PCB (Printed Circuit Board) thermal analysis equipment

Abstract

The utility model discloses PCB (printed circuit board) thermal analysis equipment which comprises a rack, a moving mechanism and a heating mechanism, the moving mechanism is arranged on the rack, and the heating mechanism is arranged on the moving mechanism; the moving mechanism comprises a first driving motor, a first moving block, a first threaded rod, a second driving motor, a second threaded rod and a second moving block, according to the PCB thermal analysis equipment, hot air flow is exhausted through the hot air assembly to heat a PCB, so that the temperature of the PCB is changed, the rotating disc is started in a matched mode to drive the fixing table to rotate, and the PCB is heated through the hot air assembly; then the PCB arranged on the fixing table is rotated through rotation of the fixing table, so that the surface of the PCB is uniformly covered with uniform hot air flow, different areas can be uniformly heated, an infrared camera shooting assembly is matched, real-time detection is carried out, the temperature is prevented from being too high and controlled within a certain range, and after the PCB is heated to a certain temperature, the PCB is heated to a certain temperature. And checking potential fault points positioned by the PCB.

Description

TECHNICAL FIELD

[0001] The utility model relates to thermal analysis technical field, concretely is a kind of PCB board thermal analysis equipment. BACKGROUND

[0002] With the development of the times, electronic information industry develops rapidly, and PCB is very important as the core component of electronic equipment.

[0003] In order to ensure the performance and reliability of PCB in the working process, it needs to be detected before mass production of PCB board.

[0004] In the existing equipment, when the internal circuit of PCB board is running, the elements are detected by using infrared thermal imaging principle, and the internal short circuit, open circuit and poor contact are detected, but in actual work, PCB board will be affected by external temperature on its elements, not only the heat generated by the internal operation of PCB element, some faults will appear under the temperature exceeding the normal working temperature of PCB element.

[0005] Therefore, the utility model provides a kind of PCB board thermal analysis equipment to solve the above problems. UTILITY MODEL CONTENTS

[0006] In view of the deficiencies of the prior art, the utility model provides a kind of PCB board thermal analysis equipment, which solves the above problems.

[0007] To achieve the above purpose, the utility model is realized by the following technical scheme: a kind of PCB board thermal analysis equipment, including rack, mobile mechanism and heating mechanism are further included, the mobile mechanism is arranged on rack, the heating mechanism is arranged on mobile mechanism;

[0008] The mobile mechanism includes first drive motor, first moving block, first threaded rod, second drive motor, second threaded rod, second moving block, the first threaded rod is arranged on the output end of first drive motor, the first moving block is threadedly connected on the first threaded rod, the second threaded rod is arranged on the output end of second drive motor, and the second moving block is threadedly connected on the second threaded rod;

[0009] The heating mechanism includes heat diffusion plate and hot air assembly, the third drive motor, fan and heating wire are arranged in the hot air assembly, and the hot air assembly is arranged on the outside of rack.

[0010] Optionally, the rack is fixedly connected with a fixed rod, an infrared camera assembly is arranged on the fixed rod, and the infrared camera assembly includes an infrared camera and a data acquisition module.

[0011] Optionally, the first driving motor is arranged at the side end of the rack, and the side end of the first moving block is fixedly connected with an L-shaped connecting plate, and the inner side end of the L-shaped connecting plate is fixedly connected with a sliding block.

[0012] Optionally, the sliding block is slidably connected with a sliding rod arranged at the side end of the rack, the side wall of the L-shaped connecting plate is fixedly connected with a first fixed plate, and the first fixed plate is provided with a guide rail.

[0013] Optionally, the guide rail is slidably connected with a movable guide block, the second moving block is fixed on the movable guide block, and the second driving motor is fixedly connected on the first fixed plate.

[0014] Optionally, the heating mechanism further comprises a rotating disc arranged on the second moving block, the rotating disc is rotatably connected with a fixed table, the fixed table is provided with a heat insulation plate, and the material of the heat insulation plate is selected as glass fiber.

