Optical module

Abstract

The utility model provides an optical module. A laser chip is arranged on a circuit board. The surface layer of the circuit board is etched to form a heating area which is used for generating heat. The heating area is located below the laser chip so that heat generated by the heating area can heat the laser chip. And a heat conduction layer is arranged between the heating area and the laser chip. The bottom surface of the heat-conducting layer is connected with the heating area, and the top surface of the heat-conducting layer is connected with the laser chip. Heat generated by the heating area is directly conducted to the laser chip through the heat conduction layer so as to heat the laser chip. The heat-conducting layer is non-conductive and is directly connected with the heating area, current of the heating area is conducted along the heating area and cannot enter the heat-conducting layer, and short circuit of the heating area is reduced. An insulating layer is arranged between the heat-conducting area and the heating area, the bottom surface of the insulating layer is connected with the heating area, the top surface of the insulating layer is connected with the bottom surface of the heat-conducting layer, current of the heating area is conducted along the heating area and cannot enter the heat-conducting layer, and short circuit of the heating area is reduced.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. BACKGROUND

[0002] With the development of new business and application mode such as cloud computing, mobile Internet, video, etc., the development and progress of optical communication technology becomes increasingly important. In optical communication technology, the optical module is a tool for converting optical and electrical signals, and is one of the key devices in optical communication equipment. With the development of optical communication technology, the transmission rate of the optical module is continuously improved. CONTENT OF THE UTILITY MODEL

[0003] The present disclosure provides an optical module to ensure the light emitting performance.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] a circuit board;

[0006] a laser chip disposed on the circuit board for emitting optical signals;

[0007] wherein the surface layer of the circuit board has:

[0008] a heating area located below the laser chip for heating the laser chip; the heating area is formed by etching the surface layer of the circuit board;

[0009] the circuit board is provided with:

[0010] a heat conduction layer located between the laser chip and the heating area, the bottom surface of the heat conduction layer is connected with the heating area, and the top surface of the heat conduction layer is connected with the laser chip, for conducting heat;

[0011] the heat conduction layer is not conductive, and the heat conduction layer is directly connected with the heating area; or, the heat conduction layer is conductive, and an insulating layer is arranged between the heat conduction layer and the heating area, the top surface of the insulating layer is connected with the bottom surface of the heat conduction layer, and the bottom surface of the insulating layer is connected with the heating area.

[0012] The technical scheme has the following beneficial effects: the laser chip is arranged on the circuit board and used for emitting an optical signal. The surface layer of the circuit board is etched to form a heating area, and the heating area is used for generating heat. The heating area is located below the laser chip, so that the heat generated by the heating area heats the laser chip. A heat-conducting layer is arranged between the heating area and the laser chip. The heat-conducting layer is used for conducting heat. The bottom surface of the heat-conducting layer is connected with the heating area, and the top surface of the heat-conducting layer is connected with the laser chip. The heat generated by the heating area is directly conducted to the laser chip through the heat-conducting layer, which not only can heat the laser chip and reduce the probability of the laser chip being in a low temperature state to ensure the light-emitting performance of the laser chip, but also can reduce the heat conduction path and improve the heating efficiency. The heat-conducting layer is conductive, and the current of the heating area may be conducted along the heat-conducting layer, which causes the heating area to be short-circuited. The heat-conducting layer is not conductive, and the current of the heating area only conducts along the heating area and does not enter the heat-conducting layer. Therefore, the heat-conducting layer is not conductive, the heat-conducting layer is directly connected with the heating area, the current of the heating area conducts along the heating area and does not enter the heat-conducting layer, and the short circuit of the heating area is reduced. The heat-conducting layer is conductive, and an insulating layer is arranged between the heat-conducting area and the heating area. The bottom surface of the insulating layer is connected with the heating area, and the top surface of the insulating layer is connected with the bottom surface of the heat-conducting layer. The current of the heating area conducts along the heating area and does not enter the heat-conducting layer, and the short circuit of the heating area is reduced.

[0013] In some embodiments, a light module is provided, and the heating area includes:

[0014] a first sub-heating area;

[0015] a second sub-heating area, and a first insulating area is arranged between the first sub-heating area and the second sub-heating area. The first insulating area extends from the first boundary of the heating area to the second boundary of the heating area and does not extend to the second boundary of the heating area, so that one end of the second sub-heating area is connected with one end of the first sub-heating area.

[0016] a third sub-heating area, and a second insulating area is arranged between the second sub-heating area and the third sub-heating area. The second insulating area extends from the second boundary of the heating area to the first boundary of the heating area and does not extend to the first boundary of the heating area, so that one end of the third sub-heating area is connected with the other end of the second sub-heating area.

[0017] The technical scheme has the following beneficial effects: the heating area comprises a first sub-heating area and a second sub-heating area, a first insulation area is arranged between the first sub-heating area and the second sub-heating area, the first insulation area extends from a first boundary of the heating area to a second boundary of the heating area and does not extend to the second boundary of the heating area, so that one end of the first sub-heating area is connected with one end of the second sub-heating area, the length of the heating area can be extended, the cross-sectional area of the heating area can be reduced, and the resistivity of the heating area can be improved. The heating area further comprises a third sub-heating area, a second insulation area is arranged between the second sub-heating area and the third sub-heating area, the second insulation area extends from the second boundary of the heating area to the first boundary of the heating area and does not extend to the first boundary of the heating area, so that the other end of the second sub-heating area is connected with one end of the third sub-heating area, the length of the heating area can be further extended, and the resistivity of the heating area can be further improved.

[0018] In some embodiments, a light module is provided, and the circuit board is provided with:

[0019] An adjustable voltage source, an output pin of which is connected with one end of the first sub-heating area which is not connected with the second sub-heating area, for providing voltage;

[0020] A reference ground connected with one end of the third sub-heating area which is not connected with the second sub-heating area;

[0021] The surface layer of the circuit board further comprises a body area, and there is a gap between the body area and the heating area, and the heating area is connected with the reference ground and the adjustable voltage source through wire bonding.

