Die cooling device

Abstract

The utility model provides a mold cooling device which comprises an upper mold core, a lower mold core and a side ejection block, a mold core is arranged on the lower mold core in a penetrating mode, and the bottom of the mold core is fixed to a lower mold. The upper part of the mold core extends out of the lower mold core, a mold cavity is formed in the upper mold core, and the mold cavity of the upper mold core is over against the upper part of the mold core; lower mold beryllium copper is arranged in the lower mold core and wraps the mold core located in the lower mold core, and the bottom of the lower mold beryllium copper and the bottom of the lower mold core are located on the same surface. The technical scheme has the advantages that the lower mold beryllium copper capable of wrapping the mold core is arranged in the lower mold core, the lower mold beryllium copper has a good heat dissipation effect, heat of the mold core can be taken away, efficient heat dissipation of the mold core is achieved, and the device is simple in structure and good in heat dissipation effect.

Description

TECHNICAL FIELD

[0001] The utility model belongs to injection molding equipment technical field especially, relate to a mould cooling device. BACKGROUND

[0002] Plastic mold is the tool used with plastic forming machine in plastic processing industry, for giving plastic product complete configuration and accurate size. Because plastic variety is various, processing method is different, and the structure complexity of plastic forming machine and plastic product is different, the type and structure of plastic mold also show the diversification characteristics.

[0003] Plastic mold is a tool specially used for producing plastic product, which is composed of multiple components and contains a forming cavity. In the injection molding process, the mold is fixed on the injection molding machine, the molten plastic is injected into the forming cavity, and the product is cooled and shaped in the cavity. Then, the upper and lower molds are separated, the finished product is pushed out of the cavity by the ejector device, and the mold is closed again for the next injection molding. The whole injection molding process is a continuous cycle.

[0004] In order to produce plastic products with cylindrical hole structure in the mold, a cylindrical core is usually used, but under long time work, the core is in direct contact with the injected material, and the temperature of the core is high. High temperature will affect the structural stability of the core, resulting in the appearance of defective products. Therefore, the core needs to be cooled during injection molding. The commonly used cooling method is to circulate gaseous or liquid low-temperature heat-conducting medium in the part, but for some smaller or complex structure parts, it is difficult to form a closed loop channel inside the part, which leads to the problems of slow cooling speed and poor cooling effect in the prior art, thereby reducing the production efficiency of injection molding products and the yield.

[0005] At the same time, there is a lack of effective means to cool the glue injection channel in the prior art, and the demolding operation cannot be performed until the glue injection channel is cooled. The step of waiting for the glue injection channel to cool usually takes a long time, which reduces the production efficiency. UTILITY MODEL CONTENTS

[0006] The utility model provides a mould cooling device, can increase the cooling effect of mould core and the cooling of glue injection channel, make the core satisfy the use demand, accelerate demolding time.

[0007] Other purposes and advantages of the utility model can be further understood from the technical features disclosed in the utility model.

[0008] In order to achieve one or part or all of the above-mentioned purposes or other purposes, a technical solution of the present invention provides a mold cooling device, including an upper mold core, a lower mold core and a side top block, wherein a core is provided through the lower mold core, and the bottom of the core is fixed on the lower mold; the upper part of the core extends out of the lower mold core, and a cavity is provided on the upper mold core, and the cavity of the upper mold core is opposite to the upper part of the core; a lower mold beryllium copper is provided in the lower mold core, and the lower mold beryllium copper wraps the core located in the lower mold core, and the bottom of the lower mold beryllium copper is on the same surface as the bottom of the lower mold core. The beneficial effect of this solution is that a lower mold beryllium copper that can wrap the core is provided in the lower mold core, and the lower mold beryllium copper has a better heat dissipation effect and can take away the heat of the core. The bottom of the lower mold beryllium copper is on the same surface as the bottom of the lower mold core and will not be wrapped by the lower mold core, which facilitates heat dissipation. By setting the lower mold beryllium copper in the lower mold core, the lower mold of the general mold is fixed, so while meeting the heat dissipation effect, the mold structure will not become complicated.

[0009] An annular water cooling groove is provided on the lower mold beryllium copper, and a water cooling channel is provided at the connection between the lower mold beryllium copper and the lower mold core; the water cooling channel extends into the water cooling groove.

[0010] The two water cooling channels are symmetrically arranged, and the two water cooling channels are a liquid inlet channel and a liquid outlet channel respectively.

