Wafer probe station

Abstract

The utility model discloses a wafer probe station, which comprises a pedestal and a table top, and the table top is fixedly arranged on the pedestal. An assembling groove is formed in the middle of the table top, a chuck is fixedly installed in the assembling groove, a first boss and a third boss are fixedly installed on the edge of the assembling groove, the first boss and the third boss are oppositely arranged, and second openings are formed in the first boss and the third boss correspondingly. Compared with the prior art, the wafer probe station provided by the utility model blows negative ion wind to the upper end face of the chuck through the first boss, and the negative ion wind passing through the upper part of the chuck is extracted by the third boss, so that the upper end face of the chuck can be blown and cleaned in real time in a continuous operation process, and cross contamination between wafers is prevented; the blown dirt can be extracted and collected by the third boss, so that other parts cannot be polluted; in addition, the negative ion wind can also eliminate static electricity possibly generated on the chuck, so that the wafer can be safely detected on the chuck.

Description

TECHNICAL FIELD

[0001] The utility model belongs to wafer detection technical field, and specifically about a wafer probe station. BACKGROUND

[0002] With the rapid development of semiconductor industry, wafer plays a key role in the process of manufacturing integrated circuits. Wafer detection and analysis are important links to ensure product quality and improve production efficiency, and wafer probe station as the key equipment to perform these tasks plays an indispensable role in the process.

[0003] The current wafer probe station needs to use dry cloth or soft brush to remove dust and other dirt on the surface at regular intervals. Since wafer detection usually needs continuous operation, the probe station cannot be cleaned during the operation process. Long-time work without cleaning the probe station will cause cross-contamination between wafers, affecting the quality of wafer products.

[0004] Therefore, in view of the above technical problems, it is necessary to provide a wafer probe station.

[0005] The information disclosed in this background section is intended only to increase an understanding of the general background of the present utility model and should not be construed as an acknowledgment or any form of suggestion that this information constitutes prior art with respect to the present utility model. CONTENT OF UTILITY MODEL

[0006] The utility model aims at providing a wafer probe station, which can solve the problem that since wafer detection usually needs continuous operation, the probe station cannot be cleaned during the operation process, long-time work without cleaning the probe station will cause cross-contamination between wafers, affecting the quality of wafer products.

[0007] In order to achieve the above-mentioned purpose, the technical scheme provided by a specific embodiment of the utility model is as follows:

[0008] A wafer probe station, comprising a pedestal and a table, the table is fixedly installed on the pedestal;

[0009] The middle position of the table is provided with an assembly groove, the inside of the assembly groove is fixedly installed with a chuck, the edge of the assembly groove is fixedly installed with a first boss and a third boss, the first boss and the third boss are oppositely arranged, the first boss and the third boss are both provided with a second opening, and the second opening is opposite to the upper end face of the chuck;

[0010] The table is also provided with a groove, and the inside of the groove is installed with an ion wind circulating assembly, and the output end and the input end of the ion wind circulating assembly are connected with the first boss and the third boss respectively.

[0011] In one or more embodiments of the utility model, the ion wind circulation assembly includes a collecting box and an ion wind rod, the collecting box and the ion wind rod are fixedly installed inside the groove, a return air pipe is fixedly installed on the third boss, and one end of the return air pipe away from the third boss is fixed with the collecting box.

[0012] The collecting box is fixedly installed with an axial flow fan.

[0013] The ion wind rod is fixedly installed with an air inlet pipe and an air outlet pipe respectively, one end of the air inlet pipe away from the ion wind rod is fixed with the output end of the axial flow fan, and one end of the air outlet pipe away from the ion wind rod is fixed with the first boss.

[0014] In one or more embodiments of the utility model, the collecting box is internally installed with a primary filter screen and a secondary filter screen, and the mesh of the primary filter screen is larger than that of the secondary filter screen.

[0015] In one or more embodiments of the utility model, two pairs of sockets are fixedly installed on the inner wall of the collecting box, and the primary filter screen and the secondary filter screen are respectively slidably inserted between the two pairs of sockets.

[0016] The top end of the collecting box is fixedly installed with a cover plate.

[0017] In one or more embodiments of the utility model, a pair of air suction ports are fixedly installed on the first boss, and a second boss is fixedly installed on each of the pair of air suction ports.

[0018] A first opening is formed in each of the pair of second bosses.

