Wafer platform

Abstract

The utility model discloses a wafer platform, which comprises a base, a working disc, a driving mechanism and a hinge mechanism, the working disc and the base are arranged at an interval along a first direction, the driving mechanism is respectively connected with the base and the working disc, and the driving mechanism can drive the working disc to move relative to the base along the first direction and can also drive the working disc to rotate around a second direction. The hinge mechanism is connected with the base and the working disc and used for limiting the working disc, and the second direction is any direction perpendicular to the first direction. Through the arrangement of the hinge mechanism, the work of the hinge mechanism is stable and free of friction, the hinge mechanism can deform in the working direction and is large in rigidity in other directions, and when the driving mechanism drives the working disc, due to the fact that the hinge mechanism is connected with the working disc and guides and limits the working disc through the hinge mechanism, it is guaranteed that the working disc moves stably and free of friction; therefore, the height and the angle of the wafer on the working disc can be conveniently and accurately adjusted, and manual intervention and errors are reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing, especially relates to a wafer platform. BACKGROUND

[0002] In the semiconductor manufacturing process, the position precision of wafer has important influence to the subsequent process steps such as photoetching, etching, packaging etc. The traditional wafer position adjustment method mostly adopts mechanical clamp or manual adjustment, often there are problems such as insufficient precision, long adjustment time, easy to introduce pollution etc. With the continuous development of semiconductor technology, the requirement of wafer position adjustment precision is higher and higher, therefore it is particularly important to develop high-precision wafer platform. SUMMARY

[0003] In view of the prior art deficiency, the utility model discloses a wafer platform.

[0004] In order to realize the above-mentioned purpose, the technical scheme provided by an embodiment of the utility model is as follows:

[0005] A wafer platform comprises:

[0006] A base;

[0007] A work disc is arranged spaced apart from the base along a first direction;

[0008] A driving mechanism is connected to the base and the work disc respectively, and the driving mechanism can drive the work disc to move relative to the base along the first direction, and the driving mechanism can also drive the work disc to rotate around a second direction;

[0009] A hinge mechanism is connected to the base and the work disc respectively, and the hinge mechanism is used for limiting the work disc;

[0010] The second direction is any direction perpendicular to the first direction.

[0011] As a further improvement of the utility model, the hinge mechanism comprises an outer connecting assembly, an inner connecting assembly and a connecting hinge assembly, the outer connecting assembly is connected to the work disc, the inner connecting assembly is connected to the base, the connecting hinge assembly is connected between the outer connecting assembly and the inner connecting assembly, and the connecting hinge assembly is used for limiting the outer connecting assembly.

[0012] As a further improvement of the utility model, the outer connecting assembly further includes three outer hinges, each outer hinge is connected with a corresponding outer connecting piece, and two ends of each outer hinge are connected with the first ends of two adjacent connecting hinges; and / or the inner connecting assembly further includes three inner hinges, each inner hinge is connected with a corresponding inner connecting piece, and two ends of each inner hinge are connected with the second ends of two adjacent connecting hinges.

[0013] As a further improvement of the utility model, the outer connecting assembly further includes three outer hinges, each outer hinge is connected with a corresponding outer connecting piece, and two ends of each outer hinge are connected with the first ends of two adjacent connecting hinges; and / or the inner connecting assembly further includes three inner hinges, each inner hinge is connected with a corresponding inner connecting piece, and two ends of each inner hinge are connected with the second ends of two adjacent connecting hinges.

[0014] As a further improvement of the utility model, the hinge mechanism further includes a mounting column, two ends of the mounting column along the first direction are connected with the base and the inner connecting assembly respectively.

[0015] As a further improvement of the utility model, the driving mechanism includes three driving assemblies, the three driving assemblies are arranged at intervals along the circumference of the working disc, and the three driving assemblies are connected with the base and the working disc respectively; an installation space is formed between each outer connecting piece and two corresponding connecting hinges, and each driving assembly is arranged in a corresponding installation space.

[0016] As a further improvement of the utility model, the driving assembly includes a motor and a supporting plate, the motor is connected with the base and the supporting plate respectively, the supporting plate is further connected with the working disc, and the motor can drive the supporting plate and the working disc to move along the first direction.

