Hot melting mechanism and wafer film tearing device

Abstract

The utility model relates to the technical field of wafer processing, and discloses a hot melting mechanism and a wafer film tearing device, and the hot melting mechanism comprises a carrying table, a hot melting assembly, a lifting assembly and a monitoring assembly. The carrying table is used for carrying a wafer, a protective film is arranged on the surface of the wafer, and a hot melt adhesive tape is arranged on the protective film; the hot melting assembly is arranged above the carrying table and comprises a hot melting welding head; the lifting assembly is connected with the hot melting assembly and can drive the hot melting assembly to ascend and descend, and when the hot melting welding head extrudes the hot melting adhesive tape, the hot melting welding head can connect the hot melting adhesive tape with the protective film in a hot melting mode; the monitoring assembly is arranged between the lifting assembly and the hot melting assembly and electrically connected with the lifting assembly, and the monitoring assembly is configured to monitor the pressure applied to the hot melting adhesive tape by the hot melting welding head so as to control the pressure applied to the hot melting adhesive tape by the hot melting welding head to be within a preset range. According to the design, the pressure applied to the hot melting adhesive tape by the hot melting welding head can be controlled, and wafer damage caused by the fact that the pressure exceeds a preset range is prevented.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer processing, and particularly relates to a hot melting mechanism and a wafer film tearing device. BACKGROUND

[0002] As a cornerstone of modern society, semiconductor technology promotes the progress and innovation of countless industries with the rapid development of the semiconductor industry. Wafer is a relatively important component in the semiconductor industry. In the wafer processing process, the wafer needs to be thinned to reduce the size of the chip and improve the integration. After the wafer is thinned, the wafer needs to be placed in a film tearing device to tear off the protective film of the wafer and attach a cutting film.

[0003] In the related art, after the wafer is thinned, the protective film of the wafer needs to be torn off by a film tearing device. When the protective film is torn off, the hot melt adhesive tape is first pressed to the surface of the wafer by using a hot melt welding head. In the process of pressing the surface of the wafer by using the hot melt welding head, the applied pressure cannot be accurately controlled. For wafers of different thicknesses, the pressure and the stroke of the hot melt welding head for tearing the film of the wafer with a relatively large thickness will cause damage to the wafer when tearing the film of the wafer with a relatively small thickness, thereby affecting the production efficiency and the yield and increasing the manufacturing cost. CONTENT OF THE INVENTION

[0004] Embodiments of the present application disclose a wafer film tearing device, which can control the pressure applied to the hot melt adhesive tape to prevent the wafer from being damaged due to excessive pressure.

[0005] To achieve the above-mentioned purpose, in a first aspect, embodiments of the present application disclose a hot melting mechanism, which is used for hot melt connecting a protective film of a wafer and a hot melt adhesive tape, and the hot melting mechanism comprises:

[0006] a carrier, which is used for carrying the wafer, and the wafer is provided with the protective film on the surface;

[0007] a hot melting assembly, which is arranged above the carrier, and the hot melting assembly comprises a hot melt welding head;

[0008] a lifting assembly, which is connected with the hot melting assembly, and the lifting assembly can drive the hot melting assembly to lift, and when the hot melt welding head extrudes the hot melt adhesive tape, the hot melt welding head can hot melt connect the hot melt adhesive tape and the protective film; and

[0009] a monitoring assembly, which is arranged between the lifting assembly and the hot melting assembly and is electrically connected with the lifting assembly, and the monitoring assembly is configured to monitor the pressure applied by the hot melt welding head to the hot melt adhesive tape to control the pressure applied by the hot melt welding head to the hot melt adhesive tape within a preset range.

[0010] As an optional implementation, the monitoring assembly comprises a pressure sensor, the pressure sensor comprises a sensing end and an output end, the sensing end is connected with the hot melt assembly, the sensing end is configured to sense the pressure applied by the hot melt assembly to the wafer, and the output end is electrically connected with the lifting assembly, and the output end is configured to transmit the pressure signal sensed by the sensing end to the lifting assembly.

[0011] As an optional implementation, the lifting assembly comprises a fixed support, a first lifting support and a first driving member, the first lifting support is slidingly connected with the fixed support, the first driving member is arranged on the fixed support, the first driving member is used to drive the first lifting support to lift, and the hot melt assembly is arranged on the first lifting support.

