Wafer processing system and wafer processing production line
By employing a solution device in the wafer processing system to achieve nitride and resist removal processes, and utilizing flow detectors and programmable logic controllers to improve process accuracy, the problems of multiple devices and high maintenance difficulty in traditional processes are solved, resulting in space savings and increased yield.
Patent Information
- Application Number
- CN202422782032.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-14
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-11-14
AI Technical Summary
Traditional wafer fabrication processes require multiple tanks and pipelines, which occupy a large space, are difficult to maintain, and have low process control precision.
Design a wafer fabrication system that uses a solution device to perform nitride and resist removal processes. The system uses a flow detector to detect and control the liquid flow rate, and combines a programmable logic controller for process control, thereby reducing the number of devices and improving process accuracy.
The number of devices was reduced, space occupation and maintenance difficulty were reduced, while the process control accuracy and yield were improved.
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Figure CN223450850U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to wafer processing technology, in particular to a wafer processing system and wafer processing line. BACKGROUND
[0002] In the process of wafer processing, two steps of removing nitride and removing glue are needed. In the traditional scheme, phosphoric acid tank is used to provide phosphoric acid to remove the nitride on the surface of the wafer, and sulfuric acid tank is used to provide sulfuric acid to remove the residual glue on the surface of the wafer. In addition, hydrogen peroxide tank is additionally used to provide hydrogen peroxide to cooperate with the removal of glue. Therefore, the current process needs multiple tanks and more pipelines, valves, sensors and other equipment, which occupies more space and has high maintenance difficulty. SUMMARY
[0003] In order to solve one of the above technical defects, a wafer processing system and wafer processing line are provided in the embodiments of the present application.
[0004] According to a first aspect of the embodiments of the present application, a wafer processing system is provided, comprising:
[0005] A solution device is provided with an inlet for injecting a nitride-removing liquid and an inlet for injecting a glue-removing liquid. The solution device is provided with an internal space for accommodating a tool basket containing wafers. The nitride-removing liquid can remove the nitride on the surface of the wafer, and the glue-removing liquid can remove the residual glue on the surface of the wafer.
[0006] A flow detector is arranged at the liquid inlet of the solution device, and is used to detect the flow of the liquid entering the solution device.
[0007] A conveying device is arranged beside the solution device. The conveying device is provided with a clamping mechanism for clamping the tool basket. The conveying device can walk along the track to convey the tool basket to the solution device or take the tool basket out of the solution device or convey the tool basket to the next station.
[0008] According to a second aspect of the embodiments of the present application, a wafer processing line is provided, comprising the wafer processing system, a loading waiting station and a discharging waiting station as described above.
[0009] The technical scheme provided in the embodiments of the present application sets the inlet for injecting the nitride-removing liquid and the inlet for injecting the glue-removing liquid on the solution device, and different liquids can be injected in different time periods to achieve the process of removing the nitride and removing the glue of the wafer. Two processes are realized by using one solution device, which reduces the number of devices, thereby reducing the space occupation, reducing the maintenance difficulty and cost. In addition, the flow detector is arranged at the liquid inlet of the solution device, and is used to detect the flow of the liquid entering the solution device, so as to detect and control the amount of injected liquid, which can improve the process control precision and thereby improve the yield. BRIEF DESCRIPTION OF DRAWINGS
[0010] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:
[0011] Figure 1 A structure schematic diagram of a wafer processing system provided by an embodiment of the application is shown in the figure;
[0012] Figure 2 A structure schematic diagram of a wafer processing line provided by an embodiment of the application is shown in the figure.
[0013] Reference signs:
[0014] 1 - main solution tank; 2 - main measurement tank; 3 - auxiliary solution tank; 4 - auxiliary measurement tank; 5 - decontamination tank; 6 - robot; 7 - loading waiting position; 8 - unloading waiting position. DETAILED DESCRIPTION
[0015] In order to make the technical solutions and advantages of the embodiments of the application clearer, the exemplary embodiments of the application are further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the application, rather than all the embodiments of the application. It should be noted that the embodiments in the application and the features in the embodiments can be combined with each other without conflict.
[0016] The embodiment provides a wafer processing system capable of removing nitride and residual photoresist on the surface of a wafer. The wafer processing system belongs to one process of a wafer processing line, as shown in the figure. Figure 2 The wafer processing line includes process steps of removing silicon oxide, removing silicon nitride, removing residual photoresist, removing particulate matter, drying, etc. The line is specifically provided with a station A, a station B, a station C, …, a station D. A tool basket containing a wafer is placed from a loading position 7 to the station A. After the wafer is processed by the station A, the tool basket is transported from the station A to the station B, and so on. Finally, the tool basket is transported from the station D to an unloading waiting position 8.
