High-heat-dissipation sealed power amplifier shell

Abstract

The utility model relates to a high-heat-dissipation sealed power amplifier shell, which comprises a heat-dissipation sealed panel and a power amplifier panel, the heat dissipation sealing shell comprises a shell body, a power amplifier installation groove and a heat dissipation layer. And the shell main body is provided with a sealing strip. The power amplifier mounting groove comprises a heat dissipation panel, an outer partition plate, an interface panel and a baffle plate. The baffle is provided with a sealing check ring. A heat dissipation grid is arranged on the heat dissipation panel, and the heat dissipation layer comprises a heat dissipation layer main body and heat dissipation fins. And the sealing strip is arranged to perform preliminary sealing, so that liquid is prevented from entering the sound box. According to the technical scheme, the baffle with the sealing check ring is arranged, the free end of the sealing check ring is embedded into the power amplifier panel, the power amplifier panel abuts against the heat dissipation layer, the power amplifier panel is clamped in the heat dissipation layer, and the sealing protection effect is achieved. The heat of the chip and the circuit board is absorbed through the heat dissipation layer, so that the heat is dissipated through the heat dissipation grids, and the heat dissipation effect is good.

Description

TECHNICAL FIELD

[0001] The utility model relates to a sound box panel technical field especially a kind of high heat dissipation sealed power amplifier shell. BACKGROUND

[0002] Sound box power amplifier refers to a kind of equipment in sound system, its function is to amplify the power of audio signal, to drive sound box to emit sound.The utility model discloses a kind of sound box power amplifier panel, including panel body, the inner surface of the panel body is equipped with circuit board, the outer surface of the panel body is equipped with the hoisting structure with heat conduction effect at the position corresponding with the circuit board.The power amplifier panel of the above technical scheme has good heat dissipation effect, and the hoisting structure is integrated with power amplifier heat dissipation system, reduces volume, increases firmness;But sound power amplifier is used for a long time, single heat conduction cannot timely dissipate internal heat, temperature accumulation causes damage to internal circuit element, shortens service life, cannot timely and quickly dissipate internal heat by ventilation.The utility model aims at providing the sound box power amplifier panel of convenient heat dissipation to solve the problem that the sound box power amplifier panel of the authorization publication number CN208112923U in the above background technique is used for a long time, single heat conduction cannot timely dissipate internal heat, temperature accumulation causes damage to internal circuit element, shortens service life, cannot timely and quickly dissipate internal heat by ventilation. CONTENT OF UTILITY MODEL

[0003] Therefore, the utility model provides a kind of high heat dissipation sealed power amplifier shell to solve above-mentioned technical problem.

[0004] A kind of high heat dissipation sealed power amplifier shell, it includes a heat dissipation sealed panel, and a power amplifier panel being arranged in the heat dissipation sealed panel.The heat dissipation sealed shell includes a shell main body, a power amplifier installation slot being recessed on the shell main body, and a heat dissipation layer being arranged on the end face of the power amplifier installation slot.The side of the shell main body towards the end face of the power amplifier panel is surrounded with a layer of sealing strip.The power amplifier installation slot includes a heat dissipation panel, an outer baffle being arranged on the side of the heat dissipation panel, an interface panel being arranged on the inner side of the outer baffle, and a baffle being arranged on the end of the outer baffle away from the heat dissipation panel.The end face of the baffle towards the heat dissipation panel is provided with a circle of sealing baffle ring being protruded, the free end of the sealing baffle ring is embedded into the power amplifier panel, and the power amplifier panel is clamped in.The heat dissipation panel length is provided with a plurality of heat dissipation grids on both ends, and the heat dissipation layer includes a heat dissipation layer main body and a plurality of heat dissipation fins being arranged on the side of the heat dissipation layer main body, and the end face of the heat dissipation layer main body is abutted to the power amplifier panel.

[0005] Further, a plurality of screw holes are arranged on the side of the shell body.

[0006] Further, a plurality of connecting holes are arranged on the interface panel.

[0007] Further, the interface panel is recessed in the heat dissipation panel.

[0008] Further, the heat dissipation grid is composed of a plurality of long strip-shaped grooves.

[0009] Further, a plurality of heat dissipation grooves are arranged on both ends of the heat dissipation panel.

[0010] Further, the heat dissipation fin is designed to be bent towards the baffle.

[0011] Further, the power amplifier panel comprises a circuit board and a plurality of chips arranged on the circuit board.

[0012] Compared with the prior art, the high-heat-dissipation sealed power amplifier shell provided by the utility model is provided with a sealing strip around the side of the shell body towards the end face of the power amplifier panel for preliminary sealing to prevent liquid from entering the inside of the sound box. A baffle with a sealing baffle ring is arranged, the free end of the sealing baffle ring is embedded into the power amplifier panel, the power amplifier panel is abutted against the heat dissipation layer, and the power amplifier panel is clamped inside, thereby achieving the sealing protection effect and preventing liquid from entering the inside of the sound box. The heat dissipation layer absorbs the heat of the chips and the circuit board, and then the heat is dissipated through the heat dissipation grid, so that the heat dissipation effect is good. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 The structure schematic view of the high-heat-dissipation sealed power amplifier shell is provided.

