Novel semiconductor IC integrated circuit support feeding structure

Abstract

A novel semiconductor IC integrated circuit support feeding structure relates to the technical field of semiconductor die bonding equipment, has a material stacking and feeding mode and a material box feeding mode, and comprises a base, a material stacking frame, a feeding tray, a suction cup material taking assembly, a material pushing box assembly and a material pushing assembly. The suction cup material taking assembly sequentially sucks the supports to be subjected to die bonding to the feeding track of the feeding tray, and the material pushing assembly pushes the supports to be subjected to die bonding on the feeding track into a feeding channel of the die bonder. When the material box feeding mode is used for feeding, the feeding track on the feeding tray is detached, the suction cup material taking assembly moves to the side, away from the material stacking frame, of the feeding tray, the material box pushing assembly pushes the material box to the feeding tray, and the material pushing assembly sequentially pushes the supports to be subjected to die bonding in the material box into a feeding channel of the die bonder. By the adoption of the technical scheme, the stacking feeding mode and the material box feeding mode can be compatible, the production efficiency is improved, operation is easy and convenient, and market popularization is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor crystal bonding equipment, in particular to a novel semiconductor IC integrated circuit bracket feeding structure. Background Art

[0002] Die bonding is a crucial step in the packaging of semiconductor devices such as integrated circuits (ICs) and light-emitting diodes (LEDs). The die bonding process begins as follows: First, the loading system transports the die bonder from the storage device to the feed channel. The die bonder then moves along the feed channel and settles into position. A dispensing module on the frame then automatically applies adhesive to the die bonder's die bond area. An automated pick-and-place mechanism then removes the chip from the wafer tray and bonds it to the die bonder's die bond area, completing the die bonding process.

[0003] Existing methods for loading die bonders are generally divided into two types: placing the die bonders in a cassette for loading, and stacking the die bonders for loading. Traditional die bonder loading mechanisms require separate configurations, and cannot accommodate both cassette and stack feeding on the same mechanism. Consequently, only a single loading mode is available, resulting in limited flexibility, inconvenience in actual production, and hindering production progress, hindering large-scale industrial production. Utility Model Content

[0004] The purpose of the present utility model is to address the phenomenon that the existing crystal bonding machine is not compatible with the box feeding method and the stacking feeding method, can only realize a single mode of loading, lacks flexibility, hinders the production process, and is not conducive to large-scale industrial production. The present utility model provides a new semiconductor IC integrated circuit bracket loading structure.

[0005] The technical solution adopted by the utility model is: a new type of semiconductor IC integrated circuit bracket feeding structure, which has a stacking feeding mode and a box feeding mode, and the feeding structure includes:

[0006] base;

[0007] A stacking rack is provided above the base and is used to carry a material box filled with supports to be bonded or a material tray on which supports to be bonded are stacked;

[0008] A feeding tray is provided on one side of the stacking rack and can be vertically raised and lowered relative to the stacking rack along the Z-axis direction, and a feeding track is detachably provided on its top surface and is connected to the feeding channel of the die bonder;

[0009] The suction cup material picking assembly is arranged above the stacking rack and the feeding tray. It can move relative to the stacking rack along the X-axis and the Z-axis. In the stacking loading mode, the suction cup material picking assembly is used to suck the to-be-bonded supports stacked on the tray onto the feeding track in sequence.

[0010] A pushing box assembly is arranged on the stacker, and is used to push the full box of the die carrier to the feeding tray in the box feeding mode.

[0011] A pushing assembly is arranged on the side of the feeding tray away from the feeding channel of the die bonder, and is used to push the die carrier on the feeding track to the feeding channel of the die bonder in the stack feeding mode, or to push the die carrier in the box on the feeding tray to the feeding channel of the die bonder in the box feeding mode.

[0012] In the stack feeding mode, the suction disc taking assembly takes the die carrier stacked on the tray to the feeding track of the feeding tray, and the pushing assembly pushes the die carrier on the feeding track to the feeding channel of the die bonder, so as to realize the stack feeding.

[0013] In the box feeding mode, the feeding track on the feeding tray is removed, the suction disc taking assembly is moved to the side of the feeding tray away from the stacker, the pushing box assembly pushes the box on the stacker to the feeding tray, and the pushing assembly pushes the die carrier in the box to the feeding channel of the die bonder, so as to realize the box feeding.

[0014] Optionally, the suction disc taking assembly comprises a support plate arranged on the base, an X-axis moving seat slidably arranged on the support plate, a Z-axis fixed seat fixedly arranged on the X-axis moving seat, a Z-axis lifting frame slidably arranged on the Z-axis fixed seat, and a suction disc group arranged on the Z-axis lifting frame. The support plate is arranged along the X-axis direction, and the support plate is located above the stacker. The X-axis moving seat is capable of moving left and right along the length direction of the support plate. The Z-axis fixed seat is arranged along the Z-axis direction. The Z-axis lifting frame is capable of moving up and down along the length direction of the Z-axis fixed seat. The suction disc group is used to take the die carrier stacked on the tray.

[0015] Optionally, the suction disc taking assembly further comprises an X-axis driving member for driving the X-axis moving seat to move left and right along the length direction of the support plate, and a Z-axis driving member for driving the Z-axis lifting frame to move up and down along the length direction of the Z-axis fixed seat.

