Ejector pin and wafer drying device

Abstract

The utility model relates to the field of wafer cleaning and drying, and discloses an ejector pin and a wafer drying device.The ejector pin comprises an ejector pin body, the ejector pin body comprises a first end and a second end which are opposite, and the first end is used for making contact with a wafer; the first drainage hole is formed in the first end; the second drainage hole is formed in the second end, the second drainage hole is communicated with the first drainage hole, and the hole diameter of the second drainage hole is larger than that of the first drainage hole. By adopting the ejector pin disclosed by the invention, a small part of cleaning liquid left between one end, in contact with the wafer, of the ejector pin and the wafer can be sucked out through siphonage, and the part, in contact with the ejector pin, of the wafer has no water spot after the wafer is dried, so that pollution to the wafer is reduced, and the performance and reliability of the wafer are ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of wafer cleaning and drying, and particularly relates to a top pin and a wafer drying device. BACKGROUND

[0002] In the semiconductor manufacturing process, chemical mechanical polishing (CMP) is a process step for flattening the wafer surface to ensure the accuracy of subsequent photolithography and etching steps. However, during the CMP process, tiny particles and chemical residues may be left on the wafer surface, which may cause the chip performance to decrease or even fail if not thoroughly cleaned. The cleaning process of the wafer usually needs multiple cleaning steps and complete drying to be completed. In the vertical Marangoni pulling drying technology used in the related art cleaning process, the wafer is usually lifted out of the cleaning liquid by a top pin, and nitrogen containing a certain concentration of isopropyl alcohol is sprayed to the interface between the wafer and the water surface by a jetting member arranged outside the water surface, so that a tension gradient is generated at the boundary between the wafer surface and the water surface when the wafer leaves the water surface, and then the cleaning liquid remaining on the wafer surface is pulled to the water surface, achieving complete drying.

[0003] However, in the related art, when the top pin lifts the wafer, a small amount of cleaning liquid may remain between the end of the top pin in contact with the wafer and the wafer. During the drying process, the vertical Marangoni pulling drying technology is difficult to dry the remaining cleaning liquid, so that when the wafer completely leaves the water surface and is taken away by the upper clamping mechanism, a water stain point may be left on the bottom of the wafer, which pollutes the wafer and affects the performance and reliability of the wafer. CONTENT OF THE INVENTION

[0004] Embodiments of the present application disclose a top pin and a wafer drying device, which can suck out the small amount of cleaning liquid remaining between the end of the top pin in contact with the wafer and the wafer through the siphon phenomenon, so that there is no water stain point on the part of the wafer in contact with the top pin after the wafer drying is completed, reducing the pollution to the wafer, and thus ensuring the performance and reliability of the wafer.

[0005] To achieve the above-mentioned purpose, in a first aspect, embodiments of the present application disclose a top pin for supporting a wafer, comprising:

[0006] a top pin body, the top pin body comprising opposite first and second ends, the first end being configured to contact the wafer;

[0007] a first drainage hole, the first drainage hole being arranged at the first end;

[0008] a second drainage hole, the second drainage hole being arranged at the second end, the second drainage hole being in communication with the first drainage hole, and the second drainage hole having a larger hole diameter than the first drainage hole.

[0009] As an optional implementation, the first drainage hole is multiple, and the multiple first drainage holes are arranged near the part of the first end in contact with the wafer.

[0010] As an optional implementation, the first end includes a first inclined surface and a second inclined surface, the first inclined surface and the second inclined surface intersect near one end of the wafer and form an intersection line, the intersection line is used to contact the wafer, and multiple first drainage holes are arranged on both sides of the intersection line and tangent to the intersection line.

[0011] As an optional implementation, the multiple first drainage holes are respectively arranged on both sides of the intersection line, and the positions of the multiple first drainage holes tangent to the intersection line are different.

[0012] As an optional implementation, the angle between the first inclined surface and the second inclined surface is 30°-60°.

[0013] As an optional implementation, the aperture of the first drainage hole is 0.1mm-0.5mm, and the aperture of the second drainage hole is 3mm-5mm.

[0014] As an optional implementation, the ejector pin further includes a mounting groove, the mounting groove is arranged on the outer wall of the ejector pin body and is arranged along the circumference of the ejector pin body, and the mounting groove is used to mount a sealing ring.

[0015] In a second aspect, the embodiments of the present application disclose a wafer drying device, which comprises:

[0016] A box body, the box body is used to accommodate cleaning liquid;

[0017] A gas jetting member, the gas jetting member is arranged outside the box body, and the gas jetting member can jet out gas used for drying the wafer;

[0018] A support, the support is movably arranged in the box body;

[0019] The ejector pin of the first aspect, the ejector pin is arranged on the support;

[0020] A driving member, the driving member is connected with the support, and the driving member can drive the support to move between a cleaning station and a drying station.

