Nozzle assembly and wafer drying device

Abstract

The utility model discloses a nozzle assembly and a wafer drying device, the nozzle assembly is used for spraying fluid to the surface of a wafer, and the nozzle assembly comprises a first supporting arm; the first nozzle comprises a nozzle arm and a bendable nozzle part, the nozzle arm is connected to the first supporting arm, the nozzle part is arranged below the first supporting arm and connected to the nozzle arm, and the nozzle part is used for obliquely spraying a first fluid to the surface of the wafer; the lifting unit is connected with the nozzle part; and the first driving unit is connected with the lifting unit and used for driving the lifting unit to ascend and descend, and the lifting unit drives the nozzle part to move so as to change the bending angle. According to the method, reverse splashing of isopropyl alcohol can be prevented, pattern collapse caused by diffusion of isopropyl alcohol to a dry area is avoided, and the thickness of an isopropyl alcohol liquid film is controlled.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, more particularly to a nozzle assembly and wafer drying device. BACKGROUND

[0002] Wafer drying is an important process in the semiconductor manufacturing process. After the wafer goes through the liquid treatment process such as wet etching and cleaning, the liquid on the surface of the wafer needs to be removed, and at the same time, the surface of the wafer should not be damaged due to the drying process, such as particle adsorption, water stain residue, surface damage, etc.

[0003] During the drying process, deionized water (DIW) is usually sprayed on the surface of the wafer by a deionized water nozzle, and isopropyl alcohol (IPA) is sprayed on the surface of the wafer by an isopropyl alcohol nozzle. The isopropyl alcohol with low surface tension replaces the deionized water on the surface of the wafer, thereby taking away the moisture on the surface of the wafer.

[0004] In the related art, when isopropyl alcohol is sprayed on the surface of the wafer by the isopropyl alcohol nozzle, the angular velocity of the nozzle movement is constant, and the linear velocity of the nozzle movement at the edge of the wafer is large. The thickness of the isopropyl alcohol liquid film becomes thinner and thinner, which easily causes liquid splashing at the edge of the wafer. Therefore, a nitrogen gas nozzle is usually arranged to spray nitrogen gas (N2) on the surface of the wafer by a straight spraying method to prevent isopropyl alcohol from splashing back. However, it is difficult to control the thickness of the isopropyl alcohol liquid film by the nitrogen gas straight spraying method. SUMMARY

[0005] A series of simplified concepts are introduced in the summary part, which will be further described in detail in the detailed description part. The summary part of the utility model does not mean to try to limit the key features and necessary technical features of the claimed technical solution, and does not mean to try to determine the protection scope of the claimed technical solution.

[0006] In view of the existing problems, the utility model provides a nozzle assembly for spraying fluid on the surface of a wafer, which comprises:

[0007] a first support arm;

[0008] a first nozzle comprising a nozzle arm and a bendable nozzle part, the nozzle arm being connected to the first support arm, the nozzle part being arranged below the first support arm and connected to the nozzle arm, the nozzle part being used for spraying a first fluid obliquely on the surface of the wafer;

[0009] a lifting unit connected to the nozzle part;

[0010] A first driving unit is connected with the lifting unit and used to drive the lifting unit to lift, so that the nozzle part is moved to change the bending angle.

[0011] In some embodiments of the present application, the lifting unit comprises:

[0012] A connecting piece has two ends connected with the nozzle part and the first driving unit respectively;

[0013] The first driving unit is used to move the nozzle part through the connecting piece to change the bending angle.

[0014] In some embodiments of the present application, the lifting unit further comprises:

[0015] A movable piece has one end connected with the first driving unit through the connecting piece, and the movable piece is movable along the nozzle arm;

[0016] The first driving unit is used to drive the movable piece to lift along the nozzle arm, and the movable piece moves the nozzle part through the connecting piece to change the bending angle.

[0017] In some embodiments of the present application, a fixing piece is arranged on the nozzle arm, a plurality of clamping grooves are arranged on the fixing piece in the height direction, and the first driving unit is used to drive the movable piece to lift and be clamped in one of the clamping grooves.

[0018] In some embodiments of the present application, the first driving unit comprises:

[0019] A driving element is arranged on the first supporting arm;

[0020] A transmission piece has a first end connected with the driving element and a second end connected with the lifting unit; the driving element is used to drive the transmission piece to be wound or released, and the transmission piece drives the lifting unit to lift through winding or releasing of the transmission piece.

