Parallel seal welding clamp of blue light semiconductor laser module

Abstract

The utility model provides a blue-light semiconductor laser module parallel seal welding clamp, which comprises a clamp base and a clamp fixing pressing plate, the surface of the clamp base is provided with a plurality of limiting grooves used for placing blue-light semiconductor laser modules, the limiting grooves are arranged adjacently, and the bottom of each limiting groove is provided with a plurality of through holes to form a through hole array. A plurality of threaded holes and positioning pins are arranged at the tops of partition walls of the adjacent limiting grooves; the clamp fixing pressing plate is provided with a plurality of through grooves corresponding to the shape and the size of the upper surface of the blue light semiconductor laser module, the distribution of the through grooves is the same as that of the limiting grooves, and the top of a partition wall of every two adjacent through grooves is provided with a plurality of counter bores corresponding to the threaded holes and a plurality of positioning holes corresponding to the positioning pins; the clamp base and the clamp fixing pressing plate are inserted into the positioning holes through the positioning pins to be positioned and are connected through the threaded holes and the counter bore installation connecting pieces. The clamp can reduce process loss, guarantees that products are not damaged in the production process, and improves the yield of the products.

Description

TECHNICAL FIELD

[0001] The utility model belongs to semiconductor module sealing fixture technical field, especially relates to a parallel sealing fixture of blue light semiconductor laser module. BACKGROUND

[0002] With the rapid development of science and technology information, the product electronization is increasingly important, and the reliability requirement generated thereby is increasingly strict, and the metal ceramic tube shell package becomes a relatively high-quality choice. It has excellent heat dissipation characteristics, strong shock resistance, can shield electromagnetic interference, is durable in use and the like, and is suitable for scenes with high reliability and durability requirements. The parallel sealing technology is widely used in metal ceramic packaging as a high-reliability sealing method with small temperature rise, high airtightness and simple operation.

[0003] The parallel sealing belongs to the resistance welding, and when sealing, a certain pressure is applied to the metal cavity and the cover plate by the electrode wheel, and then a voltage is applied to the electrode wheel for parallel sealing. The welding current will generate Joule heat between the metal cavity and the cover plate, so that a local molten state is formed between the metal cavity and the cover plate. The sealing is completed by the rotation and stepping of the electrode wheel.

[0004] The parallel sealing has a narrow and small weld width, and a small abnormality in the sealing process may cause poor sealing, poor airtightness or cover plate ablation and the like. The existing sealing fixture relies on the groove to fix the metal tube shell. Due to the machining error, the metal tube shell may have an uneven base problem, and the cover plate may also have a surface uneven problem due to the machining error, so that the metal tube shell moves in the sealing fixture, and the pressure applied to the cover plate by the click roller is uneven, and it is difficult to ensure the parallel sealing quality with good quality.

[0005] The existing parallel sealing fixture cannot ensure that the relative positions of the cover plate and the metal cavity do not displace during the parallel sealing process, which affects the imbalance of the downward pressure of the electrode wheels located on both sides of the tube shell, and further causes the cover plate to warp, the cover plate to ablate and the like, resulting in poor sealing quality and the risk of damaging the product. UTILITY MODEL CONTENT

[0006] The utility model discloses a parallel sealing fixture of blue light semiconductor laser module.

[0007] Technical scheme: in order to achieve the above object, the utility model adopts the following technical scheme:

[0008] A parallel sealing clamp for blue light semiconductor laser module, comprising a clamp base and a clamp fixed pressing plate, the surface of the clamp base is provided with a plurality of limiting grooves for placing the blue light semiconductor laser module, the limiting grooves are arranged adjacently, and the bottom of each limiting groove is provided with a plurality of through holes to form a through hole array, and the top of the partition wall between adjacent limiting grooves is provided with a plurality of threaded holes and positioning pins; the clamp fixed pressing plate is provided with a plurality of through grooves corresponding to the shape and size of the upper surface of the blue light semiconductor laser module, the through grooves are distributed in the same way as the limiting grooves, the top of the partition wall between adjacent through grooves is provided with a plurality of counterbores corresponding to the threaded holes, and a plurality of positioning holes corresponding to the positioning pins; the clamp base and the clamp fixed pressing plate are positioned by inserting the positioning pins into the positioning holes and connected by the threaded holes and the counterbores.

[0009] The through groove refers to a large hole structure that penetrates up and down.

[0010] As a specific embodiment, the side wall of the limiting groove is provided with a groove penetrating through both sides, and the shape and size of the groove correspond to the fiber interface of the blue light semiconductor laser module.

[0011] As a specific embodiment, the surface edge of the clamp base is also provided with a plurality of threaded holes (103) adjacent to the limiting grooves.

[0012] As a specific embodiment, the side wall of the through groove is provided with a notch, and the shape and size of the notch correspond to the fiber interface of the blue light semiconductor laser module.

