Wafer defect automatic detection device
By designing an automatic wafer defect detection device and using a robotic arm and a variety of camera light source components for automated detection, the problems of low efficiency and large errors in wafer defect detection have been solved, and efficient and accurate defect detection has been achieved.
Patent Information
- Application Number
- CN202422843206.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-11-21
AI Technical Summary
The existing wafer defect detection technology has low efficiency and large errors, and mainly relies on manual visual inspection, which leads to low efficiency and difficulty in ensuring accuracy.
An automatic wafer defect detection device was designed, which included a cassette loading unit, a wafer moving unit, a defect detection unit and a data processing unit. A robotic arm was used to move the wafer, and an edge-finding module and a detection module were integrated. Multiple cameras and light source components were used to automatically detect the wafer edge and surface.
The automation and accuracy of wafer defect detection are improved, detection efficiency is enhanced, and human errors are reduced.
Smart Images
Figure CN223461495U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to semiconductor detection technical field especially relates to a wafer defect automatic detection device. BACKGROUND
[0002] At present, due to the stability of production equipment, the adjustment of production process parameters, the handling and transfer of wafers and other factors, different kinds of defects such as particles, scratches and pollutants will be generated in the production process of wafers, so it is necessary to detect the defects of each wafer to ensure the quality of wafer production. At present, the defects are mainly detected by manual visual inspection, but this method is relatively low in efficiency, and the accuracy is also difficult to guarantee, and there is a large human error.
[0003] The utility model discloses a wafer defect automatic detection device to solve the above technical problem. UTILITY MODEL CONTENTS
[0004] The utility model provides a wafer defect automatic detection device, aims at solving the problems of low wafer defect detection efficiency and large error.
[0005] In order to achieve the above object, the utility model provides the following technical scheme: a wafer defect automatic detection device, including wafer cassette loading unit, wafer moving unit, defect detection unit and data processing unit, the wafer cassette is equipped with the warehouse door, the wafer cassette loading unit includes the bearing station, horizontal moving mechanism, warehouse door opening mechanism and warehouse door avoidance mechanism, the wafer cassette is placed in the bearing station, the horizontal moving mechanism is equipped at the bottom of wafer cassette, the warehouse door opening mechanism is opposite to the warehouse door and is arranged, can lock and open the warehouse door, the warehouse door avoidance mechanism is equipped at the bottom of warehouse door opening mechanism, can drive the warehouse door opening mechanism to move away and approach wafer cassette, the wafer moving unit includes the mechanical arm, the mechanical arm is used to control the movement of wafer, the defect detection unit includes the edge detection unit and surface detection unit, the edge detection unit includes the common stage, seeks the edge module and detection module, the common stage is equipped with the fixed clamp, the edge module includes the edge sensor, the data processing unit is connected with wafer cassette loading unit, wafer moving unit, defect detection unit.
[0006] On the basis of the above technical scheme, the side of the warehouse door towards the warehouse door opening mechanism is provided with a positioning block capable of rotating relative to the warehouse door, the warehouse door opening mechanism is provided with a matching part, the matching part cooperates with the positioning block, can lock the positioning block on the warehouse door and rotate to open the warehouse door.
[0007] On the basis of the above technical scheme, the detection module comprises a first detection module, the first detection module comprises a region camera assembly and a first light source assembly, the region camera assembly comprises a first region camera, a second region camera and a third region camera, the first region camera and the second region camera are respectively arranged obliquely above and obliquely below the edge of the wafer, and the third region camera is arranged outside the edge extending in the radial direction of the wafer; the region camera assembly is provided with a convex lens close to one side of the wafer; the first light source assembly comprises a first light source, a second light source and a third light source, the first light source and the second light source are respectively arranged correspondingly with the first region camera and the second region camera, and the third light source is arranged between the third region camera and the wafer, and is used for detecting defects in the groove region of the edge of the wafer.
[0008] On the basis of the above technical scheme, the detection module further comprises a second detection module, the second detection module comprises a line-scan camera and a C-shaped light source, one end of the wafer is inserted into a preset distance from the opening of the C-shaped light source, the number of the line-scan cameras is three, the three line-scan cameras are uniformly distributed in the circumferential direction away from the side of the opening of the C-shaped light source, and the line-scan camera is provided with a convex lens close to one side of the wafer, and is used for detecting defects in the chamfer region of the edge of the wafer.