[0016] Optionally, the X-axis driving member comprises an X-axis screw rod rotatably arranged on the support plate and arranged along the length direction of the support plate, an X-axis nut seat threadedly arranged on the X-axis screw rod and fixedly connected with the X-axis moving seat, an X-axis guide rail arranged along the length direction of the support plate and slidably matched with the X-axis moving seat, and an X-axis driving motor for driving the X-axis screw rod to rotate.

[0017] Optionally, the Z-axis driving member comprises a Z-axis screw rod rotatably arranged on the Z-axis fixing base and arranged along the length direction of the Z-axis fixing base, a Z-axis nut seat threadedly arranged on the Z-axis screw rod and fixedly connected with the Z-axis lifting base, a Z-axis guide rail arranged along the length direction of the support plate and slidably connected with the Z-axis lifting frame, and a Z-axis driving motor for driving the Z-axis screw rod to rotate.

[0018] Optionally, the pushing box assembly comprises a pushing frame slidably arranged on the stacking frame, a pushing block arranged on the pushing frame, and a pushing box cylinder for driving the pushing frame to move towards or away from the feeding tray, the pushing frame being capable of sliding along the length direction of the stacking frame towards or away from the feeding tray, the pushing block protruding from the stacking frame and abutting against the full material box containing the die bonding supports, the pushing cylinder being arranged along the length direction of the stacking frame, and the piston rod of the pushing box cylinder being fixedly connected with the pushing frame.

[0019] Optionally, a bearing frame for bearing the feeding tray is vertically arranged on the base, the feeding tray being slidably arranged on the side wall of the bearing frame, and the bearing frame being provided with a lifting assembly for driving the feeding tray to vertically lift relative to the base, so that in the material box feeding mode, the pushing assembly can sequentially push the die bonding supports in the material box into the feeding channel of the die bonder.

[0020] The lifting assembly comprises a vertical slot vertically arranged on the bearing frame, a lifting screw rod rotatably arranged in the vertical slot, a lifting seat threadedly connected with the lifting screw rod, and a lifting motor for driving the lifting screw rod to rotate, the vertical slot further being provided with a vertical guide rail slidably connected with the lifting seat, and the feeding tray being fixedly connected with the lifting seat, so that when the lifting motor drives the lifting screw rod to rotate, the lifting seat can drive the feeding tray to vertically lift relative to the base.

[0021] Optionally, the bearing frame is provided with a clamping assembly for clamping the material box so that the material box can be stably positioned on the feeding tray.

[0022] The clamping assembly comprises a sliding frame slidably arranged on the top surface of the bearing frame, an abutting plate arranged on the side of the sliding frame close to the feeding tray, a first limiting strip and a second limiting strip respectively arranged on the sliding frame and the abutting plate, and a clamping cylinder arranged on the second limiting strip, the sliding frame being capable of moving towards or away from the feeding tray relative to the bearing frame, the abutting plate being used for abutting against the material box, the first limiting strip and the second limiting strip being used for clamping the material box, and the clamping cylinder being used for abutting against one side of the material box so as to abut the other side of the material box against the first limiting strip.

[0023] Optionally, the pushing assembly comprises a mounting plate fixed on the carrier frame, a pushing cylinder arranged on the mounting plate, and a pushing rod arranged on the pushing cylinder, the pushing cylinder is located on the side of the feeding push disc away from the feeding channel of the die bonder, and the pushing rod is flush with the die support to be die bonded in the box.

[0024] Optionally, a material collecting frame is arranged between the material stacking frame and the base for collecting empty boxes, and a box collecting assembly is arranged on the base for pushing the empty boxes from one end of the material collecting frame to the other end.

[0025] The box collecting assembly comprises a moving frame slidingly arranged on the base and a collecting cylinder for driving the moving frame to move towards or away from the material collecting frame, and the moving frame is used to push the empty boxes to move along the length direction of the material collecting frame, so that the empty boxes can be pushed from one end of the material collecting frame to the other end of the material collecting frame.

[0026] After the above technical scheme is adopted, the present application has the following beneficial effects:

[0027] When the stacking mode is used for feeding, the die support to be die bonded stacked on the tray is sequentially sucked by the suction disc material taking assembly to the feeding track of the feeding tray, so that the pushing assembly can push the die support to be die bonded on the feeding track to the feeding channel of the die bonder, thereby realizing stacking feeding. When the box mode is used for feeding, the feeding track on the feeding tray is disassembled, and the suction disc material taking assembly is moved to the side of the feeding tray away from the material stacking frame. At this time, the box pushing assembly pushes the box on the material stacking frame to the feeding tray, so that the pushing assembly can push the die support to be die bonded in the box into the feeding channel of the die bonder, thereby realizing box feeding. The stacking feeding mode can be switched to the box feeding mode by disassembling the feeding track and adjusting the position of the suction disc material taking assembly, thereby meeting the feeding of various supports, being suitable for various scenes, helping to improve the production efficiency, and having good market promotion value. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0029] Figure 1 is a display diagram when the stacking feeding mode is used for feeding in the present embodiment;

