Die for manufacturing semiconductor lead frame

Abstract

The utility model provides a die for manufacturing a semiconductor lead frame, and belongs to the technical field of die manufacturing. The mold for manufacturing the semiconductor lead frame comprises a lower mold base and a force application impurity removing mechanism, an upper mold base is installed at the top of the lower mold base, assembling plates are installed on the outer sides of the upper mold base and the lower mold base, an impurity removing frame is fixedly connected to the left sides of the bottoms of the inner sides of the assembling plates, and an impurity removing plate is movably connected to the top of the impurity removing frame; the impurity removing cotton is movably connected to the inner side of the impurity removing frame and the inner side of the impurity removing plate, and by arranging the force applying impurity removing mechanism, dirt particles attached to the upper surface and the lower surface of a semiconductor lead frame material body can be wiped and cleaned before the external semiconductor lead frame material body enters the space between the upper die base and the lower die base; the situation that dirt particles enter the space between the upper die base and the lower die base along with the semiconductor lead frame material body to affect the force application machining effect is avoided, and therefore the force application forming effect and the impurity removing effect of the upper die base are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to manufacturing mould technical field, specifically, relate to a mould for manufacturing semiconductor lead frame. BACKGROUND

[0002] Semiconductor lead frame is a kind of key assembly for connecting semiconductor chip and external circuit, usually including lead frame and package, in order to manufacture high-quality semiconductor lead frame, need to use high-precision mould, metal material is formed into the basic shape of lead frame by stamping process, mould is divided into upper die and lower die, is responsible for the cutting and forming of material respectively, the design of mould needs to be accurately manufactured according to the shape and requirement of product, guiding column is installed between upper die and lower die, ensure that upper and lower moulds keep good alignment during stamping process, to avoid deviation and the generation of defective products, since upper die and lower die are actually contacted with semiconductor lead frame material body and pressurized when working, therefore, it is necessary to clean the dirt particles attached to the surface of material body.

[0003] In related art, in the process of using semiconductor lead frame mould, the semiconductor lead frame material body is moved to the upper die and the lower die by the traction device, and then the upper die is driven to move downward by the power source to apply pressure to the material, so that the semiconductor lead frame material body is formed on the lower die, thereby being used.

[0004] However, in the process of using semiconductor lead frame mould at present, dirt particles can be carried on the surface of the material body when it is moved into the upper die and the lower die, and when the dirt particles are affected by the stamping force of the upper die and the lower die, grooves can be formed on the surface of the semiconductor lead frame material body and the upper die and the lower die, which can cause defects in the semiconductor lead frame material body, and affect the force forming effect and the impurity removal effect in the mould processing process. UTILITY MODEL CONTENTS

[0005] In order to make up for the above shortcomings, the utility model provides a mould for manufacturing semiconductor lead frame to overcome the above technical problems or at least partially solve the above problems.

[0006] The utility model is implemented as follows:

[0007] The utility model provides a mould for manufacturing semiconductor lead frame, including lower die seat, the top of lower die seat is installed with upper die seat, the outside of upper die seat and lower die seat is installed with assembly plate respectively;

[0008] Force applying and impurity removing mechanism, the force applying and impurity removing mechanism includes:

[0009] Impurity removing frame;The left side of impurity removing frame fixedly connected in the bottom of the inner side of assembly plate is movably connected with impurity removing plate on the top of impurity removing frame;

[0010] The clean cotton is movably connected to the inner side of the clean frame and the clean plate respectively, and the left side of the clean frame is movably connected with the clean box.

[0011] The clean pressing mechanism is fixedly connected to the two sides of the clean frame.

[0012] In a preferred scheme, the clean pressing mechanism comprises a pressing seat, a pressing disc and a spring, the pressing seat is fixedly connected to the two sides of the clean frame, the pressing disc is movably connected to the bottom of the pressing seat, and the spring is arranged on the two sides of the clean frame, and the outer side of the spring is connected with the inner side of the pressing seat and the pressing disc.