[0011] The water cooling groove is arranged near the upper part of the lower mold core.

[0012] A plurality of glue injection channels are provided in the upper mold core, and the outlets of the glue injection channels face the molding cavity; the glue injection channels are wrapped with upper mold beryllium copper, and the upper mold beryllium copper is provided in the upper mold core.

[0013] A heat dissipation duct is provided in the upper mold core, one end of the heat dissipation duct extends out of the upper mold core, and the upper mold beryllium copper is located at the other end opening of the heat dissipation duct.

[0014] A plurality of annular heat-conducting channels are provided on the side wall of the upper mold beryllium copper. The heat-conducting channels are annular grooves opened along the side wall of the upper mold beryllium copper. The heat-conducting channels are connected to the outside through the heat dissipation duct.

[0015] A plurality of annular heat-conducting channels are arranged on the upper mold beryllium copper at equal intervals, and the plurality of annular heat-conducting channels are all located at the openings of the heat dissipation channels.

[0016] The heat dissipation duct is arranged obliquely in the upper mold core.

[0017] The plurality of glue injection channels provided in the upper mold core are all wrapped with upper mold beryllium copper, and the upper mold beryllium copper wrapping each glue injection channel dissipates heat outwards through the heat dissipation duct; the plurality of glue injection channels (22) are connected to the flow channel (21), and the plurality of flow channels (21) are connected to a glue injection port (2).

[0018] Compared with the existing technology, the present invention has the following advantages: 1. A lower mold beryllium copper is placed inside the lower mold core, enveloping the mold core. This lower mold beryllium copper has excellent heat dissipation, removing heat from the mold core. The bottom of the lower mold beryllium copper is flush with the bottom of the lower mold core and is not enveloped by the lower mold core, facilitating heat transfer. By placing the lower mold beryllium copper inside the lower mold core, the lower mold of a conventional mold is fixed, thus achieving heat dissipation without complicating the mold structure.

[0019] 2. By setting water cooling channels and water cooling grooves on the lower mold core and the lower mold beryllium copper, the heat dissipation effect of the lower mold beryllium copper on the core can be enhanced. Because the part of the core extending out of the lower mold core participates in the molding of the material, the water cooling groove is set near the top of the lower mold core to further enhance the heat dissipation effect of the core.

[0020] 3. An upper mold beryllium copper is set in the upper mold core. The upper mold beryllium copper wraps the glue injection channel. The heat dissipation channel opened on the side dissipates heat from the upper mold beryllium copper, and then dissipates heat from the glue injection channel, so that the material in the glue injection channel can be cooled quickly and is easy to demold.

[0021] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the specific embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 Schematic diagram of an injection mold including a cooling device provided in Example 1 of the present invention.

[0024] Figure 2 for Figure 1 A local enlarged schematic diagram in .

[0025] Figure 3 This is a top view of the lower mold core of the device of the utility model.

[0026] In the figure, 1, glue guide plate; 2, glue injection port; 21, runner; 22, glue injection channel; 3, molding cavity; 4, right top block; 5, left top block; 6, lower mold core; 7, lower mold beryllium copper; 71, water-cooling groove; 8, core; 81, base; 82, stepped portion; 83, upper part of core; 9, upper mold core; 10, upper mold beryllium copper; 101, heat conduction channel; 11, heat dissipation duct; 12, water-cooling channel. DETAILED DESCRIPTION

[0027] The aforementioned and other technical aspects, features, and functions of the present invention are clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. Directional terms such as up, down, left, right, front, and back, used in the following embodiments, are merely references to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes only and are not intended to limit the present invention.

[0028] Example 1

[0029] Example 1 provides a mold cooling device. To enhance heat dissipation from the core 8 within the lower mold core 6, the mold cooling device provided in Example 1 includes a lower mold beryllium copper 7 disposed within the lower mold core 6, which completely encapsulates the core 8 within the lower mold core 6. The upper portion 83 of the core 8, extending beyond the main body of the lower mold core 6, is aligned with the cavity of the upper mold core 9. The forming cavity 3 is formed between the cavity of the upper mold core 9 and the upper portion 83 of the core. Material contacts the upper portion 83 of the core, transferring heat to the core 8 within the lower mold core 6, where it is then removed by the lower mold beryllium copper 7.