[0030] Figure 2 is a display diagram when the box feeding mode is used for feeding in the present embodiment;

[0031] Figure 3 is a partial view of the suction cup material taking assembly in this embodiment;

[0032] Figure 4 is a schematic view of the cooperation between the pushing box assembly and the stacking frame;

[0033] Figure 5 is a schematic view of the cooperation between the abutting assembly, the pushing box assembly and the stacking frame;

[0034] Figure 6 is a partial view of the feeding mode using the material box in this embodiment;

[0035] Figure 7 is a schematic view of the cooperation between the bearing frame, the lifting assembly and the feeding tray;

[0036] Figure 8 is a schematic view of the cooperation between the clamping assembly, the feeding tray and the bearing frame;

[0037] Figure 9 is a view of the pushing assembly in this embodiment;

[0038] Figure 10 is a schematic view of the cooperation between the collecting box assembly and the base;

[0039] Figure 11 is a schematic view of the cooperation between the collecting frame, the moving frame and the collecting cylinder.

[0040] Reference signs: 10, base; 11, bearing frame; 111, vertical groove; 112, lifting screw; 113, lifting seat; 114, lifting motor; 115, vertical guide rail; 116, transmission belt; 12, collecting frame;

[0041] 20, stacking frame; 21, material tray; 22, material box; 23, to-be-die-bonding support; 24, waste paper box;

[0042] 30, feeding tray; 31, feeding track;

[0043] 40, suction cup material taking assembly; 41, support plate; 42, X-axis moving seat; 43, Z-axis fixed seat; 44, Z-axis lifting frame; 45, suction cup group; 46, X-axis driving member; 461, X-axis screw; 462, X-axis nut seat; 463, X-axis guide rail; 464, X-axis driving motor; 47, Z-axis driving member; 471, Z-axis screw; 472, Z-axis nut seat; 473, Z-axis guide rail; 474, Z-axis driving motor;

[0044] 50, pushing box assembly; 51, pushing frame; 52, pushing block; 53, pushing box cylinder;

[0045] 60, pushing assembly; 61, mounting plate; 611, first plate; 612, second plate; 62, pushing cylinder; 63, pushing rod;

[0046] 70, clamping assembly; 71, sliding frame; 72, abutting plate; 73, first limiting strip; 74, second limiting strip; 75, clamping cylinder; 76, adjusting piece;

[0047] 80, abutting assembly; 81, abutting cylinder; 82, abutting block;

[0048] 90, receiving box assembly; 91, moving frame; 92, receiving cylinder. DETAILED DESCRIPTION

[0049] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Figures 1-11 It should be noted that the technical solutions in the embodiments of the present application are clearly and completely described, and the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0050] It should be noted that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "back", "side", "circumferential" and the like in the present application indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the first, second, etc. words are only for distinguishing a plurality of components or structures with the same or similar structures, and do not mean a certain special limitation on the arrangement order or connection relationship.

[0051] The present embodiment relates to a novel semiconductor IC integrated circuit support loading structure, which is mainly arranged at the loading end of a die bonder to realize automatic loading.

[0052] With reference to Figure 1 and Figure 2 The loading structure provided by the present embodiment has a stack loading mode and a box loading mode. In the stack loading mode, the die-bonding supports are stacked and placed for loading, and in the box loading mode, the die-bonding supports are stacked and placed in the box 22.

[0053] The feeding structure comprises a base 10, a stacking frame 20, a feeding tray 30, a suction disc material taking assembly 40, a material box pushing assembly 50 and a material pushing assembly 60. The base 10 is in the shape of a cuboid, the stacking frame 20 is installed above the base 10 and is used to carry a material box 22 full of crystal fixing supports 23 or a material tray 21 on which the crystal fixing supports 23 are stacked. When the stacking feeding mode is used for feeding, the material tray 21 is placed on the stacking frame 20, and the crystal fixing supports 23 are stacked on the material tray 21. When the material box 22 feeding mode is used for feeding, the material box 22 is placed on the stacking frame 20, and the crystal fixing supports 23 are stacked in the material box 22.

[0054] The feeding tray 30 is arranged on one side of the stacking frame 20 and can vertically ascend and descend along the Z-axis direction relative to the stacking frame 20. The top surface of the feeding tray 30 is detachably provided with a feeding track 31 which is in communication with the feeding channel of the crystal fixing machine. It should be noted that, in the embodiment, the length direction of the base 10 is the X-axis direction, the width direction of the base 10 is the Y-axis direction, and the height direction of the base 10 is the Z-axis direction.

[0055] The suction disc material taking assembly 40 is arranged above the stacking frame 20 and the feeding tray 30 and can move along the X-axis direction and the Z-axis direction relative to the stacking frame 20. In the stacking feeding mode, the suction disc material taking assembly 40 is used to sequentially suck the crystal fixing supports 23 stacked on the material tray 21 to the feeding track 31. In addition, it should be noted that, when the stacking feeding mode is used, the two adjacent crystal fixing supports 23 on the material tray 21 are separated by a piece of paper. Therefore, when the stacking feeding mode is used for feeding, a waste paper box 24 for placing the paper is also arranged on the stacking frame 20. After the suction disc material taking assembly 40 sucks one crystal fixing support 23 to the feeding track 31 on the feeding tray 30, the paper on the next crystal fixing support 23 needs to be sucked to the waste paper box 24 before the next feeding.

