Composite vacuum chuck assembly for wafer grinding

Abstract

A composite vacuum chuck assembly for wafer grinding comprises a ventilation shaft and a vacuum chuck body, a first air exhaust channel, two second air exhaust channels and two third air exhaust channels are formed in the ventilation shaft, and the two second air exhaust channels and the two third air exhaust channels are symmetrically formed in the two sides of the first air exhaust channel respectively and communicate with the first air exhaust channel; two first air exhaust holes, a second air exhaust hole, a third air exhaust hole, a fourth air exhaust hole and a fifth air exhaust hole are formed in the vacuum chuck body, and a first chuck channel communicated with the first air exhaust channel and the two first air exhaust holes is formed in the vacuum chuck body; two second suction cup channels which are communicated with one corresponding second air exhaust channel, one corresponding second air exhaust hole and one corresponding third air exhaust hole are formed in the vacuum suction cup body in a penetrating mode, and two fourth suction cup channels which are communicated with one corresponding third air exhaust channel, one corresponding fourth air exhaust hole and one corresponding fifth air exhaust hole are formed in the vacuum suction cup body in a penetrating mode. The wafer adsorption device can be suitable for adsorbing wafers of various specifications and sizes.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer grinding vacuum chuck technical equipment field, specifically a kind of composite vacuum chuck assembly for wafer grinding. BACKGROUND

[0002] The wafer is ground by the adsorption of vacuum chuck installed on the rotating shaft to be close to the grinding disc, and the size of the wafer to be ground is not fixed. In order to ensure the stability of the wafer during grinding, the corresponding size of the vacuum chuck needs to be adjusted and replaced according to the size of the wafer to be adsorbed. However, the vacuum chuck needs to be replaced every time the size of the wafer to be ground is different, which is time-consuming and reduces the efficiency of wafer grinding. SUMMARY

[0003] The utility model aims at providing a kind of composite vacuum chuck assembly for wafer grinding, which can adsorb wafers of various sizes.

[0004] To solve the above technical problems, the utility model adopts the specific scheme of a kind of composite vacuum chuck assembly for wafer grinding, which includes a gas passage shaft and a vacuum chuck body installed on the gas passage shaft. A first air extraction channel, two second air extraction channels and two third air extraction channels are opened in the gas passage shaft. The first air extraction channel is arranged along the axis of the gas passage shaft. The two second air extraction channels are symmetrically opened on both sides of the first air extraction channel and communicate with the first air extraction channel. The two third air extraction channels are symmetrically opened on both sides of the first air extraction channel and communicate with the first air extraction channel.

[0005] A chuck first channel for communicating with the first air extraction channel is opened through the radial direction of the vacuum chuck body. The chuck first channel communicates with two first air extraction holes opened on the adsorption surface of the vacuum chuck body.

[0006] Two chuck second channels for respectively communicating with the second air extraction channels are opened through the vacuum chuck body. Any one of the chuck second channels communicates with a second air extraction hole and a third air extraction hole opened on the adsorption surface of the vacuum chuck body.

[0007] Two chuck third channels for respectively communicating with the third air extraction channels are opened through the vacuum chuck body. Any one of the chuck third channels communicates with two fourth air extraction holes and fifth air extraction holes opened on the adsorption surface of the vacuum chuck body. The chuck first channel, the two chuck second channels and the two chuck third channels are detachably installed with a lane plug at the pipe opening of the outer periphery of the vacuum chuck body.

[0008] Two first suction holes and two second suction holes are located on an inner circle track with the center of the vacuum chuck body as the center, two third suction holes and two fourth suction holes are located on a middle circle track with the center of the vacuum chuck body as the center, and two fifth suction holes are located on an outer circle track with the center of the vacuum chuck body as the center, the diameter of the outer circle is larger than that of the middle circle, and the diameter of the middle circle is larger than that of the inner circle.

[0009] As another optimization scheme of the composite vacuum chuck assembly for wafer grinding, the diameters of the first suction channel, the two second suction channels and the two third suction channels are consistent.

[0010] As another optimization scheme of the composite vacuum chuck assembly for wafer grinding, the diameters of the first suction hole, the second suction hole, the third suction hole, the fourth suction hole and the fifth suction hole are consistent.

[0011] As another optimization scheme of the composite vacuum chuck assembly for wafer grinding, the lane-changing plug is a cylindrical body with threads on the outer periphery.

[0012] As another optimization scheme of the composite vacuum chuck assembly for wafer grinding, the air passage shaft is provided with a suction main channel along the axis thereof, and the suction main channel is coaxially arranged with and communicated with the first suction channel.

