Liquid cooling switch structure

Abstract

The utility model provides a liquid cooling switch structure, and relates to the technical field of heat dissipation. The liquid cooling switch structure comprises an upper cover, a casing base and a cold plate assembly, a mounting cavity is formed in the machine shell base, and the upper cover covers the machine shell base and seals the mounting cavity; the cold plate assembly comprises a pipeline part, a power source cold plate part and a chip cold plate part which are all arranged in the installation cavity, flow channels in the power source cold plate part and the chip cold plate part communicate with the pipeline part, the chip cold plate part is used for being connected with a first part to be cooled, and the power source cold plate part is used for being connected with a second part to be cooled. Heat of the first to-be-cooled part is transmitted to the chip cold plate, heat generated by the second to-be-cooled part is transmitted to the power supply cold plate, and the heat is taken away by the pipeline part, so that independent and more accurate heat dissipation of the first to-be-cooled part and the second to-be-cooled part is realized by distributing the power supply cold plate and the chip cold plate, and the heat dissipation effect is improved; and in the heat exchange process, compared with fan heat dissipation, the noise is lower.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, in particular to a liquid cooling switch structure. BACKGROUND

[0002] The switch is a device for completing information exchange function in the communication system, which is in the form of box structure, and has different forms such as 1U / 2U / 4U according to the function configuration. The switch will generate heat in the use process, and with the continuous improvement of switching speed and configuration, the power consumption is getting larger and larger, and the heat generated is getting more and more, so it is necessary to dissipate heat.

[0003] In the prior art, air cooling is used for heat dissipation, that is, a fan and an air duct structure are used, the air duct structure is arranged in the switch, and the fan generates air to dissipate heat for the switch through the air duct structure.

[0004] However, the air cooling heat dissipation effect is weak, and noise is easy to be generated. CONTENT OF THE INVENTION

[0005] The present application provides a liquid cooling switch structure to solve the problem of weak heat dissipation effect and easy to generate noise of air cooling heat dissipation.

[0006] The present application provides a liquid cooling switch structure, which comprises an upper cover, a cabinet base and a cold plate assembly; the cabinet base has an installation cavity, the upper cover is arranged on the cabinet base and seals the installation cavity; the cold plate assembly comprises a pipeline piece, a power supply cold plate piece and a chip cold plate piece, which are all arranged in the installation cavity; the flow passages in the power supply cold plate piece and the chip cold plate piece are communicated with the pipeline piece; the chip cold plate piece is used for connecting with a first heat dissipation piece; and the power supply cold plate piece is used for connecting with a second heat dissipation piece.

[0007] In some possible implementation manners, the liquid cooling switch structure provided by the embodiment of the present application comprises a first cold plate and two second cold plates, the second cold plates are arranged on one side of the cabinet base, the first cold plate is connected with the pipeline piece, the second cold plates are connected with the pipeline piece, the two second cold plates are used for clamping the interface part of the first heat dissipation piece, and the first cold plate is used for connecting with the chip of the first heat dissipation piece.

[0008] In some possible implementation manners, the liquid cooling switch structure provided by the embodiment of the present application comprises a first cold plate and two second cold plates, the second cold plates are arranged on one side of the cabinet base, the first cold plate is connected with the pipeline piece, the second cold plates are connected with the pipeline piece, the two second cold plates are used for clamping the interface part of the first heat dissipation piece, and the first cold plate is used for connecting with the chip of the first heat dissipation piece.

[0009] In some possible implementation manners, the liquid cooling switch structure provided by the embodiment of the present application further comprises a liquid cooling connector part, and the power supply cold plate piece is inserted with the second heat dissipation piece through the liquid cooling connector part.

[0010] In some possible implementation manners, the liquid cooling exchanger structure provided by the embodiment of the present application has a liquid inlet portion and a liquid outlet portion on the bottom base of the casing, and the two ends of the pipe member are in communication with the liquid inlet portion and the liquid outlet portion respectively, and at least part of the pipe member is arranged along the inner circumferential side of the bottom base of the casing.