[0009] On the basis of the above technical scheme, the detection module further comprises a third detection module, the third detection module comprises a line-scan camera and a second light source assembly, the second light source assembly comprises an upper light source and a lower light source, the upper light source and the lower light source are oppositely arranged and respectively arranged on the upper and lower sides of the edge of the wafer, two line-scan cameras are respectively arranged correspondingly with the upper light source and the lower light source and are respectively arranged on the side away from the wafer of the upper light source and the lower light source, and the line-scan camera is provided with a convex lens close to one side of the wafer, and is used for detecting defects in the preset region inward of the edge of the wafer.
[0010] On the basis of the above technical scheme, the surface detection unit comprises a line-scan camera assembly and a third light source, the line-scan camera assembly comprises a first line-scan camera and a second line-scan camera, the first line-scan camera and the second line-scan camera are oppositely arranged and respectively arranged on the upper and lower sides of the wafer, so as to simultaneously scan defects on the upper and lower surfaces of the wafer, two third light sources are respectively arranged between the first line-scan camera and the second line-scan camera and the wafer, and the line-scan camera assembly is provided with a concave lens close to one side of the wafer.
[0011] On the basis of the above technical scheme, the surface detection unit further comprises a first support system and a second support system, the first support system and the second support system are respectively used for defect detection in different regions.
[0012] On the basis of the above technical scheme, the first support system comprises first clamping jaws, the second support system comprises second clamping jaws, and the number of the first clamping jaws and the second clamping jaws is multiple, and the multiple first clamping jaws and the multiple second clamping jaws are configured to be clamped in the circumferential direction on the wafer edge.
[0013] On the basis of the above technical scheme, the detection module and the surface detection unit are each provided with a three-axis adjusting mechanism for position adjustment of the camera and the light source.
[0014] On the basis of the above technical scheme, the data processing unit comprises an automatic identification module, a classification module and a statistical module.
[0015] Compared with the related art, the utility model has the advantages of the following:
[0016] The utility model discloses a sheet box loading unit is set up to realize the automatic opening and closing of sheet box warehouse door, and the horizontal moving mechanism moves the sheet box to be opened to the bearing platform, and the warehouse door opening mechanism moves to the lock with the warehouse door, and the warehouse door is opened, and the warehouse door avoidance mechanism drives the warehouse door opening mechanism to move the warehouse door to the direction away from the sheet box a distance, and moves down to avoid the wafer area of taking and placing, When the warehouse door needs to be closed, the warehouse door avoidance mechanism drives the warehouse door opening mechanism to move the warehouse door back to the original position, and the warehouse door opening mechanism closes the warehouse door. The setting of the sheet box loading unit can improve the automation degree of wafer taking and placing, thereby improving the wafer defect detection efficiency.
[0017] Through the setting of the wafer moving unit, the movement of the wafer is completed by the mechanical arm in the wafer defect detection process, so that the staff can not contact the wafer, and the setting of the wafer moving unit can further improve the automation degree of wafer defect detection, the edge detection unit is set, the groove position of the wafer edge is positioned by using the edge searching module, the defects in the groove area are detected by using the first detection module after positioning, the edge searching module and the detection module are integrated, the edge detection process can be directly carried out after the edge searching process is completed, the efficiency of defect detection can be improved, the second detection module and the third detection module are set, and the defects in the chamfer area of the wafer edge and the preset area inward of the wafer edge are detected, and the precision of wafer defect detection can be improved. BRIEF DESCRIPTION OF DRAWINGS
[0018] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description. Obviously, the drawings in the following description are only one embodiment of the utility model, and for those skilled in the art, other embodiment drawings can be obtained according to the provided drawings without creating labor.
[0019] Figure 1It is a structure schematic view of a wafer defect automatic detection device's wafer box loading unit provided by the utility model;
[0020] Figure 2 It is a structure schematic view of a wafer defect automatic detection device's edge searching module provided by the utility model;
[0021] Figure 3 It is a structure schematic view of a wafer defect automatic detection device's first detection module provided by the utility model;
[0022] Figure 4 It is a structure schematic view of a wafer defect automatic detection device's second detection module provided by the utility model;
[0023] Figure 5 It is a structure schematic view of a wafer defect automatic detection device's third detection module provided by the utility model;
[0024] Figure 6 It is a structure schematic view of a wafer defect automatic detection device's surface detection unit provided by the utility model.