[0013] In a preferred scheme, the top of the pressing seat is provided with a connecting hole, the inner side of the connecting hole is movably connected with a connecting frame, and the inner side of the connecting frame is fixedly connected with the outer side of the clean plate.

[0014] In a preferred scheme, the bottom of the connecting frame is provided with a screw groove, a screw column is screw-connected in the screw groove, and the bottom of the screw column is fixedly connected with the top of the pressing disc.

[0015] In a preferred scheme, the left side of the clean frame and the clean plate is movably connected with a clean plate, and the right side of the outer side of the clean plate is fixedly connected with a lifting frame.

[0016] In a preferred scheme, the left side of the clean plate and the clean frame is fixedly connected with a lifting seat, the left side of the inner side of the lifting seat is provided with a lifting hole, and the lifting frame is located in the inner side of the lifting hole.

[0017] In a preferred scheme, the right side of the outer side of the clean plate is provided with a pushing groove located on the outer side of the lifting frame, a pushing spring is arranged in the pushing groove, one end of the pushing spring is connected with the pushing groove, and the other end of the pushing spring is connected with the lifting seat.

[0018] In a preferred scheme, the right side of the clean box is fixedly connected with a magnetic embedding seat located on the inner side of the clean frame, and the bottom of the inner side of the clean frame is inlaidly connected with a magnetic block magnetically connected with the magnetic embedding seat.

[0019] The mold for manufacturing the semiconductor lead frame has the following beneficial effects:

[0020] 1. The force applying and cleaning mechanism can wipe and clean the dirt particles attached to the upper and lower surfaces of the semiconductor lead frame before the semiconductor lead frame enters between the upper die seat and the lower die seat, so that the dirt particles do not enter between the upper die seat and the lower die seat with the semiconductor lead frame, and the force forming effect and the cleaning effect of the upper die seat are improved.

[0021] 2. By setting the impurity removing down pressing mechanism, the downward pressure can be applied to the impurity removing plate to make the impurity removing cotton fully contact with the semiconductor lead frame material, avoiding the situation that the impurity removing cotton is difficult to fully contact with the semiconductor lead frame material for wiping and cleaning, thus improving the contact cleaning effect of the impurity removing cotton.

[0022] 3. By setting the connecting hole and the connecting frame, the force connecting work between the down pressing disc and the impurity removing plate can be performed, avoiding the situation that the down pressing disc is difficult to connect with the impurity removing plate for force application, thus improving the down pressing force application effect of the down pressing disc. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows, and it should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation to the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of the drawings.

[0024] Figure 1 is the overall perspective view provided by the embodiments of the present application;

[0025] Figure 2 is the right view perspective structure schematic diagram of the impurity removing frame provided by the embodiments of the present application;

[0026] Figure 3 is the impurity removing plate perspective cross-section structure schematic diagram provided by the embodiments of the present application;

[0027] Figure 4 is the down pressing seat perspective cross-section structure schematic diagram provided by the embodiments of the present application;

[0028] In the figure: 1, lower die seat; 2, upper die seat; 3, assembling plate; 4, impurity removing frame; 5, impurity removing plate; 6, impurity removing cotton; 7, impurity collecting box; 8, down pressing seat; 9, down pressing disc; 10, spring; 11, connecting hole; 12, connecting frame; 13, screw groove; 14, stud; 15, impurity removing plate; 16, lifting frame; 17, lifting seat; 18, lifting hole; 19, pushing groove; 20, pushing spring; 21, embedded magnetic seat; 22, magnetic block. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical scheme and advantages of the utility model embodiment clearer, the technical scheme in the utility model embodiment will be clearly and completely described below in combination with the drawings in the utility model embodiment. Obviously, the described embodiment is part of the utility model, rather than all the embodiments. Based on the embodiment in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model.

