Condensation adsorption device for LPCVD (low pressure chemical vapor deposition) equipment

Abstract

The utility model provides a condensation adsorption device for LPCVD (Low Pressure Chemical Vapor Deposition) equipment. The condensation adsorption device comprises a shell and a flow choking structure, an air inlet is formed in one end of the shell, and an air outlet is formed in the other end of the shell; the flow choking structure is arranged at the end, close to the air outlet, of the interior of the shell. A containing space is formed between the flow blocking structure and the air inlet. An existing condensation and adsorption device is usually blocked due to dust accumulation at the inlet end, airflow is blocked through the flow blocking structure so that gas can be condensed and adsorbed to the inner wall of the shell, enough space is reserved on the flow blocking structure, the area of the area for dust accumulation is increased, and therefore the service time is effectively prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor manufacturing, especially relates to a condensation adsorption device for LPCVD equipment. BACKGROUND

[0002] LPCVD (low pressure chemical vapor deposition equipment) is a kind of process equipment by the chemical reaction of gas solid reactant is generated, and make it deposit on substrate surface and form thin film.Machine table in the working process, will produce a large amount of exhaust gas, these exhaust gas will flow into subsequent vacuum pipeline along with air current direction.Exhaust gas material will encounter condensation and form block drop or produce sticky phenomenon, and then when flowing into vacuum pump, it can cause the pumping speed abnormality of pump even appear downtime phenomenon.Therefore, in the design process of machine table, usually add condensation adsorption barrel in vacuum road pipe to capture dust block material, to reduce or prevent the occurrence of vacuum pump downtime accident.

[0003] Condensation adsorption barrel is usually placed between vacuum cavity and vacuum pump, for condensation and adsorption of high-temperature gas discharged from process cavity.Cooling components are arranged in condensation adsorption barrel (also can not set special cooling, utilize air cooling to realize the condensation of high-temperature gas), will make that some gaseous products in exhaust gas condense into solid and deposit on the surface of cooling component.Usually solid deposit (i.e. dust) will first accumulate in the inlet end, with the continuous increase of deposit, will make the inlet be blocked.When the inlet end is completely blocked, it must be stopped to clean or replace condensation barrel.Because condensation adsorption barrel is arranged between furnace tube and vacuum pump, generally, furnace tube temperature is reduced to normal temperature.And quartz furnace tube will increase the risk of breaking after repeated temperature rise and fall.At the same time, after cleaning or replacing condensation barrel, equipment verification and process verification are also needed, and the time consumption is also relatively long.This will inevitably reduce the overall use efficiency of LPCVD machine table, and delay production.

[0004] In order to solve the above problems, it is necessary to provide a condensation adsorption device capable of long-term use, so as to prolong the maintenance and replacement period and improve the overall production efficiency of LPCVD. UTILITY MODEL CONTENT

[0005] The utility model provides a condensation adsorption device for LPCVD equipment to solve all or part of problems of the prior art.

[0006] In order to achieve the above object, the utility model provides a condensation adsorption device for LPCVD equipment, including casing and resistance flow structure, one end of casing is provided with gas inlet, the other end is provided with gas outlet, resistance flow structure sets up in the casing inside near one end of gas outlet, accommodate space is provided between resistance flow structure and gas inlet.

[0007] The height of the accommodating space is half of the height of the internal space of the casing.

[0008] The resistance flow structure is a resistance flow plate, which is a plate structure, and the center lines of the multiple resistance flow plates are located on the axis of the casing, and the multiple resistance flow plates are combined together in an interlaced manner and uniformly distributed along the circumference.

[0009] The resistance flow plate is two, two resistance flow plates are combined together in a cross interlaced manner to form a cross baffle.

[0010] The resistance flow structure includes a bracket and a resistance flow sheet, the bracket is axially arranged in the casing, the resistance flow sheet is horizontally arranged on the bracket in the axial direction, and the resistance flow sheet is multiple and arranged on the bracket.

[0011] The resistance flow sheet is circular, and a plurality of air holes are arranged on the resistance flow sheet.

[0012] The air holes include large air holes and small air holes, and the large air holes and the small air holes are arranged alternately on the resistance flow sheet.

[0013] Further comprising an outer shell, the outer shell is sleeved on the casing and is relatively sealed with the casing, a cooling space is formed between the outer shell and the casing, and the outer shell is provided with a water inlet and a water outlet.

[0014] Compared with the prior art, the utility model has the following beneficial effects: by setting the accommodating space above the resistance flow structure, the dust can be evenly attached to the inner wall of the casing, and the internal area can be gradually accumulated to completely block, the use time of the condensation adsorption device can be effectively prolonged without affecting the airflow, and the maintenance and replacement period can be prolonged. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the specific embodiments of the present application, the drawings needed in the following embodiment description will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0016] Figure 1 The installation position schematic diagram of the condensation adsorption device in the LPCVD equipment is provided.

