Heat dissipation structure, container and data center

Abstract

The embodiment of the utility model provides a heat dissipation structure, a container and a data center, the heat dissipation structure comprises at least one rack, a cooling device, a top frame and a supporting platform, the rack comprises a cabinet for integrated installation of a plurality of computing devices and a medium flow path for a cooling medium to flow through the plurality of computing devices; the cooling equipment comprises a heat exchange module and a first pipeline group connected between the heat exchange module and the medium flow path; the top frame is fixed to the top of the rack, and at least part of the first pipeline set is supported on the top frame. The rack and the cooling equipment are integrated on the supporting platform, the heat exchange module is arranged on one side of the rack in the first direction, and the first pipeline set is located on one side of the heat exchange module in the second direction, so that a skid structure is formed, the integration level and the structural stability of the heat dissipation structure are improved, unified transportation and delivery are achieved, and the heat dissipation efficiency is improved. And the concrete can be directly placed in place after being delivered, so that the requirements on land flatness and concrete foundations are reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of data centers, and in particular to a heat dissipation structure, a container and a data center. BACKGROUND

[0002] A data center is generally arranged with multiple computing devices and cooling devices for dissipating heat of the computing devices. Before delivery, the computing devices and the cooling devices are independent of each other, and need to be packaged and transported separately, which is relatively high in transportation cost. After delivery, the arrangement of the computing devices and the cooling devices needs to be adjusted to match the site, and then assembled and tested, which results in a relatively long deployment period. SUMMARY

[0003] Embodiments of the present application provide a heat dissipation structure, a container and a data center to solve or alleviate one or more technical problems in the prior art.

[0004] As an aspect of the embodiments of the present application, a heat dissipation structure is provided, comprising:

[0005] at least one rack, the rack comprising a cabinet and a medium flow path, the cabinet being configured to integrate multiple computing devices, and the medium flow path being configured to allow a cooling medium to flow through the multiple computing devices;

[0006] a cooling device, comprising a heat exchange module and a first pipe group, the first pipe group being connected between the heat exchange module and the medium flow path of the at least one rack;

[0007] a top frame, fixed to a top of the at least one rack, at least part of the first pipe group being supported by the top frame;

[0008] a support platform, the at least one rack and the cooling device being integrated in the support platform, the heat exchange module being arranged on one side of the at least one rack in a first direction, and the first pipe group being arranged on one side of the heat exchange module in a second direction, the second direction intersecting the first direction.

[0009] In an embodiment, the support platform comprises:

[0010] a frame structure, a support plate and a rack body, the frame structure having a first area and a second area arranged in a first direction, the support plate covering the first area, and the rack body being arranged in the second area;

[0011] the at least one rack being arranged on the support plate, and the heat exchange module being supported on an upper portion of the rack body.

[0012] In an embodiment, the cooling device further comprises a second pipe group, the second pipe group being connected between the heat exchange module and a cooling source device.

[0013] The second region comprises three sub-regions arranged in the second direction, a projection of the rack in a horizontal plane is located in a middle sub-region, and a bottom end of the rack is connected to the middle sub-region.

[0014] At least part of the pipe sections of the first pipe group and at least part of the pipe sections of the second pipe group are respectively located in two side sub-regions in a projection in a horizontal plane.

[0015] In an embodiment, the support plate comprises a plurality of plate bodies arranged in a splicing manner, each plate body is connected to the frame structure by a corresponding fastener.

[0016] A gap is defined between two adjacent plate bodies, and the gap is used to guide the liquid on the support plate to flow below the support plate.

[0017] In an embodiment, the upper surface of the plate body is formed with a plurality of protruding structures distributed at intervals.

[0018] In an embodiment, the top frame comprises a plurality of cross beams and at least one longitudinal beam; the plurality of cross beams respectively extend along the first direction and are arranged side by side at intervals in the second direction, and the cross beams are fixedly connected to the top of the at least one rack; the longitudinal beam extends along the second direction.

[0019] Among them, at least one longitudinal beam is fixedly connected between two adjacent cross beams, and part of the first pipe group is supported on the longitudinal beam.

[0020] In an embodiment, the plurality of cross beams comprises a first beam body and a second beam body, and the first beam body and the second beam body are fixedly connected to the top of the at least one rack.

[0021] The longitudinal beam comprises a first section and a second section connected to each other, the first section is connected between the first beam body and the second beam body, and the second section is located on a side of the second beam body away from the first beam body and extends to an outside of the rack in the second direction.

[0022] Part of the first pipe group is supported on the second section.

[0023] In an embodiment, the number of racks is a plurality, and the plurality of racks are arranged side by side along the first direction.

[0024] The number of longitudinal beams is a plurality, and the plurality of longitudinal beams correspond to the plurality of racks one by one, and the longitudinal beam is located on the top of the corresponding rack.

[0025] In an embodiment, the top frame further comprises at least one pipe support seat, the at least one pipe support seat corresponds to the at least one longitudinal beam one by one, the pipe support seat is arranged on the second section of the corresponding longitudinal beam, and part of the first pipe group is supported on the pipe support seat.

[0026] In an embodiment, the pipe support seat has a clamping groove with an upwardly arranged opening, and the inner wall surface of the clamping groove is an arc surface matched with the outer peripheral wall shape of the pipes of the first pipe group.

[0027] In an embodiment, the heat dissipation structure further comprises a power distribution cabinet arranged on the support platform and located on the other side of the at least one rack in the first direction to be opposite to the heat exchange module in the first direction.

[0028] The rack further comprises a power distribution unit arranged in the cabinet, and the power distribution unit is connected with the power distribution cabinet through a power supply cable.

[0029] In an embodiment, the top frame further comprises at least one bracket corresponding to the at least one rack, and the bracket is arranged on the top of the corresponding rack and located between the first beam body and the second beam body; the top of the bracket has a supporting surface for supporting the power supply cable.

[0030] In an embodiment, the top of the cabinet of the rack is formed with a first wire passing hole located on the side of the corresponding bracket away from the power distribution cabinet in the first direction, and the first wire passing hole is used for the corresponding power supply cable to pass through and connect with the corresponding power distribution unit.

[0031] The top of the power distribution cabinet is formed with a second wire passing hole for the power supply cable to pass through and connect with the power distribution cabinet.

[0032] In an embodiment, the heat exchange module has a first heat exchange flow path for the cooling medium to flow and a second heat exchange flow path for the heat exchange medium to flow, and the cooling medium in the first heat exchange flow path exchanges heat with the heat exchange medium in the second heat exchange flow path to reduce the temperature of the cooling medium.

[0033] The first pipe group comprises a first liquid supply pipe and a first liquid return pipe; the first liquid supply pipe is connected with the output end of the first heat exchange flow path, and the first liquid supply pipe is connected with the liquid inlet of the medium flow path of the rack; the first liquid return pipe is connected with the input end of the first heat exchange flow path, and the first liquid return pipe is connected with the liquid outlet of the medium flow path.

[0034] The cooling device further comprises a second pipe group connected between the second heat exchange flow path of the heat exchange module and the cold source device and located on the other side of the heat exchange module in the second direction.

[0035] In an embodiment, the first liquid supply pipe comprises a first liquid supply sub-pipe and a second liquid supply sub-pipe connected with each other, and the first liquid supply sub-pipe and the second liquid supply sub-pipe respectively extend along the first direction and are arranged side by side and spaced apart in the second direction.

[0036] The first liquid supply sub-pipe has a liquid supply inlet at one end adjacent to the heat exchange module, and the liquid supply inlet is connected with an output end of the first heat exchange flow path; and the second liquid supply sub-pipe has a liquid supply outlet connected with a liquid inlet of the medium flow path.

[0037] The first liquid return pipe includes a first liquid return section extending in the first direction; and the first liquid return section has a liquid return inlet connected with a liquid outlet of the medium flow path.

[0038] In one embodiment, the number of racks is multiple, and the multiple racks are arranged side by side in the first direction.

[0039] The number of liquid supply outlets is multiple, and the multiple liquid supply outlets are arranged at intervals in the first direction of the second liquid supply sub-pipe and are connected one by one with the liquid inlets of the medium flow paths of the multiple racks.

[0040] The number of liquid return inlets is multiple, and the multiple liquid return inlets are arranged at intervals in the first direction of the first liquid return section and are connected one by one with the liquid outlets of the medium flow paths of the multiple racks.

[0041] In one embodiment, the first liquid supply sub-pipe, the second liquid supply sub-pipe, and the first liquid return section are all supported on the top frame, and the first liquid return section is arranged between the first liquid supply sub-pipe and the second liquid supply sub-pipe.

[0042] In one embodiment, the first liquid return pipe further includes a second liquid return section and a third liquid return section connected in sequence, and the second liquid return section and the third liquid return section respectively extend in the vertical direction; one end of the first liquid return section away from the heat exchange module is closed, one end of the first liquid return section adjacent to the heat exchange module is connected with a first end of the second liquid return section, a second end of the second liquid return section is connected with a first end of the third liquid return section, and a second end of the third liquid return section is connected with an input end of the first heat exchange flow path.

[0043] In one embodiment, the support platform includes a frame structure having a second area including three sub-areas arranged in the second direction, the three sub-areas being a middle sub-area and two side sub-areas respectively.

[0044] The second liquid return section and the third liquid return section are located in the sub-area adjacent to one side of the first liquid supply pipe in the horizontal plane.

[0045] In one embodiment, the second pipe group includes a second liquid supply pipe and a second liquid return pipe; the second liquid supply pipe is connected with an input end of the second heat exchange flow path, and the second liquid supply pipe is connected with a medium output end of the cold source device; and the second liquid return pipe is connected with an output end of the second heat exchange flow path, and the second liquid return pipe is connected with a medium return end of the cold source device.

[0046] In an embodiment, the support platform comprises a frame structure, the frame structure has a second region, the second region comprises three sub-regions arranged in a second direction, the three sub-regions are a middle sub-region and two side sub-regions respectively.

[0047] The normal projection of the second liquid supply pipeline and the second liquid return pipeline in a horizontal plane is located in the sub-region on the side away from the first liquid supply pipeline.

[0048] In an embodiment, the cooling device further comprises a first power device and a second power device, the first power device is in communication with the first pipeline group for providing power to the flow of the cooling medium, and the second power device is in communication with the second pipeline group for providing power to the flow of the heat exchange medium.

[0049] In an embodiment, the support platform comprises a frame structure, the frame structure has a second region, the second region comprises three sub-regions arranged in a second direction, the three sub-regions are a middle sub-region and two side sub-regions respectively.

[0050] The first power device and the second power device of the cooling device are respectively arranged in the two side sub-regions.

[0051] In an embodiment, the cooling device further comprises a liquid storage module, the liquid storage module comprises a first liquid storage tank and a second liquid storage tank, the first liquid storage tank is in communication with the first pipeline group for supplementing the cooling medium to the first pipeline group, and the second liquid storage tank is in communication with the second pipeline group for supplementing the heat exchange medium to the second pipeline group.

[0052] In an embodiment, the cooling device further comprises a pressure stabilizing module, the pressure stabilizing module comprises a first pressure stabilizing tank and a second pressure stabilizing tank, the first pressure stabilizing tank is in communication with the first pipeline group for stabilizing the pressure of the first pipeline group, and the second pressure stabilizing tank is in communication with the second pipeline group for stabilizing the pressure of the second pipeline group.

[0053] In an embodiment, the support platform comprises a frame structure and a rack, the rack is arranged in the frame structure; wherein the liquid storage module and / or the pressure stabilizing module of the cooling device are arranged in the interior of the rack.

[0054] In an embodiment, the medium flow path comprises a cooling pipeline, a liquid inlet distribution pipeline and a liquid return distribution pipeline, the cooling pipeline is used for being in heat contact with the heat generating component of the computing device to cool the heat generating component;

[0055] The liquid inlet distribution pipeline and the liquid return distribution pipeline are arranged on one side of the cabinet, the liquid inlet distribution pipeline has a liquid inlet and a plurality of liquid outlet ports, the liquid inlet is connected with the liquid inlet of the first pipeline group, and the plurality of liquid outlet ports are used for corresponding to the cooling pipelines of the plurality of computing devices and are respectively connected with the input ends of the cooling pipelines of the plurality of computing devices;

[0056] The liquid return distribution pipeline has a plurality of liquid return ports and a liquid outlet port, the plurality of liquid return ports are respectively connected to the output ends of the cooling pipelines of the plurality of computing devices one by one, and the liquid outlet port is connected to the liquid inlet port of the first pipeline group.

[0057] In an embodiment, the cabinet defines a first accommodating space for integrated installation of the plurality of computing devices arranged in the vertical direction.

[0058] The liquid inlet distribution pipeline and the liquid return distribution pipeline are respectively arranged in the vertical direction on the side of the cabinet adjacent to the first pipeline group in the second direction, and the plurality of liquid supply ports and the plurality of liquid return ports are respectively arranged in the vertical direction.

[0059] In an embodiment, the liquid inlet distribution pipeline and the liquid return distribution pipeline are respectively located on both sides of the projection of the plurality of computing devices on the vertical plane.

[0060] The plurality of liquid supply ports and the plurality of liquid return ports are distributed towards each other in the first direction, and the plurality of liquid supply ports are adjacent to one side of the plurality of computing devices in the first direction, and the plurality of liquid return ports are adjacent to the other side of the plurality of computing devices in the first direction.

[0061] In an embodiment, the liquid inlet port is formed on the side of the liquid inlet distribution pipeline adjacent to the first pipeline group in the second direction and adjacent to the top end of the liquid inlet distribution pipeline; and the liquid outlet port is formed on the side of the liquid return distribution pipeline adjacent to the first pipeline group in the second direction and adjacent to the top end of the liquid return distribution pipeline.

[0062] In an embodiment, the top end of the liquid inlet distribution pipeline and the top end of the liquid return distribution pipeline are respectively provided with an exhaust valve.

[0063] In an embodiment, the exhaust port of the exhaust valve is connected to a flexible connecting pipe, and the flexible connecting pipe extends to the bottom of the cabinet to respectively discharge the gas in the liquid inlet distribution pipeline and the liquid return distribution pipeline.

[0064] In an embodiment, the cabinet includes a cabinet body and a shelf arranged inside the cabinet body, the shelf defines a first accommodating space, and the shelf and the cabinet body define a second accommodating space, and the first accommodating space and the second accommodating space are distributed side by side in the first direction.

[0065] The rack further includes a plurality of power distribution units arranged in the vertical direction in the second accommodating space.

[0066] In one embodiment, there are multiple racks, and the multiple racks are arranged side by side along a first direction; the racks also include a top connecting plate, which is arranged on the top of the cabinet and extends above the adjacent cabinets; the top connecting plate and the tops of the adjacent cabinets respectively have top connecting holes that are opposite to each other in the vertical direction, and the cabinets and adjacent cabinets are fixed by fasteners passing through the top connecting holes.

[0067] In one embodiment, the rack further includes a lifting ring, which is detachably provided on the top of the cabinet and is used to connect a lifting rope to carry the cabinet or the heat dissipation structure.

[0068] In one embodiment, the rack further includes a bottom connecting plate, which extends downwardly and obliquely on the outside of the bottom of the cabinet in the second direction, and the upper end of the bottom connecting plate is fixed to the cabinet, and the lower end of the bottom connecting plate is fixed to the support platform.

[0069] As another aspect of the embodiments of the present application, the embodiments of the present application further provide a container, including:

[0070] The heat dissipation structure of any of the above embodiments;

[0071] The box body and the heat dissipation structure are arranged inside the box body.

[0072] In one embodiment, the box includes a frame, and the frame is protruded upward on one side of the bottom of the box in the second direction;

[0073] The support platform is spaced apart from the frame at one side adjacent to the frame in the second direction to form a groove for draining liquid.

[0074] In one embodiment, the frame is formed with a plurality of drainage holes, and the plurality of drainage holes are spaced apart and distributed in the first direction.

[0075] As another aspect of the embodiments of the present application, the embodiments of the present application also provide a data center, including: a heat dissipation structure of any of the above embodiments or a container of any of the above embodiments and multiple computing devices, and the multiple computing devices are integrated and installed in a cabinet of the heat dissipation structure.

[0076] According to the heat dissipation structure of the embodiment of the present application, the rack and cooling equipment are integrated into a unified support platform to form a skid structure, which improves the integration and structural stability of the heat dissipation structure, and realizes unified transportation and delivery. After delivery, it can be directly put into place, reducing the requirements for land flatness and concrete foundation.