[0021] As an optional implementation, the bracket is provided with a mounting portion, the mounting portion is provided with a mounting hole, the mounting hole penetrates the mounting portion, an inner wall of the mounting hole is provided with a stop portion, the stop portion divides the mounting hole into a first hole section and a second hole section, the second end of the ejector pin is mounted in the first hole section and abuts against the stop portion, and the first end of the ejector pin is arranged outside the mounting hole.

[0022] As an optional implementation, the second hole section has a hole diameter larger than that of the first hole section.

[0023] As an optional implementation, the second hole section has a hole diameter of 12-16 mm.

[0024] As an optional implementation, the ejector pin further comprises a mounting groove arranged on an outer wall of the ejector pin and arranged along a circumferential direction of the ejector pin, and the wafer drying device further comprises a sealing ring arranged in the mounting groove and abutting against a hole wall of the mounting hole.

[0025] As an optional implementation, the bracket is provided with a rolling member, and the box body is provided with a sliding groove, and the rolling member is in rolling cooperation with the sliding groove.

[0026] Compared with the prior art, the application has the following beneficial effects:

[0027] The ejector pin for supporting a wafer provided by the application comprises an ejector pin body, the ejector pin body comprises opposite first and second ends, the first end is used for contacting the wafer, a first drainage hole is arranged on the first end, a second drainage hole is arranged on the second end, the second drainage hole is in communication with the first drainage hole, and the second drainage hole has a hole diameter larger than that of the first drainage hole. When the ejector pin supports the wafer to move away from the cleaning liquid, the cleaning liquid in the second drainage hole flows downward due to gravity, and a low-pressure area is formed in the upper part of the second drainage hole. The low-pressure second drainage hole can suck the cleaning liquid in the first drainage hole downward. When the cleaning liquid in the first drainage hole is sucked out, a low-pressure area is formed in the end of the first drainage hole close to the wafer, and the cleaning liquid between the ejector pin and the wafer is sucked out downward, so that the cleaning liquid between the ejector pin and the wafer is sucked out, water stains are eliminated, pollution to the wafer is reduced, and the performance and reliability of the wafer are ensured. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0029] Figure 1Structure diagram of the top pin disclosed in the embodiment of the present application;

[0030] Figure 2 Structure diagram of the top pin disclosed in the embodiment of the present application; Figure 1 Structure diagram of the top pin disclosed in the embodiment of the present application;

[0031] Figure 3 Structure diagram of the top pin disclosed in the embodiment of the present application; Figure 1 Structure diagram of the top pin disclosed in the embodiment of the present application;

[0032] Figure 4 Structure diagram of the top pin disclosed in the embodiment of the present application; Figure 3 Structure diagram of the top pin disclosed in the embodiment of the present application;

[0033] Figure 5 Structure diagram of the wafer drying device disclosed in the embodiment of the present application;

[0034] Figure 6 Structure diagram of the wafer drying device disclosed in the embodiment of the present application; Figure 5 Structure diagram of the wafer drying device disclosed in the embodiment of the present application;

[0035] Figure 7 Structure diagram of the wafer drying device disclosed in the embodiment of the present application; Figure 5 Structure diagram of the wafer drying device disclosed in the embodiment of the present application;

[0036] Figure 8 Structure diagram of the top pin and the support disclosed in the embodiment of the present application; Figure 5 Structure diagram of the top pin and the support disclosed in the embodiment of the present application;

[0037] Figure 9 Structure diagram of the support disclosed in the embodiment of the present application; Figure 5 Structure diagram of the support disclosed in the embodiment of the present application;

[0038] Figure 10 Structure diagram of the support disclosed in the embodiment of the present application. Figure 5 Structure diagram of the support disclosed in the embodiment of the present application.

[0039] Explanation of reference signs:

[0040] 100 - top pin; 10 - wafer; 1 - top pin body; 11 - first end; 111 - first inclined surface; 112 - second inclined surface; 113 - intersection line; 12 - second end; 13 - mounting groove; 2 - first drainage hole; 3 - second drainage hole; 200 - wafer drying device; 21 - box body; 22 - support; 221 - mounting portion; 221a - mounting hole; 2211 - stop portion; 2212 - first hole section; 2213 - second hole section; 222 - sliding portion; 2221 - rolling member; 2222 - avoiding groove; 23 - sealing ring; 24 - overturning mechanism. DETAILED DESCRIPTION

[0041] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts are within the scope of the present application.

[0042] In the present application, the positions or location relationships indicated by the terms "upper", "lower", "inner", "vertical" and the like are based on the positions or location relationships shown in the drawings. These terms are mainly used for better describing the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific position, or to be constructed and operated in a specific position.

