Power module and electronic device

Abstract

The utility model provides a power module and an electronic device. The power module comprises a heat dissipation plate; the at least one power assembly is mounted on the heat dissipation plate, any power assembly comprises a power circuit board mounted on the heat dissipation plate, and a gap is formed between the power circuit board and the heat dissipation plate; the power device is positioned between the power circuit board and the heat dissipation plate, is connected with the heat dissipation plate and is electrically connected with the power circuit board; and the heat conduction pad is located between the power device and the heat dissipation plate, and the two sides of the heat conduction pad are attached to the power device and the heat dissipation plate respectively. The heat conduction pad is used for conducting heat on the power device, the installation difficulty is reduced on the premise that the excellent heat conduction effect is ensured, rapid installation is achieved, and the production efficiency is improved. According to the heat dissipation mode, the heat dissipation efficiency is high, and noise is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technical field, specifically, relate to a kind of power module and electronic equipment. BACKGROUND

[0002] In electronic equipment using SIC (silicon carbide metal, silicon carbide) device, SIC device generates a lot of heat when working, and needs to cool SIC device, and in the related art, SIC device is cooled by air cooling, but this cooling method has low heat dissipation efficiency and high noise. SUMMARY

[0003] The utility model at least solves one of the technical problems in the prior art or related art.

[0004] To this end, a first object of the utility model is to provide a kind of power module.

[0005] A second object of the utility model is to provide a kind of electronic equipment.

[0006] To achieve at least one of the above purposes, according to the first aspect of the utility model, a kind of power module is provided, comprising: a heat sink;At least one power component is installed on the heat sink, any power component comprises: power circuit board, installed on the heat sink, power circuit board and heat sink have spacing;Power device is located between power circuit board and heat sink, power device is connected with heat sink, and is electrically connected with power circuit board;Thermal pad is located between power device and heat sink, and the two sides of thermal pad are respectively attached with power device and heat sink.

[0007] The power module proposed in the present application comprises a heat sink and at least one power component, the power component is installed on the heat sink, and the power component generates heat when running, and the heat sink is used for cooling the power component.

[0008] Further, any power component comprises power circuit board, power device and thermal pad. Wherein, power circuit board is installed on the heat sink, and power circuit board can be fixedly connected to the heat sink by bolt, rivet or other connecting structure, and the above connecting structure can support power circuit board, so that power circuit board and heat sink have spacing, and the spacing between power circuit board and heat sink is used for installing power device.

[0009] Further, the power device is located between the heat dissipation plate and the power circuit board, so that the power device is closer to the heat dissipation plate, and when the power assembly is running, the power device generates heat, and by arranging the power device between the power circuit board and the heat dissipation plate, the distance between the power device and the heat dissipation plate can be reduced, and the heat dissipation effect of the heat dissipation plate on the power device is improved. The power device is connected to the heat dissipation plate to install and fix the power device, and the power device is electrically connected to the power circuit board to enable the power assembly to operate normally.

[0010] Further, the heat conduction pad is located between the power device and the heat dissipation plate, and the two sides of the heat conduction pad are tightly attached to the power device and the heat dissipation plate, respectively, and the heat generated by the power device is conducted to the heat dissipation plate through the heat conduction pad, further improving the heat dissipation effect of the heat dissipation plate on the power device. Compared with the structure using traditional ceramic gasket and heat-conducting silicone grease for heat conduction, the application uses a heat conduction pad to conduct heat to the power device, which not only ensures excellent heat conduction effect, but also reduces installation difficulty, realizes rapid installation, and improves production efficiency. The heat dissipation method adopted in the application has high heat dissipation efficiency and no noise.

[0011] According to the power module of the utility model above, the following distinguished technical features can also be provided:

[0012] In some technical solutions, optionally, the heat dissipation plate has a heat dissipation flow channel for containing cooling liquid, and along the length direction of the heat dissipation plate, the heat dissipation flow channel has at least one heat dissipation part and at least one avoiding part, and the surface of the heat dissipation plate facing the power device is an installation surface, and the distance between the heat dissipation part and the installation surface is less than the distance between the avoiding part and the installation surface.