[0030] With reference to Figures 1-4 The utility model provides a kind of technical scheme: a mould for manufacturing semiconductor lead frame, including lower die seat 1 and force cleaning mechanism, the top of lower die seat 1 is equipped with upper die seat 2, and upper die seat 2 and the outside of lower die seat 1 are all equipped with assembly plate 3, can be before outside semiconductor lead frame material enters between upper die seat 2 and lower die seat 1, the dirt particle adhered on the upper and lower surfaces of semiconductor lead frame material is wiped and cleaned, avoid the dirt particle with semiconductor lead frame material enters between upper die seat 2 and lower die seat 1 influence force processing effect condition, therefore, it improves the force forming effect and the effect of removing impurities of upper die seat 2.

[0031] With reference to Figures 1-4 In a preferred embodiment, the force cleaning mechanism includes a cleaning frame 4, which is fixedly connected to the left side of the inner bottom of the assembly plate 3. A cleaning plate 5 is movably connected to the top of the cleaning frame 4. Cleaning cotton 6 is movably connected to the inner side of the cleaning frame 4 and the cleaning plate 5. A cleaning collection box 7 is movably connected to the left side of the cleaning frame 4. A cleaning down-pressure mechanism is fixedly connected to both sides of the cleaning frame 4. Before the external semiconductor lead frame material enters between the upper die seat 2 and the lower die seat 1, the cleaning plate 5 drives the cleaning cotton to move downward, and applies a force to the semiconductor lead frame material that is in contact with the cleaning cotton 6 at the top of the cleaning frame 4. The cleaning cotton 6 is in contact with the upper and lower surfaces of the semiconductor lead frame material. As the semiconductor lead frame material moves, the cleaning cotton 6 wipes and cleans the impurities. At the same time, the cleaning collection box 7 collects the impurity particles that are wiped and cleaned by the cleaning cotton 6. The cleaning down-pressure mechanism includes a down-pressure seat 8, a down-pressure disc 9, and a spring 10. The down-pressure seat 8 is fixedly connected to both sides of the cleaning frame 4. The down-pressure disc 9 is movably connected to the bottom of the down-pressure seat 8. The spring 10 is arranged on both sides of the cleaning frame 4. The outer side of the spring 10 is connected to the inner side of the down-pressure seat 8 and the down-pressure disc 9. The spring 10 can apply a downward pressure to the cleaning plate 5 to make the cleaning cotton 6 fully contact the external semiconductor lead frame material. This avoids the situation that the cleaning cotton 6 is difficult to fully contact the semiconductor lead frame material for wiping and cleaning during use. Therefore, the contact cleaning effect of the cleaning cotton 6 is improved.

[0032] With reference to Figures 2-4In a preferred embodiment, the connecting hole 11 is arranged on the top of the pressing seat 8, the connecting frame 12 is movably connected inside the connecting hole 11, the inner side of the connecting frame 12 is fixedly connected with the outer side of the cleaning plate 5, the pressing disc 9 and the cleaning plate 5 can be connected and forced, the pressing disc 9 can be prevented from being difficult to connect and force with the cleaning plate 5 during use, and thus the pressing effect of the pressing disc 9 is improved. The screw groove 13 is arranged at the bottom of the connecting frame 12, the threaded stud 14 is threadedly connected inside the screw groove 13, and the bottom of the threaded stud 14 is fixedly connected with the top of the pressing disc 9. The pressing disc 9 and the connecting frame 12 can be connected, and the pressing disc 9 can be prevented from being separated from the connecting frame 12 during use, and thus the connection effect of the pressing disc 9 and the connecting frame 12 is improved.