[0011] In some possible implementation manners, the liquid cooling exchanger structure provided by the embodiment of the present application further comprises a liquid leakage tray, the liquid leakage tray is arranged in the bottom base of the casing, the pipe member, the power supply cold plate member and the chip cold plate member are arranged in the liquid leakage tray, and the liquid leakage tray is used to collect the liquid leaked by the pipe member, the power supply cold plate member or the chip cold plate member accidentally.

[0012] In some possible implementation manners, the liquid cooling exchanger structure provided by the embodiment of the present application has a liquid leakage tray, the liquid leakage tray is arranged in the bottom base of the casing, the pipe member, the power supply cold plate member and the chip cold plate member are arranged in the liquid leakage tray, and the liquid leakage tray is used to collect the liquid leaked by the pipe member, the power supply cold plate member or the chip cold plate member accidentally.

[0013] In some possible implementation manners, the liquid cooling exchanger structure provided by the embodiment of the present application has a liquid leakage tray, the liquid leakage tray is arranged in the bottom base of the casing, the pipe member, the power supply cold plate member and the chip cold plate member are arranged in the liquid leakage tray, and the liquid leakage tray is used to collect the liquid leaked by the pipe member, the power supply cold plate member or the chip cold plate member accidentally.

[0014] In some possible implementation manners, the liquid cooling exchanger structure provided by the embodiment of the present application has a liquid leakage tray, the liquid leakage tray is arranged in the bottom base of the casing, the pipe member, the power supply cold plate member and the chip cold plate member are arranged in the liquid leakage tray, and the liquid leakage tray is used to collect the liquid leaked by the pipe member, the power supply cold plate member or the chip cold plate member accidentally.

[0015] In some possible implementation manners, the liquid cooling exchanger structure provided by the embodiment of the present application has a liquid leakage tray, the liquid leakage tray is arranged in the bottom base of the casing, the pipe member, the power supply cold plate member and the chip cold plate member are arranged in the liquid leakage tray, and the liquid leakage tray is used to collect the liquid leaked by the pipe member, the power supply cold plate member or the chip cold plate member accidentally.

[0016] The liquid cooling exchanger structure provided in the application is characterized by comprising an upper cover, a shell base and a cold plate assembly; the shell base is internally provided with an installation cavity, and the upper cover is arranged on the shell base and seals the installation cavity; the cold plate assembly comprises a pipeline piece, a power supply cold plate piece and a chip cold plate piece, which are all arranged in the installation cavity; the flow channels in the power supply cold plate piece and the chip cold plate piece are both in communication with the pipeline piece; the chip cold plate piece is used for being connected with a first heat dissipation piece; and the power supply cold plate piece is used for being connected with a second heat dissipation piece. The heat generated by the first heat dissipation piece is separately transferred to the chip cold plate piece, and the heat generated by the second heat dissipation piece is separately transferred to the power supply cold plate piece; the power supply cold plate piece and the chip cold plate piece are both in corresponding communication with the pipeline piece; the pipeline piece, the power supply cold plate piece and the chip cold plate piece complete heat exchange, and the heat of the power supply cold plate piece and the chip cold plate piece is taken away, so that the first heat dissipation piece and the second heat dissipation piece are separately and more accurately cooled by distributing the power supply cold plate piece and the chip cold plate piece, the cooling effect is improved, and the noise is smaller in the process of heat exchange compared with fan cooling. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and serve to explain the principles of the application.

[0018] Figure 1 A structural schematic view of the liquid cooling exchanger structure provided in the embodiment of the application is shown in the figure.

[0019] Figure 2 A structural schematic view of the liquid cooling exchanger structure provided in the embodiment of the application is shown in the figure. Figure 1 An exploded view of the liquid cooling exchanger structure in the embodiment of the application is shown in the figure.

[0020] Figure 3 A structural schematic view of the cold plate assembly in the shell base of the liquid cooling exchanger structure provided in the embodiment of the application is shown in the figure.