[0015] Optionally, the fixed table is provided with a second fixed plate at the side end, the second fixed plate is fixedly connected with a frame block at the side end, the frame block is arranged on the heat insulation plate, the inner side of the frame block is provided with a sliding groove, and the sliding groove is slidably connected with a third moving block.

[0016] Optionally, the second fixed plate is provided with an adjusting cap at the side end, the second fixed plate is rotatably connected with a third threaded rod, the third threaded rod is fixedly connected with the adjusting cap, the third moving block is threadedly connected on the third threaded rod, the third moving block is fixedly connected with a triangular fixed block, one end of the triangular fixed block close to the heat diffusion plate is provided with a fixed clamping groove, and the material of the heat diffusion plate is selected as copper.

[0017] Beneficial effects

[0018] The utility model provides a kind of PCB hot analysis equipment.Compared with prior art, it has the following beneficial effects:

[0019] (1) a kind of PCB hot analysis equipment, hot air component is discharged to the hot airflow to heat PCB, so as to change the temperature of PCB circuit board, cooperate with the starting rotating disc to drive fixed table rotation, then the PCB arranged on fixed table is rotated by the rotation of fixed table, so that the airflow evenly hot airflow evenly covers the surface of PCB, so that different regions can be uniformly heated, cooperate with infrared camera component, real-time detection, avoid temperature too high, control in a certain range, after PCB is heated to a certain temperature, locate potential fault point of PCB.

[0020] (2) The PCB thermal analysis equipment discharges hot air flow through the hot air component, cooperates with the heat diffusion plate at the bottom end of the PCB, quickly absorbs heat and uniformly conducts the heat to the bottom end of the PCB on the whole board surface, so that the temperature of the whole PCB can be quickly and uniformly raised, and the local overheating or uneven temperature condition is reduced.

[0021] (3) The PCB thermal analysis equipment adjusts the position of the PCB through the moving mechanism, so that the detection efficiency is improved, and repeated detection on part areas during manual detection is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0022] Fig. 1 is the overall mechanism side view of the utility model;

[0023] Fig. 2 is the overall structure oblique rear side view of the utility model;

[0024] Fig. 3 is the moving mechanism partial structure side view of the utility model;

[0025] Fig. 4 is the moving mechanism partial structure side view of the utility model;

[0026] Fig. 5 is the heating mechanism structure side view of the utility model;

[0027] Fig. 6 is the moving mechanism structure side view of the utility model.

[0028] In the figure, 1, rack; 2, fixed rod; 3, infrared camera assembly;

[0029] Moving mechanism: 41, first drive motor; 42, first moving block; 43, L-shaped connecting plate; 44, first threaded rod; 45, sliding rod; 46, sliding block; 47, first fixed plate; 48, second drive motor; 49, second threaded rod; 491, second moving block; 492, guide rail; 493, movable guide block;

[0030] Heating mechanism: 51, rotating disc; 52, fixed table; 53, heat insulation plate; 54, second fixed plate; 55, frame block; 56, third threaded rod; 57, third moving block; 58, triangular fixed block; 59, fixed clamping groove; 591, heat diffusion plate; 592, adjusting cap; 593, hot air component. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0032] Embodiment one:

[0033] Please refer to Figs. 1-6 A PCB thermal analysis equipment, including frame 1, still including moving mechanism and heating mechanism, moving mechanism sets up on frame 1, heating mechanism sets up on moving mechanism;

[0034] Moving mechanism includes first drive motor 41, first moving block 42, first threaded rod 44, second drive motor 48, second threaded rod 49, second moving block 491, first threaded rod 44 sets up on the output end of first drive motor 41, first moving block 42 is screw connected on first threaded rod 44, second threaded rod 49 sets up on the output end of second drive motor 48, second moving block 491 is screw connected on second threaded rod 49;

[0035] Heating mechanism includes heat diffusion plate 591 and hot air assembly 593, hot air assembly 593 is provided with third drive motor, small fan and heating wire inside, hot air assembly 593 sets up on the outside of frame 1.