[0017] For example, the station A is used for removing silicon oxide on the surface of the wafer. The station B is a wafer processing system below, which is used for removing silicon nitride and residual photoresist on the surface of the wafer. The station C can be an APM tank used for removing particulate matter on the surface of the wafer, and the station D can be a drying tank.
[0018] As shown in the figure, Figure 1As shown, the wafer processing system provided in the embodiment includes a solution device and a flow detector. The solution device is provided with an internal space for accommodating a tool basket, and the internal space also accommodates a liquid. A plurality of wafers are placed in the tool basket, and the tool basket is placed into the solution device by a conveying device beside the solution device.
[0019] The conveying device can be a robot 6 provided with a clamping mechanism for clamping the tool basket. The robot 6 walks along a track 9 to convey the tool basket to the solution device or take the tool basket out of the solution device or to a next station. For example, a plurality of robots 6 are arranged on a production line. One of the robots 6 is used to place the tool basket containing the wafers from a loading position 7 to a station A. After the wafers are processed at the station A, the robot 6 is used to convey the tool basket from the station A to a station B, and so on. The tool basket is conveyed in the arrow direction in sequence. Finally, the robot 6 is used to convey the tool basket from the station D to a discharging waiting position 8. Figure 2
[0020] The solution device is provided with an inlet for injecting a denitride liquid, an inlet for injecting a resist removal liquid, and a discharge port. The denitride liquid can be injected into the internal space of the solution device to remove the nitride on the surface of the wafer when the wafer is placed in the solution device. The resist removal liquid can also be injected into the solution device to remove the photoresist remaining on the surface of the wafer when the wafer is placed in the solution device. After each step is completed, the waste liquid is discharged through the discharge port, and new liquid is injected.
[0021] The flow detector is arranged at the liquid inlet of the solution device to detect the flow of the liquid entering the solution device, so as to detect and control the amount of the injected liquid to meet the process requirements.
[0022] A controller is further included. For example, a programmable logic controller (PLC) is used to acquire the data detected by the sensors, and sends control instructions to the robots 6 after processing, or sends opening and closing instructions and opening degree instructions to the electromagnetic valves of the pipelines connected to the solution device.
[0023] The technical solution provided in the embodiment is that the solution device is provided with the inlet for injecting the denitride liquid and the inlet for injecting the resist removal liquid. Different liquids can be injected in different time periods to achieve the process of removing the nitride and removing the resist on the wafer. Two processes are realized by using one solution device, so that the number of devices is reduced, the space occupation is reduced, and the maintenance difficulty and cost are reduced. In addition, the flow detector is arranged at the liquid inlet of the solution device to detect the flow of the liquid entering the solution device, so as to detect and control the amount of the injected liquid. The process control precision is improved, and the yield is improved.
[0024] The above-mentioned denitriding liquid can be phosphoric acid, and the liquid for removing the photoresist includes sulfuric acid and hydrogen peroxide. The technical solution provided by the embodiment can be improved on the basis of the old system. For example, the sulfuric acid tank and the corresponding pipeline in the old system are removed, the phosphoric acid tank in the old system is improved, an inlet for injecting sulfuric acid is added to the phosphoric acid tank, so that the phosphoric acid tank can inject phosphoric acid to remove nitrogen compounds and can inject sulfuric acid to remove the photoresist, and one liquid is used for two purposes. The newly added sulfuric acid inlet is connected to a sulfuric acid input source through a pipeline, and an electromagnetic valve, a flow meter and other devices are installed on the pipeline.
[0025] Alternatively, the solution device can also be redesigned and manufactured according to the above technical solution.
[0026] In the improvement of the old system, in addition to improving the structure of the phosphoric acid tank, the control software of the process can also be improved, so that the controller can identify whether phosphoric acid or sulfuric acid is to be injected, and different programs such as heating and stirring can be executed according to different liquids. A man-machine control device can also be provided, which is connected to the controller and the valve on the liquid inlet of the solution device. The operator inputs on the man-machine control device whether the process to be executed is to remove nitrogen compounds or to remove the photoresist, or inputs whether the liquid to be injected is phosphoric acid or sulfuric acid, and the controller automatically retrieves the corresponding process program and executes it.
[0027] For the above technical solution, the system further includes an auxiliary solution device for preparing hydrogen peroxide; the auxiliary solution device is provided with a hydrogen peroxide discharge port connected to the corresponding inlet of the solution device to provide hydrogen peroxide to the solution device for mixing with sulfuric acid to remove the photoresist from the wafer.
[0028] Based on the above technical solution, the embodiment provides a specific implementation manner as shown in Figure 1 The solution device includes a main solution tank 1 and a main measuring tank 2. The main solution tank 1 is used to contain phosphoric acid or sulfuric acid, and the wafer is placed in the main solution tank 1 to remove nitrogen compounds or residual photoresist.
