Wafer boat bearing device, process door device and semiconductor process equipment

Abstract

The utility model provides a wafer boat bearing device, a process door device and semiconductor process equipment. The wafer boat bearing device comprises a first bearing part which is used for bearing a wafer boat and driving the wafer boat to rotate around a first preset direction at a first preset rotating speed; the second bearing component is connected to the first bearing component, and the second bearing component is used for driving the first bearing component to rotate around a second preset direction at a second preset rotating speed; wherein the first preset direction is opposite to the second preset direction, and the first preset rotating speed is larger than the second preset rotating speed. According to the wafer boat bearing device, the wafer can be prevented from being affected by force possibly causing position deviation when the wafer boat is started, and the wafer density borne by the wafer boat can be improved.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to, but are not limited to, the semiconductor field, and in particular, to a wafer boat carrier, a process gate device, and semiconductor process equipment. Background Art

[0002] In the semiconductor manufacturing process, vertical furnaces are widely used for processes such as wafer oxidation and deposition. A vertical furnace is a type of heat treatment equipment used in industries such as semiconductor manufacturing. Its main feature is its vertical or vertical design, which houses heating elements, a gas flow system, and a carrier that supports wafers or other workpieces. Within the vertical furnace, wafers or other semiconductor substrates are placed inside the carrier and then undergo various processing steps.

[0003] In a vertical furnace, the process door serves as a carrier and a connecting channel between the furnace and the process body, allowing workpieces (such as wafers) to be introduced into and removed from the furnace. The structure and shape of the process door can vary depending on the furnace type, but it is typically an openable door that allows wafers or other workpieces to be easily inserted and removed. For ease of operation, the process door is often designed with a mechanism that allows it to move up and down.

[0004] To smoothly feed a large number of wafers into the furnace, they enter the furnace via a wafer boat mounted on the process door. To ensure uniform heating of the wafers during processing and prevent processing failures caused by uneven furnace temperature distribution, a boat rotation mechanism is installed between the process door and the wafer boat. This mechanism rotates the wafer boat at a preset speed, ensuring uniform heating of the wafers during processing.

[0005] However, during the activation and braking of the boat's rotation mechanism, the wafer boat may be subjected to momentary high forces, which can affect the wafers placed inside. For certain wafers that undergo special processing or require extremely high process uniformity, vibration or positional deviation is unacceptable. Utility Model Content

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a wafer boat carrying device, a process gate device and a semiconductor process equipment, which can make the angular velocity of the wafer boat take a longer time and have a smaller angular acceleration in the process of increasing from 0 to the target angular velocity, thereby causing the wafer boat to be subjected to less force when starting, solving the problem in the related technology that the position of the internal wafer is offset due to the large force applied to the wafer boat when starting.

[0007] In order to achieve the purpose of the utility model, a wafer boat carrying device is provided for semiconductor process equipment, including: a first carrying component, the first carrying component is used to carry the wafer boat and drive the wafer boat to rotate around a first preset direction at a first preset speed; a second carrying component, the second carrying component is connected to the first carrying component, the second carrying component is used to drive the first carrying component to rotate around a second preset direction at a second preset speed; wherein the first preset direction is opposite to the second preset direction, and the first preset speed is greater than the second preset speed.

[0008] In some embodiments, the first supporting component includes a first rotating shaft and a first supporting plate, and the second supporting component includes a second rotating shaft; the first supporting plate is connected to one end of the first rotating shaft to support the crystal boat; the first rotating shaft and the second rotating shaft are coaxially arranged, and the second rotating shaft is sleeved outside the first rotating shaft.

[0009] In some embodiments, the second supporting component further includes a second supporting plate, and the second supporting plate is located below the first supporting plate; the second supporting plate is connected to an end of the second rotating shaft close to the first supporting plate.

[0010] In some embodiments, the diameter of the second carrier plate is smaller than the diameter of the first carrier plate.

[0011] In some embodiments, the diameter of the second carrier plate is 0.6 to 0.85 times the diameter of the first carrier plate.

[0012] In some embodiments, the first bearing component also includes a first driving component and a first transmission component, the first driving component is used to provide power for the rotation of the first rotating shaft, and the first transmission component is connected to the first driving component and the first rotating shaft; the second bearing component also includes a second driving component and a second transmission component, the second driving component is used to provide power for the rotation of the second rotating shaft, and the second transmission component is connected to the second driving component and the second rotating shaft.

