Electrical connection structure of integrated circuit

Abstract

An integrated circuit electric connection structure comprises an array electrode and an insulating layer, the array electrode is provided with a plurality of conductive columns arranged side by side, the plurality of conductive columns are arranged at intervals and respectively provided with a first electric connection end and a second electric connection end, the insulating layer is filled among the plurality of conductive columns and enables the adjacent conductive columns to be insulated, and the first electric connection end and the second electric connection end are connected with the first electric connection end and the second electric connection end respectively. The insulating layer is provided with a first surface and a second surface, the first surface is flush with the first electric connecting end of the conductive column, and the second surface is flush with the second electric connecting end of the conductive column. The integrated circuit electrical connection structure is arranged on a printed circuit board, the first electrical connection end or the second electrical connection end is electrically connected with one or more circuits on the printed circuit board respectively, and the conductive columns form an electrical connection path between the circuits on the printed circuit board and one or more wafers.

Description

Technical Field

[0001] The utility model relates to an electrical connection structure, in particular to a vertical electrical connection structure of an integrated circuit. Background Art

[0002] Three-dimensional chip stacking has become an important part of current semiconductor technology. As transistor density continues to increase, how to efficiently design and manufacture three-dimensional chip stacking structures has become the direction of industry efforts.

[0003] In a three-dimensional chip stacking structure, the vertical electrical connection structure is crucial because it affects the stability and efficiency of the chip. Utility Model Content

[0004] The utility model discloses an integrated circuit electrical connection structure, comprising an array electrode and an insulating layer. The array electrode has a plurality of side-by-side conductive pillars, each of which is spaced apart and each having a first electrical connection end and a second electrical connection end, with the second electrical connection end facing away from the first electrical connection end. The insulating layer fills the gaps between the conductive pillars and insulates adjacent conductive pillars. The insulating layer has a first surface and a second surface. The first surface is aligned with the first electrical connection end of the conductive pillar, and the second surface is aligned with the second electrical connection end of the conductive pillar.

[0005] The integrated circuit electrical connection structure is disposed on a printed circuit board, and the first electrical connection end or the second electrical connection end is electrically connected to one or more circuits on the printed circuit board. The conductive column forms an electrical connection path between the circuit on the printed circuit board and one or more chips.

[0006] In one embodiment, the plurality of conductive pillars are laterally covered by the insulating layer and are electrically separated from each other.

[0007] In one embodiment, the plurality of conductive pillars are arranged in a matrix.

[0008] In one embodiment, a height of the conductive pillar is greater than a minimum distance between the conductive pillars.

[0009] In one embodiment, a height of the conductive pillar is greater than an outer diameter of the conductive pillar.

[0010] In one embodiment, the conductive pillar extends along a thickness direction, and the thickness direction is perpendicular to the plane of the printed circuit board.

[0011] In one embodiment, the conductive pillars are arranged side by side along a planar direction, and the planar direction is parallel to the plane of the printed circuit board.

[0012] In one embodiment, the electrical connection structure is formed in a flat plate shape. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic structural diagram of an embodiment of the present utility model;

[0014] Figures 2A to 2D This is a manufacturing diagram of an embodiment of the present invention.

[0015]

Explanation of symbols

[0016] 10: Electrical connection structure

[0017] 11: Array electrode

[0018] 111: Conductive column

[0019] 111a: first electrical connection end

[0020] 111b: second electrical connection end

[0021] 12: Insulation layer

[0022] 121: Positive

[0023] 122: Back

[0024] 20: First Component

[0025] 21: Circuit

[0026] 30: Second Component

[0027] 40a, 40b: solder balls

[0028] 50: Temporary substrate

[0029] 60: Columnar array

[0030] 60a: Materials

[0031] 61: Conductive column

[0032] 70: Insulation layer

[0033] 71: Positive

[0034] 72: Back

[0035] XY: plane direction

[0036] Z: thickness direction DETAILED DESCRIPTION

[0037] The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. Unless the context indicates otherwise, the singular forms "a", "an" and "the" used herein may also include plural forms.

[0038] Directional terms used herein, such as up, down, left, right, front, and back, and their derivatives or synonyms, refer to the orientation of elements in the accompanying drawings and are not intended to limit the present invention unless the context clearly indicates otherwise. A detailed description and technical content of the present invention are provided below with reference to the accompanying drawings.

[0039] The present invention discloses an integrated circuit electrical connection structure for electrically connecting a plurality of components stacked in a vertical direction. The components may be circuit boards, substrates, chips, wafers, etc. Therefore, the electrical connection structure can be interpreted as a vertical electrical connection structure.

[0040] Figure 1 An electrical connection structure 10 is shown, disposed on a first component 20 and located between the first component 20 and a second component 30 stacked on the first component 20. The electrical connection structure 10 includes an array electrode 11 and an insulating layer 12. The array electrode 11 includes a plurality of conductive posts 111, which are disposed in a plurality of vertically extending through-holes in the insulating layer 12. In this example, the first component 20 is a printed circuit board, and the second component 30 includes a plurality of chips.

[0041] The conductive pillars 111 are arranged side by side along a planar direction XY that is substantially parallel to the plane of the printed circuit board. In one embodiment, the plurality of conductive pillars 111 are arranged in a matrix. The conductive pillars 111 are spaced apart from each other along the planar direction XY and extend along a thickness direction Z that is substantially perpendicular to the plane of the printed circuit board. In one embodiment, a height of the conductive pillars 111 is greater than a minimum spacing between adjacent conductive pillars 111 and greater than an outer diameter of the conductive pillars 111. The conductive pillars 111 each have a first electrical connection end 111a and a second electrical connection end 111b. The first electrical connection end 111a is exposed on a front surface 121 of the insulating layer 12, while the second electrical connection end 111b is exposed on a back surface 122 of the insulating layer 12, for direct or indirect electrical connection with the second component 30 or the first component 20 located above or below.