[0077] The above summary is intended to illustrate, but not limit, the present application. Further aspects, embodiments and features of the present application will be readily apparent from the following detailed description, taken in conjunction with the accompanying drawings and claims. BRIEF DESCRIPTION OF DRAWINGS

[0078] In the drawings, like numerals refer to like elements throughout the various drawings. The drawings are not necessarily to scale, the emphasis instead being placed on the relation between the various elements. It should be understood that the drawings only depict some embodiments of the application and should not be considered to limit the scope of the application.

[0079] Figure 1 A structural schematic diagram of a heat dissipation structure according to an embodiment of the present application is shown;

[0080] Figure 2A A perspective structural schematic diagram of a support platform of a heat dissipation structure according to an embodiment of the present application is shown;

[0081] Figure 2B An exploded structural schematic diagram of a support platform of a heat dissipation structure according to an embodiment of the present application is shown;

[0082] Figure 2C A structural schematic diagram of a support platform of a heat dissipation structure according to an embodiment of the present application is shown from one perspective;

[0083] Figure 2D A structural schematic diagram of a support platform of a heat dissipation structure according to an embodiment of the present application is shown from another perspective;

[0084] Figure 3A A structural schematic diagram of a top frame of a heat dissipation structure according to an embodiment of the present application is shown;

[0085] Figure 3B A structural schematic diagram of a top frame of a heat dissipation structure according to an embodiment of the present application is shown; Figure 1 An enlarged view of a middle A region is shown;

[0086] Figure 3C A partial structural schematic diagram of a top frame of a heat dissipation structure according to an embodiment of the present application is shown;

[0087] Figure 4A A cooling principle schematic diagram of a heat dissipation structure according to an embodiment of the present application is shown;

[0088] Figure 4B A structural schematic diagram of a cooling device of a heat dissipation structure according to an embodiment of the present application is shown from one perspective;

[0089] Figure 4C A structural schematic diagram of a cooling device of a heat dissipation structure according to an embodiment of the present application is shown from another perspective;

[0090] Figure 5A Fig. 2 shows a structural schematic diagram of a rack of the heat dissipation structure according to an embodiment of the present application;

[0091] Figure 5B Fig. 3 shows an enlarged view of area A in Fig. 2A;

[0092] Figure 5C Fig. 4 shows a structural schematic diagram of a rack of the heat dissipation structure according to an embodiment of the present application from one perspective;

[0093] Figure 5D Fig. 5 shows a structural schematic diagram of a rack of the heat dissipation structure according to an embodiment of the present application from another perspective;

[0094] Figure 5E Fig. 6 shows an enlarged view of area B in Fig. 5A; Figure 5D

[0095] Figure 5F Fig. 7 shows a top structural schematic diagram of a rack of the heat dissipation structure according to an embodiment of the present application;

[0096] Figure 6 Fig. 8 shows a structural schematic diagram of a container according to an embodiment of the present application.

[0097] Explanation of reference signs:

[0098] 1-heat dissipation structure, 2-container;

[0099] 1000-rack, 100-cabinet, 100a-first accommodating space, 100b-second accommodating space, 101-roller, 110-cabinet body, 111-fixing hole, 112-cover plate, 113-power supply cable, 114-first wire passing hole;

[0100] 120-shelf, 1200-support frame, 121-stand column, 122-support plate, 122a-fixing piece, 122b-bearing piece, 123-mounting plate, 124-power supply support seat, 130-wiring column, 131-wire passing groove;

[0101] 140-liquid return distribution pipeline, 141-liquid outlet, 142-liquid return port, 150-liquid inlet distribution pipeline, 151-liquid inlet, 152-liquid delivery port, 153-connection piece, 160-second exhaust valve, 161-exhaust port, 170-lifting ring, 180-bottom connecting plate, 190-top connecting plate;

[0102] 200-cooling device, 10-heat exchange module, 10a-first heat exchange flow path, 10b-second heat exchange flow path, 210-medium flow path, 215-cooling pipeline, 216-liquid delivery connection pipeline, 217-liquid return connection pipeline, 230-computing device;

[0103] ​20 - first pipe group, 21 - first liquid supply pipe, 211 - first liquid supply sub-pipe, 212 - second liquid supply sub-pipe, 212a - liquid supply outlet, 212b - first exhaust valve, 213 - liquid inlet pipe, 22 - first liquid return pipe, 221 - first liquid return section, 221a - liquid return inlet, 222 - second liquid return section, 223 - third liquid return section, 224 - first liquid supplement branch pipe, 224a - first liquid supplement interface, 225 - first pressure stabilizing branch pipe, 226 - liquid outlet pipe;

[0104] 30 - second pipe group, 31 - second liquid supply pipe, 311 - first liquid supply section, 312 - second liquid supply section, 313 - second liquid supplement branch pipe, 313a - second liquid supplement interface, 314 - second pressure stabilizing branch pipe, 32 - second liquid return pipe;

[0105] 40 - first power device, 50 - second power device, 60 - first pressure stabilizing tank, 70 - second pressure stabilizing tank, 80 - first liquid storage tank, 90 - second liquid storage tank;

[0106] 300 - top frame, 310 - cross beam, 3101 - first beam body, 3111 - first through hole, 3102 - second beam body, 320 - longitudinal beam, 321 - first section, 322 - second section, 3221 - mounting groove;

[0107] 330 - pipe support seat, 331 - clamping groove, 332 - first elastic leg, 333 - second elastic leg, 340 - bracket, 341 - vertical plate, 342 - horizontal plate;

[0108] 400 - support platform, 410 - frame structure, 410a - first area, 410b - second area, 410b1 - sub-area, 411 - first support beam, 412 - second support beam, 413 - third support beam, 420 - support plate, 421 - plate body, 422 - gap, 423 - protruding structure, 4231 - first protrusion, 4232 - second protrusion, 424 - vertical part, 430 - frame body, 431 - vertical frame, 432 - horizontal frame, 440 - footing, 441 - base, 442 - screw rod;

[0109] 500 - cold source device, 600 - power distribution cabinet, 601 - second wire passing hole, 700 - tank body, 701 - frame, 702 - liquid discharge hole;

[0110] L1 - first direction, L2 - second direction. DETAILED DESCRIPTION

[0111] In the following, only certain exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present application. Therefore, the drawings and the description are considered to be exemplary in nature rather than limiting.

[0112] In the related art, the computing devices 230 and the cooling device 200 of the heat dissipation structure 1 are independent of each other, and need to be packaged and transported respectively, which is relatively high in transportation cost. Moreover, after delivery, the arrangement of the computing devices 230 and the cooling device 200 of the heat dissipation structure 1 needs to be adjusted to match the site, and then assembled and tested, which results in a relatively long deployment period.

[0113] Based on the above-mentioned defects in the related art, the embodiments of the present application provide a heat dissipation structure 1, which can integrate the computing devices 230 and the cooling device 200 of the heat dissipation structure 1, realize overall modular delivery and optimal space utilization, and thus improve the convenience and efficiency of deployment of the heat dissipation structure 1.

[0114] Figure 1 A structural schematic diagram of the heat dissipation structure 1 according to the embodiments of the present application is shown.

[0115] Referring to Figure 1 , and in combination with Figure 4A , the heat dissipation structure 1 provided by the embodiments of the present application includes at least one rack 1000, a cooling device 200, a top frame 300 and a support platform 400. Specifically, the rack 1000 includes a cabinet 100 and a medium flow path 210, the cabinet 100 is used to integrally install a plurality of computing devices 230, and the medium flow path 210 is used to flow a cooling medium through the plurality of computing devices 230. The cooling device 200 includes a heat exchange module 10 and a first pipe group 20, the first pipe group 20 is connected between the heat exchange module 10 and the medium flow path 210 of the at least one rack 1000.

[0116] In the embodiments of the present application, the cooling device 200 can adopt a liquid cooling mode to cool the computing devices 230 of each rack 1000. The medium flow path 210 passes through the plurality of computing devices 230, and is used to flow the cooling medium through each computing device 230 in the process of flowing inside the computing device 230, so that the cooling medium exchanges heat with each computing device 230, thereby transferring the heat generated by the computing device 230 in the working process to the cooling medium, and further cooling the plurality of computing devices 230.

[0117] The first pipe group 20 is connected between the heat exchange module 10 and the medium flow path 210 of the rack 1000, used to deliver the low-temperature cooling medium cooled by the heat exchange module 10 to the medium flow path 210 of the rack 1000, and then deliver the high-temperature cooling medium flowing through the rack 1000 from the medium flow path 210 of the rack 1000 back to the heat exchange module 10, so as to realize the circulation of the cooling medium between the heat exchange module 10 and the medium flow path 210 of the rack 1000, thereby realizing the circulation cooling of each computing device 230.

[0118] In the embodiment of the present application, the top frame 300 is fixed to the top of the at least one rack 1000, and at least part of the first pipe group 20 is supported on the top frame 300. The at least one rack 1000 and the cooling device 200 are integrated on the support platform 400, the heat exchange module 10 is arranged on one side of the at least one rack 1000 in the first direction L1, and the first pipe group 20 is located on one side of the heat exchange module 10 in the second direction L2, the second direction L2 intersects the first direction L1.

[0119] In the embodiment of the present application, the first direction L1 and the second direction L2 can be two horizontal directions perpendicular to each other.

[0120] The rack 1000 and the cooling device 200 of the heat dissipation structure 1 of the embodiment of the present application are integrated on a unified support platform 400 to form a pry block structure, which improves the integration degree of the heat dissipation structure 1, realizes unified transportation and delivery, and can be directly positioned after delivery, reducing the requirements for land flatness and concrete foundation. In addition, the heat exchange module 10, the first pipe group 20 and the rack 1000 are adapted in spatial position, the top frame 300 provides a support and fixing structure for the first pipe group 20 of the cooling device 200, and the stability of the overall structure of the heat dissipation structure 1 is improved.

[0121] In one embodiment, the heat dissipation structure 1 can further include a power distribution cabinet 600, which directly supplies power to the computing devices 230 of the data center when the heat dissipation structure 1 is applied to the data center. In such a high-density device environment as the data center, water and electricity separation can effectively prevent the safety hazards caused by liquid leakage to electrical equipment, and ensure the efficient, safe and stable operation of the data center.

[0122] Exemplarily, the power distribution cabinet 600 can be arranged separately from the cooling device 200.

[0123] In some examples, the power distribution cabinet 600 and the cooling device 200 are distributed on opposite sides of the at least one rack 1000 in the first direction L1, i.e., the cooling device 200 is arranged on one side of the at least one rack 1000 in the first direction L1, and the power distribution cabinet 600 is arranged on the other side of the at least one rack 1000 in the first direction L1. In this way, the spacing distance between the power distribution cabinet 600 and the cooling device 200 is increased, and the power distribution cabinet 600 and the cooling device 200 are physically isolated by the rack 1000, thereby greatly improving the overall reliability of the data center.

[0124] In other examples, the power distribution cabinet 600 and the cooling device 200 are distributed on opposite sides of the at least one rack 1000 in the second direction L2, and the power distribution cabinet 600 and the cooling device 200 are isolated by the at least one rack 1000, thereby improving the safety of water and electricity separation.

[0125] It should be noted that the above is only for illustration and does not constitute a limitation on the present application.

[0126] Those skilled in the art can understand that, based on the basic principle of spacing the power distribution cabinet 600 and the cooling device 200, the power distribution cabinet 600 and the cooling device 200 can also be spaced in other ways, for example, the power distribution cabinet 600 and the cooling device 200 are spaced in the up-down direction of the at least one rack 1000, i.e., one of the power distribution cabinet 600 and the cooling device 200 is located above the rack 1000, and the other is located below the rack 1000, thereby achieving physical isolation of the power distribution cabinet 600 and the cooling device 200; for another example, the power distribution cabinet 600 and the cooling device 200 are not isolated by the rack 1000, but can be isolated by adding other objects or directly by increasing the spacing distance between the two to achieve water and electricity separation. It should be noted that the above is only for illustration and the spacing of the power distribution cabinet 600 and the cooling device 200 is not limited to the above examples.

[0127] In addition, it should be noted that, in the example in which the heat dissipation structure 1 is arranged inside the box body 700 to form a container, the positional relationship between the power distribution cabinet 600 and the cooling device 200 and the box body 700 can be other than that both are accommodated inside the box body 700. For example, one of the power distribution cabinet 600 and the cooling device 200 can be arranged inside the box body 700, and the other can be arranged outside the box body 700, so that the power distribution cabinet 600 and the cooling device 200 are physically separated by the box body 700, thereby improving the safety of water and electricity separation. For another example, the power distribution cabinet 600 and the cooling device 200 are both arranged outside the box body 700 and are respectively arranged on different sides of the box body 700, so that the power distribution cabinet 600 and the cooling device 200 are physically separated by the box body 700, thereby ensuring the safety of water and electricity separation. It should be noted that the above examples are merely illustrative, and the positional relationship between the power distribution cabinet 600 and the cooling device 200 and the box body 700 is not limited to the above examples.

[0128] In an embodiment, the rack 1000 further comprises a power distribution unit, and a plurality of power distribution units can be arranged in the cabinet 100 of each rack 1000. The power distribution units are connected to the power distribution cabinet 600 through the power supply cable 113, and the power distribution units are connected to the computing devices 230 in the cabinet 100, thereby improving the convenience of power supply for the computing devices 230.

[0129] In an embodiment, the number of racks 1000 is a plurality, and the plurality of racks 1000 are arranged side by side along the first direction L1. The heat exchange module 10 is arranged on one side of the plurality of racks 1000 in the first direction L1, and the first pipe group 20 is connected between the heat exchange module 10 and the medium flow path 210 of the plurality of racks 1000.

[0130] In an embodiment, the cooling device 200 further comprises a second pipe group 30, and the second pipe group 30 is connected between the heat exchange module 10 and the cold source device 500. The second pipe group 30 is used to transport the heat exchange medium, which is heated by absorbing heat of the cooling medium in the heat exchange module 10, to the cold source device 500, and then transport the heat exchange medium cooled by the cold source device 500 back to the heat exchange module 10, so as to realize circulation of the heat exchange medium between the heat exchange module 10 and the cold source device 500, thereby realizing circulation cooling of the cooling medium.

[0131] The support platform 400, the top frame 300, the cooling device 200, and the rack 1000 of the heat dissipation structure 1 according to the embodiments of the present application are described below.

[0132] Figure 2A FIG. 4 shows a perspective structural schematic view of the support platform 400 of the heat dissipation structure 1 according to an embodiment of the present application, Figure 2B FIG. 5 shows an exploded structural schematic view of the support platform 400 of the heat dissipation structure 1 according to an embodiment of the present application,Figure 2C FIG. 4 shows a structural schematic diagram of the support platform 400 of the heat dissipation structure 1 according to an embodiment of the present application, viewed from another angle. Figure 2D FIG. 4 shows a structural schematic diagram of the support platform 400 of the heat dissipation structure 1 according to an embodiment of the present application, viewed from another angle.

[0133] Referring to Figures 2A to 2D The support platform 400 of the heat dissipation structure 1 according to an embodiment of the present application can include a frame structure 410, a support plate 420 and a rack body 430. The frame structure 410 has a first region 410a and a second region 410b arranged in a first direction L1. The support plate 420 covers the first region 410a, and the rack body is arranged in the second region 410b. At least one rack 1000 is arranged on the support plate 420, and the heat exchange module 10 is supported on the upper part of the rack body. On the one hand, the stability of the rack 1000 and the heat exchange module 10 is improved, and on the other hand, the heat exchange module 10 is lifted to facilitate the connection of the heat exchange module 10 and the first pipe group 20 supported on the top frame 300.

[0134] For example, the frame structure 410 includes a plurality of first support beams 411 extending in the first direction L1 and a plurality of second support beams 412 extending in a second direction L2. The adjacent two first support beams 411 are connected with a plurality of second support beams 412.

[0135] In some examples, the first support beam 411 and the second support beam 412 are fixedly connected by welding.

[0136] In other examples, the first support beam 411 and the second support beam 412 are fixedly connected by fasteners.

[0137] It should be noted that the above is only for illustration and does not constitute a limitation on the present application. Those skilled in the art can understand that the connection mode of the first support beam 411 and the second support beam 412 can also have other modes, such as riveting, bolt connection or buckle connection, etc., to realize the fixed connection between the first support beam 411 and the second support beam 412, and is not limited thereto.