[0021] In some embodiments of the present application, a wheel groove piece is rotatably connected with the first supporting arm, and the wheel groove piece has a wheel groove extending in the circumferential direction.

[0022] The transmission piece comprises a belt transmission piece, which is partially accommodated in the wheel groove of the wheel groove piece, and the belt transmission piece has a first end connected with the driving element and a second end connected with the lifting unit; the driving element is used to drive the belt transmission piece to be wound or released along the wheel groove piece.

[0023] In some embodiments of the present application, a gear is further included, which is rotatably connected to the first supporting arm, and the gear has gear teeth extending in a circumferential direction;

[0024] The transmission member includes a gear, which is in meshing connection with the gear teeth of the gear, and a first end of the gear is connected to the driving element, and a second end of the gear is connected to the lifting unit; the driving element is used to drive the gear to be wound or released along the gear.

[0025] In some embodiments of the present application, a second nozzle is further included, which is connected to the first supporting arm and is arranged in a spaced manner with the first nozzle, and the second nozzle is used to spray the first fluid to the surface of the wafer.

[0026] In some embodiments of the present application, a second supporting arm is further included, and a third nozzle and / or a fourth nozzle are arranged on the second supporting arm, the third nozzle is used to spray a second fluid to the surface of the wafer, and the fourth nozzle is used to spray a third fluid to the surface of the wafer.

[0027] According to still another aspect of the present application, a wafer drying device is provided, which comprises:

[0028] A carrier is used to carry a wafer;

[0029] A fourth driving unit is used to drive the carrier to rotate;

[0030] The nozzle assembly of any one of the above is used to spray a fluid to the surface of the wafer.

[0031] The nozzle assembly and the wafer drying device of the present application can spray the first fluid to the surface of the wafer in an inclined manner through the nozzle part, the inclined airflow formed can guide the isopropyl alcohol to a specific direction to prevent the isopropyl alcohol from splashing back, and avoid the isopropyl alcohol from diffusing to the drying area to cause pattern collapse; in addition, the first driving unit can drive the lifting unit to lift to drive the nozzle part to move to change the bending angle, so as to adjust the spray angle of the nozzle part when spraying the first fluid to the surface of the wafer, by controlling the spray angle of the first fluid, the isopropyl alcohol liquid film can flow from one area to another area on the wafer surface, so as to control the thickness of the isopropyl alcohol liquid film. BRIEF DESCRIPTION OF DRAWINGS

[0032] The following drawings of the present application are used as a part of the present application to understand the present application. The drawings of the present application and the description thereof are used to explain the principle of the present application.

[0033] In the drawings:

[0034] Figure 1 A schematic diagram of drying a wafer in the related art is shown.

[0035] Figure 2 A schematic diagram showing that isopropanol diffused to the drying area due to nitrogen direct injection causing pattern collapse in the related art is shown.

[0036] Figure 3 A structural schematic diagram of a nozzle assembly of one specific embodiment of the present application is shown.

[0037] Figure 4 A principle diagram of the present application changing the spray angle when the nozzle part sprays the first fluid to the surface of the wafer is shown.

[0038] Figure 5 A schematic diagram of the present application driving the first support arm and the second support arm to rotate is shown.

[0039] Figure 6 A schematic diagram of the wafer drying device of the present application drying the wafer is shown.

[0040] In the drawings:

[0041] 111 first support arm;

[0042] 112 second support arm;

[0043] 121 first nozzle;

[0044] 1211 nozzle arm;

[0045] 1212 nozzle part;

[0046] 122 second nozzle;

[0047] 123 third nozzle;

[0048] 124 fourth nozzle;

[0049] 131 first ring;

[0050] 132 connecting piece;

[0051] 133 second ring;

[0052] 141 driving element;

[0053] 142 sprocket;

[0054] 143 chain;

[0055] 150 fixing piece;

[0056] 200 wafer. DETAILED DESCRIPTION

[0057] In the following description, numerous specific details are given to provide a thorough understanding of the application. However, it will be apparent that the application can be practiced without one or more of the specific details. In other instances, well-known

[0058] It should be understood that the application can be practiced with the elements in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and fully convey the scope of the application to those skilled in the art. In the drawings, the sizes and relative sizes of layers and regions can be exaggerated for clarity. Like reference numerals can denote like elements throughout.

[0059] It should be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or connected to the other element or layer or intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application.