[0013] In this technical solution, the heat dissipation flow channel in the heat dissipation plate is limited. The heat dissipation flow channel has cooling liquid therein, and the cooling liquid flows in the heat dissipation flow channel to take away the heat generated by the power assembly, thereby achieving heat dissipation of the power assembly. Further, the shape of the heat dissipation flow channel is limited. Along the length direction of the heat dissipation plate, the heat dissipation flow channel has at least one heat dissipation part and at least one avoiding part, and the heights of the heat dissipation part and the avoiding part are different, so that the distance between the heat dissipation flow channel and the power device can be reduced, and the heat dissipation efficiency is improved. Specifically, the surface of the heat dissipation plate facing the power device is an installation surface, and the distance between the heat dissipation part and the installation surface is less than the distance between the avoiding part and the installation surface. Since the distance between the heat dissipation part and the installation surface is reduced, the distance between the heat dissipation part and the power device is also reduced, and the heat dissipation efficiency of the heat dissipation plate on the power device is improved.

[0014] Further, at least a part of the heat dissipation part is located directly below the power device, thereby shortening the straight-line distance between the heat dissipation part and the power device, and further improving the heat dissipation efficiency of the heat dissipation plate on the power device.

[0015] The shape of the heat dissipation flow channel can be stepped, curved, arched or other shapes with height variation.

[0016] In some embodiments, the power assembly further comprises a connecting member penetrating through the power device and inserted into the heat dissipation plate to mount the power device on the heat dissipation plate, wherein the avoiding portion is arranged corresponding to the connecting member, the height of any position of the avoiding portion is lower than the height of any position of the connecting member, and there is a spacing between the heat dissipation portion and the connecting member along the length direction of the heat dissipation plate, and at least a part of the heat dissipation portion has the same height as at least a part of the connecting member.

[0017] In this embodiment, the structure of the power assembly is further limited. The power assembly further comprises a connecting member, which can be a screw or a bolt. The connecting member penetrates through the power device and is inserted into the heat dissipation plate, so that the power device can be fixedly mounted on the heat dissipation plate through the connecting member. The avoiding portion is arranged corresponding to the connecting member. Since the distance between the avoiding portion and the mounting surface is greater than the distance between the heat dissipation portion and the mounting surface, i.e., the height of the avoiding portion is lower, the connecting member can be avoided through the avoiding portion. The avoiding portion is located directly below the connecting member, and the height of any position of the avoiding portion is lower than the height of any position of the connecting member, so as to avoid interference between the avoiding portion and the connecting member.

[0018] Further, there is a spacing between the heat dissipation portion and the connecting member along the length direction of the heat dissipation plate, i.e., the heat dissipation portion can avoid the connecting member. At least a part of the heat dissipation portion has the same height as at least a part of the connecting member. In this way, the distance between the heat dissipation portion and the power device can be minimized to improve the heat dissipation efficiency of the heat dissipation portion on the power device. By adopting the above structure of the heat dissipation flow channel, the minimum distance between the heat dissipation flow channel and the power device can be reduced under the premise of ensuring that the heat dissipation flow channel does not interfere with the connecting member, so as to improve the heat dissipation efficiency of the heat dissipation plate on the power device.

[0019] In some embodiments, the power assembly further comprises a soldering pin, two ends of the soldering pin being connected with the power device and the power circuit board respectively, the soldering pin being conductive to electrically connect the power device and the power circuit board.

[0020] In this embodiment, the structure of the power assembly is further limited. The power assembly further comprises a soldering pin for electrically connecting the power device and the power circuit board. Specifically, two ends of the soldering pin are connected with the power device and the power circuit board respectively, and the end of the soldering pin facing the power circuit board is bent in the direction facing the power circuit board, so as to facilitate soldering the soldering pin to the power circuit board. The soldering pin is conductive, and the power device is electrically connected with the power circuit board through the soldering pin.

[0021] By arranging the welding pins in the power assembly, the power device can be electrically connected with the power circuit board through the welding pins.

[0022] In some embodiments, the number of power devices in any power assembly is multiple.

[0023] In this embodiment, the power devices are limited. The number of power devices in any power assembly is multiple. The multiple power devices can be connected in series, in parallel, or both in series and in parallel. By selecting an appropriate connection mode between the multiple power devices, the system voltage of the power module can be improved, and the current that the power module can pass can be improved.

[0024] In some embodiments, the heat-conducting pad is insulating.

