hole segment, a second hole segment, and a third hole segment; the first hole segment and the second hole segment are both located on the slide, the first hole segment and the second hole segment are arranged at intervals, the connecting plate is located between the first hole segment and the second hole segment, and the third hole segment is located on the connecting plate;
[0017] One end of the first hole segment is provided with the liquid inlet, the first pipe joint is installed on the slide and communicated with the liquid inlet, the other end of the first hole segment is communicated with one end of the third hole segment through the first connecting pipe, one end of the second hole segment is provided with the liquid outlet, the second pipe joint is installed on the slide and communicated with the liquid outlet, and the other end of the second hole segment is communicated with the other end of the third hole segment through the second connecting pipe.
[0018] Optionally, a first grating ruler is provided on the base and a first reading head adapted to the first grating ruler is provided on the slide;
[0019] and / or
[0020] A second grating ruler is provided on the slide and a second reading head adapted to the second grating ruler is provided on the base.
[0021] Optionally, the slide has a first sliding direction and a second sliding direction, and the first sliding direction is opposite to the second sliding direction;
[0022] The base is provided with a first anti-collision block and a second anti-collision block, and the slide is provided with a first limit block and a second limit block, and the first anti-collision block and the second anti-collision block are arranged in sequence along the sliding path of the slide; when the slide slides along the first sliding direction, the first anti-collision block is located on the moving path of the first limit block; when the slide slides along the second sliding direction, the second anti-collision block is located on the moving path of the second limit block;
[0023] and / or
[0024] The base is provided with a first photoelectric switch and a second photoelectric switch, and the slide is provided with a first sensing sheet and a second sensing sheet. The first photoelectric switch and the second photoelectric switch are arranged in sequence along the sliding path of the slide; when the slide slides along the first sliding direction, the first photoelectric switch is located on the moving path of the first sensing sheet; when the slide slides along the second sliding direction, the second photoelectric switch is located on the moving path of the second sensing sheet.
[0025] Optionally, a mounting seat is provided on the sliding seat, and a wire clamping portion and a tube clamping portion are provided on the mounting seat.
[0026] The beneficial effects of the present invention are as follows: the wafer positioning device is provided with a liquid cooling channel on the slide, and the liquid cooling channel has a liquid inlet and a liquid outlet. The temperature of the slide and the camera assembly mounted on the slide is reduced by injecting cooling liquid such as water into the liquid cooling channel at the liquid inlet, thereby reducing the impact of the increased motor temperature on the slide and the camera assembly. The cooling liquid takes away the heat and flows out from the liquid outlet, thereby avoiding the precision error caused by thermal deformation of the slide and the camera assembly caused by the heat when the motor is heated, ensuring the movement accuracy of the slide and the camera assembly, and thus avoiding errors in the positioning of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] The present invention will be described in further detail below with reference to the accompanying drawings and embodiments.
[0028] Figure 1 It is a structural schematic diagram of a wafer positioning device;
[0029] Figure 2 An exploded view of a wafer positioning device;
[0030] Figure 3 It is a structural diagram of the slide;
[0031] Figure 4 This is a connection diagram of the base, slide, and cylinder.
[0032] Description of the accompanying drawings:
[0033] 11. Base; 12. Slide; 13. Linear motor; 14. Camera assembly; 15. Cylinder; 16. Cross roller guide; 17. Pressure regulating valve; 18. Floating joint; 19. Joint mounting block; 20. Cylinder base; 21. First connecting pipe; 22. Second connecting pipe; 23. First pipe joint; 24. Second pipe joint; 25. First grating scale; 26. First reading head; 27. First anti-collision block; 28. Second anti-collision block; 29. First limit block; 30. Second limit block; 31. First photoelectric switch; 32. Second photoelectric switch; 33. First sensor plate; 34. Second sensor plate; 35. Mounting base; 36. Connecting base; 37. Machine base; 38. Cable; 39. External pipe;
[0034] 121, slide plate; 122, connecting plate; 123, liquid cooling channel; 124, mounting hole; 1231, first hole section; 1232, second hole section; 1233, third hole section; 1234, liquid inlet; 1235, liquid outlet;
[0035] 131. Stator; 132. Mover. DETAILED DESCRIPTION
[0036] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved more clearly, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work shall fall within the scope of protection of the present invention.
