Cooling equipment and data center

Abstract

The embodiment of the utility model provides cooling equipment and a data center, the cooling equipment comprises a heat exchange module, a first heat exchange flow path and a second heat exchange flow path are defined in the heat exchange module, the first heat exchange flow path is used for allowing a cooling medium to flow, and the second heat exchange flow path is used for allowing a heat exchange medium to flow; the cooling medium in the first heat exchange flow path exchanges heat with the heat exchange medium in the second heat exchange flow path so as to reduce the temperature of the cooling medium; the first pipeline group comprises a first liquid supply pipeline and a first liquid return pipeline; the second pipeline group comprises a second liquid supply pipeline and a second liquid return pipeline; the first pipeline set and the second pipeline set are arranged on the two opposite sides of the heat exchange module correspondingly. According to the technology, the heat exchange efficiency of the cooling system in the equipment cluster can be improved, meanwhile, the pipeline design of the cooling system is optimized, and a better heat dissipation effect is achieved in the limited space of the equipment cluster.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of device cluster cooling, and in particular to a cooling device and a data center. BACKGROUND

[0002] A high-performance computing device cluster such as a computing system, a server cluster, or a data center generates a large amount of heat during operation. An effective heat dissipation system can ensure that the device cluster operates within a safe temperature range and prevent performance degradation and hardware damage caused by overheating.

[0003] A heat dissipation system that uses air cooling is proposed in the related art. The air cooling method has limited cooling effect and is difficult to meet the heat dissipation requirements of high-performance and high-integration computing devices. A liquid cooling heat dissipation system can directly or indirectly remove the heat generated by the computing device through a liquid cooling medium (such as water or coolant), and has better heat dissipation efficiency and temperature control performance compared with the air cooling heat dissipation system. However, the existing liquid cooling heat dissipation system has simple structure and limited functions, and the pipeline design needs to be optimized. UTILITY MODEL CONTENT

[0004] Embodiments of the present application provide a cooling device and a data center to solve or alleviate one or more technical problems in the prior art.

[0005] As an aspect of the embodiments of the present application, the embodiments of the present application provide a cooling device, comprising: a heat exchange module, which internally defines a first heat exchange flow path and a second heat exchange flow path, the first heat exchange flow path being used for flowing of a cooling medium, the second heat exchange flow path being used for flowing of a heat exchange medium, the cooling medium in the first heat exchange flow path and the heat exchange medium in the second heat exchange flow path performing heat exchange to reduce the temperature of the cooling medium; a first pipeline group, comprising a first liquid supply pipeline and a first liquid return pipeline; the first liquid supply pipeline is connected with an output end of the first heat exchange flow path, and the first liquid supply pipeline is connected with a liquid inlet of a cooling flow path of a computing assembly; the first liquid return pipeline is connected with an input end of the first heat exchange flow path, and the first liquid return pipeline is connected with a liquid outlet of the cooling flow path; a second pipeline group, comprising a second liquid supply pipeline and a second liquid return pipeline; the second liquid supply pipeline is connected with an input end of the second heat exchange flow path, and the second liquid supply pipeline is connected with a medium output end of a cooling source device; the second liquid return pipeline is connected with an output end of the second heat exchange flow path, and the second liquid return pipeline is connected with a medium return end of the cooling source device; wherein the first pipeline group and the second pipeline group are respectively arranged on opposite sides of the heat exchange module.

[0006] In an implementation manner, the number of the computing assembly is a plurality, and the plurality of computing assemblies are arranged side by side along a first direction; the heat exchange module is arranged on one side of the plurality of computing assemblies in the first direction, and the first pipeline group and the second pipeline group are respectively arranged on opposite sides of the heat exchange module in a second direction, the second direction intersecting the first direction.

[0007] In an embodiment, the first liquid supply pipeline is connected to the inlet of the cooling flow path of each of the plurality of computing assemblies.

[0008] In an embodiment, the first liquid supply pipeline comprises a first liquid supply sub-pipeline and a second liquid supply sub-pipeline connected in series, the first liquid supply sub-pipeline and the second liquid supply sub-pipeline extend along the first direction respectively, and are arranged side by side and spaced apart along the second direction, the first end of the first liquid supply sub-pipeline is connected to the output end of the first heat exchange flow path, the second end of the first liquid supply sub-pipeline is connected to the first end of the second liquid supply sub-pipeline, and the second end of the second liquid supply sub-pipeline is provided with an exhaust valve.

[0009] In an embodiment, the second liquid supply sub-pipeline is provided with a plurality of liquid distribution openings, the plurality of liquid distribution openings are arranged spaced apart along the first direction and correspond to the plurality of computing assemblies one by one, and each liquid distribution opening is in communication with the inlet of the cooling flow path of the corresponding computing assembly.

[0010] In an embodiment, the first liquid return pipeline comprises a first liquid return section, the first liquid return section is provided with a plurality of liquid return openings, the plurality of liquid return openings are arranged spaced apart along the first direction and correspond to the plurality of computing assemblies one by one, and each liquid return opening is connected to the outlet of the cooling flow path of the corresponding computing assembly.

[0011] In an embodiment, the first liquid supply pipeline comprises a first liquid supply sub-pipeline and a second liquid supply sub-pipeline arranged side by side and spaced apart along the second direction, and the first liquid return section is arranged between the first liquid supply sub-pipeline and the second liquid supply sub-pipeline.

[0012] In an embodiment, the first liquid return pipeline further comprises a second liquid return section and a third liquid return section, the second liquid return section and the third liquid return section extend along the third direction respectively, and the third direction is perpendicular to the first direction and the second direction respectively; the first end of the first liquid return section is closed, the second end of the first liquid return section is connected to the first end of the second liquid return section, the second end of the second liquid return section is connected to the first end of the third liquid return section, and the second end of the third liquid return section is connected to the input end of the first heat exchange flow path.

[0013] In an embodiment, a first power device is further arranged between the second end of the second liquid return section and the first end of the third liquid return section, and the first power device is used to provide power for the flow of the cooling medium.

[0014] In an embodiment, the cooling device further comprises a first liquid storage container, and the first liquid return pipeline further comprises a first liquid supplement branch pipe, the first end and the second end of the first liquid supplement branch pipe are in communication with the inside of the second liquid return section respectively, the pipe wall of the first liquid supplement branch pipe is provided with a first liquid supplement interface, and the first liquid supplement interface is in communication with the inside of the first liquid storage container through a first connecting branch pipe.

[0015] In an embodiment, the first liquid storage container is arranged below the heat exchange module.

[0016] In an embodiment, the cooling device further comprises a first pressure stabilizing tank; the first liquid return pipeline further comprises a first pressure stabilizing branch, a first end of the first pressure stabilizing branch being in communication with an interior of the first pressure stabilizing tank, and a second end of the first pressure stabilizing branch being in communication with an interior of the third liquid return section.

[0017] In an embodiment, the first pressure stabilizing tank is arranged below the heat exchange module.

[0018] In an embodiment, the second liquid supply pipeline comprises a first liquid supply section and a second liquid supply section connected in series, a first end of the first liquid supply section being connected to the medium output end of the cooling source device, a second end of the first liquid supply section being connected to a first end of the second liquid supply section, a second end of the second liquid supply section being connected to the input end of the second heat exchange flow path; wherein the first liquid supply section and the second liquid supply section are respectively arranged along the third direction and are spaced apart in the first direction.

[0019] In an embodiment, a second power device is further arranged between the second end of the first liquid supply section and the first end of the second liquid supply section, the second power device being configured to provide power for the flow of the heat exchange medium.

[0020] In an embodiment, the cooling device further comprises a second liquid storage container; the second liquid supply pipeline further comprises a second liquid supplement branch, a first end and a second end of the second liquid supplement branch being respectively in communication with an interior of the first liquid supply section, a pipe wall of the second liquid supplement branch being provided with a second liquid supplement interface, the second liquid supplement interface being in communication with an interior of the second liquid storage container through a second connecting branch.

[0021] In an embodiment, the second liquid storage container is arranged below the heat exchange module.

[0022] In an embodiment, the cooling device further comprises a second pressure stabilizing tank; the second liquid supply pipeline further comprises a second pressure stabilizing branch, a first end of the second pressure stabilizing branch being in communication with an interior of the second pressure stabilizing tank, and a second end of the second pressure stabilizing branch being in communication with an interior of the first liquid supply section.

[0023] In an embodiment, the second pressure stabilizing tank is arranged below the heat exchange module.

[0024] In an embodiment, the medium flow directions of the first heat exchange flow path and the second heat exchange flow path are opposite.