[0013] As a specific embodiment, the inner wall of the partition wall between adjacent through grooves is provided with a through groove that penetrates up and down and is recessed inwardly, and the shape and size of the through groove correspond to the lead pin of the blue light semiconductor laser module.

[0014] As a specific embodiment, the top of the partition wall between adjacent through grooves is also provided with a plurality of fastening threaded holes, and the position of the fastening threaded holes corresponds to the position of the tube shell mounting base of the blue light semiconductor laser module below, a fastening screw can be arranged in the fastening threaded hole, and the laser tube shell is fixed by pressing the tube shell mounting base by rotating the fastening screw.

[0015] Further, the surface edge of the clamp fixed pressing plate is also provided with a plurality of fastening threaded holes adjacent to the through grooves, and the position of the fastening threaded holes corresponds to the position of the tube shell mounting base of the blue light semiconductor laser module below, a fastening screw can be arranged in the fastening threaded hole, and the laser tube shell is fixed by pressing the tube shell mounting base by rotating the fastening screw.

[0016] As a specific embodiment, the surface edge of the clamp fixed pressing plate is also provided with a plurality of counterbores adjacent to the through grooves.

[0017] Beneficial effects: compared with the prior art, the parallel sealing and welding clamp adopts the limiting groove array through hole arrangement, which to some extent makes up for the influence of the uneven metal tube shell base. The integrated pressing plate fixing mode makes the metal tube shell limiting and fixing stable, the clamp is consistent as a whole, can well improve the influence of the slightly poor machining precision of the metal tube shell shell body, improve the sealing and welding quality, improve the finished product yield, and is especially suitable for 30W blue light semiconductor laser module. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is the overall structure schematic view of the parallel sealing and welding clamp of the utility model.

[0019] Figure 2 It is the structure schematic view of the clamp base in the parallel sealing and welding clamp of the utility model.

[0020] Figure 3 It is the structure schematic view of the clamp fixed pressing plate in the parallel sealing and welding clamp of the utility model.

[0021] Figure 4 It is the structure schematic view of the 30W blue light semiconductor laser module. DETAILED DESCRIPTION

[0022] The utility model will be further described below in combination with the drawings.

[0023] In the description of the utility model, it is understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the utility model. In addition, the terms "first", "second" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features limited by "first", "second" and the like can explicitly or implicitly include one or more features. In the description of the utility model, unless otherwise specified, the meaning of "multiple" is two or more.

[0024] In the description of the utility model, need explanation, unless another explicit provision and limitation, term '' install '' '' link '' '' connection '' should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected, can be mechanical connection, also can be electrical connection, can be direct connection, also can through intermediate medium indirectly connect, can be two element inside intercommunication. For ordinary skilled person in the art, can understand the concrete meaning of above-mentioned term in the utility model through specific situation.

[0025] Embodiment

[0026] A kind of parallel seal fixture of 30 watt blue light semiconductor laser module, as Figure 1 Shown, including fixture base 1 and fixture fixed pressing plate 2, blue light semiconductor laser module 3 is clamped in fixture base 1 and fixture fixed pressing plate 2 between. As Figure 4 Shown, 30 watt blue light semiconductor laser module 3 includes fiber interface 31, lead pin 32 and tube shell 33, fiber interface 31 and lead pin 32 all are from the side wall of tube shell 33, tube shell 33 bottom edge extends outward and forms installation base 3301.

[0027] As Figure 2 Shown, the surface of fixture base 1 is equipped with several limit slots 101 (cavity size according to the size of laser module tube shell) for placing blue light semiconductor laser module 3, limit slot 101 is adjacently arranged, and the bottom of each limit slot 101 is equipped with several through holes 102, forming through hole array, the top of the partition wall of adjacent limit slot 101 is equipped with several threaded holes 103 and positioning pins 104, the surface edge of fixture base 1, adjacent to the position of limit slot 101 is also equipped with several threaded holes 103.

[0028] More specifically, the side wall of limit slot 101 is equipped with recess 105 on both sides, which shape and size correspond to the fiber interface 31 of blue light semiconductor laser module (as Figure 4 ). Limit slot 101 does not have to be too deep, mainly used for placing blue light semiconductor laser module 3;Limit slot 101 is rectangular, and one through-hole semicircular groove is opened at each of the four corners. Reasonably set the through hole density and through hole diameter in limit slot 101, can realize the effective support to laser module, and also can relieve the influence brought by uneven metal tube shell base.