[0012] As an optional implementation, the hot melt assembly further comprises a second lifting support and an elastic member, the hot melt welding head is arranged on the second lifting support, the second lifting support is slidingly connected with the first lifting support in the vertical direction, and the elastic member is arranged between the first lifting support and the second lifting support, and the elastic member is configured to apply pressure to the hot melt welding head when the hot melt adhesive tape contacts the protective film.

[0013] As an optional implementation, the hot melt assembly further comprises a first guide member, the first guide member is connected with the first lifting support, the first guide member is arranged in the vertical direction, and the first guide member penetrates through the second lifting support, the elastic member is sleeved on the first guide member, the pressure sensor is arranged on the first guide member, a first end of the elastic member abuts against the sensing end, a second end of the elastic member abuts against the second lifting support, and when the elastic member is extruded, the sensing end can sense the extrusion force applied by the elastic member to the sensing end.

[0014] As an optional implementation, the hot melt welding head is connected below the second lifting support, the second lifting support is provided with a through hole, the through hole penetrates through the second lifting support in the vertical direction, the first guide member is slidingly matched with the through hole, a lower end of the first guide member is provided with a stop portion, the stop portion is located below the through hole, a radial dimension of the stop portion is greater than a hole diameter of the through hole, a lower surface of the second lifting support is provided with a groove, the stop portion is located in the groove, and a depth of the groove in the vertical direction is greater than a thickness of the stop portion.

[0015] As an optional implementation, the hot melt assembly further comprises a protection member, the protection member is connected with the first lifting support, the protection member extends in the vertical direction, and the protection member is located at a side of the hot melt welding head.

[0016] As an optional embodiment, the hot melt assembly further includes a second driving member, which is disposed on the first lifting bracket, and the second driving member is used to drive the hot melt welding joint to move along the vertical direction relative to the protective member.

[0017] As an optional embodiment, the first lifting bracket includes a bracket body and an adjustment plate rotatably arranged on the bracket body, the second lifting bracket is slidably connected to the adjustment plate through a second guide member, the second driving member is arranged on the adjustment plate, and the hot melt mechanism also includes a third driving member, the third driving member is arranged on the bracket body, and the driving end of the third driving member is connected to the adjustment plate to drive the adjustment plate to rotate, thereby adjusting the angle between the hot melt welding joint and the horizontal direction.

[0018] In a second aspect, an embodiment of the present application provides a wafer film tearing device for tearing off a protective film of a wafer, the wafer film tearing device comprising:

[0019] The hot melt mechanism as described in the first aspect above;

[0020] an adhesive tape supply assembly, the adhesive tape supply assembly being used to supply hot melt adhesive tape to the hot melt mechanism; and

[0021] A clamping assembly is used to clamp the hot melt tape to separate the protective film from the wafer.

[0022] Compared with the prior art, the present invention has the following advantages:

[0023] The wafer film tearing device provided by the embodiment of the application comprises a table, a hot melting assembly, a lifting assembly and a monitoring assembly. The table is used for carrying a wafer. The wafer surface is provided with a protective film, and the protective film is provided with a hot melt tape. The hot melting assembly is arranged above the table. The hot melting assembly comprises a hot melting welding head. The lifting assembly is connected with the hot melting assembly. The lifting assembly can drive the hot melting assembly to lift. When the hot melting welding head extrudes the hot melt tape, the hot melting welding head can hot melt connect the hot melt tape and the protective film. The monitoring assembly is arranged between the lifting assembly and the hot melting assembly and is electrically connected with the lifting assembly. The monitoring assembly is configured to monitor the pressure applied by the hot melting welding head to the hot melt tape, so as to control the pressure applied by the hot melting welding head to the hot melt tape within a preset range. In this way, the monitoring assembly electrically connected with the lifting assembly can monitor the pressure applied by the hot melting welding head to the hot melt tape in real time. When the pressure applied by the hot melting welding head to the hot melt tape is sufficient, the monitoring assembly controls the lifting assembly to stop moving. When the film is torn for wafers with different thicknesses, the monitoring assembly can monitor the pressure received by the wafers with different thicknesses after the wafers with different thicknesses contact the hot melt tape. The wafer damage caused by the pressure of the hot melting welding head cannot be adjusted according to the wafer thickness is avoided. The production efficiency and yield of the wafer are ensured, and the manufacturing cost is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed in the embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative effort.

