Transparent imaging standardization module capable of improving heat dissipation effect

Abstract

The utility model discloses a transparent imaging standardization module capable of improving heat dissipation effect, a plurality of hollow holes arranged vertically and horizontally and a plurality of LED lamp beads are arranged in a transparent display area of a PCB substrate main body part, one or more lamp bead positions are arranged in the middle of a connecting rib between two adjacent hollow holes, and each lamp bead position is provided with an LED lamp bead; the outer side faces of the two sides of each lamp bead position are the hole side faces of the two adjacent hollowed-out holes, heat generated in the working process of the LED lamp beads can be dissipated upwards and downwards and can also be directly dissipated through the hole side faces of the hollowed-out holes, the hole side faces of the hollowed-out holes form the heat dissipation face of the LED lamp beads, and the heat dissipation area is increased. The efficiency of directly radiating heat through the hole side surface of the hollow hole is far greater than the efficiency of transmitting and radiating heat upwards through a glass medium and downwards through a substrate medium; the heat dissipation area is increased, the service life is prolonged, the structure is simple and compact, the process is simple, and operation is convenient.

Description

TECHNICAL FIELD

[0001] The utility model belongs to LED display equipment technical field, concretely relates to a transparent imaging standardization module capable of improving the heat dissipation effect. BACKGROUND

[0002] The transparent display screen structure in prior art is basically provided with LED lamp bead position at the intersection of grid-shaped substrate, the heat generated by the LED lamp bead at the intersection of substrate can only be transmitted and dissipated upward or downward, the upward dissipation is blocked by the glass panel and can only be indirectly dissipated by the glass panel as the propagation medium, and the downward dissipated heat directly acts on the substrate of the lamp bead position and is transmitted and dissipated by the substrate as the medium, and the substrate of the lamp bead position is internally provided with fine and complex conductive circuit and driving chip and other structures, the downward dissipation of heat will affect the conductive circuit and driving chip and other structures, and easily cause faults and affect the service life. UTILITY MODEL CONTENT

[0003] In order to solve the above problems existing in the prior art, the utility model aims at providing a transparent imaging standardization module capable of improving the heat dissipation effect, increasing the heat dissipation area, improving the service life, and being simple and compact in structure, simple in process and convenient to operate.

[0004] The utility model adopts the technical scheme that:

[0005] A transparent imaging standardization module capable of improving the heat dissipation effect, comprising a grid-shaped PCB substrate, the PCB substrate is provided with a control area at one end, the main body part of the PCB substrate is provided with a transparent display area, the transparent display area is provided with a plurality of longitudinally and transversely arranged hollow holes and a plurality of LED lamp beads, characterized in that:

[0006] One or more lamp bead positions are arranged in the middle of the connecting rib between the two adjacent hollow holes, and each lamp bead position is respectively provided with an LED lamp bead;

[0007] The sum of the heights of all the lamp bead positions between the two adjacent hollow holes is less than the height of the hollow hole, and the distance from the end of the hollow hole to the lamp bead position is greater than or equal to 1 / 2 of the height of the lamp bead position;

[0008] Or the sum of the widths of all the lamp bead positions between the two adjacent hollow holes is less than the width of the hollow hole, and the distance from the end of the hollow hole to the lamp bead position is greater than or equal to 1 / 2 of the width of the lamp bead position.

[0009] Further, the upper end of the PCB substrate is provided with a control area, and the two side edges of the transparent display area are respectively provided with a column of open 1 / 2 hollow holes;

[0010] The bottom edge of the last row of the hollowed-out holes of the transparent display area is flat, and the distance from the bottom edge of the last row of the hollowed-out holes to the bottom edge of the PCB substrate is equal to 1 / 2 of the distance between the two adjacent rows of the hollowed-out holes.

[0011] The distance from the bottom edge of the last row of the hollowed-out holes of the transparent display area to the bottom edge of the PCB substrate is equal to 1 / 2 of the distance between the two adjacent rows of the hollowed-out holes.

[0012] Further, the PCB substrate is a mesh structure formed by hollowing out or punching a plurality of hollowed-out holes on the PCB substrate through a hollowing out carving process or a die punching process.

[0013] Further, the distance between the rows of the plurality of longitudinally and transversely arranged hollowed-out holes is less than the distance between the columns.

[0014] The lamp bead position is arranged on the connecting rib between the two adjacent columns of the hollowed-out holes.

