Semiconductor operation loading disc and semiconductor equipment

Abstract

The utility model relates to a semiconductor operation loading disc and semiconductor equipment. The semiconductor operation loading disc comprises a loading disc main body, a plurality of bases and a plurality of adsorption assemblies, the carrying disc main body is used for carrying a wafer; the plurality of bases are arranged in preset positions on the top surface of the carrying disc main body; the plurality of adsorption assemblies are correspondingly arranged on the plurality of bases, and the top surfaces of the adsorption assemblies are in contact with the wafer; wherein at the preset position, a preset distance is formed between the bottom surface of the wafer and the top surface of the carrying disc main body, and the height of the adsorption assembly is equal to the preset distance. According to the semiconductor operation carrying disc, the height of the adsorption assembly is adjusted, the semiconductor operation carrying disc can better adapt to a warping wafer, the bottom surface of the wafer with the warping phenomenon is generally an arc surface, so that different preset distances are formed between the bottom surface of the wafer at different preset positions and the carrying disc main body, and the height of the adsorption assembly is equal to the preset distance; the plurality of bases are arranged in preset positions on the top surface of the carrying disc main body, and under the action of the adsorption assembly, the warping of the wafer is further overcome.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a kind of semiconductor operation tray and semiconductor equipment. BACKGROUND

[0002] In advanced packaging industry, with the continuous increase of chip size, wafer warping phenomenon has become an inevitable and urgent problem to be solved. Wafer warping not only affects the quality and performance of packaging, but also may lead to the decline of product reliability, and further affect the stability and efficiency of the entire supply chain. With the increasing demand for high-performance chips in the market, the severity of warping problem is increasingly highlighted.

[0003] However, due to the diversification of equipment suppliers, different equipment has different adaptation capabilities for wafer warping, and each time the hardware of the equipment is modified, high hardware and time costs will be incurred. SUMMARY

[0004] Therefore, based on this, the embodiment of the present application provides a kind of semiconductor operation tray and semiconductor equipment, can effectively overcome wafer warping.

[0005] According to some embodiments, the present application provides a kind of semiconductor operation tray, semiconductor operation tray includes tray main body, multiple pedestals and multiple suction assemblies;Tray main body is used to support wafer;Multiple pedestals are arranged in the preset position on the top surface of tray main body;Multiple suction assemblies are correspondingly arranged on multiple pedestals, and the top surface of suction assembly is in contact with wafer;Wherein, in the preset position, the bottom surface of wafer and the top surface of tray main body have a predetermined interval, and the height of suction assembly is equal to the predetermined interval.

[0006] In some embodiments, the suction assembly includes a first sleeve, a second sleeve and a compression assembly;The first sleeve is arranged on the pedestal;The second sleeve is arranged on the first sleeve;The second sleeve is movably connected with the first sleeve, and moves along the direction perpendicular to the tray main body;The first sleeve and the second sleeve have a compression cavity;The compression assembly is located in the compression cavity;The bottom surface of the compression assembly abuts against the bottom surface of the first sleeve, and the top surface of the compression assembly abuts against the top surface of the second sleeve.

[0007] In some embodiments, the suction assembly further includes a suction nozzle and a ventilation pipeline;The suction nozzle is used to suck the wafer, and is arranged on the top of the compression assembly;The ventilation pipeline is arranged on the bottom surface of the suction nozzle, and penetrates through the top surface of the second sleeve;The ventilation pipeline is in communication with the compression cavity.

[0008] In some embodiments, the suction assembly further includes a one-way valve, and the one-way valve is arranged on the side wall of the first sleeve;The one-way valve has a gas release channel therein, and the gas release channel is in communication with the compression cavity.

[0009] In some embodiments, a second sleeve is further disposed outside the first sleeve; the first sleeve is threadedly connected with the second sleeve; the outer sidewall of the first sleeve has external threads, and the inner sidewall of the second sleeve has internal threads.

[0010] In some embodiments, the inner sidewall of the base has internal threads, and the base is threadedly connected with the first sleeve.

[0011] In some embodiments, the carrier disc body comprises a carrier disc and a limiting disc located at the periphery of the carrier disc; the carrier disc is circular, and the limiting disc is annular.