[0017] As a further improvement of the utility model, still include buffer disc, the one side of buffer disc away from the base is connected with the work disc, the one side of buffer disc towards the base is connected with the hinge mechanism, and / or still include counterweight mechanism, the counterweight mechanism is connected with the base and the work disc respectively, and / or still include reading assembly, the reading assembly is connected with the base and the hinge mechanism, and the reading assembly is used for reading the position value of the work disc, and / or still include limiting assembly, the limiting assembly is connected with the base and the work disc respectively, and the limiting assembly is used for limiting the work disc.

[0018] As a further improvement of the utility model, still include reading head and grating ruler, the reading head is installed on the base, the grating ruler is arranged along the first direction in the hinge mechanism, and the reading head is used for reading the position value of the grating ruler.

[0019] As a further improvement of the utility model, still include connecting block and two limiting blocks, the two limiting blocks are arranged along the first direction and are spaced apart, and the connecting block is arranged between the two limiting blocks, the connecting block is connected to the side of the work disc towards the base, and the connecting block can move between the two limiting blocks.

[0020] The utility model has the advantages of:

[0021] The utility model discloses a hinge mechanism is arranged, and the hinge mechanism is stable and has no friction, and the hinge mechanism can be deformed in the working direction, and the rigidity is big in other directions, when the driving mechanism drives the work disc, since the hinge mechanism is connected with the work disc, the work disc is guided and limited through the hinge mechanism, the movement of the work disc is stable and has no friction, thereby the height and angle of the wafer on the work disc can be adjusted accurately, the wafer adjustment time is saved, the precision and efficiency of wafer adjustment are greatly improved, and manual intervention and error are reduced. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description, and obviously, the drawings in the following description are only some embodiments in the utility model, and for those skilled in the art, other drawings can be obtained without creative labor under the premise of the drawings.

[0023] Figure 1 The structural schematic diagram of the shell of the embodiment of the utility model is set up;

[0024] Figure 2 The structural schematic diagram of the embodiment of the utility model is set up;

[0025] Figure 3 is a top view of the embodiment of the utility model; Figure 2

[0026] Figure 4 is structural schematic view of the embodiment of the utility model when work disc is not set;

[0027] Figure 5 is structural schematic view of the embodiment of the utility model when hinge mechanism and work disc are not set;

[0028] Figure 6 is structural schematic view of the hinge mechanism and reading component of the embodiment of the utility model;

[0029] Figure 7 is a top view of the embodiment of the utility model; Figure 5

[0030] Figure 8 is structural schematic view of the connecting hinge of the embodiment of the utility model is connected with outer hinge, inner hinge respectively;

[0031] Figure 9 is structural schematic view of the base of the embodiment of the utility model is set drive mechanism, buffer disc is set through hole;

[0032] In the drawing: 1, base, 101, base body, 102, lug, 11, cooling seat, 12, passage, 13, quick connector, 14, shell, 2, work disc, 21, circular arc surface, 22, straight surface, 3, drive mechanism, 31, drive assembly, 311, motor, 312, support plate, 4, hinge mechanism, 41, outer connecting assembly, 411, outer connecting piece, 4111, outer arc plate, 4112, recess, 4113, protruding part, 412, outer hinge, 42, inner connecting assembly, 421, inner connecting piece, 422, inner hinge, 43, connecting hinge assembly, 431, connecting hinge, 4311, first end, 4312, second end, 441, first arc slot, 442, second arc slot, 45, mounting column, 5, buffer disc, 51, through hole, 6, counterweight mechanism, 8, reading component, 81, reading head, 82, grating ruler, 83, reading head mounting seat, 84, patch piece, 9, limiting assembly, 91, connecting block, 92, limiting block, 93, limiting seat, 10, shell. DETAILED DESCRIPTION

[0033] ​​In order for the person skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the present application.

[0034] Please refer to Figure 1 and Figure 2 The embodiment of the present application discloses a wafer platform, which comprises a base 1, a worktable 2, a driving mechanism 3 and a hinge mechanism 4. The worktable 2 is arranged in a spaced manner along a first direction with the base 1. The driving mechanism 3 is connected with the base 1 and the worktable 2 respectively, and the driving mechanism 3 can drive the worktable 2 to move along the first direction relative to the base 1, and the driving mechanism 3 can also drive the worktable 2 to rotate around a second direction. The hinge mechanism 4 is connected with the base 1 and the worktable 2 respectively, and the hinge mechanism 4 is used for limiting the worktable 2. Wherein, the second direction is any direction perpendicular to the first direction. The first direction is the Z-axis direction in Figure 4 , and the second direction is any direction in the XY plane in Figure 4 .