[0043] In addition, in addition to indicating the positions or location relationships, the above-mentioned terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. Those of ordinary skill in the art can understand the specific meanings of these terms in the present application according to specific circumstances.

[0044] In addition, the terms "provided with", "provided with", "connected" should be understood broadly. For example, it can be fixedly connected, detachably connected, or integrally constructed; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication between two devices, elements or components. Those of ordinary skill in the art can understand the specific meanings of the above-mentioned terms in the present application according to specific circumstances.

[0045] In addition, the terms "first", "second" and the like are mainly used to distinguish different devices, elements or components (the specific types and structures can be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, the meaning of "multiple" is two or more.

[0046] In the semiconductor manufacturing process, chemical mechanical polishing (CMP) is a process step for flattening the wafer surface to ensure the accuracy of subsequent photolithography and etching steps. After chemical mechanical polishing, some small wafer particles and polishing liquid residues may remain on the wafer surface, which may affect the performance of the wafer or even cause the wafer to fail if not cleaned.

[0047] Existing technologies typically use vertical Marangoni pull-and-dry technology to dry wafers. During the drying process, the wafer is typically ejected from the cleaning solution by a pin. A nozzle positioned above the water surface sprays nitrogen containing a certain concentration of isopropyl alcohol toward the interface between the wafer and the cleaning solution. Because isopropyl alcohol has a lower surface tension than water, a tension gradient is generated at the boundary between the wafer and the water surface when the wafer emerges from the water. This pulls any remaining cleaning solution toward the surface, achieving complete drying.

[0048] However, during the drying process of the wafer, a small amount of cleaning liquid will remain between the end of the ejector pin that contacts the wafer and the wafer. This residual cleaning liquid is difficult to remove. When the wafer completely leaves the water surface and is taken away by the upper clamping mechanism, water stains will remain on the part of the wafer that contacts the ejector pin, contaminating the wafer and thus affecting the performance and reliability of the core wafer.

[0049] Based on this, an embodiment of the present application discloses a push pin and wafer drying device, which can suck out a small amount of cleaning liquid remaining between the end of the push pin that contacts the wafer and the wafer through a siphon phenomenon. After the wafer is dried, there are no water stains on the part of the wafer that contacts the push pin, reducing contamination of the wafer, thereby ensuring the performance and reliability of the wafer.

[0050] The technical solution of the present application will be further described below with reference to the embodiments and drawings.

[0051] See also Figures 1 to 4 , Figure 1 This is a schematic structural diagram of the ejector pin 100 disclosed in an embodiment of the present application; Figure 2 for Figure 1 A schematic diagram of the top structure of the ejector pin 100; Figure 3 for Figure 1 A schematic cross-sectional view of the ejector pin 100; Figure 4 for Figure 3 Schematic diagram of the partial structure of the ejector pin 100 at A.

[0052] The embodiment of the present application discloses an ejector pin 100 for supporting a wafer 10. The ejector pin 100 includes:

[0053] The ejector body 1 includes a first end 11 and a second end 12 opposite to each other, wherein the first end 11 is used to contact the wafer 10;

[0054] A first drainage hole 2, the first drainage hole 2 is provided at the first end 11;

[0055] The second drainage hole 3 is provided at the second end 12 . The second drainage hole 3 is communicated with the first drainage hole 2 . The aperture of the second drainage hole 3 is larger than that of the first drainage hole 2 .

[0056] Specifically, the top pin body 1 is a circular column for contacting and supporting the wafer 10; the first drainage hole 2 is arranged at the first end 11 of the top pin body 1, and is mainly used for draining the liquid remaining between the top pin body 1 and the wafer 10 when the wafer 10 contacts the top pin body 1; the second drainage hole 3 is located at the second end 12 of the top pin body 1, and is in communication with the first drainage hole 2, and the aperture of the first drainage hole 2 is greater than the aperture of the first drainage hole 2.

[0057] In an embodiment, when the top pin 100 supports the wafer 10 to leave the cleaning liquid, the cleaning liquid in the second drainage hole 3 flows downward due to gravity, the upper part of the second drainage hole 3 is caused to flow out due to the cleaning liquid, the first drainage hole 2 still has the cleaning liquid to generate a siphon effect, the cleaning liquid in the first drainage hole 2 is sucked downward due to gravity and the siphon effect, and when the cleaning liquid in the first drainage hole 2 is sucked out, the end of the first drainage hole 2 close to the wafer 10 sucks out the cleaning liquid between the top pin 100 and the wafer 10 downward, so that the cleaning liquid between the top pin 100 and the wafer 10 is sucked out.

