Double-capacitor ceramic capacitor

Abstract

The utility model relates to the technical field of sensors, and provides a double-capacitor ceramic capacitor, which comprises a substrate provided with a through hole; the diaphragm is arranged on one side of the substrate; the first pattern is arranged on the surface, close to the diaphragm side, of the substrate, and the first pattern comprises a first electrode and a second electrode; the second pattern is arranged on the surface, close to the substrate side, of the diaphragm, and the second pattern comprises a third electrode and a fourth electrode; the sealing layer is arranged between the substrate and the diaphragm; according to the double-capacitor ceramic capacitor, the reliability of the ceramic capacitor is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to sensor technical field, specifically to a kind of double-capacitance ceramic capacitor. BACKGROUND

[0002] Ceramic capacitor can be assembled together as pressure sensing piece and metal tube to form commonly used pressure sensor or temperature pressure sensor in industry, and the ceramic capacitor in prior art is mostly single-capacitance structure, and such capacitor has problems such as reliability and safety. SUMMARY

[0003] The utility model discloses a double-capacitance ceramic capacitor, which is suitable for electronic systems with strict requirements on signal accuracy, reliability and space utilization, such as automobile safety systems, industrial control and high-frequency communication equipment.

[0004] To achieve the above object and other objects, the utility model is realized by including the following technical solutions: the double-capacitance ceramic capacitor includes a substrate with a through hole on the substrate;

[0005] A diaphragm is arranged on one side of the substrate.

[0006] A first pattern is arranged on the surface of the substrate close to the diaphragm side, the first pattern includes a first electrode and a second electrode, the first electrode includes a first circuit and a first lead connected thereto, the second electrode includes a second circuit and a second lead connected thereto, and one end of the first lead and the second lead extends to the through hole.

[0007] A second pattern is arranged on the surface of the diaphragm close to the substrate side, the second pattern includes a third electrode and a fourth electrode, the third electrode includes a third circuit and a third lead connected thereto, the fourth electrode includes a fourth circuit and a fourth lead connected thereto, and one end of the third lead and the fourth lead extends to the through hole.

[0008] A sealing layer is arranged between the substrate and the diaphragm.

[0009] The sealing layer has a first opening and a second opening, the sealing layer, the substrate and the diaphragm form a first pressure sensing cavity at the first opening, the first circuit and the third circuit are located in the first pressure sensing cavity, the sealing layer, the substrate and the diaphragm form a second pressure sensing cavity at the second opening, and the second circuit and the fourth circuit are located in the second pressure sensing cavity.

[0010] In an embodiment, the first pattern comprises a first ground electrode arranged at the periphery of the first electrode and a second ground electrode arranged at the periphery of the second electrode, and the second pattern comprises a third ground electrode arranged at the periphery of the third electrode and a fourth ground electrode arranged at the periphery of the fourth electrode.

[0011] In an embodiment, the through hole comprises a first through hole, a second through hole, a third through hole, a fourth through hole and a fifth through hole arranged in sequence.

[0012] In an embodiment, the first ground electrode comprises a first annular circuit and a first ground lead connected to both ends of the first annular circuit, the second ground electrode comprises a second annular circuit and a second ground lead connected to both ends of the second annular circuit, and the first ground lead and the second ground lead are merged to form a first fusion part.

[0013] In an embodiment, the third ground electrode comprises a third annular circuit and a third ground lead connected to both ends of the third annular circuit, the fourth ground electrode comprises a fourth annular circuit and a fourth ground lead connected to both ends of the fourth annular circuit, and the third ground lead and the fourth ground lead are merged to form a second fusion part.

[0014] In an embodiment, the first fusion part is located between the first through hole and the second through hole, and the second fusion part is located between the fourth through hole and the fifth through hole.

[0015] In an embodiment, the second ground lead and the third ground lead pass through the third through hole.

[0016] In an embodiment, the first lead extends to the first through hole, the second lead extends to the second through hole, the third lead extends to the fourth through hole, and the fourth lead extends to the fifth through hole.

[0017] In an embodiment, the sealing layer is provided with a relief hole matched with the through hole.

