Two-phase thermosyphon radiator

Abstract

The utility model relates to the technical field of radiators, in particular to a two-phase thermosyphon radiator, which comprises a substrate, a heat conduction component directly contacted with a heating element is mounted on the side wall of the bottom of the substrate, and two groups of radiating fins distributed up and down are mounted on the side wall of the substrate far away from the heat conduction component. At least two circulating pipes are connected in the two groups of radiating fins in a penetrating manner; two ends of the two circulating pipes are welded with the side wall of the substrate and are communicated with an inner cavity formed in the substrate; according to the two-phase thermosyphon radiator, the heat conduction assembly is directly installed on the base plate, the whole radiator is of an integrated structure, the size is small, the requirement for the installation space is low, and after the heating element conducts heat to the base plate through the heat conduction assembly, a working medium in the base plate can be heated and gasified; one part of heat can be directly dissipated in the air under the action of the substrate and the heat dissipation fins, and the other part of heat can enable the working medium to be condensed and liquefied again under the action of the circulating pipe to achieve the heat dissipation effect, so that the whole heat dissipation device has stronger heat dissipation capability.

Description

TECHNICAL FIELD

[0001] The utility model relates to a radiator technical field, concretely is two phase heat siphon radiator. BACKGROUND

[0002] The heat siphon radiator is a kind of high-efficiency heat management equipment using the evaporation and condensation cycle of liquid to conduct and disperse heat. It conducts heat from high-temperature area to low-temperature area through capillary action and gravity, thereby realizing effective heat dissipation. However, the existing heat siphon radiator usually needs a certain length and diameter to ensure effective evaporation and condensation process, thereby resulting in large overall volume and high requirement for installation space, and when contacting with the heating element, there is the problem of poor heat exchange effect due to limited contact area with the working medium. SUMMARY

[0003] In view of the deficiencies of the prior art, the utility model provides a two-phase heat siphon radiator, which solves the technical problems of high requirement for installation space and poor heat exchange effect of the existing heat siphon radiator.

[0004] To solve the above technical problems, the utility model provides the following technical scheme: a two-phase heat siphon radiator, comprising a substrate, a heat conduction assembly directly contacting with a heating element is installed on the side wall of the bottom of the substrate, two groups of heat dissipation fins distributed above and below are installed on the side wall of the substrate away from the heat conduction assembly, at least two circulating pipes are connected through in the two groups of heat dissipation fins, and the two ends of the two circulating pipes are welded with the side wall of the substrate and are communicated with the inner cavity opened in the substrate.

[0005] The heat conduction assembly comprises a heat conduction plate, the heat conduction plate is installed in the mounting hole opened in the side wall of the substrate through a plurality of screws, and a sealing ring is arranged between the heat conduction plate and the substrate, and the sealing ring is arranged in the sealing groove opened outside the mounting hole.

[0006] Preferably, the heat conduction plate comprises a plate body, a skirt is integrally formed on the outer side of the plate body, and a honeycomb hole is arranged on the side wall of the plate body close to the inner side of the substrate.

[0007] Preferably, the circulating pipe comprises an upper cooling section and a lower cooling section, the upper cooling section and the lower cooling section are respectively embedded on the two groups of heat dissipation fins and are inclined, one end of the upper cooling section and the lower cooling section is communicated through a connecting section, the other end of the upper cooling section is provided with a gas inlet, and the other end of the lower cooling section is provided with a liquid outlet.

[0008] Preferably, a liquid injection port is arranged on the side wall of the substrate, and the liquid injection port is arranged on one side of the heat dissipation fin.

[0009] Preferably, a plurality of flow guide plates are fixedly arranged in the inner cavity at equal intervals, and the top of the flow guide plate is bent.

[0010] Preferably, a scale-marked transparent plate is fixed on the sidewall of the substrate.

[0011] By means of the technical scheme, the two-phase thermosyphon radiator has at least the following beneficial effects:

[0012] 1. The two-phase thermosyphon radiator has the heat-conducting assembly directly installed on the substrate, is of an integrated structure, has a small volume, has a low requirement on the installation space, and can make the working medium in the substrate vaporize after the heat generated by the heating element is conducted to the substrate through the heat-conducting assembly, can make the working medium condense and liquefy again to achieve the heat dissipation effect through the action of the substrate and the heat dissipation fins, and has a stronger heat dissipation capacity.

