Chip clamping jaw testing device

Abstract

The utility model provides a chip clamping jaw testing device. The chip clamping jaw testing device comprises a probe support and a testing probe arranged on the probe support. Wherein the metal bump of the to-be-detected chip comprises a support column arranged on a chip protection layer and a solder cap positioned at the end part of the support column; the test probe comprises a memory metal piece and at least two test clamping jaws; and the test clamping jaw is in contact conduction with the support column when meeting a preset condition, so that signal transmission between the to-be-detected metal bump and the test probe is realized through the support column. According to the utility model, the related test of the chip can be completed under the condition that the solder cap is not damaged.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip detection technical field, more specifically, relate to a chip gripper testing device. BACKGROUND

[0002] In the field of semiconductor chip stacking technology, before the chip is formed or shipped, its related performance needs to be tested to realize quality detection, grading and defective product screening of the chip. At present, there are various ways of chip stacking, such as HBM, Wide-IO or HMC, etc. When testing such chips, external probes need to be in contact with the metal bumps on the chip to realize the transmission of test signals and test results.

[0003] However, due to the small size and fragility of the metal bumps on the chip, if the existing probes are used to directly test the metal bumps, the solder end of the metal bump will be damaged, which will affect the subsequent bonding process and chip performance, and the product yield.

[0004] Therefore, there is an urgent need for a chip testing scheme that can realize the conduction of the chip and the test signal while preventing the solder end of the metal bump from being damaged and affecting the chip performance. SUMMARY

[0005] In view of the above problems, the purpose of the utility model is to provide a chip gripper testing device to solve the problem that the existing chip testing scheme will damage the solder end of the chip and affect the chip performance.

[0006] The chip gripper testing device provided by the utility model comprises a probe support and a test probe arranged on the probe support. The metal bump of the chip to be tested comprises a support column arranged on the chip protection layer and a solder cap located at the end of the support column. The test probe comprises a memory metal part and at least two test clamps. The test clamp is in contact with the support column when the preset condition is met to enable the metal bump to be tested to realize signal transmission with the test probe through the support column.

[0007] Optionally, the test probe further comprises a fixed part connected with the probe support. The test clamp is arranged on the fixed part, and the test clamp and the fixed part form a non-closed cavity structure. When the test clamp is in contact with the support column, the solder cap is avoided in the cavity structure.

[0008] Optionally, the test clamps are uniformly or symmetrically distributed on the fixed part.

[0009] Optionally, the test clamps are arc-shaped plate structures or columnar structures, and gaps exist between the test clamps when the test clamps are in contact with the support columns.

[0010] Optionally, the test clamps are three in number, and the gaps between the three test clamps are in a Y-shaped distribution.

[0011] Optionally, the test clamps are four in number, and the gaps between the four test clamps are in a cross-shaped distribution.

[0012] Optionally, a profiled contact portion is arranged at an end of the test clamps, the profiled contact portion has a size greater than that of a main body portion of the test clamps, and the profiled contact portion is adapted to the shape of the support column.

[0013] Optionally, the cavity structure has a circular cross section, and the difference between the cross-sectional size of the cavity structure and that of the solder cap is in a range of 0-50um.

[0014] Optionally, the preset condition is that the temperature is greater than 70℃, and when the preset condition is not met, the open end of the test clamps is in an open state, and the size of the open end is greater than that of the solder cap.

[0015] By using the above chip clamp test device, the test probe is arranged as a cavity structure having an open end, and a shape-variable memory metal piece is used, the open end of each test clamp is in contact with the support column when the preset condition is met, and the test probe and the metal bump are in contact through the support column, so that direct contact between the test probe and the solder cap is avoided, the shape of the solder cap is ensured to be complete, and the subsequent process and performance are not affected due to damage of the solder cap.