[0025] In this embodiment, the heat-conducting pad is limited. The heat-conducting pad is insulating. By installing the heat-conducting pad with insulation between the power device and the heat sink, the power device and the heat sink can be insulated, and the safety of the power module can be improved. Moreover, the heat-conducting pad used in this application has good heat conductivity and insulation, so it can replace the ceramic gasket and heat-conducting silicone grease in the traditional heat-conducting structure, realize fast installation of the heat-conducting pad, and improve production efficiency.

[0026] In some embodiments, any power assembly further comprises a driving circuit board, the driving circuit board is installed on the side of the power circuit board away from the heat sink, and the driving circuit board is used to drive the power circuit board to operate.

[0027] In this embodiment, the structure of the power assembly is further limited. Any power assembly further comprises a driving circuit board, and the driving circuit board is used to drive the power circuit board to operate. Specifically, the driving circuit board is installed on the side of the power circuit board away from the heat sink. On the one hand, it can avoid interference between the driving circuit board and the heat sink and the power device. On the other hand, it can also reduce the influence of the heat generated by the power device on the driving circuit board. The driving circuit board is plugged into the power circuit board, and the driving circuit board is electrically connected with the power circuit board. By installing the driving circuit board on the power circuit board, other electrical components in the power assembly can be driven to operate by the driving circuit board.

[0028] In some embodiments, when the power assembly is multiple, the multiple driving circuit boards in the multiple power assemblies are independent of each other, and any driving circuit board is used to drive the corresponding power circuit board to operate.

[0029] In this technical solution, the driver circuit board is further defined. The power module can contain one or more power components. In the case of multiple power components, each power component is equipped with a driver circuit board. The multiple driver circuit boards within the multiple power components are independent of each other, and each driver circuit board drives the corresponding power circuit board. This improves the operating efficiency of the power module, avoids mutual interference between the power components, and facilitates achieving a high frequency of the power module.

[0030] In some technical solutions, optionally, any power component further includes: a switch component installed on the power circuit board, and the switch component is used to control the current direction of the power component.

[0031] This technical solution further defines the structure of the power assembly. Each power assembly also includes a switch element, which is used to control the direction of current flow in the power assembly. Specifically, the switch element is mounted on and electrically connected to the power circuit board. The switch element controls the direction of current flow in the power assembly circuit, achieving rectification or inversion.

[0032] In some technical solutions, optionally, the power device is a SIC-MOSFET device.

[0033] This technical solution further defines the power device as a SiC-MOSFET (silicon carbide metal oxide semiconductor field effect transistor). SiC-MOSFET devices offer excellent high-temperature performance, high efficiency, high frequency, radiation resistance, miniaturization, and lightweight.

[0034] The second aspect of the present invention further provides an electronic device, comprising the power module provided in the first aspect of the present invention.

[0035] The electronic device provided in the second aspect of the present invention includes the power module provided in the first aspect of the present invention, and thus has all the beneficial effects of the power module.

[0036] Additional aspects and advantages of the present invention will become apparent in the following description or will be understood through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0038] Figure 1Structure diagram of a power module of one embodiment of the utility model shows;

[0039] Figure 2 Structure diagram of a power module of one embodiment of the utility model shows two;

[0040] Figure 3 Structure diagram of a power module of one embodiment of the utility model shows three;

[0041] Figure 4 Structure diagram of a power module of one embodiment of the utility model shows.

[0042] Wherein, Figures 1 to 4 The correspondence between the reference signs and the component names is as follows:

[0043] 100 power module, 110 heat dissipation plate, 111 heat dissipation flow channel, 112 heat dissipation part, 113 avoiding part, 114 mounting surface, 120 power assembly, 121 power circuit board, 122 power device, 123 heat conduction pad, 124 connecting piece, 125 welding pin, 126 driving circuit board. DETAILED DESCRIPTION

[0044] In order to more clearly understand the above purpose, features and advantages of the utility model, the utility model is further described in detail below in combination with the drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0045] In the following description, a lot of specific details are set forth in order to facilitate a thorough understanding of the utility model, however, the utility model can also be implemented in other ways different from the description herein, therefore, the protection scope of the utility model is not limited by the specific embodiments disclosed below.

[0046] The following refers to Figures 1 to 4 The power module 100 and the electronic equipment provided according to some embodiments of the utility model are described.