[0012] In some embodiments, the plurality of bases comprises a plurality of outer bases and a plurality of inner bases; the plurality of outer bases are disposed at predetermined positions of the carrier disc close to the limiting disc; the plurality of inner bases are located inside the plurality of outer bases and disposed at predetermined positions close to the center of the carrier disc; wherein the predetermined positions of the plurality of outer bases and the plurality of inner bases are respectively distributed along the circumference of the center of the carrier disc.

[0013] In some embodiments, the inner base is disposed on the connecting line between the outer base and the center of the carrier disc.

[0014] According to some embodiments, the present application provides a semiconductor equipment, which comprises the semiconductor work carrier disc in any of the above embodiments, and the semiconductor work carrier disc is used for adsorbing a wafer and performing a predetermined process.

[0015] The semiconductor work carrier disc has the following advantages: the bottom surface of the wafer with warping phenomenon is usually arc-shaped, so that the bottom surface at different predetermined positions has different predetermined distances between the wafer and the carrier disc body. In the above embodiments, the height of the adsorption assembly is equal to the predetermined distance, the plurality of adsorption assemblies are correspondingly disposed on the plurality of bases, and the plurality of bases are disposed in the predetermined positions of the top surface of the carrier disc body. In this way, by adjusting the height of the adsorption assembly, it is beneficial to better adapt to the wafer with warping, and under the action of the adsorption assembly, the warping of the wafer is further overcome. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A cross-sectional schematic view of a semiconductor work carrier disc according to an embodiment of the present application is provided;

[0017] Figure 2 A cross-sectional schematic view of an adsorption assembly in a semiconductor work carrier disc according to an embodiment of the present application is provided;

[0018] Figure 3 A cross-sectional schematic view of a carrier disc body in a semiconductor work carrier disc according to an embodiment of the present application is provided;

[0019] Figure 4 A top view schematic view of a base in a semiconductor work carrier disc according to an embodiment of the present application is provided.

[0020] 100, carrier disc main body; 110, carrier disc; 120, limiting disc; 200, base; 210, outer base; 220, inner base; 300, adsorption assembly; 310, first sleeve; 320, second sleeve; 330, compression assembly; 340, suction nozzle; 350, air duct; 360, one-way valve. DETAILED DESCRIPTION

[0021] For the purpose of facilitating the understanding of the present application, a more comprehensive description of the present application will be given below with reference to the relevant drawings. The drawings show preferred embodiments of the present application. However, the present application can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application herein is only for the purpose of describing specific embodiments of the present application and is not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more of the associated listed items.

[0023] In the description of the present application, it should be understood that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0024] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "multiple" appears, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0025] In the present application, unless specifically defined otherwise, if there is an appearance of the terms "mount", "connect", "connection", "fixed", etc., these terms should be interpreted broadly. For example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate media, or internal communication of two elements, or interaction relationship between two elements, unless otherwise specifically defined. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0026] In the present application, unless specifically defined otherwise, if there is a similar description of the first feature "on" or "under" the second feature, it means that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the second feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the second feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0027] It should be noted that if an element is referred to as "fixed to" or "provided on" another element, it can be directly on another element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are for illustrative purposes only and are not the only embodiment.

[0028] In the advanced packaging industry, the advanced semiconductor chip process usually includes a stack of multiple layers of different materials, where the coefficient of thermal expansion (CTE) of each layer of material is different, which often leads to warpage of the wafer. In addition, during the wafer backside grinding process, the wafer may also generate stress and warpage. When the wafer warps, not only is it not conducive to subsequent processing of the wafer, but it can also reduce the yield and reliability of chip production. Therefore, as chip sizes continue to increase, wafer warping has become an unavoidable and urgent problem. Wafer warping not only affects the quality and performance of packaging, but also can lead to a decrease in product reliability, thereby affecting the stability and efficiency of the entire supply chain. With the increasing demand for high-performance chips in the market, the severity of the warping problem has become increasingly prominent.

[0029] However, due to the diversification of equipment suppliers, there are significant differences in the compensation capabilities of different equipment warping. Such differences not only reflect in the technical level and equipment performance, but also in the solutions and response speed of each equipment supplier. Whenever equipment suppliers make equipment hardware modifications to deal with warping problems, they often need to invest a lot of money and time. These high hardware costs and long modification cycles make equipment suppliers face more pressure when responding to market changes. In addition, the complexity of equipment modification also increases the difficulty of project management. Different suppliers' equipment may have problems in compatibility and interoperability, causing equipment suppliers to face more challenges when integrating new and old equipment.