[0025] In an embodiment, the input end of the first heat exchange flow path is arranged below the output end of the first heat exchange flow path; and the input end of the second heat exchange flow path is arranged above the output end of the second heat exchange flow path.

[0026] The embodiment of the present application further provides a data center, comprising: at least one computing assembly, the computing assembly comprising a cabinet, a plurality of computing devices and a cooling flow path, the plurality of computing devices being integrally arranged in the cabinet, and the cooling flow path being used for the cooling medium to flow through the plurality of computing devices; a cold source device used for cooling a heat exchange medium; the cooling device of any one of the above-mentioned embodiments of the present application, the first heat exchange flow path of the heat exchange module being in communication with the cooling flow path of the at least one computing assembly to form a first circulation flow path, and the second heat exchange flow path of the heat exchange module being in communication with the cold source device to form a second circulation flow path.

[0027] In an embodiment, the data center further comprises a cabinet, and the computing assembly and the cooling device are arranged inside the cabinet.

[0028] The cooling device provided by the embodiment of the present application can improve the heat exchange efficiency of the cooling system in the device cluster by the heat exchange module to exchange heat between the cooling medium in the first heat exchange flow path and the heat exchange medium in the second heat exchange flow path, and can optimize the pipeline design of the cooling system, and achieve a better heat dissipation effect in the limited space of the device cluster.

[0029] The above summary is merely intended to illustrate the present application and is not intended to limit in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent to those skilled in the art by reference to the drawings and the following detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0030] In the drawings, like numerals refer to like elements throughout the various drawings. The drawings are not necessarily to scale, the emphasis instead being placed on the relations between various parts and on the principles of the application. It should be understood that these drawings are only intended to depict some embodiments of the application and should not be considered limiting the scope of the application.

[0031] Figure 1 A cooling principle schematic diagram of the cooling device of the embodiment of the present application is shown;

[0032] Figure 2 A partial structure schematic diagram of the data center of the embodiment of the present application is shown;

[0033] Figure 3 A structure schematic diagram of the first pipeline group and the second pipeline group of the embodiment of the present application is shown from one perspective;

[0034] Figure 4 A schematic diagram of the first pipeline group and the second pipeline group of the embodiment of the present application is shown from another perspective;

[0035] Figure 5 A whole structure schematic diagram of the data center according to the embodiment of the present application is shown.

[0036] Reference Signs List:

[0037] Data center 1;

[0038] Cooling device 100;

[0039] Heat exchange module 10; first heat exchange flow path 10a; second heat exchange flow path 10b;

[0040] First pipe group 20; first liquid supply pipe 21; first liquid supply sub-pipe 211; second liquid supply sub-pipe 212; liquid supply port 212a; exhaust valve 212b; first liquid return pipe 22; first liquid return section 221; liquid return port 221a; second liquid return section 222; third liquid return section 223; first liquid supplement branch pipe 224; first liquid supplement interface 224a; first pressure stabilizing branch pipe 225;

[0041] Second pipe group 30; second liquid supply pipe 31; first liquid supply section 311; second liquid supply section 312; second liquid supplement branch pipe 313; second liquid supplement interface 313a; second pressure stabilizing branch pipe 314; second liquid return pipe 32;

[0042] First power device 40; second power device 50; first pressure stabilizing tank 60; second pressure stabilizing tank 70; first liquid storage container 80; second liquid storage container 90;

[0043] Computing assembly 200; cooling flow path 210; cabinet 220; computing device 230;

[0044] Cold source device 300; liquid inlet pipe 301; liquid outlet pipe 302;

[0045] Box 400;

[0046] Frame structure 500;

[0047] Support platform 600;

[0048] Power distribution cabinet 700;

[0049] First direction L1; second direction L2; third direction L3. DETAILED DESCRIPTION

[0050] In the following, only certain example embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present application. Therefore, the drawings and the description are considered to be exemplary in nature rather than limiting.

[0051] In the related art, a computing assembly is a complete computing system integrating physical components and program components, and is capable of performing specific computing tasks. In a modern computing device cluster, especially in a high-performance computing system, a data center and a server cluster, the computing assembly generates a large amount of heat during operation. An effective heat dissipation system can ensure that the computing device cluster operates within a safe temperature range, preventing performance degradation and hardware damage caused by overheating.

[0052] Based on this, the embodiments of the present application provide a cooling device and a data center, which can improve the cooling efficiency of the computing assembly of the data center, and at the same time optimize the pipeline design of the cooling device, so as to achieve better heat dissipation effect in the limited space of the computing device cluster such as the data center.

[0053] Figure 1 A cooling principle schematic diagram of the cooling device of the embodiments of the present application is shown. Figure 2 A structure schematic diagram of the data center of the embodiments of the present application is shown. As shown in Figure 1 、 Figure 2 The cooling device 100 provided by the embodiments of the present application can include a heat exchange module 10, a first pipeline group 20 and a second pipeline group 30.

[0054] Specifically, the inside of the heat exchange module 10 can be defined with a first heat exchange flow path 10a and a second heat exchange flow path 10b. The first heat exchange flow path 10a can be used for the cooling medium to flow, and the second heat exchange flow path 10b can be used for the heat exchange medium to flow. The cooling medium in the first heat exchange flow path 10b can exchange heat with the heat exchange medium in the second heat exchange flow path 10b, so as to reduce the temperature of the cooling medium.

[0055] The first pipe group 20 can include a first liquid supply pipe 21 and a first liquid return pipe 22. The first liquid supply pipe 21 can be connected with the output end of the first heat exchange flow path 10a, and the first liquid supply pipe 21 can be connected with the liquid inlet of the cooling flow path 210 of the computing assembly 200; the first liquid return pipe 22 can be connected with the input end of the first heat exchange flow path 10a, and the first liquid return pipe 22 can be connected with the liquid outlet of the cooling flow path 210 of the computing assembly 200. The second pipe group 30 can include a second liquid supply pipe 31 and a second liquid return pipe 32; the second liquid supply pipe 31 can be connected with the input end of the second heat exchange flow path 10b, and the second liquid supply pipe 31 can be connected with the medium output end of the cold source device 300; the second liquid return pipe 32 can be connected with the output end of the second heat exchange flow path 10b, and the second liquid return pipe 32 can be connected with the medium return end of the cold source device 300; wherein the first pipe group 20 and the second pipe group 30 can be respectively arranged on opposite sides of the heat exchange module 10. In the embodiment of the present application, the heat exchange module 10 can be a heat exchange device integrated with at least two heat exchange flow paths. Through the internal heat-conducting material, the heat exchange module 10 can realize heat exchange of fluids in different heat exchange flow paths. The heat exchange module 10 can adopt a structure form of plate type, shell and tube type or spiral plate type, and the shell and the partition plate thereof can adopt a material with high heat conduction and corrosion resistance, such as copper, stainless steel, nickel-based alloy or titanium alloy, so as to improve the heat exchange efficiency and use durability of the heat exchange device. The specific type and structure of the heat exchange module 10 are not limited in the embodiment of the present application, and preferably, the heat exchange module 10 can adopt a plate heat exchanger.

[0056] The cooling medium can be a fluid medium flowing through the first heat exchange flow path 10a and needing to be cooled, and the heat exchange medium can be a fluid medium flowing through the second heat exchange flow path 10b and used for absorbing heat. The cooling medium and the heat exchange medium can be selected from fluid media with good heat conduction performance and stability, such as cooling water and refrigerant, and the embodiment of the present application does not make specific limitation thereon.

[0057] In a specific example, the diameters of the corresponding pipes can be adjusted according to the flow requirements of the cooling device 100 at different positions. For example, the nominal diameters of the first pipe group 20 and the second pipe group 30 can be 100 mm, and the nominal diameter of the cooling flow path 210 can be 50 mm.

[0058] It should be noted that the size parameters of the first pipe group 20 and the second pipe group 30 are only exemplary descriptions and cannot be understood as limitations of the present application, and the size parameters of the first pipe group 20 and the second pipe group 30 can be flexibly set according to actual conditions by those skilled in the art.

[0059] As Figure 1 , Figure 2As shown, the first pipe group 20 can be connected to the first heat exchange flow path 10a, and the second pipe group 30 can be connected to the second heat exchange flow path 10b. The first pipe group 20 and the second pipe group 30 can be respectively arranged on opposite sides of the heat exchange module 10. It should be noted that, Figure 1 The first heat exchange flow path 10a and the second heat exchange flow path 10b are shown in the heat exchange module 10 for the purpose of facilitating understanding of the connection relationship between the first heat exchange flow path 10a, the second heat exchange flow path 10b, the first pipe group 20, and the second pipe group 30. The specific structural design of the heat exchange between the first heat exchange flow path 10a and the second heat exchange flow path 10b is not limited in the embodiments of the present application. For example, the parallel heat exchange flow path, the cross heat exchange flow path, or the spiral heat exchange flow path can be used.