[0060] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0061] The purpose of the terms used herein is only to describe specific embodiments and is not intended to limit the present invention. When used herein, the singular forms "a", "an" and "the" are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0062] like Figure 1 As shown, the drying process typically involves spraying deionized water onto the wafer surface using a deionized water nozzle and isopropyl alcohol onto the wafer surface using an isopropyl alcohol nozzle. The isopropyl alcohol, with its lower surface tension, displaces the deionized water on the wafer surface, removing moisture from the wafer surface. During this process, the isopropyl alcohol film on the wafer surface forms an undried area, while the evaporated isopropyl alcohol forms a dry area. As the isopropyl alcohol gradually evaporates, the dry area expands, ultimately completing the drying process for the entire wafer.

[0063] In the prior art, when an isopropyl alcohol nozzle is used to spray isopropyl alcohol onto the wafer surface, the nozzle's angular velocity remains constant, but as it moves toward the wafer edge, its linear velocity increases. This causes the thickness of the isopropyl alcohol film to become increasingly thin, easily causing splashing at the wafer edge. Therefore, a nitrogen nozzle is typically used to spray nitrogen directly onto the wafer surface to prevent isopropyl alcohol from splashing back.

[0064] However, the direct nitrogen injection method is also prone to cause isopropyl alcohol to splash back, and the splashed isopropyl alcohol diffuses into the drying area, causing the pattern to collapse (pattern collapse such as Figure 2 Moreover, it is difficult to control the thickness of the isopropyl alcohol liquid film by direct nitrogen injection.

[0065] In order to solve at least one of the above-mentioned technical problems, the present application provides a nozzle assembly for spraying fluid onto the surface of a wafer, the nozzle assembly comprising: a first support arm; a first nozzle, comprising a nozzle arm and a flexible nozzle portion, the nozzle arm being connected to the first support arm, the nozzle portion being arranged below the first support arm and connected to the nozzle arm, the nozzle portion being used to spray the first fluid obliquely onto the surface of the wafer; a lifting unit, connected to the nozzle portion; a first driving unit, connected to the lifting unit, for driving the lifting unit to rise and fall, the lifting unit driving the nozzle portion to move to change the bending angle.

[0066] According to the nozzle assembly of the present application, the first fluid is sprayed obliquely to the surface of the wafer by the nozzle part, and the formed oblique airflow can guide the isopropyl alcohol to a specific direction to prevent the isopropyl alcohol from splashing back, and avoid the isopropyl alcohol from diffusing to the drying area to cause pattern collapse; moreover, the first driving unit can drive the lifting unit to lift to drive the nozzle part to move to change the bending angle, so as to adjust the spraying angle of the nozzle part when spraying the first fluid to the surface of the wafer, and by controlling the spraying angle of the first fluid, the isopropyl alcohol liquid film can flow from one area to another area on the wafer surface, so as to control the thickness of the isopropyl alcohol liquid film.

[0067] In order to thoroughly understand the present application, detailed steps and structures will be presented in the following description in order to explain the technical solutions proposed by the present application. The preferred embodiments of the present application are described in detail as follows, however, in addition to these detailed descriptions, the present application can also have other implementation manners.

[0068] The following description will be made with reference to the drawings. Figures 3 to 5 A nozzle assembly according to an embodiment of the present application is described. The nozzle assembly is used to spray a fluid to the surface of a wafer 200, and the nozzle assembly comprises: a first support arm 111; a first nozzle 121 comprising a nozzle arm 1211 and a bendable nozzle part 1212, the nozzle arm 1211 is connected to the first support arm 111, and the nozzle part 1212 is arranged below the first support arm 111 and connected to the nozzle arm 1211, and the nozzle part 1212 is used to spray a first fluid obliquely to the surface of the wafer 200; a lifting unit connected to the nozzle part 1212; and a first driving unit connected to the lifting unit, used to drive the lifting unit to lift, and the lifting unit drives the nozzle part 1212 to move to change the bending angle.

[0069] Specifically, when preventing the isopropyl alcohol from splashing back by directly spraying the nitrogen, the impact direction of the nitrogen airflow is perpendicular to the surface of the wafer 200. If the speed and pressure of the nitrogen airflow are not properly controlled, the isopropyl alcohol being evaporated or flowing will be easily affected by this vertical and relatively strong reaction force when impacting the surface of the wafer 200, and this reaction force will cause the isopropyl alcohol to splash back, and the splashed-back isopropyl alcohol will diffuse to the drying area, which will affect the drying effect on the wafer 200.