[0030] Please understand in combination Figures 1 to 4 According to some embodiments, the present application provides a semiconductor work carrier.

[0031] As Figure 1 shown, the semiconductor work carrier includes a carrier body 100, a plurality of pedestals 200, and a plurality of adsorption assemblies 300. The carrier body 100 is used to carry a wafer. The plurality of pedestals 200 are arranged in predetermined positions on the top surface of the carrier body 100. The plurality of adsorption assemblies 300 are correspondingly arranged on the plurality of pedestals 200, and the top surface of the adsorption assembly 300 is in contact with the wafer. Among them, in the predetermined position, the bottom surface of the wafer and the top surface of the carrier body 100 have a predetermined distance, and the height of the adsorption assembly 300 is equal to the predetermined distance.

[0032] It can be understood that because the bottom surface of the wafer with warping phenomenon is usually arc-shaped, it has different predetermined distances between the bottom surface and the carrier body 100 in different predetermined positions. In the above embodiment, the height of the adsorption assembly 300 is equal to the predetermined distance, the plurality of adsorption assemblies 300 are correspondingly arranged on the plurality of pedestals 200, and the plurality of pedestals 200 are arranged in the predetermined positions on the top surface of the carrier body 100. In this way, by adjusting the height of the adsorption assembly 300, it is beneficial to better adapt to the warped wafer, and under the action of the adsorption assembly 300, the warping of the wafer is further overcome.

[0033] For example, the number of pedestals 200 and adsorption assemblies 300 can be the same or different. In the embodiment where the number of pedestals 200 and adsorption assemblies 300 is the same, one adsorption assembly 300 is correspondingly arranged on each pedestal 200. In the embodiment where the number of pedestals 200 and adsorption assemblies 300 is different, the number of pedestals 200 is greater than the number of adsorption assemblies 300 to achieve redundancy and improve the adaptability to wafers with different warping degrees. For example, the number of pedestals 200 can be 1.1 to 5 times the number of adsorption assemblies 300. For example, the number of pedestals 200 can be 1.1 times, 2 times, or 5 times the number of adsorption assemblies 300, etc.

[0034] like Figure 2 As shown, in some embodiments, the adsorption assembly 300 includes a first sleeve 310, a second sleeve 320 and a compression assembly 330; the first sleeve 310 is arranged on the base 200; the second sleeve 320 is at least arranged on the first sleeve 310; the second sleeve 320 is movably connected to the first sleeve 310, and the second sleeve 320 moves in a direction perpendicular to the carrier body 100; there is a compression chamber between the first sleeve 310 and the second sleeve 320; the compression assembly 330 is located in the compression chamber; the bottom surface of the compression assembly 330 abuts against the bottom surface of the first sleeve 310, and the top surface of the compression assembly 330 abuts against the top surface of the second sleeve 320.

[0035] In some embodiments, the second sleeve 320 and the first sleeve 310 are two independent components that are movably connected. For example, the second sleeve 320 and the first sleeve 310 can be connected to the limiting plate 120 by bolts.

[0036] For example, the first sleeve 310 and the second sleeve 320 are both cylindrical. In a specific embodiment, the second sleeve 320 is further disposed outside the first sleeve 310. For example, the inner diameter of the second sleeve 320 is larger than the inner diameter of the first sleeve 310.

[0037] In some embodiments, the first sleeve 310 is threadedly connected to the second sleeve 320; the outer wall of the first sleeve 310 has an external thread, and the inner wall of the second sleeve 320 has an internal thread. During use, the second sleeve 320 can be rotated to move in a direction perpendicular to the carrier body 100 and reduce the volume of the compression chamber, thereby compressing the compression assembly 330. The threaded connection can effectively provide a larger contact area, thereby enhancing the connection strength between the two sleeves and helping to prevent leakage or loosening of the connection due to pressure changes or external impacts. In addition, the first sleeve 310 and the second sleeve 320, which are threadedly connected, can achieve a good sealing effect at the connection to prevent fluid leakage in the compression chamber.

