Thickness positioning and grinding device
By designing a thickness positioning grinding device, and utilizing the cooperation of a limiting groove and a clamping rod, precise thickness control of the sample is achieved, solving the problem of difficult thickness control in existing technologies, and improving grinding accuracy and operational flexibility.
Patent Information
- Application Number
- CN202423010565.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-12-06
AI Technical Summary
Existing technologies make it difficult to accurately control the thickness when grinding samples, especially for samples with specific observation targets or thickness requirements. They cannot effectively determine the thickness to be ground off, which can easily lead to too much or too little thickness, failing to meet the precise observation needs.
A thickness positioning grinding device was designed, comprising a fixed plate, a limiting cylinder, a top rod, a clamping rod, an observation scale plate, and a grinding mechanism. The device achieves precise thickness control of the sample by means of the sight groove and adjusting screw on the observation scale plate. The limiting groove and clamping rod work together to push the load-bearing plate and the limiting sleeve plate to move, thereby driving the top rod to rise and fall, achieving grinding at different heights.
It achieves precise control of thickness during the grinding process, is flexible in operation, can confirm the current thickness by observing the scale plate, adapts to the needs of samples of different heights, and improves grinding accuracy and flexibility.
Smart Images
Figure CN223455727U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to polishing technical field especially, relates to a thickness positioning polishing device. BACKGROUND
[0002] The polishing sample is often used for metallographic microscopic analysis or SEM sample preparation technology by using the grinding and polishing machine, and the conventional method is to cut the large sample to the observation target first, even the distance is larger, then the resin embedding is utilized, and the grinding and polishing machine is used for polishing, and the observation is carried out after polishing finally, but for the sample with specified observation target or thickness requirement, the observation control is not easy.
[0003] When polishing, the target position is too far from the sample surface, and some thickness needs to be polished, and the sample with structure can judge the thickness of the grinding according to the structure, and stops when the distance from the target position is a certain distance, if there is no structure, it is not easy to judge how much thickness is polished, and the thickness may be too much or the polishing thickness is excessive, based on this, a thickness positioning polishing device is provided. UTILITY MODEL CONTENT
[0004] In order to solve the technical problem of polishing distance marking in the polishing process, the utility model provides a thickness positioning polishing device.
[0005] The utility model adopts the following technical scheme: a thickness positioning polishing device, including fixed plate the upper side of fixed plate is connected with the limiting cylinder, the limiting groove is opened in the limiting cylinder, the inside of limiting cylinder is connected with the jackscrew of sliding, the lower extreme of jackscrew is connected with the clamping rod of fixed connection, the one end of clamping rod is connected with the observation scale board of fixed connection, the upper end of jackscrew is provided with installation fixed mechanism, one side of fixed plate is connected with the connecting plate of fixed connection, the upper side of connecting plate is provided with the jackscrew drive mechanism that makes the jackscrew reciprocatingly moves, one side of connecting plate is connected with the mounting plate of fixed connection, the mounting plate is provided with polishing mechanism.
[0006] As a further improvement of the above-mentioned scheme, the installation fixed mechanism includes a placement plate fixedly connected to the upper end of the jackscrew, a plurality of support plates are fixedly connected to the upper side of the placement plate, the plurality of support plates are arranged in a circular array, a positioning pin is threadedly connected to each support plate, and the plurality of positioning pins can position the sample polishing block.
[0007] As a further improvement of the above-mentioned scheme, the ejector rod driving mechanism comprises a sliding cylinder fixedly connected to the upper side of the connecting plate, a plurality of clamping grooves are formed in the inner side of the sliding cylinder, a plurality of clamping plates are slidably connected to the inner side of the clamping grooves respectively, a connecting rod is fixedly connected to the inner side of the sliding cylinder and is connected to the clamping plates, a push plate mechanism is arranged at one end of the connecting rod away from the sliding cylinder, and a connecting rod pushing mechanism is arranged at the other end of the connecting rod and is used to push the connecting rod to move forward and backward along the sliding cylinder.