[0022] The technical scheme has the following beneficial effects: the circuit board is provided with the adjustable voltage source and the reference ground, the output pin of the adjustable voltage source is connected with one end of the first sub-heating area which is not connected with the second sub-heating area, for providing voltage. The reference ground is connected with one end of the third sub-heating area which is not connected with the second sub-heating area. Voltage is applied to the heating area, and current flows from one end of the heating area close to the adjustable voltage source to the other end of the heating area close to the reference ground, so that heat is generated in the heating area. The surface layer of the circuit board further comprises a body area, and there is a gap between the body area and the heating area, and the heating area is connected with the reference ground and the adjustable voltage source through wire bonding, so as to separate the heating area from the body area and reduce the current flowing from the heating area to the body area.

[0023] In some embodiments, a light module is provided, and the circuit board is provided with:

[0024] An adjustable voltage source, an output pin of which is connected with one end of the first sub-heating area which is not connected with the second sub-heating area, for providing voltage;

[0025] A reference ground connected with one end of the third sub-heating area which is not connected with the second sub-heating area;

[0026] The surface layer of the circuit board further comprises a body region, the body region has a gap between the first region of the heating region and the body region is connected with the reference ground and the adjustable voltage source.

[0027] The technical scheme has the following beneficial effects: The adjustable voltage source and the reference ground are arranged on the circuit board, an output pin of the adjustable voltage source is connected with one end of the first sub-heating region which is not connected with the second sub-heating region, and the reference ground is connected with one end of the third sub-heating region which is not connected with the second sub-heating region. Voltage is applied to the heating region, and current flows from one end of the heating region close to the adjustable voltage source to one end of the heating region close to the reference ground, so that the heating region generates heat. The surface layer of the circuit board further comprises a body region, the body region has a gap between the first region of the heating region and the body region is connected with the reference ground and the adjustable voltage source, so as to separate the heating region from the body region and reduce the current flowing from the heating region to the body region. The first region is a region of the heating region except the region connected with the reference ground and the adjustable voltage source.

[0028] In some embodiments, the optical module further comprises:

[0029] a temperature detector for monitoring temperature;

[0030] an MCU, an input pin of the MCU is connected with the temperature detector, and an output pin of the MCU is connected with a feedback pin of the adjustable voltage source to output a feedback voltage;

[0031] The MCU is integrated with:

[0032] a register for storing a relationship table of temperature and feedback voltage.

[0033] The technical scheme has the following beneficial effects: The temperature detector and the MCU are arranged on the circuit board, the temperature detector is used for monitoring temperature, and the input pin of the MCU is connected with the temperature detector to obtain the temperature according to the resistance value of the temperature detector. The MCU is integrated with the register for storing the relationship table of temperature and feedback voltage. The MCU obtains the feedback voltage according to the temperature and the relationship table and outputs the feedback voltage. The output pin of the MCU is connected with the feedback pin of the adjustable voltage source to output the feedback voltage. The adjustable voltage source adjusts the output voltage of the heating region according to the feedback voltage, so that the temperature of the laser chip is stable.

[0034] In some embodiments, the optical module further comprises:

[0035] an MCU, an output pin of the MCU is connected with a feedback pin of the adjustable voltage source to output a feedback voltage;

[0036] The MCU is integrated with:

[0037] Temperature sensor, used to monitor temperature;

[0038] Register, used to store the relationship table between temperature and fed voltage.

[0039] The above technical solution has the following beneficial effects: The circuit board also includes an MCU. The MCU integrates a temperature sensor and a register. The temperature sensor is used to monitor temperature, and the register is used to store a table of relationships between temperature and feedback voltage. The MCU obtains and outputs a feedback voltage based on the temperature and the table. The output pin of the MCU is connected to the feedback pin of an adjustable voltage source to output the feedback voltage. The adjustable voltage source adjusts the output voltage to the heating zone based on the feedback voltage to stabilize the temperature of the laser chip.

[0040] In some embodiments, an optical module is provided, wherein the width of the insulating layer is greater than or equal to the width of the thermal conductive layer, and the length of the insulating layer is greater than or equal to the length of the thermal conductive layer.

[0041] The above technical solution has the following beneficial effects: the width of the insulating layer is greater than or equal to the width of the heat-conducting layer, and the length of the insulating layer is greater than or equal to the length of the heat-conducting layer, so that the heat on the insulating layer can be transferred to the heat-conducting layer as much as possible.

[0042] In some embodiments, an optical module is provided, wherein the laser chip includes:

[0043] a first positive electrode, disposed on the first top surface;

[0044] A first negative electrode is provided on the second top surface; the first top surface and the second top surface are different top surfaces of the laser chip;

[0045] A laser driver chip is provided on the circuit board, and the laser driver chip includes:

[0046] a second positive electrode connected to the first positive electrode;

[0047] The second negative electrode is connected to the second negative electrode; the second positive electrode and the second negative electrode of the laser driver chip both output modulation current and bias current, so that the modulation current and bias current are transmitted to the laser chip in the form of differential signals.

[0048] The technical scheme has the following beneficial effects: the laser chip comprises a first positive electrode and a first negative electrode, the first positive electrode and the first negative electrode are arranged on different top surfaces of the laser chip, the circuit board is provided with a laser driving chip, the laser driving chip comprises a second positive electrode and a second negative electrode, the second positive electrode is connected with the first positive electrode, the second negative electrode is connected with the first negative electrode, the second positive electrode and the second negative electrode both emit a modulation current and a bias current, so that the modulation current and the bias current are conducted to the laser chip in the form of a differential signal, and the laser chip emits an optical signal under the action of the bias current and the modulation current.

[0049] In some embodiments, the optical module further comprises:

[0050] The lens assembly is arranged on the laser chip and the laser driving chip, and comprises:

[0051] The first lens is arranged on a side of the lens assembly facing the circuit board and in an optical path of the laser chip;

[0052] The reflecting surface is arranged on a side of the lens assembly facing away from the circuit board and in a collimated light path of the first lens;

[0053] The second lens is arranged in a reflected light path of the reflecting surface, so that the second lens converges the optical signal reflected by the reflecting surface.