[0013] 2. The two-phase thermosyphon radiator is provided with the heat-conducting plate, the honeycomb holes are arranged on the sidewall of the substrate close to the heat-conducting plate, and the contact area of the heat-conducting plate and the working medium can be increased under the action of the honeycomb holes, so that the heat exchange efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] The accompanying drawings, which are included to provide a further understanding of the present application and constitute a part of this application, illustrate embodiments of the present application and serve to explain the principles of the present application:

[0015] Figure 1 It is a three-dimensional structure schematic view of the whole present application;

[0016] Figure 2 It is a structure schematic view of the heat-conducting assembly of the present application after being disassembled;

[0017] Figure 3 It is a structure schematic view of the heat-conducting plate of the present application;

[0018] Figure 4 It is a structure schematic view of the substrate of the present application;

[0019] Figure 5 It is a structure schematic view of the circulating pipe of the present application;

[0020] REFERENCE SIGNS:

[0021] 1. substrate; 101, screw hole; 102, inner cavity; 103, mounting hole; 2, heat-conducting assembly; 201, heat-conducting plate; 2011, plate body; 2012, skirt; 2013, honeycomb hole; 202, sealing ring; 203, screw; 3, heat dissipation fin; 4, circulating pipe; 401, gas inlet; 402, upper cooling section; 403, connecting section; 404, lower cooling section; 405, liquid outlet; 5, liquid injection port; 6, flow guide plate; 7, transparent plate. DETAILED DESCRIPTION

[0022] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of the present application.

[0023] The thermosyphon radiator can effectively transfer heat from a high-temperature region to a low-temperature region quickly, and the thermal conductivity is significantly higher than that of ordinary heat-conducting materials. Compared with a traditional radiator, the overall structure is more compact, and is suitable for applications with limited space. Meanwhile, the heat flow can be automatically adjusted according to the power change of the heat source, and the load change can be better adapted.

[0024] Based on the technical defects of high installation space requirement and poor heat exchange effect in the prior art, please refer to Figures 1-5 The two-phase thermosyphon radiator directly installs the heat-conducting assembly 2 on the base plate 1, and the overall structure is integrated, the volume is small, the requirement for the installation space is low, and the contact area of the heat-conducting plate 201 with the working medium can be increased under the action of the honeycomb hole 2013 arranged on the side wall inside the base plate 1, so that the heat exchange efficiency is improved. The radiator comprises a base plate 1, a heat-conducting assembly 2 arranged on the side wall of the bottom of the base plate 1 and directly contacting a heating element, two groups of heat dissipation fins 3 arranged on the side wall of the base plate 1 away from the heat-conducting assembly 2 and distributed above and below, at least two circulating pipes 4 penetratingly connected in the two groups of heat dissipation fins 3, and two ends of the two circulating pipes 4 welded with the side wall of the base plate 1 and communicated with an inner cavity 102 arranged in the base plate 1. In use, the heat-conducting assembly 2 directly contacts the heating element, and heat can be conducted to the working medium in the inner cavity 102 through the heat-conducting assembly 2. The working medium is gasified after being heated, becomes gaseous, flows upward along the inner cavity 102, and then enters the circulating pipes 4. Under the action of the heat dissipation fins 3, the working medium is cooled and liquefied, and the liquefied working medium flows back to the inner cavity 102 through the bottom of the circulating pipes 4.

[0025] For the convenience of installing the heat-conducting assembly 2, please refer to Figure 2 The heat-conducting assembly 2 comprises a heat-conducting plate 201, the heat-conducting plate 201 is installed in the mounting hole 103 arranged on the side wall of the base plate 1 through a plurality of screws 203, and a sealing ring 202 is arranged between the heat-conducting plate 201 and the base plate 1. The sealing ring 202 is arranged in a sealing groove arranged outside the mounting hole 103. The heat-conducting plate 201 is installed on the base plate 1 through the screws 203, and can be integrated with the base plate 1, so as to reduce the overall volume. Meanwhile, under the action of the sealing ring 202, the sealing property of the heat-conducting plate 201 and the base plate 1 can be improved.

[0026] For the convenience of installing the heat-conducting assembly 2, please refer to Figure 3The heat-conducting plate 201 comprises a plate body 2011, and a skirt 2012 is integrally formed on the outer side of the plate body 2011. The plate body 2011 is provided with a honeycomb hole 2013 on the side wall close to the inner side of the base plate 1. The contact area of the heat-conducting plate 201 with the working medium can be increased under the action of the honeycomb hole 2013, so that the heat exchange efficiency is improved.