[0037] In the description of this utility model, unless otherwise expressly specified or limited, the terms "connected," "fixed," "connected," "communicated," "abutted," "clamped," etc. should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections; direct connections, or indirect connections through an intermediate medium; internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.
[0038] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.
[0039] In the description herein, it should be understood that terms such as "upper," "lower," "left," and "right" are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.
[0040] Throughout this specification, references to terms such as "one embodiment" and "example" indicate that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example.
[0041] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.
[0042] Unless specifically stated or defined otherwise, the term “and / or” used in the present invention includes any and all combinations of one or more of the associated listed items.
[0043] For the convenience of description, unless otherwise specified, the following terms "upper and lower" and "lower" are Figure 1 or Figure 3 The up and down directions are consistent, and the left and right mentioned below are consistent with Figure 3 The left and right directions of the device are consistent, and the front and back mentioned below are consistent with Figure 3 The projection direction itself is consistent.
[0044] When MicroLED is performing mass transfer, it is necessary to use a high-precision camera assembly to align the upper and lower substrates, thereby achieving the positioning of the wafers on the upper and lower substrates. The traditional wafer positioning device uses a motor and a screw module to drive the slide to drive the camera assembly to slide up and down. The motor generates heat during operation, causing the slide to drive the camera assembly to expand and contract, affecting the movement accuracy of the slide and camera assembly. At the same time, the wafer positioning device is easily affected by the screw groove accuracy, guide rail rigidity, temperature rise, etc. of the screw module. It is difficult to achieve a repeatable positioning accuracy within 0.6 microns for a slightly longer stroke (over 40mm), which leads to errors in wafer positioning.
[0045] like Figures 1 to 4 As shown, this embodiment provides a wafer positioning device, including a base 11 , a slide 12 , a linear motor 13 , and a camera assembly 14 .
[0046] The slide 12 is slidably mounted on the base 11. The camera assembly 14 is mounted on the slide 12. The linear motor 13 is mounted on the base 11. The output end of the linear motor 13 is transmission-connected to the slide 12. The linear motor 13 directly drives the slide 12 to slide relative to the base 11, and there is no need to use a screw module, thereby avoiding the influence of the screw groove accuracy of the screw module on the repeat positioning accuracy of the long stroke of the wafer positioning device. The slide 12 is provided with a liquid cooling channel 123, and the liquid cooling channel 123 has a liquid inlet 1234 and a liquid outlet 1235. The liquid cooling channel 123 is connected to the outside of the slide 12 through the liquid inlet 1234 and the liquid outlet 1235. By transporting cooling liquid such as water from the liquid inlet 1234 to the liquid cooling channel 123, the cooling liquid flows out from the liquid outlet 1235 after passing through the liquid cooling channel 123. In this way, when the wafer positioning device is working, when the heat generated by the motor is transferred to the slide 12 and the camera assembly 14 installed on the slide 12, the coolant such as water is transported to the liquid cooling channel 123, and the coolant can take away the heat on the slide 12, thereby avoiding the heat from being transferred to the camera assembly 14 on the slide 12, and avoiding the temperature of the motor from causing thermal expansion and contraction on the slide 12 and the camera assembly 14, thereby ensuring the movement accuracy of the slide 12 and the camera assembly 14 and avoiding errors in wafer positioning.
[0047] Optionally, the wafer positioning device further includes a cylinder 15 mounted on the base 11. The linear motor 13 includes a stator 131 and a mover 132. The stator 131 of the linear motor 13 is mounted on the base 11 via a base 37, and the mover 132 of the linear motor 13 is in transmission connection with the slide 12. The cylinder 15 is mounted on the base 11 via a cylinder base 20.