[0016] To the accomplishment of the foregoing and related ends, one or more aspects of the application comprise the features hereinafter fully described and particularly pointed out in the claims. The following description and the annexed drawings set forth in detail certain illustrative aspects of the application. These aspects are indicative, however, of but a few of the various ways in which the principles of the application can be employed. Other aspects and advantages of the application will be apparent from the following detailed description of the application, from the claims, and from the appended drawings. BRIEF DESCRIPTION OF DRAWINGS

[0017] Other objects and results of the application will become more fully understood and appreciated only upon a reading of the following detailed description, taken in conjunction with the accompanying drawings, in which:

[0018] Figure 1 is a structural schematic view of a chip clamp test device according to an embodiment of the application in a first state.

[0019] Figure 2 FIG. 2 is a structural schematic view of a chip gripper testing device according to an embodiment of the present application in a second state;

[0020] Figure 3 FIG. 3 is a structural schematic view of a chip gripper testing device according to another embodiment of the present application;

[0021] Figure 4 FIG. 4 is a structural schematic view of three testing grippers according to an embodiment of the present application.

[0022] The reference signs in the drawings include: a testing probe 1, a fixed part 11, an inclined side arm 12, an open end 13, a solder cap 21, a support column 22, a chip protection layer 3, an insulating protection layer 4, a testing gripper 51, a testing gripper 52, and a testing gripper 53.

[0023] The same reference signs in all the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0024] In the following description, for the purposes of providing a thorough understanding of one or more embodiments, numerous specific details are set forth. It is apparent, however, to one skilled in the art that the embodiments can be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate a description of one or more embodiments.

[0025] In the description of the present application, it needs to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0026] Those skilled in the art can understand that, unless specifically stated, the singular forms "a", "an" and "the" used herein also include the plural forms. It should be further understood that the use of the term "comprising" in the specification of the present application means that the features, integers, steps, operations, elements and / or components described exist, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. It should be understood that the term "and / or" used herein includes any one of the associated listed items and all combinations of the associated listed items.

[0027] Those skilled in the art of the technology will understand that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art in the field to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0028] To describe the chip gripper testing device in detail, the specific embodiments of the present application will be described in detail below in combination with the drawings.

[0029] Figures 1 to 4 The overall or partial schematic structure of the chip gripper testing device according to the embodiments of the present application is shown from different angles, respectively.

[0030] As Figures 1 to 4 As shown in the drawings, the chip gripper testing device in the embodiments of the present application comprises a probe support and a testing probe 1 arranged on the probe support, the metal bump of the chip to be detected comprises a support column 22 arranged on a chip protection layer 3 and a solder cap 21 located at the end of the support column 22, and the material of the support column 22 is slightly harder than that of the solder cap 21, for example, the support column 22 can be made of copper, which is less likely to be damaged than the solder cap 21. In order to avoid direct contact between the traditional testing probe 1 and the solder cap 21, the testing probe 1 in the embodiments of the present application can comprise a memory metal piece and at least two testing grippers, in other words, the testing gripper can be made of a memory metal piece or a memory metal and alloy piece, and the proportion of the alloy and the memory metal can be flexibly set according to the deformation requirement of the testing probe. It can be known that, according to the characteristics of the memory metal, the opening end 13 of the testing gripper can be in contact with the support column 22 to realize signal transmission between the metal bump to be detected and the testing probe 1 through the support column 22 when the preset condition is met, that is, the transmission of the testing signal is realized through the support column 22, and the integrity of the solder cap 21 at the end is ensured.

[0031] Specifically, the above-mentioned preset condition can be set as a temperature condition, so that the memory metal is in different shapes at different temperatures, thereby completing the connection or disconnection of the test clamp and the metal bump; wherein, when in the first preset temperature range, the opening end 13 of the test clamp is opened, at this time, the test probe 1 can be driven to move to the outside of the support column 22 by driving the probe support or the driving device for moving the chip to be detected, so that the entire metal bump is located in the internal cavity of the test clamp; change the external environment temperature, so that when in the second preset temperature range, the opening end 13 of the test clamp is retracted and clamps the support column 22, the solder cap 21 at this time avoids in the internal cavity of the test clamp, thereby realizing the contact and conduction of the metal bump and the test probe 1, and effectively protecting the structure of the solder cap 21.