[0013] In some embodiments, the first bearing component further includes a first seal located between the first transmission component and the first rotating shaft; the second bearing component further includes a second seal located between the second transmission component and the second rotating shaft.

[0014] In some embodiments, the second preset rotational speed is 0.35 to 0.5 times the first preset rotational speed.

[0015] The utility model also provides a process door device, comprising a door body and the above-mentioned wafer boat carrying device, wherein the door body is connected to the second carrying component.

[0016] In some embodiments, the first carrying component includes a first carrying plate, the second carrying component includes a second carrying plate, the first carrying plate is used to carry the wafer boat, and the first carrying plate, the second carrying plate and the door body are sequentially arranged along the axial direction of the door body.

[0017] In some embodiments, at least one first notch is provided at the edge of the first carrier plate, and the first notch can allow the temperature sensor of the semiconductor process equipment that is lifted and lowered along the axial direction parallel to the door body to pass through when the first carrier plate is stationary, so as to avoid the temperature sensor; and / or at least one second notch is provided at the edge of the second carrier plate, and the second notch can allow the temperature sensor of the semiconductor process equipment that is lifted and lowered along the axial direction parallel to the door body to pass through when the second carrier plate is stationary, so as to avoid the temperature sensor.

[0018] The utility model also provides a semiconductor process equipment, including a cavity and a process door device, the opening of the cavity faces the process door device, and the door body of the process door device is used to rise and fall to close or open the opening; wherein, the process door device adopts the above-mentioned process door device.

[0019] The utility model has the following beneficial effects:

[0020] The wafer boat carrying device of an embodiment of the present application includes a first carrying component and a second carrying component. The first carrying component is used to provide a force to the wafer boat that enables it to rotate around a first preset direction, and the second carrying component provides a force to the first carrying component that enables the wafer boat to rotate around a second preset direction opposite to the first preset direction. Since the acceleration (second preset speed) of the force provided by the second carrying component to rotate the wafer boat is less than the acceleration (first preset speed) of the force provided by the first carrying component to rotate the wafer boat, the wafer boat rotates around the first preset direction with a smaller angular acceleration. The wafer carrying device of the present application can not only prevent the wafer from being affected by forces that may cause positional displacement when the wafer boat is started, but also increase the density of wafers carried by the wafer boat. In this way, while ensuring the safety of the wafers under force, the internal space of the furnace body is fully utilized, thereby significantly improving the working efficiency of the semiconductor process equipment.

[0021] Other objects and features of the present invention will become clear by reading the specification, claims and drawings of this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments with reference to the following drawings, in which:

[0023] Figure 1 It is a structural schematic diagram of the chamber structure in the related art.

[0024] Figure 2 It is an enlarged view of the chamber structure in the related art.

[0025] Figure 3 It is a cross-sectional view of a process door device according to an embodiment of the present invention.

[0026] Figure 4is a top view of the first bearing disc of the embodiment of the utility model.

[0027] Figure 5 is a front view of the first bearing disc of the embodiment of the utility model.

[0028] Figure 6 is a top view of the second bearing disc of the embodiment of the utility model.

[0029] Figure 7 is a front view of the second bearing disc of the embodiment of the utility model.

[0030] Figure 8 is a front view of the first bearing disc, the second bearing disc and the door body of the embodiment of the utility model.

[0031] Figure 9 is a structural schematic view of the process door device of the embodiment of the utility model.

[0032] Figure 10 is a structural schematic view of the process door device of the embodiment of the utility model from another perspective.

[0033] Figure 11 is a sectional view of the semiconductor processing equipment of the embodiment of the utility model.

[0034] Figure 12 is a comparison diagram of the rotation speed of the wafer boat of the wafer boat bearing device of the embodiment of the utility model and the rotation speed of the wafer boat of the related art.