[0138] For example, the materials of the first support beam 411 and the second support beam 412 can be metal, and the shapes of the first support beam 411 and the second support beam 412 are regular shapes.

[0139] In some examples, the materials of the first support beam 411 and the second support beam 412 can be steel, and the vertical cross sections of the first support beam 411 and the second support beam 412 can be I-shaped.

[0140] In other examples, the materials of the first support beam 411 and the second support beam 412 can be aluminum alloy, and the vertical cross sections of the first support beam 411 and the second support beam 412 can be rectangular.

[0141] It should be noted that the shape and material of the first support beam 411 and the second support beam 412 are not limited to the above examples, and the cross-sectional shape can also be H-shaped, T-shaped, C-shaped, circular, Z-shaped, etc., and the material can also be copper, carbon steel, alloy steel, etc., or other composite materials with high strength and support, etc., and is not limited thereto.

[0142] Exemplarily, the plurality of second support beams 412 distributed in the second direction L2 and connected between the adjacent two first support beams 411 can be distributed relatively and / or staggered. Figure 2B As shown, at least part of the second support beams 412 are staggered in the second direction L2 to optimize load distribution, avoid local stress concentration, and improve the structural stability and rigidity of the support platform 400.

[0143] In some examples, the rack body 430 is welded to the first region 410a of the frame structure 410.

[0144] In other examples, the rack body 430 can be connected to the first region 410a of the frame structure 410 by fasteners, riveting, bolt connection, or buckle connection, etc. Here, only for example, the connection mode of the rack body 430 and the frame structure 410 is not limited thereto.

[0145] Exemplarily, the rack body 430 includes a vertical frame 431 and a horizontal frame 432, the bottom end of the vertical frame 431 is connected to the first region 410a, and the horizontal frame 432 is connected to the top end of the vertical frame 431.

[0146] In some examples, the size of the first region 410a in the first direction L1 is greater than the size of the second region 410b in the first direction L1, which reasonably allocates space for the rack 1000 and the cooling device 200.

[0147] In some examples, the size of the first region 410a in the second direction L2 is substantially equal to the size of the second region 410b in the second direction L2, which meets the space requirements of the rack 1000 and the cooling device 200 in the second direction L2 while maintaining the overall regularity of the support platform 400, facilitating the accommodation of the heat dissipation structure 1 in the container, and improving the convenience of the heat dissipation structure 1.

[0148] It should be noted that the size of the first region 410a and the second region 410b can be flexibly set according to actual conditions to provide a load-bearing space for the rack 1000 and the cooling device 200, and to ensure that the rack 1000 and the cooling device 200 are distributed in different regions on the support platform 400.

[0149] In an embodiment, the second region 410b includes three sub-regions 410b1 arranged in the second direction L2, a normal projection of the rack body 430 in a horizontal plane is located in a middle sub-region 410b1, and a bottom end of the rack body 430 is connected to the middle sub-region 410b1; at least part of the pipe sections of the first pipe group 20 and at least part of the pipe sections of the second pipe group 30 are respectively located in two sub-regions 410b1 on both sides of the middle sub-region 410b1 in the horizontal plane, i.e., at least part of the pipe sections of the first pipe group 20 and at least part of the pipe sections of the second pipe group 30 are respectively located on opposite sides of the heat exchange module 10 in the second direction L2. In this way, the space on both sides of the heat exchange module 10 in the second direction L2 is fully utilized, the first pipe group 20 and the second pipe group 30 do not interfere with each other, the compactness of the heat dissipation structure 1 is improved, and the convenience of pipe connection between the cooling device 200 and the rack 1000 and the heat source device 500 is improved.

[0150] In an embodiment, the support plate 420 includes a plurality of plate bodies 421 arranged in a splicing manner.

[0151] In some examples, each plate body 421 is respectively connected to the frame structure 410 by a corresponding fastener.

[0152] For example, the relative positions of the support plate 420, the first support beam 411 and / or the second support beam 412 of the frame structure 410 are formed with screw holes, and the support plate 420 is fixed to the frame structure 410 by sequentially passing through the screw holes corresponding to the plate body 421 and the first support beam 411 and / or the second support beam 412.

[0153] In other examples, the plate body 421 is fixedly connected to the frame structure 410 by welding. For example, the plate body 421 is fixedly connected to the first support beam 411 and / or the second support beam 412 of the frame structure 410 by welding.

[0154] It should be noted that the above is only an example for illustration and does not constitute a limitation on the present application. Those skilled in the art can understand that the connection mode of the plate body 421 and the frame structure 410 can also have other modes, such as riveting, bolt connection or buckle connection, etc., which can realize the fixed connection between the plate body 421 and the frame structure 410. Here, only an example is given, and the connection mode of the plate body 421 and the frame structure 410 is not limited to this.

[0155] For example, the power distribution cabinet 600 and the cooling device 200 can be arranged on the support platform 400.

[0156] In some examples, the power distribution cabinet 600 and the cooling device 200 are integrated in different areas of the support platform 400. On the one hand, the support platform 400 elevates the power distribution cabinet 600 and does not contact the placement surface of the data center, so that the leakage of the cooling device 200 can be avoided to cause water on the placement surface to affect the power distribution cabinet 600. On the other hand, the support platform 400 can guide the leakage of the cooling device 200 to the outside of the support platform 400, completely isolating water and electricity, and further improving the safety of the data center.

[0157] In a specific example, the power distribution cabinet 600 and the rack 1000 are arranged on the support plate 420 of the first area 410a of the support platform 400, and the cooling device 200 is arranged in the second area 410b of the support platform 400. Due to the frame structure of the second area 410b, the leakage of the cooling device 200 can be discharged to the outside of the support platform 400 through the second area 410b, and will not be deposited on the support platform 400, and will not flow from the second area 410b to the support plate 420 of the first area 410a, thereby avoiding the problem of the power distribution cabinet 600 contacting the leaked liquid.

[0158] The power distribution cabinet 600, the rack 1000 and the cooling device 200 of the embodiment are integrated in the support platform 400, which not only ensures that water and electricity can be completely isolated, but also improves the integration of the heat dissipation structure 1 or the data center. Not only effectively utilizes the vertical and horizontal space, reduces the physical floor area, facilitates overall transportation and delivery, but also simplifies the monitoring and management process, facilitates the operation and maintenance of the operation and maintenance personnel, and further, the integrated design can reduce the distance and time of power and signal transmission, improve the response speed of the data center, and improve the overall reliability of the data center.

[0159] For example, the support platform 400 of the embodiment increases the defensive design of discharging liquid. Specifically, a gap 422 is defined between two adjacent plate bodies 421, and the gap 422 is used to guide the liquid on the support plate 420 to the lower side of the support plate 420 to avoid the liquid deposited on the support plate 420.

[0160] It can be understood that the liquid of the embodiment refers to the cooling medium for cooling the computing device 230 and / or the heat exchange medium for cooling the cooling medium. The cooling medium and the heat exchange medium can be selected from fluid media with good heat conduction performance and stability, such as cooling water, refrigerant, etc., and the embodiment of the present application does not make specific limitation.

[0161] Exemplarily, the width of the gap 422 between two adjacent plates 421 can be 0.5 to 2 mm, for example, 0.5 mm, 0.8 mm, 1 mm, 1.5 mm or 2 mm, etc. A gap 422 of such size can ensure smooth discharge of liquid while having almost no effect on the supporting strength and rigidity of the support platform 400.

[0162] For example, the thickness of the plate body 421 may be 2-4 mm, thereby ensuring the structural strength of the support plate 40 and controlling the overall weight of the support plate 420 .

[0163] In one embodiment, the upper surface of the plate body 421 is formed with spaced-apart raised structures 423 . The raised structures 423 are used to prevent slipping, thereby preventing workers from slipping when stepping on the support plate 420 . At the same time, the raised structures 423 can also improve the structural strength and toughness of the support plate 420 .

[0164] The plurality of protrusion structures 423 may be evenly distributed on the upper surface of the plate 421 .

[0165] In some examples, the multiple protrusion structures 423 include multiple first protrusions 4231 and multiple second protrusions 4232, the first protrusions 4231 and the second protrusions 4232 intersect in the extension direction of the horizontal plane, and the first protrusions 4231 and the second protrusions 4232 are alternately distributed in the second direction L2 to increase the anti-slip effect and structural strength of the support plate 420.

[0166] like Figure 2A As shown, the extension direction of the first protrusion 4231 is approximately perpendicular to the extension direction of the second protrusion 4232, and the plate body 421 has multiple rows of first protrusions 4231 and multiple rows of second protrusions 4232 in the second direction L2, each row of first protrusions 4231 includes multiple first protrusions 4231 spaced apart in the first direction L1, and each row of second protrusions 4232 includes multiple second protrusions 4232 spaced apart in the first direction L1, and each row of first protrusions 4231 and each row of second protrusions 4232 are alternately distributed in the second direction L2.

[0167] In an embodiment, the frame structure 410 is connected with two third support beams 413 on opposite sides in the second direction L2, and the third support beams 413 extend in the first direction L1. The support plate 420 covers the top of the frame structure 410 and the two third support beams 413, and the support plate 420 has two vertical portions 424 extending downward on opposite sides in the second direction L2, and the two vertical portions 424 are respectively located on opposite sides of the two third support beams 413 in the second direction L2. In this embodiment, the support plate 420 is supported by the frame structure 410 in the middle and the two third support beams 413 on the sides, which improves the support strength. In addition, the two vertical portions 424 on opposite sides of the support plate 420 in the second direction L2 can function as positioning for the assembly of the support plate 420 and the frame structure 410, which facilitates the placement of the support plate 420 in place.

[0168] In some examples, the support plate 420 is fixedly connected with the third support beam 413 by welding.

[0169] In other examples, the support plate 420 is fixedly connected with the third support beam 413 by fasteners.

[0170] It should be noted that the above is only illustrative and does not constitute a limitation on the present application. Those skilled in the art can understand that the connection mode of the support plate 420 and the third support beam 413 can also have other modes, such as riveting, bolt connection or buckle connection, and is not limited thereto.

[0171] In an embodiment, the third support beam 413 can be provided with a plurality of footings 440 arranged at intervals in the first direction L1, and the footing 440 includes a base 441 and a screw rod 442 connected to the base 441 and extending vertically through the bottom wall of the third support beam 413, and the screw rod 442 is used to cooperate with a nut to level the support platform 400. In this way, the influence of the unevenness of the surface to be placed, such as the ground or the bottom wall of the container, on the stability of the support platform 400 can be overcome, and the overall stability of the support platform 400 can be ensured.

[0172] For example, the bottom of the base 441 can be provided with a rubber pad to increase friction and prevent sliding.

[0173] In some examples, the third support beam 413 is fixedly connected with the first support beam 411 of the frame structure 410 by welding.

[0174] In other examples, the third support beam 413 is fixedly connected with the first support beam 411 by fasteners.

[0175] It should be noted that the above is merely an example and does not constitute a limitation of the present application. Those skilled in the art will appreciate that the third support beam 413 and the first support beam 411 may be connected in a variety of other ways, such as riveting, latching, or snap-fitting, as long as they can achieve a fixed connection between the third support beam 413 and the first support beam 411, and are not limited thereto.

[0176] Exemplarily, the third support beam 413 has a regular shape, and the material of the third support beam 413 is metal.

[0177] In some examples, the vertical cross-section of the third support beam 413 is an I-shape, and the material of the third support beam 413 can be steel.

[0178] In other examples, the vertical cross-section of the third support beam 413 may be rectangular, and the material of the third support beam 413 may be aluminum alloy.

[0179] It should be noted that the shape and material of the third support beam 413 are not limited to the above examples. Its cross-sectional shape can also be H-shaped, T-shaped, C-shaped, circular or Z-shaped, and its material can also be copper, carbon steel, alloy steel, etc. or other composite materials with higher strength and support, etc., but is not limited to this.

[0180] Figure 3A 1 is a schematic structural diagram of the top frame 300 of the heat dissipation structure 1 according to an embodiment of the present application. Figure 3B Show Figure 1 A magnified image of area A in the middle. Figure 3C A partial schematic diagram of the top frame 300 of the heat dissipation structure 1 according to an embodiment of the present application is shown.

[0181] See also Figures 3A to 3C , and combined with Figure 1 The top frame 300 of the heat dissipation structure 1 of this embodiment may include multiple crossbeams 310 and at least one longitudinal beam 320. The multiple crossbeams 310 extend along a first direction L1 and are arranged side by side and spaced apart in a second direction L2. The crossbeams 310 are fixedly connected to the top of at least one rack 1000. At least one longitudinal beam 320 extends along the second direction L2 so that the crossbeams 310 and the longitudinal beams 320 intersect. At least one longitudinal beam 320 is fixedly connected between two adjacent crossbeams 310, and a portion of the first pipeline assembly 20 is supported by the longitudinal beam 320.

[0182] The top frame 300 of the heat dissipation structure 1 according to the embodiments of the present application can be fixedly connected to the plurality of cross beams 310 on the top of the rack 1000, so that the tops of the plurality of racks 1000 are connected by the plurality of cross beams 310, thereby fixing the tops of the plurality of racks 1000, and avoiding the racks 1000 from shaking and colliding with each other during transportation of the heat dissipation structure 1.

[0183] In addition, the longitudinal beams 320 intersecting and connected with the cross beams 310 are arranged, thereby increasing the stability of the top frame 300, and providing a support and fixing structure for part of the first pipe group 20 of the cooling device 200, which facilitates the connection between the first pipe group 20 and the medium flow path 210 of the rack 1000, and does not need to additionally arrange a fixing structure for fixing the first pipe group 20, thereby improving the compactness of the structure and the space utilization.

[0184] For example, the cross beam 310 can be fixedly connected to the top of the cabinet 100 of the rack 1000 by a fastener. The connection mode can include, but is not limited to, bolt connection, screw connection, riveting, key connection, pin connection, magnetic attraction connection or buckle connection, etc., which is not limited in the embodiments of the present application.

[0185] In some examples, the longitudinal beam 320 and the cross beam 310 can be fixedly connected by clamping, welding or the like.

[0186] In another example, the longitudinal beam 320 and the cross beam 310 can be connected by a fastener, riveting, bolt connection or the like. Here, only an example is given, and the connection mode of the longitudinal beam 320 and the cross beam 310 is not limited to this.

[0187] In an embodiment, the top frame 300 can be arranged directly above the top of the rack 1000, and the part of the first pipe group 20 supported by the longitudinal beam 320 of the top frame 300 is also located directly above the top of the rack 1000, thereby ensuring the stability of the first pipe group 20.

[0188] In another embodiment, the plurality of cross beams 310 of the top frame 300 include a first beam body 3101 and a second beam body 3102, which are fixedly connected to the top of at least one frame 1000. The longitudinal beam 320 includes a first section 321 and a second section 322, wherein the first section 321 is connected between the first beam body 3101 and the second beam body 3102, and the second section 322 is located on a side of the second beam body 3102 away from the first beam body 3101 and extends to the outside of the frame 1000 in the second direction L2. Part of the first pipeline assembly 20 is supported by the second section 322. That is, the entire top frame 300 is not located directly above the top of the rack 1000. A portion of the longitudinal beam 320 of the top frame 300, namely the second section 322, extends from the top of the rack 1000 to the outside of the rack 1000 in the second direction L2, so that at least a portion of the pipe section of the first pipeline group 20 supported by the second section 322 is located outside the rack 1000 in the second direction L2, rather than directly above the top of the rack 1000.

[0189] Therefore, when the first pipeline group 20 leaks, the liquid will drip to the outside of the rack 1000 instead of dripping to the top of the rack 1000, thereby avoiding affecting the rack 1000; moreover, the first pipeline group 20 is located on the outside of the rack 1000 in the second direction, reserving a reasonable layout space for the connecting pipeline between the medium flow path 210 of the rack 1000 and the first pipeline group 20, so as to facilitate the connection between the medium flow path 210 of the rack 1000 and the first pipeline group 20.