[0035] Please refer to Figure 2 and Figure 3 The base 1 comprises a base body 101 and three supporting lugs 102 connected with the base body 101, and the three supporting lugs 102 are arranged in a spaced manner along the circumference of the base body 101. The driving mechanism 3 is connected with the base body 101, and the supporting lug 102 is arranged to facilitate the mounting of the wafer platform on other components. Wherein, the cross section of the base body 101 is a polygon, and the cross section of the base body 101 is parallel to the XY plane.

[0036] It can be understood that in some other embodiments, the number of supporting lugs 102 can be set according to actual needs, such as one, two, four, etc., which is not limited herein. In some other embodiments, the cross-sectional shape of the base body 101 can also be set according to actual needs, such as a triangle, a circle, etc., which is not limited herein.

[0037] The cross section of the worktable 2 is a polygon, and the cross section of the worktable 2 is parallel to the XY plane. Specifically, the outer side surface of the worktable 2 comprises three arc surfaces 21 and three straight surfaces 22, and the arc surfaces 21 and the straight surfaces 22 are connected alternately. Wherein, the outer side surface of the worktable 2 is perpendicular to the XY plane. It can be understood that in some other embodiments, the cross-sectional shape of the worktable 2 can be set according to actual needs, such as a triangle, a circle, etc., which is not limited herein.

[0038] Please refer toFigure 2 to Figure 4 The driving mechanism 3 comprises three driving assemblies 31, which are arranged along the circumference of the work disc 2 and are connected to the base 1 and the work disc 2 respectively. The three driving assemblies 31 can jointly drive the work disc 2 to move along the first direction, so as to adjust the height of the work disc 2 along the Z-axis direction; and the three driving assemblies 31 can also drive the work disc 2 to rotate around any second direction, so as to adjust the inclination angle of the work disc 2 relative to the XY plane.

[0039] In some embodiments, each driving assembly 31 comprises a motor 311 and a support plate 312, the motor 311 is connected to the base 1 and the support plate 312 respectively, and the support plate 312 is further connected to the work disc 2, and the motor 311 can drive the support plate 312 and the work disc 2 to move along the first direction. The power provided by the three motors 311 is transmitted to the work disc 2 through the corresponding three support plates 312. When the three motors 311 drive the work disc 2 to move along the first direction by the same distance, the height adjustment of the work disc 2 along the first direction can be realized; when the three motors 311 drive the work disc 2 to move along the first direction by different distances, the angle adjustment of the work disc 2 around the second direction can be realized.

[0040] In the present embodiment, the motor 311 is taken as an example for illustration.

[0041] In some embodiments, the base 1 is provided with three cooling seats 11 along the circumference, and each motor 311 is arranged on a corresponding cooling seat 11. Each cooling seat 11 is provided with a channel 12, and the outlet of the channel 12 is arranged on the side of the cooling seat 11 facing the motor 311. The cooling seat 11 is further provided with a quick connector 13 communicating with the channel 12. Cold air can be injected into the channel 12 through the quick connector 13 to cool the motor 311 of the driving assembly 31 during operation.

[0042] In some embodiments, the hinge mechanism 4 comprises an outer connecting assembly 41, an inner connecting assembly 42 and a connecting hinge assembly 43. The outer connecting assembly 41 is connected to the work disc 2, the inner connecting assembly 42 is connected to the base 1, and the connecting hinge assembly 43 is connected between the outer connecting assembly 41 and the inner connecting assembly 42, and is used for limiting the outer connecting assembly 41.

[0043] Please refer to Figure 6 to Figure 8In some embodiments, the outer connecting assembly 41 comprises three outer connecting pieces 411, which are respectively arranged along the circumference of the working disc 2 and connected to the working disc 2. The inner connecting assembly 42 comprises three inner connecting pieces 421, which are respectively arranged along the circumference of the working disc 2 and connected to the base 1. The connecting hinge assembly 43 comprises six connecting hinges 431, which are respectively arranged along the circumference of the working disc 2, each of the connecting hinges 431 comprises a first end 4311 and a second end 4312 arranged in a radial direction of the working disc 2. The three outer connecting pieces 411 are arranged around the outer periphery of the three inner connecting pieces 421, each of the first ends 4311 of two adjacent connecting hinges 431 is connected to a corresponding outer connecting piece 411, and each of the second ends 4312 of the two adjacent connecting hinges 431 is connected to a corresponding inner connecting piece 421. Specifically, the outer connecting piece 411 comprises an outer arc-shaped plate 4111 and recesses 4112 arranged on the outer arc-shaped plate 4111, and the recesses 4112 are arranged in a spaced manner, and the recesses 4112 between adjacent recesses 4112 are protrusions 4113. The protrusions 4113 are connected to the working disc 2. The inner connecting piece 421 is arc-shaped. The connecting hinge 431 is plate-shaped, and the width of the connecting hinge 431 gradually decreases from the first end 4311 to the second end 4312. This facilitates the deformation of the hinge mechanism 4 in the working direction while ensuring the stability of the deformation.