[0035] Main element symbol explanation:

[0036] 1, chamber structure, 2, furnace body, 3, wafer boat, 4, wafer, 5, rotating shaft, 6, process door, 7, rotary drive device,

[0037] 10, wafer boat bearing device, 20, process door device, 21, door body, 30, semiconductor process equipment, 31, furnace body, 32, temperature sensor,

[0038] 100, first bearing part, 110, first rotating shaft, 120, first bearing disc, 121, first notch, 122, first mounting hole, 130, first drive piece, 140, first transmission piece, 141, first transmission belt, 142, first transmission wheel, 150, first sealing piece,

[0039] 200, second bearing part, 210, second rotating shaft, 220, second bearing disc, 221, second mounting hole, 230, second drive piece, 240, second transmission piece, 241, second transmission belt, 242, second transmission wheel, 250, second sealing piece. DETAILED DESCRIPTION

[0040] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be understood as limiting the present invention.

[0041] Figure 1 It is a structural schematic diagram of the chamber structure 1 in the related art. Figure 2 This is an enlarged view of the chamber structure 1 in the related art. Figure 1 and Figure 2 The chamber structure 1 includes a furnace body 2, a wafer boat 3, a rotating shaft 5, a process door 6, and a rotary drive device 7. To smoothly feed a large number of wafers 4 into the furnace body 2, the wafers 4 are placed in the wafer boat 3 and moved into the furnace body 2 via the vertically movable process door 6. To ensure uniform heating of the wafers 4 during the process and prevent processing failures caused by uneven temperature distribution in the furnace body 2, a boat rotation mechanism is incorporated into the bottom of the wafer boat 3.

[0042] The boat rotation mechanism drives the wafer boat 3 to rotate at a preset speed, which in turn drives the wafers 4, ensuring uniform heating of the wafers 4 during processing. The boat rotation mechanism includes a shaft 5 and a rotation drive 7. The wafer boat 3 is placed on the shaft 5. The rotation drive 7 is connected to the shaft 5 and is used to drive the shaft 5 to rotate. The rotation of the shaft 5 drives the rotation of the wafer boat 3.

[0043] Generally speaking, the wafer boat 3 and the rotating shaft 5 are fixedly connected by bolts or other fasteners. However, the chamber structure 1 in the related art may have the following problems: problems with force and position offset of the wafer 4. During the start-up and braking of the rotating shaft 5, due to the fixed connection between the wafer boat 3 and the rotating shaft 5, the wafer boat 3 may be subjected to a large force instantaneously, affecting the wafer 4 placed inside the wafer boat 3. The start-up and braking process of the rotating shaft 5 may cause instantaneous force on the wafer 4, and even cause the position of the wafer 4 to shift. This instability may have a negative impact on the process effect, especially for wafers 4 that have undergone special process treatment or wafers 4 with high process uniformity requirements.

[0044] In order to reduce this adverse effect, the related art generally adopts the following measures: reducing the number of wafers 4 placed in the wafer boat 3 in a single process and reducing the inertial effect of the wafers 4 by reducing the weight of the wafer boat 3 (including the wafers 4).

[0045] However, the related art has at least the following disadvantage: the reduced number of wafers 4 leads to wasted space. To address the aforementioned stress issue on the wafers 4, the related art adopts a strategy of reducing the number of wafers 4 placed in the wafer boat 3 during a single process. However, this approach wastes space in the chamber of the furnace body 2, as the furnace cavity is not fully utilized. This impacts the operating efficiency of the semiconductor process equipment, as the processing capacity of the semiconductor process equipment cannot be fully utilized.

[0046] To address the aforementioned technical issues, the present invention provides a wafer boat loading device 10 for use in semiconductor process equipment 30. This device not only prevents wafers from being affected by forces that could cause them to shift position when the wafer boat is activated, but also increases the density of wafers carried by the boat. In this way, while ensuring the safety of the wafers under stress, the internal space of the furnace body 31 is fully utilized, significantly improving the operating efficiency of the semiconductor process equipment 30.

[0047] In order to better explain this embodiment, the following is described in combination with the accompanying drawings. It should be noted that the structure in the accompanying drawings is only a schematic illustration and does not specifically limit the structure in this embodiment. Other structures derived therefrom are also within the scope of protection of this utility model.