[0048] The slide 12 is slidably mounted on the base 11 along the vertical direction. When the slide 12 slides upward, it approaches the upper base plate. When the slide 12 slides downward, it approaches the lower base plate. The output shaft of the cylinder 15 is connected to the slide 12 to provide an upward pulling force to the slide 12. Compressed air at a certain pressure is introduced into the cylinder 15 to provide an upward pulling force to the slide 12. The pulling force of the cylinder 15 on the slide 12 is equal to or slightly greater than the total weight of the slide 12 and the camera assembly 14. For example, in this embodiment, the pulling force of the cylinder 15 on the slide 12 is slightly greater than the total weight of the slide 12 and the camera assembly 14. The pulling force of the cylinder 15 can offset the weight of the slide 12 and the camera assembly 14, and lift the slide 12 and the camera assembly 14 to the upper limit when the linear motor 13 is accidentally powered off, thereby achieving high-precision positioning of the camera assembly 14 and a self-lifting protection mechanism when the linear motor 13 is powered off. The traditional screw module cannot automatically rise and return to zero after the motor is accidentally powered off, which may cause the camera assembly 14 to collide with other components. After the camera assembly 14 of the present application recognizes the mark point on the lower substrate, the slide 12 and the camera assembly 14 can be raised to avoid other components.
[0049] In one embodiment, the wafer positioning device further includes a cross roller guide 16 disposed on the base 11. The slide 12 is slidably mounted on the cross roller guide 16. Two cross roller guides 16 are provided and arranged horizontally, spaced apart from each other. Both cross roller guides 16 extend from top to bottom. As guide elements, the cross roller guide 16 has advantages over traditional guides, such as low rolling friction, good stability, large contact area, and small elastic deformation, making it easy to achieve high rigidity and high-load motion.
[0050] Furthermore, the wafer positioning device also includes a pressure regulating valve 17. The pressure regulating valve 17 is connected to the cylinder 15. The wafer positioning device achieves gravity balance through the low-friction cylinder 15. The air inlet of the cylinder 15 is connected to the precision pressure regulating valve 17. The precision pressure regulating valve 17 can be adjusted to allow the cylinder 15 to obtain different pulling forces to adapt to different loads, reduce the output power of the linear motor 13, and reduce the impact of the heating of the linear motor 13 on the wafer positioning device. The pressure regulating valve 17 adjusts the pulling force of the cylinder 15 to be slightly greater than the total gravity of the slide 12 and the camera assembly 14. By utilizing the excess pulling force of the cylinder 15, when the wafer positioning device is accidentally powered off, the camera assembly 14 can also self-lift to the upper limit safety position, thereby avoiding collision between the camera assembly 14 and other components.
[0051] Optionally, the wafer positioning device further includes a floating joint 18. The output shaft of the cylinder 15 is connected to the slide 12 via the floating joint 18. The slide 12 is provided with a joint mounting block 19. The floating joint 18 is mounted on the joint mounting block 19 and connected to the output shaft of the cylinder 15. The floating joint 18 prevents the output shaft of the cylinder 15 from becoming stuck.
[0052] In one embodiment, the slide 12 includes a slide 121 and a connecting plate 122. The slide 121 is provided with a mounting hole 124, which passes through the slide 121 from front to back. The connecting plate 122 is detachably mounted on the slide 121 and covers the mounting hole 124. The mover 132 of the linear motor 13 is connected to the connecting plate 122. The linear motor 13 is a U-shaped linear motor 13. The mover 132 of the linear motor 13 directly generates linear motion without passing through an intermediate conversion mechanism. The mover 132 of the linear motor 13 is directly connected to the connecting plate 122. When the mover 132 moves, there is no mechanical contact with the intermediate conversion mechanism. There is no influence on the straightness of the slide 12 caused by the runout error of the screw itself in the traditional screw transmission method. The movement accuracy of the slide 12 is higher. The connecting plate 122 is detachably mounted on the slide 121, which is convenient for installing the mover 132 and also convenient for the maintenance of the linear motor 13. When the mover 132 of the linear motor 13 fails or the coil is burned, the connecting plate 122 can be disassembled and the linear motor 13 can be inspected through the mounting hole 124 .