[0054] The technical scheme has the following beneficial effects: the optical module further comprises the lens assembly, the lens assembly is arranged on the laser chip and the laser driving chip, so as to reduce the wire bonding distance between the laser chip and the laser driving chip. The lens assembly comprises the first lens, the reflecting surface and the second lens, the first lens is arranged on a side of the lens assembly facing the circuit board and in an optical path of the laser chip, so as to collimate the optical signal emitted by the laser chip. The reflecting surface is arranged on a side of the lens assembly facing away from the circuit board and in a collimated light path of the first lens, so as to reflect the collimated optical signal of the first lens. The second lens is arranged in a reflected light path of the reflecting surface, so that the second lens converges the optical signal reflected by the reflecting surface to the optical fiber, so as to realize the emission of the optical signal.

[0055] In some embodiments, the optical module further comprises:

[0056] The optical receiving chip is used for receiving the optical signal;

[0057] The optical matching chip is connected with the optical receiving chip through wire bonding, and the lens assembly is arranged on the optical receiving chip and the optical matching chip.

[0058] The technical scheme has the following beneficial effects: The circuit board is further provided with a light receiving chip and a light matching chip, the light receiving chip is used for receiving an optical signal and converting the optical signal into an electrical signal, so that the optical module can realize receiving of the optical signal, the light matching chip is connected with the light receiving chip through wire bonding, so that the electrical signal is transmitted to the light matching chip through wire bonding, and the lens assembly is arranged on the light receiving chip and the light matching chip, so as to shorten the wire bonding distance between the light receiving chip and the light matching chip. BRIEF DESCRIPTION OF DRAWINGS

[0059] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required to be used in the embodiments or prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0060] Figure 1 A partial structure diagram of an optical communication system according to some embodiments is provided.

[0061] Figure 2 A partial structure diagram of a host computer according to some embodiments is provided.

[0062] Figure 3 A structure diagram of an optical module according to some embodiments is provided.

[0063] Figure 4 An exploded view of an optical module according to some embodiments is provided.

[0064] Figure 5 A sectional view of an internal structure of an optical module according to some embodiments is provided.

[0065] Figure 6 An exploded view of an internal structure of an optical module according to some embodiments is provided.

[0066] Figure 7 A partial enlarged view of an internal structure of an optical module according to some embodiments is provided.

[0067] Figure 8 A partial enlarged view of a circuit board of an optical module according to some embodiments is provided.

[0068] Figure 9 A structure diagram of a laser chip according to some embodiments is provided.

[0069] Figure 10 A partial sectional view of an internal structure of an optical module according to some embodiments is provided.

[0070] Figure 11Another partial sectional view of an internal structure of an optical module according to some embodiments;

[0071] Figure 12 A schematic diagram of an internal structure of an optical module according to some embodiments;

[0072] Figure 13 Another schematic diagram of an internal structure of an optical module according to some embodiments. DETAILED DESCRIPTION

[0073] Some embodiments of the present disclosure will be described in detail below with reference to the drawings. However, the described embodiments are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided in the present disclosure, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0074] Unless otherwise required by the context, throughout the specification and claims, the term "comprising" is interpreted to mean "including, but not limited to"; the terms "first", "second", etc. are not used to denote or imply relative importance or an upper limit on the number of items; the term "multiple" means two or more; the term "connected" is to be interpreted broadly, for example, "connected" can be fixedly connected, or detachably connected, or integrated, can be directly connected, or indirectly connected through an intermediate medium; the use of the terms "adapted to" or "configured to" means open and inclusive language, which does not exclude devices adapted or configured to perform additional tasks or steps; the terms "parallel", "vertical", "same", "consistent", "flush", etc. are not limited to absolute mathematical relationships, but also include acceptable error ranges generated in practice, and differences formed based on the same design concept but due to manufacturing reasons.

[0075] In optical communication technology, in order to establish information transmission between information processing devices, information is loaded onto light, and the transmission of information is carried out by using the propagation speed of light. Such information-loaded light is an optical signal. The optical signal can reduce the loss of optical power when transmitted in an optical information transmission device, and realize long-distance transmission of the optical signal. At the same time, the cost of optical information transmission devices such as optical fibers is lower than that of electrical information transmission devices such as copper wires. Therefore, optical communication technology can realize high-speed, long-distance, and low-cost information transmission.

[0076] An information processing device generally includes an optical network unit (ONU), a gateway, a router, a switch, a mobile phone, a computer, a server, a tablet computer, a television, etc., and an optical information transmission device generally includes an optical fiber and an optical waveguide, etc. The signal capable of being recognized and processed by the information processing device is an electrical signal, and the optical communication technology adopts an optical signal for transmission, which requires an optical module to convert the optical signal and the electrical signal.

[0077] The optical module can realize the mutual conversion between the optical signal and the electrical signal between the information processing device and the optical information transmission device. In some embodiments, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network unit; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network unit; a second electrical signal from the optical network unit is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber.

[0078] Since the information transmission between multiple information processing devices can be performed through electrical signals, at least one of the multiple information processing devices needs to be directly connected with the optical module, without the need for all the information processing devices to be directly connected with the optical module. Here, the information processing device directly connected with the optical module is also referred to as a host computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module is referred to as an optical port, and the electrical signal input end or the electrical signal output end of the optical module is referred to as an electrical port.

[0079] Figure 1 A partial structure diagram of an optical communication system according to some embodiments is provided. As shown in Figure 1 the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 of an optical module, an optical module 200, an optical fiber 101, and a network cable 103, wherein the optical fiber 101 belongs to an optical information transmission device, and the network cable 103 belongs to an electrical information transmission device.

[0080] In some embodiments, one end of the optical fiber 101 extends to the direction of the remote information processing device 1000, and the other end of the optical fiber 101 is connected with the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the totally reflected direction can almost maintain the original optical power. The optical signal is totally reflected in the optical fiber 101 for multiple times, so as to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing the information transmission at a long distance based on low power loss.