[0048] Figure 3 2 is a cross-sectional view of the process door device 20 according to the embodiment of the present invention. Figure 3 The wafer boat carrying device 10 includes a first carrying component 100 and a second carrying component 200. The first carrying component 100 is used to carry the wafer boat and drive the wafer boat to rotate in a first predetermined direction at a first predetermined speed. The second carrying component 200 is connected to the first carrying component 100 and is used to drive the first carrying component 100 to rotate in a second predetermined direction at a second predetermined speed. The first predetermined direction is opposite to the second predetermined direction, and the first predetermined speed is greater than the second predetermined speed.

[0049] It should be noted that the first support member 100 is used to drive the wafer boat to rotate, while the second support member 200 is used to drive the first support member 100 to rotate the wafer boat, and the two support members drive the wafer boat to rotate in opposite directions. In other words, the angular velocity and angular acceleration of the wafer boat's rotation are affected by both the first support member 100 and the second support member 200. It is understood that the direction of motion of the wafer boat is a first predetermined direction, and the first predetermined rotational speed is greater than the second predetermined rotational speed.

[0050] Optionally, the first supporting member 100 can be used to drive the wafer boat to rotate clockwise at a first preset speed, and the second supporting member 200 can be used to drive the first supporting member 100 to rotate counterclockwise at a second preset speed that is less than the first preset speed. Alternatively, the first supporting member 100 can be used to drive the wafer boat to rotate counterclockwise at a first preset speed, and the second supporting member 200 can be used to drive the first supporting member 100 to rotate clockwise at a second preset speed that is less than the first preset speed. The specific settings of the first preset direction and the second preset direction are not limited herein, as long as they are opposite.

[0051] In response to the problems existing in the prior art such as the wafer being subjected to force, collision or position shifting during the startup process, the present application adds a second supporting component 200, and utilizes the second supporting component 200 to provide the first supporting component 100 with a force that can cause the wafer boat to turn in the opposite direction, so that the angular velocity of the wafer boat is increased to the target value with a more stable angular acceleration, thereby significantly reducing the force on the wafer boat and the wafer, reducing the degree to which the wafer is affected by inertia during the startup process, and effectively preventing the wafer from being bumped or shifted during these processes. In such an environment, the wafer is no longer susceptible to the severe impact of the startup inertia, thereby greatly improving the safety and stability of the wafer during the process. At the same time, the embodiments of the present application improve the stability of the wafer boat during rotation by reducing the inertial effect on the wafer during the startup process, thereby increasing the number of wafers that can be loaded on the wafer boat at a time, effectively improving the utilization rate of the semiconductor process equipment 30, and thus improving the production capacity of the semiconductor process equipment 30.

[0052] This application not only solves the problem of force on the wafer during the startup process, but also improves the utilization rate of the furnace body 31 by increasing the number of wafers loaded at a time, thereby significantly improving the yield and production capacity of the semiconductor process equipment 30.

[0053] Optionally, the second preset rotational speed is 0.35 to 0.5 times the first preset rotational speed.

[0054] In some embodiments, the angular acceleration of the second rotating shaft 210 is 0.8 to 1 times the angular acceleration of the first rotating shaft 110. For example, the first predetermined rotation speed may be 2.8 r / min, and the angular acceleration may be 0.6 r / s^2; the second predetermined rotation speed may be 1.2 r / min, and the angular acceleration may be 0.6 r / s^2.

[0055] See also Figure 3 The first supporting member 100 includes a first rotating shaft 110 and a first supporting plate 120. The first supporting plate 120 is connected to one end of the first rotating shaft 110 to support the wafer boat. The second supporting member 200 includes a second rotating shaft 210. The first rotating shaft 110 and the second rotating shaft 210 are coaxially arranged, and the second rotating shaft 210 is sleeved outside the first rotating shaft 110.

[0056] In this embodiment, the first carrier plate 120 is used to support the wafer boat, and the first rotating shaft 110 is connected to the surface of the first carrier plate 120 facing away from the wafer boat. The first rotating shaft 110 is configured to rotate at a first predetermined speed in a first predetermined direction, thereby driving the first carrier plate 120 to rotate at the first predetermined speed in the first predetermined direction. Similarly, the second rotating shaft 210 is disposed outside the first rotating shaft 110 and is configured to rotate at a second predetermined speed in a second predetermined direction, thereby driving the first rotating shaft 110 to rotate at the second predetermined speed in the second predetermined direction. In other words, while the first rotating shaft 110 rotates in the first predetermined direction, it is also subjected to a force (provided by the second rotating shaft 210) that rotates in the second predetermined direction. Because the second predetermined speed provided by the second rotating shaft 210 is less than the angular velocity (i.e., the first predetermined speed) achieved by the first rotating shaft 110, the first rotating shaft 110 still rotates in the first predetermined direction.