[0008] As a further improvement of the above-mentioned scheme, the push plate mechanism comprises a bearing plate fixedly connected to one end of the connecting rod, and limiting sleeve plates are fixedly connected to the two sides of the bearing plate respectively, and the clamping rod is slidably connected to the inner sides of the two limiting sleeve plates.
[0009] As a further improvement of the above-mentioned scheme, a sliding groove is formed in the bearing plate, and the limiting cylinder is slidably connected to the inner side of the sliding groove.
[0010] As a further improvement of the above-mentioned scheme, the connecting rod pushing mechanism comprises a threaded sleeve fixedly connected to one end of the sliding cylinder away from the bearing plate, and an adjusting screw is rotatably connected to one end of the connecting rod and is screwed with the threaded sleeve.
[0011] As a further improvement of the above-mentioned scheme, the polishing mechanism comprises a grinder fixedly connected to the lower side of the mounting plate, and a rotating disc is arranged on the upper side of the grinder and is used to polish the surface of the sample block.
[0012] As a further improvement of the above-mentioned scheme, a plurality of sighting grooves are formed in the observation scale plate, and the heights represented by the sighting grooves are matched with the height marks previously arranged on the side surface of the sample block.
[0013] Compared with the prior art, the utility model has the advantages that:
[0014] 1、The polishing mechanism is used for polishing the sample block fixed on the placing plate, the sighting groove on the observation scale plate on one side is used to confirm the current polishing thickness during the polishing process, and the utility model has the advantages of convenient use and flexible operation.
[0015] 2、The adjusting screw pushes the connecting rod to extend forward, the bearing plate is pushed forward, the limiting sleeve plates at a certain angle with the limiting groove push the clamping rod to move upward along the limiting groove, the placing plate is lifted, the user can polish the sample at different heights, and the utility model has the advantage of high height adjustment precision. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 The utility model provides a kind of overall structure schematic diagram of thickness positioning polishing device;
[0017] Figure 2 is a partial structure schematic view of the present application; Figure 1
[0018] Figure 3 is a top view of the present application; Figure 2
[0019] Figure 4 is an exploded structure schematic view of the present application; Figure 3
[0020] Figure 5 is a structure schematic view of the connecting rod pushing mechanism top rod (19) in the present application;
[0021] Figure 6 is a structure schematic view of the connecting rod (21) of the connecting rod pushing mechanism in the present application;
[0022] Figure 7 is a structure schematic view of the mounting and fixing mechanism in the present application;
[0023] Figure 8 is a structure schematic view of the observation scale plate (6) in the present application.
[0024] Main symbol explanation:
[0025] 1, connecting plate; 2, mounting plate; 3, fixed plate; 4, adjusting screw; 5, sliding cylinder; 6, observation scale plate; 7, limiting sleeve plate; 8, limiting cylinder; 9, limiting groove; 10, clamping rod; 11, bearing plate; 12, sliding groove; 14, grinding machine; 15, rotating disc; 16, placing plate; 17, support plate; 18, positioning pin; 19, top rod; 20, threaded sleeve; 21, connecting rod; 22, clamping plate; 23, sight groove; 24, clamping groove. Specific implementation
[0026] In the following, the present application is further described in combination with the drawings and specific implementation, and it should be noted that, under the premise of no conflict, the following described embodiments or technical features can be combined to form new embodiments.
[0027] Embodiment:
[0028] Please combine Figures 1-6 The thickness positioning polishing device of the embodiment comprises a fixed plate 3, the upper side of the fixed plate 3 is fixedly connected with a limiting cylinder 8, a limiting groove 9 is formed in the limiting cylinder 8, the limiting groove 9 is designed to be through on both sides, the inner side of the limiting cylinder 8 is slidably connected with a jacking rod 19, the lower end of the jacking rod 19 is fixedly connected with a clamping rod 10, one end of the clamping rod 10 is fixedly connected with an observation scale plate 6, in the embodiment, the observation scale plate 6 is provided with three-stage stepped scales, the upper end of the jacking rod 19 is provided with a mounting and fixing mechanism, one side of the fixed plate 3 is fixedly connected with a connecting plate 1, the upper side of the connecting plate 1 is provided with a jacking rod driving mechanism for reciprocating the jacking rod 19 up and down, one side of the connecting plate 1 is fixedly connected with a mounting plate 2, the mounting plate 2 is provided with a polishing mechanism.