[0044] The outer connecting assembly 41 further comprises three outer hinges 412, each of which is connected to a corresponding outer connecting piece 411, and the two ends of each outer hinge 412 are connected to the first ends 4311 of two adjacent connecting hinges 431. The inner connecting assembly 42 further comprises three inner hinges 422, each of which is connected to a corresponding inner connecting piece 421, and the two ends of each inner hinge 422 are connected to the second ends 4312 of two adjacent connecting hinges 431. Specifically, the outer hinge 412 is arc-shaped, the outer connecting piece 411 is stacked on the outer hinge 412 in a first direction, and the recesses 4112 of the outer connecting piece 411 are fixed on the outer hinge 412. The inner hinge 422 is arc-shaped, the inner connecting piece 421 is stacked on the inner hinge 422 in the first direction and connected to the inner hinge 422.

[0045] The first arc-shaped slot 441 is arranged at the connection position of the outer hinge 412 and the first end 4311 of the connecting hinge 431, and the second arc-shaped slot 442 is arranged at the connection position of the inner hinge 422 and the connecting hinge 431. The deformation size of the hinge mechanism 4 can be adjusted by changing the sizes of the first arc-shaped slot 441 and the second arc-shaped slot 442, and the adjustment is convenient and fast. In detail, when the sizes of the first arc-shaped slot 441 and the second arc-shaped slot 442 increase, the rigidity of the first arc-shaped slot 441 and the second arc-shaped slot 442 decreases, and the deformation capacity of the first arc-shaped slot 441 and the second arc-shaped slot 442 increases; when the sizes of the first arc-shaped slot 441 and the second arc-shaped slot 442 decrease, the rigidity of the first arc-shaped slot 441 and the second arc-shaped slot 442 increases, and the deformation capacity of the first arc-shaped slot 441 and the second arc-shaped slot 442 decreases.

[0046] In some embodiments, in order to facilitate the connection between the hinge mechanism 4 and the base 1, the hinge mechanism 4 further comprises a mounting column 45, and the two ends of the mounting column 45 along the first direction are connected to the base 1 and the inner connecting assembly 42, respectively. The number of the mounting column 45 is three, and the three mounting columns 45 are arranged at intervals along the circumference of the worktable 2, and one end of each of the three mounting columns 45 along the first direction is connected to the base 1, and the other end of each of the three mounting columns 45 along the first direction is connected to a corresponding inner hinge 422. Specifically, each inner hinge 422 is arranged on a corresponding mounting column 45 along the first direction, and each inner connecting piece 421 is arranged on a corresponding inner hinge 422 along the first direction, and the inner connecting piece 421, the inner hinge 422 and the mounting column 45 are connected together.

[0047] It can be understood that in some other embodiments, the number of the mounting column 45 can also be set according to actual needs, for example, the mounting column 45 can be one, two, four, etc., and two or more inner hinges 422 can be connected to the same mounting column 45, or one inner hinge 422 can be connected to multiple mounting columns 45, and the number of the mounting column 45 is not limited herein.

[0048] Please refer to Figure 9 The wafer platform further comprises a buffer disc 5, and one side of the buffer disc 5 away from the base 1 is connected to the worktable 2, and the other side of the buffer disc 5 facing the base 1 is connected to the hinge mechanism 4. The buffer disc 5 and the worktable 2 are independently processed and then assembled together, so as to ensure the high precision of the working surface of the worktable 2. The worktable 2 and the buffer disc 5 can be connected together by screws, and are approximately integrated, so as to maintain the same movement posture. The buffer disc 5 and the protruding part 4113 of the outer connecting piece 411 are connected together, so as to realize the connection between the hinge mechanism 4 and the worktable 2 through the buffer disc 5. In order to facilitate the connection between the driving mechanism 3 and the worktable 2, three through holes 51 are arranged on the buffer disc 5 along the circumference, and the supporting plate 312 of each driving assembly 31 passes through a corresponding through hole 51 and is connected to the worktable 2.

