Grinding and polishing device for semiconductor wafer production

Abstract

The utility model discloses a grinding and polishing device for semiconductor wafer production, and relates to the technical field of machine manufacturing. Comprising a fixing cylinder, the top of the fixing cylinder is fixedly connected with a stepping motor through a rack, the output end of the stepping motor is fixedly connected with a grinding wheel, and the outer wall of the fixing cylinder is rotationally connected with an opening and closing door through a hinge; the bottom of the adjusting assembly is fixedly connected with the inner wall of the bottom of the fixed cylinder; through the arrangement of the fixing assembly, the fixing operation of the semiconductor wafer is relatively simple and convenient through the design of the fixing assembly, an operator only needs to place the wafer on the suction cup and keep the wafer in contact with the suction cup, then the wafer can be adsorbed and fixed by pulling the piston rod, and after polishing is completed, the wafer can be fixed through the piston rod. Adsorption can be released only by pushing the piston rod reversely, and the purpose of the grinding and polishing device for semiconductor wafer production is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to mechanical manufacturing technical field, concretely relates to a polishing device for semiconductor wafer production. BACKGROUND

[0002] In the production process of semiconductor wafer, polishing is a crucial procedure, and its processing quality and efficiency have a decisive influence on the performance and yield of subsequent semiconductor devices, with the rapid development of semiconductor industry, the market for semiconductor wafer yield and quality requirements are increasing, which puts forward more stringent standards for polishing device in operation convenience, production efficiency etc.

[0003] Traditional semiconductor wafer polishing device gradually exposes many shortcomings in practical application, first, in the fixing link of wafer, part of the device is fixed through multiple bolts, nut combination and specific fixture structure, the operator not only needs to spend a lot of time when installing and disassembling these fixed parts, but also is easy to cause wafer damage due to improper operation, in the scene of batch production of semiconductor wafer, frequent polishing operation makes the time consumed in each wafer fixing process cumulatively, which has serious negative influence on the overall production efficiency SUMMARY

[0004] In view of the deficiency of prior art, the utility model solves its technical problems by adopting the following technical scheme: a polishing device for semiconductor wafer production, comprising: a fixed cylinder, the top of the fixed cylinder is fixedly connected with a stepping motor through a rack, the output end of the stepping motor is fixedly connected with a polishing wheel, and the outer wall of the fixed cylinder is rotatably connected with an opening and closing door through a hinge; an adjusting assembly, the bottom of the adjusting assembly is fixedly connected with the inner wall of the bottom of the fixed cylinder, and the adjusting assembly is used for adjusting the height position of the semiconductor wafer through the sliding plug-in mode; a fixing assembly, the bottom of the fixing assembly is fixedly connected with the inner wall of the bottom of the fixed cylinder, and the fixing assembly is used for limiting the position of the semiconductor wafer through adsorption; the fixing assembly comprises a fixed disc, the inner wall of the fixed disc is fixedly connected with a suction cup, the suction cup is arranged in an annular array along the central axis of the fixed disc, the inner wall of the fixed disc is fixedly connected with a gas shell through a connecting pipe, one end of the connecting pipe away from the fixed disc is fixedly connected with the top of the gas shell, the inner wall of the gas shell is slidably connected with a piston rod, and the piston rod comprises a piston and a rod body.

[0005] Preferably, the bottom of the gas shell is fixedly connected with the inner wall of the bottom of the fixed cylinder, one end of the connecting pipe away from the fixed disc is fixedly connected with the top of the gas shell, the outer wall of the fixed disc is fixedly connected with a handle, the outer wall of the piston rod is slidably connected with the inner wall of the fixed cylinder, and a sliding groove corresponding to the piston rod is formed in the wall of the fixed cylinder.

[0006] Preferably, the adjusting assembly comprises a support frame, an inner wall of the support frame is slidably connected with an adjusting block, the inner wall of the support frame is provided with a sliding groove corresponding to the adjusting block, an inner wall of the bottom of the support frame is fixedly connected with the bottom of the fixed cylinder.