[0060] In the embodiments of the present application, the cooling flow path 210 of the computing assembly 200 can be a series of fine pipes. The computing assembly 200 can include a cabinet and a plurality of computing devices arranged in the cabinet. The internal part of the computing device is provided with a cooling medium flow path, and the cooling medium flow paths of the plurality of computing devices collectively form the cooling flow path 210 of the computing assembly 200. The cooling medium flow path can be attached to or embedded in the key heat source part of the computing device, such as the central processing unit, the graphics processing unit, the memory module, and other heat generating electronic components.

[0061] Exemplarily, the heat exchange module 10 can realize heat exchange between the cooling medium in the first heat exchange flow path 10a and the heat exchange medium in the second heat exchange flow path 10b, so as to reduce the temperature of the cooling medium and ensure that the cooling medium is in a low-temperature state before entering the first pipe group 20 through the output end of the first heat exchange flow path 10a. The cooling source device 300 can be used to refrigerate the circulating heat exchange medium to ensure that it is in a low-temperature state before entering the second heat exchange flow path 10b.

[0062] Specifically, the low-temperature cooling medium can enter the first liquid supply pipe 21 through the output end of the first heat exchange flow path 10a, and then enter the cooling flow path 210 of the computing assembly 200 through the first liquid supply pipe 21 to absorb the heat generated by the computing assembly 200 during operation. The high-temperature cooling medium after absorbing heat can flow back to the input end of the first heat exchange flow path 10a through the first liquid return pipe 22, and then exchange heat with the heat exchange medium in the second heat exchange flow path 10b in the first heat exchange flow path 10a, thereby circulating.

[0063] The low-temperature heat exchange medium can flow out from the medium output end of the cold source device 300, enter the second heat exchange flow path 10b through the second liquid supply pipeline 31. Through the heat exchange module 10, the cooling medium in the first heat exchange flow path 10a can exchange heat with the heat exchange medium in the second heat exchange flow path 10b to reduce the temperature of the cooling medium. After heat exchange, the temperature of the heat exchange medium in the second heat exchange flow path 10b is increased, and the high-temperature heat exchange medium flows back to the medium return end of the cold source device 300 through the second liquid return pipeline 32, and the cold source device 300 further processes the heat exchange medium to reduce its temperature again, preparing for the next cooling cycle. The structure and type of the cold source device 300 are not limited in the embodiment of the application. For example, the cold source device 300 can cool the heat exchange medium by using gaseous medium or liquid medium, and a cooling tower or a dry cooler can be used.

[0064] In this way, the cooling device 100 proposed in the embodiment of the application exchanges heat between the cooling medium in the first heat exchange flow path 10a and the heat exchange medium in the second heat exchange flow path 10b through the heat exchange module 10, so as to cool the computing assembly 200 by using the cooled cooling medium, which can improve the cooling efficiency of the computing assembly 200 and prevent performance degradation and hardware damage of the computing element caused by overheating.

[0065] It should be noted that the cooling device 100 in the embodiment of the application can be applied to the data center 1 and integrated with the computing assembly 200 of the data center 1. The data center 1 can be a container type data center, for example, can include a box body 400, and the cooling device 100 and the computing assembly 200 are integrated and arranged in the interior of the box body 400. Since the interior space of the box body 400 is limited, in order to improve the utilization rate of the interior space of the box body 400 and as much as possible improve the deployment quantity of the computing assembly 200 in the box body 400, the arrangement of the first pipeline group 20 and the second pipeline group 30 of the cooling device 100 in the box body 400 is particularly important.

[0066] In the embodiment of the application, the first pipeline group 20 and the second pipeline group 30 are arranged on opposite sides of the heat exchange module 10, which is beneficial to improving the convenience of the pipeline connection between the cooling device 100 and the computing assembly 200 and the cold source device 300, and can fully utilize the space on both sides of the heat exchange module, so that the first pipeline group 20 and the second pipeline group 30 do not interfere with each other, and the utilization rate of the interior space of the box body 400 is improved, thereby improving the compactness of the data center 1.

[0067] In one embodiment, the number of computing assemblies 200 may be multiple, and the multiple computing assemblies 200 may be arranged side by side along the first direction L1; the heat exchange module 10 is arranged on one side of the multiple computing assemblies 200 in the first direction L1, and the first pipeline group 20 and the second pipeline group 30 may be respectively arranged on opposite sides of the heat exchange module 10 in the second direction L2, and the second direction L2 may intersect with the first direction L1.

[0068] In the embodiment of this application, Figure 2 As shown, the data center 1 may include a cabinet 400 (partial structure of the cabinet 400 is shown in the figure), and a cooling device 100 and a plurality of computing assemblies 200 may be provided inside the cabinet 400. In some specific examples, the cabinet 400 of the data center 1 may be a rectangular parallelepiped structure, and the first direction L1 may be parallel to the length direction of the cabinet 400, wherein the length direction of the cabinet 400 may be understood as a straight line direction extending from one end of the longest side of the cabinet 400 to the other end. The second direction L2 may intersect with the first direction L1. For example, the second direction L2 may be parallel to the width direction of the cabinet 400, wherein the width direction of the cabinet 400 may be a direction perpendicular to the length direction of the cabinet 400 and in the same plane. It should be noted that the above application examples provided in the embodiments of the present application are for ease of understanding, and the embodiments of the present application do not specifically limit the specific directions and positional relationships of the first direction L1 and the second direction L2.

[0069] Furthermore, multiple computing assemblies 200 can be arranged side by side and adjacent to each other along a first direction L1. The heat exchange module 10 can be disposed on one side of the multiple computing assemblies 200 in the first direction L1, and the first pipeline group 20 and the second pipeline group 30 can be disposed on opposite sides of the heat exchange module 10 in the second direction L2. The cooling device provided in the embodiments of the present application can be used to dissipate heat in a cluster of high-performance, high-density computing devices, improving the heat exchange efficiency of the cooling system in the device cluster. By optimizing the spatial arrangement of the heat exchange module and pipeline group in the cooling device, a better heat dissipation effect is achieved within the limited space of the device cluster.

[0070] In other examples of the present application, multiple computing assemblies 200 may also be arranged side by side and adjacent to each other along the second direction L2. It is understood that the arrangement of the multiple computing assemblies 200 can be flexibly arranged according to the size of the computing assemblies 200 and the spatial size of the data center 1, as long as the integrated arrangement of the multiple computing assemblies 200 is followed.

[0071] In one embodiment, the first liquid supply pipeline 21 may be connected to the liquid inlets of the cooling flow paths 210 of the plurality of computing assemblies 200 respectively.

[0072] Exemplarily, each computing assembly 200 can correspond to a separately arranged cooling flow path 210, which can ensure uniform cooling of each computing assembly 200 and improve the heat dissipation efficiency of each computing assembly 200. The first liquid supply pipeline 21 can be connected with the liquid inlet of the cooling flow path 210 of each computing assembly 200, to ensure that the cooling medium can smoothly flow into the cooling flow path 210 of each computing assembly 200. In an embodiment, the first liquid supply pipeline 21 can include a first liquid supply sub-pipeline 211 and a second liquid supply sub-pipeline 212 connected with each other, the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212 can extend along the first direction L1 respectively, and be arranged side by side and spaced apart in the second direction L2, the first end of the first liquid supply sub-pipeline 211 can be connected with the output end of the first heat exchange flow path 10a, the second end of the first liquid supply sub-pipeline 211 can be connected with the first end of the second liquid supply sub-pipeline 212, and the second end of the second liquid supply sub-pipeline 212 is provided with an exhaust valve 212b.

[0073] Figure 3 A structural schematic diagram of the first pipeline group and the second pipeline group of the embodiment of the present application is shown from one perspective. Figure 4 A structural schematic diagram of the first pipeline group and the second pipeline group of the embodiment of the present application is shown from another perspective. As shown in the figure, Figures 1 to 4 Further, the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212 can be arranged side by side and spaced apart in the second direction L2. By arranging a plurality of liquid supply sub-pipelines side by side and spaced apart, on the one hand, the flow rate of the medium can be evenly distributed, avoiding that a single pipeline bears too high flow rate and pressure, thereby reducing the pressure loss of fluid flow, reducing the local resistance of fluid when entering and leaving the pipeline, and on the other hand, by arranging each liquid supply sub-pipeline independently, the thermal interference of the cooling fluid between the pipelines can be reduced, and the overall heat exchange efficiency of the cooling device can be improved.