[0025] In the drawing: 1, wafer box loading unit;10, wafer box;11, bearing table;12, horizontal moving mechanism;13, warehouse door opening mechanism;14, warehouse door avoidance mechanism;2, defect detection unit;3, edge detection unit;31, common bearing table;311, fixed clamp;32, edge searching module;321, edge searching sensor;33, detection module;331, first detection module;3311, first area camera;3312, second area camera;3313, third area camera;3314, convex lens;3315, first light source;3316, second light source;3317, third light source;332, second detection module;3321, line scanning camera;3322, C-shaped light source;333, third detection module;3331, upper light source;3332, lower light source;4, surface detection unit;41, first line scanning camera;42, second line scanning camera;43, third light source assembly;44, concave lens;45, first support system;46, second support system;5, wafer. DETAILED DESCRIPTION
[0026] The utility model will be further described below in combination with the drawings and examples:
[0027] The embodiments of the utility model are described in detail below, and the examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model.
[0028] In the description of the utility model, it is necessary to explain that, unless another explicit provision and limitation, the term "installation", "link", "connection" should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected, can be direct connection, also can pass through the indirect connection of intermediate medium.
[0029] In the description of the utility model, it is necessary to understand that, the orientation or positional relation indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is the orientation or positional relation based on the orientation or positional relation shown in the drawing, and is only for the convenience of describing the utility model and simplifying the description, and is not indicative or suggestive of the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, therefore, cannot be understood as a limitation on the utility model.
[0030] In combination Figures 1-6 As shown in the figure, the utility model discloses a wafer defect automatic detection device, including wafer magazine loading unit 1, wafer moving unit, defect detection unit 2 and data processing unit, the wafer magazine 10 is equipped with the warehouse door, the wafer magazine loading unit 1 includes bearing platform 11, horizontal moving mechanism 12, warehouse door opening mechanism 13 and warehouse door avoidance mechanism 14, the wafer magazine 1 is placed in bearing platform 11, the horizontal moving mechanism 12 is equipped in wafer magazine 1 bottom, the warehouse door opening mechanism 13 is opposite to the warehouse door and is set up, can lock and open the warehouse door, the warehouse door avoidance mechanism 14 is equipped in the bottom of warehouse door opening mechanism 13, can drive the warehouse door opening mechanism 13 to move away and approach wafer magazine, the wafer moving unit includes mechanical arm, the mechanical arm is used to control the movement of wafer, the defect detection unit 2 includes edge detection unit 3 and surface detection unit 4, the edge detection unit 3 includes common stage 31, edge searching module 32 and detection module 33, the common stage 31 is equipped with fixed clamp 311, the edge searching module 32 includes edge searching sensor 321, the data processing unit is connected with wafer magazine loading unit 1, wafer moving unit, defect detection unit 2.
[0031] The automatic wafer defect detection device provided by the embodiment of the present disclosure is adopted. By setting up a cassette loading unit 1, the automatic opening and closing of the door of the cassette 10 is realized. The transverse movement mechanism 12 moves the cassette to be opened to the carrier 11. The door opening mechanism 13 moves to lock with the door and opens the door. The door avoidance mechanism 14 drives the door opening mechanism 13 to move the door a distance away from the cassette 10 and moves downward to avoid the area for taking and placing the wafer 5. When the door needs to be closed, the door avoidance mechanism 14 drives the door opening mechanism 13 to move the door back to its original position, and the door opening mechanism 13 closes the door. The setting of the cassette loading unit 1 can improve the degree of automation of taking and placing the wafer 5, thereby improving the efficiency of defect detection of the wafer 5.
[0032] By setting up a wafer moving unit, a robotic arm is used to complete the movement of wafer 5 during the defect detection process of wafer 5, avoiding staff contact with wafer 5. The setting of the wafer moving unit can further improve the degree of automation of wafer 5 defect detection. By setting up an edge detection unit 3, an edge-finding module 32 is used to locate the groove position of the edge of wafer 5. After positioning, the first detection module 331 is used to detect defects in the groove area. The edge-finding module 32 is integrated with the detection module 33. After completing the edge-finding process, the edge detection process can be directly performed, which can improve the efficiency of defect detection. By setting up a second detection module 332 and a third detection module 333 to respectively detect defects in the chamfered area of the edge of wafer 5 and the preset area inward from the edge of wafer 5, the accuracy of wafer 5 defect detection can be improved.
