Semiconductor sheet for extracting water from air

Abstract

The utility model discloses a semiconductor sheet for taking water from air, which comprises a semiconductor thermoelectric module, a conductive module and a substrate layer, and the semiconductor thermoelectric module and the conductive module form a Peltier circuit to generate a Peltier effect to realize refrigeration, so that water vapor in the air is condensed into liquid water. The cold surfaces of the P-type semiconductor thermoelectric particles and the N-type semiconductor thermoelectric particles directly exchange heat with external air through the cold surface conductive strips and the hydrophobic structure layer, so that the thermal resistance is effectively reduced; a substrate layer is arranged in an inner cavity of the semiconductor air water taking piece, and the refrigeration influence of a hot surface of the semiconductor air water taking piece on a cold surface is reduced by blocking internal air convective heat transfer and cold and hot surface radiative heat transfer; the hydrophobic structure layer is arranged on the outer surface of the cold face conductive strip of the semiconductor air water taking piece, under the water condensation working condition, tiny water drops gathered on the cold face of the semiconductor air water taking piece are rapidly condensed and polymerized into large water drops through the tension effect, the large water drops rapidly slide down, and the influence of a water film on water taking efficiency is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to air water taking and its peripheral supporting facility technical field, especially a kind of semiconductor air water taking piece. BACKGROUND

[0002] Where there is air, there is water, and the atmosphere, which is the habitat of human beings, is also a water vapor cycle. According to the differences in air temperature, humidity and atmospheric pressure, the water content in air is not the same. Under ideal conditions, the maximum water content in each cubic meter of air can reach 30.38 grams. Even in the extremely arid desert region, there is still a small amount of water in the air. Therefore, obtaining fresh water from the air breaks the geographical and spatial limitations of water use and provides a way to solve the water problem in water-deficient areas.

[0003] At present, researchers have carried out a lot of beneficial research on air water taking technology. The methods used mainly include condensation method and physical and chemical adsorption method. The main principle of the condensation method is to lower the temperature of air to below the dew point temperature through a device, so that the water in the air is separated out. According to the different refrigeration temperatures, the water is condensed in the form of liquid water or solid ice. In recent years, with the continuous development of air water taking technology, semiconductor refrigerating sheets based on the Peltier principle have been gradually used in condensation method air water taking devices due to their advantages of environmental protection, reliable performance, long service life and the like. For example, the patent "A Portable Air Water Taking Device" with the publication number CN102587453A and the patent "A Portable Solar Air Water Taking Device" with the publication number CN106869243A. The surface of the semiconductor refrigerating sheet in the prior art is packaged with a ceramic or copper-aluminum metal panel. A plurality of P-type and N-type semiconductor thermoelectric particles are arranged inside the semiconductor refrigerating sheet. The P-type and N-type semiconductor thermoelectric particles are connected by brazing with a conductive copper strip. The periphery is sealed with organic silicone glue or epoxy resin. Although the semiconductor refrigerating sheet based on the prior art can achieve a certain refrigeration and condensation effect when used in the condensation method air water taking device, it still has the following defects: the ceramic or metal packaging panel material has thermal resistance. In particular, the semiconductor refrigerating sheet packaged with a metal panel needs to be provided with an insulating layer between the conductive copper strip and the metal panel, which further increases the thermal resistance. Except for the semiconductor thermoelectric particles and the conductive copper strip, the rest of the semiconductor refrigerating sheet is a hollow structure. Although air is a poor conductor of heat, there is still air convection and radiation heat transfer between the cold and hot surfaces of the semiconductor refrigerating sheet. At present, the condensation method air water taking device mainly uses a ceramic panel to package the semiconductor refrigerating sheet. Since the ceramic material itself is brittle and easy to break, it can only be made into small rectangular, circular or strip-shaped in production. In practical applications, in order to increase the refrigeration and heat dissipation area, a plurality of semiconductor refrigerating sheets need to be connected in series and in parallel and installed with fins. The overall weight of the air water taking device increases after system integration, and the reliability decreases. At the same time, due to the material thermal resistance of the fins and the contact thermal resistance between the fins and the semiconductor refrigerating sheet, the overall refrigeration and condensation efficiency of the air water taking device is not high. Utility model content