[0190] Illustratively, the projection of the first section 321 of the longitudinal beam 320 in the horizontal plane is within the range of the projection of the rack 1000 in the horizontal plane, and the projection of the second section 322 of the longitudinal beam 320 in the horizontal plane is outside the range of the projection of the rack 1000 in the horizontal plane, that is, the second section 322 is entirely located on the outside of the rack 1000 in the second direction L2, so that all the pipe sections of the first pipeline group 20 supported by the second section 322 are located on the outside of the rack 1000 in the second direction L2, which facilitates the connection between the medium flow path 210 of the rack 1000 and the first pipeline group 20, while allowing the first pipeline group 20 to completely avoid the top of the rack 1000, avoiding the impact on the rack 1000 when the first pipeline group 20 leaks, thereby improving the safety of the heat dissipation structure 1.

[0191] A plurality of first mounting holes may be provided on the top of the rack 1000, and corresponding second mounting holes may be provided on the first beam 3101 and the second beam 3102. The connection and fixation between the first beam 3101 and the second beam 3102 and the rack 1000 may be achieved by bolts passing through the first mounting holes and the second mounting holes.

[0192] The first beam 3101 can be disposed adjacent to a side edge of the top of the rack 1000 away from the first pipeline assembly 20, and the second beam 3102 can be disposed adjacent to a side edge of the top of the rack 1000 close to the first pipeline assembly 20. That is, the first beam 3101 and the second beam 3102 are respectively connected to two sides of the rack 1000 in the second direction L2, so that both sides of the rack 1000 in the second direction L2 are fixedly limited by the first beam 3101 and the second beam 3102, which helps to improve the connection stability of multiple racks 1000.

[0193] In one embodiment, there are multiple racks 1000 arranged side by side along a first direction L1. There are multiple longitudinal beams 320, each corresponding to one of the racks 1000. The longitudinal beams 320 are located at the top of the corresponding rack 1000. That is, each rack 1000 is topped with a longitudinal beam 320 extending along a second direction L2. Accordingly, the cross beams 310 connect the multiple racks 1000. This optimizes load distribution on the longitudinal beams 320, avoids localized stress concentration, improves the structural stability and strength of the top frame 300, and ensures stable support for the first pipeline assembly 20. Furthermore, the longitudinal beams 320 and cross beams 310 are used to limit the top of each rack 1000, improving the stability of the top connection of the multiple racks 1000.

[0194] In one embodiment, the top frame 300 further includes at least one pipe support 330, which is disposed corresponding to at least one longitudinal beam 320. The pipe support 330 is disposed in the second section 322 of the corresponding longitudinal beam 320, and a portion of the first pipeline assembly 20 is supported by the pipe support 330. The pipe support 330 can position the first pipeline assembly 20 for installation, facilitating installation of the first pipeline assembly 20. At the same time, multiple pipe support 330 can support and secure the first pipeline assembly 20 at different locations in the first direction L1, thereby improving the stability of the first pipeline assembly 20.

[0195] In one embodiment, the pipeline support seat 330 is provided with a card slot 331, and the card slot 331 has an upward opening. The pipeline of the first pipeline group 20 is card-connected in the corresponding card slot 331. The inner wall surface of the card slot 331 is an arc-shaped surface adapted to the outer peripheral wall shape of the pipeline of the first pipeline group 20, so that the outer wall surface of the pipeline and the inner wall surface of the card slot 331 can fit as closely as possible, thereby improving the stability of the pipeline support.

[0196] Exemplarily, the pipeline support seat 330 has a plurality of slots 331 , and the plurality of pipe sections of the first pipeline assembly 20 are engaged with the corresponding slots 331 .

[0197] Exemplarily, the pipe support seat 330 comprises a first elastic leg 332 and a second elastic leg 333, and the first elastic leg 332 and the second elastic leg 333 are made of an elastic material. The first elastic leg 332 and the second elastic leg 333 are respectively connected to the second section 322 of the longitudinal beam 320 and extend upward. A clamping groove 331 for accommodating the pipes of the first pipe group 20 is formed between the first elastic leg 332 and the second elastic leg 333.

[0198] The first elastic leg 332 and the second elastic leg 333 are deformed by being pressed by the pipes of the first pipe group 20, and the opening of the clamping groove 331 is expanded, so that the pipes of the first pipe group 20 are clamped into the clamping groove 331 from the opening of the clamping groove 331, thereby improving the installation efficiency of the pipes of the first pipe group 20. After the pipes of the first pipe group 20 are clamped into the clamping groove 331, the first elastic leg 332 and the second elastic leg 333 can clamp the pipes of the first pipe group 20, thereby improving the stability of the connection between the pipes of the first pipe group 20 and the pipe support seat 330.

[0199] Exemplarily, the second section 322 is provided with a mounting groove 3221 extending along the second direction L2, and the pipe support seat 330 is arranged in the mounting groove 3221, and the mounting groove 3221 is used to limit the pipe support seat 330 in the first direction L1. The pipe support seat 330 is fixedly connected to the mounting groove 3221 by a fastener, or the pipe support seat 330 is welded in the mounting groove 3221.

[0200] In an embodiment, referring to Figure 3B , the longitudinal beam 320 is clamped and matched with the first beam body 3101 and the second beam body 3102. Specifically, the first beam body 3101 is provided with at least one first through hole 3111, and the first through hole 3111 penetrates the first beam body 3101 in the second direction L2. The second beam body 3102 is provided with at least one second through hole, and the second through hole penetrates the second beam body 3102 in the second direction L2. The at least one first through hole 3111 and the at least one second through hole are arranged one by one in the second direction L2, and the at least one longitudinal beam 320 is arranged in the corresponding first through hole 3111 and the second through hole.

[0201] Exemplarily, the shape of the first through hole 3111 and the shape of the second through hole are matched with the shape of the longitudinal beam 320, so that the longitudinal beam 320 can be clamped in the first through hole 3111 and the second through hole, thereby realizing the fixation among the longitudinal beam 320, the first beam body 3101 and the second beam body 3102.

[0202] Exemplarily, the material of at least one of the first beam body 3101, the second beam body 3102 and the longitudinal beam 320 can be metal, and the shape of at least one of the first beam body 3101, the second beam body 3102 and the longitudinal beam 320 is a regular shape.

[0203] In some examples, the first beam body 3101, the second beam body 3102 and the longitudinal beam 320 can be made of steel and have a C shape.

[0204] In other examples, the first beam body 3101, the second beam body 3102 and the longitudinal beam 320 can be made of aluminum profile, so as to reduce the weight of the top frame 300 while ensuring the strength of the top frame 300.

[0205] It should be noted that the shape and material of the first beam body 3101, the second beam body 3102 and the longitudinal beam 320 are not limited to the above examples, and the material can also be carbon steel, alloy steel or other composite materials with high strength and support, and the shape can also be I-shaped, rectangular, circular, H-shaped, T-shaped, C-shaped or Z-shaped, and the like, and is not limited thereto.

[0206] The first beam body 3101, the second beam body 3102 and the longitudinal beam 320 can not only be designed differently in terms of material and shape, but also can be optimized in terms of structure design to reduce the weight while improving the strength.

[0207] Specifically, in some examples, the first beam body 3101 and the second beam body 3102 can have openings arranged towards each other in the second direction L2, and the longitudinal beam 320 has an upward opening to form a mounting groove 3221 by using the opening of the longitudinal beam 320.

[0208] In other examples, each side of the first beam body 3101 and the second beam body 3102 can be defined with a first groove body extending in the first direction L1 to reduce the weight of the first beam body 3101 and the second beam body 3102. Each side of the longitudinal beam 320 is defined with a second groove body extending in the second direction L2 to reduce the weight of the longitudinal beam 320.

[0209] In other examples, the inside of the first beam body 3101, the second beam body 3102 and the longitudinal beam 320 can be provided with a plurality of reinforcing ribs to improve the tensile, compressive and bending strength of the top frame 300, so that the top frame 300 can withstand greater load without being damaged.

[0210] It should be noted that the above examples are only illustrative and do not constitute a limitation on the present application. Those skilled in the art can understand that the structure of the first beam body 3101, the second beam body 3102 and the longitudinal beam 320 can also have other designs, such as honeycomb beams and corrugated beams, which can enhance the strength while reducing the material and weight. Here, only illustrative examples are provided, and the structure is not limited to the foregoing examples.

[0211] In some embodiments, referring to Figure 3CThe longitudinal beam 320 can be lapped on the upper portions of the first beam body 3101 and the second beam body 3102. Specifically, the lower surface of the longitudinal beam 320 has a first support plane, and the upper surface of the first beam body 3101 and the second beam body 3102 has a second support plane, and the second support plane of the first beam body 3101 and the second beam body 3102 is lapped on the first support plane of the longitudinal beam 320.

[0212] In some examples, the longitudinal beam 320 and the first beam body 3101 and the second beam body 3102 can be fixed at the lapped portions by fasteners, respectively.

[0213] In other examples, the longitudinal beam 320 and the first beam body 3101 and the second beam body 3102 can be fixed at the lapped portions by welding.

[0214] It should be noted that the above is only an example and does not constitute a limitation on the present application. Those skilled in the art can understand that the connection mode of the longitudinal beam 320 and the first beam body 3101 and the second beam body 3102 at the lapped portions can also have other various modes, such as riveting, bolt connection or buckle connection, etc., and is not limited thereto.

[0215] In an embodiment, the top frame 300 further comprises at least one bracket 340 corresponding to the at least one rack 1000, the bracket 340 is arranged on the top of the corresponding rack 1000 and located between the first beam body 3101 and the second beam body 3102, and the top of the bracket 340 has a supporting surface for carrying the power cable 113. The bracket 340 can support the power cable 113 on the top of the rack 1000, facilitate the connection of the power cable 113 with the power distribution cabinet 600 and the power distribution unit, and unify the power cable 113 to avoid cable clutter.

[0216] For example, the bracket 340 comprises two vertical plates 341 and a horizontal plate 342, the two vertical plates 341 are arranged on opposite sides of the horizontal plate 342 in the second direction L2, the lower end of the vertical plate 341 is connected with the cabinet 100 of the rack 1000, the horizontal plate 342 is connected with the upper end of the two vertical plates 341, and the upper surface of the horizontal plate 342 defines the supporting surface, and the power cable 113 is supported on the upper surface of the horizontal plate 342.

[0217] For example, the horizontal position of the horizontal plate 342 is higher than the horizontal position of the cross beam 310 and / or the longitudinal beam 320, so that the arrangement of the cross beam 310 and the longitudinal beam 320 does not affect the layout of the power cable 113.

[0218] Exemplarily, the top frame 300 comprises a plurality of brackets corresponding to the plurality of racks 1000 distributed side by side in the first direction L1, and each bracket is arranged on the top of the cabinet 100 of each rack 1000. The power supply cable 113 extends along the first direction L1 and is supported by the brackets arranged upward at multiple positions in the first direction L1, thereby improving the stability and neatness of the arrangement of the power supply cable 113.

[0219] In some examples, the bracket 340 can be made of aluminum material, so as to reduce the weight of the bracket 340.

[0220] In other examples, the bracket 340 can be made of copper, carbon steel, alloy steel or plastic with high strength and support, so as to enhance the support strength of the bracket 340.

[0221] It should be noted that the above is only an example and does not constitute a limitation on the present application. Those skilled in the art can understand that the material of the bracket 340 is not limited to the above description, but can also be a composite material made of any different material combination, such as a composite of metal and plastic, a composite of metal and rubber, glass fiber reinforced plastic or carbon fiber reinforced plastic, and the like.

[0222] In an embodiment, the top of the cabinet 100 of the rack 1000 is formed with a first wire hole 114, the first wire hole 114 is located on the side of the corresponding bracket 340 away from the power distribution cabinet 600 in the first direction L1, and the first wire hole 114 is used for the corresponding power supply cable 113 to pass through and connect with the corresponding power distribution unit; the top of the power distribution cabinet 600 is formed with a second wire hole 601, and the second wire hole 601 is used for the power supply cable 113 to pass through and connect with the power distribution cabinet 600. In this way, the power supply cable 113 is arranged in the space above the power distribution cabinet 600 and the rack 1000, which improves the space utilization and facilitates the connection of the power supply cable 113 with the power distribution units of the power distribution cabinet 600 and the rack 1000, respectively.

[0223] Exemplarily, the heat dissipation structure 1 has a plurality of power supply cables 113 corresponding to the plurality of racks 1000, and the plurality of power supply cables 113 are distributed side by side in the second direction L2 and are supported by the brackets 340 arranged in the first direction L1, so as to avoid the crossing and entanglement between the plurality of power supply cables 113 and reduce the arrangement difficulty of the power supply cable 113.

[0224] Figure 4A Fig. 2 shows a cooling principle schematic diagram of the heat dissipation structure 1 according to an embodiment of the present application, Figure 4B Fig. 3 shows a structure schematic diagram of the cooling equipment 200 of the heat dissipation structure 1 according to an embodiment of the present application from one perspective, Figure 4CFig. 2 shows a structural schematic diagram of the cooling device 200 according to the heat dissipation structure 1 of the embodiment of the present application from another perspective.

[0225] Referring to Figures 4A to 4C , and in combination with Figure 1 , in the cooling device 200 of the heat dissipation structure 1 provided in the embodiment, the inside of the heat exchange module 10 can be defined with a first heat exchange flow path 10a and a second heat exchange flow path 10b. The first heat exchange flow path 10a can be used for flowing of the cooling medium, and the second heat exchange flow path 10b can be used for flowing of the heat exchange medium. The cooling medium in the first heat exchange flow path 10a can exchange heat with the heat exchange medium in the second heat exchange flow path 10b, so as to reduce the temperature of the cooling medium.

[0226] The first pipeline group 20 can include a first liquid supply pipeline 21 and a first liquid return pipeline 22. The first liquid supply pipeline 21 can be connected with the output end of the first heat exchange flow path 10a, and the first liquid supply pipeline 21 can be connected with the liquid inlet 151 of the medium flow path 210 of the rack 1000. The first liquid return pipeline 22 can be connected with the input end of the first heat exchange flow path 10a, and the first liquid return pipeline 22 can be connected with the liquid outlet 141 of the medium flow path 210 of the rack 1000.

[0227] The second pipeline group 30 can include a second liquid supply pipeline 31 and a second liquid return pipeline 32. The second liquid supply pipeline 31 can be connected with the input end of the second heat exchange flow path 10b, and the second liquid supply pipeline 31 can be connected with the medium output end of the cold source device 500. The second liquid return pipeline 32 can be connected with the output end of the second heat exchange flow path 10b, and the second liquid return pipeline 32 can be connected with the medium return end of the cold source device 500. The first pipeline group 20 and the second pipeline group 30 can be respectively arranged on opposite sides of the heat exchange module 10.

[0228] In the embodiment of the present application, the heat exchange module 10 can realize heat exchange of fluids in different heat exchange flow paths. The heat exchange module 10 can adopt a structure form of plate type, shell and tube type, or spiral plate type, and the shell and the partition plate thereof can adopt a material with high heat conductivity and corrosion resistance, such as copper, stainless steel, nickel-based alloy, or titanium alloy, so as to improve the heat exchange efficiency and use durability of the heat exchange module 10. The specific type and structure of the heat exchange module 10 are not limited in the embodiment of the present application.

[0229] As shown in Figure 1 and Figure 4A , the first pipeline group 20 communicates with the first heat exchange flow path 10a, and the second pipeline group 30 communicates with the second heat exchange flow path 10b. The first pipeline group 20 and the second pipeline group 30 can be respectively arranged on opposite sides of the heat exchange module 10. It should be noted that, Figure 1The first heat exchange flow path 10a and the second heat exchange flow path 10b in the heat exchange module 10 are shown for the purpose of facilitating the understanding of the connection relationship between the first heat exchange flow path 10a, the second heat exchange flow path 10b, the first pipe group 20 and the second pipe group 30. The specific structure design of the heat exchange between the first heat exchange flow path 10a and the second heat exchange flow path 10b is not limited in the embodiments of the present application, for example, parallel heat exchange flow path, cross heat exchange flow path or spiral heat exchange flow path can be used.

[0230] Exemplarily, the heat exchange module 10 can realize the heat exchange between the cooling medium in the first heat exchange flow path 10a and the heat exchange medium in the second heat exchange flow path 10b, so as to reduce the temperature of the cooling medium and ensure that the cooling medium is in a low-temperature state before entering the first pipe group 20 through the output end of the first heat exchange flow path 10a. The cold source device 500 can be used to refrigerate the circulating heat exchange medium and ensure that the heat exchange medium is in a low-temperature state before entering the second heat exchange flow path 10b.