[0057] Figure 4 FIG. 1 is a top view of the first carrier plate 120 according to an embodiment of the present invention. Figure 5 This is a front view of the first carrier plate 120 according to an embodiment of the present invention. Figures 3 to 5 The first carrier plate 120 is thicker at the edges and thinner in the middle, forming an overall disc-shaped structure. The first carrier plate 120 is also provided with a first mounting hole 122, which is connected to the wafer boat via a fastener to prevent the wafer boat from shaking. Optionally, the fastener can be a quartz screw. The first carrier plate 120 and the first rotating shaft 110 bracket can be connected via vacuum bolts.

[0058] In an optional embodiment, the second supporting member 200 further includes a second supporting plate 220, which is located below the first supporting plate 120. The second supporting plate 220 is connected to an end of the second rotating shaft 210 that is close to the first supporting plate 120. The second supporting plate 220 is used to increase the stability of the wafer boat when the first rotating shaft 110 and the second rotating shaft 210 rotate.

[0059] Figure 6 FIG. 2 is a top view of the second carrier plate 220 according to an embodiment of the present invention. Figure 7 2 is a front view of the second carrier plate 220 according to an embodiment of the present invention. Figure 6 and Figure 7 The second carrier plate 220 is thicker at the edges and thinner in the middle, forming a disc-shaped structure. A second mounting hole 221 is provided on the second carrier plate 220, which is connected to the door body 21 via a fastener. The second carrier plate 220 can be connected to the second rotating shaft 210 via vacuum bolts.

[0060] The specific dimensions of the first and second carrier trays 120 and 220 can be adaptively designed based on the dimensions of the furnace body 31 and the wafer boat. The only requirement is that the diameter and thickness of the first carrier tray 120 be sufficient to support the wafer boat's movement. For example, the thickness of the second carrier tray 220 is 1.5 times that of the first carrier tray 120.

[0061] In some embodiments, the diameter of the second carrier plate 220 is smaller than the diameter of the first carrier plate 120 .

[0062] Optionally, the diameter of the second carrier plate 220 is 0.6 to 0.85 times the diameter of the first carrier plate 120 . In other words, the diameter of the second carrier plate 220 is at most 0.85 times the diameter of the first carrier plate 120 .

[0063] Figure 9 It is a structural schematic diagram of the process door device 20 according to an embodiment of the present invention. Figure 10 This is a structural diagram of the process door device 20 in another perspective according to the embodiment of the present invention. Figure 3 、 Figure 9 and Figure 10 The first bearing component 100 further includes a first driving member 130 and a first transmission member 140 . The first driving member 130 is used to provide power for the first rotating shaft 110 to rotate. The first transmission member 140 is connected to the first driving member 130 and the first rotating shaft 110 .

[0064] Specifically, the first driving member 130 , the first transmission member 140 , the first rotating shaft 110 and the first carrying plate 120 are connected in sequence.

[0065] Optionally, the first drive member 130 includes a first motor, which serves as the starting point for power transmission and is used to convert electrical energy into mechanical energy. When the first motor is energized, it generates rotational motion and outputs power. The first transmission member 140 includes a first transmission belt 141 and a first transmission pulley 142. The first transmission belt 141 is used to transmit the power of the first motor to the first rotating shaft 110. Through the transmission of the first transmission belt 141, the rotational motion of the first motor is ultimately converted into rotational motion on the first rotating shaft 110. The first transmission belt 141 can specifically be a belt—a flexible transmission element—that transmits the power generated by the first motor to the first rotating shaft 110. Belt transmission can adjust the transmission ratio, reduce vibration, and reduce noise. The power generated by the rotation of the first motor is transmitted to a belt connected to the motor shaft. The belt begins to move under the action of tension, transmitting power to the first rotating shaft 110 to which it is connected.