[0004] The utility model discloses a semiconductor air water taking piece to solve the problems of the prior art, reduce the thermal resistance of semiconductor air water taking piece, enhance the refrigeration performance of semiconductor air water taking piece, and then improve the water taking efficiency of air water taking equipment.

[0005] To achieve the above object, the utility model provides the following scheme:

[0006] The utility model provides a semiconductor air water taking piece, it includes:

[0007] Semiconductor thermoelectric module, the semiconductor thermoelectric module includes the P type semiconductor thermoelectric particle and N type semiconductor thermoelectric particle of alternative arrangement, and the P type semiconductor thermoelectric particle with the N type semiconductor thermoelectric particle between adjacent has the gap;

[0008] Conductive module, the conductive module includes cold face conductive strip and hot face conductive strip, the cold face conductive strip is set up in the cold face one side of semiconductor thermoelectric module, and the hot face conductive strip is set up in the hot face one side of semiconductor thermoelectric module;The conductive module is connected with the semiconductor thermoelectric module and constitutes the peltier circuit;

[0009] Substrate layer, the substrate layer is special-shaped structure, the substrate layer fills the gap between the P type semiconductor thermoelectric particle and the N type semiconductor thermoelectric particle, and is connected with the conductive module, and the substrate layer is made of heat insulation material;The substrate layer is close to the one side of the hydrophobic structure layer of semiconductor thermoelectric module cold face, and the substrate layer is close to the one side of the insulating heat conduction layer of semiconductor thermoelectric module hot face.

[0010] Preferably, the cold face conductive strip and the hot face conductive strip are both made of copper material.

[0011] Preferably, the thickness of the substrate layer ranges from 0.3mm to 3mm.

[0012] Preferably, the substrate layer is made of nano-silica aerogel powder and elastic emulsion.

[0013] Preferably, the thickness of the hydrophobic structure layer ranges from 3μm to 50μm.

[0014] Preferably, the hydrophobic structure layer is made of modified nano-silica hydrophobic coating or fluorosilane polymer hydrophobic coating.

[0015] Preferably, the insulating heat conduction layer is made of insulating heat conduction silica gel.

[0016] Preferably, the thickness of the insulating heat conduction layer is 0.01mm to 0.1mm.

[0017] The semiconductor air water taking sheet has the following technical effects compared with the prior art: the semiconductor air water taking sheet comprises a semiconductor thermoelectric module, a conductive module and a substrate layer, the semiconductor thermoelectric module comprises P-type semiconductor thermoelectric particles and N-type semiconductor thermoelectric particles arranged alternately, and gaps are formed between the adjacent P-type semiconductor thermoelectric particles and N-type semiconductor thermoelectric particles; the conductive module comprises a cold face conductive strip and a hot face conductive strip, the cold face conductive strip is arranged on one side of a cold face of the semiconductor thermoelectric module, and the hot face conductive strip is arranged on one side of a hot face of the semiconductor thermoelectric module; the conductive module and the semiconductor thermoelectric module are connected to form a Peltier circuit; the substrate layer has a special-shaped structure, fills the gaps between the P-type semiconductor thermoelectric particles and the N-type semiconductor thermoelectric particles, and is connected with the conductive module, and the substrate layer is made of a heat insulation material; a hydrophobic structure layer is arranged on one side of the substrate layer close to the cold face of the semiconductor thermoelectric module, and an insulating heat conduction layer is arranged on one side of the substrate layer close to the hot face of the semiconductor thermoelectric module.