[0032] Among them, the temperature range and shape type of the memory metal can be diversified through material design and processing technology. Among them, the material type of the memory metal can include:

[0033] 1. Low temperature range material: capable of working in a temperature range as low as -100°C. For example, copper-based alloy (such as Cu-Zn-Al) can exhibit good shape memory effect in low temperature environment;

[0034] 2. Normal temperature range material: for example, nickel-titanium alloy (Nitinol) usually exhibits the best shape memory effect between -50°C and 100°C;

[0035] 3. High temperature range: nickel-titanium alloy with hafnium (Hf) or aluminum (Al) can increase the phase transition temperature to 200°C or even higher. For example, the phase transition temperature of Ni-Ti-Hf alloy can reach 200°C to 400°C;

[0036] 4. Ultra-high temperature range: iron-based alloy (such as Fe-Mn-Si) also exhibits shape memory effect in the temperature range of 200°C to 400°C, and such materials can be suitable for extremely high temperature environment.

[0037] In one specific embodiment of the utility model, the memory metal adopts metal material (for example, nickel titanium alloy) in normal temperature range, at this time the first preset temperature can be set as normal temperature, the range is 0~70 DEG C;The range of second preset temperature is greater than 70 DEG C, the first preset temperature can also be preferably set as normal temperature, for example 0~40 DEG C, can ensure that the opening end 13 of test clamp is in the open state under normal temperature state, and the opening end 13 after its opening is greater than the maximum size of metal bump, so that the metal bump can be in-depth to the internal cavity of test probe 1, in the testing process, by the temperature control heating of test clamp or changing its environment temperature, make the environment temperature reach the second preset temperature range required by test probe 1 deformation, at this time the opening end 13 of test clamp is inwards shrinkage and deforms until being attached with support column 22.

[0038] In one specific embodiment of the utility model, the test probe 1 further includes a fixed part 11 connected with the probe support;Wherein, the test clamp is arranged on the fixed part 11, and the test clamp and the fixed part 11 cooperate to form a non-closed cavity structure, when the test clamp is in contact with the support column, the solder cap is avoided in the cavity structure, the non-closed cavity structure can be realized by controlling the gap between the test clamps, for example, when the test clamp is inwards shrinkage to the support column, there will be a gap between each test clamp, or a through hole is arranged on the fixed part 11, so as to realize the non-closed structure of the cavity, which can effectively communicate with the outside when the temperature changes in the testing process, realize the heat dissipation effect, prevent the temperature from being too high to cause adverse effects on the chip or test clamp.

[0039] It can be known that the test clamps are evenly or symmetrically distributed on the fixed part 11, so as to ensure that the stress of the support column is uniform during testing, in addition, the test clamps can be arranged in an arc plate structure or a columnar structure, for example, the test clamps can be arranged in three, the gaps between the three test clamps are arranged in a "Y" shape, including test clamp 51, test clamp 52 and test clamp 53, as shown in Figure 3 Or, the test clamps can be arranged in four, the gaps between the four test clamps are arranged in a "cross" shape, as shown in Figure 4 The specific number or shape of the test clamps can be flexibly set according to the size of the support column or the test space, and is not limited to the specific structure shown in the drawings.

[0040] Further, in order to ensure that the test clamps can effectively contact with the support column after parallel, realize the transmission of test signal, the protruding profiled contact part can also be arranged at the end of the test clamp, the size of the profiled contact part can be slightly larger than the size of the main part of the test clamp, and smaller than the size of the support column, so that the profiled contact part can be adapted to the shape of the support column, realize effective contact and signal transmission.