[0070] In the present embodiment, the first fluid can be nitrogen or inert gas, etc., and is not limited to this. Taking the first fluid as nitrogen as an example, when spraying the isopropyl alcohol to the surface of the wafer 200 by the isopropyl alcohol nozzle, the bendable nozzle part 1212 of the first nozzle 121 is used to spray the nitrogen obliquely to the surface of the wafer 200, and the obliquely sprayed nitrogen forms an oblique airflow force on the surface of the wafer 200, and this oblique impact force can guide the isopropyl alcohol to a specific direction, instead of directly being vertically pushed back to splash back, so as to prevent the isopropyl alcohol from splashing back, avoid the isopropyl alcohol from diffusing to the drying area, and improve the drying effect on the wafer 200.

[0071] Moreover, the vertically sprayed nitrogen gas mainly acts vertically on the surface of the wafer 200, and has little effect on the horizontal distribution of the isopropyl alcohol liquid film on the surface of the wafer 200. The obliquely sprayed nitrogen gas can cause the isopropyl alcohol liquid film to flow directionally on the surface of the wafer 200. For example, by controlling the spray angle (denoted as θ in the figure, and referring to the angle between the spray direction of the nitrogen gas and the surface of the wafer 200) of the nitrogen gas, the isopropyl alcohol liquid film can be caused to flow from one region to another region on the surface of the wafer 200, so as to change the thickness distribution of the liquid film. Figure 3

[0072] Based on this, the present application provides a nozzle assembly capable of preventing isopropyl alcohol back-splashing and controlling the thickness of the isopropyl alcohol liquid film. The nozzle assembly of the present application obliquely sprays the first fluid from the nozzle part 1212 to the surface of the wafer 200, and the formed oblique airflow can guide the isopropyl alcohol to a specific direction to prevent isopropyl alcohol back-splashing, and avoid the isopropyl alcohol from diffusing to the drying region to cause pattern collapse. Moreover, the first driving unit can drive the lifting unit to lift and move the nozzle part 1212 to change the bending angle, so as to adjust the spray angle of the nozzle part 1212 when spraying the first fluid to the surface of the wafer 200. By controlling the spray angle of the first fluid, the isopropyl alcohol liquid film can be caused to flow from one region to another region on the surface of the wafer 200, so as to control the thickness of the isopropyl alcohol liquid film.

[0073] In some embodiments, the thickness of the isopropyl alcohol liquid film on the surface of the wafer 200 can be further controlled by controlling the flow of the first fluid sprayed by the nozzle part 1212.

[0074] In some embodiments, as shown in FIG. 1, one end of the nozzle arm 1211 is arranged on the first support arm 111, and the other end is connected to the nozzle arm 1211. The end of the nozzle arm 1211 arranged on the first support arm 111 can be connected to a first fluid supply device, and the first fluid supply device supplies the first fluid to the first nozzle 121, so that the nozzle part 1212 can obliquely spray the first fluid to the surface of the wafer 200. Figure 3

[0075] In some embodiments, the bendable nozzle part 1212 can be made of a flexible material, such as flexible plastic, flexible rubber, flexible composite material, etc., which is not limited.

[0076] In some embodiments, the lifting unit can include a connecting piece 132, and both ends of the connecting piece are respectively connected to the nozzle part 1212 and the first driving unit. The first driving unit is used to move the nozzle part 1212 through the connecting piece 132 to change the bending angle.

[0077] ​​The connecting member 132 is obliquely arranged, the connecting member 132, the horizontal direction and the vertical direction form a right triangle, the length of the hypotenuse of the right triangle is equal to the length of the connecting member 132, the length of the vertical side of the right triangle is equal to the vertical distance between the two ends of the connecting member 132, the length of the horizontal side of the right triangle is equal to the horizontal distance between the two ends of the connecting member 132, and the included angle between the horizontal side and the hypotenuse of the right triangle is the spray angle when the nozzle portion 1212 sprays the first fluid to the surface of the wafer 200. Therefore, the first driving unit can drive the connecting member 132 to move to change the oblique angle of the connecting member 132, and then change the included angle between the horizontal side and the hypotenuse of the right triangle, that is, change the spray angle when the nozzle portion 1212 sprays the first fluid to the surface of the wafer 200.

[0078] In some embodiments, the lifting unit can further include a movable member, one end of the connecting member 132 is connected to the first driving unit through the movable member, and the movable member is movable along the nozzle arm 1211; wherein the first driving unit is used to drive the movable member to ascend and descend along the nozzle arm 1211, and the movable member drives the nozzle portion 1312 to move to change the bending angle through the connecting member 132.