[0053] Furthermore, the wafer positioning device also includes a first connecting tube 21, a second connecting tube 22, a first pipe joint 23, and a second pipe joint 24. The liquid cooling channel 123 has a first hole section 1231, a second hole section 1232, and a third hole section 1233. The first hole section 1231 and the second hole section 1232 are both located on the slide 121. The connecting plate 122 is located between the first hole section 1231 and the second hole section 1232, and the third hole section 1233 is located on the connecting plate 122. One end of the first hole section 1231 is provided with a liquid inlet 1234. The first pipe joint 23 is mounted on the slide 121 and communicates with the liquid inlet 1234. The other end of the first hole section 1231 is connected to one end of the third hole section 1233 via the first connecting pipe 21. One end of the second hole section 1232 is provided with a liquid outlet 1235. The second pipe joint 24 is mounted on the slide 121 and communicates with the liquid outlet 1235. The other end of the second hole section 1232 is connected to the other end of the third hole section 1233 via the second connecting pipe 22. The first and second hole sections 1231 and 1232 are arranged at intervals from bottom to top. Both the first and second hole sections 1231 and 1232 extend horizontally in the left-right direction, while the third hole section 1233 extends obliquely from top to bottom. This increases the length of the liquid cooling channel 123, thereby increasing the cooling area of the slide 12 and improving the efficiency of liquid cooling. The liquid inlet 1234 of the liquid cooling channel 123 is connected to constant temperature cooling water, which can reduce the thermal expansion and contraction of the slide 12 and the camera assembly 14 caused by the heat generated by the linear motor 13, thereby avoiding the accuracy deviation of the slide 12 and the camera assembly 14 due to thermal expansion and contraction.
[0054] In one embodiment, a first optical scale 25 is provided on the base 11, and a first reading head 26 adapted to the first optical scale 25 is provided on the slide 12. The first optical scale 25 and the first reading head 26 cooperate to provide feedback on the sliding position of the slide 12, thereby achieving the positioning of the camera assembly 14 when it is raised or lowered. The first optical scale 25 is attached to the side of the base 11, and the first reading head 26 is mounted on the side of the slide 12.
[0055] It is understandable that the positions of the first grating scale 25 and the first reading head 26 can also be interchanged. For example, a second grating scale is provided on the slide 12 and a second reading head adapted to the second grating scale is provided on the base 11.
[0056] Optionally, the slide 12 has a first sliding direction and a second sliding direction, the first sliding direction being opposite to the second sliding direction. Exemplarily, the first sliding direction is the direction in which the slide 12 slides downward, and the second sliding direction is the direction in which the slide 12 slides upward.
[0057] The base 11 is provided with a first anti-collision block 27 and a second anti-collision block 28, and the slide 12 is provided with a first stop block 29 and a second stop block 30. The first stop block 29 and the second stop block 30 are arranged in a spaced relationship from top to bottom. The first anti-collision block 27 and the second anti-collision block 28 are arranged in sequence along the sliding path of the slide 12, and are arranged in a spaced relationship from top to bottom. When the slide 12 slides in a first sliding direction, the first anti-collision block 27 is located in the movement path of the first stop block 29. When the slide 12 slides in a second sliding direction, the second anti-collision block 28 is located in the movement path of the second stop block 30. When the slide 12 slides downward a certain distance, the first limit block 29 abuts against the first anti-collision block 27, thereby limiting the slide 12 to the lower limit position. When the slide 12 slides upward a certain distance, the second limit block 30 abuts against the second anti-collision block 28, thereby limiting the slide 12 to the upper limit position, thereby preventing the slide 12 from sliding up and down too far, causing the camera assembly 14 to collide with other components and be damaged.
[0058] It is understandable that the first anti-collision block 27 and the second anti-collision block 28 can also be installed on the slide 12 and the first limit block 29 and the second limit block 30 can be installed on the base 11.
[0059] Optionally, the slide 12 has a first sliding direction and a second sliding direction, and the first sliding direction is opposite to the second sliding direction. The first sliding direction is the direction in which the slide 12 slides downward, and the second sliding direction is the direction in which the slide 12 slides upward. A first photoelectric switch 31 and a second photoelectric switch 32 are provided on the base 11, and the first photoelectric switch 31 and the second photoelectric switch 32 are arranged at intervals from top to bottom. A first sensing plate 33 and a second sensing plate 34 are provided on the slide 12, and the first sensing plate 33 and the second sensing plate 34 are arranged at intervals from top to bottom. The first photoelectric switch 31 and the second photoelectric switch 32 are arranged in sequence along the sliding path of the slide 12. When the slide 12 slides along the first sliding direction, the first photoelectric switch 31 is located on the moving path of the first sensing plate 33. When the slide 12 slides along the second sliding direction, the second photoelectric switch 32 is located on the moving path of the second sensing plate 34. When the slide 12 slides downward a certain distance, the first sensing sheet 33 triggers the first photoelectric switch 31, and the mover 132 of the linear motor 13 stops moving. When the slide 12 slides upward a certain distance, the second sensing sheet 34 triggers the second photoelectric switch 32, and the mover 132 of the linear motor 13 stops moving, preventing the slide 12 from sliding up and down too far and causing the camera assembly 14 to collide with other components and be damaged.