[0081] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected with the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected with the optical module 200.

[0082] The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor or control the working state of the optical module 200.

[0083] The host computer 100 includes a housing accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102, so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0084] The host computer 100 further includes an external electrical interface that can access an electrical signal network. In some embodiments, the external electrical interface includes a universal serial bus (USB) or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional or bidirectional electrical signal connection.

[0085] One end of the network cable 103 is connected to a local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, the host computer 100 generates a second electrical signal according to the third electrical signal, the second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, the second optical signal is transmitted to a remote information processing device 1000 in the optical fiber 101.

[0086] In some embodiments, a first optical signal from the remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000.

[0087] In some embodiments, the optical module is a tool for converting optical signals and electrical signals, and in the conversion process, the information does not change, and the encoding or decoding method of the information changes.

[0088] The host computer 100 includes an optical line terminal (OLT), an optical network terminal (ONT), or a data center server, in addition to the optical network terminal.

[0089] Figure 2 A partial structure diagram of a host computer according to some embodiments is provided. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. As Figure 2 shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 arranged in the accommodation cavity, and a cage 106 arranged on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0090] In some embodiments, the cage 106 is provided with a heat sink 107, which can dissipate heat for the optical module; in some embodiments, the heat sink 107 has a fin or other protruding structure to increase the heat dissipation area.

[0091] In some embodiments, the cage 106 is internally provided with an electrical connector configured to access the electrical port of the optical module 200.

[0092] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107.

[0093] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 establish electrical signal connection.

[0094] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish optical signal connection.

[0095] Figure 3 A structure diagram of an optical module according to some embodiments is provided, Figure 4 A partial structure diagram of a host computer according to some embodiments is provided. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 3 and Figure 4As shown, in some embodiments, the optical module 200 comprises a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical opening, and the other of which is an optical opening. In some embodiments, the shell forms one opening, which is both an electrical opening and an optical opening.

[0096] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which are conducive to electromagnetic shielding and heat dissipation.

[0097] The assembly method of the upper shell 201 and the lower shell 202 facilitates the installation of the circuit board 300, the optical transceiver component 900, and the like into the shell, and the shell can encapsulate and protect the above-mentioned devices.

[0098] The direction of the connection line of the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or can be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the right end of the optical module 200), and the opening 205 is also located at the end of the optical module 200 (the left end of the optical module 200). Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. Figure 3 Figure 3

[0099] In some embodiments, the lower shell 202 comprises a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper shell 201 comprises a cover plate 2011, which covers the two lower side plates 2022 of the lower shell 202 to form the shell.

[0100] In some embodiments, the lower shell 202 comprises a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper shell 201 comprises a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011, and the two upper side plates and the two lower side plates 2022 are combined to cover the lower shell 202 by the upper shell 201.

[0101] As shown in FIG. 1, the optical module 200 comprises a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical opening, and the other of which is an optical opening. In some embodiments, the shell forms one opening, which is both an electrical opening and an optical opening. Figure 3 Figure 4 ​​​As shown, in some embodiments, the optical module includes a circuit board 300 disposed in a housing. The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. The electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). The chips may include a microcontroller unit (MCU), a laser driver chip, a transimpedance amplifier (TIA), a limiting amplifier (LA), a clock and data recovery chip (CDR), a power management chip, and a digital signal processing (DSP) chip.

[0102] In some embodiments, the circuit board includes a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a load-bearing function. For example, the rigid circuit board can stably support the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0103] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0104] In some embodiments, the circuit board further includes a gold finger formed on an end surface thereof, wherein the gold finger is composed of a plurality of independent pins.

[0105] In some implementations, the gold finger is disposed on a surface of one side of the circuit board 300 (eg Figure 4 In some implementations, gold fingers are provided on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to occasions where a large number of pins are required.

[0106] In some implementations, the circuit board's gold fingers extend from the electrical port and plug into an electrical connector on the host computer 100. The circuit board is inserted into the cage 106, with the gold fingers providing electrical connection to the electrical connector within the cage 106. The gold fingers are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (I2C) signal transmission, and data signal transmission.

[0107] In some embodiments, the light module 200 further comprises an unlocking component 600 located outside the shell thereof. The unlocking component 600 is configured to achieve the fixed connection between the light module 200 and the host computer, or to release the fixed connection between the light module 200 and the host computer.

[0108] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower shell 202, and comprises a clamping component matched with the cage 106 of the host computer 100. When the light module 200 is inserted into the cage 106, the light module 200 is fixed in the cage 106 by the clamping component of the unlocking component 600; when the unlocking component 600 is pulled, the clamping component of the unlocking component 600 moves accordingly, thereby changing the connection relationship of the clamping component with the host computer, to release the fixation of the light module 200 with the host computer, so that the light module 200 can be pulled out of the cage 106.

[0109] In some embodiments, the light module 200 further comprises a light transceiver component 900 located inside the shell. The light transceiver component 900 can be placed on the circuit board 300. The light transceiver component 900 has both transmitting and receiving functions to achieve the transmission and reception of optical signals.

[0110] Figure 5 A cross-sectional view of an internal structure of a light module according to some embodiments. Figure 6 An exploded view of an internal structure of a light module according to some embodiments. As shown in Figure 4 、 Figure 5 and Figure 6 In some embodiments, the circuit board 300 can be provided with an optical chip 310. The optical chip 310 can be a laser chip 311 and / or a light receiving chip 312, and the laser chip 311 and the light receiving chip 312 can be fixed side by side on the circuit board 300.

[0111] The circuit board 300 can be provided with an optical matching chip 320. The optical matching chip 320 can be a laser driving chip 321 and / or a TIA chip 322, etc. The bare chip is adhered to the circuit board 300 by silver glue, which plays a role in fixation and heat dissipation, and then the bare chip and the circuit board 300 are electrically connected by gold wire bonding.