[0019] In one or more embodiments of the utility model, the first opening is designed to be upwardly inclined.

[0020] In one or more embodiments of the utility model, the angle of the upward inclination of the first opening is 30°-60°.

[0021] In one or more embodiments of the utility model, the second opening is horizontally designed.

[0022] In one or more embodiments of the utility model, the lower end surface of the second opening is lower than the upper end surface of the chuck, and the upper end surface of the second opening is higher than the upper end surface of the chuck.

[0023] In one or more embodiments of the utility model, a plurality of probe supports are rotatably installed on the table top.

[0024] Compared with the prior art, the wafer probe station of the utility model can blow the upper end face of the chuck in real time in the continuous operation process, prevent cross contamination between wafers, and collect the dirt blown off by the third boss, without contaminating other components.

[0025] In addition, the negative ion wind can also eliminate static electricity that may be generated on the chuck, so as to safely detect the wafer on the chuck. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments described in the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0027] Figure 1 It is a structure diagram of a wafer probe station in an embodiment of the utility model;

[0028] Figure 2 It is a top view of a wafer probe station in an embodiment of the utility model;

[0029] Figure 3 It is a front view of a wafer probe station in an embodiment of the utility model;

[0030] Figure 4 It is a wafer probe station in an embodiment of the utility model; Figure 3 It is an enlarged view of A in the middle;

[0031] Figure 5 It is a side view of a wafer probe station in an embodiment of the utility model;

[0032] Figure 6 It is a wafer probe station in an embodiment of the utility model; Figure 5 It is an enlarged view of B in the middle;

[0033] Figure 7 It is an explosion view of a collection box of a wafer probe station in an embodiment of the utility model.

[0034] MAIN REFERENCE NUMERALS DESCRIPTION:

[0035] 1. Base; 2. Table; 201. Groove; 3. Probe support; 4. Assembly slot; 5. Chuck; 6. First boss; 601. Exhaust port; 7. Second boss; 701. First opening; 8. Third boss; 801. Return air duct; 9. Collection box; 901. Cover; 902. Primary filter; 903. Socket; 904. Secondary filter; 10. Axial fan; 11. Ion wind rod; 1101. Inlet pipe; 1102. Outlet pipe; 12. Second opening. DETAILED DESCRIPTION

[0036] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the following will be combined with the drawings of the embodiments of the present invention to clearly and completely describe the technical solutions of the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0037] like Figures 1-7 As shown, a wafer probe station in one embodiment of the present invention includes a base 1 and a table 2, the table 2 is fixedly mounted on the base 1, and multiple sets of probe supports 3 are rotatably mounted on the table 2, and the multiple sets of probe supports 3 are used to install probes so that the wafer can be tested by the probes.

[0038] An assembly groove 4 is provided in the middle of the table 2, and a chuck 5 is fixedly installed inside the assembly groove 4. The chuck 5 is provided with a plurality of microholes. By connecting to a vacuum system, the wafer can be vacuum-adsorbed and positioned with the help of the microholes.

[0039] like Figure 1 、 Figure 3 and Figure 4 As shown, the edge of the assembly groove 4 is fixedly mounted with a first boss 6 and a third boss 8 which are relatively arranged. The first boss 6 and the third boss 8 are both provided with a second opening 12, and the second openings 12 on the first boss 6 and the third boss 8 correspond to each other. The second opening 12 on the first boss 6 can blow out negative ion wind, and the second opening 12 on the third boss 8 can extract the negative ion wind blown out by the second opening 12 on the first boss 6.

[0040] The second opening 12 is designed to be horizontal, ensuring that the negative ion wind blown out of the second opening 12 on the first boss 6 can be drawn into the interior of the third boss 8 through the second opening 12 on the third boss 8. The lower end surface of the second opening 12 is lower than the upper end surface of the chuck 5, and the upper end surface of the second opening 12 is higher than the upper end surface of the chuck 5. This ensures that the negative ion wind can pass through the upper end surface of the chuck 5, achieving a purge and cleaning of the upper end surface of the chuck 5.