[0079] The movable member can be realized as the first annular member 131 or any other form of component capable of moving along the nozzle arm 1211, and is not limited. The connecting member 132 is obliquely arranged, the connecting member 132, the horizontal direction and the vertical direction form a right triangle, the length of the hypotenuse of the right triangle is equal to the length of the connecting member 132, the length of the vertical side of the right triangle is equal to the vertical distance between the end connected to the nozzle portion and the movable member of the connecting member 132, the length of the horizontal side of the right triangle is equal to the horizontal distance between the end connected to the nozzle portion and the movable member of the connecting member 132, and the included angle between the horizontal side and the hypotenuse of the right triangle is the spray angle when the nozzle portion 1212 sprays the first fluid to the surface of the wafer 200. Therefore, the first driving unit can drive the movable member to ascend and descend along the nozzle arm 1211 to drive the connecting member 132 to move, so as to change the oblique angle of the connecting member 132, and then change the included angle between the horizontal side and the hypotenuse of the right triangle, that is, change the spray angle when the nozzle portion 1212 sprays the first fluid to the surface of the wafer 200.

[0080] In some embodiments, as Figure 3As shown, the lifting unit may include: a first annular member 131, which is mounted on the nozzle arm 1211 and connected to the first driving unit; a connecting member 132; a second annular member 133, which is mounted on the nozzle part 1212 and connected to the first annular member 131 through the connecting member 132; wherein, the first driving unit is used to drive the first annular member 131 to rise and fall along the nozzle arm 1211, the first annular member 131 drives the second annular member 133 to rise and fall through the connecting member 132, and the second annular member 133 drives the nozzle part 1212 to change the bending angle.

[0081] Specifically, the principle of the lifting unit driving the nozzle portion 1212 to change the bending angle can be as follows: Figure 4 As shown, the connecting member 132 connecting the first annular member 131 and the second annular member 133 is arranged at an angle, and the connecting member 132, the horizontal direction and the vertical direction form a right triangle, the length of the hypotenuse of the right triangle is equal to the length of the connecting member 132 (which can be recorded as L), the length of the vertical side of the right triangle is equal to the vertical distance between the first annular member 131 and the second annular member 133 (which can be recorded as y), the length of the horizontal side of the right triangle is equal to the horizontal distance between the first annular member 131 and the second annular member 133, and the angle between the horizontal side and the hypotenuse of the right triangle is the spraying angle when the nozzle part 1212 sprays the first fluid onto the surface of the wafer 200.

[0082] Among them, such as Figure 4 As shown, when the length of the vertical side is equal to y1, the following formula exists:

[0083] y1=L×sinθ1

[0084] On the premise that y1 and L are known, the spraying angle θ1 at which the nozzle portion 1212 sprays the first fluid toward the surface of the wafer 200 can be calculated using this formula.

[0085] like Figure 4 As shown, when the first driving unit is used to drive the first annular member 131 to rise along the nozzle arm 1211 by a height d, the following formula exists:

[0086] y2=y1+d

[0087] y2=L×sinθ2

[0088] On the premise that y1, d and L are known, the formula can be used to calculate the spraying angle θ2 when the nozzle part 1212 sprays the first fluid toward the surface of the wafer 200.

[0089] Thus, in the embodiment, the first driving unit is controlled to drive the first annular member 131 to ascend or descend along the nozzle arm 1211, so as to control the spray angle of the nozzle part 1212 when spraying the first fluid to the surface of the wafer 200, and then the nitrogen gas is sprayed at the spray angle, so as to control the thickness distribution of the isopropyl alcohol liquid film on the wafer 200.

[0090] In some embodiments, as shown in FIG. 1, the apparatus further comprises a fixing member 150 arranged on the nozzle arm 1211, and a plurality of clamping grooves are arranged on the fixing member 150 in the height direction, and the first driving unit is used to drive the movable member to ascend or descend and be clamped in one of the clamping grooves. Figure 3

[0091] Specifically, the plurality of buckles arranged on the fixing member 150 can play the role of scale lines, the first driving unit drives the movable member to ascend or descend and be clamped in one of the clamping grooves, so as to control the height of the movable member ascending along the nozzle arm 1211, and then control the spray angle of the nozzle part 1212 when spraying the first fluid to the surface of the wafer 200.

[0092] In some embodiments, the movable member can be clamped in the clamping groove in various ways, for example, buckles can be arranged on the movable member, the movable member is clamped in the clamping groove through the buckles, or the movable member can be directly clamped in the clamping groove by itself, or can be clamped in the clamping groove by other suitable ways, which are not limited.