[0013] As another optimization scheme of the composite vacuum chuck assembly for wafer grinding, the air passage shaft is provided with a suction main channel along the axis thereof, and the suction main channel is coaxially arranged with and communicated with the first suction channel.

[0014] As another optimization scheme of the composite vacuum chuck assembly for wafer grinding, the air passage shaft is provided with a suction main channel along the axis thereof, and the suction main channel is coaxially arranged with and communicated with the first suction channel.

[0015] As another optimization scheme of the composite vacuum chuck assembly for wafer grinding, the air passage shaft is provided with a suction main channel along the axis thereof, and the suction main channel is coaxially arranged with and communicated with the first suction channel.

[0016] Compared with the prior art, the utility model has the beneficial effects that:

[0017] The first air extraction channel arranged in the ventilation shaft can be communicated with the suction disc first channel penetrating through the vacuum suction disc body, the suction disc first channel communicates two first air extraction holes, when small wafers of small specifications need to be ground, only the two ends of the suction disc first channel are blocked by the lane blocking piece, and the two first air extraction holes extract air to adsorb the wafers on the adsorption surface of the vacuum suction disc body. The two second air extraction channels in the ventilation shaft can be communicated with the suction disc second channel penetrating through the vacuum suction disc body, respectively, any one of the suction disc second channels is communicated with the third air extraction hole and the fourth air extraction hole, the two third air extraction channels in the ventilation shaft can be communicated with the suction disc third channel penetrating through the vacuum suction disc body, respectively, any one of the suction disc third channels is communicated with the fourth air extraction hole and the fifth air extraction hole, the lane blocking piece at the channel port of the corresponding vacuum suction disc body can be taken off or mounted to adapt to adsorb wafers of various specifications and sizes, the vacuum suction disc assembly can adapt to adsorb wafers of various specifications and sizes for grinding through switching of the channels, compared with the prior art, the time for replacing the vacuum suction disc is greatly saved, and the wafer grinding efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a top view structure schematic diagram of the utility model;

[0019] Figure 2 It is Figure 1 It is a sectional view structure schematic diagram of A-A in the middle;

[0020] Figure 3 It is a top view structure schematic diagram of the ventilation shaft installed in the mounting shaft;

[0021] Figure 4 It is Figure 3 It is a sectional view structure schematic diagram of a-a in the middle;

[0022] Figure 5 It is Figure 3 It is a sectional view structure schematic diagram of b-b in the middle;

[0023] Figure 6 It is Figure 3 It is a sectional view structure schematic diagram of c-c in the middle.

[0024] Fig. 1, ventilation shaft, 101, first air extraction channel, 102, second air extraction channel, 103, third air extraction channel, 104, air extraction main channel, 2, vacuum suction disc body, 201, groove, 3, suction disc first channel, 301, first air extraction hole, 4, suction disc second channel, 401, third air extraction hole, 402, second air extraction hole, 5, suction disc third channel, 501, fourth air extraction hole, 502, fifth air extraction hole, 6, lane blocking piece, 7, mounting shaft, 701, boss. DETAILED DESCRIPTION

[0025] A composite vacuum chuck assembly for wafer grinding, as shown in the drawings, comprises a vacuum chuck body 2, a vent shaft 1 and a mounting shaft 7, the vent shaft 1 is distributed along the axis of the mounting shaft 7 and is arranged through the mounting shaft 7, and the vacuum chuck body 2 is detachably mounted on the mounting shaft 7 by bolts. Figures 1-6

[0026] A first suction channel 101 is formed in the upper half of the vent shaft 1 along its axis, and a main suction channel 104 is formed in the lower half of the vent shaft 1 along its axis, and the main suction channel 104 is in communication with the first suction channel 101. Two second suction channels 102 and two third suction channels 103 are also formed in the vent shaft 1, the two second suction channels 102 are symmetrically arranged on both sides of the first suction channel 101, and the two second suction channels 102 are in communication with the first suction channel 101 and the main suction channel 104. The two third suction channels 103 are symmetrically arranged on both sides of the first suction channel 101, and the two third suction channels 103 are in communication with the first suction channel 101 and the main suction channel 104. The inner diameters of the main suction channel 104, the first suction channel 101, the two second suction channels 102 and the two third suction channels 103 are consistent.

[0027] The side of the vacuum chuck body 2 that is fixedly connected with the mounting shaft 7 is the mounting surface, and the side of the vacuum chuck body 2 that is used to adsorb and fix the wafer is the adsorption surface. A first chuck channel 3 is formed in the vacuum chuck body 2 along its radial direction, the first chuck channel 3 passes through the vacuum chuck body 2, and the first chuck channel 3 is in communication with the first suction channel 101. Two first suction holes 301 are formed around the center of the adsorption surface of the vacuum chuck body 2, and the first chuck channel 3 is in communication with the two first suction holes 301.