[0021] Explanation of reference signs:

[0022] 10-first heat dissipation piece; 11-chip; 12-interface part; 20-second heat dissipation piece; 21-power supply compartment structure;

[0023] 100-upper cover;

[0024] 200-shell base;

[0025] 300-cold plate assembly;

[0026] 310-chip cold plate piece; 311-first cold plate; 312-second cold plate;

[0027] 320-power supply cold plate piece;

[0028] 330-pipeline piece; 331-first pipeline; 332-second pipeline;

[0029] 340 - liquid cooling connector part;

[0030] 400 - liquid leakage tray;

[0031] 410 - liquid discharge part;

[0032] 500 - liquid inlet part;

[0033] 600 - liquid outlet part;

[0034] 700 - connector.

[0035] The specific embodiments of the application have been shown by way of example in the above figures, and will be described in more detail hereafter. These figures and this written description are not intended to limit the scope of the inventive concept in any way, but rather to illustrate the inventive concept to one of ordinary skill in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0036] Exemplary embodiments are described herein in detail with reference to the accompanying drawings. The use of the same reference numerals in different figures indicates similar or identical elements. The exemplary embodiments described herein represent the best attempts at non-limiting examples of the application, with a variety of modifications being applicable.

[0037] In general, terminology can be understood at least in part from usage in context. For example, the term "one or more" as used herein, depending at least in part upon context, can be used to describe any feature, structure, or characteristic in a singular sense or can be used to describe combinations of features, structures or characteristics in a plural sense. Similarly, terms, such as "a" and "the", as used herein, can be understood to convey a singular usage or to convey a plural usage, depending at least in part upon context.

[0038] The switch is a device for completing information exchange function in communication system, which is in box type structure, and has different forms such as 1U / 2U / 4U according to function configuration. In the use process of the switch, heat will be generated, and with the continuous improvement of switching speed and configuration, the power consumption is getting larger and larger, and the heat generated is also getting more and more, so it is necessary to dissipate heat.

[0039] In the prior art, air cooling is used for heat dissipation, that is, a fan and an air duct structure are used. The air duct structure is arranged in the switch, and the fan generates air to dissipate heat for the switch. However, the heat dissipation effect of air cooling is weak, and noise is easy to be generated.

[0040] Therefore, the liquid cooling exchanger structure provided in the application comprises an upper cover, a shell base and a cold plate assembly; the shell base has a mounting cavity therein, the upper cover is arranged on the shell base and seals the mounting cavity; the cold plate assembly comprises a pipeline piece, a power supply cold plate piece and a chip cold plate piece, which are all arranged in the mounting cavity; the flow channels in the power supply cold plate piece and the chip cold plate piece are both in communication with the pipeline piece; the chip cold plate piece is used for being connected with a first heat dissipation object; and the power supply cold plate piece is used for being connected with a second heat dissipation object. The heat generated by the first heat dissipation object is transferred to the chip cold plate piece alone, the heat generated by the second heat dissipation object is transferred to the power supply cold plate piece alone, the power supply cold plate piece and the chip cold plate piece are both in corresponding communication with the pipeline piece, the pipeline piece, the power supply cold plate piece and the chip cold plate piece complete heat exchange, and the heat of the power supply cold plate piece and the chip cold plate piece is taken away, so that the first heat dissipation object and the second heat dissipation object are separately and more accurately cooled by distributing the power supply cold plate piece and the chip cold plate piece, the cooling effect is improved, and the noise is smaller in the process of heat exchange compared with fan cooling.

[0041] The technical solutions of the application and how the technical solutions solve the above technical problems will be described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes can not be described again in some embodiments. The following will be described in combination with Figures 1 to 3 Specific embodiments of the liquid cooling exchanger structure of the application are described. Figure 1 A structural schematic diagram of the liquid cooling exchanger structure provided in the embodiments of the application is shown in the figure. Figure 2 The liquid cooling exchanger structure provided in the embodiments of the application is shown in the figure. Figure 1 An exploded view of the liquid cooling exchanger structure in the embodiments of the application is shown in the figure. Figure 3 A structural schematic diagram of the cold plate assembly in the shell base of the liquid cooling exchanger structure provided in the embodiments of the application is shown in the figure.

