Firmly-fixed heat-conducting silica gel pad

Abstract

The utility model discloses a firmly fixed heat-conducting silica gel pad. The firmly-fixed heat-conducting silica gel pad comprises a heat-conducting silica gel pad body and cooling fins, a plurality of connecting frames are uniformly mounted on the heat-conducting silica gel pad body; a plurality of connectors are uniformly mounted on one side of the cooling fin; a plurality of elastic limiting pieces are installed on the inner side of the connecting frame in an annular array mode. And an anti-falling step is arranged on the connector. According to the firmly-fixed heat-conducting silica gel pad provided by the utility model, the plurality of connecting frames are uniformly mounted on the heat-conducting silica gel pad body, the plurality of connectors are uniformly mounted on one side of the radiating fin, the elastic limiting sheets are mounted in the connecting frames, and the anti-falling steps are arranged on the connectors, so that the radiating fin can be inserted and fixed on the heat-conducting silica gel pad body; and the heat-conducting silica gel pad and the heat-conducting silica gel pad are firmly fixed, so that even if the heat-conducting silica gel pad is vertically mounted, the radiating fins cannot fall off from the heat-conducting silica gel pad body.

Description

TECHNICAL FIELD

[0001] The utility model relates to heat conduction silica gel pad technical field especially relates to a fixed heat conduction silica gel pad. BACKGROUND

[0002] The heat conduction silica gel sheet is a kind of heat conduction medium sheet with silica gel as base material, is also called heat conduction silica gel pad, heat conduction silica gel sheet, soft heat conduction pad, heat conduction silica gel gasket in industry, is specially designed for the production of heat transfer by gap, can fill gap, complete the heat transfer between heating part and heat dissipation part, also play the role of insulation, shock absorption, sealing and the like.

[0003] The conventional heat conduction silica gel pad is flat sheet structure, and the heat conduction silica gel pad is pasted together between the heat dissipation fin by its own adhesion, however, the adhesion of the heat conduction silica gel pad is limited, when the fitting surface is vertical, the heat dissipation fin is prone to move on the heat conduction silica gel pad under the action of gravity, leading to the dislocation of fitting surface, and even the heat dissipation fin may fall off, thereby reducing the heat dissipation effect of the heat conduction silica gel pad.

[0004] Therefore, it is necessary to provide a fixed heat conduction silica gel pad to solve the above technical problems. UTILITY MODEL CONTENT

[0005] In view of the above situation, in order to overcome the defects of prior art, the utility model provides a fixed heat conduction silica gel pad, which can improve the connection stability between the heat dissipation fin and the heat conduction silica gel pad.

[0006] To achieve the above purpose, the utility model adopts the following technical scheme:

[0007] The fixed heat conduction silica gel pad comprises a heat conduction silica gel pad body and a heat dissipation fin, a plurality of connecting frames are uniformly installed on the heat conduction silica gel pad body, and a plurality of connecting heads are uniformly installed on one side of the heat dissipation fin; a plurality of elastic limiting sheets are annularly arranged on the inner side of the connecting frame; and a anti-falling step is arranged on the connecting head.

[0008] Preferably, the connecting frame is embeddedly installed in the heat conduction silica gel pad body.

[0009] Preferably, a plurality of embedding grooves are uniformly formed on the heat conduction silica gel pad body, the connecting frame is embeddedly installed in the embedding groove, and the connecting frame and the embedding groove can be fixed by using glue, and the top of the connecting frame does not exceed the embedding groove.

[0010] Preferably, the bottom end of the connecting head is provided with a chamfer.

[0011] Preferably, a first connecting sheet and a second connecting sheet are installed between the plurality of connecting frames, and the plurality of connecting frames are connected into a whole through the plurality of first connecting sheets and the second connecting sheet.

[0012] Preferably, the fin is provided with a heat dissipation groove, which can increase the contact area of the fin with air or the device shell, and improve the heat dissipation efficiency.

[0013] Compared with the prior art, the utility model has the advantages of:

[0014] (1) the utility model discloses a heat conduction silica gel pad body is installed even multiple connecting frame, even multiple connecting head is installed on one side of the fin, and the elastic spacing piece is installed in the connecting frame, and the anti -drop step is equipped on the connecting head, can make the fin plug -in fixed on the heat conduction silica gel pad body, and the fixed firm between both, even if the heat conduction silica gel pad vertical installation, also can not make the fin from the heat conduction silica gel pad body fall off;

[0015] (2) the utility model discloses a connecting frame of embedding type installation in the heat conduction silica gel pad body, has facilitated the installation and stability of connecting frame;