[0018] In an embodiment, the dual-capacitance ceramic capacitor has a notch at the outer edge.

[0019] The utility model provides a kind of dual-capacitance ceramic capacitor packaged by ceramic substrate and ceramic diaphragm, substrate is equipped with the dual-capacitance unit of being independent to each other and integrated in same substrate, each capacitor unit has independent electrode area and customized electrode connection path.Dual-capacitance unit can realize differential detection, utilize differential signal characteristics, effectively improve signal acquisition accuracy, suppress common-mode interference.

[0020] It also supports redundant design. If a single capacitor unit fails, the remaining unit maintains basic circuit functionality, enhancing system reliability and meeting ASIL C requirements with a 10ms fault response time, expanding the application range of ceramic capacitors in functional safety applications. The compact assembly path and integrated layout are compatible with miniaturized electronic devices, optimizing circuit space utilization, reducing signal transmission interference, and improving overall electrical performance.

[0021] Compared to traditional single-capacitor or distributed capacitor layouts, this new design utilizes dual-capacitor integration. In signal processing, differential detection improves accuracy and enhances anti-interference capabilities. Redundant design increases system fault tolerance and significantly optimizes reliability. Regarding space utilization, the integrated structure reduces circuit board space usage, contributing to the miniaturization and lightweighting of electronic devices. Furthermore, integration reduces assembly and space costs in mass production, resulting in significant market application potential and providing high-performance, highly reliable capacitor solutions for demanding applications such as automotive electronics and industrial control. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Shown is a schematic structural diagram of the dual-capacitance ceramic capacitor of the utility model;

[0023] Figure 2 Shown is an exploded view of the dual-capacitance ceramic capacitor of the utility model;

[0024] Figure 3 Shown is a bottom view of the substrate of the dual-capacitance ceramic capacitor of the present invention;

[0025] Figure 4 Shown is a top view of the diaphragm of the utility model;

[0026] Figure 5 Shown is a cross-sectional view of the first pressure-sensing chamber of the present invention;

[0027] Figure 6 Shown is a cross-sectional view of the second pressure-sensing chamber of the present invention;

[0028] The figure mark: 1- substrate, 11- through hole, 111- first through hole, 112- second through hole, 113- third through hole, 114- fourth through hole, 115- fifth through hole, 2- diaphragm, 3- sealing layer, 31- first opening, 32- second opening, 33- avoiding hole, 4- first pattern, 41- first electrode, 411- first circuit, 412- first lead, 42- first ground electrode, 421- first annular circuit, 422- first ground lead, 43- second electrode, 431- second circuit, 432- second lead, 44- second ground electrode, 441- second annular circuit, 442- second ground lead, 5- second pattern, 51- third electrode, 511- third circuit, 512- third lead, 52- fourth electrode, 521- fourth circuit, 522- fourth lead, 53- third ground electrode, 531- third annular circuit, 532- third ground lead, 54- fourth ground electrode, 541- fourth annular circuit, 542- fourth ground lead, 100- first fusion part, 200- second fusion part, 300- terminal, 400- conductive glue, 500- first pressure sensing cavity, 600- second pressure sensing cavity, 700- notch. DETAILED DESCRIPTION

[0029] As Figure 1 shown, the utility model provides a kind of double-capacitance ceramic capacitor, the working principle of the double-capacitance ceramic capacitor can be exemplified as follows.Double-capacitance ceramic capacitor internal electrode is not contacted with external environment, and pressure is directly acted on the outer surface of diaphragm 2.Diaphragm 2 and substrate 1 inner surface sputter or silk screen print electrode to form capacitor structure, according to the principle of parallel-plate capacitor, the capacitor change value caused by deformation and diaphragm 2 deformation are proportional, i.e.diaphragm 2 and the pressure applied are proportional, to measure the pressure of corresponding medium by this.The diaphragm 2 and substrate 1 are in non-contact state when working, i.e.when diaphragm 2 is deformed by external load, capacitor cavity spacing decreases, and upper electrode and lower electrode gradually approach, but always do not contact.The double-capacitance ceramic capacitor can be assembled into the inner cavity of pressure sensor to feedback the pressure of medium to be measured.