[0025] Figure 1 Structure diagram of the hot melting mechanism (not including the table) disclosed by the embodiment of the application;

[0026] Figure 2 Structure diagram of the hot melting assembly and the monitoring assembly disclosed by the embodiment of the application;

[0027] Figure 3 Partial structure diagram of the hot melting mechanism (including the table) disclosed by the embodiment of the application.

[0028] Explanation of reference signs:

[0029] 100-hot melting mechanism;

[0030] 200-wafer; 220-hot melt tape;

[0031] 1-table;

[0032] 2 - hot melt assembly; 21 - hot melt welding head; 22 - second lifting support; 221 - groove; 23 - second driving member; 24 - first guide member; 241 - stop; 25 - elastic member; 26 - protection member;

[0033] 3 - lifting assembly; 31 - fixed support; 32 - first lifting support; 321 - support body; 322 - adjusting plate; 33 - first driving member; 34 - second guide member;

[0034] 4 - monitoring assembly; 41 - pressure sensor; 5 - third driving member. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0036] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0037] In addition, in addition to being used to indicate the orientation or positional relationship, the above-mentioned partial terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. Those of ordinary skill in the art can understand the specific meaning of these terms in the present application according to the specific situation.

[0038] In addition, the terms "mount", "set", "provided with", "connected", "connected" should be broadly understood. For example, it can be fixedly connected, detachably connected, or integrally constructed; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. Those of ordinary skill in the art can understand the specific meaning of the above-mentioned terms in the present application according to the specific situation.

[0039] In addition, the terms "first", "second", and the like are used merely to distinguish different devices, elements or components (the specific type and configuration of which can be the same or different), and are not intended to indicate or imply relative importance or significance of the indicated devices, elements or components. The meaning of "a plurality" is two or more, unless otherwise specified.

[0040] Semiconductor technology, as one of the cornerstones of modern society, is leading the innovation and progress of numerous industries with its astonishing development speed. In the semiconductor industry, wafers, as a crucial component, involve numerous precise and complex processes in their manufacturing process. In particular, in the wafer thinning process, the purpose is not only to significantly reduce the size of the chip and improve the integration of integrated circuits, but also to meet the urgent demand for high-performance and miniaturized electronic products in the current market.

[0041] However, wafer thinning is only part of the entire manufacturing process. After thinning is completed, the next key process is to place the waer on a tear-off film machine to remove the protective film on the waer surface and then attach a cutting film. This step is crucial to ensure the stability and integrity of the waer during subsequent processing.

[0042] In related technologies, the removal of waer protective film is usually completed by a tear-off film device. One of the core components of the device is a hot melt welding head, which is responsible for pressing the hot melt tape to the waer surface to achieve the peeling of the protective film. However, in this pressing process, in related technologies, when facing wafers of different thicknesses, the tear-off film device may not be able to flexibly adjust the size of the pressure it applies. Specifically, when the waer thickness is large, the pressure required to tear off the film and the travel of the hot melt welding head will also increase accordingly. However, if such parameters are used to process wafers with thin thickness, it is likely to cause damage or scratches on the waer surface.

[0043] Once the waer is damaged, not only will it affect the stability and reliability of the subsequent processing process, but also will reduce the production efficiency and yield of the entire production line.

[0044] Therefore, in related technologies, it is not possible to achieve more precise and flexible pressure control for wafers of different thicknesses.

[0045] Based on this, the present application provides a hot melt mechanism and a waer tear-off film device, which can control the size of the pressure applied to the hot melt tape to prevent waer damage caused by excessive pressure.

[0046] The technical solutions of the present application will be further described below in conjunction with embodiments and drawings.

[0047] Please refer to Figures 1 to 3In a first aspect, the present application discloses a hot melt mechanism 100, which is used to hot-melt the protective film of a wafer 200 with a hot melt tape 220. The hot melt mechanism 100 includes a carrier 1, a hot melt assembly 2, a lifting assembly 3, and a monitoring assembly 4. Specifically, the carrier 1 is used to carry the wafer 200, and the surface of the wafer 200 placed on the carrier 1 is provided with a protective film. The hot melt assembly 2 is arranged above the carrier 1, and the hot melt assembly 2 includes a hot melt welding joint 21. The hot melt welding joint 21 is used to squeeze the hot melt tape 220 onto the protective film on the surface of the wafer 200, and heat the hot melt tape 220 to hot-melt the hot melt tape 220 so that the hot melt tape 220 and the protective film are hot-melt connected. The lifting component 3 is connected to the hot melt component 2, and the lifting component 3 can drive the hot melt component 2 to rise and fall. When the hot melt welding joint 21 squeezes the hot melt tape 220 under the drive of the lifting component 3, the hot melt welding joint 21 and the hot melt tape 220 contact the protective film together, so that the hot melt tape 220 and the protective film are hot-melt connected.