[0007] Preferably, the outer wall of the plug-in plate is inserted with the inner wall of the adjusting block through a limiting groove, the limiting groove is arranged in the wall of the adjusting block, the limiting grooves are linearly arranged along the outer wall of the adjusting block, one end of the tension spring away from the plug-in plate is fixedly connected with the outer wall of the support frame, the top of the adjusting block is fixedly connected with the bottom of the fixed disc, and the outer wall of the plug-in plate is slidably connected with the inner wall of the fixed cylinder.

[0008] The beneficial effects of the present application are as follows:

[0009] 1. The utility model discloses a fixing assembly, which is designed to facilitate the fixing operation of the semiconductor wafer. The operator only needs to place the wafer on the suction cup and keep contact, then pull the piston rod to realize the adsorption and fixation of the wafer. After polishing, the operator only needs to push the piston rod in the opposite direction to release the adsorption. This simple and direct fixing and releasing method does not require complex tools or professional skills and can be completed in a short time, greatly improving the operation efficiency in the production process, especially suitable for frequent polishing operation requirements in batch production of semiconductor wafers.

[0010] 2. The utility model discloses an adjusting assembly, which is convenient for adjusting the height position of the wafer. The operator can easily complete the height adjustment according to the specific processing requirements by pulling the plug-in plate to release the restriction of the adjusting block, then holding the handle and pushing the adjusting block to slide to the appropriate position, and finally releasing the plug-in plate to complete the fixation. This convenient height adjustment mechanism does not require tedious debugging process and can quickly adapt to different height requirements, reducing the production delay caused by untimely height adjustment and improving the production efficiency of the polishing process. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1 It is a structure schematic view of the utility model;

[0012] Figure 2 It is a structure schematic view of the utility model;

[0013] Figure 3 It is a structure schematic view of the utility model;

[0014] Figure 4 It is a structure schematic view of the utility model.

[0015] In the figure: 1, fixed cylinder; 2, stepper motor; 3, open-close door; 4, polishing wheel; 5, fixed assembly; 6, adjusting assembly; 51, fixed disc; 52, suction disc; 53, handle; 54, connecting pipe; 55, air shell; 56, piston rod; 61, support frame; 62, plug plate; 63, tension spring; 64, adjusting block; 65, limiting groove. DETAILED DESCRIPTION

[0016] The utility model will be explained in further detail below in combination with the drawings and specific embodiments. The embodiments of the utility model are given for the purpose of illustration and description, and are not exhaustive or limit the utility model to the disclosed forms. Many modifications and changes will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical application of the utility model, and to enable those of ordinary skill in the art to understand the utility model so as to design various embodiments with various modifications suitable for specific purposes.

[0017] Embodiment:

[0018] Please refer to Figure 1 - Figure 4The utility model provides a technical scheme: a kind of grinding and polishing device for semiconductor wafer production, it include: fixed cylinder 1, the top of fixed cylinder 1 is connected with step motor 2 by rack fixedly, the output of step motor 2 is fixedly connected with grinding wheel 4, step motor 2 is installed on the rack of fixed cylinder 1 top, and its output is connected with grinding wheel 4, step motor 2 is as power source, drives grinding wheel 4 high-speed rotation, to realize the grinding and polishing function of semiconductor wafer, the outer wall of fixed cylinder 1 is rotatably connected with opening and closing door 3 by hinge;Adjusting assembly 6, the bottom of adjusting assembly 6 is fixedly connected with the inner wall of fixed cylinder 1 bottom, and adjusting assembly 6 is used to adjust the height position of semiconductor wafer by sliding plug-in mode;Fixed component 5, the bottom of fixed component 5 is fixedly connected with the inner wall of fixed cylinder 1 bottom, and fixed component 5 is used to limit the position of semiconductor wafer by adsorption mode;Fixed component 5 includes fixed disc 51, the inner wall of fixed disc 51 is fixedly connected with suction cup 52, and suction cup 52 is annular array along the central axis of fixed disc 51, the inner wall of fixed disc 51 is fixedly connected with gas shell 55 by connecting pipe 54, and the top of connecting pipe 54 is fixedly connected with the inner wall of fixed disc 51, the inner wall of gas shell 55 is slidably connected with piston rod 56, the bottom of gas shell 55 is fixedly connected with the inner wall of fixed cylinder 1 bottom, the end of connecting pipe 54 away from fixed disc 51 is fixedly connected with the top of gas shell 55, the outer wall of fixed disc 51 is fixedly connected with handle 53, the outer wall of piston rod 56 is slidably connected with the inner wall of fixed cylinder 1, and the operator moves piston rod 56 to the direction away from fixed cylinder 1 by pulling, piston rod 56 slides in gas shell 55, so that the space in gas shell 55 increases, and air pressure reduces. Since gas shell 55 is communicated with suction cup 52 in fixed disc 51 by connecting pipe 54, the air pressure of the space where suction cup 52 is located also reduces, and the atmospheric pressure is relatively high, under the action of atmospheric pressure, suction cup 52 is tightly adsorbed on the surface of wafer, to realize the adsorption fixation of wafer.