[0041] Since the solder cap 21 on the chip is generally a ball top structure, and the support column 22 below it is a cylindrical structure, in order to adapt to the outer shape structure of the metal bump, realize that the test probe 1 can effectively contact the support column 22 when deformed, the cross section of the internal cavity of the test probe 1 (parallel to the direction of the chip protection layer 3) can be set to a circular structure, and the space of the internal cavity is ensured to have a sufficient margin to accommodate the solder cap 21, for example, the difference between the cross-sectional size of the internal cavity and the solder cap 21 is in the range of 0-50um, and preferably can be set to 0-27um, at this time, the solder cap 21 and the test probe 1 can be effectively avoided from colliding, and the opening end 13 of the test probe 1 can be safely avoided in the internal cavity before and after the deformation, thereby ensuring the integrity of the solder cap 21.

[0042] In the chip test clamp jaw device of the embodiment of the utility model, the test probe 1 is a hollow structure with an opening end 13, an internal cavity communicated with the opening end 13, and a fixed part 11 connected with the probe support, further, the opening end 13 and the fixed part 11 are connected through the inclined side arm 12, so as to avoid the solder cap 21 when the opening end 13 is connected with the support column 22; in the first preset temperature range, the size of the opening end 13 is greater than the size D of the solder cap 21, or further smaller than the size E of the internal cavity, at this time, when the test probe 1 is deformed due to the temperature influence, since the fixed part 11 is a solid structure, the deformation has little influence on the size, and under the action of the inclined side arm 12, the opening end 13 has the largest deformation, so as to realize the deformation effect of opening outward or shrinking inward.

[0043] It should be noted that, in order to avoid the test probe 1 from shrinking or enlarging as a whole, and causing the internal cavity to collide with the solder cap 21, the test clamp jaw part and / or the inclined side arm 12 part can be made of a memory metal material, and the fixed part 11 and other parts can be made of a conventional probe material, so as to effectively open or clamp the opening end 13. The cross section of the fixed part 11 can be set to a rectangle or a square, so as to facilitate the fixation on the probe support and reduce the interference between the fixed part 11 and other position test probes 1.

[0044] In addition, since there is a certain temperature change in the process of testing the chip by the test probe 1, in order to avoid mutual interference between adjacent test probes 1 or between the test probe 1 and the test chip, an insulating protective layer 4 surrounding the test probe 1 can be arranged outside the fixed part 11 of the test probe 1, and the material and thickness of the insulating protective layer 4 can be set according to the specific probe size, which can play the roles of insulation and protection. In addition, the test probe 1 can be connected with an external test system through a PCB, and a conversion board can also be arranged under special requirements, that is, the test probe is connected and conducted with the PCB through the conversion board, the PCB is connected with the external test system, and the test system tests the chip to be tested. In other words, the test probe 1 can be fixed on the PCB through the probe support, and in the testing process, the external test system is conducted with the test probe 1 through the PCB, so as to realize the transmission of test signals.

[0045] In another specific embodiment of the present application, in order to ensure the position accuracy between the test probe 1 and the metal bump, a first positioning mechanism can be arranged on the chip protective layer 3, and a second positioning mechanism can be arranged on the test probe 1 or the probe support. In the testing process, the test probe 1 and the metal bump are positioned by the cooperation of the first positioning mechanism and the second positioning mechanism, so as to ensure that the support column 22 is located at the center position of the opening end 13, and when the opening end 13 is deformed and contacted with the support column 22, the solder cap 21 is located in the internal cavity.

[0046] In the process of testing the chip to be tested by using the chip jaw test device, first, the test probe is moved above the chip to be tested, and then the end of the test jaw of the test probe is lowered or the chip to be tested is raised until the test jaw is located outside the support column. Then, when the opening end of the test jaw is in an open state, the test probe is controlled to move downward or the chip to be tested is raised until the first positioning mechanism and the second positioning mechanism are aligned with each other, at which time the opening end of the test jaw is located outside the support column of the metal bump. Further, the test jaw is controlled to be in a second preset temperature range. Due to the characteristics of the memory metal, the opening end of the test jaw will shrink inward and be in contact with the support column. Finally, the external test system completes the related performance detection of the chip through the test probe.