[0038] In some embodiments, the suction assembly 300 further comprises a suction nozzle 340 and a venting pipe 350. The suction nozzle 340 is used to suck the wafer and is arranged on the top of the compression assembly 330 to ensure the stability and efficiency of the suction process, thereby minimizing the movement and damage of the wafer during the processing. The venting pipe 350 is arranged on the bottom surface of the suction nozzle 340 and penetrates through the top surface of the second sleeve 320. The venting pipe 350 is in communication with the compression cavity and is conducive to more flexible adjustment of the suction and release processes. The venting pipe 350 can provide an effective air flow channel, so that the negative pressure generated during the suction process can be quickly conducted into the compression cavity, thereby enhancing the suction force. In addition, the process of releasing air through the venting pipe 350 after the process is completed is also optimized, greatly shortening the ejection time of the wafer and improving the production efficiency.

[0039] In some embodiments, the suction assembly 300 further comprises a one-way valve 360 arranged on the side wall of the first sleeve 310. The one-way valve 360 has a gas discharge channel therein, which is in communication with the compression cavity. It can be understood that the one-way valve 360 is a valve that allows fluid to flow in only one direction. In the embodiments of the present application, the one-way valve 360 is arranged to allow gas to be discharged outward from the compression cavity through the gas discharge channel, so as to reduce the pressure in the compression cavity when the second sleeve 320 is moved to compress the compression assembly 330, thereby improving the suction effect on the wafer.

[0040] For example, the one-way valve 360 includes but is not limited to a spring-loaded one-way valve 360, a gravity one-way valve 360 (self-weight valve), a slide valve one-way valve 360, a ball valve one-way valve 360, a composite one-way valve 360, an electric one-way valve 360, an acrylic one-way valve 360, a plastic one-way valve 360, etc.

[0041] In some embodiments, the compression assembly 330 comprises a compression air bag. The compression air bag stores and releases energy by using gas pressure, is usually made of flexible material, and can expand when gas is filled and contract when gas is discharged. For example, the compression air bag comprises an air inlet at the top end, which is in communication with the venting pipe 350, and the inside of the air bag is a closed space.

[0042] In some embodiments, the base 200 is movably connected to the first sleeve 310. In an embodiment where the outer wall of the first sleeve 310 has an external thread, the inner wall of the base 200 has an internal thread, and the base 200 is threadedly connected to the first sleeve 310. By providing a movably connected base 200 and first sleeve 310, the flexibility of the semiconductor work carrier can be increased, making it convenient for staff to inspect or maintain the adsorption assembly 300. If necessary, a single adsorption assembly 300 can be replaced separately, reducing equipment maintenance time and improving work efficiency. In addition, in an embodiment where the number of bases 200 is greater than the number of adsorption assemblies 300, the installation position of the adsorption assembly 300 can also be selected according to the degree of warping of the wafer to be carried, so as to better overcome the wafer warping.

[0043] like Figure 3 As shown, in some embodiments, the carrier body 100 includes a carrier plate 110 and a limiting plate 120 located around the carrier plate 110. The carrier plate 110 is circular, and the limiting plate 120 is annular.

[0044] It is understandable that Figure 4 As shown, the orthographic projection of the carrier plate 110 is circular, and the orthographic projection of the limiting plate 120 is annular. It should be noted that the orthographic projection of the carrier plate 110 can be understood as Figure 1 The Z direction shown in FIG. 1 is used to project the carrier plate 110 to obtain the following image: Figure 4 The projection shown in the figure and the orthographic projection in the following text can be understood in the same way and will not be explained in detail.

[0045] In some embodiments, the inner diameter of the limiting plate 120 is not less than the maximum diameter of the wafer carried by the susceptor 110 to ensure that the wafer carried by the susceptor 110 can be confined within the limiting plate 120. For example, the inner diameter of the limiting plate 120 can be 1 to 1.2 times the maximum diameter of the wafer carried by the susceptor 110. For example, the inner diameter of the limiting plate 120 can be 1 times, 1.1 times, or 1.2 times the maximum diameter of the wafer carried by the susceptor 110.

[0046] In some embodiments, the size of the top surface of the limiting plate 120 is smaller than the size of the bottom surface of the limiting plate 120. For example, the width of the top surface of the limiting plate 120 is smaller than the width of the bottom surface of the limiting plate 120. Here, the width of the top surface of the limiting plate 120 can be understood as the width of the top surface of the limiting plate 120 along the first direction, and the first direction can be understood as the direction parallel to the top surface of the carrier plate 110, that is, Figure 2 Since the width of the top surface of the limiting plate 120 is smaller than the width of the bottom surface of the limiting plate 120 , the load can be effectively dispersed, the anti-seismic performance and strength of the limiting plate 120 are improved, and the bearing capacity and stability of the limiting plate 120 are increased.