[0058] In the top pin 100 provided in the embodiment of the present application, by arranging the first drainage hole 2 at the first end 11 and the second drainage hole 3 at the second end 12, and the aperture of the second drainage hole 3 is greater than the aperture of the first drainage hole 2, when the top pin 100 supports the wafer 10 to leave the cleaning liquid, the cleaning liquid remaining between the top pin 100 and the wafer 10 is drained by the first drainage hole 2 and the second drainage hole 3 through the siphon effect. In this way, the top pin 100 provided in the embodiment of the present application realizes draining the cleaning liquid remaining between the top pin 100 and the wafer 10, eliminates the water stain points formed after the part of the wafer 10 contacting the top pin 100 is dried, reduces the pollution to the wafer 10, and thus guarantees the performance and reliability of the wafer 10.

[0059] For example, the material of the top pin 100 can be polyether ether ketone, polypropylene or polyvinylidene fluoride, etc. which has good wear resistance, corrosion resistance, high temperature resistance and hydrophobicity. The surface energy of the hydrophobic material is relatively low, and water molecules are difficult to form stable combination on the surface of the hydrophobic material. Therefore, the attachment of the cleaning liquid on the surface of the top pin 100 can be reduced, so that the residence time of the water on the surface of the top pin 100 is reduced, the remaining cleaning liquid between the wafer 10 and the top pin 100 is reduced, the time of the cleaning liquid staying on the top pin 100 is less, the corrosion of the cleaning liquid to the top pin 100 can be reduced, the service life of the top pin 100 is prolonged, and the frequency of maintenance and replacement is reduced. The material of the top pin 100 is not limited in the embodiment of the present application.

[0060] Optionally, please refer to Figures 1 to 4The first drainage holes 2 are multiple, and the multiple first drainage holes 2 are arranged close to the part where the first end 11 contacts the wafer 10. The multiple first drainage holes 2 arranged close to the part where the first end 11 contacts the wafer 10 are to further ensure the drainage effect of the first drainage holes 2. If the first drainage holes 2 are arranged away from the part where the first end 11 contacts the wafer 10, the residual cleaning liquid between the first end 11 and the wafer 10 needs to flow downward to be drained by the first drainage holes 2, because the first drainage holes 2 are arranged away from the wafer 10, and there is a distance between the first drainage holes 2 and the wafer 10. On the other hand, the first drainage holes 2 cannot be completely covered by the residual cleaning liquid, which affects the siphon phenomenon formed by the first drainage holes 2 and the second drainage holes 3, and causes the residual cleaning liquid to be not completely removed. In contrast, the first drainage holes 2 arranged close to the wafer 10 can ensure the drainage effect of the siphon phenomenon, and can ensure the drainage efficiency of the first drainage holes 2. The multiple first drainage holes 2 can increase the drainage speed and further ensure the drainage effect.

[0061] Specifically, please refer to Figures 1 to 4 The first end 11 includes a first inclined surface 111 and a second inclined surface 112. The first inclined surface 111 and the second inclined surface 112 intersect at one end close to the wafer 10 and form an intersection line 113. The intersection line 113 is used to contact the wafer 10. The multiple first drainage holes 2 are arranged on both sides of the intersection line 113 and are tangent to the intersection line 113.

[0062] It can be understood that the first inclined surface 111 and the second inclined surface 112 included in the first end 11 can reduce the contact area between the needle 100 and the wafer 10, thereby reducing the residual cleaning liquid between the wafer 10 and the needle 100. The first inclined surface 111 and the second inclined surface 112 can also make the cleaning liquid attached to the first inclined surface 111 and the second inclined surface 112 flow down quickly. The multiple first drainage holes 2 arranged on both sides of the intersection line 113 and tangent to the intersection line 113 can more evenly disperse the liquid than the multiple first drainage holes 2 arranged on one side of the intersection line 113. The first drainage holes 2 distributed on both sides can more comprehensively cover the contact surface of the wafer 10 and the needle 100, accelerate the drainage of the residual cleaning liquid, and thus improve the drainage efficiency.

[0063] Optionally, please refer to Figures 1 to 4 The positions of the multiple first drainage holes 2 tangent to the intersection line 113 are different. It can be understood that by arranging multiple drainage holes on both sides of the intersection line 113 and making the positions of the multiple first drainage holes 2 tangent to the intersection line 113 different, multiple drainage paths can be formed on the contact surface of the wafer 10, which improves the drainage efficiency. If the positions of the multiple first drainage holes 2 are the same, it will result in a single drainage path and low drainage efficiency.

[0064] Exemplarily, the included angle between the first inclined surface 111 and the second inclined surface 112 is 30°-60°. When the included angle between the first inclined surface 111 and the second inclined surface 112 is less than 30°, the diameter of the pin 100 is reduced due to the decrease of the included angle between the first inclined surface 111 and the second inclined surface 112, and the decrease of the hole diameter of the pin 100 reduces the strength and rigidity of the pin 100, which makes it difficult to ensure that sufficient support force is provided when supporting the wafer 10, and the decrease of the diameter of the pin 100 also means that the service life of the pin 100 is reduced, which requires more frequent inspection and replacement, increasing maintenance costs and downtime.