[0047] In one embodiment according to the present application, as Figure 1 and Figure 4As shown, the application provides a power module 100, comprising: a heat sink 110; at least one power assembly 120 mounted on the heat sink 110, any power assembly 120 comprising: a power circuit board 121 mounted on the heat sink 110, the power circuit board 121 having a spacing with the heat sink 110; a power device 122 located between the power circuit board 121 and the heat sink 110, the power device 122 connected to the heat sink 110 and electrically connected to the power circuit board 121; and a heat-conducting pad 123 located between the power device 122 and the heat sink 110, the heat-conducting pad 123 being attached to the power device 122 and the heat sink 110 on both sides.

[0048] The power module 100 provided by the application comprises the heat sink 110 and the at least one power assembly 120, the power assembly 120 is mounted on the heat sink 110, the power assembly 120 generates heat during operation, and the heat sink 110 is used for heat dissipation for the power assembly 120.

[0049] Further, any power assembly 120 comprises the power circuit board 121, the power device 122 and the heat-conducting pad 123. The power circuit board 121 is mounted on the heat sink 110, the power circuit board 121 can be fixedly connected to the heat sink 110 by bolts, rivets or other connecting structures, and the connecting structure can support the power circuit board 121, so that the power circuit board 121 has a spacing with the heat sink 110, and the spacing between the power circuit board 121 and the heat sink 110 is used for mounting the power device 122.

[0050] Further, the power device 122 is located between the heat sink 110 and the power circuit board 121, so that the power device 122 is closer to the heat sink 110, when the power assembly 120 operates, the power device 122 generates heat, by arranging the power device 122 between the power circuit board 121 and the heat sink 110, the distance between the power device 122 and the heat sink 110 can be reduced, and the heat dissipation effect of the heat sink 110 on the power device 122 is improved. The power device 122 is connected to the heat sink 110 to mount and fix the power device 122, and the power device 122 is electrically connected to the power circuit board 121, so that the power assembly 120 can operate normally.

[0051] Further, the heat-conducting pad 123 is located between the power device 122 and the heat-dissipating plate 110, and the two sides of the heat-conducting pad 123 are tightly attached to the power device 122 and the heat-dissipating plate 110 respectively, the heat generated by the power device 122 is conducted to the heat-dissipating plate 110 through the heat-conducting pad 123, further improving the heat dissipation effect of the heat-dissipating plate 110 on the power device 122. Compared with the structure of using traditional ceramic gasket and heat-conducting silicone grease for heat conduction, the application uses the heat-conducting pad 123 to conduct heat for the power device 122, which reduces the installation difficulty, realizes rapid installation and improves the production efficiency on the premise of ensuring good heat conduction effect. The heat dissipation method adopted by the application has high heat dissipation efficiency and no noise.

[0052] In some embodiments, as shown in Figure 4 The heat-dissipating plate 110 has a heat-dissipating flow channel 111 for containing cooling liquid, and along the length direction of the heat-dissipating plate 110, the heat-dissipating flow channel 111 has at least one heat-dissipating part 112 and at least one avoiding part 113, and the surface of the heat-dissipating plate 110 facing the power device 122 is the mounting surface 114, and the distance between the heat-dissipating part 112 and the mounting surface 114 is less than the distance between the avoiding part 113 and the mounting surface 114.

[0053] In this embodiment, the heat-dissipating flow channel 111 in the heat-dissipating plate 110 is limited. The heat-dissipating flow channel 111 in the heat-dissipating plate 110 has cooling liquid, and the cooling liquid flows in the heat-dissipating flow channel 111 to take away the heat generated by the power assembly 120, thereby achieving heat dissipation for the power assembly 120. Further, the shape of the heat-dissipating flow channel 111 is limited. Along the length direction of the heat-dissipating plate 110, the heat-dissipating flow channel 111 has at least one heat-dissipating part 112 and at least one avoiding part 113, and the heights of the heat-dissipating part 112 and the avoiding part 113 are different, so that the distance between the heat-dissipating flow channel 111 and the power device 122 can be reduced, and the heat dissipation efficiency is improved. Specifically, the surface of the heat-dissipating plate 110 facing the power device 122 is the mounting surface 114, and the distance between the heat-dissipating part 112 and the mounting surface 114 is less than the distance between the avoiding part 113 and the mounting surface 114. Due to the reduced distance between the heat-dissipating part 112 and the mounting surface 114, the distance between the heat-dissipating part 112 and the power device 122 is also reduced, and the heat dissipation efficiency of the heat-dissipating plate 110 on the power device 122 is improved.

