Space-saving pcb (printed circuit board) structure
By rationally arranging the capacitor group and Hall sensor on the PCB board, using the gap to install the capacitor plate and connecting it through solder fingers, the problem that the PCB board structure fails to fully utilize the height space is solved, achieving the effect of space saving and cost reduction.
Patent Information
- Application Number
- CN202422845573.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-11-21
AI Technical Summary
The PCB structure of existing household energy storage inverters fails to fully utilize the height space, resulting in an oversized box and increased production costs.
The capacitor plate is installed in the gap between the capacitor groups on the PCB and connected to the substrate using tin fingers. The Hall sensor is located on one side of the capacitor group. Through reasonable layout and compact connection, the wiring length and signal transmission distance are reduced.
Effectively save space, improve integration, reduce the size of household energy storage inverter boxes, and reduce costs.
Smart Images
Figure CN223452166U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of a pcb board, in particular to a space-saving pcb board structure. BACKGROUND
[0002] In a household energy storage inverter, a relatively neat component layout mode is often adopted for the pcb board structure; for example, capacitors are arranged in rows and columns on a capacitor plate, and the height of the capacitors is kept relatively consistent with that of capacitors on a bottom plate and Hall elements; the layout mode is relatively simple and intuitive in design and manufacturing, and is therefore widely used by most manufacturers.
[0003] However, the layout structure of the pcb board ignores the full use of height space, resulting in an increase in the size of a box body of the household energy storage inverter, and thus an increase in manufacturing cost.
[0004] Therefore, there is an urgent need for a space-saving pcb board structure to solve the above problems.
[0005] The above content is only used to assist in understanding the technical scheme of the application and does not represent the acknowledgement of the above content as prior art. CONTENT OF THE UTILITY MODEL
[0006] The main purpose of the application is to provide a space-saving pcb board structure to solve the problem that the component layout on the pcb board in the existing household energy storage inverter is unreasonable, resulting in an excessively large volume of the box body of the household energy storage inverter and an increase in cost.
[0007] To achieve the above purpose, the application provides a space-saving pcb board structure, which comprises a base plate, a plurality of capacitor groups are arranged on the base plate, a first gap exists between two adjacent capacitor groups, a Hall sensor is arranged on one side of each capacitor group on the base plate, a capacitor plate is arranged in the first gap, a tin finger is arranged on one side of the capacitor plate, and the capacitor plate is connected with the base plate through the tin finger.
[0008] As a preferred scheme of the application, the capacitor group comprises at least two first capacitors, a second gap exists between two adjacent first capacitors in the same group, and a third gap exists between the first capacitors and the capacitor plate.
[0009] As a preferred scheme of the application, a plurality of positioning holes are arranged in the first gap, and the tin finger is connected with the base plate through the plurality of positioning holes.
[0010] As a preferred scheme of the application, the capacitor plate is further provided with a plurality of heat dissipation holes.
[0011] As a preferred scheme of the present application, a second capacitor is further included, the second capacitor is arranged on the capacitor plate, and the second capacitor is arranged on the top of the first capacitor.
[0012] As a preferred scheme of the present application, a fourth gap is arranged between the bottom of the second capacitor and the top of the first capacitor.
[0013] As a preferred scheme of the present application, a plurality of mounting holes are arranged on the substrate, and the plurality of first capacitors are connected to the substrate through the plurality of mounting holes.
[0014] As a preferred scheme of the present application, the number of tin fingers is two or more, and the shape of the tin fingers is rectangular.
[0015] The pcb board structure provided by the present application saves space, effectively saves space by reasonably arranging the space and reasonably utilizing the original blank area, and installs the capacitor plate in the first gap between the capacitor groups. The Hall sensor is arranged on one side of the capacitor group, which is beneficial to improve the integration and reduce the wiring length, thereby saving space. Meanwhile, the tin fingers are directly inserted into the substrate, the installation method is simple, the thickness of the tin fingers is consistent with the thickness of the capacitor plate, and a large mounting hole does not need to be reserved. Through the above arrangement, the connection between elements is more compact, the signal transmission distance is reduced, and the volume of the household energy storage inverter box is effectively reduced. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 FIG. 1 is a first structural schematic diagram of a space-saving pcb board structure according to an embodiment of the present application;
[0017] Figure 2 FIG. 2 is a second structural schematic diagram of a space-saving pcb board structure according to an embodiment of the present application;
[0018] Figure 3 FIG. 3 is a mounting schematic diagram of a first capacitor in a space-saving pcb board structure according to an embodiment of the present application;
[0019] Figure 4 FIG. 4 is a structural schematic diagram of a tin finger in a space-saving pcb board structure according to an embodiment of the present application.
[0020] REFERENCE SIGNS:
[0021] 1, substrate; 2, first capacitor; 3, capacitor plate; 4, second capacitor; 5, tin finger; 6, Hall sensor. DETAILED DESCRIPTION
[0022] The embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application, all other embodiments obtained by those skilled in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.
[0023] In addition, if the description involving "first", "second" and the like in the present application is only for the purpose of description (such as for distinguishing the same or similar elements), and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can be explicitly or implicitly included at least one of the features. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the fact that the technical solutions can be realized by those skilled in the art, when the combination of technical solutions appears contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist, nor within the scope of protection required by the present application.