[0112] Since the optical chip 310 is attached to the circuit board 300, the light emitting surface or the light entering surface is located at the top surface of the optical chip 310, so that the light beams emitted by the laser chip are perpendicular to the circuit board 300, and the light beams received by the light receiving chip are perpendicular to the circuit board 300; and the optical fiber 101 connected to the optical module is parallel to the circuit board 300, and the transmission direction of the light beams emitted by the laser chip and transmitted to the external light receiving chip needs to be changed, so that the light beams emitted by the laser chip can be changed by the optical transceiver component 900, so that the light beams emitted by the laser chip are reflected by the lens assembly, and the reflected light beams are parallel to the circuit board 300, so as to facilitate the coupling of the reflected light beams into the optical fiber; the received light beams transmitted by the external optical fiber are reflected by the lens assembly, and the reflected light beams are perpendicular to the circuit board 300, so as to facilitate the reception by the light receiving chip.

[0113] In some embodiments, the optical transceiver component 900 can include a lens assembly 901. The lens assembly 901 covers the optical matching chip 320 and the optical chip 310 on the circuit board 300, so as to place the optical matching chip 320 and the optical chip 310 in a cover cavity formed by the lens assembly 901 and the circuit board 300, shorten the distance between the optical matching chip 320 and the optical chip 310, and further shorten the wire bonding distance between the optical matching chip 320 and the optical chip 310. For example, the lens assembly 901 covers the TIA 322 and the light receiving chip 312, so as to shorten the wire bonding distance between the TIA 322 and the light receiving chip 312; the lens assembly 901 covers the laser driving chip 321 and the laser chip 311, so as to shorten the wire bonding distance between the laser driving chip 321 and the laser chip 311.

[0114] The optical transceiver component 900 can include an optical fiber support 902. The optical fiber support 902 can be connected to the side of the lens assembly 901 facing the optical port.

[0115] In some embodiments, the side of the lens assembly 901 facing the circuit board 300 is recessed inward to form a cover groove. The cover groove can be provided with a first lens 9121. The first lens 9121 can be located directly above the optical chip 310 to realize collimation or convergence of the light beams.

[0116] The side of the lens assembly 901 facing away from the circuit board 300 can be recessed inward to form an optical port groove. The side wall of the optical port groove can be a reflecting surface 9131. The reflecting surface 9131 can be located above the first lens 9121 to realize reflection of the light beams.

[0117] The side of the lens assembly 901 facing the optical fiber support 902 can be provided with a second lens 9142 to realize convergence or collimation of the light beams.

[0118] The laser chip 311 emits a divergent light beam, which is converted into a collimated light beam by the first lens 9121, the collimated light beam is reflected by the reflecting surface 9131, and the reflected collimated light beam is coupled into the optical fiber as a convergent light beam by the second lens 9142 and transmitted to the outside of the optical module by the optical fiber, thereby realizing the emission of the optical signal. The light beam outside the optical module is transmitted to the second lens 9142 by the optical fiber, collimated as a collimated light beam by the second lens 9142, reflected by the reflecting surface 9131, and vertically downward transmitted, and then coupled into the optical receiving chip 312 after passing through the first lens 9121, thereby realizing the reception of the optical signal.

[0119] The light emitting performance of the laser chip is sensitive to temperature, and the light emitting performance of the laser chip deteriorates at low temperature. In order to solve this problem, in some embodiments, a heating resistor is arranged around the laser chip, and the heating resistor is fixed to the surface of the circuit board by the heat-conducting glue. The heat generated by the heating resistor is conducted to the surface of the circuit board through the heat-conducting silver glue, and then to the surrounding of the laser chip, so as to heat the laser chip and reduce the probability of the laser chip being at low temperature, thereby ensuring the light emitting performance of the laser chip.

[0120] When the heat-conducting glue can conduct electricity, the direct contact between the heat-conducting glue and the electrode will cause short circuit. Therefore, in some embodiments, when the heat-conducting glue can conduct electricity, the upper surface of the heating resistor is provided with an electrode, and the other surfaces are not provided with an electrode, so as to reduce the contact between the electrode and the heat-conducting silver glue, and further reduce the short circuit of the electrode.

[0121] In order to heat the laser chip, in some embodiments, the surface layer of the circuit board has a heating area, the laser chip is arranged above the heating area, and the heating area and the laser chip are connected by the heat-conducting glue to form a heat-conducting layer. The heat generated by the heating area is directly conducted to the laser chip through the heat-conducting layer, which not only can heat the laser chip and reduce the probability of the laser chip being at low temperature, thereby ensuring the light emitting performance of the laser chip, but also can reduce the heat transfer path and improve the heating efficiency.

[0122] When the heat-conducting glue can conduct electricity, the direct contact between the heat-conducting glue and the heating area will cause short circuit. Therefore, in some embodiments, when the heat-conducting glue can conduct electricity, an insulating layer is arranged between the heating area and the heat-conducting layer, which can electrically isolate the heating area and the heat-conducting area, reduce the current of the heating area entering the heat-conducting area, and further reduce the short circuit of the heating area.

[0123] Figure 7 A partial enlarged view of the internal structure of an optical module according to some embodiments is provided. Figure 8 A partial enlarged view of the circuit board of an optical module according to some embodiments is provided. As shown in Figure 7 and Figure 8As shown, in some embodiments, the circuit board 300 may include an upper surface layer 331. The upper surface layer 331 may have a heating area 3311. The laser chip 311 may be placed above the heating area 3311 so that the heating area 3311 heats the laser chip 311.

[0124] In some embodiments, a reference ground 350 may be provided on the upper surface layer 331. One end of the heating area 3311 may be connected to the reference ground 350. The reference ground 350 may be a grounding area located on the upper surface layer 331 or a grounding layer located in the middle layer of the circuit board 300.

[0125] In some embodiments, an adjustable voltage source 360 ​​may be provided on the upper surface layer 331. The adjustable voltage source 360 ​​may be connected to the other end of the heating zone 3311 to provide voltage to the heating zone 3311 so that the heating zone 3311 can generate heat.