[0033] Referring to Figures 2-3 In a preferred embodiment, the scrap plate 15 is movably connected to the left side of the cleaning frame 4 and the cleaning plate 5, the lifting frame 16 is fixedly connected to the right side of the outer side of the scrap plate 15, the dirt particles attached to the upper and lower surfaces of the semiconductor lead frame material can be scraped and removed before the cleaning cotton 6 is used for wiping and cleaning, the subsequent cleaning work of the semiconductor lead frame material by the cleaning cotton 6 is facilitated, and thus the cleaning effect of the cleaning cotton 6 is improved. The lifting seat 17 is fixedly connected to the left side of the cleaning plate 5 and the cleaning frame 4, the lifting hole 18 is arranged in the left side of the lifting seat 17, and the lifting frame 16 is located inside the lifting hole 18. The lifting frame 16 is provided with a medium for lifting connection between the cleaning plate 5 and the cleaning frame 4, and thus the lifting connection effect of the lifting frame 16 is improved.

[0034] Referring to Figures 2-3 In a preferred embodiment, the push groove 19 is arranged on the right side of the outer side of the scrap plate 15 and located on the outer side of the lifting frame 16, the push spring 20 is arranged inside the push groove 19, one end of the push spring 20 is connected with the push groove 19, and the other end of the push spring 20 is connected with the lifting seat 17. The lifting seat 17 can apply a pushing force to the scrap plate 15 to contact the semiconductor lead frame material, the scrap plate 15 can be prevented from being difficult to contact and scrape the semiconductor lead frame material during use, and thus the scraping effect of the scrap plate 15 is improved. The embedded magnetic seat 21 is fixedly connected to the inner side of the cleaning frame 4 on both sides of the right side of the collection box 7, the magnetic block 22 is inlaidly connected to the inner side of the bottom of the cleaning frame 4 and magnetically connected with the embedded magnetic seat 21. The collection box 7 and the cleaning frame 4 can be connected and magnetically positioned, the collection box 7 can be prevented from being deviated during use, and thus the use stability of the collection box 7 is improved.

[0035] Specifically, the working process or working principle of the mold for manufacturing a semiconductor lead frame is as follows: when the upper die holder 2 and the lower die holder 1 are connected with the external punch through the assembling plate 3, the cleaning plate 5 is first moved upward by hand, at this time, the cleaning plate 5 is lifted through the lifting frame 16 and the lifting seat 17, and then the semiconductor lead frame material is held by hand and moved between the cleaning cotton 6 inside the cleaning plate 5 and the cleaning frame 4 and the scraping plate 15, so as to prepare for the subsequent scraping plate 15 and the cleaning cotton 6 to clean the surface of the semiconductor lead frame material, in this process, the connecting frame 12 moves inside the connecting hole 11 to connect the lifting work between the lower pressing disc 9 and the cleaning plate 5, at this time, the spring 10 is affected by the lifting force of the lower pressing disc 9 and enters the groove inside the lower pressing seat 8 and the lower pressing disc 9, at the same time, the screw column 14 cooperates with the screw groove 13 to connect the lower pressing disc 9 and the connecting frame 12, and then the semiconductor lead frame material is moved between the upper die holder 2 and the lower die holder 1, and the semiconductor lead frame material is connected with the external traction device, when the position of the semiconductor lead frame material is adjusted, the cleaning plate 5 is slowly moved downward, so that the cleaning cotton 6 between the cleaning plate 5 and the cleaning frame 4 contacts the semiconductor lead frame material, at this time, the push spring 20 applies a pushing force to the scraping plate 15 through the push groove 19 and the lifting seat 17, so that the scraping plate 15 on both sides of the semiconductor lead frame material contacts the semiconductor lead frame material, at the same time, the lifting frame 16 moves inside the lifting hole 18 to connect the lifting work of the scraping plate 15, and then the collecting box 7 is held by hand and moved to the inside of the cleaning frame 4 to contact the magnetic block 22, so as to magnetically connect the collecting box 7 and the cleaning frame 4, when the semiconductor lead frame material is moved by the external traction device and the punch work is carried out between the upper die holder 2 and the lower die holder 1, the scraping plate 15 first scrapes and cleans the dirt particles attached to the upper and lower surfaces of the semiconductor lead frame material, the semiconductor lead frame material after being scraped and cleaned by the scraping plate 15 enters the inside of the cleaning cotton 6, at this time, the cleaning cotton 6 wipes and cleans the upper and lower surfaces of the semiconductor lead frame material, at the same time, the collecting box 7 receives and collects the dirt particles cleaned by the scraping plate 15 and the cleaning cotton 6, since the cleaning cotton 6 is connected with the cleaning plate 5 and the cleaning frame 4 through the magic tape, when the cleaning cotton 6 needs to be replaced, the cleaning cotton 6 can be separated from the cleaning plate 5 and the cleaning frame 4 for replacement.