[0042] The liquid cooling exchanger structure provided in the application comprises an upper cover 100, a shell base 200 and a cold plate assembly 300; the shell base 200 has a mounting cavity 210 therein, the upper cover 100 is arranged on the shell base 200 and seals the mounting cavity 210; the cold plate assembly 300 comprises a pipeline piece 330, a power supply cold plate piece 320 and a chip cold plate piece 310, which are all arranged in the mounting cavity 210; the flow channels in the power supply cold plate piece 320 and the chip cold plate piece 310 are both in communication with the pipeline piece 330; the chip cold plate piece 310 is used for being connected with a first heat dissipation object 10; and the power supply cold plate piece 320 is used for being connected with a second heat dissipation object 20.

[0043] Specifically, the upper cover 100 is arranged on the chassis base 200, the chassis base 200 has a mounting cavity 210, and the upper cover 100 is used for closing the chassis base 200. The first heat dissipation component 10 and the second heat dissipation component 20 are arranged in the mounting cavity 210. The cold plate assembly 300 is also arranged in the mounting cavity 210, and the first heat dissipation component 10 and the second heat dissipation component 20 are connected with the cold plate assembly 300. The chassis base 200 and the upper cover 100 provide a protective shell for the first heat dissipation component 10, the second heat dissipation component 20 and the cold plate assembly 300.

[0044] The cold plate assembly 300 comprises a pipeline component 330, two chip cold plate components 310 and one power supply cold plate component 320. The two chip cold plate components 310 are arranged on the first heat dissipation component 10, and the first heat dissipation component 10 is a mainboard. The power supply cold plate component 320 is connected with the second heat dissipation component 20, and the second heat dissipation component 20 is a power supply module. Specifically, the power supply module is electrically connected with the mainboard through the power supply adapter plate 30 and the copper bar 40, and the power supply module is used for providing power supply for the mainboard.

[0045] The chassis base 200 is provided with a power supply compartment structure 21, and the power supply compartment structure 21 is connected with two inner side walls adjacent to the chassis base 200. The second heat dissipation component 20 is inserted into the power supply compartment structure 21. The number of the second heat dissipation component 20 is not limited in the application. For example, the number of the second heat dissipation component 20 can be one, or the number of the second heat dissipation component 20 can be two, and each second heat dissipation component 20 is arranged in the power supply compartment structure 21.

[0046] The mounting cavity 210 of the chassis base 200 is provided with a liquid leakage tray 400, and the pipeline component 330, the power supply cold plate component 320 and the chip cold plate component 310 are arranged in the liquid leakage tray 400. The bottom of the liquid leakage tray 400 is inclined, used for collecting the liquid leaked from the pipeline component 330, the power supply cold plate component 320 or the chip cold plate component 310. The leaked liquid flows along the inclined bottom of the liquid leakage tray 400 to a liquid discharge part 410, so that the leaked liquid is guided out of the chassis base 200.

[0047] The end of the chassis base 200 away from the second heat dissipation component 20 is provided with a front window, used for placing the interface part 12 of the first heat dissipation component 10. A plurality of fixing stud structures are arranged on the inner side of the front window facing the chassis base 200, and the fixing stud structures are connected with the first heat dissipation component 10, so as to fix the first heat dissipation component 10 in the chassis base 200.

[0048] The pipeline component 330 comprises an inlet pipe 331 and an outlet pipe 332. The inlet pipe 331 is connected with the inlets of the chip cold plate components 310 and the power supply cold plate component 320 respectively, and the outlet pipe 332 is connected with the outlets of the chip cold plate components 310 and the power supply cold plate component 320. The inlet pipe 331 has cold liquid.

[0049] The pipeline piece 330 is in communication with the flow channels in the power cold plate piece 320 and the chip cold plate piece 310. The side of the chassis base 200 is provided with a liquid outlet 600 and a liquid inlet 500. The pipeline piece 330 includes a first pipeline 331 and two second pipelines 332.