[0056] The material box pushing assembly 50 is arranged on the stacking frame 20 and is used to push the material box 22 full of the crystal fixing supports 23 to the feeding tray 30 in the material box 22 feeding mode.

[0057] The material pushing assembly 60 is arranged on the side of the feeding tray 30 away from the feeding channel of the crystal fixing machine and is used to push the crystal fixing supports 23 sucked to the feeding track 31 by the suction disc material taking assembly 40 into the feeding channel of the crystal fixing machine, so as to complete the stacking feeding in the stacking feeding mode, or is used to sequentially push the crystal fixing supports 23 in the material box 22 pushed to the material box 22 on the feeding tray 30 by the material box pushing assembly 50 into the feeding channel of the crystal fixing machine, so as to complete the material box 22 feeding in the material box 22 feeding mode.

[0058] When using the stack loading mode for loading, the suction disc taking component 40 takes the die carrier 23 placed on the tray 21 to the feeding track 31 of the feeding tray 30 one by one, at this time, the pushing component 60 pushes the die carrier 23 on the feeding track 31 into the feeding channel of the die bonder, thereby realizing the stack loading.

[0059] When using the box loading mode, first, the feeding track 31 on the feeding tray 30 is disassembled, second, the suction disc taking component 40 is moved to the side of the feeding tray 30 away from the stack rack 20, that is, the suction disc taking component 40 does not participate in the loading, at this time, the box pushing component 50 pushes the box 22 on the stack rack 20 to the feeding tray 30, and the pushing component 60 pushes the die carrier 23 in the box 22 into the feeding channel of the die bonder one by one, thereby realizing the box 22 loading. Here, it needs to be explained that since the feeding tray 30 can be vertically lifted relative to the base 10, when the pushing component 60 pushes out the die carrier 23 on the uppermost layer of the box 22, the feeding tray 30 is lowered relative to the base 10 by a certain position, so that the pushing component 60 is aligned with the die carrier 23 on the second layer of the box 22, thereby enabling the pushing component 60 to push out the die carrier 23 on the second layer of the box 22, and so on, so that all the die carriers 23 in the box 22 can be pushed out.

[0060] Further, referring to Figure 1 and Figure 3 , the suction disc taking component 40 includes a support plate 41 provided on the base 10, an X-axis moving seat 42 provided along the length direction of the support plate 41, a Z-axis fixed seat 43 fixedly provided on the X-axis moving seat 42, a Z-axis lifting frame 44 slidingly provided on the Z-axis fixed seat 43, and a suction disc group 45 provided on the Z-axis lifting frame 44, wherein the support plate 41 is provided along the X-axis direction, the support plate 41 is located above the base 10, and the support plate 41 is connected to the base by a connecting plate, the X-axis moving seat 42 can slide along the length direction of the support plate (i.e. the X-axis direction), the Z-axis fixed seat 43 is provided along the Z-axis direction, the Z-axis lifting frame 44 can slide up and down along the length direction of the Z-axis fixed seat 43, and the suction disc group 45 includes a plurality of suction discs uniformly provided on the bottom side of the Z-axis lifting frame 44, and the suction disc group 45 is used to take the die carrier 23 stacked and placed on the tray 21.

[0061] Further, the suction disc taking component 40 further includes an X-axis driving member 46 for driving the X-axis moving seat 42 to move left and right along the length direction of the support plate 41, and a Z-axis driving member 47 for driving the Z-axis lifting frame 44 to move up and down along the length direction of the Z-axis fixed seat 43.

[0062] Specifically, the X-axis driving member 46 comprises an X-axis screw rod 461 rotatably arranged on the support plate 41 and arranged along the length direction of the support plate 41, an X-axis nut seat 462 threadedly sleeved on the X-axis screw rod 461 and fixedly connected with the X-axis moving seat 42, an X-axis guide rail 463 arranged along the length direction of the support plate 41 and slidably connected with the X-axis lifting frame 44, and an X-axis driving motor 464 for driving the X-axis screw rod 461 to rotate.

[0063] The Z-axis driving member 47 comprises a Z-axis screw rod 471 rotatably arranged on the Z-axis fixed seat 43 and arranged along the length direction of the Z-axis fixed seat 43, a Z-axis nut seat 472 threadedly sleeved on the Z-axis screw rod 471 and fixedly connected with the Z-axis lifting seat 113, a Z-axis guide rail 473 arranged along the length direction of the support plate 41 and slidably connected with the Z-axis lifting frame 44, and a Z-axis driving motor 474 for driving the Z-axis screw rod 471 to rotate.