[0014] Figure 2 The structure schematic view of the high-heat-dissipation sealed power amplifier shell is provided. Figure 1

[0015] Figure 3 The structure schematic view of the high-heat-dissipation sealed power amplifier shell is provided. Figure 1 The sectional structure schematic view of the high-heat-dissipation sealed power amplifier shell is provided. DETAILED DESCRIPTION

[0016] The specific embodiments of the utility model are further described in detail below. It should be understood that the description of the embodiments of the utility model herein is not used to limit the protection scope of the utility model.

[0017] As Figures 1 to 3 ​As shown, it is a kind of high heat dissipation sealed power amplifier shell structure schematic diagram provided by the utility model. The high heat dissipation sealed power amplifier shell includes a heat dissipation sealed shell 10, and a power amplifier panel 20 arranged in the heat dissipation sealed panel 10. It is conceivable that the high heat dissipation sealed power amplifier shell also includes other functional structures, such as connecting terminals and the like, which are known to those skilled in the art, and will not be described here.

[0018] The heat dissipation sealed shell 10 includes a shell body 11, a power amplifier mounting groove 12 recessed on the shell body 11, and a heat dissipation layer 13 arranged on one end face of the power amplifier mounting groove 12.

[0019] The shell body 11 is a long rectangular frame. A plurality of screw holes 111 are arranged on the shell body 11 along the side edge. The shell body 11 is screwed and fixed on the sound box side plate (not shown) through the screw holes 111. The sound box side plate is the existing technology on the market.

[0020] The shell body 11 is provided with a sealing strip 112 around the side edge of the end face of the power amplifier panel 20, which is preliminarily sealed to prevent liquid from entering the sound box.

[0021] The power amplifier mounting groove 12 includes a heat dissipation panel 121, an outer partition plate 122 arranged on one side of the heat dissipation panel 121, an interface panel 123 arranged on the inner side of the outer partition plate 122, and a baffle 124 arranged on the end of the outer partition plate 122 away from the heat dissipation panel 121.

[0022] The heat dissipation panel 121 is provided with a plurality of heat dissipation grids 125 on both ends along the length direction. The heat dissipation grid 125 is composed of a plurality of long strip grooves, which facilitates the circulation of air from the plurality of long strip grooves, improves the flow efficiency of air, and further improves the heat dissipation effect. The heat dissipation panel 121 is provided with a plurality of heat dissipation slots 126 on both ends along the width direction, which are also used for heat dissipation.

[0023] The outer partition plate 122 cooperates with the baffle 124 to clamp the power amplifier panel 20 inside, preventing liquid from entering the sound box from the heat dissipation grid 125 and the heat dissipation slot 126. The outer partition plate 122 and the baffle 124 are connected by screws. As for the baffle 124 itself, since it needs to be embedded in the power amplifier shell such as sound box during use, it does not need to consider the structure design of sealing and waterproof.

[0024] The interface panel 123 is recessed in the heat dissipation panel 121, and thus leaves space for connecting audio plug and the like, increasing space utilization. Therefore, the interface panel 123 is provided with a plurality of connecting holes 127, so that the audio plug and the like can be connected to the power amplifier panel 20 through the connecting holes 127. The interface panel 123 is connected to the power amplifier panel 20, which will be described below.

[0025] The baffle 124 is provided with a sealing baffle ring 128 on the end face of the heat dissipation panel 121, and the free end of the sealing baffle ring 128 abuts against the power amplifier panel 20, so as to abut the power amplifier panel 20 against the heat dissipation layer 13, and clamp the power amplifier panel 20 between the baffle 124 and the interface panel 123, so as to quickly conduct heat on the power amplifier panel 20 to the heat dissipation layer 13.

[0026] The heat dissipation layer 13 is made of copper, iron or other high thermal conductivity metal, and is attached to the power amplifier panel 20, so that the heat generated by the power amplifier panel 20 can be transferred to the heat dissipation layer 13, and then dissipated to the air by the heat dissipation layer 13. Since the heat dissipation layer 13 is made of a material that can easily absorb heat, it can quickly absorb the heat generated by the power amplifier panel 20, avoiding the accumulation of heat in the power amplifier panel 20.

[0027] The heat dissipation layer 13 includes a heat dissipation layer main body 131 and a plurality of heat dissipation fins 132 arranged at the side of the heat dissipation layer main body 131. One end face of the heat dissipation layer main body 131 abuts against the power amplifier panel 20, helping the power amplifier panel 20 to dissipate heat. The heat dissipation fins 132 are designed to be bent towards the baffle 124, so that the size of the heat dissipation fins 132 is as long as possible, increasing the heat dissipation area, so as to improve the heat dissipation effect of the heat dissipation layer 13.