[0027] To realize the rapid return flow of the working medium after being cooled and liquefied, please refer to Figure 5 The circulating pipe 4 comprises an upper cooling section 402 and a lower cooling section 404, and the upper cooling section 402 and the lower cooling section 404 are embedded on the two groups of heat dissipation fins 3 and are inclined. One end of the upper cooling section 402 and the lower cooling section 404 is communicated through a connecting section 403. The other end of the upper cooling section 402 is provided with an air inlet 401, and the other end of the lower cooling section 404 is provided with a liquid outlet 405. The working medium is vaporized from the air inlet 401 into the circulating pipe 4 and is dissipated under the action of the heat dissipation fins 3. At this time, the working medium is condensed and liquefied. Since the upper cooling section 402 and the lower cooling section 404 are inclined, the working medium after being liquefied can flow back into the inner cavity 102 rapidly, and the length of the whole pipeline is increased, so that the condensation time is improved.

[0028] To facilitate the addition of the working medium, the liquid injection port 5 is arranged on the side wall of the base plate 1, and the liquid injection port 5 is located on one side of the heat dissipation fins 3.

[0029] To enable the gaseous working medium to flow into the circulating pipe 4 rapidly, a plurality of equidistantly arranged flow guide plates 6 are fixedly arranged in the inner cavity 102, and the top of the flow guide plate 6 is bent. When the gaseous working medium moves upward, it can flow to the air inlet 401 of the circulating pipe 4 under the action of the flow guide plate 6, so that the flow of the gaseous working medium is guided.

[0030] To facilitate the observation of the remaining amount of the working medium, the transparent plate 7 with scales is fixedly arranged on the side wall of the base plate 1. The remaining amount of the working medium in the inner cavity 102 can be directly observed through the transparent plate 7, so that the problem that the evaporation of the working medium is reduced and the heat dissipation efficiency is affected is avoided.

[0031] As known from the above embodiment, since the heat-conducting assembly 2 directly contacts the heat-generating element, the heat can be conducted to the working medium in the inner cavity 102 through the heat-conducting assembly 2. The working medium is vaporized after being heated and becomes gaseous and flows upward along the inner cavity 102, and then enters the circulating pipe 4. The working medium is cooled and liquefied under the action of the heat dissipation fins 3, and the liquefied working medium flows back to the inner cavity 102 through the bottom of the circulating pipe 4.

[0032] It should be noted that the terms "comprising", "including", or any other variant thereof are intended to cover non-exclusive inclusions, so that processes, methods, articles or devices including a series of elements not only include those elements, but also include other elements not explicitly listed, or further include elements inherent to such processes, methods, articles or devices.

[0033] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.

Claims

1. A two-phase thermosyphon radiator, comprising a substrate (1), characterized in that: A heat-conducting assembly (2) in direct contact with the heating element is mounted on the side wall of the bottom of the substrate (1); two groups of heat-dissipating fins (3) distributed vertically are mounted on the side wall of the substrate (1) away from the heat-conducting assembly (2); at least two circulation pipes (4) are connected through the two groups of heat-dissipating fins (3); both ends of the two circulation pipes (4) are welded to the side wall of the substrate (1) and communicate with an inner cavity (102) opened inside the substrate (1); The heat-conducting assembly (2) comprises a heat-conducting plate (201), which is mounted in a mounting hole (103) provided on a side wall of the base plate (1) via a plurality of screws (203), and a sealing ring (202) is provided between the heat-conducting plate (201) and the base plate (1), the sealing ring (202) being located in a sealing groove provided on the outside of the mounting hole (103).

2. The two-phase thermosyphon radiator according to claim 1, characterized in that: The heat conducting plate (201) comprises a plate body (2011), a skirt (2012) is integrally formed on the outer side of the plate body (2011), and honeycomb holes (2013) are provided on the side wall of the plate body (2011) close to the interior of the base plate (1).

3. The two-phase thermosyphon radiator according to claim 1, characterized in that: The circulation pipe (4) comprises an upper cooling section (402) and a lower cooling section (404); the upper cooling section (402) and the lower cooling section (404) are respectively embedded in two groups of heat dissipation fins (3) and are inclined; one end of the upper cooling section (402) and the lower cooling section (404) are both connected through a connecting section (403); the other end of the upper cooling section (402) is provided with an air inlet (401), and the other end of the lower cooling section (404) is provided with a liquid outlet (405).

4. The two-phase thermosyphon radiator according to claim 1, characterized in that: A liquid injection port (5) is provided on the side wall of the substrate (1), and the liquid injection port (5) is located on one side of the heat dissipation fins (3).

5. The two-phase thermosyphon radiator according to claim 1, characterized in that: A plurality of equally spaced guide plates (6) are fixedly arranged in the inner cavity (102), and the tops of the guide plates (6) are bent.

6. The two-phase thermosyphon radiator according to claim 1, characterized in that: A transparent plate (7) with scales is fixedly provided on the side wall of the substrate (1).

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