[0018] The semiconductor air water taking sheet has the following technical effects compared with the prior art: the semiconductor air water taking sheet comprises a semiconductor thermoelectric module, a conductive module and a substrate layer, the semiconductor thermoelectric module comprises P-type semiconductor thermoelectric particles and N-type semiconductor thermoelectric particles arranged alternately, and gaps are formed between the adjacent P-type semiconductor thermoelectric particles and N-type semiconductor thermoelectric particles; the conductive module comprises a cold face conductive strip and a hot face conductive strip, the cold face conductive strip is arranged on one side of a cold face of the semiconductor thermoelectric module, and the hot face conductive strip is arranged on one side of a hot face of the semiconductor thermoelectric module; the conductive module and the semiconductor thermoelectric module are connected to form a Peltier circuit; the substrate layer has a special-shaped structure, fills the gaps between the P-type semiconductor thermoelectric particles and the N-type semiconductor thermoelectric particles, and is connected with the conductive module, and the substrate layer is made of a heat insulation material; a hydrophobic structure layer is arranged on one side of the substrate layer close to the cold face of the semiconductor thermoelectric module, and an insulating heat conduction layer is arranged on one side of the substrate layer close to the hot face of the semiconductor thermoelectric module. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0020] Figure 1 The axial measurement structure schematic diagram of the semiconductor air water taking sheet disclosed in the embodiments of the present application is shown in the figure.

[0021] Figure 2Part structure schematic view of the semiconductor air water taking sheet is disclosed in the embodiment of the utility model.

[0022] Figure 3 Front view schematic view of the semiconductor air water taking sheet is disclosed in the embodiment of the utility model.

[0023] In the drawing: 100, semiconductor air water taking sheet;

[0024] 1, P-type semiconductor thermoelectric particle;2, N-type semiconductor thermoelectric particle;3, cold face conductive strip;4, hot face conductive strip;5, substrate layer;6, hydrophobic structure layer;7, insulating heat conducting layer. Specific implementation

[0025] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the scope of protection of the utility model.

[0026] The utility model aims at providing a kind of semiconductor air water taking sheet, to solve the problems existing in the above prior art, reduce the thermal resistance of semiconductor air water taking sheet, enhance the refrigeration performance of semiconductor air water taking sheet, to further improve the water taking efficiency of air water taking equipment.

[0027] So that the above-mentioned purposes, features and advantages of the utility model can be more obvious and easy to understand, the utility model will be further described in detail below in conjunction with the drawings and specific implementation.

[0028] Embodiment one

[0029] The embodiment provides a kind of semiconductor air water taking sheet 100, including semiconductor thermoelectric module, conductive module and substrate layer 5, semiconductor thermoelectric module includes the P-type semiconductor thermoelectric particle 1 and N-type semiconductor thermoelectric particle 2 of alternative arrangement, there is gap between adjacent P-type semiconductor thermoelectric particle 1 and N-type semiconductor thermoelectric particle 2;Conductive module includes cold face conductive strip 3 and hot face conductive strip 4, cold face conductive strip 3 is set to the cold side of semiconductor thermoelectric module, and hot face conductive strip 4 is set to the hot side of semiconductor thermoelectric module;Conductive module and semiconductor thermoelectric module are connected to form peltier circuit;Substrate layer 5 is special-shaped structure, substrate layer 5 fills the gap between P-type semiconductor thermoelectric particle 1 and N-type semiconductor thermoelectric particle 2, and is connected with conductive module, substrate layer 5 is made of heat insulation material;Hydrophobic structure layer 6 is arranged on the side of substrate layer 5 close to the cold face of semiconductor thermoelectric module, and insulating heat conducting layer 7 is arranged on the side of substrate layer 5 close to the hot face of semiconductor thermoelectric module.