[0019] Adjusting assembly 6 includes support frame 61, the inner wall of support frame 61 is slidably connected with adjusting block 64, the inner wall of support frame 61 is slidably connected with plugboard 62, the outer wall of plugboard 62 on both sides is fixedly connected with tension spring 63, the bottom of support frame 61 is fixedly connected with the inner wall of fixed cylinder 1 bottom, and by the sliding of adjusting block 64, fixed disc 51 and wafer adsorbed thereon can be driven to move up and down, to realize the adjustment of wafer height position.

[0020] The outer wall of the plug plate 62 is inserted into the inner wall of the adjusting block 64 through the limiting groove 65, the limiting groove 65 is opened in the wall of the adjusting block 64, one end of the tension spring 63 away from the plug plate 62 is fixedly connected with the outer wall of the support frame 61, the top of the adjusting block 64 is fixedly connected with the bottom of the fixed disc 51, the outer wall of the plug plate 62 is slidably connected with the inner wall of the fixed cylinder 1, the plug plate 62 is pulled to move outwardly against the tension of the tension spring 63, at this time, the plug plate 62 is pulled out of the limiting groove 65 of the adjusting block 64, and the restriction on the upward and downward sliding of the adjusting block 64 is removed.

[0021] Working principle:

[0022] The polishing device for semiconductor wafer production mainly comprises a fixed cylinder 1, a stepping motor 2, a polishing wheel 4, an opening and closing door 3, an adjusting assembly 6, a fixing assembly 5 and the like. The fixed cylinder 1 serves as the basic support structure of the whole device and provides a stable mounting basis for other assemblies. The stepping motor 2 is installed on the rack at the top of the fixed cylinder 1, and its output end is connected with the polishing wheel 4. The stepping motor 2 serves as the power source and drives the polishing wheel 4 to rotate at high speed, thereby realizing the polishing function of the semiconductor wafer. The opening and closing door 3 is rotatably connected with the outer wall of the fixed cylinder 1 through a hinge, which facilitates the operator to put the wafer into or take it out of the working area inside the fixed cylinder 1.

[0023] The adjusting assembly 6 is installed on the inner wall at the bottom of the fixed cylinder 1. Its main function is to adjust the height position of the semiconductor wafer through the sliding insertion mode, so as to meet different polishing requirements and process requirements. The fixing assembly 5 is also installed on the inner wall at the bottom of the fixed cylinder 1 and is responsible for limiting the position of the semiconductor wafer through adsorption, so as to ensure that the wafer remains stable and does not displace during the polishing process, thereby providing reliable conditions for the polishing operation.

[0024] The fixing assembly 5 plays a key role in limiting the position of the semiconductor wafer. It mainly comprises a fixed disc 51, a suction cup 52, a connecting pipe 54, a gas shell 55, a piston rod 56 and a handle 53. The components work cooperatively to realize the adsorption positioning of the wafer.

[0025] The fixed disc 51 is one of the main structures of the fixing assembly 5. The inner wall thereof is annularly arrayed with a plurality of suction cups 52. These suction cups 52 are used to directly contact the surface of the semiconductor wafer. When it is necessary to fix the wafer, the operator first places the wafer on the suction cups 52 and keeps the suction cups 52 in contact with the wafer.