[0074] Further, the first end of the first liquid supply sub-pipeline 211 can be connected with the output end of the first heat exchange flow path 10a, to enable the cooling medium from the first heat exchange flow path 10a to enter the first liquid supply sub-pipeline 211. The second end of the first liquid supply sub-pipeline 211 can be connected with the first end of the second liquid supply sub-pipeline 212, to form a continuous liquid supply path, ensuring that the cooling medium can flow to the cooling flow path 210 of the computing assembly 200 through the second liquid supply pipeline 21. The second end of the second liquid supply sub-pipeline 212 can be provided with an exhaust valve 212b, to exhaust air in the system, prevent air from hindering the flow of the cooling medium, reduce the pressure loss caused by air in the flow of the cooling medium, and ensure smooth flow of the cooling medium.

[0075] In an embodiment, the second liquid supply sub-pipe 212 can be provided with a plurality of liquid distribution ports 212a, which can be arranged along the first direction L1 and correspond to the plurality of computing assemblies 200 one by one. Each liquid distribution port 212a can be in communication with the liquid inlet of the cooling flow path 210 of the corresponding computing assembly 200.

[0076] Exemplarily, each liquid distribution port 212a can be connected to the liquid inlet of the cooling flow path of the corresponding computing assembly 200 through a joint. The liquid distribution port 212a can be formed in the bottom of the wall of the second liquid supply sub-pipe 212.

[0077] In an embodiment, the first liquid return pipe 22 can include a first liquid return section 221, which can be provided with a plurality of liquid return ports 221a, which can be arranged along the first direction L1 and correspond to the plurality of computing assemblies 200 one by one. Each liquid return port 221a can be connected to the liquid outlet of the cooling flow path 210 of the corresponding computing assembly 200.

[0078] Exemplarily, each liquid return port 221a can be connected to the liquid outlet of the cooling flow path 210 of the corresponding computing assembly 200 through a joint. The high-temperature cooling medium in the cooling flow path 210 of each computing assembly 200 enters the first liquid return pipe 22 through the liquid return port 221a, and then flows back to the first heat exchange flow path 10a of the heat exchange module 10 through the first liquid return pipe 22.

[0079] In some specific examples, as shown in Figure 1 each liquid distribution port 212a can be connected to the liquid inlet of the cooling flow path 210 of the corresponding computing assembly 200 through a liquid inlet pipe 301. Each liquid return port 221a can be connected to the liquid outlet of the cooling flow path 210 of the corresponding computing assembly 200 through a liquid outlet pipe 302. The low-temperature cooling medium in the second liquid supply sub-pipe 212 can flow into the cooling flow path 210 of the computing assembly 200 through the liquid inlet pipe 301 to take away the heat generated by the computing assembly during operation. The high-temperature cooling medium in the cooling flow path 210 of each computing assembly 200 can enter the first liquid return pipe 22 through the liquid outlet pipe 302, and then flow back to the first heat exchange flow path 10a of the heat exchange module 10 through the first liquid return pipe 22 to cool the cooling medium.

[0080] In some examples, at least one of the liquid inlet pipe 301 and the liquid outlet pipe 302 is a flexible pipe to accommodate space constraints and facilitate installation and disassembly.

[0081] In other examples, at least one of the liquid inlet pipe 301 and the liquid outlet pipe 302 is a rigid pipe to improve the structural strength of the pipe.

[0082] It should be noted that the above is merely an example and does not constitute a limitation of the present application. Those skilled in the art will appreciate that the flexible tubes used in the liquid inlet lines 301 and 302 may be flexible and elastic tubes such as plastic tubes and corrugated tubes, and the rigid tubes may be relatively hard metal tubes such as copper tubes, aluminum tubes, and stainless steel tubes, or relatively hard and supportive plastic tubes, or rigid tubes made of plastic, metal, or composite materials with a certain degree of hardness and flexibility.

[0083] The materials of the liquid inlet pipes 301 and 302 are not limited to the above examples and can also be any combination of the above materials, such as a combination of soft and hard pipes, both soft pipes, or both hard pipes, etc., but are not limited to these examples. Any other variations or alternative solutions that can be conceived by those skilled in the art within the technical scope disclosed in this application are intended to be included in the scope of protection of this application.

[0084] According to the above embodiment, by providing multiple liquid return ports 221a spaced apart along the first direction L1, the cooling medium's return path is evenly distributed, optimizing space utilization. Furthermore, the modular design of the liquid distribution ports 212a and liquid return ports 221a corresponding to the computing assembly 200 facilitates the overall expansion and maintenance of the cooling system. When adding or removing computing assemblies 200, simply adjust the location and number of the corresponding liquid distribution ports 212a and liquid return ports 221a, thereby improving the flexibility and maintenance efficiency of the cooling system.

[0085] In one embodiment, the first liquid supply pipeline 21 includes a first liquid supply sub-pipeline 211 and a second liquid supply sub-pipeline 212 arranged side by side and spaced apart in the second direction L2, and the first liquid return section 221 is arranged between the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212.

[0086] Exemplarily, the ends of the first liquid supply sub-pipeline 21 and the second liquid supply sub-pipeline 22 away from the heat exchange module are connected to each other, and the first liquid return section 221 can be arranged between the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212 in the second direction.

[0087] With such an arrangement, the space between the first liquid supply sub-pipeline 21 and the second liquid supply sub-pipeline 22 can be fully utilized.

[0088] In one embodiment, the first liquid return line 22 further includes a second liquid return section 222 and a third liquid return section 223. The second liquid return section 222 and the third liquid return section 223 each extend along a third direction L3, which is perpendicular to the first direction L1 and the second direction L2. The first end of the first liquid return section 221 is sealed, the second end of the first liquid return section 221 is connected to the first end of the second liquid return section 222, the second end of the second liquid return section 222 is connected to the first end of the third liquid return section 223, and the second end of the third liquid return section 223 is connected to the input end of the first heat exchange flow path 10a.

[0089] In some examples, the first direction L1 and the second direction L2 can be two horizontal directions perpendicular to each other, and the third direction L3 can be a vertical direction perpendicular to the first direction L1 and the second direction L2. The upper end of the second liquid return section 222 forms its first end, and the upper end of the second liquid return section 222 is connected to the second end of the first liquid return section 221; the lower end of the second liquid return section 222 forms its second end, and the lower end of the second liquid return section 222 is connected to the first end of the third liquid return section 223. The lower end of the third liquid return section 223 forms its first end, the upper end of the third liquid return section 223 forms its second end, and the upper end of the third liquid return section 223 is connected to the input end of the first heat exchange flow path 10a of the heat exchange module 10.

[0090] More specifically, the second liquid return section 222 and the third liquid return section 223 can be arranged side by side and spaced apart in the first direction L1, so that the first liquid return section 221, the second liquid return section 222, and the third liquid return section 223 are coplanarly arranged in a plane perpendicular to the second direction L2, thereby further reducing the space occupied by the first liquid return pipeline 22 in the second direction L2. In this way, the pipeline layout can be effectively optimized, the cooling system structure can be made compact, and the pipeline installation and maintenance can be facilitated.

[0091] like Figure 3 、 Figure 4 As shown, the first liquid return section 221, the second liquid return section 222, and the third liquid return section 223 are interconnected. The first end of the first liquid return section 221 can be closed. After the cooling medium enters the first liquid return section 221 from the output end of the first heat exchange flow path 10a, it can flow along the first liquid return section 221 to the second liquid return section 222. The second end of the second liquid return section 222 can be connected to the first end of the third liquid return section 223 to form a continuous liquid supply path, so that the cooling medium can eventually flow back to the first heat exchange flow path 10a through the third liquid return section 223, completing the closed-loop design of the entire liquid return pipeline. In this way, the cooling medium can be output from the cooling flow path 210, pass through the first liquid return pipeline 22, and finally enter the first heat exchange flow path 10a, thereby achieving an efficient heat exchange effect.

[0092] In an embodiment, a first power device 40 is arranged between the second end of the second return liquid section 222 and the first end of the third return liquid section 223, and is configured to provide power for the flow of the cooling medium.

[0093] In some examples, the first power device 40 can be a fluid power pump configured to push the cooling medium to flow in the pipeline. For example, the first power device 40 can be a fluid power pump with a lift of 3 bar and a delivery flow of 60 m 3 / h.