[0033] Based on the above technical solution, a positioning block that can rotate relative to the warehouse door is provided on the side of the warehouse door facing the warehouse door opening mechanism 13, and the warehouse door opening mechanism 13 is provided with a matching part, which cooperates with the positioning block and can lock the positioning block on the warehouse door and rotate it to open the warehouse door.
[0034] Specifically, the matching structure between the positioning block and the matching part can be a snap-fit structure or a plug-in structure. There is no limitation on the specific matching structure here, as long as it can achieve locking between the door opening structure 13 and the door.
[0035] Based on the above technical solution, Figure 3As shown, the detection module 33 includes a first detection module 331, which includes a regional camera assembly and a first light source 3315 assembly. The regional camera assembly includes a first regional camera 3311, a second regional camera 3312, and a third regional camera 3313. The first regional camera 3311 and the second regional camera 3312 are respectively arranged obliquely above and obliquely below the edge of the wafer 5, and the third regional camera 3313 is arranged outside the edge extending radially along the wafer 5. The regional camera assembly is provided with a convex lens 3314 close to one side of the wafer 5. The first light source 3315 assembly includes a first light source 3315, a second light source 3316, and a third light source 3317. The first light source 3315 and the second light source 3316 are respectively arranged corresponding to the first regional camera 3311 and the second regional camera 3312. The third light source 3317 is arranged between the third regional camera 3313 and the wafer 5, and is used for defect detection of the groove region of the wafer edge.
[0036] The first detection module 331 is used for defect detection of the groove region of the wafer 5 edge. The groove refers to the notch of the wafer 5, which is a kind of notch mark used to mark the crystal direction, and usually presents a V shape or a U shape. In addition to marking the crystal direction, another function is to enable the wafer 5 to be correctly positioned and aligned in the semiconductor manufacturing equipment. In the detection process of the first detection module 331, the light emitted by the first light source 3315, the second light source 3316, and the third light source 3317 irradiates the surface of the groove region of the wafer 5 from multiple directions. Where there are defects on the surface, there will be abnormal scattered light. The scattered light is projected to the imaging unit of the first regional camera 3311, the second regional camera 3312, or the third regional camera 3313 through the lens, and a detection picture is obtained.
[0037] It can be understood that in the detection process of the first detection module 331, the field of view range and the lens type of the regional camera can be adjusted according to actual needs. In addition, the number of cameras in the regional camera assembly can also be adjusted according to actual needs. The number of cameras can be one, for example, the third regional camera 3313 performs scanning detection alone. The number of cameras can also be two, for example, the first regional camera 3311 and the second regional camera 3312 cooperate to perform scanning detection. The first light source 3315, the second light source 3316, and the third light source 3317 are arranged in cooperation with the corresponding regional camera, and the first light source 3315 and the second light source 3316 are symmetrically arranged relative to the wafer 5. The groove of the wafer 5 edge has a chamfer structure, and the extension direction of the light source panel of the first light source 3315 and the second light source 3316 is perpendicular to the surface of the chamfer structure, so as to ensure that the emitted light is parallel to the surface of the chamfer structure.
[0038] On the basis of the above technical solutions, as Figure 4As shown, the detection module 33 further comprises a second detection module 332, which comprises a line-scan camera 3321 and a C-shaped light source 3322. One end of the wafer 5 is inserted into the C-shaped light source 3322 at a preset distance. The number of the line-scan cameras 3321 is three. The three line-scan cameras 3321 are uniformly distributed along the circumference of the side away from the opening of the C-shaped light source 3322. The line-scan camera 3321 is provided with a convex lens 3314 on the side close to the wafer 5, which is used for detecting defects in the chamfered area of the wafer edge.
[0039] During the detection process of the second detection module 332, the C-shaped light source 3322 surrounds the chamfer of the wafer 5 edge. The light emitted by the C-shaped light source 3322 continuously irradiates the surface of the chamfered area. Where there are defects on the surface, there will be abnormal scattered light. The scattered light is projected to the corresponding line-scan camera 3321 through the lens, and the corresponding detection picture is obtained.