[0015] Further, the width of the lamp bead position is less than or equal to the width of the connecting rib between the two adjacent columns of the hollowed-out holes.

[0016] Further, the control area is provided with a control box for providing driving control signals and power supply for the PCB substrate.

[0017] The control box is provided with a modular splicing connecting hole.

[0018] Further, the material of the control box is an aluminum alloy profile formed by a one-time pultrusion molding process.

[0019] Further, the control box is a horizontally arranged U-shaped groove box, and the control box is connected to the front surface of the control area of the PCB substrate.

[0020] Further, the control box is provided with a mounting structure for hiding the standardization module in the equipment support frame through the control box.

[0021] Further, the mounting structure is a magnetic mounting structure, and the four corner positions of the control box and the four corner positions of the control area of the PCB substrate are respectively provided with through holes, and the four corner positions of the inner cavity of the control box are respectively provided with positioning columns with double-end internal screw holes.

[0022] The front side of the control box and the back side of the driving control PCB are respectively provided with magnetic rings and / or magnetic support columns, forming a magnetic mounting structure.

[0023] The beneficial effects of the utility model are as follows:

[0024] A transparent imaging standardized module capable of improving heat dissipation effect is provided. A transparent display area of ​​a main body of a PCB substrate is provided with a plurality of hollow holes arranged vertically and horizontally and a plurality of LED lamp beads. One or more lamp bead positions are provided in the middle of a connecting rib between two adjacent hollow holes, and an LED lamp bead is provided on each lamp bead position. The outer side surfaces on both sides of each lamp bead position are the hole side surfaces of two adjacent hollow holes. Heat generated by the LED lamp beads during operation can be directly dissipated through the hole side surfaces of the hollow holes in addition to being dissipated upward and downward. The hole side surfaces of the hollow holes constitute the heat dissipation surface of the LED lamp beads, thereby increasing the heat dissipation area. Moreover, the efficiency of directly dissipating heat through the hole side surfaces of the hollow holes is much greater than the efficiency of dissipating heat through a glass medium upward and a substrate medium downward. Thus, the heat dissipation area is increased and the service life is improved. The structure is simple and compact, the process is simple, and the operation is convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0026] Figure 1 This is a structural diagram of a transparent imaging standardized module capable of improving heat dissipation effect according to a first embodiment of the present utility model;

[0027] Figures 2-3 yes Figure 1 A magnified schematic diagram of the local structure;

[0028] Figure 4 This is an enlarged schematic diagram of the left-view structure of a transparent imaging standardized module capable of improving heat dissipation effect according to a first embodiment of the present utility model;

[0029] Figure 5 This is a schematic diagram of the splicing structure of a transparent imaging standardized module capable of improving heat dissipation effect according to the first embodiment of the present utility model;

[0030] Figure 6 yes Figure 5 A magnified schematic diagram of the local structure;

[0031] Figure 7 This is a structural diagram of a transparent imaging standardized module capable of improving heat dissipation effect according to a first embodiment of the present utility model;

[0032] Figures 8-9 yes Figure 7 A magnified schematic diagram of the local structure;

[0033] Figure 10It is the splicing structure schematic diagram of the transparent imaging standardized module with improved heat dissipation effect of the embodiment one of the utility model.

[0034] Figure 11 It is Figure 10 The partial structure enlarged schematic diagram. Specific embodiments

[0035] The utility model will be further explained in detail in combination with the drawings.

[0036] The specific embodiment is only the explanation of the utility model, and it is not the limitation of the utility model, and the person skilled in the art can make the modification without the creative contribution according to the need after reading the present specification, but as long as it is in the right claim range of the utility model, it is protected by the patent law.

[0037] As Figures 1-11 The utility model discloses a kind of transparent imaging standardized module capable of improving heat dissipation effect, and the working principle of the utility model is roughly as follows: main structure is optimized and improved on the standardized display module of conventional transparent splicing screen in prior art;

[0038] On the basis of the standardized display module structure of conventional transparent splicing screen, control area is arranged at one end of grid-shaped PCB substrate 1, transparent display area is arranged at the main body part of PCB substrate 1, and a plurality of longitudinal and transverse arrangement of hollow holes and a plurality of LED lamp beads 2 are arranged in the transparent display area;The transparency can be ensured by a plurality of longitudinal and transverse arrangement of hollow holes after the LED lamp beads of the transparent display area are turned off, a transparent effect is presented, and imaging can be displayed by a plurality of LED lamp beads according to driving control signal.