[0029] Please refer to Figure 6 , the mounting and fixing mechanism comprises a placing plate 16 fixedly connected with the upper end of the jacking rod 19, the upper side of the placing plate 16 is fixedly connected with four supporting plates 17, the four supporting plates 17 are distributed in a circumferential array, a positioning pin 18 is threadedly sleeved on each supporting plate 17, and the four positioning pins 18 can position the sample polishing block.
[0030] Please refer to Figure 5 , the jacking rod driving mechanism comprises a sliding cylinder 5 fixedly connected with the upper side of the connecting plate 1, two clamping grooves 24 are formed in the inner side of the sliding cylinder 5, two clamping plates 22 are slidably connected with the inner sides of the two clamping grooves 24, the two clamping plates 22 are fixedly connected with a connecting rod 21 slidably connected with the inner side of the sliding cylinder 5, the end of the connecting rod 21 away from the sliding cylinder 5 is provided with a push plate mechanism, and the other end of the connecting rod 21 is provided with a connecting rod pushing mechanism for pushing the connecting rod 21 to move forward and backward along the sliding cylinder 5.
[0031] Please refer to Figure 3 , the push plate mechanism comprises a bearing plate 11 fixedly connected with one end of the connecting rod 21, the two sides of the bearing plate 11 are respectively fixedly connected with limiting sleeve plates 7, and the clamping rod 10 is slidably connected with the inner sides of the two limiting sleeve plates 7, it should be particularly pointed out that the grooves formed in the limiting sleeve plates 7 are at a certain angle with the limiting groove 9.
[0032] Please refer to Figure 4 , a sliding groove 12 is formed in the bearing plate 11, and the limiting cylinder 8 is slidably connected with the inner side of the sliding groove 12, and the sliding groove 12 reserves space for the movement of the limiting cylinder 8.
[0033] Please refer to Figure 5 , the connecting rod pushing mechanism comprises a threaded sleeve 20 fixedly connected with the end of the sliding cylinder 5 away from the bearing plate 11, one end of the connecting rod 21 is rotatably connected with an adjusting screw 4, and the adjusting screw 4 is threadedly sleeved with the threaded sleeve 20.
[0034] Please refer to Figure 1As shown, the polishing mechanism includes a grinder (14) fixedly connected to the lower side of the mounting plate (2), and the upper side of the grinder (14) is provided with a rotating disc (15) for polishing the surface of the sample block, when the ejector rod (19) is lowered and pushes the sample polishing block to contact the surface of the rotating disc (15) on the grinder (14), the polishing effect can be achieved.
[0035] Please combine Figure 8 As shown, the observation scale board (6) is provided with three foresights (23), the height represented by the foresights (23) is matched with the height marks on the side surface of the sample block, for example, Figure 4 As shown, the observation scale board (6) is provided with three foresights (23), when the staff observes the sample thickness through the foresights (23), it can be known that the sample has been polished to the scale corresponding to the foresights (23).
[0036] The implementation principle of the thickness positioning polishing device in the embodiment is as follows: the sample block to be polished is placed on the placing plate (16), then the sample block is fixedly abutted through the surrounding positioning pins (18), then the adjusting screw (4) is rotated, under the limiting action of the clamping plate (22) and the clamping groove (24), the connecting rod (21) is pushed to move forward in the inside of the sliding cylinder (5), the connecting rod (21) drives the bearing plate (11) to move, and indirectly drives the limiting sleeve plate (7) to move, since the limiting groove on the limiting sleeve plate (7) and the limiting groove (9) are at a certain angle, the movement of the limiting sleeve plate (7) can push the clamping rod (10) to move upward along the limiting groove (9), drives the ejector rod (19) to move upward, and reaches the required height of contacting the rotating disc (15) on the grinder (14), then the grinder (14) is started, and the polishing function can be realized.