[0030] In the semiconductor air water extraction sheet 100 of the present invention, the cold surface conductive strip 3, the hot surface conductive strip 4, the P-type semiconductor thermoelectric particles 1 and the N-type semiconductor thermoelectric particles 2 are connected to form a Peltier circuit, which produces a Peltier effect to achieve refrigeration, thereby condensing water vapor in the air into liquid water. Compared to the semiconductor refrigeration sheets in the prior art, the semiconductor air water extraction sheet 100 of the present invention has no ceramic or metal packaging structure on the surface. The cold surfaces of the P-type semiconductor thermoelectric particles 1 and the N-type semiconductor thermoelectric particles 2 directly exchange heat with the outside air through the cold surface conductive strips 3 and the hydrophobic structure layer 6, effectively reducing thermal resistance. The internal cavity of the semiconductor air water extraction sheet 100 is provided with a substrate layer 5, which reduces the cooling effect of the hot surface of the semiconductor air water extraction sheet 100 on the cold surface by blocking the internal air convection heat transfer and the heat transfer from the hot and cold surfaces. The outer surface of the cold surface conductive strips 3 of the semiconductor air water extraction sheet 100 is provided with a hydrophobic structure layer 6. Under condensation conditions, the tiny water droplets gathered on the cold surface of the semiconductor air water extraction sheet 100 are quickly condensed and aggregated into large water droplets through tension and quickly slide down, reducing the impact of the water film on the water extraction efficiency. The use of the semiconductor air water extraction sheet 100 of the present invention is conducive to improving the overall performance of the air water extraction equipment, reducing the quality of the air water extraction equipment, and thus improving the adaptability of the air water extraction equipment.

[0031] In this specific embodiment, the cold surface conductive strips 3 and the hot surface conductive strips 4 are both made of copper, which enables the cold surface conductive strips 3 and the hot surface conductive strips 4 to efficiently transmit electrical energy and reduce energy loss.

[0032] In addition, it should be noted that, in actual applications, in order to improve the surface oxidation resistance and corrosion resistance of the cold surface conductive strip 3, its water intake outer surface may also be subjected to surface oxidation resistance treatment such as nickel plating or chromium plating.

[0033] It should also be noted that the thickness of the substrate layer 5 ranges from 0.3 mm to 3 mm, and the thickness of the substrate layer 5 can be adjusted according to actual working conditions.

[0034] In this specific embodiment, the substrate layer 5 is made of nano-silica aerogel powder and elastic emulsion, and is obtained by injecting it into the gaps between adjacent P-type semiconductor thermoelectric particles 1, N-type semiconductor thermoelectric particles 2, and the cold surface conductive strips 3 and the hot surface conductive strips 4 for condensation and solidification. The nano-silica aerogel has excellent thermal insulation properties. After condensation and solidification, the substrate layer 5 can further stabilize the structure of the semiconductor air water intake sheet 100 while blocking the convection heat transfer of the air inside the semiconductor air water intake sheet 100 and the radiation heat transfer of the hot and cold surfaces.

[0035] At the same time, the thickness of the hydrophobic structure layer 6 ranges from 3 μm to 50 μm. In practical applications, it can be adjusted according to different water intake requirements to adapt to different working conditions.

[0036] In the specific embodiment, the hydrophobic structure layer 6 is made of modified nano-silica hydrophobic coating or fluorosilane polymer hydrophobic coating, so as to avoid the formation of water film on the cold surface of the semiconductor air water taking sheet 100 in the water taking process, and to affect the normal work of the semiconductor air water taking sheet 100.

[0037] In other specific embodiments that can be realized by the utility model, the surface of the hydrophobic structure layer 6 has concave-convex microstructure, and the concave-convex microstructure is combined with the low surface energy of the hydrophobic material, so that the lotus leaf effect is generated on the outer surface of the cold surface conductive strip 3, and under the condensation water taking condition, the outer surface of the cold surface of the semiconductor air water taking sheet 100 cannot form water film, and the influence of the water film on the water taking efficiency is reduced.

[0038] In addition, the hydrophobic structure layer 6 can also be obtained by laser and chemical etching process, so as to have permanent hydrophobicity or superhydrophobicity.