[0040] Based on the above technical solutions, as shown in the first aspect, Figure 5 As shown, the detection module 33 further comprises a third detection module 333, which comprises a line-scan camera 3321 and a second light source 3316 assembly. The second light source 3316 assembly comprises an upper light source 3331 and a lower light source 3332. The upper light source 3331 and the lower light source 3332 are oppositely arranged and respectively arranged on the upper and lower sides of the wafer 5 edge. Two line-scan cameras 3321 are respectively arranged corresponding to the upper light source 3331 and the lower light source 3332 and are respectively arranged on the side away from the wafer 5 of the upper light source 3331 and the lower light source 3332. The line-scan camera 3321 is provided with a convex lens 3314 on the side close to the wafer 5, which is used for detecting defects in the preset area inward of the wafer edge.
[0041] Specifically, the third detection module 333 is used for detecting defects in the preset area inward of the wafer 5 edge. The preset area can be the area covered by the length a inward of the wafer 5 edge. The value of a ranges from 1mm to 4mm. The value of a can be selected according to the actual size parameters of the wafer 5.
[0042] Based on the above technical solutions, as shown in the first aspect, Figure 6 As shown, the surface detection unit 4 comprises a line-scan camera assembly and a third light source assembly 43. The line-scan camera assembly comprises a first line-scan camera 41 and a second line-scan camera 42. The first line-scan camera 41 and the second line-scan camera 42 are oppositely arranged and respectively arranged on the upper and lower sides of the wafer 5, so as to simultaneously scan defects on the upper and lower surfaces of the wafer 5. Two third light source assemblies 43 are respectively arranged between the first line-scan camera 41 and the second line-scan camera 42 and the wafer 5. The line-scan camera assembly is provided with a concave lens 44 on the side close to the wafer 5.
[0043] The surface detection unit 4 is used for detecting defects on the surface of the wafer 5, the line scanning camera assembly and the third light source assembly 43 are arranged on the upper and lower sides of the wafer 5 oppositely, so that the first line scanning camera 41 and the second line scanning camera 42 simultaneously scan the front and back surfaces of the wafer 5, and the efficiency of the defect detection of the wafer 5 is improved. Compared with the area scanning or rotary scanning mode, the use of the line scanning camera assembly can reduce the picture splicing and ensure the accuracy of the detection picture.
[0044] On the basis of the above technical scheme, the surface detection unit 4 further comprises a first support system 45 and a second support system 46, and the first support system 45 and the second support system 46 are respectively used for defect detection in different areas.
[0045] During the detection process of the surface detection unit 4, the working states of the first support system 45 and the second support system 46 can be adjusted to cooperate with the detection of the surface detection unit 4, the first support system 45 and the second support system 46 are uniformly supported on the edge of the wafer 5 in the circumferential direction, and during the detection process, the corresponding support system can be selected to support the wafer 5 according to the area to be detected, so that the influence of the support system on the defect detection of the front surface and the back surface of the wafer 5 is avoided.
[0046] On the basis of the above technical scheme, the first support system 45 comprises a first clamping jaw, the second support system 46 comprises a second clamping jaw, the number of the first clamping jaw and the second clamping jaw is multiple, and the multiple first clamping jaws and the multiple second clamping jaws are circumferentially clamped on the edge of the wafer 5.
[0047] On the basis of the above technical scheme, the detection module 33 and the surface detection unit 4 are provided with three-axis adjusting mechanisms for position adjustment of the camera and the light source.
[0048] On the basis of the above technical scheme, the first support system 45 and the second support system 46 are coated with light-absorbing materials or wrapped with light-absorbing films, so that the reflected light of the first support system 45 and the second support system 46 can be removed during the surface detection process of the wafer 5, and the information extraction and the detection accuracy of the surface detection unit 4 during the surface detection of the wafer 5 are avoided.
[0049] On the basis of the above technical scheme, the data processing unit comprises an automatic identification module, a classification module and a statistical module.
[0050] The utility model is described above by way of example, but the utility model is not limited to the above specific embodiments, and any modification or change based on the utility model belongs to the range of protection required by the utility model.