[0049] Please refer to Figure 4 and Figure 5 In some embodiments, the wafer platform further comprises a counterweight mechanism 6 connected to the base 1 and the worktable 2 respectively. In the present embodiment, the counterweight mechanism 6 can provide a force equal in magnitude and opposite in direction to the gravity of the load on the worktable 2, avoiding the influence of the load on the worktable 2 on the adjustment accuracy of the driving mechanism 3 and improving the adjustment efficiency. Specifically, in the present embodiment, the counterweight mechanism 6 is a magnetic spring, and different magnetic forces of the magnetic spring are selected to achieve the counterweight function, suitable for wafers or other workpieces of different sizes. It can be understood that the counterweight mechanism 6 is not limited to the above structure, and in some other embodiments, the counterweight mechanism 6 can be set according to actual needs, such as air cylinders, hydraulic cylinders, motors, etc.

[0050] In some embodiments, the wafer platform further comprises a reading assembly 8 mounted on and connected to the base 1, and the reading assembly 8 is connected to the hinge mechanism 4, and the reading assembly 8 is used to read the position value of the worktable 2. Please refer to Figure 5 , the reading assembly 8 comprises a reading head 81 and a grating ruler 82, the reading head 81 is mounted on the base 1, and the grating ruler 82 is arranged along the first direction on the hinge mechanism 4, and the reading head 81 is used to read the position value of the grating ruler 82. Specifically, the base 1 is fixed with a reading head mounting seat 83, the reading head 81 is connected to the reading head mounting seat 83, the outer connecting piece 411 is connected with a patch piece 84, and the grating ruler 82 is connected to the patch piece 84. The reading head 81 and the grating ruler 82 are correspondingly arranged, which facilitates reading the position of the hinge mechanism 4 at any time and feeding back the position of the worktable 2 in time.

[0051] In some embodiments, the wafer platform further comprises a limiting assembly 9 connected to the base 1 and the worktable 2 respectively, and the limiting assembly 9 is used to limit the worktable 2. The limiting assembly 9 comprises a connecting block 91 and two limiting blocks 92, the two limiting blocks 92 are arranged in the first direction and spaced apart, and the connecting block 91 is arranged between the two limiting blocks 92. The connecting block 91 is connected to one side of the worktable 2 facing the base 1, and the connecting block 91 can move between the two limiting blocks 92. In order to facilitate the arrangement of the two limiting blocks 92, the base 1 is provided with a limiting seat 93, and the two limiting blocks 92 are arranged in the first direction and spaced apart on the limiting seat 93. Specifically, the connecting block 91 is connected to the buffer disc 5. The limiting position of the entire wafer platform is controlled through the cooperation of the connecting block 91 and the two limiting blocks 92, so that the deformation caused by the driving force of the driving mechanism 3 is within the allowable range of the deformation of the hinge mechanism 4, preventing excessive deformation from causing the hinge mechanism 4 to fail and ensuring the safety performance of the hinge mechanism 4.

[0052] Please refer to Figure 1In some embodiments, the wafer platform further comprises a housing 10, one end of the housing 10 is connected to the base 1, the housing 10 and the base 1 jointly enclose a mounting space, the driving mechanism 3 and the hinge mechanism 4 are at least partially arranged in the mounting space, and the counterweight mechanism 6, the reading assembly 8 and the limiting assembly 9 are all arranged in the mounting space. The buffer disc 5 is arranged on the side of the housing 10 away from the base 1, and a gap is arranged between the buffer disc 5 and the housing 10, so that the buffer disc 5 can move or rotate relative to the housing 10.

[0053] The utility model discloses in using, by three motor 311 provides power, through corresponding three support board 312, power transmission to work disc 2. When the output of three motor 311 lifts to the same height, can realize the motion of work disc 2 along the first direction, thereby realizes the height adjustment of the wafer placed on work disc 2, when the output of three motor 311 lifts the height is different, then work disc 2 and the angle between the second direction exist, realize the angle adjustment of work disc 2 around the second direction, thereby realize the angle adjustment of the wafer placed on work disc 2. When driving mechanism 3 drives work disc 2, through hinge mechanism 4 for work disc 2 guide and limit, guarantee the motion of work disc 2 smooth and no friction, thereby facilitate the height and angle adjustment of the wafer on work disc 2 accurately.