[0050] The liquid cooling exchanger structure in the embodiment of the present application is used to separately transfer the heat generated by the first heat dissipation piece 10 to the chip cold plate piece 310, and separately transfer the heat generated by the second heat dissipation piece 20 to the power cold plate piece 320. The power cold plate piece 320 and the chip cold plate piece 310 are in communication with the pipeline piece 330, and the pipeline piece 330, the power cold plate piece 320 and the chip cold plate piece 310 complete heat exchange, and the heat of the power cold plate piece 320 and the chip cold plate piece 310 is taken away, so that the first heat dissipation piece 10 and the second heat dissipation piece 20 are separately and more accurately cooled by distributing the power cold plate piece 320 and the chip cold plate piece 310, the heat dissipation effect is improved, and the noise is smaller in the process of heat exchange compared with fan cooling.

[0051] In some possible implementations, the liquid cooling exchanger structure provided by the embodiment of the present application is used to include the first cold plate 311 and two second cold plates 312 in the chip cold plate piece 310, the second cold plate 312 is arranged on one side of the chassis base 200, the first cold plate 311 is connected with the pipeline piece 330, the second cold plate 312 is connected with the pipeline piece 330, the two second cold plates 312 are used to clamp the interface part 12 of the first heat dissipation piece 10, and the first cold plate 311 is used to connect with the chip 11 of the first heat dissipation piece 10.

[0052] The first cold plate 311 and the second cold plate 312 have a cold surface on the side facing the first heat dissipation piece 10, and the cold surface is connected with the first heat dissipation piece 10. The first cold plate 311 and the two second cold plates 312 each have a cold surface, which is arranged towards the first heat dissipation piece 10 and connected with the first heat dissipation piece 10. The cold surface is connected with the first heat dissipation piece 10 through a heat conduction piece, and can also be directly connected with the first heat dissipation piece 10

[0053] The first heat dissipation component 10 includes a plate body, a chip 11 and two interface parts 12. The chip 11 is arranged on one side of the plate body, and the two interface parts 12 are respectively arranged on opposite sides of the plate body. The plate body is arranged in the mounting cavity 210 through a bolt column structure connected to the side of the plate body away from the chip 11. The two second cold plates 312 are arranged oppositely, and the first heat dissipation component 10 is located between the two second cold plates 312. The cold surfaces of the second cold plates 312 are connected with the interface parts 12 of the first heat dissipation component 10. The power cold plate component 320 is connected with the chip cold plate component 310 through the pipe component 330, and the power cold plate component 320 is connected with the power module through the liquid cooling connector 340. The heat generated by the first heat dissipation component 10 is transmitted to the chip cold plate component 310 alone, and the heat generated by the second heat dissipation component 20 is transmitted to the power cold plate component 320 alone, thereby providing the accuracy of heat dissipation.

[0054] In some possible implementations, the liquid cooling exchanger structure provided by the embodiment of the present application is provided. The first cold plate 311 is attached to the chip 11, and the two second cold plates 312 are connected through the connecting component 700, so that the two second cold plates 312 sandwich the interface part 12.

[0055] The connecting component 700 is arranged on one side of the second cold plate 312. The second cold plate 312 is provided with a connecting hole. The connecting component 700 sequentially passes through the connecting holes of the two second cold plates 312 and is connected with the case base 200. The two second cold plates 312 are arranged at intervals along the extension direction of the connecting component 700, so that the two second cold plates 312 sandwich the interface part 12. Through the interval arrangement of the two second cold plates 312, the interface part 12 is flexibly connected to adapt to the first heat dissipation component 10 with different heights or thicknesses.

[0056] For example, the interface part 12 is an IO interface of the first heat dissipation component 10. The specific structure of the connecting component 700 is not limited in the embodiment of the present application. For example, the connecting component 700 can be a fixed stud structure.

[0057] The end of the case base 200 away from the second heat dissipation component 20 is provided with a front window for mounting and placing the interface part 12 of the first heat dissipation component 10. A plurality of fixed stud structures are arranged on the inner side of the front window facing the case base 200. The fixed stud structures are connected with the first heat dissipation component 10 to fix the first heat dissipation component 10 inside the case base 200.