[0028] Two second chuck channels 4 and two third chuck channels 5 are formed in the vacuum chuck body 2, the two second chuck channels 4 pass through the vacuum chuck body 2 and are in communication with the corresponding second suction channels 102, respectively, two second suction holes 402 and two third suction holes 401 are formed on the adsorption surface of the vacuum chuck body 2, and any one of the second chuck channels 4 is in communication with one of the second suction holes 402 and one of the third suction holes 401.

[0029] The two third chuck channels 5 pass through the vacuum chuck body 2 and are in communication with the corresponding third suction channels 103, respectively, two fourth suction holes 501 and two fifth suction holes 502 are formed on the adsorption surface of the vacuum chuck body 2, and any one of the third chuck channels 5 is in communication with one of the fourth suction holes 501 and one of the fifth suction holes 502.

[0030] ​The channel inner diameters of the first suction disc channel 3, the two second suction disc channels 4 and the two third suction disc channels 5 are consistent, and the hole diameters of the first air extraction hole 301, the second air extraction hole 402, the third air extraction hole 401, the fourth air extraction hole 501 and the fifth air extraction hole 502 are consistent. In addition, the two first air extraction holes 301 and the two second air extraction holes 402 are located on an inner circular track with the center of the vacuum suction disc body 2 as the center, the two third air extraction holes 401 and the two fourth air extraction holes 501 are located on a middle circular track with the vacuum suction disc body 2 as the center, and the two fifth air extraction holes 502 are located on an outer circular track with the vacuum suction disc body 2 as the center. Since the diameter of the outer circular track is greater than the diameter of the middle circular track, and the diameter of the middle circular track is greater than the diameter of the inner circular track, the distance from the two first air extraction holes 301 and the two second air extraction holes 402 to the center is less than that of the two third air extraction holes 401 and the two fourth air extraction holes 501, and less than that of the two fifth air extraction holes 502.

[0031] The two ends of the first suction disc channel 3, the two ends of the two second suction disc channels 4 and the two ends of the two third suction disc channels 5 are all open on the outer periphery of the vacuum suction disc body 2. A channel changing plug 6 is detachably and correspondingly installed in each end opening of the channels. The channel changing plug 6 is a cylinder, and the cylinder is rotatably provided in the corresponding channel end opening through a thread provided on the outer periphery of the cylinder.

[0032] Further, a boss 701 is provided on the middle of one end of the installation shaft 7 connected to the vacuum suction disc body 2. The upper end of the air passage shaft 1 penetrating the installation shaft 7 is flush with the top surface of the boss 701. A groove 201 for clamping the boss 701 is provided in the center of the installation surface of the vacuum suction disc body 2. After the vacuum suction disc body 2 is clamped on the boss 701 through the groove 201, the first air extraction channel 101 is aligned and communicated with the corresponding first suction disc channel 3, the two second air extraction channels 102 are respectively aligned and communicated with the corresponding second suction disc channels 4, and the two third air extraction channels 103 are respectively aligned and communicated with the corresponding third suction disc channels 5.

[0033] Further, a rotary air passage joint (not shown in the figure) is installed on the lower end of the air passage shaft 1. The rotary air passage joint is provided with an air hole for communication with the air extraction main channel 104. The end of the rotary air passage joint is screw-boltedly installed on the lower end of the installation shaft 7. The air hole in the rotary air passage joint is in communication with the air extraction main channel 104 in the air passage shaft 1.

[0034] When small wafers of small specifications need to be polished, the channel changing plugs 6 in the two end openings of the two second suction disc channels 4 and the two third suction disc channels 5 are removed, and the two second suction disc channels 4 and the two third suction disc channels 5 are opened. Only the two ends of the first suction disc channel 3 are blocked by the channel changing plugs 6, and the wafer is adsorbed on the adsorption surface of the vacuum suction disc body 2 by the air extraction of the two first air extraction holes 301.

[0035] When the medium-sized wafers of moderate specifications need to be polished, the bypass plugs 6 of the two chuck third passages 5 and one chuck first passage 3 can be removed, and only the two ends of the two chuck second passages 4 need to be plugged, and the wafers can be adsorbed by the two second suction holes 402 and the third suction hole 401. Alternatively, the bypass plugs 6 of the two ends of the two chuck second passages 4 can be removed, and only the two ends of the chuck first passage 3 and the chuck second passage 4 need to be plugged, and the wafers can be adsorbed on the adsorption surface of the vacuum chuck body 2 by the two first suction holes 301, the two second suction holes 402 and the two third suction holes 401.