[0066] See also Figure 3 、 Figure 9 and Figure 10The second bearing component 200 further includes a second driving member 230 and a second transmission member 240 . The second driving member 230 is used to provide power for the second rotating shaft 210 to rotate. The second transmission member 240 is connected to the second driving member 230 and the second rotating shaft 210 .

[0067] Specifically, the second driving member 230, the second transmission member 240, the second rotating shaft 210, and the second carrier plate 220 are connected in sequence. To prevent interference between the second transmission member 240 and the first transmission member 140, the axial length of the first rotating shaft 110 is greater than the axial length of the second rotating shaft 210. This allows the end of the first rotating shaft 110 away from the first carrier plate 120 to extend from the interior of the second rotating shaft 210 for connection with the first transmission member 140.

[0068] Optionally, the second drive member 230 includes a second motor, which serves as the starting point for power transmission and is used to convert electrical energy into mechanical energy. When the second motor is energized, it generates rotational motion and outputs power. The second transmission member 240 includes a second transmission belt 241 and a second transmission pulley 242. The second transmission belt 241 is used to transmit the power of the second motor to the second rotating shaft 210. Through the transmission of the second transmission belt 241, the rotational motion of the motor is ultimately converted into rotational motion on the second rotating shaft 210. The second transmission belt 241 can specifically be a belt—a flexible transmission element—that transmits the power generated by the second motor to the second rotating shaft 210. Belt transmission can adjust the transmission ratio, reduce vibration, and reduce noise. The power generated by the rotation of the second motor is transmitted to a belt connected to the motor shaft. The belt begins to move under the action of tension, transmitting power to the second rotating shaft 210 to which it is connected.

[0069] In an optional embodiment, the first bearing member 100 further includes a first sealing member 150, see Figure 3 , the first sealing member 150 is located between the first transmission member 140 and the first rotating shaft 110. In an optional embodiment, the second bearing member 200 further includes a second sealing member 250, see Figure 3 The second sealing member 250 is located between the second transmission member 240 and the second rotating shaft 210 .

[0070] Optionally, the first seal 150 and / or the second seal 250 can be a magnetic fluid device, which includes a magnetic fluid to achieve a rotary seal. Magnetic fluid, also known as magnetic fluid or magnetic liquid, is a suspension system formed by tiny magnetic particles suspended in a liquid. These tiny magnetic particles are usually composed of ferrite, iron oxide or other magnetic materials. The working principle of magnetic fluid is based on the influence of an external magnetic field on the magnetic particles therein. When the magnetic fluid is exposed to an external magnetic field, the magnetic particles are magnetized by the magnetic field. Under the guidance of the external magnetic field, the magnetic particles exhibit properties similar to those of magnetic solids, forming the overall magnetism of the magnetic fluid. Because magnetic fluid exhibits fluidity and controllability under a magnetic field, it is widely used to manufacture magnetic seals to prevent gas from entering the cavity of the semiconductor process equipment 30 through the process door device 20. The entry of external air may cause temperature fluctuations in the furnace, affecting the process effect. The sealed state helps to maintain the required high temperature environment.

[0071] In order to further improve the sealing performance of the process door device 20 , a sealing ring is provided between the first sealing member 150 and the first rotating shaft 110 , and / or a sealing ring is provided between the second sealing member 250 and the second rotating shaft 210 .

[0072] Figure 12 This is a comparison diagram of the rotation speed of the wafer boat using the wafer boat carrying device 10 according to the embodiment of the present invention and the rotation speed of the wafer boat in the related art, wherein the horizontal axis represents time in seconds; the vertical axis represents angular velocity in r / min. Figure 12 The dotted line in the figure represents the corresponding relationship between the angular velocity of the crystal boat and time in the related art, and the solid line represents the corresponding relationship between the angular velocity of the crystal boat and time in the present invention. Figure 12 , when the first motor and the second motor are started at the same time, but because the starting time of the first motor has a lag value compared to the second motor (lag value = first preset speed / 3*first preset angular acceleration), the starting time of the first motor is longer than the starting time of the second motor. When the first motor is started, the second motor stops working. At the same time, the first motor continues to accelerate until the angular velocity of the first rotating shaft 110 reaches a uniform speed. The above-mentioned starting method of the first motor and the second motor can break through the minimum starting acceleration time of the stepper motor, thereby minimizing the vibration of the wafer caused by inertia.