[0058] In some embodiments, the liquid cooling exchanger structure provided by the embodiment of the present application further includes a liquid cooling connector 340. The power cold plate component 320 is connected with the second heat dissipation component 20 through the liquid cooling connector 340.

[0059] The second heat dissipation component 20 is provided with an interface, the interface is plugged with the power cold plate component 320 through the liquid cooling connector 340, and it needs to be noted that the liquid cooling connector 340 is convenient for blind plugging with the second heat dissipation component 20, and the connection step is simplified. The second heat dissipation component 20 is provided with a handle clamping structure, and the handle clamping structure is detachably connected with the power bin structure 21.

[0060] When the second heat dissipation component 20 is two, the liquid cooling connector 340 is also two, and the number of the liquid cooling connector 340 is not limited in the application.

[0061] In some other embodiments, the liquid cooling exchanger structure provided by the application is provided with a liquid inlet part 500 and a liquid outlet part 600 which are in communication with the mounting cavity 210 on the machine shell base 200, the two ends of the pipe component 330 are in communication with the liquid inlet part 500 and the liquid outlet part 600 respectively, and at least part of the pipe component 330 is arranged along the inner circumferential side of the machine shell base 200.

[0062] Specifically, the liquid inlet part 500 and the liquid outlet part 600 are located on the outer side of the machine shell base 200 away from the first heat dissipation component 10, the cold liquid flows into the liquid inlet part 500, and the liquid with heat flows out of the liquid outlet part 600. The two ends of the pipe component 330 are in communication with the liquid inlet part 500 and the liquid outlet part 600 respectively, and the pipe component 330 flows out from one end of the machine shell base away from the first heat dissipation component 10 in turn through the first cold plate, the power cold plate component and the second cold plate.

[0063] By arranging the pipe component 330 along the inner circumferential side of the machine shell base 200, the limited space is effectively utilized.

[0064] In some possible implementation manners, the liquid cooling exchanger structure provided by the application further includes a liquid leakage tray 400, the liquid leakage tray 400 is arranged in the machine shell base 200, and the pipe component 330, the power cold plate component 320 and the chip cold plate component 310 are all arranged in the liquid leakage tray 400.

[0065] The liquid leakage tray 400 is arranged in the mounting cavity 210 of the machine shell base 200, the pipe component 330, the power cold plate component 320 and the chip cold plate component 310 are arranged in the liquid leakage tray 400, and the liquid leakage tray 400 is convenient for collecting the liquid leaked by the pipe component 330, the power cold plate component 320 or the chip cold plate component 310.

[0066] Among them, the liquid cooling exchanger structure provided by the application, the bottom of the liquid leakage tray 400 is arranged obliquely by the first heat dissipation component 10.

[0067] The liquid leakage flows along the inclined bottom of the liquid leakage tray 400 to the liquid discharge part 410, so as to facilitate the liquid leakage to be guided out to the outside of the machine shell base 200, and the liquid flow is guided.

[0068] In addition, the liquid cooling exchanger structure provided by the embodiment of the present application is provided with a liquid discharge part 410 on the chassis base 200, the liquid discharge part 410 is communicated with the liquid leakage tray 400, so as to guide the liquid leakage of the liquid leakage tray 400 to the outside of the chassis base 200. The liquid leakage tray is provided with a liquid discharge part, the liquid discharge part 410 is connected with the chassis base 200, so as to guide the liquid leakage of the liquid leakage tray to the outside of the chassis base.

[0069] The liquid discharge part 410 is located on one side of the chassis base 200, and the liquid discharge part 410 is located on one side of the liquid outlet part 600 of the chassis base 200, so as to guide the liquid leakage of the liquid leakage tray 400 to the outside of the chassis base 200. The liquid leakage of the collection pipe 330, the power supply cold plate 320 or the chip cold plate is guided to the outside of the chassis base 200 along the inclined bottom of the liquid leakage tray 400 to the liquid discharge part 410, so as to guide the liquid leakage to the outside of the chassis base 200.