[0016] (3) the utility model discloses the chamfer of setting up in the bottom of connecting head, has facilitated the insertion of connecting head into connecting frame;

[0017] (4) the utility model discloses the first connecting piece and second connecting piece are installed between the connecting frame, can connect multiple connecting frame into a whole, can improve the stability of connecting frame;

[0018] (5) the utility model discloses the heat dissipation groove of setting up on the fin, can be favorable to improve the heat dissipation speed, improve the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is the structure schematic drawing of fixed firm's heat conduction silica gel pad provided by the utility model;

[0020] Figure 2 It is the fixed firm's heat conduction silica gel pad of Figure 1 The explosion structure schematic drawing of

[0021] Figure 3 It is the structure schematic drawing of the fin in the fixed firm's heat conduction silica gel pad of Figure 1

[0022] It is the structure schematic drawing of connecting frame in the fixed firm's heat conduction silica gel pad of Figure 4 Figure 1 It is the structure schematic drawing of connecting head in the fixed firm's heat conduction silica gel pad of

[0023] Figure 5 Figure 1 It is the structure schematic drawing of connecting head in the fixed firm's heat conduction silica gel pad of

[0024] Figure 6 It is the structure schematic drawing of connecting head in the fixed firm's heat conduction silica gel pad of Figure 1 ​​The fixed and firm heat-conducting silica gel pad connection structure diagram of the connecting frame is shown;

[0025] Figure 7 For Figure 1 The fixed and firm heat-conducting silica gel pad connection structure diagram of the connecting frame is shown.

[0026] Wherein, the name corresponding to the reference sign is: 1-heat-conducting silica gel pad body, 2-radiating fin, 3-connecting frame, 4-connection head, 5-elastic limiting piece, 6-anti-falling step, 7-chamfer, 8-first connecting piece, 9-second connecting piece, 10-embedded groove. DETAILED DESCRIPTION

[0027] The utility model will be further explained in combination with the drawings and examples, and the mode of the utility model includes but is not limited to the following examples.

[0028] Example 1:

[0029] As Figures 1-7 The fixed and firm heat-conducting silica gel pad provided by the utility model, including: heat-conducting silica gel pad body 1 and radiating fin 2, evenly install multiple connecting frames 3 on heat-conducting silica gel pad body 1, and multiple connection heads 4 are evenly installed on one side of radiating fin 2, multiple elastic limiting pieces 5 are annularly installed in the inner side of connecting frame 3, and anti-falling step 6 is arranged on connection head 4, when using, one side of heat-conducting silica gel pad body 1 is laid and bonded and installed at the part needing heat dissipation, connection head 4 is inserted into connecting frame 3 in alignment, connection head 4 is inserted into the symmetry center of multiple elastic limiting pieces 5 in alignment, when connection head 4 is inserted, elastic limiting piece 5 is extruded, elastic limiting piece 5 is bent and deformed, until the head of connection head 4 completely passes through elastic limiting piece 5, elastic limiting piece 5 is clamped at the position of anti-falling step 6, at this moment, elastic limiting piece 5 is against the top of anti-falling step 6, connection head 4 cannot be taken out from connecting frame 3, so that radiating fin 2 is inserted and fixed on heat-conducting silica gel pad body 1, it is worth mentioning that the rest parts of heat-conducting silica gel pad body 1 except connecting frame 3 are closely combined with radiating fin 2, and heat transfer is facilitated.

[0030] By evenly installing multiple connecting frames 3 on heat-conducting silica gel pad body 1, multiple connection heads 4 are evenly installed on one side of radiating fin 2, elastic limiting piece 5 is installed in connecting frame 3, and anti-falling step 6 is arranged on connection head 4, radiating fin 2 can be inserted and fixed on heat-conducting silica gel pad body 1, and the fixed firmness between the two, even if heat-conducting silica gel pad 1 is vertically installed, radiating fin 2 will not fall off from heat-conducting silica gel pad body 1.

[0031] Example 2:

[0032] As Figures 2-7As shown, the connecting frame 3 is embeddedly installed in the heat-conducting silica gel pad body 1, specifically, a plurality of embedding grooves 10 are uniformly formed on the heat-conducting silica gel pad body 1, and the connecting frame 3 is embeddedly installed in the embedding grooves 10, and the connecting frame 3 and the embedding grooves 10 can be fixedly connected by using glue, the top of the connecting frame 3 does not exceed the embedding grooves 10, and the connecting frame 3 and the embedding grooves 10 have a large bonding surface area, so that the connection between the connecting frame 3 and the heat-conducting silica gel pad body 1 is more stable, and in use, the connecting head 4 is inserted into the connecting frame 3, and since the connecting frame 3 is embeddedly installed, the heat dissipation fin 2 and the rest of the heat-conducting silica gel pad body 1 can be conveniently bonded (by the adhesion of the heat-conducting silica gel pad body 1 itself).