[0048] Because before tearing off the protective film on the surface of the wafer 200, the hot melt welding joint 21 needs to apply pressure to the hot melt tape 220 to make the hot melt tape 220 contact the protective film, controlling the magnitude of the pressure applied by the hot melt welding joint 21 is the key to preventing the wafer 200 from being damaged. The embodiment of the present application is provided with a monitoring component 4, which is used to monitor the pressure applied by the hot melt welding joint 21 to the hot melt tape 220 under the drive of the lifting component 3 to ensure that the pressure applied by the hot melt welding joint 21 is within a preset range. In other words, the pressure applied by the hot melt welding joint 21 can be adaptively adjusted according to the thickness of the wafer 200. When the pressure applied by the hot melt welding joint 21 to the hot melt tape 220 is sufficient, the monitoring component 4 will control the lifting component 3 to stop moving downward. When the hot melt welding joint 21 presses down on wafers 200 of different thicknesses, the monitoring component 4 can adjust the pressure applied to the hot melt tape 220 according to the different thicknesses of the wafers 200, thereby preventing the hot melt tape 220 from being pressed using the pressure parameters required for contact between the thicker wafer 200 surface and the hot melt tape 220, thereby preventing the hot melt tape 220 from contacting the thinner wafer 200 surface and causing damage to the wafer 200. Therefore, by controlling the lifting and lowering of the lifting component 3 according to the different thicknesses of the wafers 200 through the monitoring component 4, damage to the wafer 200 caused by excessive downward pressure from the hot melt welding joint is avoided, thereby ensuring the production efficiency and yield of the wafer 200 and reducing manufacturing costs.

[0049] Among them, the hot melt welding joint 21 includes a welding head body and a heating fixture. The welding head body is fixedly connected to the heating fixture. The welding head body is made of heat-conducting material. A heating rod is arranged in the heating fixture. Heat-conducting material is coated between the heating rod and the welding head body, or a heat-conducting member is arranged. The heating rod heats the welding head body to realize the hot melt welding function of the hot melt welding joint 21.

[0050] It should be noted that the monitoring component 4 has a control end, which converts the pressure applied by the hot melt welding joint 21 to the hot melt tape 220 into a signal, and transmits the signal to the control end, which then controls the movement of the lifting component 3.

[0051] In some embodiments, as Figure 2 As shown, monitoring assembly 4 includes a pressure sensor 41, a device that senses pressure signals and converts them into usable electrical signals according to a specific pattern. Pressure sensor 41 converts the pressure exerted on a pressure-bearing component into mechanical deformation, which is then converted into an electrical signal and transmitted to the unit to be controlled. Pressure sensor 41 includes a sensing end and an output end. The sensing end is connected to hot melt assembly 2 and is capable of sensing the pressure applied by hot melt assembly 2 to hot melt tape 220 by lift assembly 3. The output end of pressure sensor 41 is electrically connected to lift assembly 3 and is capable of converting the pressure sensed by the sensing end into an electrical signal and transmitting it to lift assembly 3. This allows lift assembly 3 to make real-time adjustments based on the pressure signal transmitted from the sensing end to the output end, preventing insufficient pressure from preventing hot melt tape 220 from fusing to the protective film, or excessive pressure from causing contact between the hot melt tape 220 and the protective film and compressing wafer 200, potentially damaging it.

[0052] For example, when the pressure sensed by the sensing end has not yet reached the pressure required by the thickness of the wafer 200 to achieve the desired thermal connection between the hot melt tape 220 and the protective film, the lifting assembly 3 continues to move downward, driving the hot melt welding head 21 to continue applying pressure. This prevents the hot melt tape 220 from failing to thermally connect to the protective film due to insufficient pressure.

[0053] For example, when the pressure sensed by the sensing end reaches the pressure required to fuse the hot melt tape 220 to the protective film, the output end transmits a stop signal to the lifting assembly 3, causing the lifting assembly 3 to stop at the current position, thereby allowing the hot melt tape 220 to fuse to the protective film of the wafer 200 via the hot melt welding head 21. This prevents excessive pressure from causing the hot melt tape 220 to contact the protective film and squeeze the wafer 200, thereby damaging the wafer 200.