[0030] As Figure 2 shown, the double-capacitance ceramic capacitor includes substrate 1, diaphragm 2 and intermediate sealing layer 3, and the substrate 1, diaphragm 2 and sealing layer 3 can be circular.

[0031] As Figure 1 shown, the pressure sensor includes substrate 1, and the substrate 1 can be alumina or zirconia material, the cross-sectional structure of the substrate 1 can be circular, the thickness of the substrate 1 can be 1-10mm, and the radius of the substrate 1 can be 9-13mm.

[0032] As Figure 2 and Figure 3 As shown, a first pattern 4 can be provided on the bottom surface of the substrate 1, and the first pattern 4 includes a first electrode 41 and a second electrode 43. The shapes of the first electrode 41 and the second electrode 43 can be similar. The first electrode 41 and the second electrode 43 are power supply electrodes. The first electrode 41 includes a first circuit 411 and a first lead 412 connected to the first circuit 411. The second electrode 43 includes a second circuit 431 and a second lead 432 connected to the second circuit 431.

[0033] like Figure 3 As shown, the bottom surface of the substrate 1 is further provided with a first grounding electrode 42 and a second grounding electrode 44. The first grounding electrode 42 is arranged on the periphery of the first electrode 41, and the second grounding electrode 44 is arranged on the periphery of the second electrode 43. The first grounding electrode 42 includes a first ring circuit 421 and a first grounding lead 422 connected to both ends of the first ring circuit 421. The second grounding electrode 44 includes a second ring circuit 441 and a second grounding lead 442 connected to both ends of the second ring circuit 441.

[0034] The first ring circuit 421 surrounds the first circuit 411 , and the second ring circuit 441 surrounds the second circuit 431 .

[0035] The material of the first electrode 41 and the second electrode 43 can be a conductive paste, such as gold, silver, or palladium. The thickness of the first electrode 41 and the second electrode 43 is less than 1 μm. The material of the first grounding electrode 42 and the second grounding electrode 44 is a conductive paste, such as gold, silver, or palladium, with a thickness of less than 1 μm.

[0036] like Figure 2 and Figure 4 As shown, the dual-capacitance ceramic capacitor includes a diaphragm 2, which can be an elastic ceramic diaphragm. The diaphragm 2 can be made of aluminum oxide or zirconium oxide. The thickness of the diaphragm 2 can be 0.1-1 mm, and further can be 0.2-0.35 mm. The diaphragm 2 can be circular, and a second pattern 5 is provided on the top surface of the diaphragm 2. The second pattern 5 includes a third electrode 51 and a fourth electrode 52. The third electrode 51 and the first electrode 41 form a group of parallel plate capacitors, and the fourth electrode 52 and the second electrode 43 form another group of parallel plate capacitors, thereby constituting a dual-capacitance ceramic capacitor. The third electrode 51 includes a third circuit 511 and a third lead 512 connected thereto. The third circuit 511 is a circular circuit.

[0037] like Figure 4As shown, the fourth electrode 52 comprises a fourth circuit 521 and a fourth lead 522 connected to the fourth circuit 521. The top of the diaphragm 2 is further provided with a third ground electrode 53 and a fourth ground electrode 54, the third ground electrode 53 is arranged at the periphery of the third electrode 51, and the fourth ground electrode 54 is arranged at the periphery of the fourth electrode 52, the third ground electrode 53 comprises a third annular circuit 531 and a third ground lead 532 connected to both ends of the third annular circuit 531, and the fourth ground electrode 54 comprises a fourth annular circuit 541 and a fourth ground lead 542 connected to both ends of the fourth annular circuit 541.

[0038] As shown in the drawings, Figure 2 As shown, the double-capacitance ceramic capacitor comprises a sealing layer 3, which can be arranged between the substrate 1 and the diaphragm 2, the sealing layer 3 can comprise glass paste and insulating beads, the thickness of the sealing layer 3 depends on the diameter of the insulating beads, the thickness of the sealing layer 3 can be 10-25 μm, or even more, and the sealing layer 3 is also circular.