[0036] Frame 1 is fixedly connected with fixed rod 2, and infrared camera assembly 3 is arranged on the fixed rod 2, and the infrared camera assembly 3 comprises an infrared camera and a data acquisition module inside. The data acquisition module is matched with the infrared camera, which is prior art.

[0037] First drive motor 41 sets up on the side end of frame 1, and the side end of first moving block 42 is fixedly connected with L-shaped connecting plate 43, and the inner side end of L-shaped connecting plate 43 is fixedly connected with sliding block 46.

[0038] Sliding block 46 is slidably connected with sliding rod 45, and sliding rod 45 is arranged on the side end of frame 1, and L-shaped connecting plate 43 is fixedly connected with first fixed plate 47, and first fixed plate 47 is provided with guide rail 492.

[0039] Guide rail 492 is slidably connected with movable guide block 493, and second moving block 491 is fixed on movable guide block 493, and second drive motor 48 is fixedly connected on first fixed plate 47.

[0040] Working principle: start the first drive motor 41, so that the first threaded rod 44 rotates, control the first moving block 42 front and back direction movement, the first moving block 42 drive L type connecting plate 43 movement, in turn drive the slider 46 along the slide rod 45 on the movement, so as to adjust the position of the first fixed plate 47, and then start the second drive motor 48, so that the second threaded rod 49 rotates, so that the second moving block 491 along the second threaded rod 49 on the left and right movement, movable guide block 493 movement drive movable guide block 493 along the guide rail 492 on the movement, adjust the appropriate position, convenient for the PCB board to adjust to the appropriate position, convenient for infrared camera assembly 3 observation of PCB board.

[0041] Embodiment two:

[0042] Please refer to Figs. 1-6 , the embodiment provides a kind of PCB board thermal analysis equipment technical scheme based on embodiment one: heating mechanism further includes rotary disc 51, rotary disc 51 is set on the second moving block 491, rotary disc 51 is rotationally connected with fixed table 52, fixed table 52 is provided with heat insulation plate 53, the material selection of heat insulation plate 53 is glass fiber.

[0043] Fixed table 52 side end is provided with second fixed plate 54, second fixed plate 54 side end is fixedly connected with frame block 55, frame block 55 is arranged on heat insulation plate 53, frame block 55 inner side is provided with sliding slot, sliding slot is slidably connected with third moving block 57.

[0044] Second fixed plate 54 side end is provided with adjusting cap 592, second fixed plate 54 is rotationally connected with third threaded rod 56, third threaded rod 56 is fixedly connected with adjusting cap 592, third moving block 57 is screw-connected on third threaded rod 56, third moving block 57 is fixedly connected with triangular fixed block 58, triangular fixed block 58 is provided with fixed clamping groove 59 close to one end of heat diffusion plate 591, the material selection of heat diffusion plate 591 is copper.

[0045] Working principle: the PCB board is placed on the heat diffusion plate 591, and then the adjusting cap 592 is manually rotated to drive the third threaded rod 56 to rotate, so that the third moving block 57 moves towards the heat diffusion plate 591, the position of the third moving block 57 is adjusted, the third moving block 57 drives the triangular fixed block 58 to move towards the heat diffusion plate 591, and then the side end of the PCB board is fixed by the fixed clamping groove 59, and then the third driving motor and the heating wire in the hot air assembly 593 are started, so that the third driving motor in the hot air assembly 593 rotates to drive the small fan to rotate, and the hot air is discharged by the small fan, and the hot air flow directly heats the PCB board clamped by the heating mechanism, so that the temperature of the PCB circuit board is changed, the fixed table 52 is driven to rotate by starting the rotating disc 51, and then the PCB board arranged on the fixed table 52 is rotated by rotating the fixed table 52, so that the airflow uniformly covers the surface of the PCB board, so that different areas can be uniformly heated, and the infrared camera assembly 3 is used for real-time detection, so that the temperature is controlled within a certain range, and the PCB board is detected by the infrared camera assembly 3 to troubleshoot faults.