[0054] Further, at least a part of the heat-dissipating part 112 is located directly below the power device 122, thereby shortening the straight-line distance between the heat-dissipating part 112 and the power device 122, and further improving the heat dissipation efficiency of the heat-dissipating plate 110 on the power device 122.

[0055] The shape of the heat-dissipating flow channel 111 can be stepped, curved, arched or other shapes with height changes.

[0056] In some embodiments, as shown in Figure 4 any power assembly 120 further comprises a connecting member 124, the connecting member 124 passes through the power device 122 and is inserted into the heat sink 110 to mount the power device 122 to the heat sink 110; wherein the avoiding portion 113 is arranged corresponding to the connecting member 124, the height of any position of the avoiding portion 113 is lower than the height of any position of the connecting member 124; along the length direction of the heat sink 110, the heat radiating portion 112 and the connecting member 124 have a spacing, at least a part of the heat radiating portion 112 has the same height as at least a part of the connecting member 124.

[0057] In this embodiment, the structure of the power assembly 120 is further limited. Any power assembly 120 further comprises a connecting member 124, the connecting member 124 can be a screw or a bolt, the connecting member 124 passes through the power device 122 and is inserted into the heat sink 110, so that the power device 122 can be fixedly mounted to the heat sink 110 through the connecting member 124. The avoiding portion 113 is arranged corresponding to the connecting member 124, because the distance between the avoiding portion 113 and the mounting surface 114 is greater than the distance between the heat radiating portion 112 and the mounting surface 114, that is, the height of the avoiding portion 113 is lower, so that the connecting member 124 can be avoided through the avoiding portion 113. The avoiding portion 113 is located directly below the connecting member 124, the height of any position of the avoiding portion 113 is lower than the height of any position of the connecting member 124, to avoid interference between the avoiding portion 113 and the connecting member 124.

[0058] Further, along the length direction of the heat sink 110, the heat radiating portion 112 and the connecting member 124 have a spacing, that is, the heat radiating portion 112 can avoid the connecting member 124. At least a part of the heat radiating portion 112 has the same height as at least a part of the connecting member 124, in this way, the distance between the heat radiating portion 112 and the power device 122 can be minimized to improve the heat dissipation efficiency of the heat radiating portion 112 to the power device 122. By adopting the above structure of the heat radiating flow channel 111, the minimum distance between the heat radiating flow channel 111 and the power device 122 can be reduced under the premise of ensuring that the heat radiating flow channel 111 and the connecting member 124 do not interfere with each other, so as to improve the heat dissipation efficiency of the heat sink 110 to the power device 122.

[0059] In some embodiments, as shown in Figure 3 and Figure 4 any power assembly 120 further comprises a soldering pin 125, two ends of the soldering pin 125 are connected with the power device 122 and the power circuit board 121 respectively, the soldering pin 125 can conduct electricity to electrically connect the power device 122 and the power circuit board 121.

[0060] In this embodiment, the structure of the power assembly 120 is further defined. Any power assembly 120 further comprises a soldering pin 125, the soldering pin 125 being used to electrically connect the power device 122 and the power circuit board 121. Specifically, the two ends of the soldering pin 125 are connected to the power device 122 and the power circuit board 121 respectively, the end of the soldering pin 125 facing the power circuit board 121 is bent towards the power circuit board 121 so as to facilitate the soldering of the soldering pin 125 to the power circuit board 121, the soldering pin 125 is capable of conducting electricity, and the power device 122 is electrically connected to the power circuit board 121 through the soldering pin 125.

[0061] By arranging the soldering pin 125 in the power assembly 120, the power device 122 can be electrically connected to the power circuit board 121 through the soldering pin 125.

[0062] In some embodiments, optionally, the number of power devices 122 in any power assembly 120 is multiple.

[0063] In this embodiment, the power device 122 is defined. The number of power devices 122 in any power assembly 120 is multiple, and the multiple power devices 122 can be connected in series, in parallel, or both in series and in parallel. By selecting an appropriate connection mode between the multiple power devices 122, the system voltage of the power module 100 can be improved, and the current that the power module 100 can pass through can also be improved.

[0064] In some embodiments, optionally, the heat-conducting pad 123 has insulation.