[0070] In some possible implementation manners, the liquid cooling exchanger structure provided by the embodiment of the present application is provided with a liquid discharge part 410 on the chassis base 200, the liquid discharge part 410 is communicated with the liquid leakage tray 400, so as to guide the liquid leakage of the liquid leakage tray 400 to the outside of the chassis base 200. The liquid leakage tray is provided with a liquid discharge part, the liquid discharge part 410 is connected with the chassis base 200, so as to guide the liquid leakage of the liquid leakage tray to the outside of the chassis base.

[0071] The first section of the first pipe 331 is connected with the liquid inlet part 500 at one end and communicated with the inlet of the flow channel of the chip cold plate 310 at the other end. The second section of the first pipe 331 is communicated with the outlet of the flow channel of the chip cold plate 310 at one end and communicated with the inlet of the flow channel of the power supply cold plate 320 at the other end. The first sections of the two second pipes 332 are communicated with the outlet of the flow channel of the power supply cold plate 320 at one end and connected with the inlets of the two second cold plates 312 at the other end respectively. The second sections of the two second pipes 332 are connected with the outlets of the two second cold plates 312 at one end and connected with the liquid outlet part 600 at the other end. The second sections of the second pipes 332 and the first sections of the second pipes 332 are arranged along the inner side of the chassis base 200.

[0072] By arranging the second sections and the first sections of the second pipes 332 along the inner side of the chassis base 200, the layout of the cooling system is compact, the bending points are reduced, the smooth flow of the cooling liquid is ensured, and the flow resistance is reduced.

[0073] In some possible implementation manners, the liquid cooling exchanger structure provided by the embodiment of the present application is provided with a liquid discharge part 410 on the chassis base 200, the liquid discharge part 410 is communicated with the liquid leakage tray 400, so as to guide the liquid leakage of the liquid leakage tray 400 to the outside of the chassis base 200. The liquid leakage tray is provided with a liquid discharge part, the liquid discharge part 410 is connected with the chassis base 200, so as to guide the liquid leakage of the liquid leakage tray to the outside of the chassis base.

[0074] The chip cold plate member 310 includes a first cold plate 311 connected with the chip 11 of the first heat-dissipating member 10 and two second cold plates 312 connected with the interface part 12 of the first heat-dissipating member 10. It should be noted that the pipe diameter of the first pipe 331 is larger than that of the second pipe 332, so as to enhance the refrigeration effect of the first cold plate 311, which is conducive to heat dissipation of the chip 11 of the first heat-dissipating member 10. When the first heat-dissipating member 10 is running, the chip of the first heat-dissipating member 10 generates more heat, and the first cold plate 311 can effectively dissipate heat of the first heat-dissipating member 10. The interface part 12 of the first heat-dissipating member 10 generates less heat than the chip, the second pipe 332 is connected with the second cold plate 312 correspondingly, and the second cold plate 312 can also effectively dissipate heat of the interface part 12, so as to realize effective utilization of liquid cooling and precise heat dissipation. The cooling liquid enters from the liquid inlet part 500, exchanges heat through the first cold plate 311, the power cold plate member 320 and the second cold plate 312, and finally flows out from the liquid outlet part 600, so as to form a heat exchange cycle.

[0075] Each embodiment or implementation in the specification is described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts between the embodiments can be referred to each other.

[0076] It should be readily understood that "on", "above", and "over" in the present disclosure should be interpreted in the broadest manner, such that "on" means not only "directly on", but also includes the meaning of "on" with intermediate features or layers therebetween, and "above" or "over" includes not only the meaning of "above" or "over", but also the meaning of "above" or "over" without intermediate features or layers therebetween (i.e., directly on).

[0077] In addition, spatial relative terms, such as "below", "under", "lower", "above", "on", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatial relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. The device can have other orientations (rotated 90 degrees or otherwise) and the spatial relative descriptors used herein can be interpreted accordingly.