[0039] As shown in the drawings, Figure 1 and Figure 2 As shown, the substrate 1 is provided with a plurality of through holes 11, which can be used as the lead-out holes of electrical signals. The plurality of through holes 11 can comprise a first through hole 111, a second through hole 112, a third through hole 113, a fourth through hole 114 and a fifth through hole 115 arranged in sequence.

[0040] As shown in the drawings, Figure 2 and Figure 3 As shown, the first lead 412 can extend to the first through hole 111, the second lead 432 extends to the second through hole 112, one end of the first ground lead 422 and one end of the second ground lead 442 can converge and merge to form a first fusion portion 100, the first fusion portion 100 is located between the first through hole 111 and the second through hole 112, and the first ground lead 422 and the second ground lead 442 both extend to the through hole 11, specifically, one end of the second ground lead 442 can pass through the third through hole 113 to output the electrical signals of the first ground electrode 42 and the second ground electrode 44.

[0041] As shown in the drawings, Figure 4As shown, the third lead 512 can extend to the fourth through hole 114, the fourth lead 522 extends to the fifth through hole 115, one end of the third ground lead 532 and one end of the fourth ground lead 542 can converge and merge to form a second fusion portion 200, the second fusion portion 200 is located between the fourth through hole 114 and the fifth through hole 115, the third ground lead 532 and the fourth ground lead 542 both extend to the through hole 11, in particular, one end of the third ground lead 532 can pass through the third through hole 113 to output the electrical signal of the third ground electrode 53 and the fourth ground electrode 54.

[0042] As shown in FIG. 1, the pressure sensor comprises a substrate 1, a diaphragm 2, a sealing layer 3, a first circuit 411, a second circuit 431, a third circuit 511, a fourth circuit 521, a first ground electrode 42, a second ground electrode 44, a third electrode 51, a fourth electrode 52, a first through hole 11, a second through hole 12, a third through hole 13, a fourth through hole 114, a fifth through hole 115, a first opening 31, a second opening 32, and a gap 700. Figure 2 As shown in FIG. 1, the pressure sensor comprises a substrate 1, a diaphragm 2, a sealing layer 3, a first circuit 411, a second circuit 431, a third circuit 511, a fourth circuit 521, a first ground electrode 42, a second ground electrode 44, a third electrode 51, a fourth electrode 52, a first through hole 11, a second through hole 12, a third through hole 13, a fourth through hole 114, a fifth through hole 115, a first opening 31, a second opening 32, and a gap 700.

[0043] As shown in FIG. 1, the pressure sensor comprises a substrate 1, a diaphragm 2, a sealing layer 3, a first circuit 411, a second circuit 431, a third circuit 511, a fourth circuit 521, a first ground electrode 42, a second ground electrode 44, a third electrode 51, a fourth electrode 52, a first through hole 11, a second through hole 12, a third through hole 13, a fourth through hole 114, a fifth through hole 115, a first opening 31, a second opening 32, and a gap 700. Figure 5 Figure 6 As shown in FIG. 1, the pressure sensor comprises a substrate 1, a diaphragm 2, a sealing layer 3, a first circuit 411, a second circuit 431, a third circuit 511, a fourth circuit 521, a first ground electrode 42, a second ground electrode 44, a third electrode 51, a fourth electrode 52, a first through hole 11, a second through hole 12, a third through hole 13, a fourth through hole 114, a fifth through hole 115, a first opening 31, a second opening 32, and a gap 700.

[0044] As shown in FIG. 1, the pressure sensor comprises a substrate 1, a diaphragm 2, a sealing layer 3, a first circuit 411, a second circuit 431, a third circuit 511, a fourth circuit 521, a first ground electrode 42, a second ground electrode 44, a third electrode 51, a fourth electrode 52, a first through hole 11, a second through hole 12, a third through hole 13, a fourth through hole 114, a fifth through hole 115, a first opening 31, a second opening 32, and a gap 700. Figure 2 As shown in FIG. 1, the pressure sensor comprises a substrate 1, a diaphragm 2, a sealing layer 3, a first circuit 411, a second circuit 431, a third circuit 511, a fourth circuit 521, a first ground electrode 42, a second ground electrode 44, a third electrode 51, a fourth electrode 52, a first through hole 11, a second through hole 12, a third through hole 13, a fourth through hole 114, a fifth through hole 115, a first opening 31, a second opening 32, and a gap 700.