[0231] Specifically, the low-temperature cooling medium can enter the first liquid supply pipe 21 through the output end of the first heat exchange flow path 10a, and then enter the medium flow path 210 of the rack 1000 through the first liquid supply pipe 21, so as to absorb the heat generated by the rack 1000 during operation. The high-temperature cooling medium after absorbing heat can flow back to the input end of the first heat exchange flow path 10a through the first liquid return pipe 22, and then exchange heat with the heat exchange medium in the second heat exchange flow path 10b in the first heat exchange flow path 10a, so as to circulate.

[0232] The low-temperature heat exchange medium can flow out from the medium output end of the cold source device 500, and then enter the second heat exchange flow path 10b through the second liquid supply pipe 31. Through the heat exchange module 10, the cooling medium in the first heat exchange flow path 10a can exchange heat with the heat exchange medium in the second heat exchange flow path 10b, so as to reduce the temperature of the cooling medium. After heat exchange, the temperature of the heat exchange medium in the second heat exchange flow path 10b is increased, and the high-temperature heat exchange medium flows back to the medium return end of the cold source device 500 through the second liquid return pipe 32. The cold source device 500 further processes the heat exchange medium, so as to reduce the temperature of the heat exchange medium and prepare for the next cooling cycle. The structure and type of the cold source device 500 are not limited in the embodiments of the present application, for example, the cold source device 500 can cool the heat exchange medium by using gaseous medium or liquid medium, and a cooling tower or a dry cooler can be used.

[0233] In the embodiment of the present application, the first pipe group 20 and the second pipe group 30 are arranged on opposite sides of the heat exchange module 10, which is beneficial to the convenience of connecting the cooling device 200, the rack 1000 and the cooling source device 500, and makes full use of the space on both sides of the heat exchange module 10, so that the first pipe group 20 and the second pipe group 30 do not interfere with each other, and the space utilization is improved, thereby improving the compactness of the heat dissipation structure 1.

[0234] In an embodiment, the first liquid supply pipe 21 can include a first liquid supply sub-pipe 211 and a second liquid supply sub-pipe 212 connected in series, the first liquid supply sub-pipe 211 and the second liquid supply sub-pipe 212 can extend along the first direction L1 respectively, and are arranged side by side and spaced apart in the second direction L2, the first liquid supply sub-pipe 211 has a liquid supply inlet at one end adjacent to the heat exchange module 10, the liquid supply inlet is connected with the output end of the first heat exchange flow path 10a, the second liquid supply sub-pipe 212 is connected with the other end of the first liquid supply sub-pipe 211 away from the heat exchange module 10, and the second liquid supply sub-pipe 211 has a liquid supply outlet 212a connected with the liquid inlet 151 of the medium flow path 210. The first liquid return pipe 22 can include a first liquid return section 221 extending along the first direction L1, and the first liquid return section 221 can be provided with a liquid return inlet 221a connected with the liquid outlet 141 of the medium flow path 210.

[0235] In the embodiment, two liquid supply sub-pipes are arranged side by side and spaced apart, which can uniformly distribute the flow of the medium, avoid a single pipe bearing too high flow rate and pressure, thereby reducing the pressure loss of fluid flow and the local resistance of fluid when entering and leaving the pipe, and on the other hand, by independently arranging each liquid supply sub-pipe, the thermal interference between the pipes can be reduced, and the overall heat exchange efficiency of the cooling device 200 can be improved.

[0236] In an embodiment, the second liquid supply sub-pipe 212 can be provided with a plurality of liquid supply outlets 212a, the plurality of liquid supply outlets 212a can be arranged in the first direction L1 and correspond one by one to the liquid inlets 151 of the medium flow paths 210 of the plurality of racks 1000, and each liquid supply outlet 212a can be in communication with the liquid inlet 151 of the medium flow path 210 of the corresponding rack 1000.

[0237] For example, each liquid supply outlet 212a can be connected with the liquid inlet 151 of the medium flow path 210 of the corresponding rack 1000 through a liquid inlet pipe 213. The liquid supply outlet 212a can be formed in the bottom of the pipe wall of the second liquid supply sub-pipe 212.

[0238] In an embodiment, the first return liquid section 221 can be provided with a plurality of return liquid inlets 221a, which can be arranged at intervals along the first direction L1 and correspond to the liquid outlets 141 of the medium flow paths 210 of the plurality of racks 1000 one by one. Each return liquid inlet 221a can be connected to the liquid outlet 141 of the medium flow path 210 of the corresponding rack 1000.

[0239] Exemplarily, each return liquid inlet 221a can be connected to the liquid outlet 141 of the medium flow path 210 of the corresponding rack 1000 through a liquid return pipeline 226. The high-temperature cooling medium in the medium flow path 210 of each rack 1000 enters the first return liquid pipeline 22 through the return liquid inlet 221a, and then flows back to the first heat exchange flow path 10a of the heat exchange module 10 through the first return liquid pipeline 22.

[0240] In some examples, at least one of the liquid inlet pipeline 213 and the liquid outlet pipeline 226 is a flexible pipe to adapt to space limitations and facilitate installation and disassembly.

[0241] In other examples, at least one of the liquid inlet pipeline 213 and the liquid outlet pipeline 226 is a rigid pipe to improve the structural strength of the pipeline.

[0242] It should be noted that the above is only illustrative and does not constitute a limitation on the present application. Those skilled in the art can understand that the flexible pipe used in the liquid inlet pipeline 213 and the liquid outlet pipeline 226 can be a plastic pipe, a corrugated pipe, etc. which can be bent and has elasticity. The rigid pipe can be a copper pipe, an aluminum pipe, a stainless steel pipe, etc. which has a large hardness, or a plastic pipe which has a strong hardness and support, or a rigid pipe made of plastic, metal or composite material which has a certain hardness and bending ability.

[0243] The material of the liquid inlet pipeline 213 and the liquid outlet pipeline 226 is not limited to the above examples, but can also be any combination of the above materials, such as a combination of soft and hard pipes, all flexible pipes or all rigid pipes, etc. According to the above embodiment, by arranging a plurality of return liquid inlets 221a at intervals along the first direction L1, the return flow path of the cooling medium is uniformly distributed, and the space utilization is optimized. At the same time, the modular design of the corresponding rack 1000 of the liquid supply outlet 212a and the return liquid inlet 221a helps to expand and maintain the overall cooling equipment 200. When it is necessary to increase or decrease the rack 1000, only the positions and quantities of the corresponding liquid supply outlet 212a and return liquid inlet 221a need to be adjusted, which improves the flexibility and maintenance efficiency of the cooling equipment 200.

[0244] In one embodiment, the first liquid supply pipeline 21 and the first liquid return pipeline 22 can both be arranged on one side of the rack 1000 in the second direction L2, for example, on the side of the medium flow path 210 adjacent to the rack 1000 in the second direction L2, and fixedly supported by a support structure arranged on one side of the rack 1000 in the second direction L2 to ensure the stability of each pipeline.

[0245] In one embodiment, the first liquid supply sub-pipeline 211, the second liquid supply sub-pipeline 212 and the first liquid return section 221 of the first liquid return pipeline 22 can be supported on the top frame 300. While fixing the multiple racks 1000, the top frame 300 also provides fixed support for partial sections of the first liquid supply pipeline 21 and the first liquid return pipeline 22, avoiding the problems of increased space occupation and increased costs caused by setting up a separate support structure.

[0246] Furthermore, the first liquid return section 221 is arranged between the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212, reducing the intersection and overlap between the pipelines, reducing the heat exchange between the first liquid supply pipeline 21 and the first liquid return pipeline 22, which is conducive to maintaining the uniformity of the cooling medium temperature and improving the cooling effect. At the same time, it improves the compactness of the arrangement of the first liquid supply pipeline 21 and the first liquid return pipeline 22 and the rack 1000, facilitating the connection between the liquid supply outlet 212a of the first pipeline group 20 and the liquid inlet 151 of the medium flow path 210 of the rack 1000, and facilitating the connection between the liquid return inlet 221a of the first pipeline group 20 and the liquid outlet 141 of the medium flow path 210 of the rack 1000.

[0247] For example, the ends of the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212 away from the heat exchange module 10 are connected to each other, and the first liquid return section 221 can be arranged between the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212 in the second direction L2, thereby making full use of the space between the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212.

[0248] In one embodiment, a first exhaust valve 212b is provided at the end of the second liquid supply sub-pipeline 212 adjacent to the heat exchange module 10. This valve is used to exhaust air from the system, prevent air from obstructing the flow of the cooling medium, reduce pressure loss caused by air during the flow of the cooling medium, and ensure smooth flow of the cooling medium.

[0249] In an embodiment, the first return pipe 22 further comprises a second return section 222 and a third return section 223 connected in series, and the second return section 222 and the third return section 223 extend along the vertical direction respectively. The first return section 221 is closed at an end away from the heat exchange module 10, and the first return section 221 is connected to a first end of the second return section 222 at an end adjacent to the heat exchange module 10, a second end of the second return section 222 is connected to a first end of the third return section 223, and a second end of the third return section 223 is connected to the input end of the first heat exchange flow path 10a.

[0250] The upper end of the second return section 222 forms the first end thereof, and the upper end of the second return section 222 is connected to the end of the first return section 221 adjacent to the heat exchange module 10; the lower end of the second return section 222 forms the second end thereof, and the lower end of the second return section 222 is connected to the first end of the third return section 223. The lower end of the third return section 223 forms the first end thereof, and the upper end of the third return section 223 forms the second end thereof, and the upper end of the third return section 223 is in communication with the input end of the first heat exchange flow path 10a of the heat exchange module 10.

[0251] More specifically, the second return section 222 and the third return section 223 can be arranged side by side and spaced apart in the first direction L1, so that the second return section 222 and the third return section 223 are arranged coplanarly in the vertical plane, thereby further reducing the space occupation of the first return pipe 22 in the second direction L2. Thus, the pipe layout can be effectively optimized, and the structure of the cooling device 200 is compact, facilitating the installation and maintenance of the pipes.

[0252] For example, the second return section 222 and the third return section 223 have their orthographic projections in the horizontal plane located in the sub-area 410b1 of the frame structure 410 of the bottom support platform 400. Specifically, the second area 410b of the frame structure 410 has three sub-areas 410b1 arranged in the second direction L2, the three sub-areas 410b1 are a middle sub-area 410b1 and two sub-areas 410b1 on both sides respectively, the middle sub-area 410b1 is provided with a rack, and the heat exchange module 10 is arranged on the upper part of the rack, the second return section 222 and the third return section 223 are both located in one of the sub-areas 410b1 adjacent to one side of the first liquid supply pipe 21, which makes full use of the space above the support platform 400, and facilitates the connection of the third return section 223 to the input end of the first heat exchange flow path 10a of the heat exchange module 10.

[0253] In an embodiment, the second liquid supply pipeline 31 and the second liquid return pipeline 32 are located in a sub-region 410b1 on the side of the support platform 400 away from the first liquid supply pipeline 21, i.e., the second liquid supply pipeline 31 and the second liquid return pipeline 32 of the second pipeline group 30 are distributed on opposite sides of the heat exchange module 10 in the first direction with the second liquid return section 222 and the third liquid return section 223 of the first pipeline group 20. In this way, the pipelines of the cooling device 200 are further concentrated, improving the structural compactness of the cooling device 200.

[0254] In an embodiment, the cooling device 200 further comprises a first power device 40, which is in communication with the first pipeline group 20 and is used to power the flow of the cooling medium.

[0255] For example, the first power device 40 is arranged between the second end of the second liquid return section 222 and the first end of the third liquid return section 223.

[0256] For example, the first power device 40 can be arranged in a sub-region 410b1 on one side of the support platform 400, i.e., the first power device 40 is arranged on one side of the heat exchange module 10 in the first direction and can be fixed in the sub-region 410b1 on that side of the support platform 400, improving the structural compactness of the cooling device 200.

[0257] For example, the first power device 40 can be a fluid power pump for pushing the cooling medium to flow in the pipeline. Optionally, the first power device 40 can use a fluid power pump with a lift of 3 bar and a delivery flow of 60 m3 / h.

[0258] In an embodiment, the cooling device 200 further comprises a liquid storage module, which comprises a first liquid storage tank 80 in communication with the first pipeline group 20, the first liquid storage tank 80 being used to store the cooling medium and supplement the cooling medium to the first pipeline group 20.

[0259] In an embodiment, the first liquid return pipeline 22 can further comprise a first liquid supplement branch 224, the first and second ends of the first liquid supplement branch 224 can be in communication with the interior of the second liquid return section 222, and the pipe wall of the first liquid supplement branch 224 can be provided with a first liquid supplement interface 224a in communication with the interior of the first liquid storage tank 80 through a first connecting branch (not shown in the figure).

[0260] In the embodiments of the present application, the first liquid storage tank 80 and the first liquid supplement branch 224 can be used to realize the liquid supplement function of the cooling device 200 for the cooling medium. For example, the cooling medium in the first pipeline group 20 can be supplemented by an automatic water supplement pump, and the cooling medium can be filtered by a filter.

[0261] The cooling device 200 can automatically supplement the cooling medium during operation through the first liquid storage tank 80, the first liquid supplement branch pipe 224, and the automatic liquid supplement pump, so as to ensure that the total amount of the cooling medium inside the cooling device 200 is kept in a proper state. Optionally, the volume of the first liquid storage tank 80 can be 30 L.

[0262] In an embodiment, the first liquid storage tank 80 can be arranged inside the frame of the support platform 400, i.e., the first liquid storage tank 80 is located below the heat exchange module 10, so as to make full use of the space below the heat exchange module 10, reduce the space occupation of the first liquid storage tank 80 in the horizontal direction, and further improve the structural compactness of the cooling device 200. For example, the first liquid storage tank 80 is fixed to the frame inside the frame.

[0263] In an embodiment, the cooling device 200 further comprises a pressure stabilizing module, which comprises a first pressure stabilizing tank in communication with the first pipe group 20, for stabilizing the pressure of the first pipe group 20.

[0264] In an embodiment, the first liquid return pipe 22 can further comprise a first pressure stabilizing branch pipe 225, a first end of the first pressure stabilizing branch pipe 225 can be in communication with the inside of the first pressure stabilizing tank 60, and a second end of the first pressure stabilizing branch pipe 225 can be in communication with the inside of the third liquid return section 223.

[0265] In the embodiments of the present application, the pressure inside the cooling device 200 can be adjusted and stabilized by the pressure stabilizing tank. During the operation of the cooling device 200, temperature changes and fluid flow can cause fluctuations in the internal pressure. The first pressure stabilizing tank 60 can be used to maintain the pressure balance of the cooling device 200, avoiding the influence of excessively high or low pressure on the heat dissipation effect. In addition, when the cooling medium flow in the cooling device 200 suddenly changes, the first pressure stabilizing tank 60 can act as a buffer to reduce the impact of flow fluctuations on the system and protect other components of the cooling device 200.

[0266] Through the first pressure stabilizing branch pipe 225, the cooling medium can flow freely between the third liquid return section 223 and the first pressure stabilizing tank 60. When the system pressure is too high, the excess cooling medium will enter the first pressure stabilizing tank 60; when the system pressure is too low, the cooling medium in the first pressure stabilizing tank 60 will flow back to the system, keeping the pressure stable. In this way, the stability, reliability, and heat dissipation exchange efficiency of the operation of the cooling device 200 are improved. Optionally, the volume of the first pressure stabilizing tank 60 can be 20 L.

[0267] In an embodiment, the first pressure tank 60 can be arranged inside the frame of the support platform 400. For example, the first pressure tank 60 is fixed in the middle sub-region 410b1 of the support platform 400, and the heat exchange module 10, the first liquid storage tank 80, and the first pressure tank 60 are arranged in a vertical direction from top to bottom in sequence, so that the space below the heat exchange module 10 can be further utilized, the space occupation of the first pressure tank 60 in the horizontal direction is reduced, and the structural compactness of the cooling device 200 is further improved.

[0268] In an embodiment, the second liquid supply pipeline 31 can include a first liquid supply section 311 and a second liquid supply section 312 connected in sequence. A first end of the first liquid supply section 311 can be connected with a medium output end of the cooling source device 500, a second end of the first liquid supply section 311 can be connected with a first end of the second liquid supply section 312, and a second end of the second liquid supply section 312 can be connected with an input end of the second heat exchange flow path 10b. The first liquid supply section 311 and the second liquid supply section 312 can be respectively arranged in a vertical direction and spaced apart in the first direction L1.