[0039] The utility model improves in that the technical scheme of arranging lamp bead position at the intersection position of longitudinal and transverse grid-shaped PCB substrate in traditional technology is abandoned, the defects in traditional technology are eliminated, and one or more lamp bead positions 3 are arranged in the middle of connecting rib between adjacent two hollow holes 4 of grid-shaped PCB substrate 1 in the utility model, one or more lamp bead positions 3 can be arranged on horizontal connecting rib in actual operation, or one or more lamp bead positions 3 can be arranged on vertical connecting rib;LED lamp bead 2 is arranged on each lamp bead position 3 respectively;The hole side surface of adjacent two hollow holes is the outer side surface on both sides of each lamp bead position, and the heat generated by LED lamp bead in working process can be directly dissipated through the hole side surface of hollow hole, the hole side surface of hollow hole constitutes the heat dissipation surface of LED lamp bead, and the heat dissipation area is increased;And the efficiency of directly dissipating heat through the hole side surface of hollow hole is much higher than the efficiency of dissipating through glass medium upward and substrate medium downward;The heat dissipation area is increased, the service life is improved, the structure is simple and compact, the process is simple, and the operation is convenient.

[0040] The sum of the heights of all the lamp bead positions between the two adjacent hollow holes can be less than the height of the hollow hole, and the distance from the end of the hollow hole to the lamp bead position is greater than or equal to 1 / 2 of the height of the lamp bead position; or the sum of the widths of all the lamp bead positions between the two adjacent hollow holes is less than the width of the hollow hole, and the distance from the end of the hollow hole to the lamp bead position is greater than or equal to 1 / 2 of the width of the lamp bead position; to ensure the installation space requirement of the LED lamp bead.

[0041] Embodiment one:

[0042] In embodiment one, a lamp bead position is arranged in the middle of the transverse connecting rib between the two hollow holes of the adjacent two columns of the grid-shaped PCB substrate; the connecting rib between the adjacent two rows of hollow holes is relatively narrow, so as to increase the hollow area as much as possible, thereby improving the transparent effect as much as possible; and the image display effect is ensured.

[0043] A control area is arranged at the upper end of the PCB substrate 1; a column of open 1 / 2 hollow holes is arranged at the two side edges of the transparent display area, to form an edge hole 6, and the last row of hollow holes of the transparent display area is a whole hole, so that the bottom edge of the PCB substrate is a flat edge 11; and the distance from the bottom edge of the last row of hollow holes of the transparent display area to the bottom edge of the PCB substrate is equal to 1 / 2 of the distance between the adjacent two rows of hollow holes. When the transparent imaging standardized module capable of improving the heat dissipation effect is used in splicing, the left and right adjacent two standardized modules can be combined to form a column of whole hollow holes through the edge hole 6 of the open 1 / 2 hollow hole at the edge of the transparent display area when the two modules are spliced; and the upper standardized module can be directly aligned and spliced with the lower standardized module through the flat bottom edge 11 of the PCB substrate of the transparent display area when the upper and lower standardized modules are spliced, so that the operation convenience is further improved, and seamless invisible splicing is realized.

[0044] The utility model discloses the drawing due to the limitation of pixel, only shows the splicing structure schematic diagram of the edge of the standardized module in the splicing process, and does not show the whole structure of the adjacent standardized module up and down and left and right.

[0045] The transparent imaging standardized module capable of improving the heat dissipation effect of the utility model can be seamlessly spliced in the splicing process, and the bottom edge of the PCB substrate is a flat edge, which is more convenient for splicing butt joint and simplifies the splicing process.

[0046] The PCB substrate in the transparent imaging standardized module capable of improving the heat dissipation effect of the utility model can also adopt a mesh structure formed by engraving or punching a plurality of hollow holes on the PCB substrate through a hollow engraving process or a die punching process.

[0047] The transparent display area of the transparent imaging standardized module capable of improving the heat dissipation effect is arranged in a plurality of longitudinal and transverse hollow holes, and the row spacing is less than the column spacing; that is, the spacing distance between each row of hollow holes and the adjacent row of hollow holes is less than the spacing distance between each column of hollow holes and the adjacent column of hollow holes, and the lamp bead position is arranged on the connecting rib between the adjacent two columns of hollow holes.