[0029] The main measuring tank 2 has a first inlet for injecting phosphoric acid, a second inlet for injecting sulfuric acid, a third inlet for injecting hydrogen peroxide, and a fourth inlet for injecting water. The first inlet is connected to a phosphoric acid supply source through a pipeline, the second inlet is connected to a sulfuric acid supply source through a pipeline, the third inlet is connected to a hydrogen peroxide supply source through a pipeline, and the fourth inlet is connected to a water supply source through a pipeline. The main measuring tank 2 is used to mix the injected phosphoric acid and water or to mix the injected sulfuric acid and hydrogen peroxide; the main measuring tank 2 also has a discharge port connected to the main solution tank 1; and a flow detector is arranged at each inlet.
[0030] Specifically, in the process of removing nitride, phosphoric acid is injected into the main measuring tank 2 through the first inlet, and water is injected into the main measuring tank 2 through the fourth inlet, the phosphoric acid and the water are mixed in the main measuring tank 2, and when the requirements are met, they are discharged into the main solution tank 1 through the discharge port.
[0031] In the process of removing residual glue, sulfuric acid is injected into the main measuring tank 2 through the second inlet, and hydrogen peroxide is injected into the main measuring tank 2 through the third inlet, the sulfuric acid and the hydrogen peroxide are mixed in the main measuring tank 2, and when the requirements are met, they are discharged into the main solution tank 1 through the discharge port.
[0032] The electromagnetic valve and the flow detector are arranged on the pipeline of each liquid inlet, the opening and closing and the opening degree of the electromagnetic valve are controlled by the controller, and the liquid flow is detected by the flow detector.
[0033] In the above scheme, the main measuring tank 2 is used to mix the solution first, and then the mixed liquid is injected into the main solution tank 1 when the process requirements are met, which can improve the effect of wafer processing and improve the yield.
[0034] Further, the auxiliary solution device includes an auxiliary solution tank 3 and an auxiliary measuring tank 4. The auxiliary measuring tank 4 has an inlet for injecting hydrogen peroxide and a hydrogen peroxide discharge port, the inlet for injecting hydrogen peroxide is connected to a hydrogen peroxide supply source, and the hydrogen peroxide discharge port is connected to the auxiliary solution tank 3. The hydrogen peroxide supplied by the hydrogen peroxide supply source is first injected into the auxiliary measuring tank 4, and the flow is detected by the flow detector arranged on the pipeline, and when the flow meets the requirements, it is discharged into the auxiliary solution tank 3 for storage. When entering the glue removal process, the hydrogen peroxide in the auxiliary solution tank 3 is discharged into the main measuring tank 2 to meet the process requirements of mixing with sulfuric acid.
[0035] On the basis of the above technical scheme, a decontamination tank 5 for containing decontamination liquid can also be used, the decontamination tank 5 has an ammonia inlet, a hydrogen peroxide inlet and a water inlet, which are respectively connected to an ammonia supply source, a hydrogen peroxide supply source and a water supply source through pipelines. The decontamination tank 5 can be the original component of the old system, and the embodiment improves it. A three-way valve is arranged on the pipeline connected to the hydrogen peroxide inlet, a branch pipe is connected, and the branch pipe is connected to the hydrogen peroxide inlet of the auxiliary measuring tank 4. This scheme can reduce the length of the pipeline, and use the original decontamination tank component to directly connect the branch pipe from the hydrogen peroxide inlet of the decontamination tank 5.
[0036] Based on the above scheme, the flow detector used is a high-temperature resistant flow detector, which can adapt to a temperature range of 150-160℃, which can meet the needs of phosphoric acid removal of nitride process and sulfuric acid removal of residual glue process, and has a lower cost.
[0037] Further, the main solution tank 1 is provided with an exhaust device for exhausting the acid gas evaporated from the sulfuric acid and the white crystals generated from the ammonia water, so as to avoid affecting the process.
[0038] Further, the main solution tank 1 is also provided with an inlet for injecting water, so as to directly inject water into the main solution tank 1 for cleaning.
[0039] Further, a heater is also used and arranged in the main solution tank 1, so as to heat the liquid in the main solution tank 1 to meet the process requirements.
[0040] In the above scheme, in the process of removing the nitride by the system, the etching rate ER=60A / min, SPEC: 56-62. In the process of removing the residual glue, ER: 1.3A / min, SPEC: 0.8-1.8.
[0041] When the system needs to switch the process, the parameters are set on the man-machine control device to distinguish whether the solution device injects phosphoric acid or sulfuric acid. Moreover, the tank temperature can be manually switched (Manual set value), and when the temperature, concentration and flow are normal, the equipment is switched from the manual mode to the automatic mode, and the process is automatically executed and monitored by the computer.