[0024] Please refer to Figure 1 , Figure 2 , Figure 4 In an embodiment, a space-saving pcb board structure includes a substrate 1, a plurality of capacitor groups are arranged on the substrate 1, a first gap exists between adjacent two capacitor groups, a Hall sensor 6 is arranged on one side of each capacitor group on the substrate 1, a capacitor plate 3 is arranged in the first gap, a tin finger 5 is arranged on one side of the capacitor plate 3, and the capacitor plate 3 is connected with the substrate 1 through the tin finger 5.
[0025] Preferably, in the present embodiment, the tin finger 5 is a protruding structure extending from one side of the capacitor plate 3, the thickness of the tin finger 5 is the same as that of the capacitor plate 3, the number of the tin finger 5 is two or more, and the shape of the tin finger 5 is rectangular.
[0026] It can be understood that the present application utilizes the originally blank area reasonably, installs the capacitor plate 3 in the first gap between the capacitor groups, effectively saves space, arranges the Hall sensor 6 on one side of the capacitor group, which is conducive to improving the integration level and reducing the wiring length, thereby being conducive to saving space. At the same time, the tin finger 5 is directly connected with the substrate 1, the installation method is simple, the tin finger 5 design eliminates the solder terminal device for fixing the capacitor plate 3, the thickness of the tin finger 5 is consistent with that of the capacitor plate 3, and a large installation hole does not need to be reserved. Through the above arrangement, the connection between elements is more compact, the signal transmission distance is reduced, and the highly integrated pcb board is applied to the household energy storage inverter, which effectively reduces the volume of the household energy storage inverter box.
[0027] Specifically, refer to Figure 3 On the basis of the above embodiment, the capacitor group at least includes two first capacitors 2, and a second gap exists between the two first capacitors 2 adjacent to each other in the same group, and a third gap exists between the first capacitors 2 and the capacitor plate 3.
[0028] It can be understood that by reserving the second gap and the third gap, the electrical isolation effect can be achieved, and at the same time, additional space is provided for heat dissipation, which is beneficial to heat dissipation.
[0029] Specifically, refer to Figure 2 , Figure 4 On the basis of the above embodiment, a plurality of positioning holes are arranged in the first gap, and the tin fingers 5 are connected with the substrate 1 through the plurality of positioning holes; at the same time, a plurality of mounting holes are arranged on the substrate 1, and the plurality of first capacitors 2 are connected with the substrate 1 through the plurality of mounting holes.
[0030] It can be understood that by arranging the positioning holes, the tin fingers 5 can be accurately installed, and the capacitor plate 3 can be prevented from being deviated during installation. Similarly, by arranging the positioning holes, the first capacitors 2 can be accurately installed, and after installation is completed, the capacitor plate 3 and the first capacitors 2 are fixed on the substrate 1 by wave soldering.
[0031] Specifically, refer to Figure 4 On the basis of the above embodiment, a plurality of heat dissipation holes are arranged on the capacitor plate 3. It can be understood that by arranging the heat dissipation holes, heat dissipation of the capacitor is facilitated.
[0032] Specifically, refer to Figure 2 On the basis of the above embodiment, a second capacitor 4 is further included, the second capacitor 4 is arranged on the capacitor plate 3, and the second capacitor 4 is arranged on the top of the first capacitors 2; and a fourth gap exists between the bottom of the second capacitor 4 and the top of the first capacitors 2.
[0033] It can be understood that by reserving the fourth gap, the second capacitor 4 can be effectively prevented from contacting the first capacitors 2, the electrical isolation effect is achieved, and at the same time, space is provided for heat dissipation, which is beneficial to heat dissipation.
[0034] It should be noted that in this document, the terms "comprising", "including", or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, device, article or method including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such a process, device, article or method. Without more limitations, the element defined by the statement "including a" does not exclude the presence of additional identical elements in the process, device, article or method including the element.
[0035] The above only represents the preferred embodiments of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields, which are made by using the content of the present application specification and drawings, are also included in the patent protection scope of the present application.
Claims
1. A space-saving PCB structure, characterized in that: The invention comprises a substrate, on which a plurality of capacitor groups are arranged, a first gap is provided between two adjacent capacitor groups, a Hall sensor is provided on one side of each capacitor group on the substrate, a capacitor plate is provided in the first gap, a tin finger is provided on one side of the capacitor plate, and the capacitor plate is connected to the substrate through the tin finger.
2. A space-saving PCB structure according to claim 1, characterized in that: The capacitor group includes at least two first capacitors, a second gap exists between two adjacent first capacitors in the same group, and a third gap exists between the first capacitor and the capacitor plate.
3. The space-saving PCB structure according to claim 1, characterized in that: A plurality of positioning holes are provided in the first gap, and the solder fingers are connected to the substrate through the plurality of positioning holes.
4. A space-saving PCB structure according to claim 1, characterized in that: It also includes heat dissipation holes, and a plurality of heat dissipation holes are opened on the capacitor plate.
5. The space-saving PCB structure according to claim 2, characterized in that: A second capacitor is also included. The capacitor plate is provided with the second capacitor, and the second capacitor is provided on top of the first capacitor.
6. A space-saving PCB structure according to claim 5, characterized in that: A fourth gap exists between the bottom of the second capacitor and the top of the first capacitor.
7. The space-saving PCB structure according to claim 2, characterized in that: The substrate is provided with a plurality of mounting holes, and a plurality of the first capacitors are connected to the substrate through the plurality of mounting holes.
8. The space-saving PCB structure according to claim 1, characterized in that: The number of the tin fingers is two or more, and the shape of the tin fingers is rectangular.