[0039] Specifically, the insulating and heat conducting layer 7 is made of insulating and heat conducting silica gel. The semiconductor air water taking sheet 100 of the utility model is mainly attached to the pipe wall or the box body of the condensation method air water taking equipment with heat dissipation capacity in actual application, so that the hot surface of the semiconductor air water taking sheet 100 needs to be insulated and heat conducted, and the insulating and heat conducting layer 7 is obtained after the insulating and heat conducting adhesive is condensed and solidified, so as to guarantee the insulation and heat conduction capacity.

[0040] More specifically, the thickness of the insulating and heat conducting layer 7 is 0.01mm-0.1mm, which can be adjusted in actual application to meet different working conditions.

[0041] The semiconductor air water taking sheet 100 has two working conditions of condensation and frosting, when the surface temperature of the cold surface of the semiconductor air water taking sheet 100 is lower than the current air dew point temperature and higher than zero, the water vapor in the environment air is condensed and gathered on the cold surface of the semiconductor air water taking sheet 100, and the semiconductor air water taking sheet 100 is in the condensation water taking working state; when the surface temperature of the cold surface of the semiconductor air water taking sheet 100 is at zero and below, the water vapor in the environment air is gathered on the outer surface of the cold surface of the semiconductor air water taking sheet 100 in the form of frost, and the semiconductor air water taking sheet 100 is in the frosting water taking working state.

[0042] The principle and implementation mode of the utility model are described by using specific examples in the utility model, and the above embodiment is only used for helping to understand the method and core idea of the utility model; meanwhile, according to the idea of the utility model, the specific embodiment and application range can be changed by the general technical personnel in the field. In conclusion, the content of the specification should not be understood as the limitation of the utility model.

Claims

1. A semiconductor air water extraction sheet, characterized in that: include: A semiconductor thermoelectric module, comprising alternatingly arranged P-type semiconductor thermoelectric particles and N-type semiconductor thermoelectric particles, with gaps between adjacent P-type semiconductor thermoelectric particles and adjacent N-type semiconductor thermoelectric particles; A conductive module, the conductive module comprising a cold surface conductive strip and a hot surface conductive strip, the cold surface conductive strip being arranged on the cold surface side of the semiconductor thermoelectric module, and the hot surface conductive strip being arranged on the hot surface side of the semiconductor thermoelectric module; the conductive module and the semiconductor thermoelectric module being connected to form a Peltier circuit; The substrate layer has a special-shaped structure, fills the gap between the P-type semiconductor thermoelectric particles and the N-type semiconductor thermoelectric particles, and is connected to the conductive module. The substrate layer is made of a thermal insulation material; a hydrophobic structure layer is provided on the side of the substrate layer close to the cold surface of the semiconductor thermoelectric module, and an insulating thermal conductive layer is provided on the side of the substrate layer close to the hot surface of the semiconductor thermoelectric module.

2. The semiconductor air water extraction sheet according to claim 1, characterized in that: The cold surface conductive strips and the hot surface conductive strips are both made of copper.

3. The semiconductor air water extraction sheet according to claim 1, characterized in that: The thickness of the substrate layer ranges from 0.3 mm to 3 mm.

4. The semiconductor air water extraction sheet according to claim 1, characterized in that: The thickness of the hydrophobic structure layer ranges from 3 μm to 50 μm.

5. The semiconductor air water extraction sheet according to claim 1, characterized in that: The hydrophobic structure layer is made of a modified nano-silica hydrophobic coating or a fluorosilane polymer hydrophobic coating.

6. The semiconductor air water extraction sheet according to claim 1, characterized in that: The insulating heat-conducting layer is made of insulating heat-conducting silica gel.

7. The semiconductor air water extraction sheet according to claim 1, characterized in that: The thickness of the insulating heat-conducting layer is 0.01 mm to 0.1 mm.

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