[0017] Figure 2 The installation position schematic diagram of the condensation adsorption device in the LPCVD equipment is provided. DETAILED DESCRIPTION

[0018] The foregoing and other technical contents, features and effects of the present application will be clearly presented in the following detailed description of a preferred embodiment in cooperation with the drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only the directions of the drawings. Therefore, the directional terms used are used for illustration and not for limitation of the present application.

[0019] As Figure 1 The installation position schematic diagram of the condensation adsorption device in the LPCVD equipment is provided. The condensation adsorption device 3 is generally installed on the vacuum pipeline between the process chamber 1 and the vacuum pump 4, and the different components are connected through the pipeline 2. The main function of the condensation adsorption device 3 is to process the high-temperature gas discharged from the process chamber 1, and to convert part of the substances in the high-temperature gas into solid state (i.e. dust) through condensation and fix them in the condensation adsorption device 3, so as to avoid the dust entering the vacuum pump 4 in the rear part, avoid the vacuum pump 4 abnormally stuck during the process running, prolong the running life of the vacuum pump 4, and further prevent the backflow of the discharged gas and pollute the process chamber.

[0020] For the condensation adsorption device 3, the inside of the condensation adsorption device 3 can be at room temperature or in a cooling state, while the gas discharged from the process chamber 1 is at a high temperature, and the temperature of the gas is much higher than the internal temperature of the condensation adsorption device 3. Thus, when the high-temperature gas enters from the inlet, it will contact the internal components (such as cooling components, flow guiding components or inner walls) and cause part of the substances to be condensed and deposited on the surface of the components due to the rapid temperature reduction. Therefore, the deposits or dust will always start to accumulate at the inlet of the condensation adsorption device 3 and quickly block the inlet end. At this time, there is still a large space in the inside of the condensation adsorption device 3 for dust deposition, but due to the blockage of the inlet end, the gas flow is not smooth, and cleaning and replacement must be performed.

[0021] Embodiment one:

[0022] In order to extend the service life of the condensation adsorption device 3 and reduce the number of replacements, the utility model provides a condensation adsorption device for LPCVD equipment.

[0023] like Figure 2 The figure shows a condensation adsorption device for LPCVD equipment provided in the first embodiment. Figure 2 A in the figure is a cross-sectional schematic diagram of the condensation adsorption device along a direction perpendicular to the axis; Figure 2 B in the figure is a schematic cross-sectional view of the condensation adsorption device along the aa direction. As shown in the figure, the condensation adsorption device includes a housing 30 and a baffle 31. The housing 30 is provided with an air inlet (not shown) at one end and an air outlet (not shown) at the other end. The baffle 31 is located inside the housing 30 near the air outlet. A storage space 32 is provided between the baffle 31 and the air inlet, and the storage space 32 occupies approximately half of the internal space of the housing 30. In this embodiment, the baffle 31 is a plate-like structure, with two baffles 31 interlaced in a cross pattern to form a cross-shaped baffle.

[0024] When the condensation adsorption device is working, the air inlet of the condensation adsorption device is connected to the process chamber 1 through the pipe 2, and the air outlet of the condensation adsorption device is connected to the vacuum pump 4 through the pipe 2. The high-temperature gas generated inside the process chamber 1 enters the air inlet of the condensation adsorption device by vacuuming (i.e., along the Figure 2 The air enters in the direction of the dotted arrow in the upper middle part), and then contacts the baffle 31. The baffle 31 can block the air flow to intercept the gas, and then use the air cooling state inside the shell 30 to make the condensable substances in the high-temperature gas transform into physical dust state after self-condensation and adhere to the inner wall of the shell 30 for collection and treatment, while the rest of the gas is discharged along the exhaust port of the shell 30 (that is, along the Figure 2 (discharge in the direction of the dotted arrow in the lower middle section).

[0025] In this embodiment, when high-temperature gas enters, condensed dust initially accumulates on the inner wall of housing 30 above baffle 31 toward the center of housing 30. Because the condensation adsorption device includes a storage space 32 above baffle 31, the accumulation area is larger, requiring longer for clogging to occur, thereby extending the lifespan. This design is estimated to extend the cleaning and replacement cycle by 25%, from the original 75 days to approximately 100 days, effectively reducing the number of downtimes for PM (preventive maintenance).