[0126] When a voltage is applied to a resistor, current will flow through the resistor and generate heat in the process. The heating area 3311 is equivalent to a resistor. Therefore, when a voltage is applied to the heating area 3311, current will flow through the heating area 3311 and generate heat in the heating area 3311.

[0127] In some embodiments, the heating zone 3311 can be formed by etching the metal region of the upper surface layer 331. The metal region of the upper surface layer 331 is etched along at least one etch line to provide the metal region with at least one insulating region, thereby transforming the metal region from a single piece of metal into multiple pieces of metal to form the heating zone 3311. Compared to the unetched metal region, the cross-sectional area of ​​the heating zone 3311 is reduced, the length is increased, and the resistivity is increased. The resistivity of the heating zone 3311 is greater than that of other surrounding areas, causing the heating zone 3311 to generate a large amount of heat when current passes through it.

[0128] like Figure 8 As shown, the current moves in the direction indicated by the arrow (→) within the heating zone 3311 and generates heat.

[0129] In some embodiments, the heating zone 3311 is connected to the reference ground 350 and the adjustable voltage source 360, and a gap may be provided between the first region 3314 of the heating zone 3311 and the bulk region 3312 of the upper surface layer 331. In other words, the first region 3314 of the heating zone 3311 is not connected to the bulk region 3312 of the upper surface layer 331. The first region 3314 is the area of ​​the heating zone 3311 excluding the area connected to the reference ground 350 and the adjustable voltage source 360. The gap provided between the first region 3314 and the bulk region 3312 of the upper surface layer 331 can separate the first region 3314 of the heating zone 3311 from the bulk region 3312, thereby reducing the amount of current flowing through the heating zone 3311 from flowing to the bulk region 3312.

[0130] In some embodiments, a gap may be provided between the heating region 3311 and the bulk region 3312 of the upper surface layer 331, and the heating region 3311 and the bulk region 3312 may be connected by wire bonding. The gap may be provided between the heating region 3311 and the bulk region 3312 of the upper surface layer 331 to separate the heating region 3311 from the bulk region 3312 and reduce the amount of current flowing through the heating region 3311 from flowing to the bulk region 3312.

[0131] like Figure 8 As shown, the heating zone 3311 may include a first sub-heating zone 33111 and a second sub-heating zone 33112. A first insulating zone 33114 may be provided between the first sub-heating zone 33111 and the second sub-heating zone 33112. The first insulating zone 33114 may extend from the first boundary of the heating zone 3311 to the second boundary of the heating zone 3311, but not to the second boundary of the heating zone 3311, so that one end of the first sub-heating zone 33111 is connected to one end of the second sub-heating zone 33112. This may extend the length of the heating zone 3311, reduce the cross-sectional area of ​​the heating zone 3311, and increase the resistivity of the heating zone 3311.

[0132] The first boundary of the heating zone 3311 and the second boundary of the heating zone 3311 can be arranged relative to each other. For example, the first boundary of the heating zone 3311 can be the upper boundary of the heating zone 3311, and the second boundary of the heating zone 3311 can be the lower boundary of the heating zone 3311. The upper boundary of the heating zone 3311 and the lower boundary of the heating zone 3311 are arranged relative to each other.

[0133] The heating zone 3311 may include a third sub-heating zone 33113. A second insulating zone 33115 may be provided between the third sub-heating zone 33113 and the second sub-heating zone 33112. The second insulating zone 33115 may extend from the second boundary of the heating zone 3311 to the first boundary of the heating zone 3311, but not to the first boundary of the heating zone 3311. This allows the other end of the second sub-heating zone 33112 to connect to one end of the third sub-heating zone 33113, further extending the length of the heating zone 3311 and improving the resistivity of the heating zone 3311.

[0134] The end of the first sub-heating area 33111 not connected with the second sub-heating area 33112 is the first end of the first sub-heating area 33111, and the end of the first sub-heating area 33111 connected with the second sub-heating area 33112 is the second end of the first sub-heating area 33111. The first end of the first sub-heating area 33111 can be connected with the adjustable voltage source 360, so that the adjustable voltage source 360 provides voltage for the heating area 3311. The first end of the first sub-heating area 33111 refers to the area between the left boundary of the heating area 3311 and the first insulating area 33114.

[0135] The end of the third sub-heating area 33113 not connected with the second sub-heating area 33112 is the first end of the third sub-heating area 33113, and the end of the third sub-heating area 33113 not connected with the second sub-heating area 33112 is the second end of the third sub-heating area 33113, and the second end of the third sub-heating area 33113 can be connected with the reference ground 350. The second end of the third sub-heating area 33113 refers to the area between the right boundary of the heating area 3311 and the second insulating area 33115.

[0136] Figure 9 A structure diagram of a laser chip is provided according to some embodiments. As shown in Figure 9 The first laser chip 311 can include a first top surface 3113. The first top surface 3113 can be provided with a first positive electrode 3111. The first positive electrode 3111 can be connected with the second positive electrode 3211 of the laser drive chip 321 through a first wire.

[0137] The first laser chip 311 can include a second top surface 3114. The second top surface 3114 can be provided with a first negative electrode 3112. The first negative electrode 3112 can be connected with the second negative electrode 3212 of the laser drive chip 321 through a second wire.

[0138] The first top surface 3113 and the second top surface 3114 are top surfaces of different substrates, so that the first positive electrode 3111 and the first negative electrode 3112 are arranged on different top surfaces of the first laser chip 311.

[0139] The first top surface 3113 and the second top surface 3114 can be flush or not flush.

[0140] In some embodiments, the modulation current and the bias current provided by the laser drive chip 321 can be conducted to the first laser chip 311 in the form of a differential signal through the first wire and the second wire, so that the first laser chip 311 emits an optical signal under the action of the modulation current and the bias current.