[0269] For example, an upper end of the first liquid supply section 311 forms the first end thereof, and the upper end of the first liquid supply section 311 is connected with the medium output end of the cooling source device 500 through a pipeline. A lower end of the first liquid supply section 311 forms the second end thereof, and the lower end of the first liquid supply section 311 is connected with the first end of the second liquid supply section 312. An upper end of the second liquid supply section 312 forms the second end thereof, and the upper end of the second liquid supply section 312 is connected with the input end of the second heat exchange flow path 10b.

[0270] In this way, the first liquid supply section 311 and the second liquid supply section 312 can form a continuous liquid supply path. During the cooling process, the low-temperature heat exchange medium can flow out from the medium output end of the cooling source device 500, enter the second heat exchange flow path 10b through the first liquid supply section 311 and the second liquid supply section 312. Through the heat exchange module 10, the cooling medium in the first heat exchange flow path 10a can exchange heat with the heat exchange medium in the second heat exchange flow path 10b to reduce the temperature of the cooling medium. After heat exchange, the temperature of the heat exchange medium in the second heat exchange flow path 10b is increased. The heat exchange medium can return to the medium return end of the cooling source device 500 through the second liquid return pipeline 32, and the cooling source device 500 further processes the heat exchange medium to reduce its temperature, preparing for the next cooling cycle. In this way, the heat exchange efficiency of the cooling device 200 in the heat dissipation structure 1 can be improved, and the performance degradation and hardware damage of the computing elements of the computing device 230 caused by overheating can be prevented.

[0271] In addition, by spacing the first liquid supply section 311 and the second liquid supply section 312 in the first direction L1, the space occupied by the second liquid supply pipeline 31 in the second direction L2 can be reduced, further improving the structural compactness of the cooling device 200.

[0272] In an embodiment, the cooling device 200 further comprises a second power device 50, which is in communication with the second pipeline group 30, and is configured to provide power to the flow of the heat exchange medium.

[0273] For example, the second power device 50 can be arranged in one of the sub-regions 410b1 on the other side of the support platform 400, i.e., the second power device 50 is arranged on the other side of the heat exchange module 10 in the first direction L1, and is arranged in the sub-region 410b1 on the side of the support platform 400, so as to improve the structural compactness of the cooling device 200.

[0274] For example, the second power device 50 is arranged between the second end of the first liquid supply section 311 and the first end of the second liquid supply section 312. For example, the second power device 50 can be a fluid power pump configured to push the heat exchange medium to flow in the pipeline. Alternatively, the second power device 50 can be a fluid power pump with a lift of 2.5 bar and a delivery flow of 65 m3 / h.

[0275] In an embodiment, the liquid storage module of the cooling device 200 further comprises a second liquid storage tank 90, which is in communication with the second pipeline group 30, and is configured to contain the cooling medium and supply the heat exchange medium to the second pipeline group 30.

[0276] In an embodiment, the second liquid supply pipeline 31 can further comprise a second liquid supplement branch 313, the first end and the second end of the second liquid supplement branch 313 can be in communication with the interior of the first liquid supply section 311, and the pipe wall of the second liquid supplement branch 313 can be provided with a second liquid supplement interface 313a, which can be in communication with the interior of the second liquid storage tank 90 through a second connecting branch (not shown in the figure).

[0277] In the embodiment of the present application, the second liquid storage tank 90 and the second liquid supplement branch pipe 313 can be used to realize the liquid supplement function of the cooling device 200 for the heat exchange medium. For example, the cooling medium in the second pipeline group 30 can be supplemented by the automatic water supplement pump, and the cooling medium can be filtered by the filter. The second liquid supplement interface 313a can be connected to the inside of the second liquid storage tank 90 below the heat exchange module 10 through a second connecting branch pipe (not shown in the figure). Further, the cooling device 200 can automatically supplement the cooling medium during operation through the second liquid storage tank 90, the second liquid supplement branch pipe 313, and the automatic water supplement pump, so as to ensure that the total amount of the heat exchange medium in the cooling device 200 is maintained in an appropriate state.

[0278] In an embodiment, the second liquid storage tank 90 can be arranged inside the frame structure 410 of the support platform 400, i.e., the second liquid storage tank 90 is located below the heat exchange module 10, so as to fully utilize the space below the heat exchange module 10, reduce the space occupation of the second liquid storage tank 90 in the horizontal direction, and further improve the structural compactness of the cooling device 200.

[0279] For example, the second liquid storage tank 90 and the first liquid storage tank 80 can be arranged side by side and adjacent to each other in the second direction L2, so as to further fully utilize the space below the heat exchange module 10, reduce the space occupation of the second liquid storage tank 90 in the horizontal direction, and further improve the structural compactness of the cooling device 200.

[0280] In an embodiment, the pressure stabilizing module of the cooling device 200 can further include a second pressure stabilizing tank 70, which is connected to the second pipeline group 30 and used to stabilize the pressure of the second pipeline group 30.

[0281] In an embodiment, the second liquid supply pipeline 31 can further include a second pressure stabilizing branch pipe 314, the first end of which is connected to the inside of the second pressure stabilizing tank 70, and the second end of which can be connected to the inside of the first liquid supply section 311. The second liquid storage tank 90 and the second liquid supplement branch pipe 313 can be used to realize the liquid supplement function of the cooling device 200 for the second pipeline group 30, and the second pressure stabilizing tank 70 can be used to adjust and stabilize the pressure in the cooling device 200, so as to improve the stability, reliability, and heat exchange efficiency of the cooling system. Optionally, the volume of the second liquid storage tank 90 can be 30L, and the volume of the second pressure stabilizing tank 70 can be 20L.

[0282] In one embodiment, the second surge tank 70 may be disposed within the frame of the support platform 400. Exemplarily, the second surge tank 70 is secured within the central subregion 410b1 of the support platform 400 and arranged side by side with the first surge tank 60 in the second direction L2. That is, the heat exchange module 10, the second liquid storage tank 90, and the second surge tank 70 are arranged vertically from top to bottom, with the second surge tank 70 adjacent to and side by side with the first surge tank 60 in the second direction L2. This further utilizes the space below the heat exchange module 10, further improving the structural compactness of the cooling device 200 and reducing the horizontal space occupied by the second surge tank 70.

[0283] In one embodiment, the input end of the first heat exchange circuit 10a may be located below the output end of the first heat exchange circuit 10a; and the input end of the second heat exchange circuit 10b may be located above the output end of the second heat exchange circuit 10b. In some examples, the flow direction of the media within the first and second pipeline groups 20, 30 may be configured based on specific application requirements, and the specific positional relationship between the heat exchange circuit input and output ends may be configured based on the actual flow direction of the cooling medium and heat exchange medium within the pipeline groups.

[0284] Figure 5A A schematic structural diagram of a rack 1000 of a heat dissipation structure 1 according to an embodiment of the present application is shown. Figure 5B An enlarged view of region A in 5A is shown. Figure 5C A schematic structural diagram of a rack 1000 of a heat dissipation structure 1 according to an embodiment of the present application at a certain viewing angle is shown. Figure 5D A schematic structural diagram of the rack 1000 of the heat dissipation structure 1 according to an embodiment of the present application is shown in another perspective. Figure 5E Show Figure 5D The enlarged image of area B in the middle Figure 5F A schematic top view of a rack 1000 of a heat dissipation structure 1 according to an embodiment of the present application is shown.

[0285] See also Figures 5A to 5F , and combined with Figure 4A As shown, in the heat dissipation structure 1 of the embodiment of the present application, the medium flow path 210 of the rack 1000 includes a cooling pipe 215, a liquid inlet distribution pipe 150 and a liquid return distribution pipe 140. The cooling pipe 215 is used to thermally contact the heat-generating components of the computing device 230 to cool the heat-generating components.

[0286] For example, the cooling line 215 may be disposed inside the computing device 230. The cooling line 215 may be attached to or embedded in key heat-generating components of the computing device 230, such as a central processing unit, a graphics processing unit, a memory module, and other heat-generating electronic components.

[0287] The liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 are arranged on one side of the cabinet 100. The liquid inlet distribution pipeline 150 has a liquid inlet 151 connected with the liquid supply inlet of the first pipeline group 20 and a plurality of liquid delivery outlets 152 corresponding to the cooling pipelines 215 of the plurality of computing devices 230 and connected with the input ends of the cooling pipelines 215 of the plurality of computing devices 230 respectively. The liquid return distribution pipeline 140 has a plurality of liquid return outlets 142 corresponding to the cooling pipelines 215 of the plurality of computing devices 230 and connected with the output ends of the cooling pipelines 215 of the plurality of computing devices 230 respectively and a liquid outlet 141 connected with the liquid return inlet of the first pipeline group 20.

[0288] In the rack 1000 of the embodiment, the cabinet 100 not only bears the plurality of computing devices 230 but also cools the plurality of computing devices 230, so that the structure is compact and the space occupation is small, thereby facilitating maintenance and reducing cost. Moreover, the liquid delivery distribution and the liquid return distribution to the plurality of computing devices 230 are realized by one liquid inlet distribution pipeline 150 and one liquid return distribution pipeline 140, so that the number of components of the rack 1000 is reduced and the overall structure of the cabinet 100 is simplified. Moreover, it is convenient to centrally manage and conducive to more effectively controlling temperature and reducing energy consumption.

[0289] In an embodiment, the cabinet 100 defines a first accommodating space 100a for integrally arranging the plurality of computing devices 230 arranged in the vertical direction. The liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 are arranged in the vertical direction on one side of the cabinet 100 adjacent to the first pipeline group 20 in the second direction L2, and the plurality of liquid delivery outlets 152 and the plurality of liquid return outlets 142 are arranged in the vertical direction. On the one hand, the liquid inlet 151 of the liquid inlet distribution pipeline 150 and the liquid outlet 141 of the liquid return distribution pipeline 140 are connected with the liquid supply outlet 212a of the first pipeline group 20 and the liquid return inlet 221a of the first pipeline group 20 respectively. On the other hand, the arrangement directions of the liquid delivery outlets 152 and the liquid return outlets 142 are consistent with the arrangement direction of the plurality of computing devices 230, so that the liquid delivery outlets 152 and the liquid return outlets 142 are connected with the cooling pipelines 215 inside the plurality of computing devices 230.

[0290] In some examples, the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 can each be a square, for example, a square. In other examples, the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 can be circular pipes. It should be noted that this is only an example and does not limit the present application. Those skilled in the art can understand that the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 can also be corrugated pipes, special-shaped pipes, spiral pipes, multi-layer composite pipes and the like, and are not limited thereto.

[0291] For example, the inner diameter of the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 can be 70mm to 160mm, to ensure the flow rate of the cooling medium while reducing the pressure loss.

[0292] For example, the inner diameter of the liquid inlet 151 and the liquid outlet 141 can be 50mm to 150mm, to ensure sufficient flow rate of the cooling medium at the liquid inlet 151 and the liquid outlet 141 while reducing the flow rate at the liquid inlet 151 and the liquid outlet 141, thereby reducing the friction loss and pressure drop and ensuring that the cooling medium at each liquid inlet 151 and liquid outlet 141 has sufficient pressure.

[0293] For example, the inner diameter of the liquid inlet 151 and the liquid outlet 141 can be 50mm to 150mm, to ensure sufficient flow rate of the cooling medium at the liquid inlet 151 and the liquid outlet 141 while reducing the flow rate at the liquid inlet 151 and the liquid outlet 141, thereby reducing the friction loss and pressure drop and ensuring that the cooling medium at each liquid inlet 151 and liquid outlet 141 has sufficient pressure.

[0294] For example, each liquid inlet 152 can be connected to the input end of each cooling pipeline 215 of each computing device 230 through a liquid delivery connecting pipeline 216, and each liquid return port 142 can be connected to the output end of each cooling pipeline 215 of each computing device 230 through a liquid return connecting pipeline 217.

[0295] In some examples, at least one of the liquid delivery connecting pipeline 216 and the liquid return connecting pipeline 217 is a flexible pipe to accommodate space constraints and facilitate installation and removal.

[0296] In other examples, at least one of the liquid delivery connecting pipeline 216 and the liquid return connecting pipeline 217 is a rigid pipe to improve the structural strength of the pipeline.

[0297] It should be noted that the above is only an example and does not constitute a limitation on the present application. Those skilled in the art can understand that the flexible pipe used in the liquid delivery connecting pipeline 216 and the liquid return connecting pipeline 217 can be a plastic pipe, a corrugated pipe, etc. which can be bent and has elasticity. The rigid pipe can be a copper pipe, an aluminum pipe, a stainless steel pipe, etc. which has a large hardness, or a plastic pipe which has a strong hardness and support, or a rigid pipe made of plastic, metal or composite material which has a certain hardness and bending ability.

[0298] The material of the liquid delivery connecting pipeline 216 and the liquid return connecting pipeline 217 is not limited to the above examples, but can also be any combination of the above materials, such as a combination of soft and hard pipes, all flexible pipes or all rigid pipes, etc.

[0299] In an embodiment, the liquid inlet distribution pipe 150 and the liquid return distribution pipe 140 are projected on two sides of the projections of the plurality of computing devices 230 in the vertical plane; the plurality of liquid inlet ports 152 and the plurality of liquid return ports 142 are oppositely arranged in the first direction Ll, and the plurality of liquid inlet ports 152 are adjacent to one side of the plurality of computing devices 230 in the first direction Ll, and the plurality of liquid return ports 142 are adjacent to the other side of the plurality of computing devices 230 in the first direction Ll. In this way, the arrangement of the liquid inlet hoses between the liquid inlet ports 152 and the input ends of the cooling pipes 215, and the arrangement of the liquid return hoses between the liquid return ports 142 and the output ends of the cooling pipes 215 can be simplified, thereby shortening the lengths of the liquid inlet hoses and the liquid return hoses.

[0300] In an embodiment, the liquid inlet port 151 is formed on a side of the liquid inlet distribution pipe 150 adjacent to the first pipe group 20 in the second direction L2, and adjacent to the top end of the liquid inlet distribution pipe 150; and the liquid return port 141 is formed on a side of the liquid return distribution pipe 140 adjacent to the first pipe group 20 in the second direction L2, and adjacent to the top end of the liquid return distribution pipe 140. In this way, the liquid inlet port 151 of the liquid inlet distribution pipe 150 and the liquid return port 141 of the liquid return distribution pipe 140 are shortened in distance from the first pipe group 20, facilitating the connection of the liquid inlet port 151 and the liquid return port 141 to the liquid supply inlet and the liquid return inlet 221a of the first pipe group 20, respectively.

[0301] In an embodiment, the top end of the liquid inlet distribution pipe 150 and the top end of the liquid return distribution pipe 140 are provided with an exhaust valve, i.e., a second exhaust valve 160, to take advantage of the natural upward movement of gas, so that the gas is more easily discharged through the second exhaust valve 160, reducing the gas content in the pipes and improving the delivery efficiency of the liquid inlet distribution pipe 150 and the liquid return distribution pipe 140 for the cooling medium.

[0302] For example, the second exhaust valve 160 is a mechanical valve. Normally, the valve of the second exhaust valve 160 is closed, and when the cooling medium in the liquid inlet distribution pipe 150 and the liquid return distribution pipe 140 accumulates air or gas, the gas rises and accumulates at the top of the second exhaust valve 160. When the gas pressure is high enough, the valve of the second exhaust valve 160 opens, and the gas is discharged. After the gas is discharged, the valve closes quickly.

[0303] In an embodiment, the exhaust port 161 of the second exhaust valve 160 can be connected with a flexible connecting pipe (not shown), which can extend to the bottom of the cabinet 100 to discharge the gas in the liquid inlet distribution pipe 150 and the liquid return distribution pipe 140, respectively. The water vapor is drained through the flexible connecting pipe to the support platform 400 at the bottom of the cabinet 100, and is discharged to the outside through the gap of the bottom support platform 400, avoiding the influence of the water vapor on the computing devices 230 inside the cabinet 100.

[0304] In an embodiment, the cabinet 100 comprises a cabinet body 110 and a shelf 120, the shelf 120 is arranged in the interior of the cabinet body 110, and the shelf 120 defines a first accommodating space 100a. By providing the accommodating space for the computing devices 230 through the independent shelf 120, the weight of the computing devices 230 can be dispersed, the overall structure of the cabinet 100 is prevented from being excessively stressed, and the overall stability and safety of the cabinet 100 are improved.