[0045] As shown in FIG. 1, the pressure sensor comprises a substrate 1, a diaphragm 2, a sealing layer 3, a first circuit 411, a second circuit 431, a third circuit 511, a fourth circuit 521, a first ground electrode 42, a second ground electrode 44, a third electrode 51, a fourth electrode 52, a first through hole 11, a second through hole 12, a third through hole 13, a fourth through hole 114, a fifth through hole 115, a first opening 31, a second opening 32, and a gap 700.

[0046] As shown in FIG. 1, the pressure sensor comprises a substrate 1, a diaphragm 2, a sealing layer 3, a first circuit 411, a second circuit 431, a third circuit 511, a fourth circuit 521, a first ground electrode 42, a second ground electrode 44, a third electrode 51, a fourth electrode 52, a first through hole 11, a second through hole 12, a third through hole 13, a fourth through hole 114, a fifth through hole 115, a first opening 31, a second opening 32, and a gap 700.

[0047] Figure 1 As shown in FIG. 1, the pressure sensor comprises a substrate 1, a diaphragm 2, a sealing layer 3, a first circuit 411, a second circuit 431, a third circuit 511, a fourth circuit 521, a first ground electrode 42, a second ground electrode 44, a third electrode 51, a fourth electrode 52, a first through hole 11, a second through hole 12, a third through hole 13, a fourth through hole 114, a fifth through hole 115, a first opening 31, a second opening 32, and a gap 700. Figure 3 As shown in FIG. 1, the pressure sensor comprises a substrate 1, a diaphragm 2, a sealing layer 3, a first circuit 411, a second circuit 431, a third circuit 511, a fourth circuit 521, a first ground electrode 42, a second ground electrode 44, a third electrode 51, a fourth electrode 52, a first through hole 11, a second through hole 12, a third through hole 13, a fourth through hole 114, a fifth through hole 115, a first opening 31, a second opening 32, and a gap 700.

[0048] ​​The preparation process of the utility model can be exemplified as follows: the substrate 1 and the diaphragm 2 can be formed by flow casting or dry pressing and then sintering. Based on the substrate 1 and the diaphragm 2, the first pattern 4 and the second pattern 5 are brushed thereon by vacuum sputtering or silk screen printing, then the glass paste is brushed on the substrate 1 after sintering, and the glass paste is sintered again to form the sealing layer 3. Then the substrate 1 and the diaphragm 2 are combined together, the first electrode 41 is opposite to the third electrode 51, and the second electrode 43 is opposite to the fourth electrode 52, and after alignment, high-temperature sintering is carried out again, so that the two are closely bonded together. During the sintering process, a certain pressure needs to be maintained to avoid separation of the two ceramic sheets. By doping some high-temperature-resistant fixed-diameter insulating beads in the glass paste, it can be ensured that the glass is still in a solid state when the paste is molten, so as to ensure that the metal electrode planes do not contact each other and can maintain a basically fixed distance.

[0049] After the substrate 1 and the diaphragm 2 are assembled, the semi-solid conductive glue 400 can be injected into the through hole 11 of the substrate 1, and then the terminal 300 is inserted, and after curing, the double-capacitance ceramic capacitor for leading out the capacitance signal can be obtained.

[0050] The double-capacitance ceramic capacitor of the utility model and the single-capacitance ceramic capacitor in the prior art are subjected to capacitance value testing, and the results are shown in Table 1. Among them, X1: ceramic capacitor of the utility model, X2: single-capacitance ceramic capacitor in the prior art, the first electrode 41 and the third electrode 51 form electrode one, and the second electrode 43 and the fourth electrode 52 form electrode two.