[0065] When the included angle between the first inclined surface 111 and the second inclined surface 112 is greater than 60°, the angle formed by the first inclined surface 111 and the second inclined surface 112 and the edge of the wafer is smaller, and the volume of liquid remaining on both sides of the contact point between the wafer 10 and the pin 100 after the water surface is larger, increasing the burden of discharging the cleaning liquid.

[0066] Exemplarily, taking the included angle between the first inclined surface 111 and the second inclined surface 112 as 30° as an example, when the included angle between the first inclined surface 111 and the second inclined surface 112 is 30°, the 30° included angle can effectively reduce the contact area between the pin 100 and the wafer 10, thereby reducing the residual cleaning liquid and reducing the workload of discharging the cleaning liquid, increasing the efficiency of draining water, and the 30° included angle can reduce the contact area while maintaining sufficient rigidity of the pin 100, ensuring that the pin 100 is not easily deformed during the lifting process and maintaining good mechanical properties.

[0067] Exemplarily, taking the included angle between the first inclined surface 111 and the second inclined surface 112 as 60° as an example, when the included angle between the first inclined surface 111 and the second inclined surface 112 is 60°, compared to a smaller angle, the 60° included angle can provide better structural rigidity and is not easily deformed, ensuring the reliability of the lifting process.

[0068] Optionally, the hole diameter of the first drainage hole 2 is 0.1mm-0.5mm, and the hole diameter of the second drainage hole 3 is 3mm-5mm.

[0069] In one aspect, if the hole diameter of the first drainage hole 2 is less than 0.1mm, the slow drainage speed caused by the too small hole diameter may affect the drainage effect, and the small hole diameter is difficult to process and maintain. If the hole diameter of the first drainage hole 2 is greater than 0.5mm, since the contact part between the wafer 10 and the pin 100 is small, if the hole diameter is too large, part of the first drainage hole 2 will be located outside the contact part between the wafer 10 and the pin 100, thereby affecting the generation of the siphon phenomenon and affecting the drainage effect.

[0070] For example, taking the aperture of the first drainage hole 2 as 0.1 mm as an example, when the aperture of the first drainage hole 2 is 0.1 mm, the siphon phenomenon formed at one end of the first drainage hole 2 close to the wafer 10 has a better effect, thereby improving the drainage effect.

[0071] For example, taking the aperture of the first drainage hole 2 as 0.5 mm as an example, when the aperture of the first drainage hole 2 is 0.5 mm, the aperture of the first drainage hole 2 is larger, and the drainage speed is faster than that of the smaller aperture, and the aperture is relatively large, the processing difficulty is lower, and the maintenance difficulty is low.

[0072] On the other hand, if the diameter of the second drain hole 3 is less than 3 mm, the siphon effect within the second drain hole 3 will be affected, thereby affecting the drainage effect. If the diameter of the second drain hole 3 is greater than 5 mm, the strength and rigidity of the ejector pin 100 will be reduced, making it difficult to ensure sufficient support force when supporting the wafer 10, affecting the normal operation of the ejector pin 100 and requiring more frequent inspection and replacement, increasing maintenance costs and downtime.

[0073] For example, taking the aperture of the second drainage hole 3 as 3 mm as an example, when the aperture of the second drainage hole 3 is 3 mm, while ensuring the effect of the siphon phenomenon, the ejector pin 100 can provide better structural rigidity, is not easy to deform, and ensures the reliability of the lifting process.

[0074] For example, taking the second drainage hole 3 having a diameter of 5 mm as an example, when the diameter of the second drainage hole 3 is 5 mm, while ensuring the structural rigidity of the ejector pin 100 , the ejector pin 100 can provide a better siphon effect and increase the drainage rate.

[0075] In some embodiments, the ejector pin 100 further includes a mounting groove 13 . The mounting groove 13 is disposed on the outer wall of the ejector pin body 1 and along the circumference of the ejector pin body 1 . The mounting groove 13 is used to mount the sealing ring 23 .

[0076] Second, see Figures 5 to 7 , Figure 5 Schematic diagram of the structure of the wafer drying device 200 disclosed in the embodiment of the present application. Figure 6 for Figure 5 A schematic structural diagram of a wafer drying device 200 from one perspective, Figure 7 for Figure 6 Another structural schematic diagram of the wafer drying device 200 in the embodiment of the present application discloses a wafer drying device 200, which includes:

[0077] The box body 21 is used to contain cleaning liquid;

[0078] a jetting member (not shown in the figure) disposed outside the box 21, the jetting member being capable of jetting out a gas for drying the wafer 10;

[0079] a support 22 movably disposed in the box 21;

[0080] the top pin 100 of the first aspect described above, the top pin 100 being disposed on the support 22;

[0081] a driving member (not shown in the figure) connected with the support 22, the driving member being capable of driving the support 22 to move between the cleaning station and the drying station.