Claims
1. A wafer defect automatic detection apparatus characterized by comprising: It includes a film box loading unit, a wafer moving unit, a defect detection unit and a data processing unit. The film box is provided with a warehouse door. The film box loading unit includes a carrier, a transverse movement mechanism, a warehouse door opening mechanism and a warehouse door avoidance mechanism. The film box is placed on the carrier, and the transverse movement mechanism is arranged at the bottom of the film box. The warehouse door opening mechanism is arranged opposite to the warehouse door and can lock and open the warehouse door. The warehouse door avoidance mechanism is arranged at the bottom of the warehouse door opening mechanism and can drive the warehouse door opening mechanism to move away from and close to the film box. The wafer moving unit includes a robotic arm, which is used to control the movement of the wafer. The defect detection unit includes an edge detection unit and a surface detection unit. The edge detection unit includes a common carrier, an edge-finding module and a detection module. The common carrier is provided with a fixing fixture. The edge-finding module includes an edge-finding sensor. The data processing unit is connected to the film box loading unit, the wafer moving unit and the defect detection unit.
2. The wafer defect automatic detection apparatus according to claim 1, wherein The door opening mechanism has a positioning block on one side thereof that can rotate relative to the door. The door opening mechanism has a matching portion that cooperates with the positioning block to lock the positioning block on the door and rotate it to open the door.
3. The wafer defect automatic detection apparatus according to claim 1, wherein The detection module includes a first detection module, the first detection module includes an area camera assembly and a first light source assembly, the area camera assembly includes a first area camera, a second area camera and a third area camera, the first area camera and the second area camera are respectively arranged obliquely above and below the edge of the wafer, the third area camera is arranged outside the edge extending radially along the wafer, a convex lens is provided on the side of the area camera assembly close to the wafer, the first light source assembly includes a first light source, a second light source and a third light source, the first light source and the second light source are respectively arranged corresponding to the first area camera and the second area camera, the third light source is arranged between the third area camera and the wafer, and is used for defect detection in the groove area of the wafer edge.
4. The wafer defect automatic detection apparatus according to claim 3, wherein The detection module also includes a second detection module, which includes a line scan camera and a C-shaped light source. One end of the wafer is inserted into the opening of the C-shaped light source at a preset distance. There are three line scan cameras, and the three line scan cameras are evenly distributed circumferentially along the side away from the opening of the C-shaped light source. A convex lens is provided on the side of the line scan camera close to the wafer for defect detection in the chamfered area of the wafer edge.
5. The wafer defect automatic detection apparatus according to claim 4, wherein The detection module also includes a third detection module, which includes a line scan camera and a second light source assembly. The second light source assembly includes an upper light source and a lower light source. The upper light source and the lower light source are arranged opposite to each other and are respectively arranged on the upper and lower sides of the edge of the wafer. The two line scan cameras are respectively arranged corresponding to the upper light source and the lower light source, and are respectively arranged on the side of the upper light source and the lower light source away from the wafer. A convex lens is provided on the side of the line scan camera close to the wafer for defect detection in a preset area inward from the edge of the wafer.
6. The wafer defect automatic detection apparatus according to any one of claims 1 to 5, characterized by, The surface detection unit comprises a line-scan camera assembly and a third light source, the line-scan camera assembly comprises a first line-scan camera and a second line-scan camera, the first line-scan camera and the second line-scan camera are oppositely arranged and respectively arranged on the upper and lower sides of the wafer to simultaneously scan the upper and lower surfaces of the wafer, the two third light sources are respectively arranged between the first line-scan camera and the second line-scan camera and the wafer, and the line-scan camera assembly is provided with a concave lens on one side close to the wafer.
7. The wafer defect automatic detection apparatus according to claim 6, wherein The surface detection unit further comprises a first support system and a second support system, the first support system and the second support system are respectively used for defect detection in different areas.
8. The wafer defect automatic detection apparatus according to claim 7, wherein The first support system comprises a first clamp jaw, and the second support system comprises a second clamp jaw, the number of the first clamp jaw and the second clamp jaw is multiple, and the multiple first clamp jaws and the multiple second clamp jaws are configured to be circumferentially clamped to the edge of the wafer.
9. The wafer defect automatic detection apparatus according to any one of claims 1 to 5, characterized by, The detection module and the surface detection unit are both provided with a three-axis adjusting mechanism for position adjustment of the camera and the light source.
10. The wafer defect automatic detection apparatus according to any one of claims 1 to 5, characterized by, The data processing unit comprises an automatic identification module, a classification module and a statistical module.