[0042] The insulating layer 12 fills the spaces between the conductive pillars 111 and insulates adjacent conductive pillars 111 in the plane direction XY. In one example, the conductive pillars 111 are laterally covered by the insulating layer 12, electrically separating them from one another. A first surface (the front surface 121) of the insulating layer 12 is aligned with the first electrical connection ends 111a of the conductive pillars 111, and a second surface (the back surface 122) of the insulating layer 12 is aligned with the second electrical connection ends 111b of the conductive pillars 111. Furthermore, the electrical connection structure 10 is formed into a flat plate.

[0043] The first electrical connection end 111a and the second electrical connection end 111b of the conductive pillar 111 can be electrically connected to the second component 30 and the first component 20 respectively through a plurality of solder balls 40a and 40b. The solder ball 40a is arranged between the second component 30 and the first electrical connection end 111a, and the solder ball 40b is arranged between the first component 20 and the second electrical connection end 111b. Accordingly, the conductive pillar 111 forms an electrical connection path between one or more circuits 21 on the first component 20 (the printed circuit board) and the second component 30 (the chip), so that the electrical connection structure 10 serves as a vertical electrical connection path between chip stacks, achieving the purpose of chip stacking and connection, and can be used in a three-dimensional (3D) packaging structure.

[0044] See Figure 2A , about the formation Figure 1 The electrical connection structure 10 can first form a conductive material 60a on a temporary substrate 50. The material 60a can be in the form of a block, plate, layer or thick film according to the needs, such as copper or other conductive metals. Then, part of the material 60a is removed to form a columnar array 60 on the temporary substrate 50, including a plurality of conductive columns 61, such as Figure 2B The removal may be performed by wet etching, dry etching, machining, etc. However, in addition to forming the conductive pillar 61 by a subtractive process, in other examples, the conductive pillar 61 may also be formed by an additive process such as electroplating.

[0045] Then, if Figure 2C As shown, UV glue or thermosetting glue is filled between the conductive pillars 61 of the columnar array 60 to insulate adjacent conductive pillars 61. The glue is then cured by ultraviolet light or heat to form an insulating layer 70. Besides UV glue or thermosetting glue, other insulating materials can also be used for the insulating layer 70. In this example, the insulating layer 70 is higher than the conductive pillars 61.

[0046] Then, if Figure 2D As shown, the temporary substrate 50 is removed, and a front surface 71 or a back surface 72 of the insulating layer 70 is polished by chemical-mechanical polishing (CMP) or other polishing techniques until the conductive pillars 61 are exposed. In one example, the temporary substrate 50 can also be removed by CMP or polishing techniques and performed together with the polishing of the insulating layer 70. Finally, the following is obtained: Figure 1 The electrical connection structure 10.

[0047] In one example, the conductive pillar 61 and the insulating layer 70 are made of non-silicon and non-glass materials, and thus are different from conventional through silicon via (TSV) and through glass via (TGV) structures and processes.

[0048] This invention utilizes the array electrodes and the insulating layer to form a vertical electrical connection path, which can be used in chip stacking and three-dimensional packaging structures. Furthermore, because the array electrodes and the insulating layer can be made of non-silicon and non-glass conductive materials, compared to TSV and TGV processes, they have the advantages of simpler manufacturing and lower cost.

Claims

1. An integrated circuit electrical connection structure, characterized in that: include: An array electrode having a plurality of conductive pillars arranged side by side, each of the conductive pillars being spaced apart from the other and each having a first electrical connection end and a second electrical connection end facing away from the first electrical connection end; as well as an insulating layer, the insulating layer filling between the plurality of conductive pillars and insulating adjacent conductive pillars, the insulating layer having a first surface aligned with the first electrical connection end of the conductive pillar and a second surface aligned with the second electrical connection end of the conductive pillar; The integrated circuit electrical connection structure is disposed on a printed circuit board, and the first electrical connection end or the second electrical connection end is electrically connected to one or more circuits on the printed circuit board, respectively. The conductive column forms an electrical connection path between the circuit on the printed circuit board and one or more chips.

2. The integrated circuit electrical connection structure according to claim 1, wherein: The plurality of conductive pillars are laterally covered by the insulating layer and are electrically separated from each other.

3. The integrated circuit electrical connection structure according to claim 1, wherein: The plurality of conductive pillars are arranged in a matrix.

4. The integrated circuit electrical connection structure according to claim 1, wherein: A height of the conductive pillar is greater than a minimum distance between the conductive pillars.

5. The integrated circuit electrical connection structure according to claim 1, wherein: A height of the conductive post is greater than an outer diameter of the conductive post.

6. The integrated circuit electrical connection structure according to claim 1, wherein: The conductive column extends along a thickness direction, and the thickness direction is perpendicular to the plane of the printed circuit board.

7. The integrated circuit electrical connection structure according to claim 1, wherein: The conductive pillars are arranged side by side along a plane direction, and the plane direction is parallel to the plane of the printed circuit board.

8. The integrated circuit electrical connection structure according to claim 1, wherein: The electrical connection structure is formed in a flat plate shape.

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