[0037] The above embodiment is only the preferred embodiment of the present application, and cannot be used to limit the range of protection of the present application, and any non-substantial change and replacement made by the person skilled in the art on the basis of the present application all belong to the range of protection of the present application.
Claims
1. A thickness positioning grinding device comprising a fixed plate (3), characterized in that, The upper side of the fixed plate (3) is fixedly connected with a limiting cylinder (8), the limiting cylinder (8) is provided with a limiting groove (9), the inner side of the limiting cylinder (8) is slidably connected with a jacking rod (19), the lower end of the jacking rod (19) is fixedly connected with a clamping rod (10), the clamping rod (10) is slidably connected with the inner side of the limiting groove (9), one end of the clamping rod (10) is fixedly connected with an observation scale plate (6), the upper end of the jacking rod (19) is provided with a mounting and fixing mechanism, one side of the fixed plate (3) is fixedly connected with a connecting plate (1), the upper side of the connecting plate (1) is provided with a jacking rod driving mechanism for reciprocating the jacking rod (19) up and down, one side of the connecting plate (1) is fixedly connected with a mounting plate (2), the mounting plate (2) is provided with a polishing mechanism.
2. A thickness positioning and sanding device as defined in claim 1, wherein, The mounting and fixing mechanism comprises a placing plate (16) fixedly connected with the upper end of the jacking rod (19), the upper side of the placing plate (16) is fixedly connected with a plurality of supporting plates (17), the plurality of supporting plates (17) are arranged in a circumferential array, each supporting plate (17) is threadedly sleeved with a positioning pin (18), and the plurality of positioning pins (18) can position the sample polishing block.
3. A thickness positioning and sanding device as described in claim 1, wherein, The jacking rod driving mechanism comprises a sliding cylinder (5) fixedly connected with the upper side of the connecting plate (1), the inner side of the sliding cylinder (5) is provided with a plurality of clamping grooves (24), the inner sides of the plurality of clamping grooves (24) are respectively slidably connected with clamping plates (22), the plurality of clamping plates (22) are fixedly connected with a connecting rod (21) slidably connected with the inner side of the sliding cylinder (5), the end of the connecting rod (21) away from the sliding cylinder (5) is provided with a push plate mechanism, and the other end of the connecting rod (21) is provided with a connecting rod pushing mechanism for moving the connecting rod (21) forward and backward along the sliding cylinder (5).
4. A thickness positioning and polishing apparatus as claimed in claim 3, characterized in that The push plate mechanism comprises a bearing plate (11) fixedly connected with one end of the connecting rod (21), the two sides of the bearing plate (11) are respectively fixedly connected with limiting sleeve plates (7), and the clamping rod (10) is slidably connected with the inner sides of the two limiting sleeve plates (7).
5. A thickness positioning and polishing apparatus as claimed in claim 4, characterized in that The bearing plate (11) is provided with a sliding groove (12), and the limiting cylinder (8) is slidably connected with the inner side of the sliding groove (12).
6. A thickness positioning and polishing apparatus as described in claim 4, wherein, The connecting rod pushing mechanism comprises a threaded sleeve (20) fixedly connected with the end of the sliding cylinder (5) away from the bearing plate (11), one end of the connecting rod (21) is rotatably connected with an adjusting screw rod (4), and the adjusting screw rod (4) is threadedly sleeved with the threaded sleeve (20).
7. A thickness positioning sander as defined in claim 1, wherein, The polishing mechanism comprises a grinding machine (14) fixedly connected with the lower side of the mounting plate (2), the upper side of the grinding machine (14) is provided with a rotating disc (15), and the rotating disc (15) is used for polishing the surface of the sample block.
8. A thickness positioning sander as defined in claim 1, wherein, A plurality of foresight grooves (23) are formed in the observation scale plate (6), and the height represented by the foresight grooves (23) is matched with the height marks previously arranged on the side surface of the sample block.