[0093] In some embodiments, the first driving unit can comprise: a driving element 141 arranged on the first support arm 111; a transmission member, the first end of the transmission member is connected to the driving element 141, and the second end is connected to the lifting unit; the driving element 141 is used to drive the transmission member to wind or release, and the transmission member drives the lifting unit to ascend or descend through winding or releasing of itself.

[0094] In some embodiments, the driving unit can be a motor, a hydraulic motor, etc., which are not limited. Taking the motor as an example, the number of revolutions of the motor can be controlled to control the ascending or descending height of the lifting unit, and then control the spray angle of the nozzle part 1212 when spraying the first fluid to the surface of the wafer 200.

[0095] The transmission member can be a belt transmission member, a gear transmission member or other transmission elements that can wind or release, which are not limited.

[0096] ​Exemplarily, the transmission member includes a tooth transmission member meshingly connected with the gear teeth of the gear member, and a first end of the tooth transmission member is connected with the driving element 141 and a second end of the tooth transmission member is connected with the lifting unit; the driving element 141 is configured to drive the tooth transmission member to wind up or release along the gear member.

[0097] Specifically, the gear member can be arranged on the first support arm 111 through a rotating shaft or the like. When it is necessary to adjust the spray angle of the nozzle portion 1212 when spraying the first fluid to the surface of the wafer 200, the tooth transmission member can be driven to wind up or release along the gear member by the driving element 141, the lifting unit is driven to lift by the winding up or releasing of the tooth transmission member, and the nozzle portion 1212 is driven to move to change the bending angle, so as to change the spray angle of the nozzle portion 1212 when spraying the first fluid to the surface of the wafer 200.

[0098] The gear member can be implemented as a sprocket 142, the tooth transmission member can be implemented as a chain 143, or the gear member and the tooth transmission member can also be implemented as other any suitable components for achieving transmission through tooth meshing connection, which is not limited. Figure 3 The gear member can be implemented as a sprocket 142, the tooth transmission member can be implemented as a chain 143, or the gear member and the tooth transmission member can also be implemented as other any suitable components for achieving transmission through tooth meshing connection, which is not limited. Figure 3 The gear member can be implemented as a sprocket 142, the tooth transmission member can be implemented as a chain 143, or the gear member and the tooth transmission member can also be implemented as other any suitable components for achieving transmission through tooth meshing connection, which is not limited.

[0099] Exemplarily, the transmission member includes a belt transmission member partially accommodated in the wheel groove of the wheel groove member, and a first end of the belt transmission member is connected with the driving element and a second end of the belt transmission member is connected with the lifting unit; the driving element is configured to drive the belt transmission member to wind up or release along the wheel groove member.

[0100] Specifically, the wheel groove member can be arranged on the first support arm 111 through a rotating shaft or the like. When it is necessary to adjust the spray angle of the nozzle portion 1212 when spraying the first fluid to the surface of the wafer 200, the belt transmission member can be driven to wind up or release along the wheel groove member by the driving element 141, the lifting unit is driven to lift by the winding up or releasing of the belt transmission member, and the nozzle portion 1212 is driven to move to change the bending angle, so as to change the spray angle of the nozzle portion 1212 when spraying the first fluid to the surface of the wafer 200.

[0101] The wheel groove member can be implemented as a belt wheel, the belt transmission member can be implemented as a transmission belt, or the wheel groove member and the belt transmission member can also be implemented as other any suitable components for achieving transmission through cooperation of the belt and the wheel groove, which is not limited.

[0102] In some embodiments, as shown in FIG. 1, the first support arm 111 is arranged on the first support frame 110, and the second support arm 112 is arranged on the second support frame 120. Figure 3As shown, the second nozzle 122 is connected to the first support arm 111 and is arranged apart from the first nozzle 121, and the second nozzle 122 is used to spray the first fluid to the surface of the wafer 200.

[0103] The second nozzle 122 arranged at one end of the first support arm 111 can be connected to the first fluid supply device, and the first fluid is supplied to the second nozzle 122 through the first fluid supply device, so that the second nozzle 122 can spray the first fluid to the surface of the wafer 200.

[0104] In some embodiments, as Figure 3 As shown, the second support arm 112 is arranged with the third nozzle 123 and / or the fourth nozzle 124, the third nozzle 123 is used to spray the second fluid to the surface of the wafer 200, and the fourth nozzle 124 is used to spray the third fluid to the surface of the wafer 200. The second fluid can be isopropyl alcohol or other liquid with smaller surface tension than the third fluid, and the third fluid can be deionized water, ultrapure water, etc., which is not limited.