[0026] The inner wall of the fixing disc 51 is connected with the air casing 55 through a connecting pipe 54, the top of the connecting pipe 54 is fixedly connected with the inner wall of the fixing disc 51, the bottom of the connecting pipe 54 is fixedly connected with the top of the air casing 55, the bottom of the air casing 55 is fixedly connected with the inner wall of the bottom of the fixing cylinder 1, the inner wall of the air casing 55 is slidably connected with the piston rod 56, and the outer wall of the piston rod 56 is also slidably connected with the inner wall of the fixing cylinder 1.

[0027] In the initial state, the gas in the air casing 55 is in a natural state, when the wafer needs to be fixed, the operator moves the piston rod 56 away from the fixing cylinder 1, the piston rod 56 slides in the air casing 55, so that the space in the air casing 55 increases, the air pressure decreases, because the air casing 55 is connected with the suction disc 52 in the fixing disc 51 through the connecting pipe 54, the air pressure in the space where the suction disc 52 is located also decreases, and the atmospheric pressure is relatively high, under the action of the atmospheric pressure, the suction disc 52 is tightly adsorbed on the surface of the wafer, so that the wafer is adsorbed and fixed, and when the polishing of the wafer is completed, the piston rod 56 is pushed in the opposite direction, so that the adsorption of the suction disc 52 to the wafer is released.

[0028] Through the synergistic effect of the plurality of suction discs 52 arranged in an annular array, uniform adsorption force can be applied to the wafer, the position of the wafer on the fixing disc 51 is stable, displacement of the wafer during polishing and polishing is prevented, and a solid foundation is laid for subsequent polishing and polishing operations.

[0029] The adjusting assembly 6 is mainly responsible for adjusting the height position of the semiconductor wafer, which is composed of a support frame 61, an adjusting block 64, an insertion plate 62, a tension spring 63, a limiting groove 65 and the like. Each component realizes the adjustment of the height position of the wafer through a specific mechanical structure.

[0030] The support frame 61 serves as the basic support structure of the adjusting assembly 6, and its bottom is fixedly connected with the inner wall of the bottom of the fixing cylinder 1, thereby providing a mounting and sliding support platform for other components. The inner wall of the support frame 61 is slidably connected with the adjusting block 64, so that the adjusting block 64 can slide up and down in the support frame 61. The top of the adjusting block 64 is fixedly connected with the bottom of the fixing disc 51 in the fixing assembly 5. Thus, by sliding the adjusting block 64, the fixing disc 51 and the wafer adsorbed thereon can be moved up and down, thereby achieving the adjustment of the height position of the wafer.

[0031] The inner wall of the support frame 61 is also slidably connected with the insertion plate 62. The outer walls of the two sides of the insertion plate 62 are fixedly connected with the tension spring 63, and the other end of the tension spring 63 is fixedly connected with the outer wall of the support frame 61. The outer wall of the insertion plate 62 is inserted into the inner wall of the adjusting block 64 through the limiting groove 65, and the limiting groove 65 is formed in the wall of the adjusting block 64.

[0032] When the height position of the wafer needs to be adjusted, the operator first pulls the plug-in plate 62 to move outward against the tension of the tension spring 63, at this time the plug-in plate 62 is pulled out of the limiting groove 65 of the adjusting block 64, and the restriction of the upward and downward sliding of the adjusting block 64 is released, then the operator can grasp the handle 53 and push the adjusting block 64 to slide upward or downward in the supporting frame 61 according to the specific polishing requirement, so as to drive the fixed disc 51 and the wafer to rise or fall to the appropriate height position,

[0033] When the adjusting block 64 slides to the appropriate position, the operator releases the plug-in plate 62, and under the elastic restoring force of the tension spring 63, the plug-in plate 62 will automatically move inward, reinserting into the limiting groove 65 of the adjusting block 64, again limiting the position of the adjusting block 64, ensuring that it remains stable at the adjusted height position, providing accurate height conditions for subsequent polishing operation,

[0034] After the adsorption positioning and height position adjustment of the semiconductor wafer are completed, the polishing operation can be performed, at this time, the stepping motor 2 drives the polishing wheel 4 to rotate at high speed, since the fixed assembly 5 has stably adsorbed and fixed the wafer, and the adjusting assembly 6 has adjusted the wafer to the appropriate height position, the high-speed rotating polishing wheel 4 will polish the wafer positioned by the fixed assembly 5.