[0054] It can be understood that the pressure sensor 41 converts the pressure value sensed by the sensing end into a signal, and then sends the signal from the output end. At this time, the control end in the monitoring component 4 receives the signal sent by the output end of the pressure sensor 41, and controls the lifting component 3 to drive the movement of the hot melt welding joint 21 through the received signal.

[0055] In some embodiments, as Figure 1As shown, the lifting assembly 3 includes a fixed bracket 31, a first lifting bracket 32, and a first driving member 33. The first lifting bracket 32 ​​is slidably connected to the fixed bracket 31. The first driving member 33 is used to drive the first lifting bracket 32 ​​to move upward and downward. The hot melt assembly 2 is disposed on the first lifting bracket 32. The first driving member 33 drives the first lifting bracket 32 ​​to move upward and downward, so that the hot melt assembly 2 is moved upward and downward by the first lifting bracket 32, thereby realizing automatic lifting of the first lifting bracket 32.

[0056] The first driving member 33 may be a motor or a cylinder, which is not specifically limited in this embodiment.

[0057] Exemplarily, the first driving member 33 is a motor. Specifically, the fixed bracket 31 is provided with a motor, the driving end of which is connected to the first lifting bracket 32. Driven by the motor, the first lifting bracket 32 ​​is raised and lowered, thereby causing the hot melt assembly 2 to rise and fall. The motor's driving performance is stable and reliable, providing a continuous and stable driving force. Within the lifting assembly 3, the motor precisely controls the speed and position of the first lifting bracket 32, ensuring that the hot melt assembly 2 accurately reaches the predetermined operating position, ensuring full contact between the hot melt tape 220 and the protective film, and guaranteeing the accuracy and reliability of the lifting assembly 3.

[0058] In some embodiments, as Figure 3 As shown, the hot melt assembly 2 further includes a protective member 26 , which is connected to the first lifting bracket 32 ​​. The protective member 26 extends in a vertical direction and is located on the side of the hot melt welding joint 21 .

[0059] Among them, the protective part 26 is located on the side of the hot melt welding joint 21, which means that the protective part 26 can be arranged around the hot melt welding joint 21, that is, the hot melt welding joint 21 is wrapped by the protective part 26; the protective part 26 is located on the side of the hot melt welding joint 21, which can also mean that the protective part 26 is arranged on the side of the hot melt welding joint 21 close to the operator.

[0060] Since the hot melt welding joint 21 is heated during the process of hot-melt connection between the hot melt tape 220 and the protective film, the temperature of the hot melt welding joint 21 is very high. A protective part 26 is provided on the side of the hot melt welding joint 21 to isolate the operator from the hot melt welding joint 21 and prevent the operator from being burned by the hot melt welding joint 21.

[0061] It should be noted that the protective member 26 is made of heat-insulating material, which may be fiber material, graphite, polyurethane foam, high-density polyethylene or other heat-insulating materials, and this embodiment does not specifically limit this.

[0062] In some embodiments, as Figure 3As shown, the hot melt assembly 2 further comprises a second driving member 23, which is arranged on the first lifting support 32 and is configured to drive the hot melt welding head 21 to move along the vertical direction relative to the protection member 26. The hot melt welding head 21 is driven to move up and down by the second driving member 23, so that the hot melt welding head 21 can extend out of the protection member 26 or be retracted into the protection member 26 under the driving of the second driving member 23.

[0063] For example, when the hot melt welding head 21 needs to be pressed down to make the hot melt adhesive tape 220 contact with the protection film of the wafer 200, the second driving member 23 drives the hot melt welding head 21 to move down, so that the hot melt welding head 21 extends out of the protection member 26 under the driving of the second driving member 23; after the hot melt welding head 21 connects the hot melt adhesive tape 220 and the protection film, the second driving member 23 drives the hot melt welding head 21 to move up, so that the hot melt welding head 21 is retracted into the protection member 26 under the driving of the second driving member 23.

[0064] It should be noted that the second driving member 23 can be a pneumatic cylinder or a motor, and the present embodiment does not make specific limitation thereto.