[0094] It should be noted that the working parameters of the first power device 40 can be flexibly set according to the heat generation of the computing assembly 200 and the heat dissipation efficiency of the cooling device 100, and the above is only an exemplary description, and the embodiments of the present application do not specifically limit the working parameters of the first power device 40.

[0095] In an embodiment, as shown in Figure 1 , the cooling device can further include a first liquid storage container 80 configured to store the cooling medium, and the first return liquid pipeline 22 can further include a first liquid supplement branch 224, the first end and the second end of the first liquid supplement branch 224 can be respectively communicated with the interior of the second return liquid section 222, and the pipe wall of the first liquid supplement branch 224 can be provided with a first liquid supplement interface 224a, the first liquid supplement interface 224a is communicated with the interior of the first liquid storage container 80 through a first connecting branch (not shown in the figure).

[0096] In the embodiments of the present application, the liquid supplement function of the cooling device 100 to the cooling medium can be realized through the cooperation of the first liquid storage container 80 and the first liquid supplement branch 224. For example, the cooling medium in the first pipeline group 20 can be supplemented by an automatic water supplement pump, and the cooling medium can be filtered by a filter. Figure 1 、 Figure 2 As shown in the figure, for the first pipeline group 20, the first return liquid pipeline 22 can further be designed to include one or more first liquid supplement branches 224 communicated with the interior of the second return liquid section 222. The pipe wall of the first liquid supplement branch 224 can be provided with a first liquid supplement interface 224a, and the first liquid supplement interface 224a can be communicated with the interior of the first liquid storage container 80 below the heat exchange module 10 through a first connecting branch (not shown in the figure). Further, the cooling device 100 can automatically supplement the cooling medium during operation through the first liquid storage container 80, the first liquid supplement branch 224 and the automatic water supplement pump, so as to ensure that the total amount of the cooling medium in the cooling device 100 is maintained in an appropriate state.

[0097] Further, the first liquid storage container 80 can be arranged below the heat exchange module 10. In this way, the space below the heat exchange module 10 can be fully utilized, and the space occupation of the first liquid storage container 80 in the horizontal direction is reduced, and the structural compactness of the cooling device 100 is further improved.

[0098] In an embodiment, the cooling device 100 can further comprise a first pressure stabilizing tank 60, and the first liquid return pipeline 22 can further comprise a first pressure stabilizing branch 225, a first end of the first pressure stabilizing branch 225 being in communication with the inside of the first pressure stabilizing tank 60, and a second end of the first pressure stabilizing branch 225 being in communication with the inside of the third liquid return section 223.

[0099] In the embodiments of the present application, the pressure in the cooling device 100 can be adjusted and stabilized by the pressure stabilizing tank. During the operation of the cooling device 100, the temperature change and fluid flow can cause fluctuations in the internal pressure. The first pressure stabilizing tank 60 can be used to maintain the pressure balance of the cooling device 100, avoiding the influence of excessively high or low pressure on the heat dissipation effect. In addition, when the flow of the cooling medium in the cooling device 100 suddenly changes, the first pressure stabilizing tank 60 can act as a buffer to reduce the impact of flow fluctuations on the system and protect other components of the cooling device 100. In some examples, one end of the first pressure stabilizing branch 225 can be connected to the first pressure stabilizing tank 60, and the other end can be connected to the third liquid return section 223. Through the first pressure stabilizing branch 225, the cooling medium can flow freely between the third liquid return section 223 and the first pressure stabilizing tank 60. When the system pressure is too high, the excess cooling medium will enter the pressure stabilizing tank; when the system pressure is too low, the cooling medium in the pressure stabilizing tank will flow back to the system, keeping the pressure stable. Preferably, the volume of the first pressure stabilizing tank 60 can be 20L. The cooling device 100 provided in the embodiments of the present application can improve the stability, reliability and heat dissipation exchange efficiency of the cooling system.

[0100] In an embodiment, the first pressure stabilizing tank 60 can be arranged below the heat exchange module 10.

[0101] For example, the first pressure stabilizing tank 60 is arranged below the first liquid storage container 80. That is, the heat exchange module 10, the first liquid storage container 80 and the first pressure stabilizing tank 60 are arranged in order from top to bottom in the vertical direction. In this way, the space below the heat exchange module 10 can be further utilized, and the space occupation of the first pressure stabilizing tank 60 in the horizontal direction is reduced, and the structural compactness of the cooling device 100 is further improved.

[0102] In an embodiment, the second liquid supply pipeline 31 can include a first liquid supply section 311 and a second liquid supply section 312 connected in series. A first end of the first liquid supply section 311 can be connected to the medium output end of the cooling source device 300. A second end of the first liquid supply section 311 can be connected to a first end of the second liquid supply section 312. A second end of the second liquid supply section 312 can be connected to the input end of the second heat exchange flow path 10b. The first liquid supply section 311 and the second liquid supply section 312 can be respectively extended along the third direction L3 and arranged in the first direction L1.

[0103] For example, an upper end of the first liquid supply section 311 can form the first end thereof, and the upper end of the first liquid supply section 311 can be connected to the medium output end of the cooling source device 300 through a pipeline. A lower end of the first liquid supply section 311 can form the second end thereof, and the lower end of the first liquid supply section 311 can be connected to the first end of the second liquid supply section 312. An upper end of the second liquid supply section 312 can form the second end thereof, and the upper end of the second liquid supply section 312 can be connected to the input end of the second heat exchange flow path 10b.

[0104] In this way, the first liquid supply section 311 and the second liquid supply section 312 can form a continuous liquid supply path. During the cooling process, the low-temperature heat exchange medium can flow out of the medium output end of the cooling source device 300, enter the second heat exchange flow path 10b through the first liquid supply section 311 and the second liquid supply section 312. Through the heat exchange module 10, the cooling medium in the first heat exchange flow path 10a can exchange heat with the heat exchange medium in the second heat exchange flow path 10b to reduce the temperature of the cooling medium. After heat exchange, the temperature of the heat exchange medium in the second heat exchange flow path 10b is increased. The heat exchange medium can return to the medium return end of the cooling source device 300 through the second liquid return pipeline 32, and the cooling source device 300 can further process the heat exchange medium to reduce its temperature and prepare for the next cooling cycle. In this way, the cooling device provided in the embodiments of the present application can exchange heat between the cooling medium in the first heat exchange flow path and the heat exchange medium in the second heat exchange flow path through the heat exchange module, which can improve the heat exchange efficiency of the cooling system in the computing device cluster and prevent performance degradation and hardware damage of the computing elements caused by overheating.

[0105] In addition, by arranging the first liquid supply section 311 and the second liquid supply section 312 in the first direction L1, the space occupation of the second liquid supply pipeline 31 in the second direction L2 can be reduced, and the structural compactness of the cooling device can be further improved.

[0106] In an embodiment, a second power device 50 can be arranged between the second end of the first liquid supply section 311 and the first end of the second liquid supply section 312. The second power device 50 can be used to provide power for the flow of the heat exchange medium.

[0107] In some examples, the second power device 50 can be a fluid power pump to push the heat exchange medium to flow in the pipeline. For example, the second power device 50 can be a fluid power pump with a lift of 2.5 bar and a delivery flow of 65 m 3 / h.

[0108] It should be noted that the working parameters of the second power device 50 can be flexibly set according to the heat generation of the computing assembly 200 and the heat dissipation efficiency of the cooling device 100, and the above is only an exemplary description, and the embodiments of the present application do not specifically limit the working parameters of the second power device 50.

[0109] In an embodiment, the cooling device 100 can further include a second liquid storage container 90 for containing the cooling medium, and the second liquid supply pipeline 31 can further include a second liquid supplement branch 313, the first end and the second end of the second liquid supplement branch 313 can be in communication with the inside of the first liquid supply section 311, and the pipe wall of the second liquid supplement branch 313 can be provided with a second liquid supplement interface 313a, which can be in communication with the inside of the second liquid storage container 90 through a second connecting branch (not shown in the figure).

[0110] In the embodiments of the present application, the liquid supplement function of the cooling device 100 to the heat exchange medium can be realized through the cooperation of the second liquid storage container 90 and the second liquid supplement branch 313. For example, the cooling medium in the second pipeline group 30 can be supplemented by an automatic water supplement pump, and the cooling medium can be filtered by a filter. For example, Figure 1 、 Figure 2 For the second pipeline group 30, the second liquid supply pipeline 31 can further be designed to include one or more second liquid supplement branches 313 in communication with the inside of the first liquid supply section 311. The pipe wall of the second liquid supplement branch 313 can be provided with a second liquid supplement interface 313a, which can be in communication with the inside of the second liquid storage container 90 below the heat exchange module 10 through a second connecting branch (not shown in the figure). Further, the cooling device 100 can automatically supplement the cooling medium during operation through the second liquid storage container 90, the second liquid supplement branch 313 and the automatic water supplement pump, to ensure that the total amount of the heat exchange medium inside the cooling device 100 is maintained in a proper state.