[0082] Specifically, the box 21 provides a closed space for storing cleaning liquid required for cleaning the wafer 10, ensuring that the wafer 10 is fully soaked and cleaned therein; the jetting member forms a specific tension gradient at the interface between the wafer 10 and the liquid surface of the cleaning liquid by jetting out nitrogen gas with a certain concentration of isopropyl alcohol, so that the moisture on the surface of the wafer 10 can be pulled to the water surface, achieving the effect of rapid drying; the support 22 is used to carry the top pin 100 and the wafer 10; the driving member is connected with the support 22, capable of controlling the movement of the support 22, ensuring the transfer of the wafer 10 from the cleaning station to the drying station, and realizing automatic operation.

[0083] The cleaning station described above is a station in the box 21 responsible for cleaning the wafer 10, and the drying station is a station outside the box 21 responsible for drying the wafer 10.

[0084] In one embodiment, the wafer 10 is lifted by the support 22 and the top pin 100 to leave the cleaning station, after the wafer 10 contacts the top pin 100, the support 22 is driven by the driving member to move from the cleaning station to the drying station, the jetting member jets out nitrogen gas with a certain concentration of isopropyl alcohol to the interface between the wafer 10 and the liquid surface of the cleaning liquid during the lifting of the wafer 10, the interface between the wafer 10 and the liquid surface of the cleaning liquid forms a specific tension gradient due to the nitrogen gas with a certain concentration of isopropyl alcohol, the cleaning liquid on the surface of the wafer 10 is pulled to the water surface, and after the top pin 100 leaves the cleaning station, the residual cleaning liquid in the contact part between the top pin 100 and the wafer 10 is sucked away by the first drain hole 2 and the second drain hole 3.

[0085] In the wafer drying device 200 provided in the embodiments of the present application, through the top pin 100 provided with the first drain hole 2 and the second drain hole 3 and the jetting member capable of jetting out nitrogen gas with a certain concentration of isopropyl alcohol, the complete drying of the wafer 10 is realized, and at the same time, the residual cleaning liquid between the wafer 10 and the top pin 100 is eliminated, the water stain points formed after drying in the contact part between the wafer 10 and the top pin 100 are eliminated, the pollution to the wafer 10 is reduced, and thus the performance and reliability of the wafer 10 are ensured.

[0086] Specifically, please refer to Figures 8 to 10 ,Figure 8 for Figure 5 A schematic diagram of the structure of the ejector pin 100 and the bracket 22, Figure 9 for Figure 5 A schematic structural diagram of the bracket 22, Figure 10 for Figure 5 Figure 2 is a schematic cross-sectional view of the bracket 22. The bracket 22 includes a mounting portion 221 and a sliding portion 222. The mounting portion 221 is provided with a mounting hole 221a that passes through the mounting portion 221. A stopper 2211 is provided on the inner wall of the mounting hole 221a. The stopper 2211 divides the mounting hole 221a into a first hole section 2212 and a second hole section 2213. The second end 12 of the ejector pin 100 is mounted in the first hole section 2212 and abuts against the stopper 2211. The first end 11 of the ejector pin 100 is disposed outside the mounting hole 221a. The sliding portion 222 is slidably connected to the housing 21.

[0087] The first end 11 of the ejector pin 100 is the end that contacts the wafer 10, and the second end 12 is the end that contacts the bracket 22. To allow the cleaning liquid in the first and second drain holes 2 and 3 to be drained, the bracket 22 is provided with a mounting portion 221 and a mounting hole 221a extending through the mounting portion 221. This allows the cleaning liquid in the first and second drain holes 2 and 3 to be drained from the mounting portion 221 through the mounting hole 221a. A stopper 2211 divides the mounting hole 221a into a first hole section 2212 and a second hole section 2213. The first hole section 2212 is used to mount the ejector pin 100, and the second hole section 2213 is used to drain the cleaning liquid in the first and second drain holes 2 and 3. The second end 12 of the ejector pin 100 is installed in the first hole section 2212 and abuts against the stopper 2211 . The first end 11 of the ejector pin 100 is disposed outside the mounting hole 221 a . If the first end 11 of the ejector pin 100 is disposed in the mounting hole 221 a , the wafer 10 will contact the bracket 22 .