[0065] Further, as shown in Figure 3 the hot melt assembly 2 further comprises a second lifting support 22 and an elastic member 25, the hot melt welding head 21 is arranged on the second lifting support 22, the second lifting support 22 is slidably connected to the first lifting support 32 along the vertical direction, and the elastic member 25 is arranged between the first lifting support 32 and the second lifting support 22. The elastic member 25 is configured to apply pressure to the hot melt welding head 21 when the hot melt adhesive tape 220 contacts with the protection film of the wafer 200.

[0066] When the first lifting support 32 moves down, the hot melt welding head 21 is pressed down to make the hot melt adhesive tape 220 contact with the protection film of the wafer 200, and the hot melt welding head 21 is subjected to a vertical upward reaction force, so that the second lifting support 22 compresses the elastic member 25 upward. Since the elastic member 25 can be deformed, it applies pressure to the hot melt welding head 21 during the deformation process. Therefore, the monitoring assembly 4 identifies whether the pressure of the hot melt welding head 21 is within the preset range through the deformation of the elastic member 25. In the above embodiment, the pressure of the hot melt welding head 21 is controlled within the preset range by the monitoring assembly 4, which avoids damaging the wafer 200. Meanwhile, after the elastic member 25 is compressed and deformed by the second lifting support 22, it applies pressure to the hot melt welding head 21 through its elastic deformation, which further improves the hot melt welding effect, makes the connection between the hot melt adhesive tape 220 and the protection film more firm, and ensures that the hot melt adhesive tape 220 is fully connected with the protection film.

[0067] In some embodiments, as Figure 2As shown, the hot melt assembly 2 further comprises a first guide 24 connected to the first lifting bracket 32, the first guide 24 is arranged in the vertical direction and penetrates the second lifting bracket 22, the elastic member 25 is sleeved on the first guide 24, and the pressure sensor 41 is arranged on the first guide 24. The first end of the elastic member 25 abuts against the sensing end, and the second end of the elastic member 25 abuts against the second lifting bracket 22. When the elastic member 25 is extruded, the sensing end can sense the extrusion force applied by the elastic member 25 to the sensing end. That is to say, the pressure sensor 41 senses the pressure applied by the hot melt welding head 21 to the hot melt adhesive tape 220 through the deformation degree of the elastic member 25.

[0068] Exemplarily, because the first guide 24 penetrates the second lifting bracket 22, when the hot melt welding head 21 extrudes the hot melt adhesive tape 220 to contact the protective film on the surface of the wafer 200, the second lifting bracket 22 extrudes the elastic member 25, and the pressure sensor 41 senses the deformation degree of the elastic member 25 through the sensing end, and then converts it into a signal from the output end to control the movement of the hot melt welding head 21 under the driving of the lifting assembly 3.

[0069] It should be noted that the first guide 24 can be a cylindrical guide column, a rectangular guide rail or a linear guide rail, and the elastic member 25 can be a spiral spring, a disc spring or a rubber ring, and the present embodiment does not make specific limitation thereto.

[0070] Further, as shown in the figure, Figure 2 The hot melt welding head 21 is connected below the second lifting bracket 22, the second lifting bracket 22 is provided with a through hole penetrating the second lifting bracket 22 in the vertical direction, the first guide 24 is in sliding fit with the through hole, the lower end of the first guide 24 is provided with a stop portion 241, the stop portion 241 is located below the through hole, and the radial dimension of the stop portion 241 is greater than the hole diameter of the through hole.

[0071] Through the stop portion 241 at the lower end of the first guide 24, the second lifting bracket 22 and the hot melt welding head 21 can be hung at the lower end of the first guide 24, and the stop portion 241 provides support to prevent the second lifting bracket 22 and the hot melt welding head 21 from being separated.

[0072] The lower surface of the second lifting bracket 22 is provided with a groove 221, and the stop portion 241 is located in the groove 221. The depth of the groove 221 in the vertical direction is greater than the thickness of the stop portion 241.

[0073] Since the first guide member 24 is inserted into the through hole of the second lifting bracket 22 and slides with the through hole, the groove 221 formed on the lower surface of the second lifting bracket 22 provides a sliding space for the first guide member 24, ensuring that when the elastic member 25 is compressed by the upper surface of the second lifting bracket 22, the first guide member 24 can smoothly extend into the groove 221, thereby ensuring the normal operation of the pressure sensor 41 in sensing pressure.