[0028] The power amplifier panel 20 includes a circuit board 21 and a plurality of electronic components 22 arranged on the end face of the circuit board 21 away from the heat dissipation layer 13. It is prior art, and will not be described here.

[0029] The circuit board 21 and the electronic components 22 are all existing products on the market. When powered on, part of the electrical energy will be converted into heat energy, and then the circuit board 21 and the electronic components 22 will generate heat. In order to avoid overheating of the circuit board 21 and the electronic components 22 affecting performance and service life, and also to ensure safety, the heat dissipation panel 121 and the heat dissipation layer 13 are designed to help the circuit board 21 and the electronic components 22 dissipate heat.

[0030] In use, the circuit board 21 and the chip 22 work after being powered on, and the heat generated by the circuit board 21 and the chip 22 is transferred to the heat dissipation layer 13. The heat dissipation layer 13 dissipates heat between the outer partition plate 122 and the baffle 124, and because one side of the heat dissipation layer body 131 is provided with a plurality of heat dissipation fins 132, the temperature of the side of the heat dissipation layer body 131 provided with the heat dissipation fins 132 is higher, so that the air between the outer partition plate 122 and the baffle 124 is heated and expanded, and is discharged between the heat dissipation grids 125 and the heat dissipation notches 126 close to the side of the heat dissipation fins 132. Then external cold air enters the heat dissipation grids 125 and the heat dissipation notches 126 from the other side, so as to achieve the purpose of air self-circulation, thereby reducing the temperature of the circuit board 21 and the chip 22.

[0031] Compared with the prior art, the high-heat-dissipation sealed power amplifier shell provided by the utility model prevents liquid from entering the inside of the sound box through the preliminary sealing of the sealing strip 112 arranged around the side edge of the shell body 11 towards the end face of the power amplifier panel 20. The baffle 124 provided with the sealing baffle ring 128 prevents liquid from entering the inside of the sound box by embedding the free end of the sealing baffle ring 128 into the power amplifier panel 20, abutting the power amplifier panel 20 against the heat dissipation layer 13, and clamping the power amplifier panel 20 inside, thereby achieving the sealing protection effect. The heat dissipation layer 13 absorbs the heat of the chip 22 and the circuit board 21, and then dissipates the heat through the heat dissipation grids 125, so that the heat dissipation effect is good.

[0032] The above is only a preferred embodiment of the utility model, and is not used for limiting the protection scope of the utility model, and any modification, equivalent replacement or improvement within the spirit of the utility model is covered in the claim scope of the utility model.

Claims

1. A high heat dissipation sealed power amplifier housing, characterized by: The high heat dissipation sealed power amplifier housing includes a heat dissipation sealing panel and a power amplifier panel arranged in the heat dissipation sealing panel. The heat dissipation sealed housing includes a housing body, an amplifier mounting slot recessed on the housing body, and a heat dissipation layer arranged on one end face of the power amplifier mounting slot. A sealing strip is arranged around the side of the housing body facing the end face of the power amplifier panel. The power amplifier mounting slot includes a heat dissipation panel, an outer partition arranged on one side of the heat dissipation panel, an interface panel arranged on the inner side of the outer partition, and a baffle arranged on the end of the outer partition facing away from the heat dissipation panel. A circle of sealing retaining ring is protruded on the end face of the baffle facing the heat dissipation panel. The free end of the sealing retaining ring abuts against the power amplifier panel and clamps the power amplifier panel therein. A plurality of heat dissipation grids are arranged at intervals on both ends of the heat dissipation panel along the length direction. The heat dissipation layer includes a heat dissipation layer body and a plurality of heat dissipation fins arranged at intervals on the side of the heat dissipation layer body. One end face of the heat dissipation layer body abuts against the power amplifier panel.

2. The high heat dissipation sealed power amplifier housing according to claim 1, characterized in that: A plurality of screw holes are arranged at intervals along the side of the shell body.

3. The high heat dissipation sealed power amplifier housing according to claim 1, characterized in that: The interface panel is provided with a plurality of connection holes.

4. The high heat dissipation sealed power amplifier housing according to claim 1, characterized in that: The interface panel is recessed in the heat dissipation panel.

5. The high heat dissipation sealed power amplifier housing according to claim 1, characterized in that: The heat dissipation grid is composed of a plurality of long strip grooves.

6. The high heat dissipation sealed power amplifier housing according to claim 1, characterized in that: A plurality of heat dissipation slots are arranged at intervals on both ends of the heat dissipation panel along the width direction.

7. The high heat dissipation sealed power amplifier housing according to claim 1, characterized in that: The heat dissipation fins are bent toward the baffle.

8. The high heat dissipation sealed power amplifier housing according to claim 1, characterized in that: The power amplifier panel includes a circuit board and a plurality of chips arranged on the circuit board.

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