[0305] A second accommodating space 100b is defined between the shelf 120 and the cabinet body 110, the second accommodating space 100b is arranged in the first direction L1 with the first accommodating space 100a, and a plurality of power distribution units of the cabinet 100 can be vertically arranged in the second accommodating space 100b. The plurality of computing devices 230 and the plurality of power distribution units are concentrated in one cabinet 100, the space utilization is improved, and the power management and maintenance are facilitated. Moreover, the power of the power distribution cabinet 600 outside the cabinet 100 is distributed to each computing device 230 inside the cabinet 100 through the plurality of power distribution units, the power wiring can be simplified, and the cable mess is avoided.

[0306] For example, the number of the power distribution units can be less than the number of the computing devices 230, that is, one power distribution unit can distribute power to a plurality of computing devices 230.

[0307] In some examples, the shelf 120 can be welded and fixed in the interior of the cabinet body 110.

[0308] In other examples, the shelf 120 can be fixed in the interior of the cabinet body 110 through fasteners.

[0309] It should be noted that the above is only an example for illustration and does not constitute a limitation on the present application. Those skilled in the art can understand that the fixing mode between the shelf 120 and the cabinet body 110 can also have other modes, such as riveting fixation, slot insertion fixation, magnet adsorption fixation, or suction cup adsorption fixation, etc.

[0310] For example, the material of the shelf 120 can be metal. In some examples, the material of the shelf 120 can be steel. In other examples, the material of the shelf 120 can be aluminum alloy. It should be noted that the material of the shelf 120 is not limited to the above examples, and the material thereof can also be copper, carbon steel, alloy steel, etc., or other composite materials with high strength and support, etc., and is not limited thereto.

[0311] In an embodiment, the shelf 120 includes two support frames 1200 spaced apart in the first direction L1, i.e., the first accommodation space 100a is defined by the two support frames 1200. The support frame 1200 includes a plurality of columns 121 spaced apart in the second direction L2 and a plurality of support plates 122 spaced apart in the vertical direction and connected to the plurality of columns 121. The plurality of support plates 122 of one support frame 1200 are sequentially and oppositely distributed with the plurality of support plates 122 of the other support frame 1200 in the first direction L1, so as to support the computing device 230 by the oppositely distributed two support frames 1200, which can improve the stability of the placement of the computing device 230 and provide regular and neat arrangement space for the computing device 230, facilitating the management and maintenance of the computing device 230.

[0312] For example, each support frame 1200 includes two columns 121 arranged on both sides of the second direction L2, which constitute the vertical columns of the support frame 1200. The two columns 121 are connected to a plurality of support plates 122 spaced apart in the vertical direction, which constitute the support platform 400 of each computing device 230, so as to enhance the overall strength of the shelf 120.

[0313] For example, the support plate 122 can include a fixed plate 122a extending vertically and a bearing plate 122b extending horizontally. The fixed plate 122a is fixed to the corresponding plurality of columns 121, and the bearing plate 122b extends horizontally from the lower end of the fixed plate 122a towards the support plate 122 of the other support frame 1200, forming a plurality of pairs of oppositely arranged bearing plates 122b spaced apart in the vertical direction. Each computing device 230 can be directly pushed into the corresponding pair of bearing plates 122b in the second direction L2, which is easy to place and convenient to operate.

[0314] For example, a bearing platform can be arranged between the two oppositely arranged fixed plates 122a, which is located above the two oppositely arranged bearing plates 122b. The computing device 230 can be placed on the corresponding bearing platform, which improves the stability of the placement of the computing device 230.

[0315] In an embodiment, the rack 1000 can further include a plurality of power supply support seats 124 spaced apart in the vertical direction and arranged in the second accommodation space 100b. The plurality of power supply support seats 124 are connected between the cabinet 110 and the shelf 120, and are used to support a plurality of power distribution units respectively, so as to ensure the stability of the placement of the power distribution units. Referring to Figure 5C As shown, the support frame 1200 located on the right side of the shelf 120 in the first direction L1 is connected between the right side wall of the cabinet 110 in the first direction L1 and the plurality of power supply support seats 124 spaced apart in the vertical direction. For example, each power supply support seat 124 can place one power distribution unit.

[0316] In some examples, the power supply support 124 can be fixed between the cabinet body 110 and the shelf 120 by welding. In other examples, the power supply support 124 can be fixed between the cabinet body 110 and the shelf 120 by fasteners. It should be noted that this is only an example and does not limit the present application. Those skilled in the art can understand that the power supply support 124 can be connected to the cabinet body 110 and the shelf 120 in other ways, such as riveting, pin connection or buckle connection, and the like, and is not limited thereto.

[0317] For example, the liquid inlet distribution pipeline 150 is vertically arranged on one of the support frames 1200 of the shelf 120 adjacent to one side of the first pipeline group 20 in the second direction L2, and the liquid return distribution pipeline 140 is vertically arranged on the other support frame 1200 adjacent to one side of the first pipeline group 20 in the second direction L2.

[0318] For example, the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 can be fixed to the shelf 120 in a detachable manner.

[0319] In some examples, a plurality of mounting plates 123 are vertically and spacedly arranged between the upright column 121 adjacent to the second accommodation space 100b in the first direction L1 and the cabinet body 110 of the cabinet 100. The liquid inlet distribution pipeline 150 is fixed to the corresponding mounting plate 123 by the connecting member 153 thereon. One of the upright columns 121 of the other support frame 1200 can be provided with a plurality of other mounting plates (not shown) vertically and spacedly arranged, and the liquid return distribution pipeline 140 is fixed to the corresponding other mounting plate by the connecting member 153 thereon.

[0320] In other examples, the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 can be detachably connected to the shelf 120 by buckle connection, magnetic attraction or suction cup adsorption, and the like, and are not limited thereto.

[0321] For example, the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 can be fixedly connected to the shelf 120. For example, the connecting member 153 of each of the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 is fixed to the corresponding upright column 121 of the shelf 120 by screwing, welding or riveting, and the like.

[0322] It should be noted that the above is only an example and does not limit the present application. Those skilled in the art can understand that the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 can be connected to the shelf 120 in other ways, such as clamp fixing, binding fixing or buckle fixing, and the like, and are not limited thereto.

[0323] In an embodiment, the rack 1000 further comprises a wiring column 130 vertically arranged on the other side of the shelf 120 in the second direction L2, the wiring column 130 is formed with a plurality of wire slots 131 for network cables to pass through, the network cables are used to connect with the network interface of the computing device 230 to realize the network connection of the computing device 230.

[0324] For example, the wiring column 130 is distributed with a plurality of lightening holes to reduce the overall weight.

[0325] In some examples, the wiring column 130 can be welded to the inside of the cabinet body 110. In other examples, the wiring column 130 can be fixed to the inside of the cabinet body 110 by fasteners. It should be noted that the above is only illustrative and does not constitute a limitation on the present application. Those skilled in the art can understand that the fixing mode between the wiring column 130 and the cabinet body 110 can also have other various modes, such as rivet fixing, slot embedded fixing, magnet adsorption fixing or suction cup adsorption fixing, etc., and is not limited thereto.

[0326] In an embodiment, the rack 1000 further comprises a top connecting plate 190 arranged on the top of the cabinet 100 and extending above the adjacent cabinet 100; the top connecting plate and the top of the adjacent cabinet 100 respectively have top connecting holes opposite in the vertical direction, and the cabinet 100 and the adjacent cabinet 100 are fixed by fasteners passing through the top connecting holes. That is, the two adjacent cabinets 100 arranged in the first direction L1 can be connected together by the top connecting plate 190 to construct a plurality of racks 1000 arranged and connected in turn, thereby forming a stable integrated plurality of racks 1000, facilitating transportation and delivery.

[0327] For example, the top connecting plate 190 can be arranged at the edge of the cabinet body 110 on the top in the first direction L1, facilitating connection with the adjacent cabinet 100.

[0328] For example, two top connecting plates 190 spaced apart in the second direction L2 are installed on the first side of the top of the cabinet 100 in the first direction L1, and the two top connecting plates 190 in the second direction L2 are connected with the adjacent cabinet 100, improving the stability of the connection between the two adjacent cabinets 100, thereby making the connection between the plurality of racks 1000 more stable and avoiding the shaking of the rack 1000 during transportation.

[0329] In an embodiment, referring to Figure 5FThe first wire hole 114 is covered by a cover plate 112 which is installed on the top wall of the cabinet body 110. Specifically, the top of the cabinet body 110 is provided with a plurality of first fixing holes around the first wire hole 114, and the cover plate 112 is provided with a plurality of second fixing holes corresponding to the first fixing holes. Before the power cable 113 is connected, the cover plate 112 is fixed above the wire hole by fasteners sequentially passing through the second fixing holes and the first fixing holes. That is, before the power cable 113 is connected, the first wire hole 114 is covered by the cover plate 112. For example, during transportation and handling of the cabinet 100, the cover plate 112 covers the first wire hole 114 to prevent foreign matter from falling into the interior of the cabinet 100. After delivery, the cover plate 112 is removed, and the power cable 113 is connected to the power distribution unit in the interior of the cabinet 100 through the first wire hole 114.

[0330] In an embodiment, the top of the cabinet 100 can be provided with lifting rings 170 which are detachably arranged on the top of the cabinet 100 for connecting lifting ropes to facilitate handling of the cabinet 100. The lifting rings 170 can be multiple to improve the stability of lifting and handling of the cabinet 100.

[0331] For example, one lifting ring 170 is arranged at each of the four corners of the top of the cabinet 100 to facilitate maintaining the balance and stability of the cabinet 100 when lifted.

[0332] For example, the lifting ring 170 includes a ring portion and a mounting portion. The mounting portion is connected to the top of the cabinet 100, and the ring portion is above the mounting portion to facilitate connection with the lifting rope. The lifting ring 170 is vertically arranged as a whole so that the cabinet 100 can be kept in a vertical state when lifted, which is conducive to maintaining the stability of the cabinet 100 and facilitating placement of the cabinet 100. For example, the mounting portion can be a bolt, and the top of the cabinet 100 is provided with a screw hole corresponding to the mounting portion. The bolt and the screw hole cooperate to facilitate mounting and dismounting of the lifting ring 170.

[0333] In an embodiment, the bottom of the cabinet 100 can be formed with vertically extending fixing holes 111 to fix the cabinet 100 to the support platform 400 by fasteners passing through the fixing holes 111 to maintain the stability of the cabinet 100 and facilitate transportation.

[0334] For example, the four corner regions of the bottom of the cabinet 100 can be respectively formed with fixing holes 111, and the cabinet 100 is fixed to the support platform 400 by the four fixing holes 111, which is more stable and less likely to shake during transportation.

[0335] In an embodiment, the rack 1000 further comprises a bottom connecting plate 180, which extends downwardly outside the rack 100 in the second direction L2 and is fixed at the upper end to the rack 100 and at the lower end to the support platform 400. The bottom connecting plate 180 thus forms a stable triangular structure, which improves the stability of the connection between the rack 100 and the support platform 400.

[0336] For example, the bottom connecting plate 180 is provided with connecting holes for connecting to the rack 100 and the support platform 400, and the fasteners are passed through the corresponding connecting holes to fix the bottom connecting plate 180 to the rack 100 and the support platform 400, respectively.

[0337] For example, the two outer sides of the bottom of the rack 100 in the second direction L2 are respectively provided with a bottom connecting plate 180, which improves the stability of the connection between the rack 100 and the support platform 400.

[0338] In an embodiment, the bottom of the rack 100 is provided with a plurality of rollers 101, which facilitates the separate movement of the rack 100. For example, the bottom of the rack 100 is provided with four rollers 101, which are evenly spaced and respectively arranged at the regions adjacent to the four corners of the bottom of the rack 100.

[0339] The present application also provides a container 2, which comprises a box body 700 and the heat dissipation structure 1 of any of the above embodiments, and the heat dissipation structure 1 is arranged inside the box body 700. The heat dissipation structure 1 is thus formed in the form of a container, which facilitates transportation and delivery, and at the same time provides a stable structure to prevent the influence of the external environment.

[0340] In some examples, the heat dissipation structure 1 is directly placed inside the box body 700. In order to ensure the stability of the heat dissipation structure 1 during the transportation of the container 2, the internal dimensions of the box body 700 can be matched with the external dimensions of the heat dissipation structure 1 to prevent movement; or a buffer protection layer can be additionally arranged between the heat dissipation structure 1 and the box body 700 to provide additional protection against movement.

[0341] In other examples, the heat dissipation structure 1 is fixed inside the box body 700, for example, the support platform 400 and / or the top frame 300 of the heat dissipation structure 1 can be fixed to the bottom wall and / or the side wall of the box body 700 by fasteners.

[0342] It should be noted that the above is only an example for illustration and does not constitute a limitation on the present application.

[0343] Those skilled in the art can understand that the arrangement of the heat dissipation structure 1 relative to the box body 700 can also have other forms. For example, an anti-skid pad can be additionally arranged at the bottom of the box body 700, or a shock-absorbing pad or shock absorber can be used to isolate the heat dissipation structure 1 from the box body 700 to reduce the vibration and impact generated by the box body 700 during transportation. In addition, clamps or buckles can also be arranged inside the box body 700, or the heat dissipation structure 1 can be fixed by magnetic attraction or vacuum adsorption. Here, only examples are given, and the arrangement of the heat dissipation structure 1 relative to the box body 700 is not limited to the foregoing examples.

[0344] In an embodiment, the box body 700 includes a frame 701, which is arranged upwardly protruding at one side of the bottom of the box body 700 in the second direction L2. The support platform 400 is arranged spaced apart from the frame 701 at one side adjacent to the frame 701 in the second direction L2 to form a groove for liquid drainage. That is, when arranged at the bottom of the box body 700, the support platform 400 needs to maintain a certain distance from the frame 701 of the box body 700 in the second direction L2 to reserve a channel for liquid drainage, so as to facilitate timely drainage of liquid.

[0345] The frame 701 can be formed with a plurality of liquid drainage holes 702 spaced apart in the first direction L1. The liquid in the groove is drained to the outside of the box body 700 through the liquid drainage holes 702 to avoid water accumulation at the bottom of the box body 700.

[0346] For example, the liquid drainage holes 702 are two. The two liquid drainage holes 702 can jointly form a forklift hole to facilitate forklift transportation of the container.

[0347] In some examples, the shape and size of the box body 700 can be arranged in correspondence with a standard container of a 40-foot specification, and the overall size is 12.192m*2.438m*2.438m. Thus, after the heat dissipation structure 1 is integrated and arranged inside the box body 700, the heat dissipation structure 1 can be directly transported by sea or other means such as land transportation, and no secondary assembly is required after transportation is completed, thereby improving the convenience of transportation and delivery.

[0348] The above is only one specific example and does not constitute a limitation of the present application. Those skilled in the art can understand that the shape and size of the box body 700 can be arbitrarily set according to actual conditions. In order to facilitate transportation, the shape and size of the box body 700 can be arranged in correspondence with a standard container, for example, the same shape and size as a standard container of a 20-foot, 40-foot or 45-foot specification, and is not limited thereto.

[0349] The shape and size of the box 700 can also have other different designs, for example, a compact design can be adopted, so that the internal shape and size of the box 700 are close to the shape and size of the heat dissipation structure 1, reducing the excess space and avoiding the movement of the heat dissipation structure 1 in the box 700; or, a design with excess space can be adopted, a certain buffer space is reserved around the inside of the box 700, which is convenient for placing fillers or buffer materials and providing additional protection. Here, only examples are given, and the shape and size of the box 700 are not limited to the foregoing examples.

[0350] The embodiment also provides a data center, which includes a plurality of computing devices 230 and the heat dissipation structure 1 or the container 2 of any of the foregoing embodiments. The plurality of computing devices 230 can be integrated and installed in the cabinet 100 of each heat dissipation structure 1, forming a data center in the form of a pry block integration, or the heat dissipation structure 1 is placed in the box, forming a data center in the form of a container.

[0351] Compared with the traditional data center, the data center provided by the embodiment can be pre-assembled and tested. After delivery, only simple power cable 113 and network cable are needed to connect the power distribution cabinet 600 and the network on site, respectively, so that the data center can be put into use, thereby greatly saving the deployment time. Moreover, the data center of the embodiment has high standardization and consistency, which can reduce the uncertainty and potential problems of on-site construction, thereby reducing the construction cost and operation cost. In addition, the modular design of the data center can be customized according to different needs, including different power density, cooling scheme and network configuration, to meet the needs of various application scenarios.