[0105] In related technologies, as Figure 1 As shown, the deionized water nozzle, the nitrogen gas nozzle and the isopropyl alcohol nozzle are arranged on the same support arm in sequence, and the deionized water nozzle is closer to the center of the wafer 200 than the isopropyl alcohol nozzle. Because the deionized water nozzle has a stealing phenomenon, and because the deionized water nozzle is closer to the center of the wafer 200 than the isopropyl alcohol nozzle, the stolen deionized water falls in the drying area, which affects the drying effect of the wafer 200.

[0106] Taking the second fluid as isopropyl alcohol and the third fluid as deionized water as an example, in the embodiment, the first nozzle 121 and the second nozzle 122 for spraying nitrogen are arranged on the first support arm 111, and the third nozzle 123 for spraying isopropyl alcohol and the fourth nozzle 124 for spraying deionized water are arranged on the second support arm 112, so that even if the fourth nozzle 124 has a stealing phenomenon, the stolen deionized water falls in the undried area, and will be volatilized with the isopropyl alcohol in the undried area subsequently, so as not to affect the drying effect of the drying area and the wafer 200.

[0107] In some embodiments, a second driving unit is further included, which is connected to the first support arm 111 and is used to drive the first support arm 111 to rotate; and a third driving unit is further included, which is connected to the second support arm 112 and is used to drive the second support arm 112 to rotate.

[0108] As Figure 5As shown, by driving the first support arm 111 to rotate through the second driving unit, the first nozzle 121 and the second nozzle 122 on the first support arm 111 can be further driven to move from the center of the wafer 200 to the edge of the wafer 200 constantly, and similarly, by driving the second support arm 112 to rotate through the third driving unit, the third nozzle 123 and the fourth nozzle 124 on the second support arm 112 can be further driven to move from the center of the wafer 200 to the edge of the wafer 200 constantly, so as to dry the wafer 200 gradually along the direction from the center of the wafer 200 to the edge of the wafer 200.

[0109] The second driving unit and the third driving unit can be motor driving units, hydraulic motor driving units, etc., and are not limited in this regard.

[0110] According to yet another aspect of the present application, a wafer drying device is provided, which comprises: a carrier for carrying a wafer 200; a fourth driving unit for driving the carrier to rotate; and a nozzle assembly for spraying fluid to the surface of the wafer 200.

[0111] The nozzle assembly can be implemented as the nozzle assembly described above, and reference can be made to the description above, which will not be repeated here.

[0112] Specifically, as shown, Figure 6 after the wafer 200 is placed on the carrier, the carrier can be driven to rotate through the fourth driving unit, so as to drive the wafer 200 on the carrier to rotate. During the rotation of the wafer 200, fluid can be sprayed to the surface of the wafer 200 through the nozzle assembly, so as to dry the wafer 200.

[0113] The fourth driving unit can be a motor driving unit, a hydraulic motor driving unit, etc., and is not limited in this regard.

[0114] In summary, according to the nozzle assembly and the wafer drying device of the embodiments of the present application, the first fluid is sprayed obliquely to the surface of the wafer through the nozzle part, and the oblique airflow formed can guide the isopropyl alcohol to a specific direction to prevent the isopropyl alcohol from splashing back, and avoid the isopropyl alcohol from diffusing to the drying area to cause pattern collapse; moreover, the first driving unit can drive the lifting unit to lift to drive the nozzle part to move to change the bending angle, so as to adjust the spray angle of the nozzle part when spraying the first fluid to the surface of the wafer, and by controlling the spray angle of the first fluid, the isopropyl alcohol liquid film can flow from one area to another area on the wafer surface, so as to control the thickness of the isopropyl alcohol liquid film.

[0115] While example embodiments have been described herein with reference to the accompanying drawings, it is to be understood that the example embodiments are intended to be illustrative only and not limiting of the scope of the application. Numerous variations and modifications will become apparent to those skilled in the art once the above description is fully appreciated. It is intended that the scope of the application encompass such variations and modifications as long as the essential features of the application are maintained. All such modifications and variations are intended to be within the scope of the application as claimed.

[0116] Similarly, it is to be understood that the various features of the application described herein are sometimes grouped together in a single embodiment, figure or description of a related aspect of the application for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various aspects of the application. This method of disclosure, however, is not to be interpreted as reflecting an intention that the application requires more features than are explicitly recited in each claim. Rather, inventive aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim acting as a separate embodiment of the application.