[0047] For example, the width of the top surface of the limiting disc 120 is 0.6 to 0.7 times the width of the bottom surface of the limiting disc 120. For example, the inner diameter of the limiting disc 120 can be 0.6, 0.7, or 0.8 times the maximum diameter of the wafer carried by the carrier disc 110, and the like.

[0048] In some embodiments, the longitudinal section of the limiting disc 120 is trapezoidal. The limiting disc 120 with a trapezoidal longitudinal section can achieve greater carrying capacity and stability in a limited space while ensuring seismic performance and strength, thereby improving space utilization.

[0049] It should be noted that the specific material of the limiting disc 120 is not limited in the present application. Those skilled in the art can select a material with high temperature resistance, corrosion resistance, and appropriate mechanical strength to manufacture the limiting disc 120 according to the requirements and application environment of the semiconductor work carrier disc and the compatibility with other components, so as to ensure that the limiting disc 120 can stably work and maintain good performance in the semiconductor work carrier disc.

[0050] In some embodiments, the carrier disc 110 and the limiting disc 120 are integrally formed. It can be understood that integrally forming refers to a processing method in which multiple processes are completed in the same tooling or mold, and the raw material is processed into the final product at one time. Since integrally forming can complete the entire production process of the carrier disc 110 and the limiting disc 120 in a single tooling or mold, and multiple processes are completed in the same tooling or mold, the processing and assembly links of the components are reduced, integrally forming can improve production efficiency, save production time, and reduce production cost. Moreover, integrally forming can ensure the consistency of the carrier disc 110 and the limiting disc 120, avoiding quality problems caused by non-compliance of the interface between the carrier disc 110 and the limiting disc 120, and the processing process of integrally forming is accurately controlled by the mold or tooling, which can ensure the precision requirements of the carrier disc 110 and the limiting disc 120, thereby reducing processing errors and improving the stability and reliability of the carrier disc 110 and the limiting disc 120. In addition, integrally forming can usually reduce waste and secondary processing in the production process. Therefore, the integrally formed carrier disc 110 and limiting disc 120 can improve production efficiency, reduce cost, ensure product quality and precision, and save raw materials.

[0051] In the embodiment in which the carrier disc 110 and the limiting disc 120 are integrally formed, the materials of the carrier disc 110 and the limiting disc 120 are the same. For example, in the embodiment in which the carrier disc 110 and the limiting disc 120 are made of plastic material, the integrally formed carrier disc 110 and limiting disc 120 can be processed by injection molding. By injecting molten plastic material into the mold on the injection molding machine, the integrally formed carrier disc 110 and limiting disc 120 can be obtained after cooling and solidification.

[0052] For example, in the embodiment where the bearing disc 110 and the limiting disc 120 are made of metal or alloy material, the bearing disc 110 and the limiting disc 120 can be integrally formed by pressure casting. The bearing disc 110 and the limiting disc 120 are integrally formed by heating and melting the metal alloy or other materials, and then injecting the molten material into the mold cavity under high pressure for rapid cooling. For example, the bearing disc 110 and the limiting disc 120 can also be integrally formed by extrusion molding. The molten plastic or metal material is extruded by an extruder to form the bearing disc 110 and the limiting disc 120 integrally. For example, the bearing disc 110 and the limiting disc 120 can also be integrally formed by powder metallurgy molding. The metal powder is mixed with additives and then pressed into the shape of the product at one time, and then sintered to combine the powder particles into a whole, to obtain the bearing disc 110 and the limiting disc 120 integrally.

[0053] In some embodiments, the bearing disc 110 and the limiting disc 120 can be fixedly connected. The fixedly connected bearing disc 110 and the limiting disc 120 can form a high-strength connection to improve the stability of the bearing disc 110 and the limiting disc 120. For example, the bearing disc 110 and the limiting disc 120 can be connected by welding, i.e. by melting and solidifying the material to form a connection, such as by spot welding, gas welding, arc welding, etc. to form a fixed connection between the bearing disc 110 and the limiting disc 120. For example, the bearing disc 110 and the limiting disc 120 can also be connected by mortise and tenon connection, i.e. by embedding the bearing disc 110 and the limiting disc 120 together through the concave-convex structure of the tenon and the mortise. For example, the bearing disc 110 and the limiting disc 120 can also be connected by adhesive connection, i.e. using glue, tape, etc. to bond the bearing disc 110 and the limiting disc 120 together. For example, the bearing disc 110 and the limiting disc 120 can also be connected by clamping, i.e. using pliers to clamp the bearing disc 110 and the limiting disc 120, and fixing the limiting disc 120 and the bearing disc 110 by mechanical torque.