[0029] As Figure 3As shown, the fixture fixing plate 2 is provided with a plurality of through grooves 201 corresponding to the shape and size of the upper surface of the blue light semiconductor laser module. The distribution of the through grooves 201 is the same as that of the limiting grooves 101. The tops of the partition walls adjacent to the through grooves 201 are provided with a plurality of countersunk holes 202 corresponding to the threaded holes 103, and a plurality of positioning holes 203 corresponding to the positioning pins 104; the surface edge of the fixture fixing plate 2, adjacent to the through grooves 201, is also provided with a plurality of countersunk holes 202; the tops of the partition walls adjacent to the through grooves 201 are also provided with a plurality of fastening threaded holes 206; the surface edge of the fixture fixing plate 2, adjacent to the through grooves 201, is also provided with a plurality of fastening threaded holes 206. The position below the fastening threaded holes 206 corresponds to the tube shell mounting base 3301 of the blue light semiconductor laser module 3, which is used to install fastening screws. The metal tube shell 33 of the laser module is fixed by screwing the fastening screws and squeezing the tube shell mounting base 3301.

[0030] More specifically, a notch 204 is provided on the sidewall of the through slot 201, the shape and size of which are consistent with the optical fiber interface 31 (eg, Figure 4 ) corresponds. The inner wall of the partition wall of the adjacent through groove 201 is provided with a through groove 205 which is through and recessed toward the inner wall. Its shape and size correspond to the lead pin 32 of the blue light semiconductor laser module 3 (such as Figure 4 ).

[0031] The fixture base 1 and the fixture fixing plate 2 are positioned by inserting the positioning pin 104 into the positioning hole 203, and are connected by installing a connecting piece through the threaded hole 103 and the countersunk hole 202. Preferably, the connecting piece is a fixing screw.

[0032] The working process and principle of the above-mentioned parallel sealing fixture are as follows:

[0033] Place the 30-watt blue semiconductor laser module 3 in the limiting slot 101 on the fixture base 1, cover it with the fixture fixing plate 2, and insert the locating pin 104 into the positioning hole 203 for positioning. Insert the fixing screw through the countersunk hole 202 and tighten the fixing screw through the threaded hole 103 to secure the fixture fixing plate 2, ensuring that there is no gap between the fixture fixing plate 2 and the fixture base 1. Then, screw the fixing screw through the tightening threaded hole 206 to secure the metal tube 33 of the laser module 3.

[0034] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A parallel sealing fixture for a blue light semiconductor laser module, characterized in that: The invention comprises a fixture base (1) and a fixture fixing plate (2); the surface of the fixture base (1) is provided with a plurality of limiting grooves (101) for placing a blue light semiconductor laser module; the limiting grooves (101) are arranged adjacent to each other, and the bottoms thereof are provided with a plurality of through holes (102) to form a through hole array; the tops of the partition walls of adjacent limiting grooves (101) are provided with a plurality of threaded holes (103) and positioning pins (104); the fixture fixing plate (2) is provided with a plurality of corresponding shapes and sizes of the upper surface of the blue light semiconductor laser module. The through slots (201) are arranged in the same distribution as the limiting slots (101). The tops of the partition walls of adjacent through slots (201) are provided with a plurality of countersunk holes (202) corresponding to the threaded holes (103), and a plurality of positioning holes (203) corresponding to the positioning pins (104). The fixture base (1) and the fixture fixing plate (2) are inserted into the positioning holes (203) through the positioning pins (104) for positioning, and are connected by installing connectors through the threaded holes (103) and the countersunk holes (202).

2. The parallel sealing fixture for a blue semiconductor laser module according to claim 1, characterized in that: The side wall of the limiting groove (101) is provided with grooves (105) passing through on both sides, and the shape and size of the grooves correspond to the optical fiber interface of the blue light semiconductor laser module.

3. The parallel sealing fixture for a blue semiconductor laser module according to claim 1, characterized in that: A plurality of threaded holes (103) are also provided on the surface edge of the clamp base (1) adjacent to the limiting groove (101).

4. The parallel sealing fixture for a blue semiconductor laser module according to claim 1, characterized in that: A notch (204) is provided on the side wall of the through groove (201), the shape and size of which correspond to the optical fiber interface of the blue light semiconductor laser module.

5. The parallel sealing fixture for a blue semiconductor laser module according to claim 1, characterized in that: The inner wall of the partition wall between the adjacent through grooves (201) is provided with a through groove (205) which penetrates vertically and is recessed toward the inner wall, and the shape and size of the through groove correspond to the pin of the blue light semiconductor laser module.

6. The parallel sealing fixture for a blue semiconductor laser module according to claim 1, characterized in that: A plurality of fastening threaded holes (206) are further provided on the tops of the partition walls of the adjacent through slots (201), the bottoms of which correspond to the positions of the tube shell mounting bases of the blue light semiconductor laser modules.

7. The parallel sealing fixture for a blue semiconductor laser module according to claim 6, characterized in that: A plurality of fastening threaded holes (206) are also provided on the surface edge of the clamp fixing plate (2) adjacent to the through slot (201).

8. The parallel sealing fixture for a blue semiconductor laser module according to claim 1, characterized in that: A plurality of countersunk holes (202) are also provided on the surface edge of the clamp fixing plate (2) adjacent to the through slot (201).

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