[0042] In the above scheme, the original phosphoric acid tank can not only complete the function of removing the nitride by the phosphoric acid, but also complete the process of removing the glue by the sulfuric acid, so as to improve the processing capacity of the equipment and the production capacity. Moreover, compared with the traditional scheme, one solution tank is reduced, and the cost is greatly reduced.
[0043] Reducing one solution tank can also shorten the processing time of the maintenance, cleaning and control parameter setting of the solution tank, and can greatly improve the production efficiency.
[0044] The embodiment also provides a wafer processing production line, which comprises a feeding waiting position, a discharging waiting position and the wafer processing system provided in any of the above content. Figure 2 As shown in the figure, the feeding waiting position 7 is located at the front end of the wafer processing system, the discharging waiting position 8 is located at the rear end of the wafer processing system, the wafer processing system comprises a plurality of processing stations, and the solution device and the flow detector in the above content belong to one of the stations. The conveying device is a mechanical hand 6, which moves along a track 9 and conveys the tooling flower basket containing the wafer to each station.
[0045] In the description of the application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used for the purpose of facilitating the description of the application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the application.
[0046] In addition, the terms "first", "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.
[0047] In this application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected or can communicate with each other; it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.
[0048] Although the preferred embodiments of the application have been described, those skilled in the art can make further changes and modifications to these embodiments once they know the basic inventive concept. Therefore, the appended claims are intended to include the preferred embodiments and all changes and modifications falling within the scope of the application.
[0049] Obviously, those skilled in the art can make various modifications and variations to the application without departing from the spirit and scope of the application. Thus, if these modifications and variations of the application fall within the scope of the claims of the application and their equivalents, the application also intends to include these modifications and variations.
Claims
1. A wafer processing system, characterized in that: include: The solution device is provided with an inlet for injecting a nitride removal liquid and an inlet for injecting a glue removal liquid; the solution device is provided with an internal space for accommodating a tooling basket for holding wafers, the nitride removal liquid can remove nitrides on the surface of the wafer, and the glue removal liquid can remove residual glue on the surface of the wafer; A flow detector is provided at the liquid inlet of the solution device and is used to detect the flow of the liquid entering the solution device; The transport device is arranged beside the solution device and is provided with a clamping mechanism for clamping the tooling flower basket; the transport device can move along the track to transport the tooling flower basket to the solution device or take the tooling flower basket out of the solution device or transport it to the next workstation.
2. The wafer processing system according to claim 1, wherein: The nitrogen-removing liquid is phosphoric acid, and the glue-removing liquid includes sulfuric acid and hydrogen peroxide; The system further comprises: an auxiliary solution device for preparing hydrogen peroxide; the auxiliary solution device is provided with a hydrogen peroxide discharge port connected to a corresponding inlet of the solution device.
3. The wafer processing system according to claim 2, wherein: The solution device comprises: Main solution tank; The main measuring tank has a first inlet for injecting phosphoric acid, a second inlet for injecting sulfuric acid, a third inlet for injecting hydrogen peroxide, and a fourth inlet for injecting water. The main measuring tank is used to mix the injected phosphoric acid and water or the injected sulfuric acid and hydrogen peroxide. The main measuring tank also has a discharge port connected to the main solution tank. Flow detectors are set at each inlet.
4. The wafer processing system according to claim 2, wherein: The auxiliary solution device includes: Auxiliary solution tank; The auxiliary measuring tank is provided with an inlet for injecting hydrogen peroxide and a hydrogen peroxide discharge port, and the hydrogen peroxide discharge port is connected to the auxiliary solution tank.
5. The wafer processing system according to claim 4, wherein: Also includes: A decontamination tank for accommodating decontamination liquid; the decontamination tank has an ammonia inlet, a hydrogen peroxide inlet and a water inlet; a pipeline connected to the hydrogen peroxide inlet is connected to a branch pipe, and the branch pipe is connected to the hydrogen peroxide inlet of the auxiliary measuring tank.
6. The wafer processing system according to claim 1, wherein: The flow detector is a high temperature resistant flow detector.
7. The wafer processing system according to claim 3, wherein: An exhaust device is provided on the main solution tank.
8. The wafer processing system according to claim 3, wherein: The main solution tank also has an inlet for injecting water.
9. The wafer processing system according to claim 8, wherein: Also includes: The heater is arranged in the main solution tank and is used for heating the liquid in the main solution tank.
10. A wafer processing production line, characterized in that: It comprises the wafer processing system, loading waiting position and unloading waiting position according to any one of claims 1 to 9.