[0065] In this embodiment, the heat-conducting pad 123 is defined. The heat-conducting pad 123 has insulation, and by installing the heat-conducting pad 123 having insulation between the power device 122 and the heat-dissipating plate 110, the power device 122 and the heat-dissipating plate 110 can be insulated, and the safety of the power module 100 can be improved. Moreover, the heat-conducting pad 123 used in the present application has both good heat conductivity and insulation, so that the heat-conducting pad 123 can replace the ceramic gasket and the heat-conducting silicone grease in the traditional heat-conducting structure, and the heat-conducting pad 123 can be quickly installed, and the production efficiency can be improved.

[0066] In some embodiments, optionally, as shown in Figure 1 and Figure 2 Any power assembly 120 further comprises a driving circuit board 126, the driving circuit board 126 being installed on the side of the power circuit board 121 away from the heat-dissipating plate 110, and the driving circuit board 126 being used to drive the power circuit board 121 to operate.

[0067] In this embodiment, the structure of the power assembly 120 is further defined. Any power assembly 120 further comprises a driving circuit board 126, which is used to drive the power circuit board 121 to operate. Specifically, the driving circuit board 126 is mounted on the side of the power circuit board 121 away from the heat dissipation plate 110, which can avoid interference between the driving circuit board 126 and the heat dissipation plate 110 and the power device 122, and can also reduce the influence of the heat generated by the power device 122 on the driving circuit board 126. The driving circuit board 126 is plugged into the power circuit board 121, and the driving circuit board 126 is electrically connected with the power circuit board 121. By mounting the driving circuit board 126 on the power circuit board 121, other electrical components in the power assembly 120 can be driven to operate by the driving circuit board 126.

[0068] In some embodiments, optionally, in the case of multiple power assemblies 120, the plurality of driving circuit boards 126 in the plurality of power assemblies 120 are independent of each other, and any driving circuit board 126 is used to drive the corresponding power circuit board 121 to operate.

[0069] In this embodiment, the driving circuit board 126 is further defined. The power assembly 120 in the power module 100 can be one or multiple, and in the case of multiple power assemblies 120, any power assembly 120 is provided with a driving circuit board 126, and the plurality of driving circuit boards 126 in the plurality of power assemblies 120 are independent of each other, and any driving circuit board 126 drives the corresponding power circuit board 121 to operate. In this way, the working efficiency of the power module 100 can be improved, the mutual influence between the power assemblies 120 can be avoided, and high frequency of the power module 100 can be easily realized.

[0070] In some embodiments, optionally, any power assembly 120 further comprises a switching element mounted on the power circuit board 121, which is used to control the current direction of the power assembly 120.

[0071] In this embodiment, the structure of the power assembly 120 is further defined. Any power assembly 120 further comprises a switching element mounted on the power circuit board 121, which is used to control the current direction of the power assembly 120. Specifically, the switching element is mounted on the power circuit board 121 and is electrically connected with the power circuit board 121, and the direction of the circuit current in the power assembly 120 can be controlled by the switching element to realize rectification or inversion.

[0072] In some embodiments, optionally, the power device 122 is an SIC-MOSFET device.

[0073] In this embodiment, the power device 122 is further defined as a SIC-MOSFET device. The SIC-MOSFET device has excellent high-temperature performance, high efficiency, high frequency, radiation resistance, miniaturization, and light weight.

[0074] The second aspect of the utility model further provides an electronic device, including the power module 100 proposed in any of the above embodiments.

[0075] The electronic device provided by the second aspect of the utility model has all the beneficial effects of the power module 100.