[0051] Table 1: Capacitance value test table of double-capacitance ceramic capacitor and single-capacitance ceramic capacitor

[0052]

[0053] As can be seen from Table 1, the utility model optimizes the design of the traditional single-capacitance ceramic capacitor on the market, and compared with single-capacitance, the capacitance value change of double-capacitance is larger, and the precision is higher. The improved double-electrode capacitor does not affect the precision of the capacitor, and the customized chip and circuit board can make a single ceramic capacitor react to two groups of capacitance signals and check each other. When the difference between the two signals is greater than 5% of the full range (the alarm limit can be flexibly set, and 5% is an example), the system will feedback an alarm, which means that the sensor will self-check the output. Compared with the traditional single-capacitance output ceramic capacitor, the safety and reliability during operation are greatly improved, and the personal and property safety of the client is guaranteed.

[0054] Therefore, the utility model effectively overcomes various shortcomings in prior art and has high industrial utilization value. The above embodiment only exemplarily illustrates the principle and effect of the utility model, and is not used for limiting the utility model. Any person skilled in the art can modify or change the above embodiment without departing from the spirit and scope of the utility model. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the utility model should be covered by the claims of the utility model.

Claims

1. A dual-capacitance ceramic capacitor, characterized in that: The dual-capacitance ceramic capacitor includes: a substrate having a through hole; a diaphragm, disposed on one side of the substrate; a first pattern disposed on a surface of the substrate close to the diaphragm, the first pattern comprising a first electrode and a second electrode, the first electrode comprising a first circuit and a first lead connected thereto, the second electrode comprising a second circuit and a second lead connected thereto, one end of the first lead and the second lead extending to the through hole; a second pattern disposed on a surface of the diaphragm close to the substrate, the second pattern comprising a third electrode and a fourth electrode, the third electrode comprising a third circuit and a third lead connected thereto, the fourth electrode comprising a fourth circuit and a fourth lead connected thereto, one end of the third lead and the fourth lead extending to the through hole; and a sealing layer disposed between the substrate and the diaphragm; In which, the sealing layer has a first opening and a second opening, and the sealing layer, the substrate and the diaphragm form a first pressure-sensing cavity at the first opening, and the first circuit and the third circuit are located in the first pressure-sensing cavity; the sealing layer, the substrate and the diaphragm form a second pressure-sensing cavity at the second opening, and the second circuit and the fourth circuit are located in the second pressure-sensing cavity.

2. The dual-capacitance ceramic capacitor according to claim 1, wherein: The first pattern includes a first ground electrode disposed around the first electrode and a second ground electrode disposed around the second electrode. The second pattern includes a third ground electrode disposed around the third electrode and a fourth ground electrode disposed around the fourth electrode.

3. The dual-capacitance ceramic capacitor according to claim 2, wherein: The through holes include a first through hole, a second through hole, a third through hole, a fourth through hole and a fifth through hole which are arranged in sequence.

4. The dual-capacitance ceramic capacitor according to claim 3, wherein: The first grounding electrode includes a first ring circuit and a first grounding lead connected to both ends of the first ring circuit. The second grounding electrode includes a second ring circuit and a second grounding lead connected to both ends of the second ring circuit. The first grounding lead and the second grounding lead merge to form a first fusion portion.

5. The dual-capacitance ceramic capacitor according to claim 4, wherein: The third grounding electrode includes a third ring circuit and a third grounding lead connected to both ends of the third ring circuit. The fourth grounding electrode includes a fourth ring circuit and a fourth grounding lead connected to both ends of the fourth ring circuit. The third grounding lead and the fourth grounding lead merge to form a second fusion portion.

6. The dual-capacitance ceramic capacitor according to claim 5, wherein: The first fusion portion is located between the first through hole and the second through hole, and the second fusion portion is located between the fourth through hole and the fifth through hole.

7. The dual-capacitance ceramic capacitor according to claim 5, wherein: The second ground lead and the third ground lead pass through the third through hole.

8. The dual-capacitance ceramic capacitor according to claim 3, wherein: The first lead extends to the first through hole, the second lead extends to the second through hole, the third lead extends to the fourth through hole, and the fourth lead extends to the fifth through hole.

9. The dual-capacitance ceramic capacitor according to claim 1, wherein: The sealing layer is provided with an avoidance hole matching the through hole.

10. The dual-capacitance ceramic capacitor according to claim 1, wherein: The dual-capacitance ceramic capacitor has a notch at an outer edge.

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