[0111] In an embodiment, the second liquid storage container 90 can be arranged below the heat exchange module 10, and the second liquid storage container 90 and the first liquid storage container 80 are arranged side by side and adjacent in the second direction L2. In this way, the space below the heat exchange module 10 can be fully utilized, reducing the space occupation of the second liquid storage container 90 in the horizontal direction, and further improving the structural compactness of the cooling device 100.

[0112] In an embodiment, the cooling device 100 can further comprise a second pressure stabilizing tank 70; the second liquid supply pipeline 31 can further comprise a second pressure stabilizing branch 314, a first end of the second pressure stabilizing branch 314 being in communication with an interior of the second pressure stabilizing tank 70, and a second end of the second pressure stabilizing branch 314 being in communication with an interior of the first liquid supply section 311.

[0113] In the embodiment, the second liquid storage container 90 and the second liquid supplement branch 313 can be used to supplement liquid in the second pipeline group 30 of the cooling device 100, and the second pressure stabilizing tank 70 can be used to adjust and stabilize the pressure in the cooling device 100. Preferably, the volume of the second liquid storage container 90 can be 30 L, and the volume of the second pressure stabilizing tank 70 can be 20 L. The cooling device provided in the embodiment can improve the stability, reliability and heat exchange efficiency of the cooling system.

[0114] In an embodiment, the second pressure stabilizing tank 70 can be arranged below the heat exchange module 10.

[0115] For example, the second pressure stabilizing tank 70 can be arranged below the second liquid storage container 90. That is, the heat exchange module 10, the second liquid storage container 90 and the second pressure stabilizing tank 70 are arranged in sequence from top to bottom in the vertical direction, and the second pressure stabilizing tank 70 and the first pressure stabilizing tank 60 are arranged adjacent to each other in the second direction L2. In this way, the space below the heat exchange module 10 can be further utilized, and the space occupied by the second pressure stabilizing tank 70 in the horizontal direction can be reduced, thereby further improving the compactness of the cooling device 100.

[0116] In an embodiment, the medium flow directions of the first heat exchange flow path 10a and the second heat exchange flow path 10b are the same.

[0117] For example, the medium flow directions of the first heat exchange flow path 10a and the second heat exchange flow path 10b in the heat exchange module 10 can be the same. In the embodiment, the high-temperature cooling medium and the low-temperature heat exchange medium can flow in the same direction in the heat exchange module 10, which can make the temperature change in the heat exchange module 10 more uniform, thereby prolonging the service life of the heat exchange module 10.

[0118] In an embodiment, the medium flow directions of the first heat exchange flow path 10a and the second heat exchange flow path 10b are opposite.

[0119] For example, the medium flow directions of the first heat exchange flow path 10a and the second heat exchange flow path 10b in the heat exchange module 10 can be opposite. In the embodiment, the high-temperature cooling medium and the low-temperature heat exchange medium can flow in opposite directions in the heat exchange module 10, which can keep a large temperature difference between the two ends of the heat exchange module 10, thereby improving the efficiency of heat transfer.

[0120] In an embodiment, the input end of the first heat exchange flow path 10a can be located below the output end of the first heat exchange flow path 10a; the input end of the second heat exchange flow path 10b can be located above the output end of the second heat exchange flow path 10b. In some examples, the flow directions of the media in the first pipe group 20 and the second pipe group 30 can be set according to specific application requirements, and the specific positional relationship between the input end and the output end of the heat exchange flow path can be set according to the actual flow directions of the cooling medium and the heat exchange medium in the pipe group.

[0121] As another aspect of the present application, as shown in Figure 1 、 Figure 2 The present application also provides a data center 1, which includes at least one computing assembly 200, a cold source device 300, and the cooling device 100 of any of the above embodiments.

[0122] Specifically, the computing assembly 200 can include a cabinet 220, a plurality of computing devices 230, and a cooling flow path 210. The plurality of computing devices 230 can be integrally arranged inside the cabinet 220, and the cooling flow path 210 can be used to flow through the plurality of computing devices 230.

[0123] In the embodiments of the present application, the cooling device 100 can use liquid cooling to cool the computing devices 230 of each computing assembly 200. The cooling flow path 210 passes through the plurality of computing devices 230, and is used to flow through each computing device 230 during the flow of the cooling medium inside the cooling flow path 210, so that the cooling medium exchanges heat with each computing device 230, thereby transferring the heat generated by the computing devices 230 during operation to the cooling medium, and achieving cooling of the plurality of computing devices 230.

[0124] The cooling device 100 can include a heat exchange module 10, a first pipe group 20, and a second pipe group 30. The heat exchange module 10 can include a first heat exchange flow path 10a and a second heat exchange flow path 10b, and is used to cool the cooling medium. The first pipe group 20 can include a first liquid supply pipe 21 and a first liquid return pipe 22. The first liquid supply pipe 21 is connected between the input end of the cooling flow path 210 of each computing assembly 200 and the heat exchange module 10, and is used to deliver the low-temperature cooling medium cooled by the heat exchange module 10 to the cooling flow path 210 of the computing assembly 200. The first liquid return pipe 22 is connected between the output end of the cooling flow path 210 of each computing assembly 200 and the heat exchange module 10, and is used to deliver the high-temperature cooling medium flowing through the computing assembly 200 from the cooling flow path 210 of the computing assembly 200 back to the heat exchange module 10.

[0125] The first heat exchange flow path 10a of the heat exchange module 10 can be in communication with the cooling flow path 210 of the at least one computing assembly 200 to form a first circulation flow path, and the second heat exchange flow path 10b of the heat exchange module 10 can be in communication with the cold source device 300 to form a second circulation flow path. Specifically, the first heat exchange flow path 10a is used for the cooling medium to flow, and the second heat exchange flow path 10b is used for the heat exchange medium to flow. The cooling medium in the first heat exchange flow path 10a exchanges heat with the heat exchange medium in the second heat exchange flow path 10b during the flow process, and the heat of the cooling medium is transferred to the heat exchange medium to reduce the temperature of the cooling medium, thereby achieving the cooling of the cooling medium. The heat exchange module 10 is in communication with the cooling flow path 210 of the computing assembly 200 through the first pipe group 20 and is in communication with the cold source device 300 through the second pipe group 30. The output end of the first heat exchange flow path 10a is connected with the first liquid supply pipe 21, and the input end of the first heat exchange flow path 10a is connected with the first liquid return pipe 22. The input end and the output end of the second heat exchange flow path 10b are connected with the medium output end and the medium input end of the cold source device 300 through the second pipe group 30, respectively, and the cold source device 300 can be used for cooling the heat exchange medium.

[0126] In the embodiments of the present application, the heat exchange module can adopt any one of a plate heat exchanger, a shell-and-tube heat exchanger, a spiral plate heat exchanger, a finned tube heat exchanger, and a micro-channel heat exchanger. It should be noted that the above is only an exemplary description, and the structure and form of the heat exchange module are not specifically limited in the embodiments of the present application. In some specific examples, the data center 1 can include a plurality of computing assemblies 200. The plurality of computing assemblies 200 can be arranged side by side and adjacent along the first direction L1. The first pipe group 20 of the cooling device 100 passes through the plurality of computing assemblies 200 and is connected with the cooling flow path 210 of each computing assembly 200. Among them, the frame structure 500 can be fixedly connected to the top of the plurality of computing assemblies 200 to achieve the connection and fixation of the plurality of computing assemblies 200. In addition, the frame structure 500 can also be used to provide support and fixation for the first pipe group 20, thereby achieving the fixation of the first pipe group 20 relative to the at least one computing assembly 200.

[0127] In some embodiments, the data center 1 can further include a frame structure 500 and a support platform 600. Specifically, the frame structure 500 is fixed on top of the at least one computing assembly 200, and at least part of the first pipe group 20 is supported on the frame structure 500. The at least one computing assembly 200 and the cooling device 100 are integrated on the support platform 600, the heat exchange module 10 is arranged on one side of the at least one computing assembly 200 in the first direction L1, and the first pipe group 20 is arranged on one side of the heat exchange module 10 in the second direction L2, which intersects the first direction. The data center 1 of the embodiments of the present application forms a pry block structure by integrating the computing assembly 200 and the cooling device 100 on a unified support platform 600, which can be transported and delivered uniformly, and can be directly positioned after delivery, reducing the requirements for land flatness and concrete foundation. In addition, the heat exchange module 10, the first pipe group 20, and the second pipe group 30 can be adapted in spatial position with the computing assembly 200, and the frame structure 500 provides a support and fixing structure for the first pipe group 20 of the cooling device 100, improving the space utilization, the integration degree of the data center 1, and the structural stability.