[0064] When the material is fed in the stacking and feeding mode, the X-axis screw rod 461 is driven to rotate by the X-axis driving motor 464, the X-axis nut seat 462 is driven to move along the length direction of the X-axis screw rod 461 towards the stacking frame 20, the Z-axis fixed seat 43 and the suction disc group 45 are driven to move along the X-axis direction towards the stacking frame 20, when the suction disc group 45 moves to the directly above of the tray 21, the Z-axis screw rod 471 is driven to rotate by the Z-axis driving motor 474, the Z-axis nut seat 472 is driven to descend along the Z-axis direction, i.e. the suction disc group 45 is driven to descend along the Z-axis direction and the wafer support 23 on the tray 21 is sucked, then the Z-axis screw rod 471 is driven to reversely rotate by the Z-axis driving motor 474, the suction disc group 45 and the wafer support 23 are driven to ascend along the Z-axis direction, when the ascending height reaches a certain height, the X-axis screw rod 461 is driven to reversely rotate by the X-axis driving motor 464, the suction disc group 45 is driven to move to the directly above of the feeding tray 30, then the Z-axis screw rod 471 is driven to forwardly rotate by the Z-axis driving motor 474, so that the wafer support can be placed on the feeding tray 30.

[0065] Further, referring to Figure 2 , Figure 4 and Figure 5 , the material pushing box assembly 50 comprises a material pushing frame 51 slidably arranged on the stacking frame 20, a material pushing block 52 arranged on the material pushing frame 51, and a material pushing cylinder 62 for driving the material pushing frame 51 to move towards or away from the feeding tray 30, the material pushing frame 51 can move along the length direction of the stacking frame 20 towards or away from the feeding tray 30, the material pushing block 52 protrudes from the stacking frame 20 and abuts against the side of the tray 22 away from the feeding tray 30, the material pushing cylinder 62 is arranged along the length direction of the stacking frame 20, and the piston rod of the material pushing cylinder 62 is fixedly connected with the material pushing frame 51.

[0066] When the material box loading mode is used, the pushing cylinder 62 drives the pushing rack 51 to move toward the feeding tray 30, driving the pushing block 52 to move toward the feeding tray 30, thereby pushing the material box 22 from the stacking rack 20 to the feeding tray 30.

[0067] Further, refer to Figure 2 、 Figure 6 and Figure 7 A carrier frame 11 for carrying the feeding tray 30 is vertically provided on the base 10, and the feeding tray 30 is slidably provided on the side wall of the carrier frame 11, that is, the feeding tray 30 can be vertically lifted and lowered relative to the carrier frame 11, and a lifting component for driving the feeding tray 30 to be vertically lifted and lowered relative to the base 10 is provided on the carrier frame 11, so that in the loading mode of the material box 22, the pushing component 60 can push the crystal bracket 23 to be fixed in the material box 22 into the feeding channel in sequence.

[0068] Specifically, the lifting assembly includes a vertical slot 111 vertically opened on the carrier 11, a lifting screw rod 112 rotatably arranged in the vertical slot 111, a lifting seat 113 threadedly connected to the lifting screw rod 112, and a lifting motor 114 for driving the lifting screw rod 112 to rotate, wherein the vertical slot 111 is opened along the length direction of the carrier 11, and the opening of the vertical slot 111 faces the feeding tray 30, the screw rod is arranged along the length direction of the vertical slot 111, and the two ends of the screw rod are respectively rotatably connected to the upper and lower ends of the vertical slot 111, and a vertical guide rail 115 is provided in the vertical slot 111, which is slidably matched with the lifting seat 113, so that the lifting seat 113 can move up and down in the length direction of the vertical guide rail 115 when the screw rod rotates, and the feeding tray 30 is fixedly connected to the side of the lifting seat 113 away from the vertical slot 111.

[0069] In this embodiment, the output shaft of the lifting motor 114 is connected to the lifting screw 112 through a transmission belt 116, so that the lifting motor 114 can stably drive the lifting screw 112 to rotate, thereby driving the lifting seat 113 and the feeding tray 30 to rise and fall vertically relative to the base 10, and then the pushing assembly 60 can push the crystal bracket 23 to be fixed in the material box 22 out of the material box 22 one by one to realize loading.

[0070] Further, Figure 6 and Figure 8 In order to prevent the material box 22 from shifting after being pushed onto the feeding tray 30 and to ensure the loading efficiency, a clamping assembly 70 is provided on the carrier 11 for clamping the material box 22 so that the material box 22 can be stably located on the feeding tray 30.

[0071] Specifically, the clamping assembly 70 comprises a sliding frame 71 slidingly arranged on the top surface of the carrier frame 11, an abutting plate 72 arranged on the side of the sliding plate close to the feeding tray 30, a first limiting strip 73 and a second limiting strip 74 arranged on the abutting plate 72 and the sliding frame 71 respectively, and a clamping cylinder 75 arranged on the second limiting strip 74. The sliding frame 71 is slidingly connected to the carrier frame 11 through a sliding block and sliding rail structure, and the sliding frame 71 can move towards or away from the feeding tray 30 relative to the carrier frame 11. The abutting plate 72 is used to abut against the material box 22. The first limiting strip 73 is fixedly installed on the side of the sliding frame 71 facing the feeding tray 30. The second limiting strip 74 is installed on the abutting plate 72. The first limiting strip 73 and the second limiting strip 74 cooperate to clamp the material box 22. The clamping cylinder 75 is located on the second limiting strip 74, and the clamping cylinder 75 is used to abut against one side of the material box 22 so as to abut the other side of the material box 22 against the first limiting strip 73.