[0352] In the description of the present application, it should be understood that the terms "length", "upper", "lower", "front", "rear", "left", "right", "vertical" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0353] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0354] In this application, unless otherwise clearly indicated and limited, the terms "on", "connected to", "connected with" and like terms can be electrically connected, and can also be communicated; can be directly connected, and can also be indirectly connected through an intermediate medium; can be internal communication of two elements or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0355] In this application, unless otherwise clearly indicated and limited, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "over" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0356] The above disclosure provides many different implementations or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and arrangements of specific examples are described in the above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numbers and / or letters in different examples, and such repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or arrangements discussed.

[0357] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any skilled person in the art can easily think of various changes or replacements within the technical scope disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A heat dissipation structure, characterized in that: include: at least one rack, the rack comprising a cabinet and a medium flow path, the cabinet being used for integrated installation of a plurality of computing devices, the medium flow path being used for supplying a cooling medium to flow through the plurality of computing devices; A cooling device, comprising a heat exchange module and a first pipeline group, wherein the first pipeline group is connected between the heat exchange module and the medium flow path of the at least one rack; a top frame fixed to the top of the at least one frame, wherein at least a portion of the first pipeline group is supported by the top frame; A support platform, the at least one rack and the cooling device are integrated on the support platform, the heat exchange module is arranged on one side of the at least one rack in a first direction, the first pipeline group is located on one side of the heat exchange module in a second direction, and the second direction intersects with the first direction.

2. The heat dissipation structure according to claim 1, characterized in that: The support platform comprises: A frame structure, a support plate and a frame body, wherein the frame structure has a first area and a second area arranged in the first direction, the support plate covers the first area; and the frame body is arranged in the second area; The at least one frame is arranged on the support plate, and the heat exchange module is supported on the upper part of the frame.

3. The heat dissipation structure according to claim 2, characterized in that: The cooling device further includes a second pipeline group, which is connected between the heat exchange module and the cold source device; The second area includes three sub-areas arranged in the second direction, the orthographic projection of the frame in the horizontal plane is located in the middle sub-area, and the bottom end of the frame is connected to the middle sub-area; Orthographic projections of at least part of the pipe sections of the first pipeline group and at least part of the pipe sections of the second pipeline group in the horizontal plane are respectively located in the two sub-areas on both sides.

4. The heat dissipation structure according to claim 2, characterized in that: The support plate includes a plurality of plates arranged in a spliced ​​manner, and each plate is connected to the frame structure via a corresponding fastener; A gap is defined between two adjacent plates, and the gap is used to guide the liquid on the support plate to the bottom of the support plate.

5. The heat dissipation structure according to claim 4, characterized in that: A plurality of convex structures distributed at intervals are formed on the upper surface of the plate.

6. The heat dissipation structure according to claim 1, characterized in that: The top frame includes a plurality of cross beams and at least one longitudinal beam; the plurality of cross beams extend respectively along the first direction and are spaced apart side by side in the second direction, the cross beams are fixedly connected to the top of the at least one frame; the longitudinal beam extends along the second direction; Wherein, at least one longitudinal beam is fixedly connected between two adjacent transverse beams, and part of the first pipeline group is supported by the longitudinal beam.

7. The heat dissipation structure according to claim 6, characterized in that: The plurality of cross beams include a first beam body and a second beam body, wherein the first beam body and the second beam body are fixedly connected to the top of the at least one frame; The longitudinal beam includes a first section and a second section connected to each other, wherein the first section is connected between the first beam body and the second beam body; the second section is located on a side of the second beam body away from the first beam body and extends to the outside of the frame in the second direction; Part of the first pipeline group is supported on the second section.

8. The heat dissipation structure according to claim 6, characterized in that: There are multiple racks, and the multiple racks are arranged side by side along the first direction; There are multiple longitudinal beams, and the multiple longitudinal beams correspond one-to-one to the multiple racks. The longitudinal beams are located on the tops of the corresponding racks.

9. The heat dissipation structure according to claim 7, characterized in that: The top frame further includes at least one pipeline support seat, which corresponds one-to-one to the at least one longitudinal beam. The pipeline support seat is arranged in the second section of the corresponding longitudinal beam, and part of the first pipeline group is supported by the pipeline support seat.

10. The heat dissipation structure according to claim 9, characterized in that: The pipeline support seat has a clamping groove with an opening arranged upward, and the inner wall surface of the clamping groove is an arc surface adapted to the shape of the outer peripheral wall of the pipeline of the first pipeline group.

11. The heat dissipation structure according to claim 7, characterized in that: Also includes: a power distribution cabinet, disposed on the support platform and located on the other side of the at least one rack in the first direction, so as to be opposite to the heat exchange module in the first direction; The rack further includes a power distribution unit disposed inside the cabinet, and the power distribution unit is connected to the power distribution cabinet via a power supply cable.

12. The heat dissipation structure according to claim 11, characterized in that: The top frame also includes at least one bracket, which corresponds one-to-one to the at least one rack. The bracket is arranged on the top of the corresponding rack and is located between the first beam and the second beam. The top of the bracket has a supporting surface, which is used to support the power supply cable.

13. The heat dissipation structure according to claim 12, characterized in that: A first cable hole is formed on the top of the cabinet of the rack, and the first cable hole is located on a side of the corresponding bracket away from the power distribution cabinet in the first direction, and the first cable hole is used for allowing the corresponding power supply cable to pass through and be connected to the corresponding power distribution unit; A second wire hole is formed on the top of the power distribution cabinet, and the second wire hole is used for the power supply cable to pass through and be connected to the power distribution cabinet.

14. The heat dissipation structure according to claim 1, characterized in that: The heat exchange module has a first heat exchange flow path for a cooling medium to flow and a second heat exchange flow path for a cooling medium to flow, wherein the cooling medium in the first heat exchange flow path exchanges heat with the heat exchange medium in the second heat exchange flow path to reduce the temperature of the cooling medium; The first pipeline group includes a first liquid supply pipeline and a first liquid return pipeline; the first liquid supply pipeline is connected to the output end of the first heat exchange flow path, and the first liquid supply pipeline is connected to the liquid inlet of the medium flow path of the rack; the first liquid return pipeline is connected to the input end of the first heat exchange flow path, and the first liquid return pipeline is connected to the liquid outlet of the medium flow path; The cooling device further includes a second pipeline group, which is connected between the second heat exchange flow path of the heat exchange module and the cold source device and is located on the other side of the heat exchange module in the second direction.

15. The heat dissipation structure according to claim 14, characterized in that: The first liquid supply pipeline comprises a first liquid supply sub-pipeline and a second liquid supply sub-pipeline connected to each other, the first liquid supply sub-pipeline and the second liquid supply sub-pipeline respectively extending along the first direction and arranged side by side and spaced apart in the second direction; The first liquid supply sub-pipeline has a liquid supply inlet at one end adjacent to the heat exchange module, and the liquid supply inlet is connected to the output end of the first heat exchange flow path; the second liquid supply sub-pipeline has a liquid supply outlet, and the liquid supply outlet is connected to the liquid inlet of the medium flow path; The first liquid return pipeline includes a first liquid return section, which extends along the first direction; the first liquid return section has a liquid return inlet, which is connected to the liquid outlet of the medium flow path.

16. The heat dissipation structure according to claim 15, characterized in that: There are multiple racks, and the multiple racks are arranged side by side along the first direction; There are multiple liquid supply outlets, which are arranged at intervals in the first direction of the second liquid supply sub-pipeline and are connected to the liquid inlets of the medium flow paths of the multiple racks in a one-to-one correspondence; There are multiple liquid return inlets, which are arranged at intervals in the first direction of the first liquid return section and are connected to the liquid outlets of the medium flow paths of the multiple racks in a one-to-one correspondence.

17. The heat dissipation structure according to claim 15, characterized in that: The first liquid supply sub-pipeline, the second liquid supply sub-pipeline and the first liquid return section are all supported on the top frame, and the first liquid return section is arranged between the first liquid supply sub-pipeline and the second liquid supply sub-pipeline.

18. The heat dissipation structure according to claim 15, characterized in that: The first liquid return pipeline also includes a second liquid return section and a third liquid return section connected to each other, and the second liquid return section and the third liquid return section extend vertically respectively; the first liquid return section is closed at one end away from the heat exchange module, and the end of the first liquid return section adjacent to the heat exchange module is connected to the first end of the second liquid return section, the second end of the second liquid return section is connected to the first end of the third liquid return section, and the second end of the third liquid return section is connected to the input end of the first heat exchange flow path.

19. The heat dissipation structure according to claim 18, characterized in that: The support platform includes a frame structure, the frame structure has a second area, the second area includes three sub-areas arranged in the second direction, the three sub-areas are respectively the sub-area located in the middle and the two sub-areas located on both sides; The orthographic projections of the second liquid return section and the third liquid return section in the horizontal plane are located in the sub-region adjacent to a side of the first liquid supply pipeline.

20. The heat dissipation structure according to claim 14, characterized in that: The second pipeline group includes a second liquid supply pipeline and a second liquid return pipeline; the second liquid supply pipeline is connected to the input end of the second heat exchange flow path, and the second liquid supply pipeline is connected to the medium output end of the cold source equipment; the second liquid return pipeline is connected to the output end of the second heat exchange flow path, and the second liquid return pipeline is connected to the medium return end of the cold source equipment.

21. The heat dissipation structure according to claim 20, characterized in that: The support platform includes a frame structure, the frame structure has a second area, the second area includes three sub-areas arranged in the second direction, the three sub-areas are respectively the sub-area located in the middle and the two sub-areas located on both sides; The orthographic projections of the second liquid supply pipeline and the second liquid return pipeline in the horizontal plane are located in the sub-region on the side away from the first liquid supply pipeline.

22. The heat dissipation structure according to claim 14, characterized in that: The cooling device also includes a first power device and a second power device. The first power device is connected to the first pipeline group and is used to provide power for the flow of the cooling medium. The second power device is connected to the second pipeline group and is used to provide power for the flow of the heat exchange medium.

23. The heat dissipation structure according to claim 1, characterized in that: The support platform includes a frame structure, the frame structure has a second area, the second area includes three sub-areas arranged in the second direction, the three sub-areas are respectively the sub-area located in the middle and the two sub-areas located on both sides; The first power device and the second power device of the cooling device are respectively arranged in the two sub-areas on both sides.

24. The heat dissipation structure according to claim 14, characterized in that: The cooling device also includes a liquid storage module, which includes a first liquid storage tank and a second liquid storage tank. The first liquid storage tank is connected to the first pipeline group and is used to replenish cooling medium to the first pipeline group. The second liquid storage tank is connected to the second pipeline group and is used to replenish heat exchange medium to the second pipeline group.

25. The heat dissipation structure according to claim 14, characterized in that: The cooling device also includes a pressure stabilizing module, which includes a first pressure stabilizing tank and a second pressure stabilizing tank. The first pressure stabilizing tank is connected to the first pipeline group and is used to stabilize the pressure of the first pipeline group. The second pressure stabilizing tank is connected to the second pipeline group and is used to stabilize the pressure of the second pipeline group.

26. The heat dissipation structure according to claim 1, characterized in that: The support platform includes a frame structure and a frame body, and the frame body is arranged on the frame structure; wherein the liquid storage module and / or the pressure stabilizing module of the cooling device is arranged inside the frame body.

27. The heat dissipation structure according to claim 1, characterized in that: The medium flow path includes a cooling pipeline, a liquid inlet distribution pipeline, and a liquid return distribution pipeline, wherein the cooling pipeline is used to be in thermal contact with the heat-generating component of the computing device to cool the heat-generating component; The liquid inlet distribution pipeline and the liquid return distribution pipeline are arranged on one side of the cabinet, the liquid inlet distribution pipeline has a liquid inlet and a plurality of liquid delivery ports, the liquid inlet is connected to the liquid supply inlet of the first pipeline group, and the plurality of liquid delivery ports are used to correspond one-to-one with the cooling pipelines of the plurality of computing devices and are respectively used to be connected to the input ends of the cooling pipelines of the plurality of computing devices; The liquid return distribution pipeline has multiple liquid return ports and liquid outlets. The multiple liquid return ports are respectively used to correspond one-to-one with the cooling pipelines of the multiple computing devices and are respectively used to be connected to the output ends of the cooling pipelines of the multiple computing devices. The liquid outlet is connected to the liquid return inlet of the first pipeline group.

28. The heat dissipation structure according to claim 27, characterized in that: The cabinet defines a first accommodating space, wherein the first accommodating space is used for integrating and installing a plurality of computing devices arranged vertically; The liquid inlet distribution pipeline and the liquid return distribution pipeline are respectively vertically arranged on one side of the cabinet adjacent to the first pipeline group in the second direction, and the multiple liquid delivery ports and the multiple liquid return ports are respectively arranged at intervals along the vertical direction.

29. The heat dissipation structure according to claim 27, characterized in that: The projections of the liquid inlet distribution pipeline and the liquid return distribution pipeline on the vertical plane are respectively located on both sides of the projections of the plurality of computing devices on the vertical plane; The multiple liquid delivery ports and the multiple liquid return ports are distributed opposite to each other in the first direction, and the multiple liquid delivery ports are adjacent to one side of the multiple computing devices in the first direction, and the multiple liquid return ports are adjacent to the other side of the multiple computing devices in the first direction.

30. The heat dissipation structure according to claim 27, characterized in that: The liquid inlet is formed on a side of the liquid inlet distribution pipeline adjacent to the first pipeline group in the second direction, and adjacent to the top end of the liquid inlet distribution pipeline; the liquid outlet is formed on a side of the liquid return distribution pipeline adjacent to the first pipeline group in the second direction, and adjacent to the top end of the liquid return distribution pipeline.

31. The heat dissipation structure according to claim 27, characterized in that: The top end of the liquid inlet distribution pipeline and the top end of the liquid return distribution pipeline are both provided with exhaust valves.

32. The heat dissipation structure according to claim 31, characterized in that: The exhaust port of the exhaust valve is connected to a flexible connecting pipe, and the flexible connecting pipe extends to the bottom of the cabinet to discharge the gas in the liquid inlet distribution pipeline and the liquid return distribution pipeline respectively.

33. The heat dissipation structure according to claim 28, characterized in that: The cabinet includes a cabinet body and a shelf disposed inside the cabinet body, the shelf defining a first accommodating space, the shelf and the cabinet body defining a second accommodating space, and the second accommodating space and the first accommodating space being distributed side by side in the first direction; The rack further includes a plurality of power distribution units, which are vertically arranged in the second accommodating space.

34. The heat dissipation structure according to claim 1, characterized in that: There are multiple racks, and the multiple racks are arranged side by side along the first direction; The rack also includes a top connecting plate, which is arranged on the top of the cabinet and extends above the adjacent cabinet; the top connecting plate and the top of the adjacent cabinet respectively have top connecting holes that are vertically opposite to each other, and the cabinet and the adjacent cabinet are fixed by fasteners passing through the top connecting holes.

35. The heat dissipation structure according to claim 1, characterized in that: The rack further comprises a lifting ring which is detachably arranged on the top of the cabinet and is used to connect a lifting rope to carry the cabinet or the heat dissipation structure.

36. The heat dissipation structure according to claim 1, characterized in that: The rack further includes a bottom connecting plate, which extends downwardly and obliquely on the outside of the second direction at the bottom of the cabinet, and the upper end of the bottom connecting plate is fixed to the cabinet, and the lower end of the bottom connecting plate is fixed to the support platform.

37. A container, characterized in that: include: The heat dissipation structure according to any one of claims 1 to 36; The heat dissipation structure is arranged inside the box.

38. The container according to claim 37, characterized in that The box body includes a frame, and the frame is protruded upward on one side of the bottom of the box body in the second direction; The support platform is spaced apart from the frame at a side adjacent to the frame in the second direction to form a groove for draining liquid.

39. The container according to claim 38, characterized in that The frame is formed with a plurality of drainage holes, and the plurality of drainage holes are distributed at intervals in the first direction.

40. A data center, characterized in that: include: The heat dissipation structure according to any one of claims 1 to 36 or the container according to any one of claims 37 to 39; A plurality of computing devices are integrated and installed in the cabinet of the heat dissipation structure.

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