[0141] Figure 10 A partial sectional view of the internal structure of an optical module is provided according to some embodiments.Figure 11 FIG. 8 is another partial cross-sectional view of an internal structure of a light module according to some embodiments. As shown in FIG. 8, in some embodiments, there is a gap between the body region 3312 of the upper layer 331 and the first region 3314 of the heating region 3311, so that the first region 3314 of the heating region 3311 is separated from the body region 3312, and thus the current flows from one end of the heating region 3311 (i.e., the end close to the adjustable voltage source 360) to the other end of the heating region 3311 (i.e., the end close to the reference ground 350). Figure 10 Figure 11 Alternatively, there is a gap between the body region 3312 of the upper layer 331 and the heating region 3311, so that the heating region 3311 is separated from the body region 3312, and thus the current flows from one end of the heating region 3311 (i.e., the end close to the adjustable voltage source 360) to the other end of the heating region 3311 (i.e., the end close to the reference ground 350).

[0142] Alternatively, there is a gap between the body region 3312 of the upper layer 331 and the heating region 3311, so that the heating region 3311 is separated from the body region 3312, and thus the current flows from one end of the heating region 3311 (i.e., the end close to the adjustable voltage source 360) to the other end of the heating region 3311 (i.e., the end close to the reference ground 350).

[0143] In some embodiments, a thermally conductive layer 330 can be connected between the laser chip 311 and the heating region 3311. The top surface of the thermally conductive layer 330 can be connected with the laser chip 311. The bottom surface of the thermally conductive layer 330 can be connected with the heating region 3311. The thermally conductive layer 330 can conduct the heat generated by the heating region 3311 to the laser chip 311, so as to heat the laser chip 311.

[0144] In some embodiments, the width dimension of the thermally conductive layer 330 is greater than or equal to the width dimension of the laser chip 311, and the length dimension of the thermally conductive layer 330 is greater than or equal to the length dimension of the laser chip 311, so that the heat on the thermally conductive layer 330 can be conducted to the laser chip 311 as much as possible.

[0145] The thermally conductive layer 330 can be formed by a thermally conductive glue. When the thermally conductive glue cannot conduct electricity, i.e., has an insulating property, the thermally conductive layer 330 is also insulating, and the heating region 3311 is directly connected with the laser chip 311 through the thermally conductive layer 330, and the current of the heating region 3311 is conducted along the heating region 3311 and cannot enter the thermally conductive layer 330, reducing the short circuit of the heating region 3311.

[0146] The thermally conductive glue can be an epoxy thermally conductive glue, a silicone glue, and a thermally conductive silicone glue, all of which have thermal conductivity but do not have electrical conductivity, so that the thermally conductive layer 330 formed by the epoxy thermally conductive glue, the silicone glue, and the thermally conductive silicone glue can conduct heat but cannot conduct electricity.

[0147] ​When the thermal conductive glue can conduct electricity, the thermal conductive layer 330 can also conduct electricity, and an insulating layer 340 can be arranged between the heating area 3311 and the thermal conductive layer 330. The top surface of the insulating layer 340 can be connected with the bottom surface of the thermal conductive layer 330. The bottom surface of the insulating layer 340 can be connected with the heating area 3311. The insulating layer 340 can electrically isolate the heating area 3311 from the thermal conductive layer 330, so that the current of the heating area 3311 conducts along the heating area 3311 and does not enter the thermal conductive layer 330, thereby reducing the short circuit of the heating area 3311.

[0148] The thermal conductive glue can be silver glue, copper glue, and aluminum glue, all of which have the properties of conducting electricity and heat, so that the thermal conductive layer 330 formed by the silver glue, the copper glue, and the aluminum glue can conduct electricity and heat.

[0149] The insulating layer 340 can be an insulating plate. The insulating layer 340 can be formed by plating a layer of metal on the surface of the heating area 3311. The insulating layer 340 can be formed by depositing a layer of material on the surface of the heating area 3311.

[0150] In some embodiments, the width dimension of the insulating layer 340 is greater than or equal to the width dimension of the thermal conductive layer 330, and the length dimension of the insulating layer 340 is greater than or equal to the length dimension of the thermal conductive layer 330, so that the heat on the insulating layer 340 is conducted to the thermal conductive layer as much as possible.

[0151] In some embodiments, the circuit board 300 can include a lower surface layer 333. The lower surface layer 333 can be arranged corresponding to the upper surface layer 331.

[0152] In some embodiments, the circuit board 300 can include an intermediate layer 332. The intermediate layer 332 can be located between the upper surface layer 331 and the lower surface layer 333. The body area 3312 of the upper surface layer 331 and the heating area 3311 are both located above the intermediate layer 332.

[0153] Figure 12 A schematic diagram of an internal structure of a light module according to some embodiments. Figure 13 Another schematic diagram of an internal structure of a light module according to some embodiments. As shown in Figure 12 and Figure 13 As shown in some embodiments, the adjustable voltage source 360 can include an input pin 361, which can be connected to an external power supply to receive a fixed power voltage. The adjustable voltage source 360 can include a feedback pin 363 to provide a feedback voltage. The adjustable voltage source 360 can include an output pin 362. The output pin 362 can be connected to the heating area 3311 to provide a voltage to the heating area 3311. The adjustable voltage source 360 can adjust the voltage of the output pin 362 according to the feedback voltage of the feedback pin 363, so that the heating area 3311 can generate heat according to the voltage, thereby heating the laser chip 311.

[0154] In some embodiments, the surface of the circuit board 300 can be provided with an MCU. The MCU can obtain the temperature of the laser chip 311 and output a feedback voltage to the adjustable voltage source 360 according to the temperature of the laser chip 311. The MCU can include a register 374. The register 374 can store a relationship table of temperature and feedback voltage. The MCU can read the feedback voltage corresponding to the temperature of the laser chip 311 from the register 374 according to the temperature of the laser chip 311 and output the feedback voltage.