[0073] The inventors of this application have found the difference in the rotation speeds of the wafer boats in the related art and the wafer boats in the embodiment of this application during the simulation operation. Figure 12 It can be seen that when accelerating to the same angular velocity (for example, 2.8 r / min), the time required for the wafer boat in the related technology is only 5 s, the speed changes faster, so the acceleration is greater, and the wafer boat and the rotating shaft are connected by a hard connection, so the force exerted on the wafer boat and the wafer is greater.

[0074] However, the acceleration time of the wafer boat in the embodiment of the present application is about 15 seconds, the speed changes more slowly, the acceleration process is more reasonable, and the force applied to the wafer boat is smaller.

[0075] During the simulation, wafer damage due to wafer bumps was reduced by 33%. Because the acceleration process is smoother, the inertia of the wafer has less impact on the wafer boat, and the reaction force of the wafer boat on the wafer is also less, thus increasing the number of wafers processed in a single process. By using a dual-axis process gate, the number of wafers processed in a single process can be increased by 25%.

[0076] The present application further provides a process door device 20 , which includes a door body 21 and the wafer boat carrying device 10 of the above embodiment. The door body 21 is connected to the second carrying component 200 .

[0077] In some embodiments, a cooling assembly may be provided on the door body 21 to reduce the temperature of the door body 21. Optionally, the cooling assembly includes an annular cooling channel provided inside the door body 21.

[0078] The first carrying component 100 includes a first carrying plate 120, and the second carrying component 200 includes a second carrying plate 220. The first carrying plate 120 is used to carry the wafer boat. Figure 8 This is a front view of the first carrier plate 120, the second carrier plate 220 and the door body 21 according to an embodiment of the present invention. Figure 8 The first carrier plate 120, the second carrier plate 220 and the door 21 are sequentially arranged along the axial direction of the door 21. In the semiconductor process equipment 30, the door 21 is located below the second carrier plate 220 and is fixedly connected to the second carrier plate 220.

[0079] Figure 11 : is a cross-sectional view of a semiconductor processing device according to an embodiment of the present invention. Figure 11 The semiconductor processing equipment 30 includes a chamber and a process door device 20. The opening of the chamber faces the process door device 20, and the door body 21 of the process door device 20 is used to rise and fall to close or open the opening. The process door device 20 adopts the process door device 20 of the above embodiment.

[0080] In some embodiments, the semiconductor process equipment 30 further includes a temperature sensor 32. The following uses a vertical furnace as an example to illustrate the role of the temperature sensor 32 in the semiconductor process equipment 30. In a vertical furnace, the temperature sensor 32 plays a key role in monitoring and controlling the temperature. The temperature sensor 32 can be raised and lowered in a direction parallel to the axial direction of the door 21, so that when the wafer boat carrier 10 rotates, it descends to the bottom of the second carrier plate 220; and when the wafer boat carrier 10 stops rotating (stationary), it rises to the top of the first carrier plate 120 (see FIG. 1 ). Figure 8) to measure the temperature near the wafer boat.

[0081] In an optional embodiment, at least one first notch 121 is provided on an edge of the first carrier plate 120 . The first notch 121 can allow the temperature sensor 32 to pass through when the first carrier plate 120 is stationary, so as to avoid the temperature sensor 32 .

[0082] In another optional embodiment, at least one second notch (not shown) is provided on the edge of the second carrier plate 220 . The second notch can allow the temperature sensor 32 to pass through when the second carrier plate 220 is stationary, so as to avoid the temperature sensor 32 .

[0083] Specifically, if the diameter of the second carrier plate 220 is smaller than that of the first carrier plate 120 and the second carrier plate 220 does not interfere with the raising and lowering of the temperature sensor 32, the first carrier plate 120 has a first notch 121 at its edge, but the second carrier plate 220 does not need a second notch. When the wafer boat carrier 10 stops rotating, the temperature sensor 32 can be controlled to rise until it is located within the first notch 121 at the edge of the first carrier plate 120.