[0088] It will be appreciated that mounting hole 221a provides positioning for ejector pin 100, ensuring that ejector pin 100 is stably mounted on bracket 22 and prevents movement, thereby ensuring stability and accuracy during the cleaning and drying process of wafer 10. Furthermore, the provision of stopper 2211 allows the cleaning liquid within first and second drain holes 2 and 3 to be drained without affecting the stability of ejector pin 100. The separation of first and second hole sections 2212 and 2213 optimizes the drainage path for the cleaning liquid, ensuring smooth drainage while reducing the risk of clogging and improving drainage reliability and efficiency.

[0089] Optionally, see Figure 10 The aperture of the second hole section 2213 is larger than the aperture of the first hole section 2212.

[0090] In one embodiment, when the driving member drives the bracket 22 from the cleaning station to the drying station, after the second hole section 2213 leaves the cleaning liquid, the cleaning liquid in the second hole section 2213 flows downward out of the second hole section 2213 due to the action of gravity, and the second hole section 2213 is connected to the second drainage hole 3. The second hole section 2213 sucks out the cleaning liquid in the second drainage hole 3 due to the siphon phenomenon, and the second drainage hole 3 sucks out the cleaning liquid in the first drainage hole 2 through the siphon phenomenon, and the first drainage hole 2 sucks out the cleaning liquid between the ejector pins 100 of the wafer 10 through the siphon phenomenon.

[0091] Among them, since the aperture of the second hole segment 2213 is larger than the aperture of the first hole segment 2212, the aperture of the first hole segment 2212 is matched with the tolerance of the ejector pin 100, that is, the aperture of the second hole segment 2213 is larger than the aperture of the second drainage hole 3, and the aperture of the second drainage hole 3 is larger than the aperture of the first drainage hole 2, a drainage channel is formed, and the residual cleaning liquid between the wafer 10 and the ejector pin 100 can be sucked away by the siphon phenomenon generated by the second hole segment 2213, the second drainage hole 3 and the first drainage hole 2.

[0092] It can be understood that, compared with the aperture of the second hole segment 2213 being no larger than the aperture of the first hole segment 2212, the increase in the second hole segment 2213 enhances the siphon effect, so that the residual cleaning liquid can be more smoothly sucked out from the gap between the wafer 10 and the ejector pin 100, thereby improving the discharge efficiency of the cleaning liquid and ensuring the cleanliness of the wafer 10.

[0093] Exemplarily, the diameter of the second hole section 2213 is 12 mm-16 mm.

[0094] Among them, if the aperture of the second hole section 2213 is less than 12 mm, the smaller aperture will weaken the siphon effect. If the aperture is too small, the flow rate of the liquid in the pipeline will be limited, because the liquid needs to overcome greater friction to pass through the narrow channel, which makes it difficult to start the siphon phenomenon, or even if the siphon phenomenon has started, the flow rate of the liquid will be very slow, thereby weakening the siphon effect, thereby affecting the discharge efficiency of the cleaning liquid. If the aperture of the second hole section 2213 is greater than 16 mm, the siphon effect will also be weakened. If the aperture is too large, the flow rate of the liquid in the pipeline is too fast, causing the liquid to form turbulence in the pipeline, thereby destroying the stable liquid column required for the siphon phenomenon.

[0095] For example, taking the aperture of the second hole section 2213 as 12 mm as an example, when the aperture of the second hole section 2213 is 12 mm, while ensuring the discharge efficiency of the cleaning liquid, the stability of the siphon effect is increased, thereby ensuring the discharge effect of the cleaning liquid.

[0096] For example, when the hole diameter of the second hole section 2213 is 16 mm, the discharge efficiency of the cleaning liquid is increased while the stability of the siphon effect is ensured.

[0097] Optionally, referring to Figures 8 to 10 , the top pin 100 further comprises a mounting groove 13 arranged on the outer wall of the top pin 100 and along the circumference of the top pin 100, and the wafer drying device 200 further comprises a sealing ring 23 arranged in the mounting groove 13 and abutting against the hole wall of the mounting hole 221a.

[0098] The sealing ring 23 arranged in the mounting groove 13 and abutting against the hole wall of the mounting hole 221a can ensure that the connection between the second hole section 2213 and the second drain hole 3 is sealed, and the siphon effect is not affected by the gap between the first hole section 2212 and the top pin 100 when the cleaning liquid is discharged, thereby ensuring the stability of the siphon effect and the discharge effect of the cleaning liquid.

[0099] For example, the material of the sealing ring 23 can be rubber, polytetrafluoroethylene or other materials with chemical corrosion resistance, stable sealing performance and wear resistance, and the material of the sealing ring 23 is not limited in the embodiments of the present application.

[0100] In some embodiments, the bracket 22 is provided with a rolling member 2221, and the inner side of the box body 21 is provided with a sliding groove, and the rolling member 2221 is in rolling contact with the sliding groove.