[0060] It is understandable that the first photoelectric switch 31 and the second photoelectric switch 32 may also be mounted on the slide 12 and the first sensing sheet 33 and the second sensing sheet 34 may be mounted on the base 11 .
[0061] In one embodiment, a mounting seat 35 is provided on the slide 12, and a wire clamping portion and a tube clamping portion are provided on the mounting seat 35. The mounting seat 35 is mounted on the slide 12 via a connecting seat 36. There are two mounting seats 35, which are spaced apart from top to bottom on the connecting seat 36. The wire clamping portion is used to position the cable 38, which can supply power or transmit signals to the camera assembly 14 and the linear motor 13. The tube clamping portion is used to position the external tube 39, which can connect the liquid inlet 1234 and the liquid outlet 1235 to realize the delivery of the coolant. Specifically, the wire clamping portion is a semicircular groove slightly smaller than the wire diameter, and the tube clamping portion is a semicircular groove slightly smaller than the tube diameter. The cables 38 and the external tube 39 of the network cable, light source cable, etc. of the camera assembly 14 can be fixed to the slide 12, which can eliminate the influence of the jitter and deflection of the cables 38 and the external tube 39 on the movement of the slide 12 on the movement accuracy of the camera assembly 14. The mounting base 35 can make the bending and pulling forces generated by the cable 38 when the slide 12 and the camera assembly 14 move act on the slide 12 rather than the camera assembly 14, thereby reducing the shaking and deviation of the camera assembly 14 caused by the cable 38 and improving the repeatability of the camera assembly 14.
[0062] Optionally, the camera assembly 14 comprises a lens, a camera body, a cable 38, a light source, and a light source connection sleeve. The camera assembly 14 is mounted on the slide 12 via a connection hole in the lens. The camera assembly 14 is not limited to a single specification and model. The position of the connection hole on the slide 12 can be modified to accommodate camera assemblies 14 of different specifications and models.
[0063] Before the wafer positioning device of the present application works, the pressure of the compressed gas in the cylinder 15 is first adjusted by the precise pressure regulating valve 17 so that the pulling force of the cylinder 15 is slightly greater than the total weight of the load. When the wafer positioning device is working, the linear motor 13 needs to drive the slide 12 and the camera assembly 14 to move downward until the focus of the camera reaches the wafer surface of the lower substrate, thereby identifying the mark point of the lower substrate. At this time, due to the pulling force of the cylinder 15, the gravity of the load has been completely offset, and the linear motor 13 only needs to overcome the excess pulling force of the cylinder 15. By adjusting the pressure regulating valve 17, the excess pulling force of the cylinder 15 can be appropriately reduced. The linear motor 13 only needs to provide a smaller power to drive the slide 121 and the camera up and down, reducing the heat generation of the motor. In conjunction with the feedback of the first grating scale 25 and the first reading head 26, the movement accuracy of the wafer positioning device can reach a repeat positioning accuracy within 0.6 microns. When the linear motor 13 of the wafer positioning device is accidentally powered off, the slide 12 will be lifted up and returned to the upper limit position under the action of the excess tension of the cylinder 15, avoiding the risk of collision between the camera component 14 and the slide 12, and realizing the power-off self-lifting protection function.
[0064] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and should not be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will be able to devise other specific implementations of the present invention without inventive effort, and such implementations will fall within the scope of protection of the present invention.
Claims
1. A wafer positioning device, characterized in that: include: base (11); A slide (12) is slidably mounted on the base (11); the slide (12) is provided with a liquid cooling channel (123), and the liquid cooling channel (123) has a liquid inlet (1234) and a liquid outlet (1235); A linear motor (13) is mounted on the base (11); an output end of the linear motor (13) is in transmission connection with the slide (12); as well as A camera assembly (14) is mounted on the slide (12).