[0084] In the description of the present invention, it should be understood that the terms "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0085] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections, or mutual communication; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0086] In the description of the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature can include the first and second features directly contact, or can include the first and second features are not directly contact but contact through another feature between them. Moreover, the first feature is "on", "above" and "on" the second feature includes the first feature is directly above and obliquely above the second feature, or just means the horizontal height of the first feature is higher than the second feature. The first feature is "under", "below" and "under" the second feature includes the first feature is directly below and obliquely below the second feature, or just means the horizontal height of the first feature is less than the second feature.

[0087] In the description of the present application, the description of the terms "one embodiment", "certain embodiments", "exemplary embodiment", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0088] It can be understood that the above embodiments are only exemplary embodiments adopted for illustrating the principles of the present application, and the present application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present application, and these modifications and improvements are also considered as the protection scope of the present application.

Claims

1. A wafer boat carrying device for semiconductor process equipment, characterized in that: include: a first carrying component, the first carrying component being used to carry the wafer boat and drive the wafer boat to rotate around a first preset direction at a first preset speed; a second bearing member, the second bearing member being connected to the first bearing member, and the second bearing member being used to drive the first bearing member to rotate around a second preset direction at a second preset speed; The first preset direction is opposite to the second preset direction, and the first preset speed is greater than the second preset speed.

2. The wafer boat carrying device according to claim 1, characterized in that: The first bearing member includes a first rotating shaft and a first bearing plate, and the second bearing member includes a second rotating shaft; The first carrying plate is connected to one end of the first rotating shaft to carry the wafer boat; The first rotating shaft and the second rotating shaft are coaxially arranged, and the second rotating shaft is sleeved outside the first rotating shaft.

3. The wafer boat carrying device according to claim 2, characterized in that: The second carrying component further includes a second carrying plate, and the second carrying plate is located below the first carrying plate; The second carrying plate is connected to an end of the second rotating shaft close to the first carrying plate.

4. The wafer boat carrying device according to claim 3, characterized in that: The diameter of the second carrier plate is smaller than the diameter of the first carrier plate.

5. The wafer boat carrying device according to claim 4, characterized in that: The diameter of the second carrier plate is 0.6 to 0.85 times the diameter of the first carrier plate.

6. The wafer boat carrying device according to claim 2, characterized in that: The first bearing member further includes a first driving member and a first transmission member, wherein the first driving member is used to provide power for rotating the first rotating shaft, and the first transmission member is connected to the first driving member and the first rotating shaft; The second bearing component further includes a second driving member and a second transmission member. The second driving member is used to provide power for the second rotating shaft to rotate. The second transmission member is connected to the second driving member and the second rotating shaft.

7. The wafer boat carrying device according to claim 6, characterized in that: The first bearing component further includes a first sealing member, and the first sealing member is located between the first transmission member and the first rotating shaft; The second bearing component further includes a second sealing component, and the second sealing component is located between the second transmission component and the second rotating shaft.

8. The wafer boat carrying device according to claim 1, wherein: The second preset rotation speed is 0.35 to 0.5 times the first preset rotation speed.

9. A process gate device for semiconductor process equipment, characterized in that: It comprises a door body and the wafer boat carrying device according to any one of claims 1 to 8, wherein the door body is connected to the second carrying component.

10. The process door device according to claim 9, characterized in that: The first carrying component includes a first carrying plate, the second carrying component includes a second carrying plate, the first carrying plate is used to carry the wafer boat, and the first carrying plate, the second carrying plate and the door body are sequentially arranged along the axial direction of the door body.

11. The process door device according to claim 10, characterized in that: At least one first notch is provided on an edge of the first carrier plate, and the first notch can allow a temperature sensor of the semiconductor process equipment that is raised and lowered in a direction parallel to the axial direction of the door to pass through when the first carrier plate is stationary, so as to avoid the temperature sensor; and / or At least one second notch is provided at the edge of the second carrier plate. When the second carrier plate is stationary, the second notch can allow the temperature sensor of the semiconductor process equipment raised and lowered in a direction parallel to the axial direction of the door to pass through so as to avoid the temperature sensor.

12. A semiconductor process equipment, characterized in that: It comprises a cavity and a process door device, wherein the opening of the cavity faces the process door device, and the door body of the process door device is used to rise and fall to close or open the opening; Wherein, the process door device adopts the process door device described in any one of claims 9 to 11.

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