[0048] Further, the width of the lamp bead position is less than or equal to the width of the connecting rib between the adjacent two columns of hollow holes, because the two side outer sides of each lamp bead position are the hole side surfaces of the adjacent two hollow holes, the hole side surfaces of the hollow holes constitute the heat dissipation surface of the LED lamp bead, and the width of the lamp bead position is less than or equal to the width of the connecting rib between the adjacent two columns of hollow holes, so that the mounting position of the LED lamp bead is ensured.

[0049] Further, the control box 7 is arranged at the control area, and the control box 7 can provide a driving control signal and a power supply for the PCB substrate;

[0050] The control box 7 is also provided with a modular splicing connecting hole 71, so that the modular splicing connection is facilitated.

[0051] Further, the material of the control box is an aluminum alloy profile formed by a one-time pultrusion molding process, which has high mechanical support strength, is light in quality, and is convenient to operate.

[0052] Further, the control box 7 adopts a groove box structure in a transverse U-shaped structure, which can directly fasten and connect the control box at the front surface of the control area of the PCB substrate 1 in the control box position, provide a mechanical mounting structure, and ensure the protection function of the control area.

[0053] Further, the mounting structure is arranged on the control box 7, and the standardized module can be hidden and mounted in the equipment support frame through the control box by the mounting structure.

[0054] Specifically, the mounting structure can be a magnetic mounting structure, which can be directly magnetically attracted and fixed, is convenient to operate, does not need to be equipped with complicated mounting connection parts and fasteners on the installation site, and does not need to use auxiliary installation tools.

[0055] Further, according to the standardized module structure in the prior art, through holes are respectively arranged at positions corresponding to the four corner positions of the control area of the PCB substrate at the four corner positions of the control box, and positioning columns 72 with double-end internal screw holes are respectively arranged at the four corner positions in the inner cavity of the control box, so that the installation connection reliability can be further improved; the transparent imaging standardized module capable of improving the heat dissipation effect is convenient to install and connect.

[0056] And according to the standardized module structure in the prior art, a magnetic ring and / or a magnetic support column are arranged on the front side of the control box and the back side of the drive control PCB, respectively, to form a magnetic mounting structure.

[0057] Embodiment two:

[0058] In the embodiment two, on the basis of the above-mentioned embodiment one, a plurality of long slot-shaped second hollow holes 8 are arranged in the transparent display area in a longitudinal and horizontal arrangement, and two lamp bead positions are arranged in the middle of the connecting rib between the two second hollow holes in the adjacent two columns.

[0059] In the subsequent continuous improvement technical scheme, three lamp bead positions or even more lamp bead positions can be arranged in the middle of the connecting rib between the two hollow holes in the adjacent two columns.

[0060] A column of open 1 / 2 second hollow holes is arranged on the two side edges of the transparent display area to form a second edge hole 9, and the second hollow holes in the lowermost row of the transparent display area are also whole holes, so that the bottom edge of the PCB substrate is also a flat edge 11; and the distance from the bottom edge of the second hollow holes in the lowermost row of the transparent display area to the bottom edge of the PCB substrate is also equal to 1 / 2 of the distance between the adjacent two rows of second hollow holes. When the embodiment two is used in splicing, the left and right adjacent two standardized modules can be combined to form a column of whole second hollow holes through the second edge hole 9 of the open 1 / 2 second hollow hole in the edge of the transparent display area, and the upper and lower adjacent two standardized modules can be directly aligned and spliced through the flat bottom edge 11 of the PCB substrate in the transparent display area of the upper standardized module, thereby further improving the operation convenience and realizing seamless invisible splicing.

[0061] The transparent imaging standardized module capable of improving the heat dissipation effect, the PCB substrate main body part transparent display area is provided with a plurality of longitudinal and horizontal arrangement hollow holes and a plurality of LED lamp beads, a connecting rib between the two adjacent hollow holes is provided with one or more lamp bead positions, and an LED lamp bead is arranged on each lamp bead position; the two side outer sides of each lamp bead position are the hole side surfaces of the two adjacent hollow holes, the heat generated by the LED lamp bead in the working process can be directly dissipated through the hole side surface of the hollow hole, the hole side surface of the hollow hole constitutes the heat dissipation surface of the LED lamp bead, and the heat dissipation area is increased; and the efficiency of directly dissipating heat through the hole side surface of the hollow hole is much higher than that of upwardly dissipating heat through the glass medium and downwardly dissipating heat through the substrate medium; the heat dissipation area is increased, the service life is improved, the structure is simple and compact, the process is simple, and the operation is convenient.