[0128] In some embodiments, the data center 1 can further include a power distribution cabinet 700, which directly supplies power to the computing devices 200 of the data center 1. In the high-density device environment of the data center 1, water and electricity separation can effectively prevent safety hazards caused by liquid leakage to electrical equipment, ensuring efficient, safe, and stable operation of the data center.

[0129] For example, the power distribution cabinet 700 can be arranged separately from the cooling device 100.

[0130] In some examples, the power distribution cabinet 700 and the cooling device 100 are distributed on opposite sides of the at least one computing assembly 200 in the first direction L1, i.e., the cooling device 100 is arranged on one side of the at least one computing assembly 200 in the first direction L1, and the power distribution cabinet 700 is arranged on the other side of the at least one computing assembly 200 in the first direction L1. By increasing the distance between the power distribution cabinet 700 and the cooling device 100, and by physically isolating the power distribution cabinet 700 and the cooling device 100 through the computing assembly 200, the overall reliability of the data center is greatly improved.

[0131] In other examples, the power distribution cabinet 700 and the cooling device 100 are distributed on opposite sides of the at least one computing assembly 200 in the second direction L2, and the power distribution cabinet 700 and the cooling device 100 are isolated by the at least one computing assembly 200, improving the safety of water and electricity separation.

[0132] It should be noted that the above is only for illustration and does not constitute a limitation on the present application.

[0133] Those skilled in the art can understand that, based on the basic principle of spacing the power distribution cabinet 700 and the cooling device 100, there can be other ways to space the power distribution cabinet 700 and the cooling device 100, for example, the power distribution cabinet 700 and the cooling device 100 are spaced in the up-down direction of the at least one computing assembly 200, that is, one of the power distribution cabinet 700 and the cooling device 100 is located above the computing assembly 200, and the other is located below the computing assembly 200, to achieve physical isolation of the power distribution cabinet 700 and the cooling device 100; for another example, the power distribution cabinet 700 and the cooling device 100 are not isolated by the computing assembly 200, and water and electricity can be separated by adding other objects or directly by increasing the distance between them. It should be noted that this is only an example, and the spacing of the power distribution cabinet 700 and the cooling device 100 is not limited to the foregoing examples.

[0134] In some examples, the power distribution cabinet 700 and the cooling device 100 can be integrated in different areas of the support platform 600. On the one hand, the support platform 600 raises the power distribution cabinet 700 and does not contact the placement surface of the data center 1, which can avoid the leakage of the cooling device 100 from affecting the power distribution cabinet 700; on the other hand, the support platform 600 can guide the leakage of the cooling device 100 to the outside of the support platform 600, completely isolating water and electricity, and further improving the safety of the data center 1.

[0135] In a specific example, the power distribution cabinet 700 of the data center 1 is arranged on the support platform 600 and located on the other side of the at least one computing assembly 200 in the first direction L1, that is, the power distribution cabinet 700 and the heat exchange module 10 are opposite to each other in the first direction L1, and are respectively located on the two sides of the at least one computing assembly 200 opposite to each other in the first direction L1. The leakage of the cooling device 100 can be discharged to the outside of the support platform 600 and will not deposit on the support platform 600, and the water on the placement surface will not affect the power distribution cabinet 700.

[0136] In addition, the power distribution cabinet 700 and the cooling device 100 are integrated on the support platform 600, which not only effectively utilizes the vertical and horizontal space, reduces the physical floor area, and facilitates overall transportation and delivery, but also simplifies the monitoring and management process, facilitates operation and maintenance of the operation and maintenance personnel, and further reduces the distance and time of power and signal transmission, improves the response speed of the data center 1, and improves the overall reliability of the data center 1. It should be noted that this is only an example, and the positional relationship of the power distribution cabinet 700 and the cooling device 100 relative to the support platform 600 is not limited to the foregoing example. Those skilled in the art can think of other various changes or alternatives within the technical scope disclosed in the present application, which should be included in the protection scope of the present application.

[0137] Figure 5 The overall structure of the data center according to the embodiments of the present application is shown. In some embodiments, as shown in Figure 5 The data center 1 can also include a box 400. The inside of the box 400 defines a receiving cavity, and at least one computing assembly 200, cooling device 100, frame structure 500 and support platform 600 can be integrated in the receiving cavity. In the embodiments of the present application, the shape and size of the box 400 can be arbitrarily set by those skilled in the art according to the actual situation. In order to facilitate transportation, the shape and size of the box 400 can be set in accordance with the corresponding standard container, for example, the same shape and size as a 20-foot, 40-foot or 45-foot standard container can be used.

[0138] In one specific example, the shape and size of the box 400 can be set in accordance with a 40-foot standard container, and the overall size is 12.192m*2.438m*2.438m. Thus, after the computing assembly 200, cooling device 100, frame structure 500 and support platform 600 are integrated and deployed in the receiving cavity of the box 400, the data center 1 can be directly transported by sea or other means such as land transportation, and no secondary assembly is required after transportation is completed, thereby improving the convenience of transportation and delivery.

[0139] It should be noted that the shape and size of the box 400 can be flexibly set according to the actual situation, and preferably the shape and size of the box 400 can match the shape and size of the data center 1 to ensure the best space utilization.

[0140] In addition, it should be noted that, in the example in which the data center 1 is arranged inside the box body 400 to form a container type, the positional relationship between the power distribution cabinet 700 and the cooling device 100 and the box body 400 can be other than that both are accommodated inside the box body 400, for example, one of the power distribution cabinet 700 and the cooling device 100 can be arranged inside the box body 400, and the other can be arranged outside the box body 400, so that the power distribution cabinet 700 and the cooling device 100 are physically isolated by the box body 400, thereby improving the safety of water and electricity separation; for another example, the power distribution cabinet 700 and the cooling device 100 are both located outside the box body 400 and are located at different sides of the box body 400, respectively, so that the power distribution cabinet 700 and the cooling device 100 are physically isolated by the box body 400, thereby ensuring the safety of water and electricity separation. It should be noted that this is only an example and does not limit the application, and the positional relationship between the power distribution cabinet 700 and the cooling device 100 and the box body 400 is not limited to the foregoing examples. Those skilled in the art can think of other various changes or alternatives within the technical scope disclosed in the present application, which should be included in the protection scope of the present application.

[0141] The other configurations of the data center 1 of the above embodiments can adopt various technical solutions known to those skilled in the art now and in the future, which will not be described in detail here.

[0142] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0143] In addition, the terms "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0144] In the present application, unless specifically defined otherwise, the terms "mount", "connected", "connecting", "fixed", and "fixedly" mean to be connected by any method, including, but not limited to, fixedly connected, releasably connected, or integrally connected. The terms "mechanically connected", "electrically connected", and "communicatively connected" mean to be directly or indirectly connected by any method including, but not limited to, mechanically, electrically, or communicatively. The terms "directly connected", "directly coupled", and "directly attached" mean to be connected by any method without any intervening material between two elements. The terms "indirectly connected", "indirectly coupled", and "indirectly attached" mean to be connected by any method with one or more intervening materials between two elements.

[0145] In the present application, unless specifically defined otherwise, the terms "on", "under", and "underneath" with respect to a first feature and a second feature mean that the first feature can be in direct contact with the second feature or the first feature can be in contact with the second feature through another feature between the first feature and the second feature. In addition, the terms "on", "over", and "above" with respect to a first feature and a second feature mean that the first feature can be directly above the second feature or obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. The terms "under", "below", and "beneath" with respect to a first feature and a second feature mean that the first feature can be directly below the second feature or obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0146] It is noted that, although the various steps of the methods of the present application are described in a particular order in the accompanying drawings, this does not require or imply that the steps must be performed in that particular order, or that all of the steps must be performed to achieve the desired result. Additionally or alternatively, certain steps can be omitted, multiple steps can be combined into a single step, a single step can be split into multiple steps, etc. The accompanying drawings are merely schematic illustrations of the processes included in the methods according to the exemplary embodiments of the present application, and are not intended to be limiting. It is readily understood that the processes shown in the accompanying drawings do not indicate or limit the time order of the processes. In addition, it is readily understood that the processes can be performed synchronously or asynchronously, for example, in multiple modules.