[0030] Since the bottom surface of the lower mold beryllium copper 7 is on the same surface as the bottom surface of the lower mold core 6, the bottom of the lower mold beryllium copper 7 can transfer heat to the outside. At the same time, the lower mold beryllium copper 7 has a good heat dissipation effect and can conduct the heat on the core 8 away.

[0031] The following is combined with Figures 1-3 For a detailed explanation and description of the device of the utility model, see Figure 1 as well as Figure 2 The injection mold of the present invention includes an upper mold core 9 and a lower mold core 6. The upper mold core 9 is fixed in the upper mold, and the lower mold core 6 is fixed in the lower mold. A core 8 is passed through the lower mold core 6. The bottom of the core 8 is provided with a base 81. The base 81 can be used to fix the core 8 in the lower mold. After the core 8 passes through the lower mold core 6, the upper part 83 of the core cooperates with the upper mold core 9 to form the material. For details, see Figure 2, an upper mold core 9 cavity is provided in the upper mold core 9. When the mold is closed, the upper core 83 is inserted into the upper mold core 9 cavity. The molding cavity 3 of the mold is formed between the upper mold core 9 cavity and the upper core 83, between the lower mold core 6 and the upper mold core 9, between the lower mold core 6 and the left top block 5, and between the lower mold core 6 and the right top block 4. A plurality of glue injection channels 22 are provided on the upper mold core 9. The bottom outlet of the glue injection channel 22 faces the molding cavity 3. The material is heated and injected into the molding cavity 3, thereby filling the entire molding cavity 3. The plurality of glue injection channels 22 are connected to the flow channel 21 on the glue guide plate 1, and the plurality of flow channels 21 are finally connected to a glue injection port 2. Through a glue injection port 2 and a flow channel, injection material can be provided to each molding cavity 3.

[0032] Because the upper portion 83 of the core directly contacts the material, it absorbs a significant amount of heat during product molding, causing the core 8 to overheat. Therefore, heat dissipation from the core 8 is necessary. The present invention incorporates a lower mold beryllium copper 7 within the lower mold core 6. This lower mold beryllium copper 7 wraps around the core 8 within the lower mold core 6. The diameter of the upper portion 83 of the core is smaller than that of the core 8 within the lower mold core 6. A step 82 is provided at the intersection of the two to adjust the diameter of the core 8. The lower mold beryllium copper 7 wraps around the core 8, terminating at the lower end of the step 82. This maximizes the wrapping of the lower mold beryllium copper 7 around the core 8, achieving optimal heat dissipation. The bottom surface of the lower mold beryllium copper 7 is coplanar with the bottom surface of the lower mold core 6, allowing the lower mold beryllium copper 7 to conduct heat directly to the lower mold, eliminating the need for heat transfer via the lower mold core 6 and improving heat dissipation.

[0033] As an embodiment, an annular water-cooling groove 71 can be provided on the lower mold beryllium copper 7. The water-cooling groove 71 is located near the upper portion of the lower mold core 6. This is because the upper portion 83 of the core is in direct contact with the material, and thus the upper portion 83 of the core will overheat. The closer the water cooling device is to the upper portion 83 of the core, the better the heat dissipation effect on the upper portion 83 of the core. Two water-cooling channels 12 are provided at the connection between the lower mold beryllium copper 7 and the lower mold core 6. The two water-cooling channels 12 are symmetrically arranged at both ends of the lower mold beryllium copper 7 and are both connected to the water-cooling groove 71. The two water-cooling channels 12 serve as the liquid inlet channel and the liquid outlet channel respectively. Figure 3 The inlet and outlet of the water cooling channel 12 are opened on the bottom surface of the lower mold beryllium copper 7 and the lower mold core 6. The two water cooling channels 12 can realize circulating heat dissipation. In this embodiment, heat transfer is carried out by water cooling, which has the advantages of high heat transfer efficiency and good heat dissipation effect.

[0034] In order to cool the glue injection channel 22 and facilitate rapid cooling of the glue injection channel 22, thereby reducing the time the glue injection channel 22 waits for cooling during demolding, the present invention provides an upper mold beryllium copper 10 within the upper mold core 9. Multiple glue injection channels 22 are provided within the upper mold core 9, each of which is surrounded by the upper mold beryllium copper 10. A heat dissipation duct 11 is also provided on the upper mold core 9. One end of the heat dissipation duct 11 extends out of the upper mold core 9, and the other end is opened at the upper mold beryllium copper 10, facilitating communication between the upper mold beryllium copper 10 and the outside world for heat dissipation.