[0062] The above merely aims to illustrate the technical solutions of the present application, and is not intended to limit the present application, which is not limited to the above optional embodiments. Other modifications or equivalent replacements to the technical solutions of the present application made by those skilled in the art, regardless of any changes in shape or structure, should be covered in the scope of the claims of the present application, as long as they do not deviate from the spirit and scope of the technical solutions of the present application.

Claims

1. A transparent imaging standardized module capable of improving heat dissipation effect, comprising a grid-shaped PCB substrate, one end of the PCB substrate being provided with a control area, a main body part of the PCB substrate being provided with a transparent display area, the transparent display area being provided with a plurality of longitudinally and transversely arranged hollow holes and a plurality of LED lamp beads, characterized in that: one or more lamp bead positions are arranged in the middle of the connecting rib between two adjacent hollow holes, and an LED lamp bead is arranged on each lamp bead position respectively; the sum of the heights of all the lamp bead positions between the two adjacent hollow holes is less than the height of the hollow hole, and the distance from the end of the hollow hole to the lamp bead position is greater than or equal to 1 / 2 of the height of the lamp bead position; or the sum of the widths of all the lamp bead positions between the two adjacent hollow holes is less than the width of the hollow hole, and the distance from the end of the hollow hole to the lamp bead position is greater than or equal to 1 / 2 of the width of the lamp bead position. The upper end of the PCB substrate is provided with a control area; the two side edges of the transparent display area are respectively provided with a column of open 1 / 2 hollow holes; The lowermost row of hollow holes of the transparent display area is a whole hole, so that the bottom edge of the PCB substrate is a flat edge; The distance from the bottom edge of the lowermost row of hollow holes of the transparent display area to the bottom edge of the PCB substrate is equal to 1 / 2 of the distance between the two adjacent rows of hollow holes.

2. The transparent imaging standardization module capable of improving heat dissipation effect according to claim 1, characterized in that: The PCB substrate is a grid structure formed by engraving or punching a plurality of hollow holes on the PCB substrate by a hollow engraving process or a die punching process. Among the plurality of longitudinally and transversely arranged hollow holes of the transparent display area, the row spacing is less than the column spacing; The lamp bead position is arranged on the connecting rib between the two adjacent columns of hollow holes.

3. The transparent imaging standardization module capable of improving heat dissipation effect according to claim 1, characterized in that: The width of the lamp bead position is less than or equal to the width of the connecting rib between the two adjacent columns of hollow holes.

4. The transparent imaging standardization module capable of improving heat dissipation effect according to any one of claims 1-3, characterized in that: The control area is provided with a control box, which is used to provide driving control signals and power supply for the PCB substrate; The control box is provided with a modular splicing connection hole.

5. The transparent imaging standardization module capable of improving heat dissipation effect according to claim 4, characterized in that: The material of the control box is an aluminum alloy profile formed by a one-time pultrusion molding process.

6. The transparent imaging standardization module capable of improving heat dissipation effect according to claim 1, characterized in that: The control box is a horizontally arranged U-shaped structure slot box; the control box is snap-fitted and connected to the front surface of the control area of the PCB substrate. The control box is provided with a mounting structure, which is used to hide the standardized module installed in the equipment support frame through the control box.

7. The transparent imaging standardization module capable of improving heat dissipation effect according to claim 6, characterized in that: The mounting structure is a magnetic mounting structure; through holes are respectively arranged at positions corresponding to the four corner parts of the control area of the PCB substrate and the four corner parts of the control box; positioning columns with double-end internal screw holes are respectively arranged at the four corner parts of the inner cavity of the control box; 8. The transparent imaging standardization module capable of improving heat dissipation effect according to claim 6, characterized in that: The front side of the control box and the back side of the driving control PCB board are respectively provided with a magnetic ring and / or a magnetic support column, forming a magnetic mounting structure.

9. The transparent imaging standardization module capable of improving heat dissipation effect according to claim 6, characterized in that: ​ 10. The transparent imaging standardization module capable of improving heat dissipation effect according to claim 9, characterized in that: ​ ​

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