[0147] The above disclosure provides many different embodiments, or examples, for implementing different structures of the present application. For purposes of simplicity of the present application, the above description has focused on specific examples. As those skilled in the art will appreciate, the present application is not limited to the examples described above, but extends to and includes variations and modifications to these examples. Further, the above description is intended to be illustrative, and not restrictive. For example, the above-described embodiments and / or examples can be used in combination with each other. In addition, many variations and modifications will be apparent to those of ordinary skill in the art once given the benefit of the present application. The formulas should therefore not be construed as limiting the scope of the application, but merely as illustrative. Further, it is intended to embrace all such variations and modifications as fall within the scope of the appended claims.

[0148] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of various changes or replacements within the technical range disclosed by the present application, and these should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A cooling device, characterized in that: include: The heat exchange module defines a first heat exchange flow path and a second heat exchange flow path therein, wherein the first heat exchange flow path is used for a cooling medium to flow, and the second heat exchange flow path is used for a heat exchange medium to flow, and the cooling medium in the first heat exchange flow path exchanges heat with the heat exchange medium in the second heat exchange flow path to reduce the temperature of the cooling medium; a first pipeline group, comprising a first liquid supply pipeline and a first liquid return pipeline; the first liquid supply pipeline is connected to the output end of the first heat exchange flow path, and the first liquid supply pipeline is connected to the liquid inlet of the cooling flow path of the computing assembly; the first liquid return pipeline is connected to the input end of the first heat exchange flow path, and the first liquid return pipeline is connected to the liquid outlet of the cooling flow path; A second pipeline group includes a second liquid supply pipeline and a second liquid return pipeline; the second liquid supply pipeline is connected to the input end of the second heat exchange flow path, and the second liquid supply pipeline is connected to the medium output end of the cold source device; the second liquid return pipeline is connected to the output end of the second heat exchange flow path, and the second liquid return pipeline is connected to the medium return end of the cold source device; Wherein, the first pipeline group and the second pipeline group are respectively arranged on two opposite sides of the heat exchange module.

2. The cooling device according to claim 1, characterized in that There are multiple computing assemblies, and the multiple computing assemblies are arranged side by side along the first direction; the heat exchange module is arranged on one side of the multiple computing assemblies in the first direction, and the first pipeline group and the second pipeline group are respectively arranged on opposite sides of the heat exchange module in the second direction, and the second direction intersects with the first direction.

3. The cooling device according to claim 2, characterized in that The first liquid supply pipeline is respectively connected to the liquid inlets of the cooling flow paths of the plurality of computing assemblies.

4. The cooling device according to claim 3, characterized in that The first liquid supply pipeline includes a first liquid supply sub-pipeline and a second liquid supply sub-pipeline that are connected to each other. The first liquid supply sub-pipeline and the second liquid supply sub-pipeline extend along the first direction respectively, and are arranged side by side and at intervals in the second direction. The first end of the first liquid supply sub-pipeline is connected to the output end of the first heat exchange flow path, and the second end of the first liquid supply sub-pipeline is connected to the first end of the second liquid supply sub-pipeline. An exhaust valve is provided at the second end of the second liquid supply sub-pipeline.

5. The cooling device according to claim 4, characterized in that The second liquid supply sub-pipeline is provided with a plurality of liquid distribution ports, which are arranged at intervals along the first direction and correspond one-to-one to the plurality of computing assemblies, and each of the liquid distribution ports is connected to the liquid inlet of the cooling flow path of the corresponding computing assembly.

6. The cooling device according to claim 2, characterized in that The first liquid return pipeline is respectively connected to the liquid outlets of the cooling flow paths of the plurality of computing assemblies.

7. The cooling device according to claim 6, characterized in that The first liquid return pipeline includes a first liquid return section, which is provided with multiple liquid return ports. The multiple liquid return ports are arranged at intervals along the first direction and correspond one-to-one to the multiple computing assemblies. Each of the liquid return ports is connected to the liquid outlet of the cooling flow path of the corresponding computing assembly.

8. The cooling device according to claim 7, characterized in that The first liquid supply pipeline includes a first liquid supply sub-pipeline and a second liquid supply sub-pipeline arranged side by side and at intervals in the second direction, and the first liquid return section is arranged between the first liquid supply sub-pipeline and the second liquid supply sub-pipeline.

9. The cooling device according to claim 7, characterized in that The first liquid return pipeline also includes a second liquid return section and a third liquid return section, the second liquid return section and the third liquid return section respectively extend along a third direction, and the third direction is perpendicular to the first direction and the second direction respectively; the first end of the first liquid return section is closed, the second end of the first liquid return section is connected to the first end of the second liquid return section, the second end of the second liquid return section is connected to the first end of the third liquid return section, and the second end of the third liquid return section is connected to the input end of the first heat exchange flow path.

10. The cooling device according to claim 9, characterized in that A first power device is further provided between the second end of the second liquid return section and the first end of the third liquid return section, and the first power device is used to provide power for the flow of the cooling medium.

11. The cooling device according to claim 9, characterized in that The cooling device further includes a first liquid storage container; The first liquid return pipeline also includes a first liquid infusion branch, the first end and the second end of the first liquid infusion branch are respectively connected to the interior of the second liquid return section, and a first liquid infusion interface is opened on the wall of the first liquid infusion branch, and the first liquid infusion interface is connected to the interior of the first liquid storage container through a first connecting branch.

12. The cooling device according to claim 11, characterized in that The first liquid storage container is arranged below the heat exchange module.

13. The cooling device according to claim 9, characterized in that The cooling device further includes a first surge tank; The first liquid return pipeline further includes a first pressure stabilizing branch pipe, a first end of the first pressure stabilizing branch pipe is communicated with the interior of the first pressure stabilizing tank, and a second end of the first pressure stabilizing branch pipe is communicated with the interior of the third liquid return section.

14. The cooling device according to claim 13, characterized in that The first pressure stabilizing tank is arranged below the heat exchange module.

15. The cooling device according to claim 2, characterized in that The second liquid supply pipeline includes a first liquid supply section and a second liquid supply section connected to each other, the first end of the first liquid supply section is connected to the medium output end of the cold source equipment, the second end of the first liquid supply section is connected to the first end of the second liquid supply section, and the second end of the second liquid supply section is connected to the input end of the second heat exchange flow path; wherein, the first liquid supply section and the second liquid supply section extend respectively along the third direction and are spaced apart in the first direction.

16. The cooling device according to claim 15, characterized in that A second power device is further provided between the second end of the first liquid supply section and the first end of the second liquid supply section, and the second power device is used to provide power for the flow of the heat exchange medium.

17. The cooling device according to claim 15, characterized in that The cooling device further includes a second liquid storage container; The second liquid supply pipeline also includes a second liquid infusion branch, the first end and the second end of the second liquid infusion branch are respectively connected to the interior of the first liquid supply section, and a second liquid infusion interface is opened on the wall of the second liquid infusion branch, and the second liquid infusion interface is connected to the interior of the second liquid storage container through a second connecting branch.

18. The cooling device according to claim 17, characterized in that The second liquid storage container is arranged below the heat exchange module.

19. The cooling device according to claim 15, characterized in that The cooling device also includes a second surge tank; The second liquid supply pipeline further includes a second pressure stabilizing branch pipe, a first end of the second pressure stabilizing branch pipe is communicated with the interior of the second pressure stabilizing tank, and a second end of the second pressure stabilizing branch pipe is communicated with the interior of the first liquid supply section.

20. The cooling device according to claim 19, characterized in that The second pressure stabilizing tank is arranged below the heat exchange module.

21. The cooling device according to any one of claims 1 to 20, characterized in that The medium flow directions of the first heat exchange flow path and the second heat exchange flow path are opposite.

22. The cooling device according to claim 21, characterized in that The input end of the first heat exchange flow path is located below the output end of the first heat exchange flow path; the input end of the second heat exchange flow path is located above the output end of the second heat exchange flow path.

23. A data center, characterized in that: include: at least one computing assembly, the computing assembly comprising a cabinet, a plurality of computing devices, and a cooling flow path, the plurality of computing devices being integrated into the cabinet, the cooling flow path being configured to allow a cooling medium to flow through the plurality of computing devices; Cold source equipment, used to cool the heat exchange medium; According to the cooling device according to any one of claims 1 to 22, the first heat exchange flow path of the heat exchange module is connected to the cooling flow path of the at least one computing assembly to form a first circulation flow path, and the second heat exchange flow path of the heat exchange module is connected to the cold source device to form a second circulation flow path.

24. The data center according to claim 23, wherein: Also includes: The computing assembly and the cooling device are arranged inside the box.

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