[0076] In a possible embodiment, the SiC-MOSFET power device (i.e., the power device 122) is crimped on the liquid cooling radiator (i.e., the heat sink 110), insulated and isolated by the heat-conducting insulating pad (i.e., the heat-conducting pad 123), and realizes heat conduction. This can greatly reduce the noise of air volume cooling. Using silicon carbide as the power device can realize bidirectional energy exchange between the battery and the power grid, realize functions such as peak load shifting and frequency modulation of the power grid, adopt a three-wire four-bridge arm staggered form to improve the overall efficiency and power density of the system, reduce the harmonic current content, and support 100% unbalanced load access. The direction of the circuit current is controlled by the switch (i.e., the switching element), and rectification or inversion is realized. The SiC-MOSFET power device and the power circuit board 121 are welded, and through series and parallel connection, high voltage and large current are realized. The liquid cooling radiator has high heat transfer efficiency, so that the temperature of the SiC-MOSFET power device is stable and controllable. The insulating and heat-conducting adhesive pad (i.e., the heat-conducting pad 123) is used to replace the insulating performance of the traditional ceramic gasket and the heat transfer mode of the traditional heat-conducting silicone grease, so that the product can be quickly installed and the production efficiency is improved. The power circuit board 121 is crimped with multiple SiC-MOSFET power devices per phase, realizing series and parallel connection of multiple SiC-MOSFET power devices to improve system voltage and through current. The power circuit board 121 is welded with a terminal seat to facilitate the connection of output and input. The driving circuit board 126 is connected to the power board circuit in a plug-in form, and each phase of the power board circuit is driven and controlled by the driving circuit board 126 to improve efficiency and realize high frequency. The flow channel (i.e., the heat dissipation flow channel 111) adopts a stepped form, which not only ensures the installation and fixation of the SiC-MOSFET power device, but also increases the heat dissipation area of the cooling liquid (the cooling liquid flows in the heat dissipation flow channel 111) in the liquid cooling radiator (i.e., the heat sink 110) to improve the heat exchange efficiency, so that the temperature of the SiC-MOSFET power device is stable and controllable.

[0077] SiC-MOSFET power device is closely attached to liquid cooling radiator through insulating heat-conducting pad, and cooling liquid is right below the SiC-MOSFET power device, so that the shortest heat transfer path is realized, heat transfer efficiency is improved, cost is saved, and assembly efficiency is improved.

[0078] In the present application, the term "a plurality of" refers to two or more, unless otherwise explicitly limited. The terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, "connecting" can be fixed connection, or detachable connection, or integrally connected; "connected" can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0079] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "specific embodiments" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0080] The above is only the preferred embodiment of the present application, and is not used to limit the present application. For those skilled in the art, the present application can have various changes and variations. Any modification, equivalent replacement, improvement and the like within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A power module, characterized in that: include: heat sink; At least one power component is mounted on the heat sink, and any of the power components includes: A power circuit board is mounted on the heat sink, with a distance between the power circuit board and the heat sink; A power device is located between the power circuit board and the heat sink, the power device is connected to the heat sink and is electrically connected to the power circuit board; The thermal pad is located between the power device and the heat sink, and two sides of the thermal pad are respectively attached to the power device and the heat sink.

2. The power module according to claim 1, wherein: The heat sink has a heat dissipation channel, which is used to accommodate coolant. Along the length direction of the heat sink, the heat dissipation channel has at least one heat dissipation portion and at least one avoidance portion. The surface of the heat sink facing the power device is the mounting surface, and the distance between the heat dissipation portion and the mounting surface is less than the distance between the avoidance portion and the mounting surface.

3. The power module according to claim 2, wherein: Any of the power components further includes: a connector, the connector passing through the power device and inserted into the heat sink, so as to mount the power device on the heat sink; Wherein, the avoidance portion is provided corresponding to the connecting member, and the height of any position of the avoidance portion is lower than the height of any position of the connecting member; Along the length direction of the heat dissipation plate, there is a distance between the heat dissipation portion and the connecting member, and at least a portion of the heat dissipation portion and at least a portion of the connecting member have the same height.

4. The power module according to claim 1, wherein: Any of the power components further includes: A welding pin, where two ends of the welding pin are respectively connected to the power device and the power circuit board, and the welding pin is conductive to electrically connect the power device to the power circuit board.

5. The power module according to claim 1, wherein: The number of the power devices in any one of the power components is multiple.

6. The power module according to any one of claims 1 to 5, characterized in that: Any of the power components further includes: A driving circuit board is installed on a side of the power circuit board away from the heat dissipation plate, and is used to drive the power circuit board to operate.

7. The power module according to claim 6, characterized in that: In the case where there are multiple power components, the multiple driving circuit boards in the multiple power components are independent of each other, and any one of the driving circuit boards is used to drive the corresponding power circuit board to operate.

8. The power module according to any one of claims 1 to 5, characterized in that: Any of the power components further includes: A switch component is installed on the power circuit board, and the switch component is used to control the current direction of the power component.

9. The power module according to any one of claims 1 to 5, characterized in that: The power device is a SIC-MOSFET device.

10. An electronic device, characterized in that: include: The power module according to any one of claims 1 to 9.

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