[0036] When the large-sized wafers of larger specifications need to be polished, only the two ends of the two chuck third passages 5 need to be plugged, and the large-sized wafers can be adsorbed on the adsorption surface of the vacuum chuck body 2 by the two fourth suction holes 501 and the fifth suction hole 502. Alternatively, the two ends of the chuck first passage 3, the two chuck second passages 4 and the two chuck third passages 5 can be plugged, and the large-sized wafers can be adsorbed on the adsorption surface of the vacuum chuck body 2 by the suction holes on the adsorption surface of the vacuum chuck body 2.

Claims

1. A composite vacuum chuck assembly for wafer grinding, characterized by: The invention comprises a ventilation shaft (1) and a vacuum suction cup body (2) mounted on the ventilation shaft (1); a first air extraction channel (101), two second air extraction channels (102) and two third air extraction channels (103) are provided in the ventilation shaft (1); the first air extraction channel (101) is arranged along the axis of the ventilation shaft (1); the two second air extraction channels (102) are symmetrically provided on both sides of the first air extraction channel (101) and are communicated with the first air extraction channel (101); the two third air extraction channels (103) are symmetrically provided on both sides of the first air extraction channel (101) and are communicated with the first air extraction channel (101); a first suction cup channel (3) for communicating with the first suction channel (101) is provided in the vacuum suction cup body (2) along its radial direction; the first suction cup channel (3) is communicated with two first air extraction holes (301) provided on the adsorption surface of the vacuum suction cup body (2); Two suction cup second channels (4) are provided through the vacuum suction cup body (2) for communicating with the second air extraction channel (102) respectively. Any one of the suction cup second channels (4) is communicated with the second air extraction hole (402) and the third air extraction hole (401) provided on the adsorption surface of the vacuum suction cup body (2). Two suction cup third channels (5) for connecting to the third air extraction channel (103) are provided through the vacuum suction cup body (2), and any one of the suction cup third channels (5) is connected to the two fourth air extraction holes (501) and the fifth air extraction hole (502) provided on the adsorption surface of the vacuum suction cup body (2); the suction cup first channel (3), the two suction cup second channels (4), and the two suction cup third channels (5) are all provided with a channel-changing blocker (6) which can be disassembled and installed at the pipe openings located on the outer periphery of the vacuum suction cup body (2); The two first air extraction holes (301) and the two second air extraction holes (402) are located on an inner circle trajectory with the center of the vacuum suction cup body (2) as the center, the two third air extraction holes (401) and the two fourth air extraction holes (501) are located on a middle circle trajectory with the center of the vacuum suction cup body (2) as the center, and the two fifth air extraction holes (502) are located on an outer circle trajectory with the center of the vacuum suction cup body (2) as the center, and the diameter of the outer circle is greater than the diameter of the middle circle and greater than the diameter of the inner circle.

2. The composite vacuum chuck assembly for wafer grinding according to claim 1, characterized in that: The diameters of the first suction cup channel (3), the two second suction cup channels (4), and the two third suction cup channels (5) are consistent.

3. The composite vacuum chuck assembly for wafer grinding according to claim 1, characterized in that: The apertures of the first air pumping hole (301), the second air pumping hole (402), the third air pumping hole (401), the fourth air pumping hole (501) and the fifth air pumping hole (502) are consistent.

4. The composite vacuum chuck assembly for wafer grinding according to claim 1, characterized in that: The lane-changing plug (6) is a cylinder with threads formed on the outer circumference.

5. The composite vacuum chuck assembly for wafer grinding according to claim 1, characterized in that: A main air extraction channel (104) is provided in the ventilation shaft (1) along its axis. The main air extraction channel (104) is coaxially arranged with the first air extraction channel (101) and is in communication with the first air extraction channel (101).

6. The composite vacuum chuck assembly for wafer grinding according to claim 5, characterized in that: A rotary ventilation joint is installed at the lower end of the ventilation shaft (1), and the rotary ventilation joint is communicated with the main air extraction channel (104).

7. The composite vacuum chuck assembly for wafer grinding according to claim 1, characterized in that: The ventilation shaft (1) is inserted into the mounting shaft (7), and the vacuum suction cup body (2) is detachably mounted on the mounting shaft (7) via bolts.

8. The composite vacuum chuck assembly for wafer grinding according to claim 7, characterized in that: A boss (701) is provided in the middle of one end where the mounting shaft (7) is connected to the vacuum suction cup body (2), and a groove (201) for the boss (701) to be clamped is provided at the center of one end surface where the vacuum suction cup body (2) and the mounting shaft (7) are fixed.

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