[0054] For those skilled in the art, it is obvious that the utility model is not limited to the details of the above-mentioned exemplary embodiments, and can be realized in other specific forms without departing from the spirit or basic characteristics of the utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, the scope of the utility model is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the utility model. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0055] In addition, it should be understood that, although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be combined appropriately to form other embodiments that those skilled in the art can understand.

Claims

1. A wafer platform, characterized in that: include: base; A working disk is spaced apart from the base along a first direction; a driving mechanism connected to the base and the working disk, respectively, wherein the driving mechanism can drive the working disk to move relative to the base along the first direction, and can also drive the working disk to rotate around the second direction; A hinge mechanism, wherein the hinge mechanism connects the base and the working disk respectively, and the hinge mechanism is used to limit the working disk; The second direction is any direction perpendicular to the first direction.

2. The wafer platform according to claim 1, characterized in that: The hinge mechanism includes an external connecting component, an internal connecting component and a connecting hinge component. The external connecting component is connected to the working disk, the internal connecting component is connected to the base, the connecting hinge component is connected between the external connecting component and the internal connecting component, and the connecting hinge component is used to limit the external connecting component.

3. The wafer platform according to claim 2, characterized in that: The external connection assembly includes three external connection members, which are respectively arranged at intervals along the circumference of the working disk and are respectively connected to the working disk; The inner connection assembly includes three inner connection members, which are spaced apart along the circumference of the working disk and are respectively connected to the base; The connecting hinge assembly includes six connecting hinges, and the six connecting hinges are respectively arranged at intervals along the circumference of the working disk, and each of the connecting hinges includes a first end and a second end that are arranged opposite to each other along the radial direction of the working disk; The three outer connecting members are arranged around the outer periphery of the three inner connecting members, the first ends of each two adjacent connecting hinges are respectively connected to a corresponding outer connecting member, and the second ends of each two adjacent connecting hinges are respectively connected to a corresponding inner connecting member.

4. The wafer platform according to claim 3, characterized in that: The external connection assembly further comprises three external hinges, each of the external hinges being connected to a corresponding one of the external connection members, and both ends of each external hinge being connected to the first ends of two adjacent connection hinges; and / or The inner connection assembly further includes three inner hinges, each of the inner hinges is connected to a corresponding inner connection member, and both ends of each inner hinge are connected to the second ends of two adjacent connection hinges.

5. The wafer platform according to claim 2, characterized in that: The hinge mechanism further includes a mounting post, with two ends of the mounting post along the first direction respectively connected to the base and the inner connecting assembly.

6. The wafer platform according to claim 3, characterized in that: The driving mechanism includes three driving assemblies, which are arranged at intervals along the circumference of the working disk and are respectively connected to the base and the working disk; An installation space is formed between each of the external connecting members and the corresponding two connecting hinges, and each of the driving components is arranged in a corresponding installation space.

7. The wafer platform according to claim 6, characterized in that: The driving assembly includes a motor and a support plate. The motor is connected to the base and the support plate respectively. The support plate is also connected to the working disk. The motor can drive the support plate and the working disk to move along the first direction.

8. A wafer platform according to any one of claims 1 to 7, characterized in that: It also includes a buffer tray, wherein a side of the buffer tray facing away from the base is connected to the working tray, and a side of the buffer tray facing the base is connected to the hinge mechanism; and / or It also includes a counterweight mechanism, wherein the counterweight mechanism is respectively connected to the base and the working disk; and / or It also includes a reading component, the reading component is connected to the base and the hinge mechanism, and the reading component is used to read the position value of the working disk; and / or It also includes a limiting component, which is respectively connected to the base and the working disk, and is used to limit the working disk.

9. A wafer platform according to any one of claims 1 to 7, characterized in that: It also includes a reading head and a grating ruler. The reading head is installed on the base. The grating ruler is set on the hinge mechanism along the first direction. The reading head is used to read the position value of the grating ruler.

10. A wafer platform according to any one of claims 1 to 7, characterized in that: It also includes a connecting block and two limiting blocks, wherein the two limiting blocks are spaced apart along the first direction, and the connecting block is arranged between the two limiting blocks; The connecting block is connected to a side of the working disk facing the base, and the connecting block can move between the two limiting blocks.

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