[0035] During the polishing process, the fixed assembly 5 continuously maintains the adsorption effect on the wafer, preventing the wafer from shifting or shaking due to the polishing force or polishing force of the polishing wheel 4, ensuring the stability of the polishing process, at the same time, the adjusting assembly 6 maintains the height position of the wafer unchanged, so that the polishing wheel 4 can complete the polishing action according to the set height and path, finally realizing the polishing of the semiconductor wafer, meeting the size, shape and quality requirements of the polishing of the semiconductor wafer production.

[0036] Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary skilled in the art and related fields without creative labor should belong to the scope of protection of the present application. The structures, devices and operation methods not specifically described and explained in the present application, if not specially described and limited, are implemented according to the conventional means in the art.

Claims

1. A grinding and polishing device for semiconductor wafer production, characterized in that: include: A fixed cylinder (1), the top of the fixed cylinder (1) is fixedly connected to a stepper motor (2) via a frame, the output end of the stepper motor (2) is fixedly connected to a grinding wheel (4), and the outer wall of the fixed cylinder (1) is rotatably connected to an opening and closing door (3) via a hinge; An adjusting component (6), the bottom of the adjusting component (6) being fixedly connected to the inner wall of the bottom of the fixed cylinder (1), and the adjusting component (6) being used to adjust the height position of the semiconductor wafer by means of sliding insertion; A fixing assembly (5), the bottom of the fixing assembly (5) being fixedly connected to the inner wall of the bottom of the fixing cylinder (1), and the fixing assembly (5) being used to limit the position of the semiconductor wafer by adsorption; The fixing assembly (5) comprises a fixing plate (51), the inner wall of the fixing plate (51) is fixedly connected to a suction cup (52), and the suction cups (52) are arranged in a circular array along the central axis of the fixing plate (51), the inner wall of the fixing plate (51) is fixedly connected to an air shell (55) via a connecting pipe (54), and the top of the connecting pipe (54) is fixedly connected to the inner wall of the fixing plate (51), and the inner wall of the air shell (55) is slidably connected to a piston rod (56).

2. The grinding and polishing device for semiconductor wafer production according to claim 1, characterized in that: The bottom of the gas shell (55) is fixedly connected to the inner wall of the bottom of the fixed cylinder (1), the end of the connecting pipe (54) away from the fixed disk (51) is fixedly connected to the top of the gas shell (55), the outer wall of the fixed disk (51) is fixedly connected to the handle (53), and the outer wall of the piston rod (56) is slidably connected to the inner wall of the fixed cylinder (1).

3. The grinding and polishing device for semiconductor wafer production according to claim 1, characterized in that: The adjustment assembly (6) comprises a support frame (61), an adjustment block (64) is slidably connected to the inner wall of the support frame (61), and an inserting plate (62) is slidably connected to the inner wall of the support frame (61).

4. The grinding and polishing device for semiconductor wafer production according to claim 3, characterized in that: The outer walls on both sides of the inserting plate (62) are fixedly connected with tension springs (63), and the bottom of the supporting frame (61) is fixedly connected to the inner wall of the bottom of the fixing cylinder (1).

5. The grinding and polishing device for semiconductor wafer production according to claim 3, characterized in that: The outer wall of the inserting plate (62) is plugged into the inner wall of the adjusting block (64) through a limiting groove (65), and the limiting groove (65) is opened in the wall of the adjusting block (64).

6. The grinding and polishing device for semiconductor wafer production according to claim 4, characterized in that: One end of the tension spring (63) away from the inserting plate (62) is fixedly connected to the outer wall of the support frame (61), the top of the adjustment block (64) is fixedly connected to the bottom of the fixed disk (51), and the outer wall of the inserting plate (62) is slidably connected to the inner wall of the fixed cylinder (1).

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