[0035] As an embodiment, multiple heat-conducting channels 101 can be opened on the side wall of the upper mold beryllium copper 10. Multiple heat-conducting channels 101 can be evenly arranged. The heat-conducting channels 101 can be arranged as a ring-open square groove. Multiple heat-conducting channels 101 are arranged at equal distances and all are located at one end opening of the heat dissipation duct 11. The setting of the heat-conducting channels 101 can realize the flow of airflow and enhance the heat dissipation effect of the upper mold beryllium copper 10.

[0036] As an embodiment, the heat dissipation duct 11 can be set in an inclined form, and then the opening of the heat dissipation duct 11 in the upper mold core 9 can be set wider to increase the contact area with the upper mold beryllium copper 10 and improve the heat dissipation effect.

[0037] As an embodiment, in order to further improve the heat dissipation effect of the upper mold beryllium copper 10, cold air can be blown into the upper mold beryllium copper 10 through the heat dissipation duct 11 to dissipate heat. The cold air fully contacts the upper mold beryllium copper 10 through the heat conduction channel 101 to dissipate heat.

[0038] The above describes in detail the mold cooling device provided by the present invention. This article uses specific examples to illustrate the structure and operating principles of the present invention. The description of the above embodiments is intended only to facilitate understanding of the method and core concept of the present invention. It should be noted that those skilled in the art may make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A mold cooling device, comprising an upper mold core (9), a lower mold core (6) and a side top block, characterized in that: A core (8) is provided through the lower mold core (6), and the bottom of the core (8) is fixed on the lower mold; The upper part (83) of the core extends out of the lower mold core (6), and a mold cavity is provided on the upper mold core (9), and the mold cavity of the upper mold core (9) faces the upper part (83) of the core; A lower mold beryllium copper (7) is provided in the lower mold core (6), and the lower mold beryllium copper (7) wraps the core (8) located in the lower mold core (6), and the bottom of the lower mold beryllium copper (7) and the bottom of the lower mold core (6) are on the same surface.

2. A mold cooling device according to claim 1, characterized in that: An annular water cooling groove (71) is provided on the lower mold beryllium copper (7), and a water cooling channel (12) is provided at the connection between the lower mold beryllium copper (7) and the lower mold core (6); The water cooling channel (12) extends into the water cooling groove (71).

3. A mold cooling device according to claim 2, characterized in that: Two water cooling channels (12) are symmetrically arranged, and the two water cooling channels (12) are respectively a liquid inlet channel and a liquid outlet channel.

4. A mold cooling device according to claim 2, characterized in that: The water cooling groove (71) is arranged close to the upper part of the lower mold core (6).

5. A mold cooling device according to claim 1, characterized in that: A plurality of glue injection channels (22) are provided in the upper mold core (9), and the outlets of the glue injection channels (22) face toward the molding cavity (3); The glue injection channel (22) is wrapped with an upper mold beryllium copper (10), and the upper mold beryllium copper (10) is arranged in the upper mold core (9).

6. A mold cooling device according to claim 5, characterized in that: A heat dissipation duct (11) is provided in the upper mold core (9), one end of the heat dissipation duct (11) extends out of the upper mold core (9), and the upper mold beryllium copper (10) is located at the other end opening of the heat dissipation duct.

7. A mold cooling device according to claim 6, characterized in that: A plurality of annular heat-conducting channels are provided on the side wall of the upper mold beryllium copper (10); the heat-conducting channels (101) are annular grooves opened along the side wall of the upper mold beryllium copper (10); and the heat-conducting channels (101) are connected to the outside through the heat dissipation duct (11).

8. A mold cooling device according to claim 7, characterized in that: A plurality of annular heat-conducting channels (101) are arranged at equal intervals on the upper mold beryllium copper (10), and the plurality of annular heat-conducting channels (101) are all located at the openings of the heat dissipation channels.

9. A mold cooling device according to claim 6, characterized in that: The heat dissipation duct (11) is arranged obliquely in the upper mold core (9).

10. The mold cooling device according to claim 6, characterized in that: The plurality of glue injection channels (22) provided in the upper mold core (9) are all wrapped with upper mold beryllium copper (10), and the upper mold beryllium copper (10) wrapping each glue injection channel (22) dissipates heat outwards through the heat dissipation duct (11); A plurality of glue injection channels (22) are connected to the flow channel (21), and the plurality of flow channels (21) are connected to one glue injection port (2).

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