2. The wafer positioning device according to claim 1, wherein: It also includes a cylinder (15) installed on the base (11); the linear motor (13) includes a stator (131) and a mover (132); The slide (12) is slidably mounted on the base (11) along a vertical direction, the output shaft of the cylinder (15) is connected to the slide (12) to provide an upward pulling force to the slide (12), the stator (131) of the linear motor (13) is mounted on the base (11), and the mover (132) of the linear motor (13) is transmission-connected to the slide (12).
3. The wafer positioning device according to claim 2, characterized in that: It also includes a cross roller guide rail (16) arranged on the base (11); the slide seat (12) is slidably arranged on the cross roller guide rail (16).
4. The wafer positioning device according to claim 2, wherein: It also includes a pressure regulating valve (17); the pressure regulating valve (17) is communicated with the cylinder (15).
5. The wafer positioning device according to claim 2, wherein: It also includes a floating joint (18); the output shaft of the cylinder (15) is connected to the slide seat (12) through the floating joint (18).
6. The wafer positioning device according to any one of claims 2 to 5, characterized in that: The slide seat (12) includes a slide plate (121) and a connecting plate (122); the slide plate (121) is provided with a mounting hole (124); the connecting plate (122) is mounted on the slide plate (121) and covers the mounting hole (124); and the mover (132) of the linear motor (13) is connected to the connecting plate (122).
7. The wafer positioning device according to claim 6, characterized in that: It also includes a first connecting pipe (21), a second connecting pipe (22), a first pipe joint (23), and a second pipe joint (24); the liquid cooling channel (123) has a first hole section (1231), a second hole section (1232), and a third hole section (1233); the first hole section (1231) and the second hole section (1232) are both located on the slide plate (121), the first hole section (1231) and the second hole section (1232) are arranged at intervals, the connecting plate (122) is located between the first hole section (1231) and the second hole section (1232), and the third hole section (1233) is located on the connecting plate (122); One end of the first hole section (1231) is provided with the liquid inlet (1234), the first pipe joint (23) is installed on the slide (121) and communicates with the liquid inlet (1234), the other end of the first hole section (1231) is communicated with one end of the third hole section (1233) through the first connecting pipe (21), one end of the second hole section (1232) is provided with the liquid outlet (1235), the second pipe joint (24) is installed on the slide (121) and communicates with the liquid outlet (1235), and the other end of the second hole section (1232) is communicated with the other end of the third hole section (1233) through the second connecting pipe (22).
8. The wafer positioning device according to any one of claims 1 to 5, characterized in that: A first grating ruler (25) is provided on the base (11), and a first reading head (26) adapted to the first grating ruler (25) is provided on the slide (12); and / or A second grating ruler is provided on the slide (12) and a second reading head adapted to the second grating ruler is provided on the base (11).
9. The wafer positioning device according to any one of claims 1 to 5, characterized in that: The sliding seat (12) has a first sliding direction and a second sliding direction, wherein the first sliding direction is opposite to the second sliding direction; The base (11) is provided with a first anti-collision block (27) and a second anti-collision block (28); the slide (12) is provided with a first limit block (29) and a second limit block (30); the first anti-collision block (27) and the second anti-collision block (28) are arranged in sequence along the sliding path of the slide (12); when the slide (12) slides along the first sliding direction, the first anti-collision block (27) is located on the moving path of the first limit block (29); when the slide (12) slides along the second sliding direction, the second anti-collision block (28) is located on the moving path of the second limit block (30); and / or A first photoelectric switch (31) and a second photoelectric switch (32) are provided on the base (11); a first sensing sheet (33) and a second sensing sheet (34) are provided on the slide (12); the first photoelectric switch (31) and the second photoelectric switch (32) are arranged in sequence along the sliding path of the slide (12); when the slide (12) slides along the first sliding direction, the first photoelectric switch (31) is located on the moving path of the first sensing sheet (33); when the slide (12) slides along the second sliding direction, the second photoelectric switch (32) is located on the moving path of the second sensing sheet (34).
10. The wafer positioning device according to any one of claims 1 to 5, characterized in that: A mounting seat (35) is provided on the sliding seat (12), and a wire clamping portion and a tube clamping portion are provided on the mounting seat (35).