[0072] Furthermore, in combination with Figure 2 and Figure 5 , the stacking frame 20 is further provided with a abutting assembly 80 for abutting the material box 22 against the abutting plate 72, so that the material box 22 is not easily displaced on the feeding tray 30 under the cooperation of the clamping assembly 70 and the abutting assembly 80, ensuring the stability of the material box 22, thereby facilitating the pushing assembly 60 to push the die-joining support 23 in the material box 22 out.

[0073] The abutting assembly 80 comprises an abutting cylinder 81 arranged along the length direction of the stacking frame 20 and an abutting block 82 arranged on the abutting cylinder 81. The abutting block 82 is arranged on the piston rod of the abutting cylinder 81, and is used to abut against the side wall of the material box 22.

[0074] After the material box 22 is pushed onto the feeding tray 30 by the pushing assembly 50, the abutting block 82 can abut the material box 22 against the abutting plate 72 by controlling the abutting cylinder 81 to act. At this time, the clamping cylinder 75 is controlled to act, so that the clamping cylinder 75 abuts against the material box 22, thereby realizing the fixation of the four side walls of the material box 22, ensuring the stability of the material box 22, so that the material box 22 is not easily displaced, and thereby realizing smooth feeding.

[0075] In addition, referring to Figure 8 , in order to adapt to material boxes 22 of different sizes, in the embodiment, the second limiting strip 74 can slide relative to the abutting plate 72, and the abutting plate 72 is provided with an adjusting member 76 for adjusting the sliding distance of the second limiting strip 74 relative to the abutting plate 72. By driving the limiting strip to slide and fixing the second limiting strip 74 through the adjusting member 76, the spacing between the first limiting strip 73 and the second limiting strip 74 is adjusted, so that material boxes 22 of different sizes can be adapted.

[0076] Further, the pushing assembly 60 comprises a mounting plate 61 fixed on the carrier 11, a pushing cylinder 62 arranged on the mounting plate 61, and a pushing rod 63 arranged on the pushing cylinder 62. The mounting plate 61 is arranged in an L shape and comprises a first plate 611 arranged along the X-axis and a second plate 612 arranged along the Y-axis. The first plate 611 and the second plate 612 can be integrally formed or fixedly connected by bolts. The first plate 611 is fixedly installed on the carrier 11, and the second plate 612 extends to one side of the feeding tray 30. The pushing cylinder 62 is installed on the second plate 612 and located on the side of the feeding tray away from the dispensing machine. The pushing rod 63 is flush with the to-be-die-bonding support 23 in the material box 22.

[0077] Further, referring to Figure 2 、 Figure 10 and Figure 11 , when the to-be-die-bonding supports 23 in the material box 22 are all pushed out by the pushing assembly 60, the material box 22 is an empty material box 22. The stacking rack 20 and the base 10 are provided with a material collecting rack 12 for collecting the empty material box 22. The base 10 is provided with a material box 22 assembly for pushing the empty material box 22 from one end of the material collecting rack 12 to the other end.

[0078] Specifically, the material box 22 assembly comprises a moving rack 91 slidingly arranged on the base 10 and a material collecting cylinder 92 for driving the moving rack 91 to move towards or away from the material collecting rack 12. The moving rack 91 is located between the base 10 and the material collecting rack 12. The piston rod of the pushing cylinder 62 is connected with the moving rack 91, so that the moving rack 91 can push the empty material box 22 to move along the length direction of the material collecting rack 12. When the to-be-die-bonding supports 23 in the material box 22 are all pushed out by the pushing assembly 60, the clamping assembly 70 and the abutting assembly 80 are first controlled to reset and release the empty material box 22. Then, the feeding tray 30 is driven by the lifting assembly to vertically descend, so that the empty material box 22 falls onto the material collecting rack 12. Finally, the material collecting cylinder 92 drives the material collecting rack 12 to slide along the length direction of the material collecting rack 12, so as to drive the empty material box 22 to move from one end of the material collecting rack 12 to the other end of the material collecting rack 12, thereby completing the storage and arrangement of the empty material box 22.

[0079] In addition, in order to improve the feeding efficiency and feeding accuracy of the whole feeding mechanism, the feeding mechanism provided by the embodiment further comprises a control mechanism, the control mechanism is electrically connected with the suction disc material taking assembly 40, the material pushing box assembly 50, the material pushing assembly 60, the lifting assembly, the clamping assembly 70, the abutting assembly 80 and the material collecting box 22 assembly, the first limiting strip 73 (or the second limiting strip 74 and the abutting plate 72) of the clamping assembly 70 is provided with a material sensing device, the supporting plate 41 and the Z-axis fixed seat 43 of the suction disc material taking assembly 40 and the bearing frame 11 are provided with motor origin photoelectric, and the material pushing box assembly 50, the clamping assembly 70, the abutting assembly 80 and the material collecting box 22 assembly all comprise cylinder origin photoelectric and cylinder in-place photoelectric, and the material sensing device, the motor origin photoelectric, the cylinder origin photoelectric and the cylinder in-place photoelectric are electrically connected with the control mechanism. It should be noted that the material sensing device, the motor origin photoelectric, the cylinder origin photoelectric and the cylinder in-place photoelectric are all conventional technical means in the field, and a person skilled in the art can set them at corresponding positions of the feeding mechanism provided by the embodiment according to actual conditions, and no more description is made here.