[0155] As shown in FIG. 3B, in some embodiments, the surface of the circuit board 300 can be provided with a temperature detector 380. The temperature detector 380 can be arranged at the side of the laser chip 311. The temperature detector 380 is a temperature-sensitive element, and its resistance value changes with the change of temperature, so the temperature around the temperature detector can be determined by the resistance value of the temperature detector, and the temperature of the laser chip 311 can be monitored. Figure 12

[0156] The MCU can be an MCU 370a. The MCU 370a can include an input pin 372, and the input pin 372 of the MCU 370a is connected with the temperature detector 380 to obtain the resistance value of the temperature detector 380. The MCU 370a can calculate the actual temperature of the temperature detector 380 according to the resistance value of the temperature detector 380. The MCU 370a can include a register 374. The register 374 can store a relationship table of temperature and feedback voltage. The MCU 370a can read the feedback voltage corresponding to the temperature of the laser chip 311 from the register 374 according to the temperature of the laser chip 311 and output the feedback voltage. The MCU 370a can include an output pin 371. The output pin 371 can be connected with the feedback pin 363 of the adjustable voltage source 360 to output the feedback voltage to the feedback pin 363 of the adjustable voltage source 360.

[0157] As shown in FIG. 3C, in some embodiments, the MCU can be an MCU 370b. The MCU 370b can internally integrate a temperature sensor 373. The MCU 370b can obtain the temperature of the laser chip 311 through the temperature sensor 370. The MCU 370b can include a register 374. The register 374 can store a relationship table of temperature and feedback voltage. The MCU 370b can read the feedback voltage corresponding to the temperature of the laser chip 311 from the register 374 according to the temperature of the laser chip 311 and output the feedback voltage. The MCU 370b can include an output pin 371. The output pin 371 can be connected with the feedback pin 363 of the adjustable voltage source 360 to output the feedback voltage to the feedback pin 363 of the adjustable voltage source 360. Figure 13

[0158] ​​Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present disclosure, but not to limit them; although the present disclosure has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: circuit boards; A laser chip, disposed on the circuit board, for emitting optical signals; Wherein, the surface layer of the circuit board has: A heating zone, located below the laser chip, for heating the laser chip; the heating zone is formed by etching the surface of the circuit board; The circuit board is provided with: a heat-conducting layer, located between the laser chip and the heating zone, with a bottom surface connected to the heating zone and a top surface connected to the laser chip, for conducting heat; The heat-conducting layer is non-conductive and is directly connected to the heating zone; or the heat-conducting layer is conductive and an insulating layer is provided between the heat-conducting layer and the heating zone, the top surface of the insulating layer is connected to the bottom surface of the heat-conducting layer, and the bottom surface of the insulating layer is connected to the heating zone.

2. The optical module according to claim 1, wherein The heating zone comprises: a first sub-heating zone; a second sub-heating zone, a first insulating zone being provided between the second sub-heating zone and the first sub-heating zone; the first insulating zone extending from the first boundary of the heating zone to the second boundary of the heating zone, but not extending to the second boundary of the heating zone, so that one end of the second sub-heating zone is connected to one end of the first sub-heating zone; A second insulating zone is provided between the third sub-heating zone and the second sub-heating zone; the second insulating zone extends from the second boundary of the heating zone to the first boundary of the heating zone, but does not extend to the first boundary of the heating zone, so that one end of the third sub-heating zone is connected to the other end of the second sub-heating zone.

3. The optical module according to claim 2, wherein: The circuit board is provided with: an adjustable voltage source, an output pin of which is connected to an end of the first sub-heating zone that is not connected to the second sub-heating zone, for providing voltage; a reference ground connected to an end of the third sub-heating zone that is not connected to the second sub-heating zone; The surface layer of the circuit board further includes a body area. There is a gap between the body area and the heating area. The heating area is connected to the reference ground and the adjustable voltage source through bonding wires.

4. The optical module according to claim 2, wherein: The circuit board is provided with: an adjustable voltage source, an output pin of which is connected to an end of the first sub-heating zone that is not connected to the second sub-heating zone, for providing voltage; a reference ground connected to an end of the third sub-heating zone that is not connected to the second sub-heating zone; The surface layer of the circuit board also includes a main body area, there is a gap between the main body area and the first area of ​​the heating zone, the main body area is connected to the reference ground and the adjustable voltage source, wherein the first area is the area in the heating zone excluding the area connected to the reference ground and the adjustable voltage source.

5. The optical module according to claim 3 or 4, characterized in that: The circuit board also includes: Temperature probe, used to monitor temperature; An MCU, having an input pin connected to the temperature detector and an output pin connected to a feedback pin of the adjustable voltage source to output a feedback voltage; The MCU is integrated with: The register is used to store a relationship table between the temperature and the feedback voltage.

6. The optical module according to claim 3 or 4, characterized in that: The circuit board also includes: MCU, an output pin of which is connected to a feedback pin of the adjustable voltage source to output a feedback voltage; The MCU is integrated with: Temperature sensor, used to monitor temperature; The register is used to store a relationship table between the temperature and the feedback voltage.

7. The optical module according to claim 1, wherein: The width of the insulating layer is greater than or equal to the width of the heat-conducting layer, and the length of the insulating layer is greater than or equal to the length of the heat-conducting layer.

8. The optical module according to claim 1, wherein: The laser chip comprises: a first positive electrode, disposed on the first top surface; a first negative electrode, disposed on the second top surface; the first top surface and the second top surface are different top surfaces of the laser chip; A laser driving chip is provided on the circuit board, and the laser driving chip includes: a second positive electrode connected to the first positive electrode; The second negative electrode is connected to the first negative electrode; the second positive electrode and the second negative electrode of the laser driver chip both output modulation current and bias current, so that the modulation current and bias current are both transmitted to the laser chip in the form of differential signals.

9. The optical module according to claim 8, wherein: Also includes: The lens assembly is covered on the laser chip and the laser driver chip, and includes: A first lens is located on a side of the lens assembly facing the circuit board and on the light path of the laser chip; a reflective surface, located on a side of the lens assembly facing away from the circuit board and located on a collimated light path of the first lens; The second lens is located on the reflected light path of the reflecting surface, so that the second lens can converge the light signal reflected by the reflecting surface.

10. The optical module according to claim 9, wherein: The circuit board is also provided with: An optical receiving chip, used for receiving optical signals; The optical matching chip is connected to the optical receiving chip through bonding; the lens assembly is covered on the optical receiving chip and the optical matching chip.

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