[0054] It should be noted that the application does not specifically limit the connection method of the bearing disc 110 and the limiting disc 120, and those skilled in the art can select a suitable connection method according to the requirements and application environment of the semiconductor work disc, as well as the cooperation with other components, according to the actual needs and application scenarios, to ensure the mechanical structural stability and reliability of the bearing disc 110 and the limiting disc 120.

[0055] For example, Figure 4As shown, in some embodiments, the plurality of pedestals 200 includes a plurality of outer pedestals 210 and a plurality of inner pedestals 220 to improve the stability and functionality of the semiconductor work carrier. The plurality of outer pedestals 210 is arranged at a predetermined position of the carrier plate 110 close to the limiting plate 120; the plurality of inner pedestals 220 is arranged at a predetermined position close to the center of the carrier plate 110 inside the outer pedestals 210, so as to optimize the load distribution of the carrier plate body 100 and effectively improve the overall performance of the system. The arrangement of the outer pedestals 210 close to the limiting plate 120 can effectively enhance the stability of the entire semiconductor work carrier. When the wafer is subjected to external force or gravity, the outer pedestals 210 can provide a support point, which helps to disperse the load and reduce the stress concentration of the material. The inner pedestals 220 are arranged inside the outer pedestals 210 close to the center of the carrier plate 110, so that the internal load is evenly distributed at the center of the carrier plate body 100, thereby reducing the deformation or instability phenomenon that may be caused by eccentric load.

[0056] In the above embodiments, the plurality of outer pedestals 210 and the plurality of inner pedestals 220 are arranged at predetermined positions along the circumference of the center of the carrier plate 110, so as to maximize the symmetry and stability of the support structure, and to help achieve high consistency and reliability during work. The circumferential distribution of the pedestals 200 can evenly distribute the load, reduce local stress, improve the service life of the material, and prevent structural damage caused by excessive stress concentration.

[0057] In the above embodiments, by reasonably planning the position and number of the pedestals 200, the complex structure design is reduced, and the maintenance and replacement process of the overall device is more convenient. The plurality of pedestals 200 can enhance the effective support of the overall structure and improve the reliability of the bearing system. When one pedestal 200 fails, other pedestals 200 can share the load to reduce the risk of system failure.

[0058] In some embodiments, the plurality of outer pedestals 210 is evenly distributed. Correspondingly, the plurality of inner pedestals 220 is also evenly distributed. For example, the number of outer pedestals 210 and inner pedestals 220 can be the same.

[0059] In a specific embodiment, the number of pedestals 200 is 8, the number of outer pedestals 210 is 4, and the number of inner pedestals 220 is 4.

[0060] In some embodiments, the inner pedestals 220 are arranged on the connecting line between the outer pedestals 210 and the center of the carrier plate 110. Figure 1 It can be understood that when the number of pedestals 200 is 8, the number of outer pedestals 210 is 4, and the number of inner pedestals 220 is 4, the inner pedestals 220 are arranged on the connecting line between the outer pedestals 210 and the center of the carrier plate 110, and 2 inner pedestals 220 and 2 outer pedestals 210 can be shown in a cross section.

[0061] According to some embodiments, the present application provides a semiconductor device, which includes the semiconductor work carrier in any of the above embodiments, and is used for adsorbing a wafer and performing a preset process.

[0062] In some embodiments, the wafer can be of 8 inches or 12 inches, etc. The embodiments of the present application can adapt to wafers of different sizes without modifying the device, thereby reducing the cost of modifying the device.