[0074] In some embodiments, as Figure 1 As shown, the first lifting bracket 32 ​​includes a bracket body 321 and an adjustment plate 322. The second lifting bracket 22 is slidably connected to the adjustment plate 322 via a second guide member 34. The second driving member 23 is disposed on the adjustment plate 322. The hot melt mechanism 100 also includes a third driving member 5. The third driving member 5 is disposed on the bracket body 321, and the driving end of the third driving member 5 is connected to the adjustment plate 322 to drive the adjustment plate 322 to rotate, thereby adjusting the angle between the hot melt welding joint 21 and the horizontal direction.

[0075] It should be noted that the head of the hot melt welding joint 21 in the embodiment of the present application can be rectangular, crescent-shaped or other shapes, and its shape is determined according to the hot melt welding.

[0076] Therefore, the adjustment plate 322 is driven to rotate by the third driving member 5, so that the hot melt welding joint 21 changes its angle with the horizontal direction under the drive of the adjusting plate 322 to adapt to the different shapes of the hot melt welding joint 21, so that the hot melt welding joint 21 can fully extrude the hot melt tape 220 under different shapes, so that the hot melt tape 220 and the protective film are fully hot-melt connected.

[0077] It is worth noting that the third driving member 5 in this embodiment can be a fine-tuning threaded column, a motor or other devices that can rotate the adjustment plate 322 in the horizontal direction, and this embodiment does not make any specific limitation to this.

[0078] Exemplarily, the third driving member 5 is a fine-tuning threaded column, that is, the bracket body 321 and the adjustment plate 322 are connected by a fine-tuning threaded column. By rotating the fine-tuning threaded column, the distance between the adjustment plate 322 and the bracket body 321 can be changed. There are three fine-tuning threaded columns on a circle of the adjustment plate 322. By rotating one of the fine-tuning threaded columns, the angle between the adjustment plate 322 and the horizontal direction can be changed, thereby changing the angle between the hot melt welding joint 21 and the horizontal direction.

[0079] The second aspect of the present application discloses a wafer film tearing device for tearing off the protective film of a wafer 200. The wafer film tearing device includes the hot melt mechanism 100, a tape supply assembly, and a clamping assembly described in the first aspect. The tape supply assembly is used to provide a hot melt tape 220 to the hot melt mechanism 100, and the clamping assembly is used to clamp the hot melt tape 220. After the hot melt tape 220 is hot-melted to the protective film of the wafer 200, the hot melt tape 220 is clamped by the clamping assembly and the hot melt tape 220 is torn off to separate the protective film from the wafer 200.

[0080] The wafer film tearing device provided in the embodiment of the present application can avoid the wafer 200 being damaged due to excessive pressure due to the unadjustable pressure applied by the hot melt welding joint 21 in the hot melt mechanism 100 during the process of tearing the protective film of the wafer 200, thereby reducing the number of damaged wafers 200, ensuring the yield of the wafer 200 after the film tearing process, and further ensuring the stability and reliability of the subsequent processing process, which can improve the production efficiency and yield of the entire wafer production line and reduce the production cost of re-production due to a large number of damaged wafers 200.

[0081] The following is a brief description of the operation process of the wafer film tearing device disclosed in the embodiment of the present application:

[0082] First, the thinned wafer 200 is placed on the carrier 1 of the hot melt mechanism 100, and the hot melt tape 220 is provided between the hot melt component 2 of the hot melt mechanism 100 and the wafer 200 through the tape supply component;

[0083] Next, the lifting assembly 3 of the hot melt mechanism 100 drives the hot melt welding head 21 of the hot melt assembly 2 to move downward, so as to squeeze the hot melt tape 220 onto the protective film of the wafer 200;

[0084] Furthermore, after the hot melt welding joint 21 contacts the surface of the wafer 200 through the hot melt tape 220, the hot melt welding joint 21 compresses the elastic member 25 upward. The pressure sensor 41 of the monitoring assembly 4 monitors the deformation of the elastic member 25. When it detects that the pressure applied by the hot melt welding joint 21 to the hot melt tape 220 is sufficient, the pressure sensor 41 controls the lifting assembly 3 to stop descending.

[0085] Finally, after the hot melt welding head 21 hot-melts the hot melt tape 220 and the protective film, the hot melt welding head 21 rises and clamps the hot melt tape 220 and tears it up through the clamping component, so that the protective film is separated from the wafer 200 under the drive of the hot melt tape 220, thus completing the film tearing.