[0033] By setting the connecting frame 3 embeddedly installed in the heat-conducting silica gel pad body 1, the installation and stability of the connecting frame 3 are facilitated.

[0034] Embodiment 3:

[0035] As shown in Figure 5 the bottom end of the connecting head 4 is provided with a chamfer 7, and the chamfer 7 is designed to make the diameter of the bottom end of the connecting head 4 smaller, so as to facilitate the insertion of the connecting head 4 into the connecting frame 3.

[0036] By providing the chamfer 7 at the bottom of the connecting head 4, the insertion of the connecting head 4 into the connecting frame 3 is facilitated.

[0037] Embodiment 4:

[0038] As shown in Figure 6 the first connecting sheet 8 and the second connecting sheet 9 are installed between the plurality of connecting frames 3, and the plurality of connecting frames 3 are connected into one whole body by the plurality of first connecting sheets 8 and the second connecting sheets 9, and according to Embodiments 1 and 2, whether the first connecting sheet 8 and the second connecting sheet 9 are adhered to the surface of the heat-conducting silica gel pad body 1 or installed in the heat-conducting silica gel pad body 1, the connection strength between the connecting frame 3 and the heat-conducting silica gel pad body 1 can be effectively improved, so that the connecting frame 3 is not easy to fall off from the heat-conducting silica gel pad body 1.

[0039] By installing the first connecting sheet 8 and the second connecting sheet 9 between the connecting frames 3, the plurality of connecting frames 3 can be connected into one whole body, and the stability of the connecting frame 3 can be improved.

[0040] Embodiment 5:

[0041] As shown in Figures 1-2As shown, the fin 2 is provided with a heat dissipation groove, which can increase the contact area of the fin and air, improve the heat dissipation speed of the fin 2, and when the heat dissipation groove of the fin 2 is connected with the equipment shell, the groove on the equipment shell is completely fitted with the heat dissipation groove, the contact area between the two is increased, and the heat dissipation speed of the fin 2 to the outside is improved, and the heat dissipation efficiency of the heat-conducting silica gel gasket 1 is improved.

[0042] By providing the fin 2 with a heat dissipation groove, the heat dissipation speed and efficiency can be improved.

[0043] Working principle: when in use, the heat-conducting silica gel gasket body 1 is laid and bonded to the part that needs to be cooled, the connecting frame 3 faces outward, the connecting head 4 is inserted into the connecting frame 3, the connecting head 4 is inserted into the symmetric center of the plurality of elastic limiting pieces 5, the elastic limiting pieces 5 are bent and deformed when the connecting head 4 is inserted, until the head of the connecting head 4 completely passes through the elastic limiting pieces 5, the elastic limiting pieces 5 are clamped at the position of the anti-falling step 6, at this time, the elastic limiting pieces 5 are pressed against the top of the anti-falling step 6, so that the connecting head 4 cannot be pulled out of the connecting frame 3, so that the fin 2 is inserted and fixed on the heat-conducting silica gel gasket body 1, it is worth noting that the rest of the heat-conducting silica gel gasket body 1 except the connecting frame 3 is closely fitted with the fin 2, which is convenient for heat transfer.

Claims

1. A firmly fixed thermal conductive silicone pad, characterized in that: include: Thermal conductive silicone pad body (1) and heat sink (2); A plurality of connection frames (3) are evenly mounted on the thermally conductive silica gel pad body (1); A plurality of connectors (4) are evenly mounted on one side of the heat sink (2); A plurality of elastic limiting pieces (5) are installed in a circular array inside the connection frame (3); The connector (4) is provided with an anti-slip step (6).

2. The firmly fixed thermal conductive silicone pad according to claim 1, characterized in that: The connection frame (3) is embedded in the thermal conductive silica gel pad body (1).

3. The firmly fixed thermal conductive silicone pad according to claim 1, characterized in that: A plurality of embedding grooves (10) are evenly arranged on the heat-conducting silica gel pad body (1).

4. The firmly fixed thermally conductive silicone pad according to claim 1, characterized in that: The bottom end of the connector (4) is provided with a chamfer (7).

5. The firmly fixed thermal conductive silicone pad according to claim 1, characterized in that: A first connecting piece (8) and a second connecting piece (9) are installed between the plurality of connecting frames (3).

6. The firmly fixed thermal conductive silicone pad according to claim 1, characterized in that: The heat sink (2) is provided with a heat dissipation groove.

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