[0026] In other embodiments, the number of spoilers 31 can be greater, with the spoilers 31 interlaced and evenly distributed along the circumference. For example, if there are three spoilers 31, their centerlines lie on the same axis, and the three spoilers 31 are spaced 60° apart. Increasing the number of spoilers 31 can achieve a greater airflow obstruction effect, thereby enhancing the condensation adsorption effect on the gas.

[0027] Example 2:

[0028] This embodiment provides a condensation adsorption device for LPCVD equipment. The basic structure of the condensation adsorption device 3 in this embodiment is similar to that of the first embodiment, except that the airflow obstruction structure has been modified. In the first embodiment, the obstruction structure is a baffle 31, a plate-shaped structure extending in the same direction as the airflow, with limited airflow obstruction. In this embodiment, the obstruction structure is further improved. The obstruction structure includes a bracket and a baffle. The bracket is axially disposed within the housing 30, and the baffle is horizontally disposed axially on the bracket. There are multiple baffles, spaced apart from each other, arranged on the bracket. The baffles are circular and have multiple vents. The vents include large and small vents, with vents of different sizes arranged alternately on the baffle. In this embodiment, the obstruction structure is also disposed within the housing 30, near the air outlet. A receiving space 32 is provided between the obstruction structure and the air inlet. Because the spoilers in this embodiment are arranged horizontally, the airflow is directed along the axis of the housing 30. This means that the airflow impacts the circular spoiler surface vertically, effectively blocking the airflow. By adjusting the number of spoilers on the bracket, different blocking effects can be achieved. The vent holes provided on the spoilers also ensure smooth airflow.

[0029] Example 3:

[0030] This embodiment provides a condensation adsorption device for LPCVD equipment. The basic structure of the condensation adsorption device 3 in this embodiment is similar to that of the first embodiment, except that it is further provided with a shell.

[0031] In the embodiment one and the embodiment two, the condensation of the high-temperature gas is realized by the air cooling state inside the shell 30, that is, the heat of the high-temperature gas is dissipated to the outside air through the shell 30, and the condensation is mainly realized by the temperature difference between the high-temperature gas and the ambient temperature. In order to improve the condensation effect, the additional cooling mode can be used. In the embodiment, on the basis of the embodiment one, an outer shell is further provided, the outer shell is sleeved outside the shell 30 and is relatively sealed with the shell 30, and a cooling space is formed between the outer shell and the shell 30. A water inlet and a water outlet are arranged on the outer shell, and the circulation flow of the cooling water can be realized through the water inlet, the cooling space and the water outlet, so that the heat of the shell 30 can be dissipated all the time, and the condensation and adsorption device can realize the high-efficiency condensation and adsorption all the time.

[0032] In the embodiment, the outer shell is arranged on the basis of the embodiment one, and it can be understood that the outer shell can also be correspondingly arranged in the embodiment two.

Claims

1. A condensation adsorption device for LPCVD equipment, characterized in that: It includes a shell and a flow-blocking structure; one end of the shell is provided with an air inlet, and the other end is provided with an air outlet; The flow-blocking structure is arranged inside the shell at one end close to the air outlet; and an accommodating space is arranged between the flow-blocking structure and the air inlet.

2. The condensation adsorption device for LPCVD equipment according to claim 1, characterized in that: The height of the accommodating space is half the height of the inner space of the shell.

3. The condensation adsorption device for LPCVD equipment according to claim 2, characterized in that: The baffle structure is a baffle, which is a plate-shaped structure. There are multiple baffles, and the center lines of the multiple baffles are located on the axis of the shell. The baffles are combined together in a staggered manner and evenly distributed along the circumference.

4. The condensation adsorption device for LPCVD equipment according to claim 3, characterized in that: The baffles are two pieces, which are combined together in a cross-staggered manner to form a cross-shaped baffle.

5. The condensation adsorption device for LPCVD equipment according to claim 2, characterized in that: The flow-blocking structure includes a bracket and a flow-blocking plate. The bracket is axially arranged in the housing, and the flow-blocking plate is axially and horizontally arranged on the bracket. There are multiple flow-blocking plates, which are arranged on the bracket at intervals.

6. The condensation adsorption device for LPCVD equipment according to claim 5, characterized in that: The spoiler is circular and is provided with a plurality of vent holes.

7. The condensation adsorption device for LPCVD equipment according to claim 6, characterized in that: The vent holes include large vent holes and small vent holes, and the large vent holes and the small vent holes are alternately arranged on the baffle.

8. A condensation adsorption device for LPCVD equipment according to any one of claims 1 to 7, characterized in that: It also includes an outer shell, which is sleeved outside the shell and sealed relative to the shell. A cooling space is formed between the outer shell and the shell. A water inlet and a water outlet are provided on the outer shell.

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