[0041] As Figure 1 , Figure 2 and Figure 7 shown, the mesa 2 is also provided with a groove 201, and an ion wind circulating assembly is mounted in the groove 201. The ion wind circulating assembly includes a collecting box 9 and an ion wind rod 11, both of which are fixedly installed in the groove 201. Two pairs of sockets 903 are fixedly installed on the inner wall of the collecting box 9. A primary filter screen 902 and a secondary filter screen 904 are respectively slidably inserted between the two pairs of sockets 903. The mesh of the primary filter screen 902 is larger than that of the secondary filter screen 904. The primary filter screen 902 and the secondary filter screen 904 are used to filter the negative ion wind in multiple stages to remove impurities inside.

[0042] A cover plate 901 is fixedly installed at the top end of the collecting box 9 by bolts. The cover plate 901 can be detached and opened to clean or replace the primary filter screen 902 and the secondary filter screen 904.

[0043] As Figure 2 shown, a return air pipe 801 is fixedly installed on the third boss 8. The end of the return air pipe 801 away from the third boss 8 is fixed to the collecting box 9. The third boss 8 and the inside of the collecting box 9 are connected through the return air pipe 801. An axial flow fan 10 is fixedly installed on the collecting box 9. The input end of the axial flow fan 10 is connected to the inside of the collecting box 9. The axial flow fan 10 is used to provide power for ion wind circulation. The model of the axial flow fan 10 can be selected as FAC6-50Y1.

[0044] An air inlet pipe 1101 and an air outlet pipe 1102 are respectively fixedly installed on the ion wind rod 11. The end of the air inlet pipe 1101 away from the ion wind rod 11 is fixed to the output end of the axial flow fan 10. That is, the wind blown out by the axial flow fan 10 can enter the inside of the ion wind rod 11 through the air inlet pipe 1101 to form a negative ion wind inside the ion wind rod 11. The ion wind rod 11 is common knowledge to those skilled in the art, and will not be described in detail here. The model of the ion wind rod 11 can be selected as ST-503A13.

[0045] The end of the air outlet pipe 1102 away from the ion wind rod 11 is fixed to the first boss 6. The negative ion wind generated inside the ion wind rod 11 can enter the inside of the first boss 6 through the air outlet pipe 1102.

[0046] Specifically, during the wafer detection process on the chuck 5, the axial flow fan 10 and the ion wind rod 11 continuously inject negative ion wind into the inside of the first boss 6. The negative ion wind passes through the upper surface of the chuck 5 to clean it, effectively removing dust and other dirt attached to the surface of the chuck 5, ensuring the cleanliness of the surface of the chuck 5 in real time to prevent contamination of the wafer. At the same time, the negative ion wind can eliminate static electricity on the surface of the chuck 5 to prevent static electricity from damaging the wafer, ensuring that the wafer can be safely detected on the chuck 5.

[0047] In addition, the negative ion wind blows the surface of the chuck 5 and is then drawn into the interior of the third boss 8, enters the interior of the collection box 9 through the air return pipe 801, is filtered to remove impurities in the interior of the collection box 9 through the primary filter screen 902 and the secondary filter screen 904, and is then sent into the interior of the ion wind rod 11 by the axial flow fan 10, so as to be recycled. In this way, the dust and dirt cleaned from the chuck 5 can be effectively prevented from contaminating other components, and the cleanliness of the probe station can be ensured.

[0048] It is worth noting that after the wafer is detected on the chuck 5, the wafer is unloaded, and the negative ion wind is blown to quickly reduce the pressure between the wafer and the contact surface of the chuck 5, so as to unload the wafer.

[0049] As shown in Figure 2 , Figure 5 , the first boss 6 is fixedly installed with a pair of air suction ports 601, the pair of air suction ports 601 are each fixedly installed with a second boss 7, the second boss 7 is connected with the interior of the first boss 6 through the air suction port 601, and the pair of second bosses 7 are each provided with a first opening 701. After the negative ion wind enters the interior of the first boss 6, the negative ion wind can also enter the interior of the second boss 7 through the air suction port 601 and be blown out through the first opening 701.

[0050] As shown in Figure 6 , the first opening 701 is designed to be upwardly inclined, and preferably, the first opening 701 is inclined upwardly at an angle of 30°-60°. That is, the negative ion wind can be blown upwardly through the first opening 701.

[0051] Specifically, in the process of placing the wafer on the chuck 5, the negative ion wind blown upwardly can blow the lower surface of the wafer, so as to blow and buffer the wafer during the falling process of the wafer, so that the wafer is stably placed on the chuck 5. At the same time, the static electricity possibly existing on the lower surface of the wafer can be removed, so that the wafer is not damaged by static electricity on the chuck 5.