[0078] It should be noted that, as the specification mentions "one embodiment", "an embodiment", "the exemplary embodiment", "some embodiments", and the like, it is meant that a particular feature, structure, or characteristic described in connection with the embodiment can be included in some embodiments, but not necessarily every embodiment. Furthermore, such phrases or phrases of similar meaning are not necessarily referring to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one of ordinary skill in the art to effect such feature, structure, or characteristic in connection with an alternative embodiment whether or not further

[0079] Finally, it should be noted that the above-mentioned embodiments are merely used to illustrate the technical solutions of the present application, but not to limit the present application; even though the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some or all of the technical features can be replaced by equivalent replacements; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A liquid cooling switch structure, characterized in that: include: An upper cover (100), a housing base (200) and a cold plate assembly (300); The housing base (200) has an installation cavity (210) therein, and the upper cover (100) is disposed on the housing base (200) and closes the installation cavity (210); The cold plate assembly (300) comprises a pipe component (330), a power supply cold plate component (320) and a chip cold plate component (310), all of which are arranged in the installation cavity (210); the flow channels in the power supply cold plate component (320) and the chip cold plate component (310) are both connected to the pipe component (330); the chip cold plate component (310) is used to connect to a first heat component to be cooled (10); and the power supply cold plate component (320) is used to connect to a second heat component to be cooled (20).

2. The liquid cooling switch structure according to claim 1, characterized in that: The chip cold plate (310) comprises a first cold plate (311) and two second cold plates (312), wherein the second cold plates (312) are arranged on one side of the housing base (200), the first cold plate (311) is connected to the pipe member (330), and the second cold plate (312) is connected to the pipe member (330), and the two second cold plates (312) are used to clamp the interface portion (12) of the first heat dissipation element (10), and the first cold plate (311) is used to connect to the chip (11) of the first heat dissipation element (10).

3. The liquid cooling switch structure according to claim 2, characterized in that: The first cold plate (311) is bonded to the chip (11), and the two second cold plates (312) are connected via a connector (700) so that the interface portion (12) is sandwiched between the two second cold plates (312).

4. The liquid cooling switch structure according to claim 3, characterized in that: The cold plate assembly (300) further comprises a liquid cooling joint portion (340), and the power supply cold plate component (320) is plugged into the second heat component (20) to be cooled via the liquid cooling joint portion (340).

5. The liquid cooling switch structure according to any one of claims 2 to 4, characterized in that: The housing base (200) is provided with a liquid inlet (500) and a liquid outlet (600) in communication with the mounting cavity (210); both ends of the pipe member (330) are in communication with the liquid inlet (500) and the liquid outlet (600), respectively; and at least a portion of the pipe member (330) is arranged along the inner circumference of the housing base (200).

6. The liquid cooling switch structure according to any one of claims 1 to 4, characterized in that: It also includes a liquid leakage tray (400), which is arranged in the housing base (200), and the pipeline component (330), the power supply cold plate component (320) and the chip cold plate component (310) are all arranged in the liquid leakage tray (400).

7. The liquid cooling switch structure according to claim 6, characterized in that: The bottom of the liquid leakage tray (400) is arranged tilted.

8. The liquid cooling switch structure according to claim 7, characterized in that: The housing base (200) is provided with a liquid drain portion (410), and the liquid drain portion (410) is communicated with the liquid leakage tray (400) so as to guide the liquid leaked from the liquid leakage tray (400) to the outside of the housing base (200).

9. The liquid cooling switch structure according to any one of claims 2 to 4, characterized in that: The pipe member (330) comprises a first pipe (331) and two second pipes (332); one end of the first pipe (331) is connected to the first cold plate (311), and the other end is connected to the power cold plate member (320); one end of each second pipe (332) is connected to the power cold plate member (320), and the other end is respectively connected to the second cold plate (312); at least part of the second pipe (332) is arranged on the peripheral side of the housing base (200).

10. The liquid cooling switch structure according to claim 9, characterized in that: The diameter of the first pipe (331) is greater than the diameter of the second pipe (332); the first pipe (331) is connected to the liquid inlet (500) of the housing base (200); and the second pipe (332) is connected to the liquid outlet (600) of the housing base (200).

Images