[0101] The rolling contact between the rolling member 2221 and the sliding groove can reduce friction, and the friction coefficient of the rolling contact is lower than that of the sliding contact, so that the energy loss can be reduced and the mechanical efficiency can be improved; the sliding groove can ensure that the lifting of the top pin 100 along the preset path is moved, and the stability of the wafer drying device 200 can be ensured, and damage or failure of the wafer drying device 200 caused by position deviation, friction, vibration and the like can be avoided.

[0102] For example, the driving member is a magnetic driving member, the bracket 22 is provided with an avoiding groove 2222, the first magnetic member is arranged on the two side walls of the avoiding groove 2222, and the second magnetic member is arranged on the outer side of the box body 21 corresponding to the avoiding groove 2222, and the magnetic force between the first magnetic member and the second magnetic member is used to drive the bracket 22 to slide relative to the box body 21. The selection of the driving member is not limited in the embodiments of the present application.

[0103] The wafer drying device 200 disclosed in the embodiments of the present application comprises the following working processes:

[0104] S1. The wafer 10 is placed on the turnover mechanism 24 by a mechanical hand (not shown in the figure);

[0105] S2. The turning mechanism 24 turns the wafer 10 to the side wall direction of the box 21;

[0106] S3. The driving member drives the support 22 to drive the ejector pin 100 to eject the wafer 10 from the cleaning liquid, and the air jet member sprays dry gas to the wafer 10;

[0107] S4. When the second hole section 2213 leaves the water surface, the cleaning liquid in the second hole section 2213 flows downward, the cleaning liquid in the first hole section 2212 flows downward, the cleaning liquid in the second drain hole 3 flows into the second hole section 2213, the cleaning liquid in the first drain hole 2 flows into the second drain hole 3, and the cleaning liquid between the wafer 10 and the ejector pin 100 flows into the first drain hole 2;

[0108] S5. All the wafers 10 leave the cleaning liquid and are clamped by the upper clamping mechanism (not shown in the figure);

[0109] S6. The support 22 drives the ejector pin 100 to return to the initial position;

[0110] S7. Repeat S1 to S6.

[0111] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not limited thereto; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A ejector pin for supporting a wafer, characterized in that: include: an ejector pin body, the ejector pin body comprising a first end and a second end opposite to each other, the first end being configured to contact the wafer; a first drainage hole, the first drainage hole being disposed at the first end; The second drainage hole is provided at the second end, the second drainage hole is communicated with the first drainage hole, and the aperture of the second drainage hole is larger than the aperture of the first drainage hole.

2. The ejector pin according to claim 1, wherein: There are a plurality of first drainage holes, and the plurality of first drainage holes are arranged near a portion where the first end contacts the wafer.

3. The ejector pin according to claim 2, wherein: The first end includes a first slope and a second slope, the first slope and the second slope intersect at one end of the wafer close to form an intersection line, the intersection line is used to contact the wafer, and multiple first drainage holes are arranged on both sides of the intersection line and are tangent to the intersection line.

4. The ejector pin according to claim 3, wherein: The plurality of first drainage holes are respectively arranged on both sides of the intersection line, and the positions at which the plurality of first drainage holes are tangent to the intersection line are different.

5. The ejector pin according to claim 1, wherein: The aperture of the first drainage hole is 0.1 mm to 0.5 mm, and the aperture of the second drainage hole is 3 mm to 5 mm.

6. The ejector pin according to claim 1, wherein: The ejector pin further includes a mounting groove, which is provided on the outer wall of the ejector pin body and along the circumference of the ejector pin body. The mounting groove is used for mounting a sealing ring.

7. A wafer drying device, characterized in that: include: A box body, wherein the box body is used to contain a cleaning liquid; a gas injection component, the gas injection component being disposed outside the box and capable of ejecting gas for drying the wafer; a bracket, the bracket being movably disposed on the box; The ejector according to any one of claims 1 to 6, wherein the ejector is arranged on the bracket; A driving member is connected to the bracket, and the driving member can drive the bracket to move between the cleaning station and the drying station.

8. The wafer drying device according to claim 7, wherein: The bracket is provided with a mounting portion, and the mounting portion is provided with a mounting hole. The mounting hole passes through the mounting portion, and the inner wall of the mounting hole is provided with a stop portion. The stop portion divides the mounting hole into a first hole section and a second hole section. The second end of the ejector pin is installed in the first hole section and abuts against the stop portion, and the first end of the ejector pin is arranged outside the mounting hole.

9. The wafer drying device according to claim 8, characterized in that: The aperture of the second hole segment is larger than the aperture of the first hole segment.

10. The wafer drying device according to claim 8, wherein: The ejector pin further includes a mounting groove, which is arranged on the outer wall of the ejector pin and along the circumference of the ejector pin. The wafer drying device further includes a sealing ring, which is arranged in the mounting groove and abuts against the hole wall of the mounting hole.

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