[0052] In use, before the wafer is placed on the chuck 5 for detection, the axial flow fan 10 and the ion wind rod 11 are started in advance to continuously generate negative ion wind. After the surface of the chuck 5 is blown and cleaned by the negative ion wind blown out through the first boss 6 and the second boss 7, the negative ion wind is drawn into the interior of the collection box 9 through the third boss 8, is filtered in the interior of the collection box 9, and participates in the circulation. The negative ion wind blown out by the second boss 7 can blow and buffer the wafer during the process of placing the wafer, and can eliminate the static electricity possibly generated, so that the wafer can be safely detected on the chuck 5.

[0053] Compared with the prior art, the wafer probe station of the utility model can blow the upper end face of chuck 5 with negative ion wind through first boss 6, and the negative ion wind above chuck 5 is extracted by third boss 8, so that the upper end face of chuck 5 can be cleaned in real time in the continuous operation process, cross contamination between wafers is prevented, and the dirt blown off can be extracted and collected by third boss 8, so that other components are not polluted.

[0054] In addition, the negative ion wind can also eliminate static electricity that can be generated on chuck 5, so that the wafer can be detected safely on chuck 5.

[0055] It is apparent for those skilled in the art that the utility model is not limited to the details of the above exemplary embodiments, and the utility model can be implemented in other specific forms without departing from the spirit or essential characteristics of the utility model. Therefore, the embodiments should be regarded as exemplary and non-restrictive in any aspect, and the scope of the utility model is defined by the appended claims rather than the above description, and all changes falling within the meaning and scope of the equivalent elements of the claims should be included in the utility model. Any reference signs in the claims should not be regarded as limiting the claims.

[0056] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be combined appropriately to form other embodiments that those skilled in the art can understand.

Claims

1. A wafer probe station, comprising a base and a table, wherein the table is fixedly mounted on the base, characterized in that: A mounting groove is provided in the middle of the table, a chuck is fixedly installed in the mounting groove, a first boss and a third boss are fixedly installed at the edge of the mounting groove, the first boss and the third boss are arranged opposite to each other, a second opening is provided on each of the first boss and the third boss, and the second opening faces the upper end surface of the chuck; A groove is also provided on the table top, and an ion wind circulation component is installed inside the groove. The output end and the input end of the ion wind circulation component are connected to the first boss and the third boss respectively.

2. A wafer probe station according to claim 1, characterized in that, The ion wind circulation assembly includes a collection box and an ion wind rod, both of which are fixedly mounted inside the groove; an air return pipe is fixedly mounted on the third boss, and one end of the air return pipe away from the third boss is fixed to the collection box; An axial flow fan is fixedly installed on the collection box; An air inlet pipe and an air outlet pipe are fixedly mounted on the ion wind rod, one end of the air inlet pipe away from the ion wind rod is fixed to the output end of the axial flow fan, and one end of the air outlet pipe away from the ion wind rod is fixed to the first boss.

3. A wafer probe station according to claim 2, characterized in that, A primary filter screen and a secondary filter screen are installed inside the collection box, and the mesh of the primary filter screen is larger than the mesh of the secondary filter screen.

4. A wafer probe station according to claim 3, characterized in that, Two pairs of sockets are fixedly installed on the inner wall of the collection box, and the primary filter and the secondary filter are respectively slidably plugged between the two pairs of sockets; A cover plate is fixedly mounted on the top of the collecting box.

5. The wafer probe station according to claim 1, characterized in that: A pair of air extraction ports are fixedly mounted on the first boss, and a second boss is fixedly mounted on each of the pair of air extraction ports; A pair of the second bosses are each provided with a first opening.

6. The wafer probe station according to claim 5, characterized in that: The first opening is designed to be inclined upward.

7. The wafer probe station according to claim 6, characterized in that: The first opening is inclined upward at an angle of 30°-60°.

8. The wafer probe station according to claim 6, characterized in that: The second opening is designed to be horizontal.

9. The wafer probe station according to claim 8, characterized in that: The lower end surface of the second opening is lower than the upper end surface of the chuck, and the upper end surface of the second opening is higher than the upper end surface of the chuck.

10. The wafer probe station according to claim 1, characterized in that: A plurality of probe supports are rotatably mounted on the table.

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