[0117] Furthermore, those skilled in the art will recognize that boundaries between the functionality of the above described embodiments are merely illustrative and that the functionality of each can be combined in a single embodiment and / or distributed in additional embodiments. Accordingly, it is intended that the scope of the application encompass all such variations and modifications as falling within the scope of the application. Thus, the application is not to be limited by the foregoing description, but is instead to be defined in accordance with the following claims, including any amendments thereto, and all equivalents thereof.

[0118] It is noted that the foregoing examples have been described by way of illustration only and not limitation and that alterations and modifications to the examples as described will become apparent to those skilled in the art without departing from the scope of the application as defined by the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The use of the words "first", "second", and the like do not imply any order but are used for naming purposes only.

Claims

1. A nozzle assembly for spraying fluid onto a surface of a wafer, characterized in that: The nozzle assembly comprises: a first support arm; a first nozzle comprising a nozzle arm connected to the first support arm and a bendable nozzle portion disposed below the first support arm and connected to the nozzle arm, the nozzle portion being used to spray a first fluid obliquely to the surface of the wafer; a lifting unit connected to the nozzle portion; a first driving unit connected to the lifting unit and used to drive the lifting unit to lift, the lifting unit driving the nozzle portion to move to change a bending angle.

2. The nozzle assembly of claim 1, wherein, The lifting unit comprises: a connecting piece, two ends of the connecting piece being connected to the nozzle portion and the first driving unit respectively; wherein the first driving unit is used to drive the nozzle portion to move through the connecting piece to change the bending angle.

3. The nozzle assembly of claim 2, wherein, The lifting unit further comprises: a movable piece, one end of the connecting piece being connected to the first driving unit through the movable piece, the movable piece being movable along the nozzle arm; wherein the first driving unit is used to drive the movable piece to lift along the nozzle arm, the movable piece driving the nozzle portion to move through the connecting piece to change the bending angle.

4. The nozzle assembly of claim 3, wherein, Further comprising a fixing piece disposed on the nozzle arm, a plurality of clamping grooves being disposed on the fixing piece in a height direction, the first driving unit being used to drive the movable piece to lift to be clamped in one of the clamping grooves.

5. The nozzle assembly of claim 1, wherein, The first driving unit comprises: a driving element disposed on the first support arm; a transmission piece, a first end of the transmission piece being connected to the driving element and a second end of the transmission piece being connected to the lifting unit; the driving element being used to drive the transmission piece to wind or release, the transmission piece driving the lifting unit to lift through winding or releasing of the transmission piece itself.

6. The nozzle assembly of claim 5, wherein, Further comprising a wheel groove piece rotatably connected to the first support arm, the wheel groove piece having a wheel groove extending in a circumferential direction; the transmission piece comprising a belt transmission piece, the belt transmission piece being partially accommodated in the wheel groove of the wheel groove piece, and a first end of the belt transmission piece being connected to the driving element and a second end of the belt transmission piece being connected to the lifting unit; the driving element being used to drive the belt transmission piece to wind or release along the wheel groove piece.

7. The nozzle assembly of claim 5, wherein, Further comprising a wheel tooth piece rotatably connected to the first support arm, the wheel tooth piece having a wheel tooth extending in a circumferential direction; the transmission piece comprising a tooth transmission piece, the tooth transmission piece being meshingly connected to the wheel tooth of the wheel tooth piece, and a first end of the tooth transmission piece being connected to the driving element and a second end of the tooth transmission piece being connected to the lifting unit; the driving element being used to drive the tooth transmission piece to wind or release along the wheel tooth piece.

8. The nozzle assembly of claim 1, wherein, Further comprising a second nozzle, the second nozzle being connected to the first support arm and disposed in a spaced manner with the first nozzle, the second nozzle being used to spray the first fluid to the surface of the wafer.

9. The nozzle assembly of claim 1, wherein, Further comprising a second support arm, the second support arm being provided with a third nozzle and / or a fourth nozzle, the third nozzle being used to spray a second fluid to the surface of the wafer, and the fourth nozzle being used to spray a third fluid to the surface of the wafer.

10. A wafer drying apparatus characterized by comprising: The wafer drying device comprises: a bearing piece used to bear a wafer; a fourth driving unit used to drive the bearing piece to rotate; A nozzle assembly as claimed in any one of claims 1 to 9 for ejecting fluid towards a surface of the wafer.

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