[0047] Specifically, when the chip to be tested is tested by using the chip jaw test device, first, the probe support and the test probe thereon are moved to the metal bump on the chip to be tested by the driving device. Then, when the opening end of the test jaw is in an open state, the test probe is controlled to move downward or the chip to be tested is raised until the first positioning mechanism and the second positioning mechanism are aligned with each other, at which time the opening end of the test jaw is located outside the support column of the metal bump. Further, the test jaw is controlled to be in a second preset temperature range. Due to the characteristics of the memory metal, the opening end of the test jaw will shrink inward and be in contact with the support column. Finally, the external test system completes the related performance detection of the chip through the test probe.

[0048] According to the chip clamp test device of the utility model, test probe is set as multiple test clamp structure of non-enclosed cavity structure, and memory metal material with variable shape is matched, so that the opening end of test clamp can be deformed under the condition of meeting preset condition, the opening end can be contacted and conducted with supporting column in clamp type, direct contact with solder cap is avoided, so that the conduction between test probe and metal bump is realized through supporting column, the integrity of solder cap is ensured, and the performance and service life of chip are not affected due to damage of solder cap.

[0049] The chip clamp test device according to the utility model is described above with reference to the drawings in an exemplary manner. However, it should be understood by those skilled in the art that various improvements can be made to the chip clamp test device of the utility model described above without departing from the content of the utility model. Therefore, the protection scope of the utility model should be determined by the content of the appended claims.

Claims

1. A chip gripper testing device, characterized in that: include: A probe holder and a test probe arranged on the probe holder; wherein, The metal bumps of the chip to be tested include support pillars arranged on the chip protection layer and solder caps located at the ends of the support pillars; The test probe includes a memory metal piece and at least two test clamping claws; The test clamp contacts and conducts with the support column when a preset condition is met, so that the metal bump to be detected and the test probe can achieve signal transmission through the support column.

2. The chip gripper testing device according to claim 1, characterized in that: The test probe further includes a fixing portion connected to the probe bracket; wherein, The test clamp is arranged on the fixing portion, and the test clamp cooperates with the fixing portion to form a non-enclosed cavity structure; When the test clamp is in contact with the support column, the solder cap is retracted into the cavity structure.

3. The chip gripper testing device according to claim 2, characterized in that: The test clamps are evenly or symmetrically distributed on the fixing portion.

4. The chip gripper testing device according to claim 1, characterized in that: The test clamp is an arc-shaped plate structure or a columnar structure; and When the test clamps are in contact with the support column, there will be a gap between the test clamps.

5. The chip gripper testing device according to claim 1, characterized in that: There are three test clamps, and the gaps between the three test clamps are distributed in a "Y" shape.

6. The chip gripper testing device according to claim 1, characterized in that: There are four test clamps, and the gaps between the four test clamps are distributed in a "cross" shape.

7. The chip gripper testing device according to claim 1, characterized in that: A contoured contact portion is provided at the end of the test clamping jaw, wherein the size of the contoured contact portion is larger than the size of the main body of the test clamping jaw; The contoured contact portion is adapted to the outer shape of the support column.

8. The chip gripper testing device according to claim 2, characterized in that: The cross section of the cavity structure is a circular structure; and The difference between the cross-sectional dimensions of the cavity structure and the solder cap ranges from 0 to 50 μm.

9. The chip gripper testing device according to claim 1, characterized in that: The preset condition is that the temperature is greater than 70°C; When the preset condition is not met, the open end of the test clamp is in an open state, and the size of the open end is larger than the size of the solder cap.

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