[0080] The working principle of the utility model is roughly as follows: when using the stacking feeding mode for feeding, the suction disc material taking assembly 40 takes the to-be-die-bonding support 23 placed on the material disc 21 to the feeding track 31 of the feeding tray 30 in turn, at this time, the material pushing assembly 60 acts to push the to-be-die-bonding support 23 on the feeding track 31 into the feeding channel of the die bonder, so as to realize stacking feeding.

[0081] When using the material box feeding mode, firstly, the feeding track 31 on the feeding tray 30 needs to be disassembled, and secondly, the suction disc material taking assembly 40 is moved to the side of the feeding tray 30 away from the stacking rack 20, that is, the suction disc material taking assembly 40 does not participate in feeding, at this time, the material pushing box assembly 50 pushes the material box 22 on the stacking rack 20 to the feeding tray 30, and the material pushing assembly 60 pushes the to-be-die-bonding support 23 in the material box 22 into the feeding channel of the die bonder in turn, so as to realize material box 22 feeding.

[0082] The above is only used to illustrate the technical scheme of the utility model and not limit it, other modifications or equivalent replacements of the technical scheme of the utility model made by a person skilled in the art should be covered in the claim range of the utility model.

Claims

1. A new type of semiconductor IC integrated circuit bracket feeding structure, characterized in that: It has a stacking loading mode and a box loading mode, and the loading structure includes: base (10); A stacking rack (20) is provided above the base (10) and is used for carrying a material box (22) filled with supports (23) to be bonded or a material tray (21) on which supports (23) to be bonded are stacked; A feeding tray (30) is provided on one side of the stacking rack (20), capable of vertically ascending and descending along the Z-axis direction relative to the stacking rack (20), and a feeding track (31) is detachably provided on its top surface for communicating with the feeding channel of the crystal bonding machine; A suction cup material taking assembly (40) is provided above the stacking rack (20) and the feeding tray (30), and is capable of moving relative to the stacking rack (20) along the X-axis direction and the Z-axis direction. In the stacking loading mode, the suction cup material taking assembly (40) is used to sequentially suck the crystal-bonding supports (23) stacked on the material tray (21) onto the feeding track (31); a material pushing box assembly (50) provided on the material stacking rack (20), and in a material box (22) loading mode, the material pushing box assembly (50) is used to push the material box (22) filled with the crystal support (23) to be bonded onto the feeding tray (30); and A material pushing assembly (60) is provided on a side of the feeding tray (30) facing away from the feeding channel of the crystal bonding machine, and is used for, in the stacking loading mode, sucking the crystal holder (23) to be bonded on the feeding track (31) by the suction cup material taking assembly (40) and pushing it into the feeding channel of the crystal bonding machine, or, in the material box loading mode, pushing the material pushing box assembly (50) from the stacking rack (20) to the crystal holder (23) to be bonded in the material box (22) on the feeding tray (30), and sequentially pushing them into the feeding channel of the crystal bonding machine; When the stacking loading mode is used for loading, the suction cup material taking component (40) sequentially sucks the crystal supports (23) to be bonded stacked on the material tray (21) onto the feeding track (31) of the feeding tray (30), and the pushing component (60) pushes the crystal supports (23) to be bonded on the feeding track (31) into the feeding channel of the crystal bonding machine, thereby realizing stacking loading; When using the material box loading mode to load materials, the feeding track (31) on the feeding tray (30) is removed, the suction cup material picking assembly (40) is moved to the side of the feeding tray (30) away from the stacking rack (20), the pushing box assembly (50) pushes the material box (22) located on the stacking rack (20) onto the feeding tray (30), and the pushing assembly (60) pushes the crystal bracket (23) to be bonded in the material box (22) into the feeding channel of the crystal bonding machine in sequence to realize the loading of the material box (22).

2. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 1 is characterized in that: The suction cup material picking assembly (40) includes a support plate (41) arranged on the base (10), an X-axis movable seat (42) slidably arranged on the support plate (41), a Z-axis fixed seat (43) fixedly arranged on the X-axis movable seat (42), a Z-axis lifting frame (44) slidably arranged on the Z-axis fixed seat (43), and a suction cup group (45) arranged on the Z-axis lifting frame (44), wherein the support plate (41) is arranged along the X-axis direction and the support plate (41) is located above the stacking rack (20), the X-axis movable seat (42) can move left and right along the length direction of the support plate (41), the Z-axis fixed seat (43) is arranged along the Z-axis direction, the Z-axis lifting frame (44) can move up and down along the length direction of the Z-axis fixed seat (43), and the suction cup group (45) is used to suck the crystal-bonding supports (23) stacked on the material tray (21).

3. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 2 is characterized in that: The suction cup material picking assembly (40) further includes an X-axis driving member (46) for driving the X-axis movable seat (42) to move left and right along the length direction of the support plate (41), and a Z-axis driving member (47) for driving the Z-axis lifting frame (44) to move up and down along the length direction of the Z-axis fixed seat (43).

4. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 3 is characterized in that: The X-axis driving member (46) includes an X-axis screw rod (461) rotatably arranged on the support plate (41) and arranged along the length direction of the support plate (41), an X-axis nut seat (462) threadedly sleeved on the X-axis screw rod (461) and fixedly connected to the X-axis moving seat (42), an X-axis guide rail (463) arranged along the length direction of the support plate (41) and slidingly matched with the X-axis moving seat (42), and an X-axis driving motor (464) for driving the X-axis screw rod (461) to rotate; The Z-axis driving member (47) comprises a Z-axis screw rod (471) rotatably arranged on the Z-axis fixing seat (43) and arranged along the length direction of the Z-axis fixing seat (43), a Z-axis nut seat (472) threadedly sleeved on the Z-axis screw rod (471) and fixedly connected to the Z-axis lifting seat (113), a Z-axis guide rail (473) arranged along the length direction of the support plate (41) and slidingly matched with the Z-axis lifting frame (44), and a Z-axis driving motor (474) for driving the Z-axis screw rod (471) to rotate.

5. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 1 is characterized in that: The pushing box assembly (50) includes a pushing frame (51) slidably arranged on the stacking frame (20), a pushing block (52) arranged on the pushing frame (51), and a pushing box cylinder (53) for driving the pushing frame (51) to move toward or away from the feeding tray (30). The pushing frame (51) can slide along the length direction of the stacking frame (20) toward or away from the feeding tray (30). The pushing block (52) protrudes from the stacking frame (20) and abuts against the material box (22) filled with the crystal support (23) to be fixed. The pushing box cylinder (53) is arranged along the length direction of the stacking frame (20), and the piston rod of the pushing box cylinder (53) is fixedly connected to the pushing frame (51).

6. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 1 is characterized in that: A carrier frame (11) for carrying a feeding tray (30) is vertically provided on the base (10), the feeding tray (30) is slidably provided on the side wall of the carrier frame (11), and a lifting assembly is provided on the carrier frame (11) for driving the feeding tray (30) to vertically lift and lower relative to the base (10), so that in the material box loading mode, the pushing assembly (60) can push the crystal support (23) to be bonded in the material box (22) into the feeding channel of the crystal bonding machine in sequence; The lifting assembly comprises a vertical slot (111) vertically opened on the carrier (11), a lifting screw (112) rotatably arranged in the vertical slot (111), a lifting seat (113) threadedly connected to the lifting screw (112), and a lifting motor (114) for driving the lifting screw (112) to rotate. A vertical guide rail (115) slidingly matched with the lifting seat (113) is also provided in the vertical slot (111). The feeding tray (30) is fixedly connected to the lifting seat (113), so that when the lifting motor (114) drives the lifting screw (112) to rotate, the lifting seat (113) can drive the feeding tray (30) to vertically lift relative to the base (10).

7. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 6 is characterized in that: The carrier (11) is provided with a clamping assembly (70) for clamping the material box (22) so that the material box (22) can be stably positioned on the feeding tray (30); The clamping assembly (70) includes a sliding frame (71) slidably arranged on the top surface of the carrier (11), an abutting plate (72) arranged on the side of the sliding frame (71) close to the feeding tray (30), a first limiting strip (73) and a second limiting strip (74) respectively arranged on the sliding frame (71) and the abutting plate (72), and a clamping cylinder (75) arranged on the second limiting strip (74), wherein the sliding frame (71) can move relative to the carrier (11) toward or away from the feeding tray (30), the abutting plate (72) is used to abut against the material box (22), the first limiting strip (73) and the second limiting strip (74) cooperate to clamp the material box (22), and the clamping cylinder (75) is used to abut one side of the material box (22) so as to abut the other side of the material box (22) against the first limiting strip (73).

8. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 6 is characterized in that: The stacking rack (20) is also provided with a pressing assembly (80) for pressing the material box (22) against the abutting plate (72). The pressing assembly (80) includes a pressing cylinder (81) arranged along the length direction of the stacking rack (20) and a pressing block (82) arranged on the pressing cylinder (81). When the pushing assembly (60) pushes the material box (22) from the stacking rack (20) to the feeding tray (30), the pressing cylinder (81) is actuated and presses the material box (22) against the abutting plate (72).

9. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 1 is characterized in that: The pushing assembly (60) includes a mounting plate (61) fixed on the carrier (11), a pushing cylinder (62) provided on the mounting plate (61), and a push rod (63) provided on the pushing cylinder (62); the pushing cylinder (62) is located on the side of the feeding push plate away from the feeding channel of the crystal bonding machine, and the push rod (63) is flush with the crystal bonding bracket (23) to be bonded in the material box (22).

10. The novel semiconductor IC integrated circuit bracket feeding structure according to claim 1, characterized in that: A material receiving rack (12) for collecting empty material boxes (22) is provided between the material stacking rack (20) and the base (10), and a material receiving box (22) assembly for pushing the empty material boxes (22) from one end of the material receiving rack (12) to the other end is provided on the base (10); The material receiving box (22) assembly includes a movable frame (91) slidably arranged on the base (10) and a material receiving cylinder (92) for driving the movable frame (91) to move toward or away from the material receiving frame (12). The movable frame (91) is used to push the empty material box (22) to move along the length direction of the material receiving frame (12) so that the empty material box (22) can be pushed from one end of the material receiving frame (12) to the other end of the material receiving frame (12).

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