Claims

1. A mold for manufacturing a semiconductor lead frame, comprising a lower mold base (1), a top of the lower mold base (1) is mounted with an upper mold base (2), the upper mold base (2) and the outer side of the lower mold base (1) are each mounted with an assembling plate (3), characterized in that ； The force applying and impurity removing mechanism comprises: An impurity removing frame (4) is fixedly connected to the left bottom inside of the assembling plate (3), and the top of the impurity removing frame (4) is movably connected with an impurity removing plate (5); An impurity removing cotton (6) is movably connected to the inside of the impurity removing frame (4) and the impurity removing plate (5) respectively, and the left side of the impurity removing frame (4) is movably connected with an impurity collecting box (7); An impurity removing and pressing mechanism is fixedly connected to the two sides of the impurity removing frame (4).

2. A mold for manufacturing a semiconductor lead frame according to claim 1, wherein The impurity removing and pressing mechanism comprises a pressing seat (8), a pressing disc (9) and a spring (10), the pressing seat (8) is fixedly connected to the two sides of the impurity removing frame (4), the pressing disc (9) is movably connected to the bottom of the pressing seat (8), and the spring (10) is arranged on the two sides of the impurity removing frame (4), and the outside of the spring (10) is connected with the inside of the pressing seat (8) and the pressing disc (9).

3. A mold for manufacturing a semiconductor lead frame according to claim 2, wherein A connecting hole (11) is formed in the top of the pressing seat (8), a connecting frame (12) is movably connected in the connecting hole (11), and the inside of the connecting frame (12) is fixedly connected with the outside of the impurity removing plate (5).

4. A mold for manufacturing a semiconductor lead frame according to claim 3, wherein A screw groove (13) is formed in the bottom of the connecting frame (12), a stud (14) is screwedly connected in the screw groove (13), and the bottom of the stud (14) is fixedly connected with the top of the pressing disc (9).

5. The mold for manufacturing a semiconductor lead frame according to claim 1, wherein A scraping plate (15) is movably connected to the left side of the impurity removing frame (4) and the impurity removing plate (5), and the right side of the outside of the scraping plate (15) is fixedly connected with a lifting frame (16).

6. A mold for manufacturing a semiconductor lead frame according to claim 5, wherein A lifting seat (17) is fixedly connected to the left side of the impurity removing plate (5) and the impurity removing frame (4), a lifting hole (18) is formed in the left side of the inside of the lifting seat (17), and the lifting frame (16) is located in the inside of the lifting hole (18).

7. A mold for manufacturing a semiconductor lead frame according to claim 6, wherein A pushing groove (19) is formed in the right side of the outside of the scraping plate (15) and located outside the lifting frame (16), a pushing spring (20) is arranged in the inside of the pushing groove (19), one end of the pushing spring (20) is connected with the pushing groove (19), and the other end of the pushing spring (20) is connected with the lifting seat (17).

8. The mold for manufacturing a semiconductor lead frame according to claim 1, wherein A magnetic embedding seat (21) is fixedly connected to the inside of the impurity removing frame (4) on the two sides of the right side of the impurity collecting box (7), and a magnetic block (22) is inlaidly connected to the bottom of the inside of the impurity removing frame (4) and magnetically connected with the magnetic embedding seat (21).

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