[0046] The heat diffusion plate 591 at the bottom end of the PCB board quickly absorbs heat and uniformly conducts the heat to the bottom end of the PCB on the entire board surface, so that the local overheating or temperature unevenness is reduced, and the temperature of the entire PCB board can be quickly and uniformly raised.

[0047] Meanwhile, the contents not described in detail in the specification all belong to the prior art known by those skilled in the art.

[0048] It should be noted that, in this paper, the relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.

[0049] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A PCB thermal analysis device, comprising a frame (1), characterized in that: It also includes a moving mechanism and a heating mechanism, wherein the moving mechanism is arranged on the frame (1), and the heating mechanism is arranged on the moving mechanism; The moving mechanism comprises a first drive motor (41), a first moving block (42), a first threaded rod (44), a second drive motor (48), a second threaded rod (49), and a second moving block (491), wherein the first threaded rod (44) is arranged at the output end of the first drive motor (41), the first moving block (42) is threadedly connected to the first threaded rod (44), the second threaded rod (49) is arranged at the output end of the second drive motor (48), and the second moving block (491) is threadedly connected to the second threaded rod (49); The heating mechanism comprises a heat diffusion plate (591) and a hot air component (593); a third driving motor, a fan and a heating wire are arranged inside the hot air component (593); and the hot air component (593) is arranged outside the frame (1).

2. A PCB thermal analysis device according to claim 1, characterized in that: The frame (1) is fixedly connected to a fixing rod (2), an infrared camera assembly (3) is provided on the fixing rod (2), and the infrared camera assembly (3) includes an infrared camera and a data acquisition module.

3. A PCB thermal analysis device according to claim 1, characterized in that: The first drive motor (41) is arranged at a side end of the frame (1); the side end of the first moving block (42) is fixedly connected to an L-shaped connecting plate (43); and the inner side end of the L-shaped connecting plate (43) is fixedly connected to a slider (46).

4. A PCB thermal analysis device according to claim 3, characterized in that: The inner side of the slider (46) is slidably connected to a slide bar (45), and the slide bar (45) is arranged at the side end of the frame (1). The side wall of the L-shaped connecting plate (43) is fixedly connected to a first fixed plate (47), and the first fixed plate (47) is provided with a guide rail (492).

5. A PCB thermal analysis device according to claim 4, characterized in that: A movable guide block (493) is slidably connected to the guide rail (492), the second movable block (491) is fixed on the movable guide block (493), and the second drive motor (48) is fixedly connected to the first fixed plate (47).

6. A PCB thermal analysis device according to claim 1, characterized in that: The heating mechanism further comprises a rotating disk (51), wherein the rotating disk (51) is arranged on the second movable block (491), a fixed platform (52) is rotatably connected to the rotating disk (51), and a heat insulation board (53) is arranged on the fixed platform (52), and the material of the heat insulation board (53) is selected to be glass fiber.

7. A PCB thermal analysis device according to claim 6, characterized in that: A second fixed plate (54) is provided at a side end of the fixed platform (52), a frame block (55) is fixedly connected to a side end of the second fixed plate (54), the frame block (55) is provided on the heat insulation board (53), a sliding groove is provided on the inner side of the frame block (55), and a third movable block (57) is slidably connected in the sliding groove.

8. A PCB thermal analysis device according to claim 7, characterized in that: An adjusting cap (592) is provided at the side end of the second fixed plate (54), a third threaded rod (56) is rotatably connected to the second fixed plate (54), the third threaded rod (56) is fixedly connected to the adjusting cap (592), the third movable block (57) is threadedly connected to the third threaded rod (56), a triangular fixed block (58) is fixedly connected to the third movable block (57), a fixing slot (59) is provided at one end of the triangular fixed block (58) close to the heat diffusion plate (591), and the material of the heat diffusion plate (591) is selected to be copper.

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