[0063] In some embodiments, the preset process can include, but is not limited to, a single crystal silicon growth process, a wafer cutting process, an oxidation process, a deposition process, a photolithography process, an etching process, an ion implantation process, an annealing process, a metallization process, a packaging process, a testing process, etc. For example, the preset process can be all processes of RDL / 2.5D / 3D products after the carrier is removed, wherein RDL (Re-Distribution Layer) is a technology for redistributing integrated circuit pins, aiming to align the chip pin position with the packaging pin position, so as to realize high-density connection in a smaller package; 2.5D technology generally refers to an indirect three-dimensional interconnection technology, in which multiple chips are placed on the same substrate (such as a silicon interposer), and are interconnected through through-silicon vias (TSVs) or other types of connections. 2.5D packaging can effectively improve performance and bandwidth while maintaining good cost-effectiveness; 3D integration technology is to vertically stack multiple chips together and realize direct interconnection through through-silicon vias (TSVs). 3D packaging can greatly improve the integration and performance of circuits and reduce the volume.

[0064] It can be understood that, according to different preset processes, the semiconductor device in the embodiments of the present application can be used as a wafer cutting machine, an oxidation furnace, a chemical vapor deposition (CVD) device, a photolithography machine (Mask Aligners / Step and Repeat Lithography), a dry etching machine (reactive ion etching, RIE), a wet etching device, an ion implantation machine, an annealing furnace, a metallization device, an evaporation machine, a sputtering machine, a testing device, a cleaning device, a packaging device, etc.

[0065] The technical features of the above embodiments can be combined in any manner. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described, however, as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the present application.

[0066] The above-described embodiments only express several implementation manners of the utility model, the description is more specific and detailed, but can not therefore be understood as the limitation of the utility model patent range. It should be pointed out that for ordinary skilled person in the art, without departing from the utility model concept, several modifications and improvements can be made, which belong to the protection range of the utility model. Therefore, the protection range of the utility model patent should be subject to the appended claims.

Claims

1. A semiconductor operation carrier, characterized in that: include: The carrier plate body is used to carry the wafer; A plurality of bases are arranged in preset positions on the top surface of the carrier body; A plurality of adsorption components are correspondingly arranged on the plurality of bases, and the top surfaces of the adsorption components are in contact with the wafer; Wherein, at the preset position, there is a preset distance between the bottom surface of the wafer and the top surface of the carrier body, and the height of the adsorption component is equal to the preset distance.

2. The semiconductor operation carrier according to claim 1, wherein: The adsorption component includes: A first sleeve is provided on the base; A second sleeve is at least provided on the first sleeve; the second sleeve is movably connected to the first sleeve and moves in a direction perpendicular to the carrier body; a compression chamber is defined between the first sleeve and the second sleeve; A compression assembly is located in the compression chamber; the bottom surface of the compression assembly abuts against the bottom surface of the first sleeve, and the top surface of the compression assembly abuts against the top surface of the second sleeve.

3. The semiconductor operation carrier according to claim 2, wherein: The adsorption component also includes: A suction nozzle, used for sucking the wafer, and arranged on the top of the compression assembly; A ventilation pipe is provided on the bottom surface of the suction nozzle and passes through the top surface of the second sleeve; the ventilation pipe is communicated with the compression chamber.

4. The semiconductor operation carrier according to claim 2, wherein: The adsorption assembly further includes a one-way valve, which is arranged on the side wall of the first sleeve; The one-way valve has an air release passage therein, and the air release passage is communicated with the compression chamber.

5. The semiconductor operation carrier according to claim 2, wherein: The second sleeve is further arranged outside the first sleeve; The first sleeve is threadedly connected to the second sleeve; the outer side wall of the first sleeve has an external thread, and the inner side wall of the second sleeve has an internal thread.

6. The semiconductor operation carrier according to claim 2, wherein: The inner side wall of the base has an internal thread, and the base is threadedly connected to the first sleeve.

7. The semiconductor operation carrier according to claim 1, wherein: The carrier plate body includes a carrier plate and a limiting plate located on the circumference of the carrier plate. The carrier plate is circular, and the limiting plate is annular.

8. The semiconductor operation carrier according to claim 7, wherein: The plurality of bases include: A plurality of outer bases are arranged at the preset positions of the carrying plate close to the limiting plate; A plurality of inner bases are located inside the outer base and are disposed at the preset positions near the center of the carrier plate; The preset positions of the plurality of outer bases and the plurality of inner bases are respectively distributed along the circumference of the center of the carrying plate.

9. The semiconductor operation carrier according to claim 8, wherein: The inner base is arranged on a connecting line between the outer base and the center of the carrying plate.

10. A semiconductor device, characterized in that: It comprises a semiconductor operation carrier as described in any one of claims 1 to 9, wherein the semiconductor operation carrier is used to absorb wafers and perform a preset process.

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