[0086] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A hot melt mechanism for hot-melt connection of a wafer protective film and a hot melt tape, characterized in that: include: A carrier, the carrier is used to carry a wafer, and a protective film is provided on the surface of the wafer; A hot melt assembly, the hot melt assembly being disposed above the carrier, the hot melt assembly comprising a hot melt welding joint; A lifting assembly, wherein the lifting assembly is connected to the hot melt assembly, and the lifting assembly can drive the hot melt assembly to move up and down, and when the hot melt welding head squeezes the hot melt tape, the hot melt welding head can hot-melt the hot melt tape and the protective film; and A monitoring component is arranged between the lifting component and the hot melt component and is electrically connected to the lifting component. The monitoring component is configured to monitor the pressure applied by the hot melt welding joint to the hot melt tape to control the pressure applied by the hot melt welding joint on the hot melt tape to be within a preset range.

2. The hot melt mechanism according to claim 1, characterized in that: The monitoring component includes a pressure sensor, which includes a sensing end and an output end. The sensing end is connected to the hot melt component, and the sensing end is configured to sense the magnitude of the pressure applied by the hot melt component to the hot melt tape. The output end is electrically connected to the lifting component, and the output end is configured to transmit the pressure signal sensed by the sensing end to the lifting component.

3. The hot melt mechanism according to claim 2, characterized in that: The lifting assembly includes a fixed bracket, a first lifting bracket and a first driving member. The first lifting bracket is connected to the fixed bracket. The first driving member is arranged on the fixed bracket. The first driving member is used to drive the first lifting bracket to rise and fall. The hot melt assembly is arranged on the first lifting bracket.

4. The hot melt mechanism according to claim 3, characterized in that: The hot melt assembly also includes a second lifting bracket and an elastic member. The hot melt welding joint is arranged on the second lifting bracket. The second lifting bracket is slidably connected to the first lifting bracket along the vertical direction. The elastic member is arranged between the first lifting bracket and the second lifting bracket. The elastic member is configured to apply pressure to the hot melt welding joint when the hot melt tape contacts the protective film.

5. The hot melt mechanism according to claim 4, characterized in that: The hot melt assembly also includes a first guide member, which is connected to the first lifting bracket. The first guide member is arranged in a vertical direction and passes through the second lifting bracket. The elastic member is sleeved on the first guide member. The pressure sensor is arranged on the first guide member. The first end of the elastic member abuts the sensing end, and the second end of the elastic member abuts the second lifting bracket. When the elastic member is squeezed, the sensing end can sense the squeezing force applied by the elastic member to the sensing end.

6. The hot melt mechanism according to claim 5, characterized in that: The hot melt welding joint is connected to the bottom of the second lifting bracket. The second lifting bracket is provided with a through hole. The through hole passes through the second lifting bracket along the vertical direction. The first guide member is slidably engaged with the through hole. The lower end of the first guide member is provided with a stop portion. The stop portion is located below the through hole, and the radial dimension of the stop portion is larger than the aperture of the through hole. The lower surface of the second lifting bracket is provided with a groove. The stop portion is located in the groove. The depth of the groove in the vertical direction is greater than the thickness of the stop portion.

7. The hot melt mechanism according to claim 4, characterized in that: The hot melt assembly further includes a protective member connected to the first lifting bracket. The protective member extends along the vertical direction and is located on a side of the hot melt welding joint.

8. The hot melt mechanism according to claim 7, characterized in that: The hot melt assembly further includes a second driving member, which is disposed on the first lifting bracket and is used to drive the hot melt welding joint to move along the vertical direction relative to the protective member.

9. The hot melt mechanism according to claim 8, characterized in that: The first lifting bracket includes a bracket body and an adjustment plate rotatably arranged on the bracket body, the second lifting bracket is slidably connected to the adjustment plate through a second guide member, and the second driving member is arranged on the adjustment plate. The hot melt mechanism also includes a third driving member, which is arranged on the bracket body, and the driving end of the third driving member is connected to the adjustment plate to drive the adjustment plate to rotate, thereby adjusting the angle between the hot melt welding joint and the horizontal direction.

10. A wafer film tearing device for tearing off a protective film of a wafer, characterized in that: include: The hot melt mechanism according to any one of claims 1 to 9; an adhesive tape supply assembly, the adhesive tape supply assembly being located on one side of the carrier of the hot melt mechanism and being used for supplying hot melt adhesive tape to the hot melt mechanism; and A clamping assembly is located on the other side of the carrier, and is used to clamp the hot melt tape to separate the protective film from the wafer.

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